A method and device for parallel calibration between optical fiber and chip

Abstract

The present invention discloses a method and device for parallel calibration between an optical fiber and a chip, and relates to the field of silicon photonic chip performance testing. The method comprises adjusting the chip to a preset horizontal orientation, moving the optical fiber above the chip, adjusting the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface; and adjusting the optical fiber tilt angle based on the parallelism between the optical fiber and the optical fiber projection until the optical fiber and the optical fiber projection are parallel. By forming an optical fiber projection on the chip through the optical fiber, and observing and assisting in adjusting the parallelism between the optical fiber and the optical fiber projection through a parallelism observation camera, parallelism calibration between the optical fiber and the chip can be achieved. When performing batch chip performance testing, after a single calibration, the optical fiber always maintains the current posture, so as to be used for batch testing of multiple chips of the same model and parameters, thereby ensuring the accuracy and consistency of the experimental environment and improving the accuracy and convenience of batch chip performance testing.

Description

Technical Field

[0001] The present invention relates to the field of silicon photonic chip performance detection, and in particular to a method and device for parallel calibration between an optical fiber and a chip. Background Art

[0002] Silicon photonics, short for silicon-based optoelectronics, is an innovative approach to developing integrated optoelectronic devices using silicon and silicon-based materials (such as SiGe / Si and SOI) as substrates and leveraging CMOS process technology. Silicon photonic chips, as the heart of optical modules, are the core of optical communication systems.

[0003] The spacing between the optical fiber and the chip is crucial, usually 5 to 50 microns, and needs to be kept level. When conducting batch chip performance tests, due to the unevenness of the stage on which the chips are placed and the chips themselves, the initial horizontal calibration of the optical fiber cannot ensure that the optical fiber and the chip are completely level, resulting in deviations in the experimental basic environment. In this case, the measured data cannot truly reflect the performance of the chip itself. Summary of the Invention

[0004] The present application provides a method and device for parallel calibration between an optical fiber and a chip, which can solve the technical problem in the prior art that when performing performance testing on a chip, the chip performance cannot be accurately measured due to the unevenness of the stage on which the chip is placed and the chip itself, and the fact that the initial horizontal calibration of the optical fiber cannot ensure that the optical fiber and the chip are completely level, resulting in an unqualified initial experimental environment.

[0005] In a first aspect, an embodiment of the present application provides a method for parallel calibration between an optical fiber and a chip, comprising:

[0006] Adjust the chip to a preset horizontal orientation, move the optical fiber above the chip, and adjust the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface;

[0007] Adjusting the fiber tilt angle based on the parallelism between the optical fiber and the optical fiber projection until the optical fiber is parallel to the optical fiber projection;

[0008] The adjusting of the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface specifically includes:

[0009] A parallelism observation camera is set on one side of the long side of the chip adsorption platform, with its focus facing the side of the chip adsorption platform. The focal length of the parallelism observation camera is adjusted until a side image of the chip is formed in the parallelism observation camera.

[0010] Based on the design parameters of the chip and optical fiber, the optimal coupling distance between the chip and optical fiber is calculated;

[0011] Based on the optimal coupling spacing, adjusting the longitudinal position of the optical fiber until a fiber projection is formed on the chip surface, and both the optical fiber and the fiber projection form images in the parallelism observation camera;

[0012] The adjusting the fiber tilt angle based on the parallelism between the optical fiber and the optical fiber projection so that the optical fiber and the optical fiber projection are parallel specifically includes:

[0013] Based on the parallelism, the optical fiber side image and the optical fiber projection image formed in the camera are observed, and according to the parallelism between the optical fiber side image and the optical fiber projection image, the optical fiber tilt angle is adjusted until the optical fiber side image and the optical fiber projection image are parallel.

[0014] In combination with the first aspect, in one embodiment, adjusting the chip to a preset horizontal orientation and moving the optical fiber above the chip specifically includes:

[0015] A chip adjustment camera is set above the chip adsorption platform with its focus facing the upper surface of the chip adsorption platform, and the focus of the chip adjustment camera is adjusted until an image of the upper surface of the chip is formed in the chip adjustment camera;

[0016] The control chip adjusts the camera to start recognizing the right angle of the chip edge to determine the current horizontal orientation of the chip;

[0017] Based on the determination result of the chip adjustment camera, the horizontal orientation of the chip adsorption platform is adjusted until the chip adjustment camera determines that the chip on the chip adsorption platform is located within a preset orientation angle;

[0018] One end of the optical fiber is fixed, and the other end is facing the adjustment chip adsorption platform. The horizontal position of the optical fiber is adjusted until the free end of the optical fiber is located directly above the adjustment chip adsorption platform.

[0019] In a second aspect, an embodiment of the present application provides a parallel calibration device between an optical fiber and a chip, for implementing the above-mentioned parallel calibration method between an optical fiber and a chip, the parallel calibration device between an optical fiber and a chip comprising:

[0020] A placement assembly, the placement assembly comprising a chip placement unit and an optical fiber placement unit located on one side of the chip placement unit, the chip placement unit comprising a chip adsorption platform and a rotation axis located at the bottom of the chip adsorption platform, the optical fiber placement unit comprising, from top to bottom, an optical fiber holder facing the chip adsorption platform, a three-degree-of-freedom rotating member, and a three-degree-of-freedom translation platform;

[0021] An imaging component includes a chip adjustment camera located above the chip adsorption platform and with its focus toward the upper surface of the chip adsorption platform, and a parallelism observation camera located on one side of the length direction of the chip adsorption platform and with its focus toward the side of the chip adsorption platform.

[0022] In combination with the second aspect, in one embodiment, the chip adsorption platform includes a platform body and a negative pressure through hole longitudinally penetrating the platform body, and an outflow end of the negative pressure through hole is provided with a connection end for connecting to an external adsorption pipeline.

[0023] In one embodiment, the bottom of the self-rotating shaft is connected to a power source, and the top of the self-rotating shaft is connected to the bottom of the chip adsorption platform.

[0024] In one embodiment, one end of the optical fiber holder is detachably connected to the top of the three-degree-of-freedom rotating member, and the other end of the optical fiber holder extends horizontally toward the chip adsorption platform.

[0025] In one embodiment, an optical fiber connector is provided at one end of the optical fiber holder close to the chip adsorption platform.

[0026] In one embodiment, the imaging assembly further includes a camera bracket for fixing the chip adjustment camera and the parallelism observation camera.

[0027] The beneficial effects of the technical solutions provided in the embodiments of the present application include:

[0028] The parallel calibration method between optical fiber and chip in the present application forms an optical fiber projection on the chip through optical fiber, and uses a parallelism observation camera to observe and assist in adjusting the parallelism between the optical fiber and the optical fiber projection, which can realize the parallelism calibration between the optical fiber and the chip. When performing batch chip performance testing, after a single calibration, the optical fiber always maintains the current posture, so as to be used for batch testing of multiple chips of the same model and parameters, ensuring the accuracy and consistency of the experimental environment, and improving the accuracy and convenience of batch chip performance testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 A schematic flow chart of a parallel calibration method between an optical fiber and a chip provided in an embodiment of the present application;

[0031] Figure 2 A schematic diagram of the structure of a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application;

[0032] Figure 3 A schematic diagram of the structure of the placement components and imaging components in a device for parallel calibration between an optical fiber and a chip provided in an embodiment of the present application;

[0033] Figure 4 This is a schematic longitudinal section of a chip adsorption platform in a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application.

[0034] In the figure: 1. Chip placement unit; 101. Chip adsorption platform; 1011. Platform body; 1012. Negative pressure through hole; 1013. Connection end; 102. Rotation axis; 2. Fiber placement unit; 201. Fiber bracket; 202. Three-degree-of-freedom rotating part; 203. Three-degree-of-freedom translation platform; 3. Chip adjustment camera; 4. Parallelism observation camera. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] First, some technical terms in this application are explained to facilitate understanding of this application by those skilled in the art:

[0037] Optical fiber, or optical fiber, is a light transmission tool that uses the principle of total internal reflection of light within a fiber made of glass or plastic. It boasts high transmission speeds, wide bandwidth, and strong anti-interference capabilities, making it the core of modern communications technology. Optical fiber transmits data in the form of light signals, enabling information to travel across long distances in an instant.

[0038] A chip is a miniature electronic component that integrates multiple electronic components on a single substrate to perform specific circuit or system functions. It is the most important part of an electronic device, responsible for computing, control, and storage. In communications systems, chips are responsible for decoding, processing, and re-encoding received optical signals.

[0039] Fiber-to-chip coupling methods: Coupling fiber and chip is a key step in achieving optical signal transmission and processing. Common coupling methods include direct coupling, ball lens coupling, inverted cone coupling, fiber array coupling, and grating coupling. End-face coupling is the most common coupling method. This method achieves optical signal transmission by closely aligning the chip's output light spot with the fiber's end face. This coupling method offers advantages such as simple structure and high coupling efficiency.

[0040] On the one hand, the embodiments of the present application provide a method for parallel calibration between an optical fiber and a chip, which can solve the technical problem in the prior art that when performing performance testing on a chip, the chip performance cannot be accurately measured due to the unevenness of the stage on which the chip is placed and the chip itself, and the fact that the initial horizontal calibration of the optical fiber cannot ensure that the optical fiber and the chip are completely level, and the initial experimental environment is unqualified.

[0041] Figure 1 A schematic flow chart of a parallel calibration method between an optical fiber and a chip provided in an embodiment of the present application is shown as follows: Figure 1 As shown, the parallel calibration method between the optical fiber and the chip in this application specifically includes:

[0042] S1: Adjust the chip to a preset horizontal orientation, move the optical fiber above the chip, and adjust the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface;

[0043] Chip orientation refers to the direction or angle of the chip surface relative to the optical fiber during installation or use. In optoelectronic integration, precise control of chip orientation is crucial for achieving efficient optical coupling, reducing optical loss, and improving overall system performance. Therefore, before beginning an experiment, the chip's flatness and orientation must be adjusted. Once the chip is properly aligned, the optical fiber can be placed over it.

[0044] It should be noted here that the coupling efficiency between the chip and the optical fiber depends on the angle between the chip and the optical fiber. Therefore, in this application, the chip is not required to be absolutely horizontal. As long as the optical fiber is debugged with the chip as the reference, the optical fiber can be debugged to be relatively parallel to the chip.

[0045] The imaging process of optical fiber on chip mainly includes: the optical fiber transmits the optical signal to the inside of the chip through the chip interface, the optical signal processing starts inside the chip, and finally the image is formed. This process belongs to the existing technology and will not be described in detail here. The main influencing factor of optical fiber imaging on chip is the coupling efficiency between the optical fiber and the chip, and the important parameter that determines the coupling efficiency is the coupling distance between the optical fiber and the chip. Therefore, in this step, by using the chip as the debugging reference, the longitudinal position of the optical fiber is adjusted so that the distance between the optical fiber and the chip reaches the optimal coupling efficiency, so that the optical fiber can form a clear and clear optical fiber projection on the chip surface.

[0046] S2: Based on the parallelism between the optical fiber and the optical fiber projection, adjust the optical fiber tilt angle until the optical fiber is parallel to the optical fiber projection.

[0047] The surface of the chip itself is uneven, and it is not convenient to observe the parallelism. Therefore, in this application, we use the method of observing the optical fiber projection formed on the chip surface and calibrating the parallelism of the optical fiber projection and the optical fiber. This can indirectly achieve the parallelism calibration between the optical fiber and the chip, and can also ensure the optimal coupling distance between the optical fiber and the chip by observing the clarity of the optical fiber projection. When conducting batch chip performance testing, after a single calibration, the optical fiber always maintains the current posture to be applicable to multiple chips of the same model and parameters, so as to ensure the accuracy and consistency of the test environment and improve the accuracy and convenience of batch chip performance testing.

[0048] Specifically, adjusting the chip to a preset horizontal orientation and moving the optical fiber above the chip in step S1 specifically includes:

[0049] S101: A chip adjustment camera 3 is set above the chip adsorption platform 101 with its focus facing the upper surface of the chip adsorption platform 101, and the chip adjustment camera 3 adjusts its focus until an image of the chip upper surface is formed in the chip adjustment camera 3;

[0050] S102: The control chip adjusts the camera 3 to start recognizing the right angle of the chip edge to determine the current horizontal orientation of the chip;

[0051] S103: Based on the determination result of the chip adjustment camera 3 , the horizontal orientation of the chip adsorption platform 101 is adjusted until the chip adjustment camera 3 determines that the chip on the chip adsorption platform 101 is located within a preset orientation angle.

[0052] S104 : One end of the optical fiber is fixed, and the other end is directed toward the adjustment chip adsorption platform 101 , and the horizontal position of the optical fiber is adjusted until the free end of the optical fiber is directly above the adjustment chip adsorption platform 101 .

[0053] The chip adsorption platform 101 is mainly used to stably place the chip. After placement and debugging are completed, the chip adjustment camera 3 is perpendicular to the chip surface to reduce perspective distortion. The focus of the chip adjustment camera 3 is facing the chip on the chip adsorption platform 101, so that the chip adjustment camera 3 can obtain a clear chip image. Then, the edge detection algorithm is applied to identify the chip edge and extract the right-angle point from the detected chip edge. Finally, based on the extracted right-angle feature points, the orientation angle of the chip edge is calculated and the result is output. The staff can adjust the horizontal orientation of the chip according to the output result of the chip adjustment camera 3.

[0054] Furthermore, the step S1 of adjusting the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface specifically includes:

[0055] S105: Setting a parallelism observation camera 4 with its focus facing the side of the chip adsorption platform 101 on one side of the long side of the chip adsorption platform 101, and adjusting the focal length of the parallelism observation camera 4 until a side image of the chip is formed within the parallelism observation camera 4;

[0056] S106: Calculating an optimal coupling distance between the chip and the optical fiber based on the parameters of the chip and the optical fiber;

[0057] S107: Based on the optimal coupling spacing, the longitudinal position of the optical fiber is adjusted until a fiber projection is formed on the chip surface, and both the optical fiber and the fiber projection form images in the parallelism observation camera 4;

[0058] The parallelism observation camera 4 is mainly used to observe the horizontality between the optical fiber and the optical fiber shadow. It is set on the side of the long side of the chip adsorption platform 101 so that the parallelism observation camera 4 can observe the side of the long side of the optical fiber. After the height position of the optical fiber is adjusted, the optical fiber forms an optical fiber projection on the chip surface. At the same time, the optical fiber and the optical fiber projection are both displayed in the parallelism observation camera 4.

[0059] Furthermore, step S2 specifically includes:

[0060] S201: Observe the optical fiber side image and the optical fiber projection image formed in the parallelism camera 4, and adjust the optical fiber tilt angle according to the parallelism between the optical fiber side image and the optical fiber projection image until the optical fiber side image and the optical fiber projection image are parallel.

[0061] The optical fiber forms a side image of the optical fiber in the parallelism observation camera 4, and the optical fiber projection forms a optical fiber projection image in the parallelism observation camera 4. The optical fiber projection is directly formed on the chip surface. Therefore, the parallelism between the optical fiber and the optical fiber projection can be equivalent to the parallelism between the optical fiber and the chip. On the premise that the chip posture has been debugged, the chip is used as a horizontal reference to debug the optical fiber tilt angle until the optical fiber and the optical fiber projection are relatively parallel.

[0062] The parallel calibration method between the optical fiber and the chip in the present application forms an optical fiber projection on the chip through the optical fiber, and observes and assists in adjusting the parallelism between the optical fiber and the optical fiber projection through the parallelism observation camera 4, so as to realize the parallelism calibration between the optical fiber and the chip. When performing batch chip performance testing, after a single calibration, the optical fiber always maintains the current posture, so as to be used for batch testing of multiple chips of the same model and parameters, thereby ensuring the accuracy and consistency of the experimental environment and improving the accuracy and convenience of batch chip performance testing.

[0063] In a second aspect, the present application further provides a device for parallel calibration between an optical fiber and a chip, for implementing the above-mentioned method for parallel calibration between an optical fiber and a chip. Figure 2 A schematic diagram of a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application, Figure 3 A schematic diagram of the structure of the placement components and imaging components in a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application is shown as follows: Figure 2 、 Figure 3 As shown, the parallel calibration device between the optical fiber and the chip includes a placement component and an imaging component. The placement component is used to stably place the optical fiber and the chip, and the imaging component is used to assist in debugging the chip posture and the parallelism between the chip and the optical fiber.

[0064] The placement component includes a chip placement unit 1 and a fiber placement unit 2 located on one side of the chip placement unit 1. The chip placement unit 1 includes a chip adsorption platform 101 and a rotation axis 102 located at the bottom of the chip adsorption platform 101. The fiber placement unit 2 includes, from top to bottom, a fiber bracket 201 facing the chip adsorption platform 101, a three-degree-of-freedom rotating part 202, and a three-degree-of-freedom displacement platform 203.

[0065] The imaging component includes a chip adjustment camera 3 located above the chip adsorption platform 101 and focusing toward the upper surface of the chip adsorption platform 101, and a parallelism observation camera 4 located on one side of the chip adsorption platform 101 in the longitudinal direction and focusing toward the side of the chip adsorption platform 101.

[0066] The chip placement unit 1 and the optical fiber placement unit 2 are arranged at intervals. The chip adsorption platform 101 in the chip placement unit 1 is mainly used to use negative pressure to adsorb the chip during the experiment to ensure the stability of the chip and prevent damage to the chip. The rotating shaft 102 located at the bottom of the chip adsorption platform 101 can rotate along its own axial direction to adjust the horizontal orientation of the chip.

[0067] The optical fiber holder 201 in the optical fiber placement unit 2 is mainly used to fix one end of the optical fiber. The three-degree-of-freedom rotating part 202 can drive the optical fiber holder 201 and the optical fiber to rotate around the X-axis, Y-axis and Z-axis. The three-degree-of-freedom translation platform 203 can drive the optical fiber holder 201 and the optical fiber to translate in the X-axis, Y-axis and Z-axis. The three-degree-of-freedom rotating part 202 and the three-degree-of-freedom translation platform 203 cooperate with each other to realize flexible adjustment of the optical fiber at multiple angles.

[0068] It should be noted that the aforementioned X, Y, and Z refer to the three cardinal directions in three-dimensional space. In three-dimensional space, the X direction generally represents a component of the horizontal direction, or can be understood as the left-right direction. The Y direction represents another component of the horizontal direction, or can be understood as the front-back direction. The Z direction represents a third direction perpendicular to the X and Y axes, and is generally understood as the up-down direction. The three-degree-of-freedom translation stage 203 and the three-degree-of-freedom rotation member 202 are conventional components and will not be described in detail here.

[0069] The chip adjustment camera 3 is located on the normal side of the chip adsorption platform 101 and is perpendicular to the chip adsorption platform 101. The chip adsorption platform 101 and the chip on the chip adsorption platform 101 are located in the lens of the chip adjustment camera 3. The chip adjustment camera 3 obtains the image of the chip, calculates the tilt angle of the chip and outputs the result. The staff can adjust the horizontal orientation of the chip according to the output result of the chip adjustment camera 3.

[0070] The parallelism observation camera 4 is located on one side of the long side of the chip adsorption platform 101. After the chip and the optical fiber are adjusted, one side of the long side of the chip and the optical fiber is within the lens of the parallelism observation camera 4, so that the staff can observe the parallelism between the chip and the optical fiber conveniently.

[0071] Further, Figure 4 A schematic longitudinal section diagram of a chip adsorption platform 101 in a parallel calibration device between an optical fiber and a chip provided in an embodiment of the present application, as shown in FIG. Figure 4 As shown, the chip adsorption platform 101 includes a table body 1011 and a negative pressure through hole 1012 that penetrates the table body 1011 longitudinally. The outflow end of the negative pressure through hole 1012 is provided with a connection end 1013 for connecting to an external adsorption pipe. The bottom of the rotating shaft 102 is connected to a power source, and the top of the rotating shaft 102 is connected to the bottom of the chip adsorption platform 101. The table body 1011 has a certain thickness. The negative pressure through hole 1012 penetrates the table body 1011 longitudinally and avoids the position of the rotating shaft 102. The external adsorption pipe is connected to the outflow end of the negative pressure through hole 1012. In one embodiment of the present application, the connection end 1013 of the negative pressure through hole 1012 is an internal thread type.

[0072] Furthermore, one end of the optical fiber holder 201 is detachably connected to the top of the three-degree-of-freedom rotating part 202, and the other end of the optical fiber holder 201 extends horizontally toward the chip adsorption platform 101. In one embodiment of the present application, the optical fiber holder 201 is in the shape of an elongated strip, and a threaded hole is provided at one end of the optical fiber holder 201. A connecting hole corresponding to the threaded hole is provided on the top of the three-degree-of-freedom rotating part 202. The detachable connection between the optical fiber holder 201 and the three-degree-of-freedom rotating part 202 is achieved by connecting bolts, and the end of the optical fiber holder 201 without a threaded hole extends horizontally toward the chip adsorption platform 101.

[0073] Furthermore, an optical fiber connector is provided at one end of the optical fiber holder 201 close to the chip adsorption platform 101. The specific connection method of the optical fiber connector includes but is not limited to a harness connection, a threaded connection or a snap connection, etc., as long as the connection stability between the optical fiber holder 201 and the optical fiber is ensured, and no specific restrictions are made in this application.

[0074] Furthermore, the imaging component also includes a camera bracket for fixing the chip adjustment camera 3 and the parallelism observation camera 4. In the present application, there are two camera brackets. The chip adjustment camera 3 and the parallelism observation camera 4 are respectively arranged on the camera brackets. The camera brackets are fixed on a fixed surface to ensure normal imaging of the chip adjustment camera 3 and the parallelism observation camera 4. No specific restrictions are made in the present application.

[0075] In the description of this application, it should be noted that the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0076] It should be noted that, in this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0077] The foregoing is merely a list of specific embodiments of the present application, intended to enable those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the broadest scope consistent with the principles and novel features of the present application.

Claims

1. A method for parallel calibration between an optical fiber and a chip, characterized in that: include: Adjust the chip to a preset horizontal orientation, move the optical fiber above the chip, and adjust the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface; Adjusting the fiber tilt angle based on the parallelism between the optical fiber and the optical fiber projection until the optical fiber is parallel to the optical fiber projection; The adjusting of the longitudinal position of the optical fiber so that the optical fiber forms an optical fiber projection on the chip surface specifically includes: A parallelism observation camera (4) with a focus facing the side of the chip adsorption platform (101) is arranged on a side of a long side of the chip adsorption platform (101), and the focal length of the parallelism observation camera (4) is adjusted until a side image of the chip is formed in the parallelism observation camera (4); Based on the design parameters of the chip and optical fiber, the optimal coupling distance between the chip and optical fiber is calculated; Based on the optimal coupling spacing, the longitudinal position of the optical fiber is adjusted until a fiber projection is formed on the chip surface, and both the optical fiber and the fiber projection form images in the parallelism observation camera (4); The adjusting the fiber tilt angle based on the parallelism between the optical fiber and the optical fiber projection so that the optical fiber and the optical fiber projection are parallel specifically includes: Based on the parallelism, the optical fiber side image and the optical fiber projection image formed in the camera (4) are observed, and according to the parallelism between the optical fiber side image and the optical fiber projection image, the optical fiber tilt angle is adjusted until the optical fiber side image and the optical fiber projection image are parallel.

2. A method for parallel calibration between an optical fiber and a chip according to claim 1, characterized in that: The step of adjusting the chip to a preset horizontal orientation and moving the optical fiber above the chip specifically includes: A chip adjustment camera (3) is arranged above the chip adsorption platform (101) with its focus facing the upper surface of the chip adsorption platform (101), and the focal length of the chip adjustment camera (3) is adjusted until an image of the upper surface of the chip is formed in the chip adjustment camera (3); The control chip adjusts the camera (3) to start recognizing the right angle of the chip edge to determine the current horizontal orientation of the chip; Based on the determination result of the chip adjustment camera (3), the horizontal orientation of the chip adsorption platform (101) is adjusted until the chip adjustment camera (3) determines that the chip on the chip adsorption platform (101) is located within a preset orientation angle; One end of the optical fiber is fixed, and the other end faces the adjustment chip adsorption platform (101), and the horizontal position of the optical fiber is adjusted until the free end of the optical fiber is located directly above the adjustment chip adsorption platform (101).

3. A parallel calibration device between an optical fiber and a chip, used to implement the parallel calibration method between an optical fiber and a chip according to any one of claims 1 to 2, characterized in that: The optical fiber and chip parallel calibration device comprises: A placement component, the placement component comprising a chip placement unit (1) and an optical fiber placement unit (2) located on one side of the chip placement unit (1), the chip placement unit (1) comprising a chip adsorption platform (101) and a rotation axis (102) located at the bottom of the chip adsorption platform (101), the optical fiber placement unit (2) comprising, from top to bottom, an optical fiber holder (201) facing the chip adsorption platform (101), a three-degree-of-freedom rotating member (202), and a three-degree-of-freedom displacement platform (203); An imaging component comprises a chip adjustment camera (3) located above the chip adsorption platform (101) and having a focus toward the upper surface of the chip adsorption platform (101), and a parallelism observation camera (4) located on one side in the length direction of the chip adsorption platform (101) and having a focus toward the side of the chip adsorption platform (101).

4. The parallel calibration device between an optical fiber and a chip according to claim 3, characterized in that: The chip adsorption platform (101) comprises a platform body (1011) and a negative pressure through hole (1012) longitudinally penetrating the platform body (1011); an outflow end of the negative pressure through hole (1012) is provided with a connection end (1013) for connecting to an external adsorption pipeline.

5. The parallel calibration device between an optical fiber and a chip according to claim 4, characterized in that: The bottom of the self-rotating rotation shaft (102) is connected to a power source, and the top of the self-rotating rotation shaft (102) is connected to the bottom of the chip adsorption platform (101).

6. The parallel calibration device between an optical fiber and a chip according to claim 5, characterized in that: One end of the optical fiber bracket (201) is detachably connected to the top of the three-degree-of-freedom rotating member (202), and the other end of the optical fiber bracket (201) extends horizontally toward the chip adsorption platform (101).

7. The optical fiber and chip parallel calibration device according to claim 6, characterized in that: An optical fiber connector is provided on one end of the optical fiber bracket (201) close to the chip adsorption platform (101).

8. The optical fiber and chip parallel calibration device according to claim 7, characterized in that: The imaging assembly further comprises a camera bracket for fixing the chip adjustment camera (3) and the parallelism observation camera (4).

Images