Identification device for welding spot detection and identification method thereof
By introducing rotatable track frames and moving components into the solder joint detection device, multi-angle detection is achieved, the problem of insufficient detection range in the prior art is solved, the detection accuracy and efficiency are improved, and the electronic components are fixed through the negative pressure chamber are fixed. , simplifies the operation of the device.
Patent Information
- Application Number
- CN202411438900.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-01-10
AI Technical Summary
The existing solder joint detection devices are difficult to adjust the tilt angle when detecting electronic components, resulting in insufficient detection range and affecting detection accuracy.
A device including an X-ray detection device, a support frame, a track frame and a moving assembly is designed. By driving the track frame to rotate and the moving assembly to drive the X-ray detection device to move along the track frame, realizing multi-angle detection.
It improves the comprehensiveness and accuracy of solder joint detection, can obtain detection data from multiple perspectives, improves the detection effect, and realizes the fixing and limiting of electronic components through negative pressure chambers and air holes, simplifying the installation and disassembly of the device.
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Figure CN119290926A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of solder joint detection, in particular to a solder joint detection identification device and an identification method thereof. Background Art
[0002] Electronic components are parts used in electronic devices or circuits to process, transmit and control electronic signals. During production, electronic components usually use detection devices to evaluate the welding quality of the internal solder joints of electronic components to improve the stability of the performance of electronic components.
[0003] A Chinese patent application CN112648060A discloses an injection mold, the technical solution of which is as follows: it includes a box body, the side wall of the box body is provided with an opening, and a box door is hinged at the opening of the box body, a support frame is installed on the inner wall of the top end of the box body, an X-ray tube is installed on the lower surface of the support frame, a circular track is provided on the inner wall of the bottom end of the box body, two moving devices are movably installed in the circular track, and the two moving devices are located on both sides of the circular track, support rods are welded to the top of the two moving devices, a support plate is fixed between the two support rods, a first motor is installed in the middle position of the inner wall of the bottom plate of the box body, and the end of the output shaft of the first motor is connected to the support plate. The invention has a simple structure and a novel design. It can quickly determine whether there is a gap in the welding place through the X-ray tube, with high precision and small error. At the same time, the battery is fully and evenly irradiated with X-rays, making the detection structure more accurate and the detection range more comprehensive.
[0004] However, the above technology often has the following defects: the above device is not convenient to adjust the tilt angle when detecting electronic components, so that the electronic component detection range is not comprehensive enough, affecting the final detection accuracy. To this end, the present invention provides a solder joint detection identification device and an identification method thereof. Summary of the invention
[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.
[0006] The technical solution adopted by the present invention to solve the technical problem is: a recognition device for solder joint detection according to the present invention comprises:
[0007] X-ray detection device;
[0008] A support frame, wherein a support plate is fixed in the middle of the support frame, a track frame is arranged above the support plate, the track frame is arranged in a semi-circular shape, and both ends of the track frame are rotatably mounted on both sides of the middle of the support plate through mounting shafts, and a motor 2 for driving the track frame to rotate is fixed on the outer wall of the support frame;
[0009] A moving assembly is movably mounted on a track frame, and the X-ray detection device is mounted at the bottom of the moving assembly. The X-ray detection device is driven by the moving assembly to move along the track frame.
[0010] Preferably, the moving component includes a mounting seat, which is movably mounted in a movable groove opened in the middle of the track frame, and rollers are rotatably mounted on both sides of the middle of the mounting seat through a rotating shaft, and the rollers on both sides are engaged with grooves opened in the top of the track frame. A motor is fixed in the middle of the mounting seat, and a gear set is installed on the output end of the motor, and the rotating shaft and roller are driven to rotate by the gear set. A mounting block is installed at the bottom of the mounting seat, and rollers are symmetrically rotatably mounted on both sides of the mounting block, and the rollers on both sides are respectively abutted against the bottom of the track frame.
[0011] Preferably, a movable cavity is opened in the middle of the lower part of the mounting seat, a disc is movably mounted on the top of the movable cavity, a connecting column is fixedly connected to the bottom of the disc, the bottom end of the connecting column extends downward and is fixedly connected to the top of the mounting block, and a spring is provided under the disc.
[0012] Preferably, the connecting column is a square column, and limit plates are symmetrically provided on both sides of the connecting column. Support rods are fixed on the opposite side walls of the limit plates on both sides, and support sleeves are fixed on the inner walls on both sides of the movable cavity. The support rod is slidably arranged in the support sleeve, and a spring 2 is installed inside the support sleeve to reset the support rod.
[0013] Preferably, a plurality of groups of air holes are evenly arranged on the support plate, a negative pressure cavity is fixed at the bottom of the support plate, the air holes are connected to the negative pressure cavity, and a negative pressure pump is fixed at the bottom of the negative pressure cavity.
[0014] Preferably, the roller one and the roller two are both made of silicone material.
[0015] Preferably, a mounting rod is fixed on the top of the X-ray detection device, and the mounting rod is slidably inserted into a mounting hole opened at the bottom of the mounting block.
[0016] A method for identifying solder joints, which uses the above-mentioned device for identifying solder joints, comprises the following steps:
[0017] S1. Place the electronic component to be tested on the support plate and start the negative pressure pump. The negative pressure pump generates negative pressure in the negative pressure chamber, which causes the air holes to generate downward suction, thereby adsorbing and fixing the electronic component on the support plate.
[0018] S2, making the track frame perpendicular to the support plate, starting motor 1, driving roller 1 to rotate through the gear set, and roller 1 rolling along the top of the track frame, driving the mounting seat and the mounting block to move synchronously, thereby driving the X-ray detection device to move along the track frame, so that the X-ray detection device can detect different solder joint positions of electronic components;
[0019] S3. Start Motor 2, which drives the track frame to rotate through the mounting shaft to change the inclination angle of the track frame, and then drives the X-ray detection device to reciprocate along the track frame through the moving assembly, so that the X-ray detection device can perform multi-angle detection from the side of the electronic component.
[0020] The beneficial effects of the present invention are as follows:
[0021] 1. The present invention discloses a recognition device for solder joint detection and a recognition method thereof. By setting structures such as a track frame, a moving component and an X-ray detection device, when in use, the moving component drives the X-ray detection device to reciprocate along the track frame, and then uses the X-ray detection device to scan and detect the solder joint positions of electronic components at different angles, thereby improving the detection effect, facilitating a comprehensive evaluation of the quality of the solder joints, and improving the comprehensiveness and accuracy of the detection.
[0022] 2. The identification device and identification method for solder joint detection described in the present invention, by setting structures such as a disc, a spring 1, a connecting column, a limit plate, a roller 1 and a roller 2, facilitates the rapid installation and disassembly of mobile components, reduces the difficulty of work, and improves the efficiency of assembly and disassembly. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The present invention will be further described below in conjunction with the accompanying drawings.
[0024] Figure 1 is a stereogram of the present invention;
[0025] Figure 2 It is a front view of the present invention;
[0026] Figure 3 is a cross-sectional view of the present invention;
[0027] Figure 4 yes Figure 3 A partial enlarged view of the middle part;
[0028] Figure 5 yes Figure 4 A partial enlarged view of point B in the middle;
[0029] Figure 6 It is a schematic diagram of the positions of the connecting column and the limiting plate of the present invention;
[0030] Figure 7 It is a flow chart of the method of the present invention.
[0031] In the figure: 1. support frame; 2. support plate; 3. track frame; 31. groove; 4. moving assembly; 41. mounting seat; 42. motor 1; 43. gear set; 44. roller 1; 45. mounting block; 46. roller 2; 47. movable cavity; 48. disc; 49. spring 1; 410. connecting column; 411. limit plate; 412. support rod; 413. support sleeve; 414. spring 2; 5. X-ray detection device; 51. mounting rod; 6. mounting shaft; 7. motor 2; 8. air hole; 9. negative pressure cavity; 10. negative pressure pump. DETAILED DESCRIPTION
[0032] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.
[0033] Embodiment 1: Figures 1 to 6 As shown, a device for identifying solder joints according to an embodiment of the present invention includes:
[0034] X-ray detection device 5;
[0035] A support frame 1, a support plate 2 is fixed in the middle of the support frame 1, a track frame 3 is arranged above the support plate 2, the track frame 3 is arranged in a semi-circular shape, and both ends of the track frame 3 are rotatably mounted on both sides of the middle of the support plate 2 through a mounting shaft 6, and a motor 7 for driving the track frame 3 to rotate is fixed on the outer wall of the support frame 1;
[0036] A moving component 4, wherein the moving component 4 is movably mounted on the track frame 3, and the X-ray detection device 5 is mounted at the bottom of the moving component 4, and the X-ray detection device 5 is driven by the moving component 4 to move along the track frame 3; when working, the electronic component to be detected is placed on the support plate 2, so that the track frame 3 is perpendicular to the support plate 2, and initially the X-ray detection device 5 is vertically arranged above the electronic component to achieve a planar scan of the electronic component; then the X-ray detection device 5 is driven by the moving component 4 to reciprocate along the track frame 3, and then the X-ray detection device 5 is used to scan and detect the solder joint positions of the electronic components at different angles. In addition, the motor 2 7 drives the track frame 3 to rotate through the mounting shaft 6 to change the inclination angle of the track frame 3, and then the X-ray detection device 5 is driven by the moving component 4 to reciprocate along the track frame 3, so that the X-ray detection device 5 can detect from the side of the electronic component, so that there are more detection angles, and the appropriate detection angle can be selected according to needs to improve the detection effect.
[0037] The moving assembly 4 includes a mounting seat 41, which is movably mounted in a movable groove in the middle of the track frame 3. Rollers 44 are rotatably mounted on both sides of the middle of the mounting seat 41 through a rotating shaft. The rollers 44 on both sides are engaged with the grooves 31 on the top of the track frame 3. A motor 42 is fixed in the middle of the mounting seat 41. A gear set 43 is mounted on the output end of the motor 42. The rotating shaft and roller 44 are driven to rotate by the gear set 43. A mounting block 45 is mounted at the bottom of the mounting seat 41. Rollers 46 are symmetrically mounted on both sides of the mounting block 45. The rollers 46 on both sides are respectively abutted against The bottom of the track frame 3; when working, the roller 1 44 and the roller 2 46 are clamped on the upper and lower sides of the track frame 3, so that the moving component 4 can move along the track frame 3, and the motor 1 42 is started. The motor 1 42 drives the roller 1 44 to rotate through the gear set 43, and the roller 1 44 rolls along the top of the track frame 3, driving the mounting seat 41 and the mounting block 45 to move synchronously, thereby driving the X-ray detection device 5 to move along the track frame 3, so that the X-ray detection device 5 can detect different solder joint positions of electronic components, so that the detection data can be obtained from multiple perspectives, which is helpful to comprehensively evaluate the quality of the solder joints and improve the comprehensiveness and accuracy of the detection.
[0038] A movable cavity 47 is provided in the middle of the lower part of the mounting seat 41, and a disc 48 is movably installed on the top of the movable cavity 47. A connecting column 410 is fixedly connected to the bottom of the disc 48. The bottom end of the connecting column 410 extends downward and is fixedly connected to the top of the mounting block 45. A spring 49 is provided under the disc 48. When working, the mounting block 45 is rotated first, and the mounting block 45 drives the connecting column 410 and the disc 48 to rotate, so that the rollers 46 on both sides move to a vertical position with the rollers 44 on both sides. At this time, the moving component 4 can be inserted into the middle movable groove from the top of the track frame 3, so that the roller 44 is engaged in the groove 31, and the shaking of the mounting seat 41 is limited by the groove 31. Then, the mounting block 45 is pulled downward, and the mounting block 4 5 drives the disc 48 to move downward, the spring 1 49 is compressed, and the roller 2 46 is driven to move to the bottom of the track frame 3, and then the mounting block 45 is rotated in the opposite direction, so that the rollers 2 46 on both sides are reset to a position parallel to the rollers 1 44 on both sides, and the spring 1 49 rebounds to push the disc 48, the connecting column 410 and the mounting block 45 to move upward, so that the roller 2 46 is pressed against the bottom of the track frame 3, and the rollers 1 44 and the rollers 2 46 are clamped on the upper and lower sides of the track frame 3, so that the moving assembly 4 can be stably installed on the track frame 3, so that the moving assembly 4 can be quickly installed and disassembled, and the moving assembly 4 can be easily repaired and replaced, and the moving assembly 4 can move along the track frame 3 to achieve multi-angle detection.
[0039] The connecting column 410 is a square column, and the two sides of the connecting column 410 are symmetrically provided with limit plates 411, and support rods 412 are fixed on the opposite side walls of the limit plates 411 on both sides, and support sleeves 413 are fixed on the inner walls of the two sides of the movable cavity 47. The support rod 412 is slidably set in the support sleeve 413, and a spring 414 is installed inside the support sleeve 413 to reset the support rod 412; when working, the support rod 412 is pushed to move toward the middle by the spring 414, so that the limit plates 411 on both sides are clamped on the sides of the connecting column 410, thereby limiting the connecting column 410. When the connecting column 410 is rotated, the edges of the connecting column 410 can push the limiting plate 411 to move to both sides. When the connecting column 410 is rotated 90°, it is reset by the spring 2 414, and then the limiting plate 411 is reset, so that the limiting plate 411 is clamped on the side wall of the connecting column 410 again, which is convenient for limiting the connecting column 410, and the rotation angle of the connecting column 410, the mounting block 45 and the roller 2 46 can be accurately known, so as to facilitate the rapid adjustment of the relative position of the roller 2 46 and the roller 1 44 during the disassembly and assembly of the moving component 4, thereby reducing the difficulty of work and improving the disassembly and assembly efficiency.
[0040] A plurality of groups of air holes 8 are evenly arranged on the support plate 2, a negative pressure cavity 9 is fixed at the bottom of the support plate 2, the air holes 8 are connected to the negative pressure cavity 9, and a negative pressure pump 10 is fixed at the bottom of the negative pressure cavity 9; when working, the electronic component to be detected is placed on the support plate 2, and the negative pressure pump 10 is started. The negative pressure pump 10 generates negative pressure in the negative pressure cavity 9, so that the air holes 8 generate downward suction, and the electronic component is adsorbed and fixed on the support plate 2, which can limit the electronic components of different sizes, and is convenient to use.
[0041] The roller 1 44 and the roller 2 46 are both made of silicone material; when working, the friction between the roller 1 44 , the roller 2 46 and the track frame 3 is increased, so that the moving component 4 can move smoothly along the track frame 3 .
[0042] Embodiment 2: Figure 4 As shown, compared with Example 1, another implementation of the present invention is: a mounting rod 51 is fixed on the top of the X-ray detection device 5, and the mounting rod 51 is slidably inserted into the mounting hole opened at the bottom of the mounting block 45; when working, the mounting rod 51 and the mounting hole cooperate to quickly disassemble and assemble the X-ray detection device 5, so as to facilitate the maintenance of the X-ray detection device 5.
[0043] like Figure 7 As shown, a method for identifying solder joint detection, the method adopts the above-mentioned device for identifying solder joint detection, and comprises the following steps:
[0044] S1. Place the electronic component to be tested on the support plate 2 and start the negative pressure pump 10. The negative pressure pump 10 generates negative pressure in the negative pressure chamber 9, thereby causing the air hole 8 to generate downward suction to adsorb and fix the electronic component on the support plate 2.
[0045] S2, make the track frame 3 perpendicular to the support plate 2, start the motor 1 42, the motor 1 42 drives the roller 1 44 to rotate through the gear set 43, the roller 1 44 rolls along the top of the track frame 3, drives the mounting seat 41 and the mounting block 45 to move synchronously, and then drives the X-ray detection device 5 to move along the track frame 3, so that the X-ray detection device 5 can detect different solder joint positions of electronic components;
[0046] S3. Start the second motor 7. The second motor 7 drives the track frame 3 to rotate through the mounting shaft 6 to change the inclination angle of the track frame 3. Then, the moving assembly 4 drives the X-ray detection device 5 to reciprocate along the track frame 3, so that the X-ray detection device 5 can perform multi-angle detection from the side of the electronic component.
[0047] The above-mentioned front, back, left, right, top and bottom are all based on the figures in the specification. Figure 1 As a benchmark, according to the person's observation perspective, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.
[0048] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the scope of protection of the present invention.
[0049] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.
Claims
1. A recognition device for solder joint detection, characterized in that: include: X-ray detection device (5); A support frame (1), wherein a support plate (2) is fixed in the middle of the support frame (1), a track frame (3) is arranged above the support plate (2), the track frame (3) is arranged in a semi-circular shape, and the two ends of the track frame (3) are rotatably mounted on both sides of the middle of the support plate (2) through mounting shafts (6), and a motor (7) for driving the track frame (3) to rotate is fixed on the outer wall of the support frame (1); A moving component (4), wherein the moving component (4) is movably mounted on a track frame (3), and the X-ray detection device (5) is mounted at the bottom of the moving component (4). The moving component (4) drives the X-ray detection device (5) to move along the track frame (3).
2. A solder joint detection identification device according to claim 1, characterized in that: The moving assembly (4) comprises a mounting seat (41), the mounting seat (41) being movably mounted in a movable groove in the middle of the track frame (3), rollers (44) being rotatably mounted on both sides of the middle of the mounting seat (41) through a rotating shaft, the rollers (44) on both sides being engaged with grooves (31) in the top of the track frame (3), a motor (42) being fixed in the middle of the mounting seat (41), a gear set (43) being mounted on the output end of the motor (42), the rotating shaft and the rollers (44) being driven to rotate by the gear set (43), a mounting block (45) being mounted at the bottom of the mounting seat (41), rollers (46) being symmetrically rotatably mounted on both sides of the mounting block (45), the rollers (46) on both sides being respectively abutted against the bottom of the track frame (3).
3. A solder joint detection identification device according to claim 2, characterized in that: A movable cavity (47) is provided in the middle of the lower part of the mounting seat (41), a disc (48) is movably mounted on the top of the movable cavity (47), a connecting column (410) is fixedly connected to the bottom of the disc (48), the bottom end of the connecting column (410) extends downward and is fixedly connected to the top of the mounting block (45), and a spring (49) is provided below the disc (48).
4. A solder joint detection identification device according to claim 3, characterized in that: The connecting column (410) is a square column, and limit plates (411) are symmetrically arranged on both sides of the connecting column (410), and support rods (412) are fixed on the opposite side walls of the limit plates (411) on both sides. Support sleeves (413) are fixed on the inner walls on both sides of the movable cavity (47), and the support rod (412) is slidably arranged in the support sleeve (413), and a spring 2 (414) is installed inside the support sleeve (413) to reset the support rod (412).
5. A solder joint detection identification device according to claim 4, characterized in that: The support plate (2) is evenly provided with a plurality of groups of air holes (8), a negative pressure chamber (9) is fixed at the bottom of the support plate (2), the air holes (8) are connected to the negative pressure chamber (9), and a negative pressure pump (10) is fixed at the bottom of the negative pressure chamber (9).
6. A solder joint detection identification device according to claim 5, characterized in that: The roller 1 (44) and the roller 2 (46) are both made of silicone material.
7. A solder joint detection identification device according to claim 6, characterized in that: A mounting rod (51) is fixed on the top of the X-ray detection device (5), and the mounting rod (51) is slidably inserted into a mounting hole opened at the bottom of the mounting block (45).
8. A method for identifying solder joints, the method using the device for identifying solder joints according to claim 7, characterized in that: The following steps are involved: S1. Place the electronic component to be tested on the support plate (2), start the negative pressure pump (10), and the negative pressure pump (10) generates negative pressure in the negative pressure chamber (9), thereby causing the air hole (8) to generate a downward suction force, thereby adsorbing and fixing the electronic component on the support plate (2); S2, making the track frame (3) perpendicular to the support plate (2), starting the motor 1 (42), the motor 1 (42) driving the roller 1 (44) to rotate through the gear set (43), the roller 1 (44) rolling along the top of the track frame (3), driving the mounting seat (41) and the mounting block (45) to move synchronously, thereby driving the X-ray detection device (5) to move along the track frame (3), so that the X-ray detection device (5) can detect different solder joint positions of the electronic components; S3, start the second motor (7), the second motor (7) drives the track frame (3) to rotate through the mounting shaft (6), thereby changing the inclination angle of the track frame (3), and then drives the X-ray detection device (5) to reciprocate along the track frame (3) through the moving component (4), so that the X-ray detection device (5) can perform multi-angle detection from the side of the electronic component.
Citation Information
Patent Citations
Excavator
CN112648060A