Stress applying device for microcrystalline silicon film stress detection

Abstract

The invention discloses a stress applying device for microcrystalline silicon film stress detection, the stress applying device for microcrystalline silicon film stress detection comprises a device body, a height adjusting mechanism and a torque transmission structure, the device body comprises a frame body, a fixed contact piece and a movable contact piece, the fixed contact piece is connected with a first end of the frame body, and the movable contact piece is connected with a second end of the frame body; the movable contact piece is movably connected with the frame body, a film to be detected is located between the fixed contact piece and the movable contact piece, the height adjusting mechanism comprises a fixed plate, a movable plate and a screw rod, the fixed plate is connected with the frame body, the first end of the screw rod is pivotally connected with the movable plate, and the torque transmission structure comprises a transmission rod, a pressure sensor and a linear driving piece. The first end of the transmission rod penetrates through the fixing plate to be connected with the movable contact piece, the second end of the transmission rod is connected with the linear driving piece, and the pressure sensor is arranged on the transmission rod. The stress applying device for microcrystalline silicon film stress detection has the advantages of being low in cost and good in stress applying effect.

Description

Technical Field

[0001] The present invention relates to the technical field of stress detection, and in particular to a stress applying device for microcrystalline silicon film stress detection. Background Art

[0002] In the related art, optical detection is mostly used for stress detection of microcrystalline silicon thin films. The operation is complicated, the stress application effect is poor, which affects the detection accuracy, the equipment structure is complex and the cost is high, and it is difficult to detect the stress state of the film. Summary of the invention

[0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0004] To this end, an embodiment of the present invention provides a stress applying device for microcrystalline silicon thin film stress detection. The stress applying device for microcrystalline silicon thin film stress detection has the advantages of low cost and good stress applying effect.

[0005] According to an embodiment of the present invention, a stress applying device for microcrystalline silicon film stress detection includes a device body, a height adjustment mechanism and a torque transmission structure. The device body includes a frame, a fixed contact and a movable contact. The fixed contact is connected to a first end of the frame, and the movable contact is movably connected to the frame. The film to be detected is located between the fixed contact and the movable contact. The height adjustment mechanism includes a fixed plate, a movable plate and a screw. The fixed plate is connected to the frame. The first end of the screw is pivotally connected to the movable plate, and the second end of the screw is pivotally connected to the fixed plate. The movable plate is connected to the fixed contact and can move along the screw relative to the frame. The torque transmission structure includes a transmission rod, a pressure sensor and a linear drive. The first end of the transmission rod passes through the fixed plate and is connected to the movable contact, and the second end of the transmission rod is connected to the linear drive. The pressure sensor is arranged on the transmission rod to detect the pressure on the transmission rod.

[0006] The stress applying device for microcrystalline silicon thin film stress detection according to the embodiment of the present invention has the advantages of low cost and good stress applying effect.

[0007] In some embodiments, the moving contact member includes two stress applying rods and a moving seat, the stress applying rods are connected to a first side of the moving seat, and a second side of the moving seat is connected to the transmission rod.

[0008] In some embodiments, the fixed contact member includes a fixed cap and a connecting rod, a first end of the connecting rod is connected to the fixed cap, and a second end of the connecting rod is connected to the moving plate.

[0009] In some embodiments, the movable plate is threadedly connected to the screw rod through a screw hole, and a guide groove is provided on the movable plate, and the connecting rod can move along the guide groove.

[0010] In some embodiments, a first magnetic sheet is disposed on the fixed cap, and a second magnetic sheet is disposed on the movable plate, and the first magnetic sheet is magnetically adsorbed to the second magnetic sheet.

[0011] In some embodiments, the transmission rod includes a first rod and a second rod, the extension direction of the first rod is perpendicular to the extension direction of the second rod to form a lever, the first rod is connected to the moving contact member, and the second rod is connected to the linear drive member.

[0012] In some embodiments, the frame further includes a limit plate, the limit plate is located between the fixed plate and the linear drive member, the transmission rod passes through the limit plate, and the pressure sensor is located between the limit plate and the fixed plate.

[0013] In some embodiments, the height adjustment mechanism further includes a limiting member, wherein the limiting member is located at the first end of the screw rod and is used to prevent the movable plate from escaping from the screw rod.

[0014] In some embodiments, a flexible cap is sleeved on the end of the stress-applying rod, and the flexible cap is threadedly connected to the stress-applying rod via a bolt.

[0015] In some embodiments, the linear drive member is a unidirectional piezoelectric actuator. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the structure of a stress applying device for microcrystalline silicon film stress detection according to an embodiment of the present invention.

[0017] Figure numerals: 1, frame; 2, fixed plate; 3, movable plate; 4, screw; 5, transmission rod; 6, pressure sensor; 7, linear drive member; 8, stress application rod; 9, movable seat; 10, fixing cap; 11, connecting rod; 12, guide groove; 13, limit plate. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0019] According to an embodiment of the present invention, a stress applying device for microcrystalline silicon film stress detection includes a device body, a height adjustment mechanism and a torque transmission structure. The device body includes a frame 1, a fixed contact and a movable contact. The fixed contact is connected to a first end of the frame 1, and the movable contact is movably connected to the frame 1. The film to be detected is located between the fixed contact and the movable contact. The height adjustment mechanism includes a fixed plate 2, a movable plate 3 and a screw 4. The fixed plate 2 is connected to the frame 1. The first end of the screw 4 is pivotally connected to the movable plate 3, and the second end of the screw 4 is pivotally connected to the fixed plate 2. The movable plate 3 is connected to the fixed contact and can move along the screw 4 relative to the frame 1. The torque transmission structure includes a transmission rod 5, a pressure sensor 6 and a linear drive 7. The first end of the transmission rod 5 passes through the fixed plate 2 and is connected to the movable contact, and the second end of the transmission rod 5 is connected to the linear drive 7. The pressure sensor 6 is arranged on the transmission rod 5 to detect the pressure on the transmission rod 5.

[0020] The stress applying device for microcrystalline silicon thin film stress detection according to the embodiment of the present invention has the advantages of low cost and good stress applying effect.

[0021] In some embodiments, the moving contact member includes two stress applying rods 8 and a moving seat 9 , the stress applying rod 8 is connected to a first side of the moving seat 9 , and a second side of the moving seat 9 is connected to the transmission rod 5 .

[0022] Specifically, the stress-applying rod 8 can be designed with multiple different lengths or diameters to accommodate thin film samples of different sizes. The uniformity and accuracy of stress application can be improved. The two stress-applying rods 8 cooperate with the two fixed contact members on the fixed plate 2 to form four-point contact with the thin film, namely, two fixed points and two stress-applying points. By changing the external stress, an external stress opposite to the internal stress of the silicon material itself is applied to offset the effect of the internal stress, which is convenient for combining with optical measuring instruments to detect and observe the internal stress value of the thin film material.

[0023] In some embodiments, the fixed contact member includes a fixed cap 10 and a connecting rod 11 , a first end of the connecting rod 11 is connected to the fixed cap 10 , and a second end of the connecting rod 11 is connected to the moving plate 3 .

[0024] Specifically, the fixing cap 10 can be designed to be replaceable to meet different test requirements. The connecting rod 11 can be made of high-strength material, such as stainless steel, to improve stability. The hemispherical shape of the fixing cap 10 in this structure can ensure the stability of the fixed contact during the stress application process and reduce the test error caused by the displacement of the contact.

[0025] In some embodiments, the movable plate 3 is threadedly connected to the screw rod 4 through a screw hole, and a guide groove 12 is provided on the movable plate 3 , and the connecting rod 11 can move along the guide groove 12 .

[0026] Specifically, the screw hole can be designed to be self-locking to prevent the screw 4 from accidentally loosening when stress is applied. The screw 4 and the movable plate 3 make the height adjustment more accurate and stable, which helps to improve the consistency of stress application. The screw hole of the movable plate 3 has an internal thread, and rotating the screw 4 can drive the movable plate 3 to move along the screw 4. The guide groove 12 provided on the movable plate 3 can make the fixing cap 10 move relative to the movable plate 3 to change the position of the fixing point and adjust the contact position between the fixing cap 10 and the film.

[0027] In some embodiments, a first magnetic sheet is disposed on the fixed cap 10 , and a second magnetic sheet is disposed on the movable plate 3 , and the first magnetic sheet is magnetically attracted to the second magnetic sheet.

[0028] Specifically, the fixing cap 10 and the moving plate 3 are fixed by magnetic adsorption, which can simplify the connection and removal process of the contact pieces and ensure the alignment accuracy between the contact pieces, making it convenient for the fixing cap 10 to move and fix on the surface of the moving plate 3 .

[0029] In some embodiments, the transmission rod 5 includes a first rod and a second rod, the extension direction of the first rod is perpendicular to the extension direction of the second rod to form a lever, the first rod is connected to the moving contact member, and the second rod is connected to the linear drive member 7 .

[0030] Specifically, the first rod and the second rod are connected to form a lever, which can amplify the displacement of the linear drive member 7 and achieve more accurate stress control. Optionally, the connection position of the second rod and the first rod is adjustable to achieve adjustment of the lever to meet different torque requirements.

[0031] In some embodiments, the frame 1 further includes a limit plate, the limit plate is located between the fixed plate 2 and the linear drive member 7 , the transmission rod 5 passes through the limit plate, and the pressure sensor 6 is located between the limit plate and the fixed plate 2 .

[0032] Specifically, the limit plate is used to limit the moving range of the first rod and the pressure sensor 6 , and the pressure sensor 6 can use a strain gauge as a sensor to improve the measurement accuracy.

[0033] In some embodiments, the height adjustment mechanism further includes a limiter, which is located at the first end of the screw rod 4 to prevent the movable plate 3 from escaping from the screw rod 4 .

[0034] Specifically, the limiting member is fixed to the first end of the screw rod 4 to prevent the movable plate 3 from being separated from the screw rod 4. The limiting member can be fixedly connected to the frame body 1, and the screw rod 4 is rotatably connected to the limiting member.

[0035] In some embodiments, a flexible cap is sleeved on the end of the stress applying rod 8, and the flexible cap is threadedly connected to the stress applying rod 8 via a bolt.

[0036] Specifically, the flexible cap can be made of materials such as silicone rubber to provide good elasticity and wear resistance. The bolt can be made of anti-loosening thread to prevent loosening after long-term use. The flexible cap can protect the film sample from damage while ensuring the uniformity of stress application.

[0037] In some embodiments, the linear drive member 7 is a unidirectional piezoelectric actuator.

[0038] Specifically, the unidirectional piezoelectric actuator provides high-precision and fast-response displacement control, which is suitable for the high-precision requirements of microcrystalline silicon thin film stress detection.

[0039] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0044] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. Changes, modifications, substitutions and variations of the above embodiments by those of ordinary skill in the art are all within the scope of protection of the present invention.

Claims

1. A stress applying device for microcrystalline silicon thin film stress detection, characterized in that: include: The device body comprises a frame, a fixed contact and a movable contact, wherein the fixed contact is connected to a first end of the frame, the movable contact is movably connected to the frame, and the film to be detected is located between the fixed contact and the movable contact; A height adjustment mechanism, the height adjustment mechanism comprising a fixed plate, a movable plate and a screw, the fixed plate is connected to the frame, a first end of the screw is pivotally connected to the movable plate, a second end of the screw is pivotally connected to the fixed plate, the movable plate is connected to the fixed contact member and can move relative to the frame along the screw; A torque transmission structure, the torque transmission structure includes a transmission rod, a pressure sensor and a linear drive member, the first end of the transmission rod passes through the fixed plate and is connected to the movable contact member, the second end of the transmission rod is connected to the linear drive member, and the pressure sensor is arranged on the transmission rod to detect the pressure on the transmission rod.

2. The stress applying device for microcrystalline silicon thin film stress detection according to claim 1, characterized in that: The movable contact member comprises two stress applying rods and a movable seat, wherein the stress applying rods are connected to a first side of the movable seat, and a second side of the movable seat is connected to the transmission rod.

3. The stress applying device for microcrystalline silicon thin film stress detection according to claim 1, characterized in that: The fixed contact member includes a fixed cap and a connecting rod, a first end of the connecting rod is connected to the fixed cap, and a second end of the connecting rod is connected to the moving plate.

4. The stress applying device for microcrystalline silicon thin film stress detection according to claim 3, characterized in that: The movable plate is threadedly connected to the screw rod through a screw hole, and a guide groove is arranged on the movable plate, and the connecting rod can move along the guide groove.

5. The stress applying device for microcrystalline silicon thin film stress detection according to claim 4, characterized in that: A first magnetic sheet is disposed on the fixing cap, and a second magnetic sheet is disposed on the moving plate. The first magnetic sheet and the second magnetic sheet are magnetically attracted to each other.

6. The stress applying device for microcrystalline silicon thin film stress detection according to claim 1, characterized in that: The transmission rod comprises a first rod and a second rod, the extension direction of the first rod is perpendicular to the extension direction of the second rod to form a lever, the first rod is connected to the moving contact member, and the second rod is connected to the linear drive member.

7. The stress applying device for microcrystalline silicon thin film stress detection according to claim 1, characterized in that: The frame body further includes a limit plate, the limit plate is located between the fixed plate and the linear drive member, the transmission rod passes through the limit plate, and the pressure sensor is located between the limit plate and the fixed plate.

8. The stress applying device for microcrystalline silicon thin film stress detection according to claim 1, characterized in that: It also includes a limiting piece, which is located at the first end of the screw rod and is used to prevent the movable plate from escaping from the screw rod.

9. The stress applying device for microcrystalline silicon thin film stress detection according to claim 2, characterized in that: A flexible cap is sleeved on the end of the stress applying rod, and the flexible cap is threadedly connected with the stress applying rod through a bolt.

10. The stress applying device for microcrystalline silicon thin film stress detection according to claim 1, characterized in that: The linear drive element is a unidirectional piezoelectric actuator.

Images