A semiconductor refrigeration mechanism

Abstract

The present invention relates to the field of semiconductor refrigeration technology, and discloses a semiconductor refrigeration mechanism, including a refrigeration pad body, a refrigeration patch system, and a non-contact cooling system, wherein the non-contact cooling system is used to deliver regulated air to the refrigeration pad body; the refrigeration patch system includes a cold compress patch module and a refrigeration host; the regulated air inlet is located at the refrigeration pad body, and a plurality of cooling air holes are provided on the inner side of the refrigeration pad body, and the cooling air holes are interconnected with the regulated air inlet; the cold compress patch module includes a cold compress bag and a cold conduction block, and the cold conduction block includes a cold conduction part and a cold transfer part, and the cold conduction part is arranged on the outside of the cold compress bag, and the cold transfer part is arranged on the inside of the cold compress bag; the cold compress bag contains cold storage material, and the cold end face of the refrigeration host is in contact with the cold conduction part, and the refrigeration host transfers cold to the cold storage material through the cold conduction block. The semiconductor refrigeration mechanism proposed in this scheme uses liquid cooling and air cooling to achieve the purpose of cooling, and can effectively enhance the cooling effect.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration, and in particular to a semiconductor refrigeration mechanism. Background Art

[0002] According to the relationship between ambient temperature and human thermal balance, living environments above 35°C and production environments above 32°C are usually considered high temperature environments. Under high temperature conditions, human physiological functions, especially temperature regulation, water and salt metabolism, and blood circulation, undergo abnormal changes. For example, excessive sweating will increase the burden on the cardiovascular system. If the high temperature exceeds the human body's tolerance, it will affect attention and reduce work efficiency at the least, or cause heat stroke at the worst, and even lead to sudden death, endangering the personal safety of workers and causing unnecessary economic losses.

[0003] For people who work continuously in outdoor environments without air conditioning, especially in high temperature environments, such as construction workers working under the scorching sun or maintenance personnel performing related maintenance work outdoors at high altitudes, they often have to overcome various discomforts caused by high temperatures to continue working for a period of time. When wearing ordinary clothes to work under high temperature conditions, people will sweat, and sweat will migrate to the surface of clothes through diffusion and transmission, and some heat will be taken away through sweat evaporation. However, the evaporation source provided by sweat evaporation is limited, so the heat taken away is also limited. Especially when working continuously for a period of time in a high temperature environment, ordinary clothes cannot achieve the effect of cooling down within a certain period of time.

[0004] In order to solve the above problems, cooling and air-conditioning clothing for human body temperature regulation has appeared in the prior art, but the cooling and air-conditioning clothing currently on the market usually adopts a single cooling method, that is, air cooling or liquid cooling, so the cooling effect on the human body is very limited. For example, the Chinese invention patent "A portable protective clothing micro-space temperature control and dehumidification device" with the publication number CN117045006A realizes the regulation of the temperature and humidity inside the protective clothing by mixed air supply, creating a comfortable clothing environment, and can adjust the user's comfort in the protective clothing body by mixed air supply and mixed adjustment of the hot and humid gas inside the protective clothing while ensuring the protective effect of the protective clothing. For another example, the Chinese utility model patent "A phase change cooling clothing with good cooling effect" with the announcement number CN220343733U uses a water pump to flow ice water into the liquid circulation pipeline and then into the ice water bag, so that the ice water absorbs the body heat during the circulation process, achieving the cooling effect of the cooling clothing. Therefore, there is an urgent need for a cooling clothing that can effectively enhance the cooling effect. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor refrigeration mechanism, which utilizes liquid cooling and air cooling to achieve the purpose of cooling, can effectively enhance the cooling effect, and overcome the shortcomings of the prior art.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A semiconductor refrigeration mechanism, comprising a refrigeration pad body, a refrigeration patch system and a non-contact cooling system;

[0008] The refrigeration pad body is provided with a regulated air inlet, and the regulated air outlet of the non-contact cooling system is connected to the regulated air inlet, and the non-contact cooling system is used to deliver regulated air to the refrigeration pad body;

[0009] The cooling patch system includes a cooling patch module and a cooling host; the regulating air inlet is located at the cooling pad body, and a plurality of cooling air holes are opened on the inner side of the cooling pad body, and the cooling air holes are connected to the regulating air inlet;

[0010] The cold compress patch module includes a cold compress bag and a cold conduction block, the cold conduction block includes a cold conduction part and a cold transfer part, and the cold conduction part is arranged on the outside of the cold compress bag, and the cold transfer part is arranged on the inside of the cold compress bag; the cold compress bag contains cold storage material inside, the cold end surface of the semiconductor refrigeration plate of the refrigeration host is in contact with the cold conduction part, and the refrigeration host transfers cold to the cold storage material through the cold conduction block; the cold compress patch module is arranged on the inner side of the refrigeration pad body, and the contact surface of the cold compress bag avoids the cooling air holes.

[0011] Preferably, the cross-sectional area of ​​the cooling portion is greater than or equal to the cross-sectional area of ​​the cooling conduction portion.

[0012] Preferably, the cooling portion is protrudingly arranged at the middle portion of the outer side of the cooling transfer portion.

[0013] Preferably, the cold compress patch module further comprises a plastic pressing plate, which is sleeved on the outside of the cold conducting portion and abuts against the outer side surface of the cold transmitting portion;

[0014] The inner wall of the cold compress bag is in contact with the outer side surface of the plastic pressing plate.

[0015] Preferably, a plurality of convex ridges arranged side by side are protruding from the rear side surface of the cold transfer portion, and the plastic pressing plate is attached to the outer side surface of the cold transfer portion through the convex ridges.

[0016] Preferably, the rear side surface of the cold transfer part is inwardly recessed and provided with a plurality of anti-slip grooves, and the plastic pressing plate is attached to the outer side surface of the cold transfer part through the anti-slip grooves.

[0017] Preferably, the anti-slip groove includes a connecting portion and a protruding portion which are sequentially connected from the outside to the inside, and the height of the protruding portion is greater than the height of the connecting portion.

[0018] Preferably, at least two anti-slip grooves are provided, and the two anti-slip grooves are respectively located on both sides of the cooling portion.

[0019] Preferably, the refrigeration host is arranged outside the refrigeration pad body, and the refrigeration host is located outside the refrigeration pad body;

[0020] The cooling portion passes through the cooling pad body and abuts against the cold end surface of the cooling host.

[0021] Preferably, the refrigeration host comprises a refrigeration housing, the semiconductor refrigeration sheet, a radiator and a cooling fan, and the semiconductor refrigeration sheet, the radiator and the cooling fan are all installed inside the refrigeration housing;

[0022] The semiconductor cooling sheet is provided with a hot end surface and a cold end surface, and the hot end surface is in contact with the radiator; a plurality of heat dissipation channels are provided inside the radiator, and the outlet of the heat dissipation fan faces the inlet of the heat dissipation channel;

[0023] The refrigeration shell is provided with an air inlet, a heat dissipation outlet and a cooling outlet; the cooling outlet is located on the inner side wall of the refrigeration shell, and the cooling outlet is used to avoid the cold end surface of the semiconductor refrigeration sheet and to accommodate the cooling part;

[0024] The air inlet is arranged close to the inlet of the heat dissipation fan, and the heat dissipation outlet is arranged close to the outlet of the heat dissipation channel.

[0025] Preferably, the heat dissipation fan is a centrifugal fan, and the air inlet and the heat dissipation outlet are both located on the outer side wall of the refrigeration shell.

[0026] Preferably, the heat dissipation fan is an axial flow fan, and the air inlet is located on the bottom wall of the refrigeration shell, and the heat dissipation outlet is located on the top wall of the refrigeration shell.

[0027] Preferably, the cooling pad body includes an air outlet layer, an air duct layer and a heat-insulating outer layer arranged in sequence from the inside to the outside;

[0028] The air outlet layer is provided with a plurality of cooling air holes, and the regulating air inlet and the cooling air holes are interconnected through the air duct layer.

[0029] Preferably, the regulating air inlet is located at the lower part of the refrigeration pad body, and the aperture of the cooling air hole gradually decreases from top to bottom.

[0030] Preferably, the air duct layer is a 3D support structure, and a plurality of mutually interlaced support ribs are arranged inside the 3D support structure.

[0031] Preferably, a wind shield is protrudingly provided on the edge of the air duct layer, and the wind shield forms a wind cavity; the wind shield is provided with an air inlet notch, and the air inlet notch is connected to the regulating air inlet;

[0032] A plurality of support blocks are protrudingly arranged on the inner side of the air channel layer, and the surfaces of the support blocks abut against the outer side of the air outlet layer.

[0033] Preferably, a heat dissipation auxiliary outlet is provided at the top edge of the cooling pad body, and the regulating air inlet and the heat dissipation auxiliary outlet are connected to each other through the air duct layer;

[0034] The refrigeration host is arranged inside the refrigeration pad body, and the refrigeration host is located inside the air duct layer, and the cooling portion is attached to the cold end surface of the refrigeration host after passing through the air outlet layer;

[0035] The refrigeration main unit comprises a semiconductor refrigeration element and a heat sink arranged in sequence from the inside to the outside, and the semiconductor refrigeration element is provided with a hot end surface and a cold end surface, the cold end surface is in contact with the cooling part, and the hot end surface is in contact with the heat sink;

[0036] A plurality of vertically extending heat conduction channels are provided inside the heat dissipation component, and the air duct layer, the heat conduction channels and the heat dissipation auxiliary outlet are connected in sequence.

[0037] Preferably, the refrigeration host further comprises a mounting shell and a mounting cover;

[0038] The mounting shell and the mounting cover together form a mounting cavity for mounting the semiconductor refrigeration element and the heat sink, and the mounting shell is located on the inner side of the semiconductor refrigeration element, and the mounting cover is located on the outer side of the heat sink;

[0039] The top and bottom of the installation cavity are both provided with avoidance openings, the avoidance opening at the bottom of the installation cavity is used to avoid the entrance of the heat conduction channel, and the avoidance opening at the top of the installation cavity is used to avoid the exit of the heat conduction channel;

[0040] A cooling installation opening is provided in the middle of the installation shell, and the cooling installation opening is used to avoid the cold end surface of the semiconductor refrigeration component and to accommodate the cooling part.

[0041] Preferably, the air duct layer comprises a guide inner layer and a guide outer layer, and the guide inner layer is located on the inner side of the guide outer layer;

[0042] The guiding inner layer is a 3D support structure, and a plurality of interlaced support ribs are arranged inside the 3D support structure;

[0043] The inner edge of the guide outer layer is protrudingly provided with wind-blocking ribs, and the guide outer layer and the guide inner layer together form an air storage cavity through the wind-blocking ribs;

[0044] An air inlet notch is provided on the side of the wind shield rib, the air inlet notch is communicated with the regulating air inlet, and a heat dissipation notch is provided on the top of the wind shield rib, the heat dissipation notch is communicated with the heat dissipation auxiliary outlet;

[0045] The heat conduction channel of the heat sink is located above the heat dissipation gap.

[0046] Preferably, the inner edge of the guide outer layer is protrudingly provided with guide ribs, and the guide ribs are located on the top of the wind-shielding ribs, the wind-shielding ribs and the guide ribs together form a heat dissipation cavity, and the air storage cavity and the heat dissipation cavity are connected to each other through the heat dissipation notch, and the outlet of the heat dissipation cavity is connected to the heat dissipation auxiliary outlet.

[0047] Preferably, the heat dissipation cavity is in a Y-shape, and the outlet of the heat dissipation cavity is located on both sides of the top of the guide outer layer;

[0048] The auxiliary heat dissipation outlet is arranged close to the outlet of the heat dissipation cavity.

[0049] Preferably, the refrigeration pad body further comprises an air-permeable mesh inner layer, and the air-permeable mesh inner layer, the air outlet layer, the air duct layer and the heat-insulating outer layer are arranged in sequence from inside to outside.

[0050] Preferably, the refrigeration pad body further comprises a fixing belt, and the fixing belt is connected to the heat insulating outer layer.

[0051] Preferably, the refrigeration patch system is provided with at least two groups.

[0052] The technical solution provided by the present invention may include the following beneficial effects:

[0053] 1. When the semiconductor refrigeration mechanism of the present scheme is working, the regulated wind acts on the refrigeration pad body, and the cold fluid formed by the cold storage material and the airflow formed by the regulated wind are used to take away the heat of the human body, forming a double combination of cold fluid and cold airflow flow field for the human body, so that the wearer can feel the flow of the regulated wind while directly contacting the cold compress bag storing the cold storage material, which is beneficial to further enhance the wearer's coolness in terms of body sensation, make the wearer's cooling feeling stronger, and be more conducive to satisfying the wearer's usage experience.

[0054] 2. The cold compress patch module of this scheme includes a cold compress bag and a cold conduction block, and the cold conduction block includes a cold conduction part and a cold transfer part. Since the cold transfer part of the cold conduction block is in direct contact with the cold storage material in the cold compress bag, the heat loss of the cold storage material in the process of entering and exiting the cold compress bag through pipes, etc. is reduced, and the cold amount generated by the semiconductor refrigeration plate of the refrigeration host is more effectively transferred directly to the cold storage material, thereby improving the conversion rate of the refrigeration host. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a structural schematic diagram of a semiconductor refrigeration mechanism of the present invention.

[0056] Figure 2 It is a cross-sectional view of a cold compress patch module in a semiconductor refrigeration mechanism of the present invention.

[0057] Figure 3 The present invention is a schematic structural diagram of a cooling block in a semiconductor refrigeration mechanism.

[0058] Figure 4 It is a structural schematic diagram of a first embodiment of a refrigeration pad body and a cold compress patch module in a semiconductor refrigeration mechanism of the present invention.

[0059] Figure 5 It is a partial structural exploded view of a first embodiment of a refrigeration pad body and a cold compress patch module in a semiconductor refrigeration mechanism of the present invention.

[0060] Figure 6 It is a structural schematic diagram of a second embodiment of a refrigeration pad body and a cold compress patch module in a semiconductor refrigeration mechanism of the present invention.

[0061] Figure 7 It is a partial structural exploded view of a second embodiment of a refrigeration pad body and a cold compress patch module in a semiconductor refrigeration mechanism of the present invention.

[0062] Figure 8 It is a structural schematic diagram of an embodiment of an air duct layer in a semiconductor refrigeration mechanism of the present invention.

[0063] Fig. 9 It is a structural schematic diagram of another embodiment of an air duct layer in a semiconductor refrigeration mechanism of the present invention.

[0064] Fig.10 It is a structural schematic diagram of a third embodiment of a refrigeration pad body and a cold compress patch module in a semiconductor refrigeration mechanism of the present invention.

[0065] Fig.11 It is a partial structural exploded view of a third embodiment of a refrigeration pad body and a cold compress patch module in a semiconductor refrigeration mechanism of the present invention.

[0066] Fig.12It is a structural exploded view of the first embodiment of a non-contact cooling system in a semiconductor refrigeration mechanism of the present invention.

[0067] Fig.13 It is a structural exploded view of a second embodiment of a non-contact cooling system in a semiconductor refrigeration mechanism of the present invention.

[0068] Fig.14 It is a structural exploded view of a third embodiment of a non-contact cooling system in a semiconductor refrigeration mechanism of the present invention.

[0069] Fig.15 It is a structural decomposition diagram of the fourth embodiment of a non-contact cooling system in a semiconductor refrigeration mechanism of the present invention.

[0070] Fig.16 It is a partial structural schematic diagram of a semiconductor refrigeration mechanism of the present invention.

[0071] Wherein: In the above figures, the arrows indicate the direction of air flow.

[0072] Refrigeration pad body 11, air outlet layer 111, cooling air hole 1111, air duct layer 112, wind shield strip 1121, air inlet gap 11211, support block 1122, guide inner layer 1123, guide outer layer 1124, wind shield rib 11241, air inlet gap 11241a, heat dissipation gap 11241b, guide rib 11242, heat insulation outer layer 113, air permeable mesh inner layer 114, fixing belt 115, cold compress patch module 12, cold compress bag 121, contact surface 1211, cold conduction block 122, cold conduction part 1 221, cold transfer part 1222, convex rib 12221, anti-slip groove 12222, connecting part 12222a, protruding part 12222b, plastic pressing plate 123, refrigeration main unit 13, refrigeration shell 131, air inlet 1311, heat dissipation outlet 1312, cold conduction outlet 1313, semiconductor refrigeration sheet 132, radiator 133, heat dissipation channel 1331, heat dissipation fan 134, semiconductor refrigeration element 135, heat dissipation element 136, installation shell 137, cold conduction installation port 1371, installation cover 138;

[0073] Non-contact cooling system 2, fixed shell 21, air inlet 211, regulating air outlet 212, heat dissipation air outlet 213, cooling fan 22, air guide plate 23, semiconductor refrigeration module 24, cooling block 241, heat dissipation block 242, air guide cover 25, installation bag 26. DETAILED DESCRIPTION

[0074] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0075] The technical solution provides a semiconductor refrigeration mechanism, including a refrigeration pad body 11, a refrigeration patch system and a non-contact cooling system 2;

[0076] The cooling pad body 11 is provided with a regulated air inlet, and the regulated air outlet 212 of the non-contact cooling system 2 is connected to the regulated air inlet, and the non-contact cooling system 2 is used to deliver regulated air to the cooling pad body 11;

[0077] The cooling patch system includes a cooling patch module 12 and a cooling host 13; the regulating air inlet is located at the cooling pad body 11, and a plurality of cooling air holes 1111 are opened on the inner side of the cooling pad body 11, and the cooling air holes 1111 are connected to the regulating air inlet;

[0078] The cold compress patch module 12 includes a cold compress bag 121 and a cold conduction block 122, the cold conduction block 122 includes a cold conduction portion 1221 and a cold transfer portion 1222, and the cold conduction portion 1221 is arranged on the outside of the cold compress bag 121, and the cold transfer portion 1222 is arranged on the inside of the cold compress bag 121; the cold compress bag 121 contains cold storage material, the cold end surface of the semiconductor refrigeration plate 132 of the refrigeration host 13 is in contact with the cold conduction portion 1221, and the refrigeration host 13 transfers cold to the cold storage material through the cold conduction block 122; the cold compress patch module 12 is arranged on the inner side of the refrigeration pad body 11, and the contact surface 1211 of the cold compress bag 121 avoids the cooling air hole 1111.

[0079] The cooling and air-conditioning clothing currently on the market usually uses a single cooling method, that is, air cooling or liquid cooling, so its cooling effect on the human body is very limited. Therefore, in order to enhance the cooling effect of existing cooling wearable products, this technical solution proposes a semiconductor refrigeration mechanism, which uses cold storage materials (such as water, gel, and other materials that can store and release cold energy) for cold compresses and air cooling to achieve the purpose of cooling, which is more conducive to satisfying the wearer's experience. In addition, since the wearable product of this solution is designed in the form of a cooling pad, it can be worn independently on the one hand, and on the other hand, it can be flexibly combined with products such as backpacks and car seat cushions, so that it can be applied to more scenarios, which is more conducive to improving the applicability of the cooling pad.

[0080] Specifically, Figure 1-16As shown, the main body of the semiconductor refrigeration mechanism of this scheme includes a refrigeration pad body 11 worn by the human body, a refrigeration patch system (i.e., a cold compress patch module 12 for storing cold storage materials and a refrigeration main unit 13 for transferring cold to the cold storage materials) and a non-contact cooling system 2 for generating regulated wind. When the semiconductor refrigeration mechanism of this scheme is working, the regulated wind acts on the refrigeration pad body 11, and the cold fluid formed by the cold storage material and the airflow formed by the regulated wind are used to take away the heat of the human body, forming a double combination of cold fluid and cold airflow field for the human body, so that the wearer can feel the flow of the regulated wind under the premise of directly contacting the cold compress bag 121 storing the cold storage material, which is conducive to further enhancing the wearer's coolness in terms of body sensation, making the wearer's cooling feeling more intense, and more conducive to satisfying the wearer's use experience.

[0081] In addition, in the cold compress patch module 12 of the present technical solution, since the cold transfer portion 1222 of the cold conduction block 122 is in direct contact with the cold storage material in the cold compress bag 121, the heat loss of the cold storage material in the process of entering and exiting the cold compress bag 121 through pipes, etc. is reduced, and the cold amount generated by the semiconductor refrigeration plate 132 in the refrigeration host 13 is more effectively transferred directly to the cold storage material, thereby improving the conversion rate of the refrigeration host 13.

[0082] In one embodiment, the regulating air outlet 212 of the non-contact cooling system 2 and the regulating air inlet of the cooling pad body 11 can be detachably connected via a hollow elastic band, so that the semiconductor refrigeration mechanism of this solution is more convenient to wear.

[0083] It should be noted that the inner side of the cooling pad body 11 in this solution refers to the side that is in direct contact with the wearer's body surface. The cooling block 122 in this solution can be an aluminum block.

[0084] Preferably, the cross-sectional area of ​​the cooling portion 1222 is greater than or equal to the cross-sectional area of ​​the cooling conduction portion 1221 .

[0085] like Figure 3 As shown, in this way, on the one hand, the space occupied by the refrigeration host 13 can be reduced, and on the other hand, the contact surface 1211 of the cold compress bag 121 can be increased, thereby improving the cooling effect of the cold compress bag 121.

[0086] Preferably, the cooling portion 1221 is protrudingly disposed at the middle portion of the outer side of the cooling transfer portion 1222 , so as to facilitate uniform transfer of cooling energy in the cooling portion 1221 .

[0087] Preferably, the cold compress module 12 further comprises a plastic pressing plate 123, which is sleeved on the outside of the cold conducting portion 1221 and abuts against the outer side surface of the cold transmitting portion 1222;

[0088] The inner wall of the cold compress bag 121 is in contact with the outer side of the plastic pressing plate 123 .

[0089] In order to achieve a sealed installation between the cold compress bag 121 and the cold conduction block 122, the present solution further adds a plastic pressing plate 123 in the cold compress patch module 12. Figure 2 As shown, the sealing performance of the cold compress bag 121 is improved by pressing and fixing the inner wall of the cold compress bag 121 and the outer side surface of the plastic pressing plate 123.

[0090] It should be noted that the plastic pressing plate 123 of the present solution can be cast on the outer side surface of the cold transfer part 1222 by injection molding.

[0091] Preferably, a plurality of convex ridges 12221 arranged side by side are protruded from the rear side surface of the cold transfer portion 1222 , and the plastic pressing plate 123 is attached to the outer side surface of the cold transfer portion 1222 via the convex ridges 12221 .

[0092] In a preferred embodiment of the present technical solution, in order to improve the bonding of the plastic pressing plate 123 and the cold conducting block 122, and thus improve the sealing of the cold compress bag 121, the present solution further protrudes from the rear side of the cold conducting portion 1222 with a plurality of convex ridges 12221 arranged side by side, such as Figure 3 As shown, the bonding between the plastic pressing plate 123 and the cooling block 122 is improved by increasing the contact area between the cooling portion 1222 and the plastic pressing plate 123 .

[0093] Preferably, the cross-sectional shape of the convex rib 12221 is triangular.

[0094] Preferably, the rear side surface of the cold transfer portion 1222 is inwardly recessed and provided with a plurality of anti-slip grooves 12222 , and the plastic pressing plate 123 is attached to the outer side surface of the cold transfer portion 1222 through the anti-slip grooves 12222 .

[0095] In another preferred embodiment of the present technical solution, in order to improve the bonding between the plastic pressing plate 123 and the cold conducting block 122, and thus improve the sealing of the cold compress bag 121, the present solution further provides a plurality of anti-slip grooves 12222 inwardly concavely on the rear side of the cold conducting portion 1222, such as Figure 3 As shown, on the one hand, the contact area between the cold transfer part 1222 and the plastic pressing plate 123 can be increased, and on the other hand, the separation of the plastic pressing plate 123 and the rear side of the cold transfer part 1222 can be effectively avoided, thereby improving the bonding between the plastic pressing plate 123 and the cold conduction block 122.

[0096] Preferably, the anti-slip groove 12222 includes a connecting portion 12222a and a protruding portion 12222b which are connected from outside to inside, and the height of the protruding portion 12222b is greater than the height of the connecting portion 12222a. In this way, it is more conducive to preventing the plastic pressing plate 123 from being separated from the rear side of the cold transfer portion 1222.

[0097] Preferably, the cross-sectional shape of the protrusion 12222b is any one of circular, elliptical, rectangular, triangular and trapezoidal.

[0098] Preferably, at least two anti-slip grooves 12222 are provided, and the two anti-slip grooves 12222 are respectively located on both sides of the cooling portion 1221. In this way, it is more conducive to improving the bonding performance of the plastic pressing plate 123 and the cooling block 122.

[0099] Preferably, the refrigeration host 13 is arranged outside the refrigeration pad body 11, and the refrigeration host 13 is located outside the refrigeration pad body 11;

[0100] The cooling portion 1221 passes through the cooling pad body 11 and abuts against the cold end surface of the cooling host 13 .

[0101] The cooling host 13 of this solution can be an external cooling host. Specifically, the cold compress patch module 12 and the cooling host 13 can be respectively arranged on the inner side and the outer side of the cooling pad body 11, and the cooling conducting part 1221 passes through the cooling pad body 11 and abuts against the cold end surface of the cooling host 13, so that the contact surface 1211 of the cold compress patch module 12 and the cooling air hole 1111 on the inner side of the cooling pad body 11 face the wearer, ensuring that the cold storage material and the regulated wind act accurately on the human body.

[0102] Preferably, the refrigeration host 13 includes a refrigeration shell 131, a semiconductor refrigeration sheet 132, a radiator 133 and a cooling fan 134, and the semiconductor refrigeration sheet 132, the radiator 133 and the cooling fan 134 are all installed inside the refrigeration shell 131;

[0103] The semiconductor cooling sheet 132 is provided with a hot end surface and a cold end surface, and the hot end surface is in contact with the heat sink 133; a plurality of heat dissipation channels 1331 are provided inside the heat sink 133, and the outlet of the heat dissipation fan 134 faces the inlet of the heat dissipation channel 1331;

[0104] The refrigeration shell 131 is provided with an air inlet 1311, a heat dissipation outlet 1312 and a cooling outlet 1313; the cooling outlet 1313 is located on the inner side wall of the refrigeration shell 131, and the cooling outlet 1313 is used to avoid the cold end surface of the semiconductor refrigeration plate 132 and to accommodate the cooling portion 1221;

[0105] The air inlet 1311 is disposed close to the inlet of the heat dissipation fan 134 , and the heat dissipation outlet 1312 is disposed close to the outlet of the heat dissipation channel 1331 .

[0106] In the external refrigeration host of the above embodiment, the refrigeration host 13 includes a refrigeration housing 131, a semiconductor refrigeration sheet 132, a radiator 133 and a cooling fan 134. Figure 4-7 As shown, it uses semiconductor refrigeration to transfer cold to the cold guide part 1221. Specifically, the semiconductor refrigeration sheet 132 is made using the Peltier effect. The Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration sheet 132 is made of two semiconductor materials to form a hot end and a cold end. The cold end continuously absorbs heat to achieve refrigeration; the hot end continuously releases heat. This technical solution uses the semiconductor refrigeration sheet 132 as a refrigeration device for cold storage materials, eliminating the complex mechanical refrigeration structure, and can effectively simplify the overall structure of the refrigeration host 13 and compress the overall volume of the refrigeration host 13, which is convenient for realizing silent refrigeration, and is safe and reliable, convenient and practical, with low manufacturing cost and a wide range of applications. Furthermore, a cold end of the semiconductor refrigeration plate 132 is provided with a cold end surface, and a hot end of the semiconductor refrigeration plate 132 is provided with a hot end surface, so that the cold end surface and the cooling portion 1221 are in contact with each other, and the hot end surface and the heat sink 133 are in contact with each other, which is beneficial to the direct and effective conduction of heat and cold, thereby facilitating the improvement of the cooling effect of the refrigeration host 13.

[0107] It should be noted that the heat dissipation process of the refrigeration host 13 of this scheme is specifically as follows: external air enters the refrigeration shell 131 from the air inlet 1311, and then enters the heat dissipation channel 1331 of the radiator 133 under the guidance of the heat dissipation fan 134, and brings the heat of the heat dissipation channel 1331 to the heat dissipation outlet 1312 and is discharged from the refrigeration host 13.

[0108] Preferably, the heat dissipation fan 134 is a centrifugal fan, and the air inlet 1311 and the heat dissipation outlet 1312 are both located on the outer wall of the refrigeration shell 131 .

[0109] As a preferred embodiment of the above, Figure 4-5 As shown, the heat dissipation fan 134 is a centrifugal fan, and the air inlet 1311 and the heat dissipation outlet 1312 are arranged on the outer wall of the refrigeration shell 131 opposite to the cold end surface of the semiconductor refrigeration plate 132, which is beneficial for the heat dissipation airflow to affect the cold transfer effect of the refrigeration host 13.

[0110] Preferably, the heat dissipation fan 134 is an axial flow fan, and the air inlet 1311 is located on the bottom wall of the refrigeration shell 131 , and the heat dissipation outlet 1312 is located on the top wall of the refrigeration shell 131 .

[0111] As another preferred embodiment of the above, Figure 6-7 As shown, the heat dissipation fan 134 is an axial flow fan, and the heat dissipation outlet 1312 and the air inlet 1311 are respectively arranged at the upper and lower ends of the refrigeration shell 131 to facilitate the rapid removal of heat.

[0112] Preferably, the cooling pad body 11 includes an air outlet layer 111, an air duct layer 112 and a heat insulating outer layer 113 arranged in sequence from the inside to the outside;

[0113] The air outlet layer 111 is provided with a plurality of cooling air holes 1111 , and the regulating air inlet and the cooling air holes 1111 are interconnected through the air duct layer 112 .

[0114] In order to allow the wearer to feel the cooling effect brought by the regulated wind more directly, the present solution also optimizes the structure of the cooling pad body 11, wherein the provision of the air duct layer 112 is conducive to better storage of a large amount of regulated wind in the cooling pad body 11, thereby increasing the airflow of the cooling air holes 1111, making the cooling effect more obvious. The provision of the heat-insulating outer layer 113 is mainly used to prevent the regulated wind from escaping from the outside of the cooling pad body 11, and can also, to a certain extent, block the temperature of the wearer from the external environment, thereby being more conducive to increasing the cooling effect of the cooling pad; in one embodiment, the material of the heat-insulating outer layer 113 can be polyester fiber, which is not limited here.

[0115] Preferably, the regulating air inlet is located at the lower part of the refrigeration pad body 11, and the aperture of the cooling air hole 1111 gradually decreases from top to bottom.

[0116] In a preferred embodiment of the present technical solution, the regulating air inlet is located at the lower part of the cooling pad body 11, that is, the non-contact cooling system 2 is installed at the lower part of the cooling pad body 11, which is convenient for human body to wear. Based on the above wearing method, in order to ensure the uniform cooling effect of the cooling pad body 11, the present solution especially gradually reduces the aperture of the cooling air hole 1111 from top to bottom. The larger aperture can reduce the wind resistance of the regulating air flow generated by the non-contact cooling system 2, making it easier for the regulating air flow to reach the upper part of the cooling pad body 11, thereby matching with the outlet air flow of the cooling air hole 1111 at the lower part of the cooling pad body 11, ensuring the uniform cooling effect.

[0117] Preferably, the air duct layer 112 is a 3D support structure, and a plurality of mutually staggered support ribs are arranged inside the 3D support structure.

[0118] In order to ensure that the air channel layer 112 can store the conditioned air flow, in the first embodiment of the present technical solution, the air channel layer 112 is a 3D support structure, such as Figure 8As shown, the three-dimensional space of the air duct layer 112 is supported by a plurality of mutually interlaced supporting ribs, which is conducive to regulating the large amount of storage of wind, while not affecting the flow of airflow inside the air duct layer 112, avoiding the increase of wind resistance.

[0119] Preferably, a wind shield 1121 is protrudingly provided on the edge of the air duct layer 112, and the wind shield 1121 forms a wind cavity; the wind shield 1121 is provided with an air inlet notch 11211, and the air inlet notch 11211 is communicated with the regulating air inlet;

[0120] A plurality of support blocks 1122 are protrudingly disposed on the inner side of the air channel layer 112 , and the surfaces of the support blocks 1122 abut against the outer side of the air outlet layer 111 .

[0121] In order to ensure that the air channel layer 112 can store the conditioned air flow, in the second embodiment of the present technical solution, the air channel layer 112 is a 3D support structure, such as Fig. 9 As shown, a windshield strip 1121 is protruding from its edge, which can better achieve the large-scale storage of regulated wind and prevent the air flow from being lost from places other than the cooling air holes 1111.

[0122] As a better embodiment of the above embodiment, a plurality of support blocks 1122 are protrudingly provided on the inner side of the air duct layer 112 , which can effectively ensure effective storage space for conditioned wind in the air duct layer 112 .

[0123] Preferably, a heat dissipation auxiliary outlet is provided at the top edge of the refrigeration pad body 11, and the regulating air inlet and the heat dissipation auxiliary outlet are connected to each other through the air duct layer 112;

[0124] The refrigeration host 13 is arranged inside the refrigeration pad body 11, and the refrigeration host 13 is located inside the air duct layer 112, and the cooling portion 1221 is attached to the cold end surface of the refrigeration host 13 after passing through the air outlet layer 111;

[0125] The refrigeration host 13 includes a semiconductor refrigeration element 135 and a heat sink 136 arranged in sequence from the inside to the outside, and the semiconductor refrigeration element 135 is provided with a hot end surface and a cold end surface, the cold end surface is in contact with the cooling portion 1221, and the hot end surface is in contact with the heat sink 136;

[0126] A plurality of vertically extending heat conduction channels are provided inside the heat dissipation element 136 , and the air channel layer 112 , the heat conduction channels and the heat dissipation auxiliary outlet are connected in sequence.

[0127] The refrigeration host 13 of this solution can also be a built-in refrigeration host. Figure 10-11As shown, the refrigeration host 13 includes a semiconductor refrigeration element 135 and a heat sink 136 arranged in sequence from the inside to the outside, and also uses semiconductor refrigeration to transfer cold to the cold guide part 1221. However, since the refrigeration host 13 of this solution is arranged inside the refrigeration pad body 11, and the refrigeration host 13 is located inside the air duct layer 112, this solution can use part of the conditioned air entering the air duct layer 112 to dissipate the heat of the heat sink 136, so that the cooling fan of the refrigeration host 13 can be omitted in the structure, making the structure of the refrigeration host 13 more compact and the cost lower.

[0128] It should be noted that the heat dissipation process of the refrigeration host 13 of the present scheme is specifically as follows: the regulated air generated by the non-contact cooling system 2 enters the air duct layer 112 of the refrigeration pad body 11 from the regulated air inlet, wherein a part of the regulated air forms an outlet airflow on the inner side of the refrigeration pad body 11 through the cooling air holes 1111, and the remaining part of the regulated air enters the heat conduction channel (not marked in the figure) of the heat dissipation element 136, and brings the heat of the heat conduction channel to the auxiliary heat dissipation outlet, and is discharged from the refrigeration pad body 11.

[0129] Preferably, the refrigeration host 13 further includes a mounting shell 137 and a mounting cover 138;

[0130] The mounting shell 137 and the mounting cover 138 together form a mounting cavity for mounting the semiconductor cooling element 135 and the heat sink 136, and the mounting shell 137 is located on the inner side of the semiconductor cooling element 135, and the mounting cover 138 is located on the outer side of the heat sink 136;

[0131] The top and bottom of the installation cavity are both provided with avoidance openings, the avoidance opening at the bottom of the installation cavity is used to avoid the entrance of the heat conduction channel, and the avoidance opening at the top of the installation cavity is used to avoid the exit of the heat conduction channel;

[0132] A cooling installation opening 1371 is provided in the middle of the installation shell 137 , and the cooling installation opening 1371 is used to avoid the cold end surface of the semiconductor refrigeration component 135 and to accommodate the cooling portion 1221 .

[0133] In the built-in refrigeration host of the above-mentioned embodiment, in order to ensure the effective fit between the refrigeration host 13 and the cooling part 1221, the present solution further provides an installation shell 137 and an installation cover 138 in the refrigeration host 13, wherein a cooling installation opening 1371 is provided in the middle of the installation shell 137 to realize the installation of the built-in refrigeration host and the cooling part 1221, and avoidance openings are provided at the top and bottom of the installation cavity jointly surrounded by the installation shell 137 and the installation cover 138 to ensure that part of the conditioned air can effectively enter the heat conduction channel.

[0134] Preferably, the air channel layer 112 includes a guide inner layer 1123 and a guide outer layer 1124, and the guide inner layer 1123 is located on the inner side of the guide outer layer 1124;

[0135] The guide inner layer 1123 is a 3D support structure, and a plurality of interlaced support ribs are arranged inside the 3D support structure;

[0136] The inner edge of the guide outer layer 1124 is protrudingly provided with a wind shielding rib 11241, and the guide outer layer 1124 and the guide inner layer 1123 together form a wind storage cavity through the wind shielding rib 11241;

[0137] The side of the wind shield rib 11241 is provided with an air inlet notch 11241a, the air inlet notch 11241a is communicated with the regulating air inlet, and the top of the wind shield rib 11241 is provided with a heat dissipation notch 11241b, the heat dissipation notch 11241b is communicated with the heat dissipation auxiliary outlet;

[0138] The heat conduction channel of the heat sink 136 is located above the heat dissipation gap 11241b.

[0139] As a preferred embodiment of the above-mentioned built-in refrigeration host, the specific structure of the air duct layer 112 is also optimized. Specifically, the air intake process of the regulated air in this embodiment is as follows: the regulated air generated by the non-contact cooling system 2 enters the cooling pad body 11 from the regulated air inlet, and enters the air storage cavity of the air duct layer 112 through the air inlet notch 11241a, wherein a part of the regulated air passes through the guide inner layer 1123, and forms an outlet airflow on the inner side of the cooling pad body 11 through the cooling air hole 1111, while the remaining part of the regulated air enters the heat conduction channel (not marked in the figure) of the heat dissipation element 136 through the heat dissipation notch 11241b, and brings the heat of the heat conduction channel to the heat dissipation auxiliary outlet, and is discharged from the cooling pad body 11. The optimization of the above-mentioned structure can effectively separate the regulated air used to form the outlet airflow and the regulated air carrying heat through the heat conduction channel, and to a certain extent can prevent the regulated air carrying heat from forming the outlet airflow through the cooling air hole 1111, resulting in a reduction in the wearer's cooling feeling.

[0140] Preferably, the inner edge of the guide outer layer 1124 is protrudingly provided with a guide rib 11242, and the guide rib 11242 is located on the top of the wind shielding rib 11241, the wind shielding rib 11241 and the guide rib 11242 together form a heat dissipation cavity, and the air storage cavity and the heat dissipation cavity are connected to each other through the heat dissipation notch 11241b, and the outlet of the heat dissipation cavity is connected to the heat dissipation auxiliary outlet.

[0141] As a better embodiment of the above-mentioned built-in refrigeration host, a guide rib 11242 is protrudingly provided on the inner edge of the guide outer layer 1124, and the wind shielding rib 11241 and the guide rib 11242 together form a heat dissipation cavity, which plays a role in centrally guiding and discharging the regulated wind carrying heat.

[0142] Preferably, the heat dissipation cavity is in a Y-shape, and the outlet of the heat dissipation cavity is located on both sides of the top of the guide outer layer 1124;

[0143] The auxiliary heat dissipation outlet is arranged close to the outlet of the heat dissipation cavity, so as to guide the regulated wind carrying heat to be discharged toward the top two sides of the cooling pad body 11, and avoid the hot air flow being discharged directly toward the body surface of the wearer.

[0144] Preferably, the refrigeration pad body 11 further includes an air-permeable mesh inner layer 114 , and the air-permeable mesh inner layer 114 , the air outlet layer 111 , the air duct layer 112 and the heat-insulating outer layer 113 are arranged in sequence from inside to outside.

[0145] Preferably, the mesh size of the breathable mesh inner layer 114 is 16-20 meshes.

[0146] Furthermore, in order to improve the wearing comfort of the wearer, the present invention also provides a breathable mesh inner layer 114 with a mesh number of 16-20 on the inner side of the air outlet layer 111. Fig.11 As shown, the cooling effect and comfortable feeling of the cooling pad are taken into account at the same time.

[0147] Preferably, the material of the breathable mesh inner layer 114 in this embodiment can be nylon, which is not limited here.

[0148] Preferably, the refrigeration pad body 11 further includes a fixing belt 115 , and the fixing belt 115 is connected to the heat insulating outer layer 113 .

[0149] Furthermore, in order to facilitate the wearing stability of the cooling pad body 11 and its coordination stability with products such as backpacks and car seat cushions, the present solution also adds a fixing belt 115 to the cooling pad body 11. In addition, when the wearer wears the cooling pad body 11 of the present solution independently, in order to make it have a better fit with the body surface, the present solution also specially connects the fixing belt 115 with the heat-insulating outer layer 113 to ensure that the cooling effect of the cooling pad is effectively transmitted on the body surface.

[0150] Preferably, at least five fixing belts 115 are provided, any three fixing belts 115 are evenly provided on the top of the heat insulating outer layer 113 , and the remaining two fixing belts 115 are respectively provided on both sides of the heat insulating outer layer 113 .

[0151] In a more preferred embodiment of the present technical solution, Fig.16As shown, the setting position of the fixing belt 115 is also optimized so that the refrigeration pad can be matched for use in more application scenarios.

[0152] Preferably, the non-contact cooling system 2 comprises a fixed shell 21 and a cooling fan 22, and the cooling fan 22 is installed inside the fixed shell 21;

[0153] The fixed shell 21 is provided with an air inlet 211 and the regulating air outlet 212, and the inlet of the cooling fan 22 is arranged close to the air inlet 211, the outlet of the cooling fan 22 is arranged close to the regulating air outlet 212, and the air inlet 211 and the regulating air outlet 212 are located on two different side walls of the fixed shell 21.

[0154] Specifically, the non-contact cooling system 2 of the present solution includes a fixed shell 21 and a cooling fan 22, wherein the cooling fan 22 is used to introduce air outside the cooling pad into the cooling pad body 11, so as to deliver regulated air in a direction to the cooling pad body 11. In addition, the air inlet 211 and the regulated air outlet 212 provided in the fixed shell 21 of the present solution are located on two different side walls thereof, which is conducive to a large amount of external air entering the non-contact cooling system 2 smoothly.

[0155] Preferably, the air inlet 211 and the regulating air outlet 212 are respectively located on two opposite side walls of the fixed shell 21;

[0156] Alternatively, the air inlet 211 and the regulating air outlet 212 are respectively located on two adjacent side walls of the fixed shell 21 .

[0157] like Figure 12-13 As shown, the air inlet 211 and the regulating air outlet 212 are respectively located on two adjacent sides or two opposite sides of the fixed shell 21, which is beneficial to reduce the interference with the incoming air flow and is more conducive to a large amount of external air smoothly entering the non-contact cooling system 2.

[0158] It should be noted that the number of the air inlets 211 can be set according to the actual demand for adjusting the air volume and is not limited here.

[0159] Preferably, the cooling fan 22 is any one of an axial flow fan and a centrifugal fan.

[0160] Preferably, the non-contact cooling system 2 further includes an air guide plate 23 , which is installed inside the fixed shell 21 , and is disposed between the outlet of the cooling fan 22 and the regulating air outlet 212 .

[0161] In this solution, a wind guide plate 23 is also provided in the non-contact cooling system 2, such as Fig.14As shown, the directional flow of external air is achieved, thereby improving the conversion rate of the conditioned wind in the non-contact cooling system 2.

[0162] Preferably, the non-contact cooling system 2 further includes a semiconductor refrigeration module 24, the semiconductor refrigeration module 24 is installed inside the fixed shell 21, and the semiconductor refrigeration module 24 is arranged at the outlet of the cooling fan 22;

[0163] The semiconductor refrigeration module 24 includes a semiconductor refrigerator, a cooling block 241 and a heat sink 242. The semiconductor refrigerator is provided with a cold end face and a hot end face opposite to each other, and the cold end face is attached to the cooling block 241, and the hot end face is attached to the heat sink 242.

[0164] The fixed shell 21 is also provided with a heat dissipation air outlet 213;

[0165] The cooling block 241 and the heat dissipation block 242 are both provided with heat exchange channels. The inlet of the heat exchange channel of the cooling block 241 and the inlet of the heat exchange channel of the heat dissipation block 242 are arranged close to the outlet of the cooling fan 22. The outlet of the heat exchange channel of the cooling block 241 is arranged close to the regulating air outlet 212, and the outlet of the heat exchange channel of the heat dissipation block 242 is arranged close to the heat dissipation air outlet 213.

[0166] In a more preferred embodiment of the present technical solution, in order to further enhance the cooling effect of the cooling pad, the present solution can also add a semiconductor cooling module 24 to the non-contact cooling system 2, such as Fig.15 As shown, the external air entering the non-contact cooling system 2 is first cooled by the semiconductor refrigeration module 24, and then forms cold conditioned air to enter the refrigeration pad body 11, so as to better meet the wearer's usage experience.

[0167] Preferably, the non-contact cooling system 2 further includes an air guide cover 25, and the air guide cover 25 is a hollow structure;

[0168] The air guide cover 25 is detachably mounted on the outside of the fixed shell 21 , and the regulating air outlet 212 is connected to the inlet of the air guide cover 25 , and the regulating air outlet 212 is connected to the regulating air inlet through the air guide cover 25 .

[0169] The cross-sectional area of ​​the inlet of the air guide cover 25 is larger than the cross-sectional area of ​​the outlet of the air guide cover 25 .

[0170] In another preferred embodiment of the present technical solution, an air guide cover 25 may be provided at the regulating air outlet 212 of the fixed shell 21. Figure 14-15As shown, the different inlet and outlet cross-sectional areas of the air guide cover 25 can effectively increase the wind speed of the regulated wind entering the refrigeration pad body 11, and further enhance the cooling experience brought by the airflow.

[0171] Preferably, the non-contact cooling system 2 further includes a mounting bag 26 , the fixing shell 21 is mounted inside the mounting bag 26 , and the mounting bag 26 is provided with a mesh surface, and the mesh surface is provided close to the air inlet 211 .

[0172] Preferably, the mesh size of the mesh is 6-10 meshes.

[0173] Preferably, at least two sets of the non-contact cooling system 2 are provided, and the two sets of the non-contact cooling system 2 are respectively provided on both sides of the refrigeration pad body 11 .

[0174] So, like Fig.16 As shown, it is more conducive to increasing the air intake volume of the regulated wind and improving the cooling experience brought by the flowing airflow formed by the regulated wind.

[0175] To further explain, the refrigeration patch system is provided with at least two groups.

[0176] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A semiconductor refrigeration mechanism, characterized in that: It includes a cooling pad body, a cooling patch system and a non-contact cooling system; The refrigeration pad body is provided with a regulated air inlet, and the regulated air outlet of the non-contact cooling system is connected to the regulated air inlet, and the non-contact cooling system is used to deliver regulated air to the refrigeration pad body; The cooling patch system includes a cooling patch module and a cooling host; the regulating air inlet is located at the cooling pad body, and a plurality of cooling air holes are opened on the inner side of the cooling pad body, and the cooling air holes are connected to the regulating air inlet; The cold compress patch module includes a cold compress bag and a cold conduction block, the cold conduction block includes a cold conduction part and a cold transmission part, and the cold conduction part is arranged outside the cold compress bag, and the cold transmission part is arranged inside the cold compress bag; the cold compress bag contains cold storage material inside, the cold end surface of the semiconductor refrigeration sheet of the refrigeration host is in contact with the cold conduction part, and the refrigeration host transfers cold to the cold storage material through the cold conduction block; the cold compress patch module is arranged on the inner side of the refrigeration pad body, and the contact surface of the cold compress bag avoids the cooling air hole; The cold compress patch module also includes a plastic pressing plate, which is sleeved on the outside of the cold conducting part and abuts against the outer side surface of the cold transmitting part; the inner wall of the cold compress bag abuts against the outer side surface of the plastic pressing plate; the rear side surface of the cold transmitting part is protrudingly provided with a plurality of convex ridges arranged side by side, and the plastic pressing plate abuts against the outer side surface of the cold transmitting part through the convex ridges; The refrigeration pad body includes an air outlet layer, an air duct layer and an insulating outer layer, which are arranged in sequence from the inside to the outside; the air duct layer includes a guide inner layer and a guide outer layer, and the guide inner layer is located on the inner side of the guide outer layer; the guide inner layer is a 3D support structure, and a plurality of mutually staggered support ribs are arranged inside the 3D support structure; the inner edge of the guide outer layer is protrudingly provided with wind-shielding ribs, and the guide outer layer and the guide inner layer together form an air storage cavity through the wind-shielding ribs; an air inlet gap is opened on the side of the wind-shielding rib, and the air inlet gap is connected to the regulating air inlet.

2. A semiconductor refrigeration mechanism according to claim 1, characterized in that: The cross-sectional area of ​​the cooling portion is greater than or equal to the cross-sectional area of ​​the cooling conduction portion.

3. A semiconductor refrigeration mechanism according to claim 1, characterized in that: The cooling portion is protrudingly arranged at the middle portion of the outer side of the cooling transfer portion.

4. A semiconductor refrigeration mechanism according to claim 1, characterized in that: The rear side surface of the cold transfer part is inwardly recessed and provided with a plurality of anti-slip grooves, and the plastic pressing plate is attached to the outer side surface of the cold transfer part through the anti-slip grooves.

5. A semiconductor refrigeration mechanism according to claim 4, characterized in that: The anti-slip groove includes a connecting portion and a protruding portion which are connected in sequence from outside to inside, and the height of the protruding portion is greater than the height of the connecting portion.

6. A semiconductor refrigeration mechanism according to claim 4, characterized in that: At least two anti-slip grooves are provided, and the two anti-slip grooves are respectively located on both sides of the cooling portion.

7. A semiconductor refrigeration mechanism according to claim 1, characterized in that: The refrigeration host is arranged outside the refrigeration pad body, and the refrigeration host is located outside the refrigeration pad body; The cooling portion passes through the cooling pad body and abuts against the cold end surface of the cooling host.

8. A semiconductor refrigeration mechanism according to claim 7, characterized in that: The refrigeration host comprises a refrigeration shell, the semiconductor refrigeration sheet, a radiator and a cooling fan, and the semiconductor refrigeration sheet, the radiator and the cooling fan are all installed inside the refrigeration shell; The semiconductor cooling sheet is provided with a hot end surface and a cold end surface, and the hot end surface is in contact with the radiator; a plurality of heat dissipation channels are provided inside the radiator, and the outlet of the heat dissipation fan faces the inlet of the heat dissipation channel; The refrigeration shell is provided with an air inlet, a heat dissipation outlet and a cooling outlet; the cooling outlet is located on the inner side wall of the refrigeration shell, and the cooling outlet is used to avoid the cold end surface of the semiconductor refrigeration sheet and to accommodate the cooling part; The air inlet is arranged close to the inlet of the heat dissipation fan, and the heat dissipation outlet is arranged close to the outlet of the heat dissipation channel.

9. A semiconductor refrigeration mechanism according to claim 8, characterized in that: The heat dissipation fan is a centrifugal fan, and the air inlet and the heat dissipation outlet are both located on the outer side wall of the refrigeration shell.

10. A semiconductor refrigeration mechanism according to claim 8, characterized in that: The heat dissipation fan is an axial flow fan, and the air inlet is located on the bottom wall of the refrigeration shell, and the heat dissipation outlet is located on the top wall of the refrigeration shell.

11. A semiconductor refrigeration mechanism according to claim 1, characterized in that: The air outlet layer is provided with a plurality of cooling air holes, and the regulating air inlet and the cooling air holes are interconnected through the air duct layer.

12. A semiconductor refrigeration mechanism according to claim 11, characterized in that: The regulating air inlet is located at the lower part of the refrigeration pad body, and the aperture of the cooling air hole gradually decreases from top to bottom.

13. A semiconductor refrigeration mechanism according to claim 11, characterized in that: A heat dissipation auxiliary outlet is provided on the top edge of the cooling pad body, and the regulating air inlet and the heat dissipation auxiliary outlet are connected to each other through the air duct layer; The refrigeration host is arranged inside the refrigeration pad body, and the refrigeration host is located inside the air duct layer, and the cooling portion is attached to the cold end surface of the refrigeration host after passing through the air outlet layer; The refrigeration main unit comprises a semiconductor refrigeration element and a heat sink arranged in sequence from the inside to the outside, and the semiconductor refrigeration element is provided with a hot end surface and a cold end surface, the cold end surface is in contact with the cooling part, and the hot end surface is in contact with the heat sink; A plurality of vertically extending heat conduction channels are provided inside the heat dissipation component, and the air duct layer, the heat conduction channels and the heat dissipation auxiliary outlet are connected in sequence.

14. A semiconductor refrigeration mechanism according to claim 13, characterized in that: The refrigeration host also includes a mounting shell and a mounting cover; The mounting shell and the mounting cover together form a mounting cavity for mounting the semiconductor refrigeration element and the heat sink, and the mounting shell is located on the inner side of the semiconductor refrigeration element, and the mounting cover is located on the outer side of the heat sink; The top and bottom of the installation cavity are both provided with avoidance openings, the avoidance opening at the bottom of the installation cavity is used to avoid the entrance of the heat conduction channel, and the avoidance opening at the top of the installation cavity is used to avoid the exit of the heat conduction channel; A cooling installation opening is provided in the middle of the installation shell, and the cooling installation opening is used to avoid the cold end surface of the semiconductor refrigeration component and to accommodate the cooling part.

15. A semiconductor refrigeration mechanism according to claim 14, characterized in that: A heat dissipation gap is provided on the top of the wind shield rib, and the heat dissipation gap is connected to the heat dissipation auxiliary outlet; The heat conduction channel of the heat sink is located above the heat dissipation gap.

16. A semiconductor refrigeration mechanism according to claim 15, characterized in that: The inner edge of the guide outer layer is protrudingly provided with a guide rib, and the guide rib is located on the top of the wind shielding rib, the wind shielding rib and the guide rib together form a heat dissipation cavity, and the air storage cavity and the heat dissipation cavity are connected to each other through the heat dissipation gap, and the outlet of the heat dissipation cavity is connected to the heat dissipation auxiliary outlet.

17. A semiconductor refrigeration mechanism according to claim 16, characterized in that: The heat dissipation cavity is in a Y-shape, and the outlets of the heat dissipation cavity are located on both sides of the top of the guide outer layer; The auxiliary heat dissipation outlet is arranged close to the outlet of the heat dissipation cavity.

18. A semiconductor refrigeration mechanism according to claim 11, characterized in that: The cooling pad body also includes an air-permeable mesh inner layer, and the air-permeable mesh inner layer, the air outlet layer, the air duct layer and the heat-insulating outer layer are arranged in sequence from the inside to the outside.

19. A semiconductor refrigeration mechanism according to claim 11, characterized in that: The refrigeration pad body also includes a fixing belt, which is connected to the heat-insulating outer layer.

20. The semiconductor refrigeration mechanism according to claim 1, characterized in that: The refrigeration patch system is provided with at least two groups.

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