Laser cutting method, device, system and ultrafast pulse laser

Abstract

The present application discloses a method, device, system and ultrafast pulse laser for laser cutting, and relates to the field of manufacturing and processing technology. The method comprises: obtaining a first laser signal and a second laser signal; wherein the first laser signal comprises a pre-configured first frequency value, a first voltage value and a first duty cycle, the second laser signal comprises a pre-configured second frequency value, a second voltage value and a second duty cycle, the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to the configuration operation; based on the first laser signal and the second laser signal, the first laser and the second laser are output; based on the first laser and the second laser, the material to be processed is cut on the processing platform according to the preset cutting path to obtain the target material after the cutting process.

Description

Technical Field

[0001] The present application relates to the field of manufacturing and processing technology, specifically to the field of laser processing technology and other technical fields, and particularly to a laser cutting method, device, system and ultrafast pulse laser. Background Art

[0002] Using ultrafast lasers to cut transparent and brittle materials such as glass is now a popular cutting method. At present, the relevant laser cutting material technology is to first use ultrafast lasers to modify the material to be processed, and then use carbon dioxide lasers to heat the modified part so that the material expands due to heat and cracks, achieving a splitting effect.

[0003] However, the laser cutting material scheme of the related technology includes a cutting process and a splitting process. The energy of the laser in the cutting process needs to be greater than the material damage threshold, and the corresponding pulse width must be reached to allow the material to absorb. The splitting process requires the carbon dioxide laser to have enough energy to form high heat to act on the processing position of the first process. The first and second processes need to be combined with each other in terms of equipment selection and configuration, such as lasers, optical lenses, electrical mechanical structures and parameter adjustments. In addition, the excessive power of the carbon dioxide laser can easily cause damage to the edge of the product, affecting the strength of the material product. Summary of the invention

[0004] The present application provides a laser cutting method, device, system and ultrafast pulse laser, which can solve the problem of poor accuracy of laser cutting of materials. The technical solution is as follows:

[0005] In a first aspect, a laser cutting method is provided, which is applied to an ultrafast pulse laser, and the method comprises:

[0006] Acquire a first laser signal and a second laser signal; wherein the first laser signal includes a preconfigured first frequency value, a first voltage value, and a first duty cycle, and the second laser signal includes a preconfigured second frequency value, a second voltage value, and a second duty cycle, the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to a configuration operation;

[0007] Based on the first laser signal and the second laser signal, output a first laser and a second laser;

[0008] Based on the first laser and the second laser, the material to be processed is cut according to a preset cutting path on the processing platform to obtain a target material after cutting.

[0009] In a possible implementation, the method further includes:

[0010] In response to the operation of configuring the first laser signal, acquiring the first laser signal;

[0011] Based on the first laser signal, output the first laser;

[0012] Based on the first laser, cutting the material to be processed on the processing platform according to the preset cutting path to obtain a first candidate material after cutting;

[0013] In response to the operation of configuring the second laser signal, acquiring the second laser signal;

[0014] Based on the second laser signal, output a second laser;

[0015] Based on the second laser, the first candidate material is heated on a processing platform according to the preset cutting path to obtain the target material.

[0016] In a possible implementation, the material information of the material includes a thermal expansion coefficient, and outputting the first laser and the second laser based on the first laser signal and the second laser signal includes:

[0017] In response to the thermal expansion coefficient of the material to be processed satisfying a preset first condition, performing an update configuration operation on the first laser signal and the second laser signal;

[0018] In response to updating the configuration operation of the first laser signal and the second laser signal, obtaining an updated first laser signal and an updated second laser signal, wherein a voltage value of the updated second laser signal is greater than the second voltage value, and a voltage value of the updated second laser signal is less than a voltage value of the updated first laser signal;

[0019] Based on the updated first laser signal and the updated second laser signal, the first laser light and the second laser light are output.

[0020] In a possible implementation, the material information of the material includes a damage threshold, and the outputting of the first laser and the second laser based on the first laser signal and the second laser signal further includes:

[0021] In response to the damage threshold of the material to be processed satisfying a preset second condition, performing an update configuration operation on the first laser signal and the second laser signal;

[0022] In response to updating the configuration operation of the first laser signal and the second laser signal, obtaining an updated first laser signal and an updated second laser signal, wherein a voltage value of the updated first laser signal is greater than the first voltage value, and a voltage value of the updated second laser signal is less than the second voltage value;

[0023] Based on the updated first laser signal and the updated second laser signal, the first laser light and the second laser light are output.

[0024] In a possible implementation, the cutting process of the material to be processed is performed on a processing platform according to a preset cutting path based on the first laser and the second laser to obtain a target material after cutting, including:

[0025] Based on the first laser and the second laser, cutting the material to be processed according to a preset cutting path on the processing platform to obtain a second candidate material after cutting;

[0026] The second candidate material is cut by a carbon dioxide laser on a processing platform according to a preset cutting path to obtain a target material after cutting.

[0027] In a possible implementation, the first laser is a main pulse laser, and the second laser is a quasi-continuous weak pulse laser.

[0028] In a possible implementation manner, the material includes at least one of glass, sapphire, and acrylic.

[0029] In a second aspect, a laser cutting device is provided, which is applied to an ultrafast pulse laser, and the device comprises:

[0030] an acquisition unit, configured to acquire a first laser signal and a second laser signal; wherein the first laser signal includes a preconfigured first frequency value, a first voltage value, and a first duty cycle, and the second laser signal includes a preconfigured second frequency value, a second voltage value, and a second duty cycle, wherein the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to a configuration operation;

[0031] An output unit, configured to output a first laser and a second laser based on the first laser signal and the second laser signal;

[0032] The cutting unit is used to cut the material to be processed on the processing platform according to a preset cutting path based on the first laser and the second laser to obtain the target material after cutting.

[0033] In a third aspect, a laser cutting system is provided, the system comprising an ultrafast pulse laser and a processing platform;

[0034] The ultrafast pulse laser acquires a first laser signal and a second laser signal; wherein the first laser signal includes a preconfigured first frequency value, a first voltage value, and a first duty cycle, and the second laser signal includes a preconfigured second frequency value, a second voltage value, and a second duty cycle, wherein the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to a configuration operation; and based on the first laser signal and the second laser signal, outputting a first laser and a second laser;

[0035] The processing platform is used to control the ultrafast pulse laser to cut the material to be processed based on the first laser and the second laser on the processing platform according to a preset cutting path to obtain the target material after cutting.

[0036] In a fourth aspect, an ultrafast pulse laser is provided, wherein the ultrafast pulse laser can execute the method according to the above aspect and any possible implementation manner.

[0037] The beneficial effects of the technical solution provided by this application include at least:

[0038] It can be known from the above technical scheme that the embodiment of the present application can obtain a first laser signal and a second laser signal, wherein the first laser signal includes a pre-configured first frequency value, a first voltage value and a first duty cycle, and the second laser signal includes a pre-configured second frequency value, a second voltage value and a second duty cycle, wherein the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, and the first duty cycle is less than the second duty cycle. The first laser signal and the second laser signal are adjusted in response to the configuration operation, and then the first laser signal and the second laser signal can be output, so that the material to be processed can be cut on the processing platform according to the preset cutting path based on the first laser and the second laser to obtain the target material after cutting. Since two types of laser signals based on different types of configured lasers can be output, and the material can be processed according to the preset cutting path at the same time, it can avoid the use of two types of lasers in the related art to cut the material multiple times, and one laser can be used to complete the cutting of the material and the splitting to obtain the target material, thereby achieving the composite processing effect of cutting and splitting, simplifying the laser cutting process, thereby effectively improving the processing efficiency and improving the energy utilization efficiency of the laser.

[0039] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 It is a schematic flow chart of a laser cutting method provided by an embodiment of the present application;

[0042] Figure 2 is a schematic diagram of a first laser signal and a second laser signal in a laser cutting method provided by an embodiment of the present application;

[0043] Figure 3 is a schematic diagram of material cutting in a laser cutting method provided by an embodiment of the present application;

[0044] Figure 4 A structural block diagram of a laser cutting device provided in one embodiment of the present application is shown. DETAILED DESCRIPTION

[0045] The following is a description of exemplary embodiments of the present application in conjunction with the accompanying drawings, including various details of the embodiments of the present application to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description.

[0046] Obviously, the described embodiments are only part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0047] It should be noted that the terminal devices involved in the embodiments of the present application may include but are not limited to mobile phones, personal digital assistants (PDAs), wireless handheld devices, tablet computers and other smart devices; display devices may include but are not limited to personal computers, televisions and other devices with display functions.

[0048] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0049] Please refer to Figure 1 , which shows a schematic flow chart of a laser cutting method provided by an embodiment of the present application. The laser cutting method can be applied to an ultrafast pulse laser, and specifically may include:

[0050] Step 101, acquiring a first laser signal and a second laser signal; wherein the first laser signal includes a preconfigured first frequency value, a first voltage value, and a first duty cycle, and the second laser signal includes a preconfigured second frequency value, a second voltage value, and a second duty cycle, wherein the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to a configuration operation.

[0051] Step 102: output a first laser and a second laser based on the first laser signal and the second laser signal.

[0052] Step 103: Based on the first laser and the second laser, the material to be processed is cut according to a preset cutting path on a processing platform to obtain a target material after cutting.

[0053] It should be noted that the first laser signal and the second laser signal may be electrical signals of lasers.

[0054] It should be noted that the frequency value of the first laser signal and the frequency value of the second laser signal may be the frequency value of the laser electrical signal, and the frequency value corresponds to the repetition frequency of the laser output.

[0055] It should be noted that, here, the first duty cycle may be much smaller than the second duty cycle.

[0056] It should be noted that the material to be processed may be a material to be cut into a desired shape, and the target material may be a material of a target shape after cutting.

[0057] It should be noted that the preset cutting path may be determined according to the required shape of the material.

[0058] It should be noted that the first laser and the second laser can simultaneously process the material to be processed according to a preset cutting path, that is, while the material to be processed is cut by the first laser according to the preset cutting path, the material to be processed can also be heated by the second laser to finally obtain the target material. Here, heating the material to be processed by the second laser can achieve a splitting effect, that is, a splitting process is realized.

[0059] In this way, two types of laser signals based on the configured lasers can be used to output two types of lasers and process the material according to a preset cutting path. This avoids the problem of using two types of lasers to cut the material multiple times in the related art. One laser can be used to cut the material and split it at the same time to obtain the target material, thus achieving a composite processing effect of cutting and splitting, simplifying the laser cutting process, thereby effectively improving the processing efficiency and improving the energy utilization efficiency of the laser.

[0060] Optionally, in a possible implementation of this embodiment, after step 101, in addition to executing step 102, in response to the operation of configuring the first laser signal, the first laser signal may be acquired, and based on the first laser signal, the first laser may be output, and then based on the first laser, the material to be processed may be cut on the processing platform according to the preset cutting path to obtain the first candidate material after cutting. In response to the operation of configuring the second laser signal, the second laser signal may be acquired, and based on the second laser signal, a second laser may be output, and based on the second laser, the first candidate material may be heated on the processing platform according to the preset cutting path to obtain the target material.

[0061] In this implementation, the first laser signal may include a first frequency value, a first voltage value, and a first duty cycle. The second laser signal may include a second frequency value, a second voltage value, and a second duty cycle. The first frequency value may be equal to the second frequency value, the first voltage value may be greater than the second voltage value, and the first duty cycle may be much smaller than the second duty cycle.

[0062] In a specific implementation process of this implementation method, first, in response to the operator's configuration operation of the first frequency value, the first voltage value and the first duty cycle of the first laser signal of the ultrafast laser, the ultrafast laser can obtain a first laser signal. Secondly, based on the first laser signal, the first laser is output, and then based on the first laser, the material to be processed is cut according to the preset cutting path on the processing platform to obtain the first candidate material after cutting. Thirdly, in response to the operator's configuration operation of the second frequency value, the second voltage value and the second duty cycle of the second laser signal of the ultrafast laser, the ultrafast laser can obtain a second laser signal. Thirdly, based on the second laser signal, a second laser is output, so as to heat the first candidate material according to the preset cutting path on the processing platform based on the second laser to obtain the target material.

[0063] It is understandable that the voltage value of the laser signal may correspond to the power of the output laser. For example, the total power of the ultrafast pulse laser is 100W, which corresponds to a 5V electrical signal. If the voltage value is 2.5V, by calculating 2.5V / 5V×100%=50%, the power of the output laser is 100W×50%=50W, and the power of the output laser corresponding to the voltage value 2.5V is 50W.

[0064] In this way, the material to be processed can be cut once based on the configured first laser to obtain the cut material, and then the cut material can be processed again based on the configured second laser, that is, heat treatment is performed to achieve splitting to obtain the final target material, that is, the first laser is used entirely in the cutting process, and the second laser is used entirely in the splitting process, so that the material cutting process can be completed using only one laser, which simplifies the equipment used in the processing, thereby improving the processing efficiency and at the same time improving the energy utilization efficiency of the laser.

[0065] Optionally, in a possible implementation of this embodiment, the material information of the material may include a thermal expansion coefficient. In step 102, first, in response to the thermal expansion coefficient of the material to be processed satisfying a preset first condition, the first laser signal and the second laser signal may be updated and configured. Secondly, in response to the update configuration operation of the first laser signal and the second laser signal, an updated first laser signal and an updated second laser signal are obtained, the voltage value of the updated second laser signal being greater than the second voltage value, and the voltage value of the updated second laser signal being less than the voltage value of the updated first laser signal. Again, based on the updated first laser signal and the updated second laser signal, the first laser and the second laser are output.

[0066] In this implementation, the preset first condition may be that the thermal expansion coefficient of the material is less than a preset threshold.

[0067] In a specific implementation process of this implementation, first, in response to the thermal expansion coefficient of the material to be processed being less than a preset threshold, the first laser signal and the second laser signal are updated and configured to lower the first voltage value of the first laser signal and increase the second voltage value of the second laser signal, to obtain an updated voltage value of the first laser signal and an updated voltage value of the second laser signal, wherein the updated voltage value of the second laser signal is greater than the second voltage value, and the updated voltage value of the second laser signal is less than the updated voltage value of the first laser signal. Secondly, based on the updated first laser signal and the updated second laser signal, the first laser and the second laser are output.

[0068] Here, the updated voltage value of the first laser signal may be smaller than the first voltage value of the first laser signal.

[0069] It is understandable that the smaller the thermal expansion coefficient of the material, the higher the energy required for the splitting process in the cutting process, that is, the greater the energy of the second laser. Therefore, the voltage value of the second laser signal needs to be increased to better achieve the cutting process of the material.

[0070] In this way, the first voltage value of the first laser signal can be lowered and the second voltage value of the second laser signal can be increased through configuration operations, which can effectively realize the cutting processing of materials with a smaller thermal expansion coefficient, thereby further improving the processing efficiency and improving the energy utilization efficiency of the laser.

[0071] It should be noted that the specific implementation process provided in this implementation can be combined with the multiple specific implementation processes provided in the aforementioned implementation to implement the laser cutting method of this embodiment. For detailed description, please refer to the relevant content in the aforementioned implementation, which will not be repeated here.

[0072] Optionally, in a possible implementation of this embodiment, the material information of the material may further include a damage threshold. In step 102, first, in response to the damage threshold of the material to be processed satisfying a preset second condition, the first laser signal and the second laser signal may be updated and configured. Secondly, in response to the update configuration operation of the first laser signal and the second laser signal, an updated first laser signal and an updated second laser signal are obtained, wherein the voltage value of the updated first laser signal is greater than the first voltage value, and the voltage value of the updated second laser signal is less than the second voltage. Thirdly, based on the updated first laser signal and the updated second laser signal, the first laser and the second laser are output.

[0073] In this implementation, the material information of the material may further include a damage threshold. The preset second condition may be that the damage threshold of the material is greater than a preset value.

[0074] In a specific implementation process of this implementation, in response to the damage threshold of the material to be processed being greater than a preset value, the first laser signal and the second laser signal are updated and configured to increase the first voltage value of the first laser signal and decrease the second voltage value of the second laser signal, to obtain an updated voltage value of the first laser signal and an updated voltage value of the second laser signal, wherein the updated voltage value of the first laser signal is greater than the first voltage value, and the updated voltage value of the second laser signal is less than the second voltage value. Secondly, based on the updated first laser signal and the updated second laser signal, the first laser and the second laser are output.

[0075] It is understandable that the greater the damage threshold of the material, the higher the cutting process capability required, that is, the greater the energy of the first laser. Therefore, the voltage value of the first laser signal needs to be increased to better achieve the cutting process of the material.

[0076] Exemplarily, the total power of the ultrafast pulse laser can be 100W, which can correspond to a 5V electrical signal. If the given first voltage value can be 3V and the second voltage value can be 2V, if the damage threshold of the material to be processed is greater than the preset value, the first voltage value and the second voltage value can be adjusted, and the new first voltage value can be 4V and the new second voltage value can be 1V.

[0077] In this way, the first voltage value of the first laser signal can be increased and the second voltage value of the second laser signal can be decreased through configuration operations, so as to effectively realize the cutting processing of materials with a large damage threshold, thereby further improving the processing efficiency and improving the energy utilization efficiency of the laser.

[0078] It should be noted that the specific implementation process provided in this implementation can be combined with the multiple specific implementation processes provided in the aforementioned implementation to implement the laser cutting method of this embodiment. For detailed description, please refer to the relevant content in the aforementioned implementation, which will not be repeated here.

[0079] Optionally, in a possible implementation of this embodiment, in step 103, specifically, firstly, based on the first laser and the second laser, the material to be processed can be cut according to a preset cutting path on the processing platform to obtain a second candidate material after cutting. Secondly, a carbon dioxide laser can be used to cut the second candidate material according to a preset cutting path on the processing platform to obtain a target material after cutting.

[0080] In this implementation, the cutting process is performed on the second candidate material, that is, the splitting process is performed on the second candidate material.

[0081] In a specific implementation process of this implementation method, firstly, based on the first laser and the second laser, the material to be processed can be cut according to a preset cutting path on the processing platform to obtain a second candidate material after cutting. Secondly, a carbon dioxide laser can be used to split the second candidate material according to a preset cutting path on the processing platform to obtain a target material.

[0082] It is understandable that, here, a second laser may be added to the cutting process to initially crack the material to be cut, and then the pre-cut material may be heated by the carbon dioxide laser, i.e., heated and scanned, to achieve the splitting. Since the first treatment is a composite processing using two types of lasers, the energy required by the carbon dioxide laser can be reduced in the second treatment, and the success rate and efficiency of the splitting process are improved.

[0083] In this implementation, the material information of the material may further include thickness.

[0084] In another specific implementation process of the implementation method, first, in response to the thickness of the material to be processed being greater than a preset thickness threshold, first, based on the first laser and the second laser, the material to be processed can be cut according to a preset cutting path on the processing platform to obtain a second candidate material after cutting. Secondly, a carbon dioxide laser can be used to cut the second candidate material according to a preset cutting path on the processing platform to obtain a target material after cutting.

[0085] Here, the preset thickness threshold may be determined according to the total power of the ultrafast pulse laser.

[0086] It is understandable that if the thickness of the material exceeds the range that can be cut by the total power of the ultrafast pulse laser, the material can be pre-cut with an ultrafast pulse laser and then cut again with a carbon dioxide laser to obtain the target material.

[0087] In this way, the success rate of material cutting can be guaranteed while saving the energy of the carbon dioxide laser.

[0088] It should be noted that the specific implementation process provided in this implementation can be combined with the multiple specific implementation processes provided in the aforementioned implementation to implement the laser cutting method of this embodiment. For detailed description, please refer to the relevant content in the aforementioned implementation, which will not be repeated here.

[0089] Optionally, in a possible implementation of this embodiment, the first laser is a main pulse laser, and the second laser is a quasi-continuous weak pulse laser.

[0090] In this implementation, the first laser may be a main pulse laser of an ultrafast pulse laser, i.e., a pulse laser. The second laser may be a quasi-continuous weak pulse laser, and the second laser may be a substrate laser. The substrate laser may refer to a quasi-continuous laser outputted along with the main pulse laser. The first laser signal may be a main pulse laser signal. The second laser signal may be a substrate laser signal.

[0091] For example, Figure 2 Schematic diagram of a first laser signal and a second laser signal in a laser cutting method provided by an embodiment of the present application. Figure 2 As shown, H can represent energy and t can represent time. The first laser signal has a higher energy (H) value and a smaller duty cycle, that is, the red pulse control signal. The second laser signal has a lower energy (H) value and a larger duty cycle, that is, the green pulse control signal. The second laser signal can be used as a base laser for a quasi-continuous weak pulse laser. Here, the first duty cycle of the first laser signal is much smaller than the second duty cycle of the second laser signal.

[0092] In a specific implementation process of the implementation method, first, in response to the operator's configuration operation of the first frequency value, the first voltage value and the first duty cycle of the main pulse laser signal of the ultrafast laser, and the configuration operation of the second frequency value, the second voltage value and the second duty cycle of the substrate laser signal of the ultrafast laser, the ultrafast laser can obtain the main pulse laser signal and the substrate laser signal. Secondly, based on the main pulse laser signal and the substrate laser signal, the main pulse laser and the substrate laser are output, and then based on the main pulse laser and the substrate laser, the material to be processed is cut on the processing platform according to the preset cutting path to obtain the target material after cutting.

[0093] For example, Figure 3 Schematic diagram of material cutting in a laser cutting method provided in one embodiment of the present application. Figure 3As shown, based on the main pulse laser and the base laser, an elliptical material can be cut by acting on the material simultaneously according to the path of ellipse + straight lines in four directions. While the main pulse laser can modify the inside of the material, the base laser (quasi-continuous light) also acts on the material, synchronized with the action position of the main pulse laser, and generates heat. At this time, the cutting path line of the material can absorb the heat and crack, thus achieving the cutting of the material. The red dotted line in the figure can be the cutting path corresponding to the main pulse laser, that is, the first laser trajectory, and the yellow solid line can be the cutting path corresponding to the base laser, that is, the second laser trajectory. In addition, here, the ellipse can be the shape of the target material, and the straight lines in the four directions are cutting lines used to release the cutting expansion pressure.

[0094] It can be understood that here, the substrate laser acting on materials such as glass can have enough heat to achieve a continuous laser effect similar to that of a carbon dioxide laser, and the substrate laser can adjust the pulse interval and pulse energy to achieve more precise processing control.

[0095] In this way, by controlling the laser to output the base laser and pulsed laser, the composite processing effect of cutting and splitting can be achieved during the material cutting process. Moreover, the base laser focus spot is smaller than the spot of the usual carbon dioxide laser, and thus its thermal impact is small, which reduces the difficulty of controlling the processing accuracy and can reduce the scrap rate to a certain extent, especially for materials with layers, which can have a better cutting effect.

[0096] In addition, in general related technologies, when ultrafast pulsed lasers are used to cut materials, the substrate laser is usually shielded, or the substrate laser is not processed, ignoring the role and influence of the substrate laser output, and not paying attention to the substrate laser heating and scanning function. As for the solution of this embodiment, technicians found in actual business applications that the substrate laser is a quasi-continuous light with a certain heating and scanning function, which can achieve the heating of the material and thus achieve the effect of splitting. Therefore, by controlling the output of the substrate laser, the pulse laser and the substrate laser can be rearranged on the time axis to achieve simultaneous output or separate output of the two lasers, thereby achieving the composite processing effect of pulsed laser cutting + substrate laser splitting.

[0097] It should be noted that the specific implementation process provided in this implementation can be combined with the multiple specific implementation processes provided in the aforementioned implementation to implement the laser cutting method of this embodiment. For detailed description, please refer to the relevant content in the aforementioned implementation, which will not be repeated here.

[0098] Optionally, in a possible implementation of this embodiment, the material may include but is not limited to at least one transparent brittle material of glass and sapphire.

[0099] It should be noted that the specific implementation process provided in this implementation can be combined with the multiple specific implementation processes provided in the aforementioned implementation to implement the laser cutting method of this embodiment. For detailed description, please refer to the relevant content in the aforementioned implementation, which will not be repeated here.

[0100] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0101] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0102] Figure 4 A structural block diagram of a laser cutting device provided by an embodiment of the present application is shown. Figure 4 As shown. The laser cutting device 400 of this embodiment can be applied to ultrafast pulse lasers, including an acquisition unit 401, an output unit 402, and a cutting unit 403. The acquisition unit 401 is used to acquire a first laser signal and a second laser signal; wherein the first laser signal includes a preconfigured first frequency value, a first voltage value, and a first duty cycle, and the second laser signal includes a preconfigured second frequency value, a second voltage value, and a second duty cycle, the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to the configuration operation; the output unit 402 is used to output the first laser and the second laser based on the first laser signal and the second laser signal; the cutting unit 403 is used to cut the material to be processed on the processing platform according to a preset cutting path based on the first laser and the second laser to obtain the target material after cutting.

[0103] Optionally, in a possible implementation of this embodiment, the acquisition unit 401 can be specifically used to acquire the first laser signal in response to the operation of configuring the first laser signal; output the first laser based on the first laser signal; cut the material to be processed on the processing platform according to the preset cutting path based on the first laser to obtain the first candidate material after cutting; acquire the second laser signal in response to the operation of configuring the second laser signal; output the second laser based on the second laser signal; and heat the first candidate material on the processing platform according to the preset cutting path based on the second laser to obtain the target material.

[0104] Optionally, in a possible implementation of this embodiment, the material information of the material includes a thermal expansion coefficient, and the output unit 402 can be specifically used to update the configuration operation of the first laser signal and the second laser signal in response to the thermal expansion coefficient of the material to be processed satisfying a preset first condition; in response to the update configuration operation of the first laser signal and the second laser signal, obtain an updated first laser signal and an updated second laser signal, the voltage value of the updated second laser signal is greater than the second voltage value, and the voltage value of the updated second laser signal is less than the voltage value of the updated first laser signal; based on the updated first laser signal and the updated second laser signal, output the first laser and the second laser.

[0105] Optionally, in a possible implementation of this embodiment, the material information of the material includes a damage threshold, and the output unit 402 can be specifically used to update the configuration operation of the first laser signal and the second laser signal in response to the damage threshold of the material to be processed satisfying a preset second condition; in response to the update configuration operation of the first laser signal and the second laser signal, obtain an updated first laser signal and an updated second laser signal, the voltage value of the updated first laser signal is greater than the first voltage value, and the voltage value of the updated second laser signal is less than the second voltage; based on the updated first laser signal and the updated second laser signal, output the first laser and the second laser.

[0106] Optionally, in a possible implementation of the present embodiment, the cutting unit 403 can be specifically used to cut the material to be processed according to a preset cutting path on the processing platform based on the first laser and the second laser to obtain a second candidate material after cutting; and use a carbon dioxide laser to cut the second candidate material according to a preset cutting path on the processing platform to obtain a target material after cutting.

[0107] Optionally, in a possible implementation of this embodiment, the first laser is a main pulse laser, and the second laser is a quasi-continuous weak pulse laser.

[0108] Optionally, in a possible implementation manner of this embodiment, the material includes at least one of glass, sapphire, and acrylic.

[0109] In this embodiment, the first laser signal and the second laser signal can be acquired by the acquisition unit; wherein the first laser signal includes a preconfigured first frequency value, a first voltage value and a first duty cycle, and the second laser signal includes a preconfigured second frequency value, a second voltage value and a second duty cycle, the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, and the first duty cycle is less than the second duty cycle, the first laser signal and the second laser signal are adjusted in response to the configuration operation, and the output unit outputs the first laser and the second laser based on the first laser signal and the second laser signal, so that the cutting unit can cut the material to be processed on the processing platform according to the preset cutting path based on the first laser and the second laser to obtain the target material after cutting. Since two types of lasers can be output by different types of laser signals based on the configured laser, and the material is processed according to the preset cutting path at the same time, it can avoid the use of two types of lasers in the related art to cut the material multiple times, and one laser can be used to complete the cutting and splitting of the material to obtain the target material, thereby achieving the composite processing effect of cutting and splitting, simplifying the laser cutting process, thereby effectively improving the processing efficiency and improving the energy utilization efficiency of the laser.

[0110] In an embodiment of the present application, a laser cutting system is also provided, which may include an ultrafast pulse laser and a processing platform, wherein:

[0111] The ultrafast pulse laser acquires a first laser signal and a second laser signal; wherein the first laser signal includes a preconfigured first frequency value, a first voltage value, and a first duty cycle, and the second laser signal includes a preconfigured second frequency value, a second voltage value, and a second duty cycle, wherein the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to a configuration operation; and based on the first laser signal and the second laser signal, a first laser and a second laser are output.

[0112] The processing platform is used to control the ultrafast pulse laser to cut the material to be processed based on the first laser and the second laser on the processing platform according to a preset cutting path to obtain the target material after cutting.

[0113] In an embodiment of the present application, an ultrafast pulse laser is provided, and the ultrafast pulse laser can execute the method of the above embodiment.

[0114] In the technical solution of this application, the user personal information involved, such as the collection, storage, use, processing, transmission, provision and disclosure of user images and attribute data, etc., complies with the provisions of relevant laws and regulations and does not violate public order and good morals.

[0115] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution disclosed in this application can be achieved, and this document is not limited here.

[0116] The above specific implementations do not constitute a limitation on the protection scope of this application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of this application should be included in the protection scope of this application.

Claims

1. A laser cutting method, characterized in that: Applied to ultrafast pulsed lasers, the method comprises: Acquire a first laser signal and a second laser signal; wherein the first laser signal includes a preconfigured first frequency value, a first voltage value, and a first duty cycle, and the second laser signal includes a preconfigured second frequency value, a second voltage value, and a second duty cycle, the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to a configuration operation; wherein the first laser signal and the second laser signal are both electrical signals of lasers; Based on the first laser signal and the second laser signal, output a first laser and a second laser; wherein the second laser refers to a quasi-continuous base laser output accompanying the first laser; Based on the first laser and the second laser, cutting the material to be processed according to a preset cutting path on the processing platform to obtain a target material after cutting, wherein the material to be processed includes glass; The method further comprises: In response to the operation of configuring the first laser signal, acquiring the first laser signal; Based on the first laser signal, output the first laser; Based on the first laser, cutting the material to be processed on the processing platform according to the preset cutting path to obtain a first candidate material after cutting; In response to the operation of configuring the second laser signal, acquiring the second laser signal; Based on the second laser signal, output a second laser; Based on the second laser, the first candidate material is heated and split on a processing platform according to the preset cutting path to obtain the target material.

2. The method according to claim 1, characterized in that The material information of the material includes a thermal expansion coefficient, and the outputting of the first laser and the second laser based on the first laser signal and the second laser signal includes: In response to the thermal expansion coefficient of the material to be processed satisfying a preset first condition, performing an update configuration operation on the first laser signal and the second laser signal; In response to updating the configuration operation of the first laser signal and the second laser signal, obtaining an updated first laser signal and an updated second laser signal, wherein a voltage value of the updated second laser signal is greater than the second voltage value, and a voltage value of the updated second laser signal is less than a voltage value of the updated first laser signal; Based on the updated first laser signal and the updated second laser signal, the first laser light and the second laser light are output.

3. The method according to claim 1, characterized in that The material information of the material includes a damage threshold, and the outputting of the first laser and the second laser based on the first laser signal and the second laser signal also includes: In response to the damage threshold of the material to be processed satisfying a preset second condition, performing an update configuration operation on the first laser signal and the second laser signal; In response to updating the configuration operation of the first laser signal and the second laser signal, obtaining an updated first laser signal and an updated second laser signal, wherein a voltage value of the updated first laser signal is greater than the first voltage value, and a voltage value of the updated second laser signal is less than the second voltage value; Based on the updated first laser signal and the updated second laser signal, the first laser light and the second laser light are output.

4. The method according to claim 1, characterized in that The method of cutting the material to be processed based on the first laser and the second laser according to a preset cutting path on the processing platform to obtain the target material after cutting includes: Based on the first laser and the second laser, cutting the material to be processed according to a preset cutting path on the processing platform to obtain a second candidate material after cutting; The second candidate material is cut by a carbon dioxide laser on a processing platform according to a preset cutting path to obtain a target material after cutting.

5. The method according to claim 1, characterized in that The first laser is a main pulse laser, and the second laser is a quasi-continuous weak pulse laser.

6. The method according to any one of claims 1 to 5, characterized in that The material also includes sapphire.

7. A laser cutting device, characterized in that: Applied to ultrafast pulse lasers, the device comprises: an acquisition unit, configured to acquire a first laser signal and a second laser signal; wherein the first laser signal comprises a preconfigured first frequency value, a first voltage value, and a first duty cycle, and the second laser signal comprises a preconfigured second frequency value, a second voltage value, and a second duty cycle, wherein the first frequency value is equal to the second frequency value, the first voltage value is greater than the second voltage value, the first duty cycle is less than the second duty cycle, and the first laser signal and the second laser signal are adjusted in response to a configuration operation; wherein the first laser signal and the second laser signal are both electrical signals of lasers; An output unit, configured to output a first laser and a second laser based on the first laser signal and the second laser signal; wherein the second laser refers to a quasi-continuous substrate laser outputted along with the first laser; A cutting unit, configured to cut the material to be processed on a processing platform according to a preset cutting path based on the first laser and the second laser to obtain a target material after cutting, wherein the material to be processed includes glass; The acquisition unit is further used to acquire the first laser signal in response to the operation of configuring the first laser signal; output the first laser based on the first laser signal; cut the material to be processed on the processing platform according to the preset cutting path based on the first laser to obtain the first candidate material after cutting; acquire the second laser signal in response to the operation of configuring the second laser signal; output the second laser based on the second laser signal; and heat and split the first candidate material on the processing platform according to the preset cutting path based on the second laser to obtain the target material.

Images