A mold and press molding method for making inorganic glue composite bamboo board

By designing molds and arranging bamboo reinforcement, unidirectional pressure molding of inorganic adhesive composite bamboo boards was achieved, solving the problems of difficult bamboo board splicing and high equipment requirements in existing technologies, and improving construction efficiency and molding quality.

CN119283138BActive Publication Date: 2026-07-07SHANDONG JIANZHU UNIV +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANDONG JIANZHU UNIV
Filing Date
2024-11-29
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Existing technologies have limitations in preparing wide bamboo boards, including difficulties in splicing, the ability to produce only one-way boards, and process defects. Furthermore, they require sophisticated pressing equipment and cannot effectively utilize the superior properties of bamboo.

Method used

A mold design is adopted, including a pressure platform, a board mold and a top cover. Unidirectional pressure forming is achieved through a hydraulic device. Combined with different bamboo reinforcement layout schemes, inorganic adhesive composite bamboo boards can be formed in one step, avoiding sawing and splicing of multiple boards.

Benefits of technology

It enables unidirectional pressure molding based on the wall panel size, simplifies the construction process, reduces seams, improves the equipment's versatility and molding efficiency, and maintains the overall performance of the bamboo panels.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to a kind of preparation inorganic glue composite bamboo board mould and pressurized forming method, belong to the technical field of building materials.The preparation inorganic glue composite bamboo board mould includes pressure platform, board mould and top cover, pressure platform includes steel frame and hydraulic device installed on steel frame, and board mould includes mould bottom plate and four side plates;The space surrounded by four side plates is placed with bamboo reinforcement pre-soaked in inorganic glue, and one-way pressing is carried out using hydraulic device.The present application adopts a kind of board mould, and is matched with different bamboo reinforcement layout scheme, and the inorganic glue composite bamboo board processed and prepared can be one-time forming by one-way pressing according to the characteristics that wallboard length and width are larger and thickness is smaller, does not need to be cut with saw cutting processing, and there is no joint gap generated by multiple boards splicing.
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Description

Technical Field

[0001] This invention relates to the technical field of building materials, specifically to a mold and pressure molding method for manufacturing inorganic adhesive composite bamboo boards. Background Technology

[0002] Bamboo and wood are unique among all building materials in that they can grow naturally, making them environmentally friendly and compliant with sustainable development principles. Compared to wood, bamboo can be harvested and used after four years of growth, and its strength is also higher, making its utilization even more important. Furthermore, bamboo buildings, due to their light weight and high strength, possess excellent earthquake resistance.

[0003] Traditional construction primarily uses reinforced concrete and clay bricks. The production of these materials not only consumes large amounts of non-renewable resources such as sand, stone, and clay, but also consumes significant amounts of energy and emits carbon dioxide, contradicting the goals of green and environmentally friendly practices. Therefore, the rational utilization of bamboo resources to replace traditional building materials has become an urgent priority.

[0004] Patents with application numbers 202010239326.5 and 202010239335.4 disclose the use of an inorganic adhesive produced from components such as magnesium oxide, magnesium sulfate heptahydrate, silica fume, silica sol, lithium silicate, sodium silicate, citric acid, microcrystalline cellulose, nanocellulose whiskers, aminotrimethylenephosphonic acid, and water to prepare bamboo and wood building materials. Patents with application numbers 202210575079.5, 202310073807.7, and 202310076789.8 disclose methods for preparing bamboo and wood components using the aforementioned inorganic adhesive and bamboo. Components produced by this method exhibit high strength, fire resistance, and corrosion resistance. The preparation of bamboo composite components using this inorganic adhesive requires first thinning the bamboo, then spraying the inorganic adhesive, placing it in layers within a steel template under bidirectional pressure up to 3 MPa, and finally curing and demolding. Existing processing molds are mostly 3m long steel templates with a cross-section of 0.4m × 0.4m. The formed composite components need to be sawn to produce the required beams, columns, etc. However, due to the limited mold width (only 0.4m) and the limitations of the compression equipment, assembling wall panel components requires multiple 0.4m wide panels, making joint treatment difficult and limiting assembly to one-way panels along the column reinforcement direction. If wider panels are to be produced, greater downward pressure compression equipment is needed, significantly increasing equipment requirements. Patent application number 202210909124.6 proposes a structure for inorganic adhesive two-way wall panels, but fails to propose a mold with pressure forming function, and does not propose a method for extending wall panel components whose length and width exceed the length of bamboo. Furthermore, the bamboo inserted into the mold before pressure is loose; existing molds often estimate the amount of bamboo added visually, and bamboo exceeding the top surface of the mold easily scatters outside the mold during pressure. Therefore, it is essential to develop a pressure formwork device and process that is suitable for various board and wall sizes and models and can overcome the above-mentioned process defects. Summary of the Invention

[0005] To address the technical problems existing in the preparation of wide bamboo panels, such as difficulties in splicing, the limitation to producing only unidirectional panels, and existing process defects, this invention provides a mold and pressure molding method for producing inorganic adhesive composite bamboo panels, thus solving the aforementioned problems. This invention employs a panel mold, combined with different bamboo reinforcement arrangements, to produce inorganic adhesive composite bamboo panels that can be unidirectionally pressure-molded in one step, taking advantage of the large length and width but small thickness of the wall panels. This eliminates the need for sawing and the seams caused by splicing multiple panels.

[0006] In a first aspect, the present invention provides a mold for manufacturing inorganic adhesive composite bamboo boards, comprising a pressure platform, a board mold, and a top cover; the pressure platform includes a steel frame and a hydraulic device mounted on the steel frame, the steel frame including four columns, two parallel upper crossbeams welded to the top of the columns, and two parallel lower crossbeams welded to the bottom of the columns; two secondary beams are welded to the middle of the two upper crossbeams; the hydraulic device is mounted on the two secondary beams; a platform base plate is provided at the bottom of the pressure platform; several bolt holes are opened on the platform base plate in a horizontal and vertical arrangement; bolts are installed in the bolt holes, and the bolts are used to fix the side guards; the distance between the bolt holes is different, which is prepared for processing boards of different lengths and widths. The side guards fixed by bolts are the support for the side plates in the board mold, and have a certain strength and rigidity.

[0007] The sheet metal mold includes a mold base plate and four side plates. The mold base plate is fixed within the space enclosed by the four side plates, and the side plates are placed on the mold base plate and abut against the side plates. Every two side plates are connected by a pivot. A groove parallel to the length of the side plate is opened on the top of the side plate. A movable baffle is installed in the groove. A spring is installed at the bottom of the groove, and the spring abuts against the movable baffle. After the movable baffle moves into the groove, its top is flush with the top of the side plate. The outward extension height of the movable baffle is 1 / 10 to 1 / 8 of the height of the side plate. The top cover is placed on the movable baffle, and its edge covers the movable baffle.

[0008] Furthermore, the outer edge of the groove in the side plate is provided with a cutting edge, which serves as a guide device during the pressing down of the top cover.

[0009] Furthermore, the side panels are equipped with multiple clips on their outer sides, and the top cover has hooks on its edge that mate with the clips. When the top cover is pressed down, the hooks can be fixed to the clips to maintain the pressure level inside the template. After the panels inside the curing template are fixed and formed, the hooks can be removed to unload and demold.

[0010] Furthermore, the upper surface of the top cover is welded with reinforcing ribs; there are multiple reinforcing ribs, arranged in a crisscross pattern; a load-bearing plate is welded to the center of the top cover where the reinforcing ribs are located.

[0011] Furthermore, a V-groove is provided at the edge of the lower surface of the top cover. The V-groove works in conjunction with the cutting edge. When the top cover is pressed down, the cutting edge provided at the outer edge of the groove of the side plate is inserted into the V-groove to achieve precise positioning of the top cover and the plate mold.

[0012] Secondly, the present invention also provides a pressure molding method for producing inorganic adhesive composite bamboo boards using the above-mentioned mold, comprising the following steps:

[0013] (1) Select the position of the bolt holes on the platform base plate according to the size of the processing plate, and fix the side guard with bolts;

[0014] (2) Install the side panel onto the inside of the side guard;

[0015] (3) Bamboo strips are laid layer by layer in the mold according to the direction of bamboo strip laying. The bamboo strips are pre-impregnated with inorganic glue. If bamboo strip joints are required, joints are set according to regulations. If conduit boxes or junction boxes are required, they are laid according to regulations. Finally, the top row of bamboo strips is filled to be flush with the top of the movable baffle.

[0016] (4) Hoist the top cover above the plate mold, align it, and then apply pressure to the top cover with a jack;

[0017] (5) Remove the side panel and move the mold and top cover to the curing room; cure at 30℃ for 20~24h, remove the top cover, rotate the side panel to take out the formed inorganic adhesive composite bamboo board from the mold, continue curing for 150h to obtain inorganic adhesive composite bamboo board.

[0018] Furthermore, when the inorganic adhesive composite bamboo board is made into a one-way board, the bamboo ribs are evenly distributed in the same direction within the template. Generally speaking, the direction in which the bamboo ribs are distributed is the main stress direction of the one-way board.

[0019] Furthermore, when the inorganic adhesive composite bamboo board is made into a two-way board, the nth layer of bamboo ribs in the template is arranged perpendicularly to the (n+1)th layer of bamboo ribs, thus forming a two-way board; where n is a positive integer. This board can withstand force in two mutually perpendicular directions.

[0020] Furthermore, when the side length of the inorganic adhesive composite bamboo board is longer than the length of the bamboo ribs, the bamboo ribs need to be extended. To ensure reliable force transmission at the joint, the tops of adjacent bamboo ribs must be staggered.

[0021] Furthermore, when fabricating boards with overlapping bamboo reinforcement, the following method is used:

[0022] If the bamboo reinforcement joint in the first column of the 3n-2 (n is a positive integer) layer is 1 / 4 span from the end of the board, then the bamboo reinforcement joint in the second column will be 1 / 2 span from the end of the board, and the bamboo reinforcement joint in the third column will be 3 / 4 span from the end of the board. The joint sequence of the first three columns is repeated starting from the fourth column.

[0023] In the 3n-1 (n is a positive integer) layer, the bamboo reinforcement joint in the first column is located 1 / 2 span from the end of the board, the bamboo reinforcement joint in the second column is located 3 / 4 span from the end of the board, the bamboo reinforcement joint in the third column is located 1 / 4 span from the end of the board, and the joint sequence of the first 3 columns is repeated starting from the fourth column.

[0024] In the 3nth (n is a positive integer) layer, the bamboo reinforcement joint in the first column is located 3 / 4 of the span from the end of the board, the bamboo reinforcement joint in the second column is located 1 / 4 of the span from the end of the board, and the bamboo reinforcement joint in the third column is located 1 / 2 of the span from the end of the board. Starting from the fourth column, the joint sequence of the first three columns is repeated.

[0025] When fabricating a unidirectional plate, the odd-numbered layers are arranged in the same direction as the even-numbered layers; when fabricating a two-way plate, the odd-numbered layers are arranged perpendicularly to the even-numbered layers.

[0026] This arrangement ensures that the joints are spaced at least 1 / 4 span apart between adjacent bamboo reinforcement joints within each layer, and also at least 1 / 4 span apart between bamboo reinforcement joints in adjacent layers. This guarantees the proper transfer of force across the bamboo reinforcement.

[0027] Furthermore, when the inorganic adhesive composite bamboo board being manufactured requires the installation of conduits, the conduits are installed parallel to the direction of the bamboo fibers, and the conduits are covered with a bamboo fiber layer of at least one thickness from the outer surface of the board. In addition, the conduits can withstand a pressure of 3MPa.

[0028] The beneficial effects of this invention are as follows:

[0029] (1) Based on the characteristics of the wall panel having a large length and width but a small thickness, the present invention provides a mold with unidirectional pressure and side baffles to withstand lateral pressure, which is simpler in structure than the traditional inorganic glue mold with bidirectional loading. After loading, it is formed in one step, without the need for sawing or processing, and there are no seams caused by splicing multiple panels.

[0030] (2) By setting up a movable baffle, the present invention not only prevents the bamboo fiber material that is higher than the mold from falling outward, but also by setting the ratio of the height of the baffle to the height of the mold, it is only necessary to compress the top cover to be flush with the top surface of the template to obtain an inorganic adhesive composite bamboo board with an appropriate compression ratio (90%), without having to control the pressure value to reach 3MPa, which is simpler than the traditional pressure control method.

[0031] (3) The present invention can also use hooks and clamps to maintain the pressure inside the mold, and use the pivot between the side blocks to facilitate the assembly and disassembly of the template, making the construction process convenient.

[0032] (4) The present invention provides multiple rows of bolt holes on the platform base plate, which can fix various types of molds, increasing the versatility of the platform.

[0033] (5) In the production of the bamboo reinforcement overlapping panel, the present invention achieves bamboo reinforcement extension by reasonably setting the joint position, and can make full use of the cut bamboo reinforcement scraps. The conduit is set in the panel along the parallel direction of the bamboo reinforcement, which reduces the impact of the conduit on the integrity of the bamboo reinforcement and maintains the beautiful bamboo grain appearance of the bamboo composite panel. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1This is a schematic diagram of the pressurization platform of the present invention.

[0036] Figure 2 This is the front view of the pressurization platform of the present invention.

[0037] Figure 3 This is a schematic diagram of the structure of the present invention after the side guard is installed.

[0038] Figure 4 This is a front view of the present invention after the side guards are installed.

[0039] Figure 5 This is a schematic diagram of the structure of the plate mold of the present invention.

[0040] Figure 6 This is a schematic diagram of the structure of the plate mold of the present invention placed on the pressure platform.

[0041] Figure 7 This is a plan view of the sheet metal mold of the present invention placed on the pressure platform.

[0042] Figure 8 This is a plan view of the mold of the plate of the present invention filled with sprayed inorganic glue bamboo fiber.

[0043] Figure 9 This is a schematic diagram of the top cover of the present invention.

[0044] Figure 10 This is a plan view of the top cover of the present invention placed after the plate mold.

[0045] Figure 11 This is a schematic diagram of the hydraulic device of the pressurization platform of the present invention pressurizing the top cover.

[0046] Figure 12 This is a front view of the hydraulic device of the pressurization platform of the present invention pressurizing the top cover.

[0047] In the diagram, 1-upper crossbeam, 2-column, 3-lower crossbeam, 4-platform base plate, 5-bolt hole, 6-hydraulic device, 7-secondary beam, 8-side guard, 9-top cover, 10-bolt, 11-side plate, 12-movable baffle, 13-mold base plate, 14-clamp, 15-rotating shaft, 16-blade angle, 17-spring, 18-bamboo rib, 19-reinforcing rib, 20-hook, 21-stress plate, 22-V-groove. Detailed Implementation

[0048] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0049] Example 1

[0050] like Figures 1-6 As shown, a mold for producing inorganic adhesive composite bamboo boards includes a pressure platform, a board mold, and a top cover 9. The pressure platform includes a steel frame and a hydraulic device 6 mounted on the steel frame. The steel frame includes four columns 2, two parallel upper crossbeams 1 welded to the top of the columns 2, and two parallel lower crossbeams 3 welded to the bottom of the columns 2. Two secondary beams 7 are welded to the middle of the two upper crossbeams. The hydraulic device 6 is mounted on the two secondary beams 7. A platform base plate 4 is provided at the bottom of the pressure platform. Several bolt holes 5 are opened on the platform base plate 4 in a horizontal and vertical arrangement. Bolts 10 are installed in the bolt holes 5 and are used to fix the side guards 8. The board mold includes a mold base plate. The mold base plate 13 and four side plates 11 are fixed within the space enclosed by the four side plates 8. The side plates 11 are placed on the mold base plate 13 and abut against the side plates 8. Every two side plates 11 are connected by a pivot 15. A groove parallel to the length of the side plate 11 is opened on the top of the side plate 11. A movable baffle 12 is installed in the groove. A spring 17 is installed at the bottom of the groove and abuts against the movable baffle 12. After the movable baffle 12 moves into the groove, its top is flush with the top of the side plate 11. The outward extension height of the movable baffle 12 is 1 / 10 to 1 / 8 of the height of the side plate 11. The top cover 9 is placed on the movable baffle 12 and its edge covers the movable baffle 12.

[0051] In some embodiments, such as Figure 7 As shown, a cutting edge 16 is provided at the outer edge of the groove of the side plate 11, which serves as a guide device during the pressing down process of the top cover 9.

[0052] In some embodiments, such as Figure 5 As shown, the outer side of the side plate 11 is provided with multiple clips 14; as Figure 9 As shown, the edge of the top cover 9 is provided with a hook 20 for use with the card head; as Figure 11 As shown, when the top cover 9 is pressed down, the hook 20 can be fixed on the clamp 14, which can maintain the pressure level inside the template. After the plate inside the curing template is fixed and formed, the hook can be removed to achieve unloading and demolding.

[0053] In some embodiments, such as Figure 9As shown, the upper surface of the top cover 9 is welded with reinforcing ribs 19; there are multiple reinforcing ribs 19, arranged in a crisscross pattern.

[0054] In some embodiments, such as Figure 10 As shown, a V-shaped groove 22 is provided at the edge of the lower surface of the top cover 9, such as... Figure 12 As shown, the V-groove 22 works in conjunction with the cutting edge 16. When the top cover 9 is pressed down, the cutting edge 16 set at the outer edge of the groove of the side plate 11 is inserted into the V-groove 22 to achieve precise positioning of the top cover 9 and the plate mold.

[0055] Example 2

[0056] A method for manufacturing inorganic adhesive composite bamboo board (one-way board) using the mold of Example 1 includes the following steps:

[0057] (1) Select the position of the bolt holes on the platform base plate according to the required processing plate size, and fix the side guards with bolts;

[0058] (2) Install the side panel onto the inside of the side guard;

[0059] (3) The bamboo strips are evenly distributed in the same direction in the board mold, and the bamboo strips are laid layer by layer. The bamboo strips are pre-impregnated with inorganic glue.

[0060] (4) Hoist the top cover above the plate mold, align it, and then apply pressure to the top cover with a jack;

[0061] (5) Remove the side panel and move the mold and top cover to the curing room; cure at 30℃ for 20~24h, remove the top cover, rotate the side panel to take out the formed inorganic adhesive composite bamboo board from the mold, continue curing for 150h to obtain inorganic adhesive composite bamboo board (one-way board).

[0062] Example 3

[0063] A method for manufacturing inorganic adhesive composite bamboo board (two-way board) using the mold of Example 1 includes the following steps:

[0064] (1) Select the position of the bolt holes on the platform base plate according to the required processing plate size, and fix the side guards with bolts;

[0065] (2) Install the side panel onto the inside of the side guard;

[0066] (3) In the board mold, the nth layer of bamboo strips and the (n+1)th layer of bamboo strips are arranged vertically, and the bamboo strips are arranged layer by layer. The bamboo strips are pre-impregnated with inorganic glue.

[0067] (4) Hoist the top cover above the plate mold, align it, and then apply pressure to the top cover with a jack;

[0068] (5) Remove the side panel and move the mold and top cover to the curing room; cure at 30℃ for 20~24h, remove the top cover, rotate the side panel to take out the formed inorganic adhesive composite bamboo board from the mold, continue curing for 150h to obtain inorganic adhesive composite bamboo board (two-way board).

[0069] Example 4

[0070] A method for manufacturing a bamboo-reinforced lap joint board (one-way board) using the mold of Example 1 includes the following steps:

[0071] (1) Select the position of the bolt holes on the platform base plate according to the required processing plate size, and fix the side guards with bolts;

[0072] (2) Install the side panel onto the inside of the side guard;

[0073] (3) In the board mold, the bamboo reinforcement joint of the first column of the first layer is 1 / 4 span away from the end of the board, the bamboo reinforcement joint of the second column is 1 / 2 span away from the end of the board, and the bamboo reinforcement joint of the third column is 3 / 4 span away from the end of the board. The joint sequence of the first 3 columns is repeated starting from the fourth column. The second layer is set in the same direction as the first layer, the bamboo reinforcement joint of the first column is 1 / 2 span away from the end of the board, the bamboo reinforcement joint of the second column is 3 / 4 span away from the end of the board, and the bamboo reinforcement joint of the third column is 1 / 4 span away from the end of the board. The joint sequence of the first 3 columns is repeated starting from the fourth column. The third layer is set in the same direction as the second layer, the bamboo reinforcement joint of the first column is 3 / 4 span away from the end of the board, the bamboo reinforcement joint of the second column is 1 / 4 span away from the end of the board, and the bamboo reinforcement joint of the third column is 1 / 2 span away from the end of the board. The joint sequence of the first 3 columns is repeated starting from the fourth column. The bamboo reinforcement is then laid layer by layer in the same order as above, and the bamboo reinforcement is pre-impregnated with inorganic glue.

[0074] (4) Hoist the top cover above the plate mold, align it, and then apply pressure to the top cover with a jack;

[0075] (5) Remove the side panel and move the mold and top cover to the curing room; cure at 30℃ for 20~24h, remove the top cover, rotate the side panel to take out the formed inorganic adhesive composite bamboo board from the mold, continue curing for 150h to obtain inorganic adhesive composite bamboo board (two-way board).

[0076] Furthermore, when the inorganic adhesive composite bamboo board being manufactured requires the installation of conduits, the conduits should be installed parallel to the direction of the bamboo fibers, and the conduits should be covered by a bamboo fiber layer at least one layer thick from the outer surface of the board. In addition, the conduits should be able to withstand a pressure of 3 MPa.

[0077] Although the present invention has been described in detail with reference to the accompanying drawings and preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made to the embodiments of the present invention by those skilled in the art without departing from the spirit and essence of the invention, and such modifications or substitutions should all be within the scope of the present invention. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should also be covered within the protection scope of the present invention.

Claims

1. A method for press molding inorganic adhesive composite bamboo boards, characterized in that, Includes the following steps: (1) Select the position of the bolt holes on the platform base plate according to the size of the processing plate, and fix the side guard with bolts; (2) Install the side panel onto the inside of the side guard; (3) Bamboo strips are laid layer by layer in the mold according to the direction of bamboo strip laying. The bamboo strips are pre-soaked in inorganic glue. Finally, the top row of bamboo strips is filled to be flush with the top of the movable baffle. (4) Hoist the top cover above the plate mold, align it, and then apply pressure to the top cover with a jack; (5) Remove the side guards and move the board mold and top cover to the curing room; After curing at 30℃ for 20-24 hours, remove the top cover, rotate the side panel to remove the formed inorganic adhesive composite bamboo board from the board mold, and continue curing for 150 hours to obtain the inorganic adhesive composite bamboo board. When the side length of the inorganic adhesive composite bamboo board is longer than the length of the bamboo ribs, the bamboo ribs need to be lengthened. The following method can be used: If the joint of the first column of bamboo reinforcement in the 3n-2th layer is 1 / 4 span from the end of the board, then the joint of the second column of bamboo reinforcement is 1 / 2 span from the end of the board, and the joint of the third column of bamboo reinforcement is 3 / 4 span from the end of the board; the joint sequence of the first three columns is repeated starting from the fourth column. The bamboo reinforcement joints in the first column of the 3n-1 layer are located 1 / 2 span from the end of the board, the bamboo reinforcement joints in the second column are located 3 / 4 span from the end of the board, the bamboo reinforcement joints in the third column are located 1 / 4 span from the end of the board, and the joint sequence of the first three columns is repeated starting from the fourth column. The bamboo reinforcement joints in the first column of the 3nth layer are 3 / 4 span from the end of the board, the bamboo reinforcement joints in the second column are 1 / 4 span from the end of the board, the bamboo reinforcement joints in the third column are 1 / 2 span from the end of the board, and the joint sequence of the first three columns is repeated starting from the fourth column. Where n is a positive integer; when fabricating a unidirectional plate, the odd-numbered layers and even-numbered layers are set in the same direction; when fabricating a bidirectional plate, the odd-numbered layers and even-numbered layers are set perpendicular to each other; The mold includes a pressure platform, a plate mold, and a top cover (9); the pressure platform includes a steel frame and a hydraulic device (6) installed on the steel frame. The steel frame includes four columns (2), two parallel upper crossbeams (1) welded to the top of the columns (2), and two parallel lower crossbeams (3) welded to the bottom of the columns (2); two secondary beams (7) are welded in the middle of the two upper crossbeams; the hydraulic device (6) is installed on the two secondary beams (7); a platform base plate (4) is provided at the bottom of the pressure platform; several bolt holes (5) are opened on the platform base plate (4) arranged horizontally and vertically; bolts (10) are installed in the bolt holes (5), and the bolts (10) are used to fix the side guards (8); The plate mold includes a mold base plate (13) and four side plates (11); the mold base plate (13) is fixed in the space enclosed by the four side blocks (8), and the side plates (11) are placed on the mold base plate (13) and abut against the side blocks (8); every two side plates (11) are connected by a pivot (15); a groove parallel to the length direction of the side plate (11) is opened on the top of the side plate (11); a movable baffle (12) is installed in the groove; a spring (17) is installed at the bottom of the groove and abuts against the movable baffle (12); after the movable baffle (12) moves into the groove, its top is flush with the top of the side plate (11); the outward extension height of the movable baffle (12) is one-tenth to one-eighth of the height of the side plate (11); the top cover (9) is placed on the movable baffle (12) and its edge covers the movable baffle (12).

2. The pressure molding method as described in claim 1, characterized in that, The outer edge of the groove of the side plate (11) is provided with a cutting edge (16) as a guide device during the pressing process of the top cover (9).

3. The pressure molding method as described in claim 1, characterized in that, The side panel (11) has multiple clips (14) on its outer side, and the top cover (9) has hooks (20) on its edge that work with the clips.

4. The pressure molding method as described in claim 1, characterized in that, The top surface of the top cover (9) is welded with reinforcing ribs (19); there are multiple reinforcing ribs (19), which are arranged in a crisscross pattern; a load-bearing plate (21) is welded to the center of the top cover (9) where the reinforcing ribs (19) are located.

5. The pressure molding method as described in claim 1, characterized in that, A V-groove (22) is provided at the edge of the lower surface of the top cover (9). The V-groove (22) is used in conjunction with the cutting edge (16). When the top cover (9) is pressed down, the cutting edge (16) provided at the outer edge of the groove of the side plate (11) is inserted into the V-groove (22) to achieve precise positioning of the top cover (9) and the plate mold.

6. The pressure molding method as described in claim 1, characterized in that, When the inorganic adhesive composite bamboo board being produced is a one-way board, the bamboo ribs are evenly distributed in the same direction within the template.

7. The pressure molding method as described in claim 1, characterized in that, When the inorganic adhesive composite bamboo board is a two-way board, the nth layer of bamboo ribs in the template is arranged perpendicularly to the (n+1)th layer of bamboo ribs, where n is a positive integer.

8. The pressure molding method as described in claim 1, characterized in that, When the inorganic adhesive composite bamboo board being manufactured requires the installation of conduits, the conduits should be installed parallel to the direction of the bamboo fibers. The conduits should be covered with a layer of bamboo fibers at least one layer thick from the outer surface of the board, and the conduits should be able to withstand a pressure of 3 MPa.