Protective adhesive tape for heat dissipation of semiconductor chip

Abstract

The invention discloses a protective adhesive tape for heat dissipation of a semiconductor chip, which relates to the technical field of semiconductor packaging and comprises a first release layer, a first functional adhesive layer, an aluminum foil base material, a second functional adhesive layer and a second release layer which are sequentially laminated from top to bottom, the first functional adhesive layer and the second functional adhesive layer are independently prepared from the following raw materials: a heat-conducting filler, an epoxidized thermoplastic elastomer, acrylic acid modified polyether-ether-ketone, 2, 4-diamino-6-diallylamino-1, 3, 5-trimethyl-1, 3, 5-trimethyl-1, 3, 5-trimethyl-1, 3, 5-trimethyl-1, 3, 5-trimethyl-1, 3, 5-trimethyl-1 The adhesive is prepared from the following raw materials: 1, 3, 5-triazine, butyl acrylate, 4-methyl-5-vinyl thiazole, 2-(1-propylene-2-yl) benzo [D] oxazole, allyl succinimido carbonate, terpene resin, an antioxidant and an initiator. The protective adhesive tape for heat dissipation of the semiconductor chip is good in adhesive property and excellent in high temperature resistance, heat dissipation and heat conduction performance and exhaust performance.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, and in particular to a protective tape used for heat dissipation of semiconductor chips. Background Art

[0002] Semiconductor chips are a way of miniaturizing circuits (mainly semiconductor devices, but also passive components, etc.) in electronics, and are often manufactured on the surface of semiconductor wafers. In order to increase the service life of semiconductor chips, it is necessary to paste protective tape on the surface of semiconductor chips to make them not easily damaged, high temperature resistant, and insulated. Existing protective tapes for semiconductor chips have poor high temperature resistance and bonding properties, and the heat dissipation, thermal conductivity, and exhaust performance need to be further improved, which affects the protection effect of semiconductor chips.

[0003] In order to solve the above problems, the Chinese invention patent with the authorization announcement number CN109075055B discloses a semiconductor wafer surface protection tape and a processing method of a semiconductor wafer using the tape, wherein the semiconductor wafer surface protection tape is heated and bonded to the surface of a semiconductor wafer having a concave-convex difference of 20 μm or more under the condition of 40°C to 90°C, wherein the semiconductor wafer surface protection tape comprises a substrate film, an adhesive layer, and an intermediate resin layer located between the substrate film and the adhesive layer, the thickness of the intermediate resin layer is greater than the concave-convex difference, the melting point or Vickers softening point of the resin constituting the intermediate resin layer is 40°C to 90°C, and the melt mass flow rate of the resin constituting the intermediate resin layer is 10g / 10min to 100g / 10min. However, the high temperature resistance, heat dissipation and thermal conductivity of the tape and the exhaust performance still need to be further improved.

[0004] It can be seen that it is necessary to seek a more effective method to prepare a protective tape for semiconductor chip heat dissipation that has good bonding properties, excellent high temperature resistance, heat dissipation and thermal conductivity, and exhaust performance, and has a significant protective effect on semiconductor chips. Summary of the invention

[0005] The main purpose of the present invention is to provide a protective tape for semiconductor chip heat dissipation, which has good bonding performance, high temperature resistance, heat dissipation and thermal conductivity, and exhaust performance, and has a significant protective effect on semiconductor chips.

[0006] To achieve the above purpose, the present invention provides a protective tape for semiconductor chip heat dissipation, comprising a first release layer, a first functional adhesive layer, an aluminum foil substrate, a second functional adhesive layer and a second release layer which are stacked in sequence from top to bottom; the first functional adhesive layer and the second functional adhesive layer are independently made of the following raw materials in parts by weight: 25-45 parts of thermal conductive filler, 10-20 parts of epoxidized thermoplastic elastomer, 15-25 parts of acrylic acid-modified polyetheretherketone, 3-5 parts of 2,4-diamino-6-diallylamino-1,3,5-triazine, 30-40 parts of butyl acrylate, 3-5 parts of 4-methyl-5-vinylthiazole, 1-3 parts of 2-(1-propylene-2-yl)benzo[D]oxazole, 0.8-1.2 parts of allyl succinimidyl carbonate, 3-5 parts of terpene resin, 0.5-0.8 parts of antioxidant and 0.8-1.2 parts of initiator.

[0007] Preferably, the thermally conductive filler is at least one of alumina, silicon powder, and aluminum nitride; and the particle size of the thermally conductive filler is 800-1500 mesh.

[0008] Preferably, the epoxidized thermoplastic elastomer is selected from the epoxidized thermoplastic elastomer EPOFRIEND CT310 produced by Daicel of Japan.

[0009] Preferably, there is no special requirement for the source of the acrylic acid-modified polyetheretherketone. In one embodiment of the present invention, the acrylic acid-modified polyetheretherketone is prepared according to the method of Example 1 of the Chinese invention patent with authorization publication number CN109337019B.

[0010] Preferably, the terpene resin is terpene resin T-80; the antioxidant is at least one of antioxidant 1010 and antioxidant 168; and the initiator is azobisisobutyronitrile.

[0011] Preferably, the first release layer and the second release layer are independently made of any one of a PE release film, a PET release film, a PS release film and a PMMA release film.

[0012] Preferably, the thickness of the first release layer is 10-40 μm; the thickness of the second release layer is 10-40 μm.

[0013] Preferably, the thickness of the aluminum foil substrate is 30 μm; the thickness of the first functional adhesive layer is 15-25 μm; and the thickness of the second functional adhesive layer is 15-25 μm.

[0014] Another object of the present invention is to provide a method for preparing the protective tape for heat dissipation of semiconductor chips, comprising the following steps: Step S1, performing double-sided corona pretreatment on the aluminum foil substrate; Step S2, applying a second functional adhesive on the second release layer and laminating it with the lower layer of the aluminum foil substrate; Step S3, coating the first functional adhesive on the first release layer, laminating it with the upper layer of the aluminum foil substrate, drying it, and rolling it up for maturation; Step S4, the protective tape for heat dissipation of semiconductor chips is obtained by stripping into specified widths.

[0015] Due to the application of the above technical solution, the present invention has the following beneficial effects: (1) The present invention discloses a method for preparing a protective tape for semiconductor chip heat dissipation. The method has a simple process, convenient operation and control, high preparation efficiency and finished product qualification rate, no need for special equipment, low capital investment, low energy consumption, and is suitable for continuous large-scale production. It has a high value for promotion and application.

[0016] (2) The protective tape for semiconductor chip heat dissipation disclosed in the present invention comprises a first release layer, a first functional adhesive layer, an aluminum foil substrate, a second functional adhesive layer and a second release layer which are stacked in sequence from top to bottom; such a structural design enables the tape to have excellent air discharge, heat dissipation and thermal conductivity and stability; the first functional adhesive layer and the second functional adhesive layer are independently made of the following raw materials in parts by weight: 25-45 parts of thermal conductive filler, epoxidized thermoplastic 10-20 parts of elastomer, 15-25 parts of acrylic acid modified polyetheretherketone, 3-5 parts of 2,4-diamino-6-diallylamino-1,3,5-triazine, 30-40 parts of butyl acrylate, 3-5 parts of 4-methyl-5-vinylthiazole, 1-3 parts of 2-(1-propylene-2-yl)benzo[D]oxazole, 0.8-1.2 parts of allyl succinimidyl carbonate, 3-5 parts of terpene resin, 0.5-0.8 parts of antioxidant, and 0.8-1.2 parts of initiator. Through the mutual coordination and joint action of various raw materials, the product can be endowed with advantages such as good bonding performance, high temperature resistance, heat dissipation and thermal conductivity, and excellent exhaust performance, and significant protection for semiconductor chips.

[0017] (3) The protective tape for semiconductor chip heat dissipation disclosed in the present invention, through the reasonable selection of raw material types and dosage ratios for preparing the first functional adhesive layer and the second functional adhesive layer, allows the raw materials containing unsaturated olefinic bonds to undergo copolymerization during use, and the raw materials containing epoxy groups can undergo epoxy ring-opening reaction with the raw materials containing amino groups. Multiple interpenetrating network structures are introduced into the film at the same time, which can effectively improve the high temperature resistance and bonding performance of the product. The thermal conductive fillers are tightly connected and evenly dispersed in these interpenetrating network structures to form more effective thermal conductive bridges, thereby effectively dissipating heat and conducting heat. The use of aluminum foil substrate can achieve better air discharge and at the same time improve the mechanical properties and heat dissipation and thermal conductivity of the tape. DETAILED DESCRIPTION

[0018] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations. Example 1

[0019] A protective adhesive tape for heat dissipation of semiconductor chips comprises a first release layer, a first functional adhesive layer, an aluminum foil substrate, a second functional adhesive layer and a second release layer which are stacked in sequence from top to bottom; the first functional adhesive layer and the second functional adhesive layer are independently made of the following raw materials in parts by weight: 25 parts of thermal conductive filler, 10 parts of epoxidized thermoplastic elastomer, 15 parts of acrylic acid-modified polyetheretherketone, 3 parts of 2,4-diamino-6-diallylamino-1,3,5-triazine, 30 parts of butyl acrylate, 3 parts of 4-methyl-5-vinylthiazole, 1 part of 2-(1-propylene-2-yl)benzo[D]oxazole, 0.8 parts of allyl succinimidyl carbonate, 3 parts of terpene resin, 0.5 parts of antioxidant and 0.8 parts of initiator.

[0020] The thermally conductive filler is alumina; the particle size of the thermally conductive filler is 800 mesh; the epoxidized thermoplastic elastomer is selected from the epoxidized thermoplastic elastomer EPOFRIEND CT310 of Japan Daicel; the acrylic modified polyetheretherketone is prepared according to the method of Example 1 of the Chinese invention patent with authorization announcement number CN109337019B; the terpene resin is terpene resin T-80; the antioxidant is antioxidant 1010; and the initiator is azobisisobutyronitrile.

[0021] The first release layer and the second release layer are independently made of PE release films; the thickness of the first release layer is 10 μm; the thickness of the second release layer is 10 μm; the thickness of the aluminum foil substrate is 30 μm; the thickness of the first functional adhesive layer is 15 μm; and the thickness of the second functional adhesive layer is 15 μm.

[0022] A method for preparing the protective tape for semiconductor chip heat dissipation comprises the following steps: Step S1, performing double-sided corona pretreatment on the aluminum foil substrate; Step S2, applying a second functional adhesive on the second release layer and laminating it with the lower layer of the aluminum foil substrate; Step S3, coating the first functional adhesive on the first release layer, laminating it with the upper layer of the aluminum foil substrate, drying it, and rolling it up for maturation; Step S4, the protective tape for heat dissipation of semiconductor chips is obtained by stripping into specified widths. Example 2

[0023] A protective adhesive tape for heat dissipation of semiconductor chips comprises a first release layer, a first functional adhesive layer, an aluminum foil substrate, a second functional adhesive layer and a second release layer which are stacked in sequence from top to bottom; the first functional adhesive layer and the second functional adhesive layer are independently made of the following raw materials in parts by weight: 30 parts of thermal conductive filler, 13 parts of epoxidized thermoplastic elastomer, 17 parts of acrylic acid-modified polyetheretherketone, 3.5 parts of 2,4-diamino-6-diallylamino-1,3,5-triazine, 33 parts of butyl acrylate, 3.5 parts of 4-methyl-5-vinylthiazole, 1.5 parts of 2-(1-propylene-2-yl)benzo[D]oxazole, 0.9 parts of allyl succinimidyl carbonate, 3.5 parts of terpene resin, 0.6 parts of antioxidant and 0.9 parts of initiator.

[0024] The thermally conductive filler is silicon micropowder; the particle size of the thermally conductive filler is 1000 mesh; the epoxidized thermoplastic elastomer is selected from the epoxidized thermoplastic elastomer EPOFRIEND CT310 of Japan Daicel; the acrylic modified polyetheretherketone is prepared according to the method of Example 1 of the Chinese invention patent with authorization announcement number CN109337019B; the terpene resin is terpene resin T-80; the antioxidant is antioxidant 168; and the initiator is azobisisobutyronitrile.

[0025] The first release layer and the second release layer are independently made of PET release films; the thickness of the first release layer is 20 μm; the thickness of the second release layer is 20 μm; the thickness of the aluminum foil substrate is 30 μm; the thickness of the first functional adhesive layer is 18 μm; and the thickness of the second functional adhesive layer is 18 μm.

[0026] A method for preparing the protective tape for semiconductor chip heat dissipation comprises the following steps: Step S1, performing double-sided corona pretreatment on the aluminum foil substrate; Step S2, applying a second functional adhesive on the second release layer and laminating it with the lower layer of the aluminum foil substrate; Step S3, coating the first functional adhesive on the first release layer, laminating it with the upper layer of the aluminum foil substrate, drying it, and rolling it up for maturation; Step S4, the protective tape for heat dissipation of semiconductor chips is obtained by stripping into specified widths. Example 3

[0027] A protective adhesive tape for heat dissipation of semiconductor chips comprises a first release layer, a first functional adhesive layer, an aluminum foil substrate, a second functional adhesive layer and a second release layer which are stacked in sequence from top to bottom; the first functional adhesive layer and the second functional adhesive layer are independently made of the following raw materials in parts by weight: 35 parts of thermal conductive filler, 15 parts of epoxidized thermoplastic elastomer, 20 parts of acrylic acid-modified polyetheretherketone, 4 parts of 2,4-diamino-6-diallylamino-1,3,5-triazine, 35 parts of butyl acrylate, 4 parts of 4-methyl-5-vinylthiazole, 2 parts of 2-(1-propylene-2-yl)benzo[D]oxazole, 1 part of allyl succinimidyl carbonate, 4 parts of terpene resin, 0.65 parts of antioxidant and 1 part of initiator.

[0028] The thermally conductive filler is aluminum nitride; the particle size of the thermally conductive filler is 1300 mesh; the epoxidized thermoplastic elastomer is selected from the epoxidized thermoplastic elastomer EPOFRIEND CT310 of Japan Daicel; the acrylic modified polyetheretherketone is prepared according to the method of Example 1 of the Chinese invention patent with authorization announcement number CN109337019B; the terpene resin is terpene resin T-80; the antioxidant is antioxidant 1010; and the initiator is azobisisobutyronitrile.

[0029] The first release layer and the second release layer are independently made of PS release films; the thickness of the first release layer is 25 μm; the thickness of the second release layer is 25 μm; the thickness of the aluminum foil substrate is 30 μm; the thickness of the first functional adhesive layer is 20 μm; and the thickness of the second functional adhesive layer is 20 μm.

[0030] A method for preparing the protective tape for semiconductor chip heat dissipation comprises the following steps: Step S1, performing double-sided corona pretreatment on the aluminum foil substrate; Step S2, applying a second functional adhesive on the second release layer and laminating it with the lower layer of the aluminum foil substrate; Step S3, coating the first functional adhesive on the first release layer, laminating it with the upper layer of the aluminum foil substrate, drying it, and rolling it up for maturation; Step S4, the protective tape for heat dissipation of semiconductor chips is obtained by stripping into specified widths. Example 4

[0031] A protective adhesive tape for heat dissipation of semiconductor chips comprises a first release layer, a first functional adhesive layer, an aluminum foil substrate, a second functional adhesive layer and a second release layer which are stacked in sequence from top to bottom; the first functional adhesive layer and the second functional adhesive layer are independently made of the following raw materials in parts by weight: 43 parts of thermal conductive filler, 18 parts of epoxidized thermoplastic elastomer, 23 parts of acrylic acid-modified polyetheretherketone, 4.5 parts of 2,4-diamino-6-diallylamino-1,3,5-triazine, 38 parts of butyl acrylate, 4.5 parts of 4-methyl-5-vinylthiazole, 2.5 parts of 2-(1-propylene-2-yl)benzo[D]oxazole, 1.1 parts of allyl succinimidyl carbonate, 4.5 parts of terpene resin, 0.75 parts of antioxidant and 1.1 parts of initiator.

[0032] The thermally conductive filler is a mixture of alumina, silicon powder and aluminum nitride in a mass ratio of 1:2:1; the particle size of the thermally conductive filler is 1400 mesh; the epoxidized thermoplastic elastomer is selected from the epoxidized thermoplastic elastomer EPOFRIEND CT310 of Japan Daicel; the acrylic modified polyetheretherketone is prepared according to the method of Example 1 of the Chinese invention patent with authorization announcement number CN109337019B; the terpene resin is terpene resin T-80; the antioxidant is a mixture of antioxidant 1010 and antioxidant 168 in a mass ratio of 3:5; the initiator is azobisisobutyronitrile.

[0033] The first release layer and the second release layer are independently made of PMMA release films; the thickness of the first release layer is 35 μm; the thickness of the second release layer is 35 μm; the thickness of the aluminum foil substrate is 30 μm; the thickness of the first functional adhesive layer is 23 μm; and the thickness of the second functional adhesive layer is 23 μm.

[0034] A method for preparing the protective tape for semiconductor chip heat dissipation comprises the following steps: Step S1, performing double-sided corona pretreatment on the aluminum foil substrate; Step S2, applying a second functional adhesive on the second release layer and laminating it with the lower layer of the aluminum foil substrate; Step S3, coating the first functional adhesive on the first release layer, laminating it with the upper layer of the aluminum foil substrate, drying it, and rolling it up for maturation; Step S4, the protective tape for heat dissipation of semiconductor chips is obtained by stripping into specified widths. Example 5

[0035] A protective adhesive tape for heat dissipation of semiconductor chips comprises a first release layer, a first functional adhesive layer, an aluminum foil substrate, a second functional adhesive layer and a second release layer which are stacked in sequence from top to bottom; the first functional adhesive layer and the second functional adhesive layer are independently made of the following raw materials in parts by weight: 45 parts of thermal conductive filler, 20 parts of epoxidized thermoplastic elastomer, 25 parts of acrylic acid-modified polyetheretherketone, 5 parts of 2,4-diamino-6-diallylamino-1,3,5-triazine, 40 parts of butyl acrylate, 5 parts of 4-methyl-5-vinylthiazole, 3 parts of 2-(1-propylene-2-yl)benzo[D]oxazole, 1.2 parts of allyl succinimidyl carbonate, 5 parts of terpene resin, 0.8 parts of antioxidant and 1.2 parts of initiator.

[0036] The thermally conductive filler is alumina; the particle size of the thermally conductive filler is 1500 mesh; the epoxidized thermoplastic elastomer is selected from the epoxidized thermoplastic elastomer EPOFRIEND CT310 of Japan Daicel; the acrylic modified polyetheretherketone is prepared according to the method of Example 1 of the Chinese invention patent with authorization announcement number CN109337019B; the terpene resin is terpene resin T-80; the antioxidant is antioxidant 1010; and the initiator is azobisisobutyronitrile.

[0037] The first release layer and the second release layer are independently made of PE release films; the thickness of the first release layer is 40 μm; the thickness of the second release layer is 40 μm; the thickness of the aluminum foil substrate is 30 μm; the thickness of the first functional adhesive layer is 25 μm; and the thickness of the second functional adhesive layer is 25 μm.

[0038] A method for preparing the protective tape for semiconductor chip heat dissipation comprises the following steps: Step S1, performing double-sided corona pretreatment on the aluminum foil substrate; Step S2, applying a second functional adhesive on the second release layer and laminating it with the lower layer of the aluminum foil substrate; Step S3, coating the first functional adhesive on the first release layer, laminating it with the upper layer of the aluminum foil substrate, drying it, and rolling it up for maturation; Step S4, the protective tape for heat dissipation of semiconductor chips is obtained by stripping into specified widths.

[0039] Comparative Example 1 A protective tape for semiconductor chip heat dissipation and a preparation method thereof, which is similar to Example 1, except that no epoxidized thermoplastic elastomer and 4-methyl-5-vinylthiazole are added.

[0040] Comparative Example 2 A protective tape for heat dissipation of semiconductor chips and a preparation method thereof, which is similar to Example 1, except that acrylic acid-modified polyetheretherketone and allyl succinimidyl carbonate are not added.

[0041] In order to further illustrate the beneficial technical effects of the protective tape for semiconductor chip heat dissipation involved in each embodiment of the present invention, the protective tape for semiconductor chip heat dissipation involved in Examples 1-5 and Comparative Examples 1-2 was subjected to relevant performance tests. The test results are shown in Table 1. The test method is as follows: (1) Thermal conductivity: Refer to ASTM-D5470 for thermal conductivity test; (2) Peel strength: 180° peel strength test of SUS steel plate was carried out according to GB / T2792-2014; (3) High temperature resistance: Place each test sample in an aging oven at 120°C for 240 hours. After cooling to room temperature, test the 180° peel strength according to the method in (2) and calculate the retention rate of the 180° peel strength. The larger the value, the better the high temperature resistance.

[0042] (4) Exhaust effect: Visually observe whether there are bubbles.

[0043] Table 1

[0044] It can be seen from Table 1 that the protective tapes for semiconductor chip heat dissipation involved in the embodiments of the present invention have better thermal conductivity, adhesion, high temperature resistance and gas exhaust properties, and the combined use of epoxidized thermoplastic elastomer, 4-methyl-5-vinylthiazole, acrylic acid-modified polyetheretherketone and allyl succinimidyl carbonate is beneficial to improving the above properties.

[0045] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A protective tape for heat dissipation of semiconductor chips, characterized in that: The invention comprises a first release layer, a first functional adhesive layer, an aluminum foil substrate, a second functional adhesive layer and a second release layer which are stacked in sequence from top to bottom; the first functional adhesive layer and the second functional adhesive layer are independently made of the following raw materials in parts by weight: 25-45 parts of thermal conductive filler, 10-20 parts of epoxidized thermoplastic elastomer, 15-25 parts of acrylic modified polyetheretherketone, 3-5 parts of 2,4-diamino-6-diallylamino-1,3,5-triazine, 30-40 parts of butyl acrylate, 3-5 parts of 4-methyl-5-vinylthiazole, 1-3 parts of 2-(1-propylene-2-yl)benzo[D]oxazole, 0.8-1.2 parts of allyl succinimidyl carbonate, 3-5 parts of terpene resin, 0.5-0.8 parts of antioxidant and 0.8-1.2 parts of initiator.

2. The protective tape for semiconductor chip heat dissipation according to claim 1, characterized in that: The thermal conductive filler is at least one of aluminum oxide, silicon powder and aluminum nitride; the particle size of the thermal conductive filler is 800-1500 mesh.

3. The protective tape for heat dissipation of semiconductor chips according to claim 1, characterized in that: The epoxidized thermoplastic elastomer is selected from the epoxidized thermoplastic elastomer EPOFRIEND CT310 produced by Daicel of Japan.

4. The protective tape for semiconductor chip heat dissipation according to claim 1, characterized in that: The terpene resin is terpene resin T-80; the antioxidant is at least one of antioxidant 1010 and antioxidant 168; and the initiator is azobisisobutyronitrile.

5. The protective tape for semiconductor chip heat dissipation according to claim 1, characterized in that: The first release layer and the second release layer are independently made of any one of a PE release film, a PET release film, a PS release film and a PMMA release film.

6. The protective tape for semiconductor chip heat dissipation according to claim 1, characterized in that: The thickness of the first release layer is 10-40 μm; the thickness of the second release layer is 10-40 μm.

7. The protective tape for semiconductor chip heat dissipation according to claim 1, characterized in that: The thickness of the aluminum foil substrate is 30 μm; the thickness of the first functional adhesive layer is 15-25 μm; and the thickness of the second functional adhesive layer is 15-25 μm.

8. A method for preparing a protective tape for semiconductor chip heat dissipation according to any one of claims 1 to 7, characterized in that: The steps include: Step S1, performing double-sided corona pretreatment on the aluminum foil substrate; Step S2, applying a second functional adhesive on the second release layer and laminating it with the lower layer of the aluminum foil substrate; Step S3, coating the first functional adhesive on the first release layer, laminating it with the upper layer of the aluminum foil substrate, drying it, and rolling it up for maturation; Step S4, the protective tape for heat dissipation of semiconductor chips is obtained by stripping into specified widths.

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