Testing device of gate driving chip

Abstract

The invention discloses a testing device for a gate driving chip, and the device comprises a testing mother board which is provided with a first plugging electric connection part, and is suitable for testing the gate driving chip; testing the daughter board; and the grid driving chip mounting seat is arranged on the other side of the first direction of the test daughter board and is electrically connected with the test daughter board, a plugging part is arranged on the grid driving chip mounting seat, and the plugging part is suitable for being detachably and electrically connected with the grid driving chip in a plugging manner. Therefore, the grid driving chip mounting seat is arranged, the grid driving chip mounting seat is arranged on the other side of the first direction of the test daughter board and is electrically connected with the test daughter board, and the plugging part is arranged on the grid driving chip mounting seat, so that detachable electric connection of the grid driving chip on the test device can be realized; therefore, the inconvenience caused by welding and dismounting can be reduced, the gate driving chip is convenient to install and replace, and the test convenience can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a testing device for a gate drive chip. Background Art

[0002] In the power semiconductor industry, every time a new driver chip is developed, its performance needs to be tested. In order to achieve the performance test of the driver chip, a corresponding test device needs to be set up.

[0003] In the related art, the testing device includes a testing board, and the driver chip to be tested is usually welded to the testing board. Although this can achieve the performance test of the driver chip, it requires the use of a soldering iron and solder wire, and welding and disassembly are both troublesome. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a test device for a gate driver chip, which has higher testing convenience.

[0005] According to an embodiment of the present invention, a test device for a gate drive chip includes: a test motherboard, a first plug-in electrical connection portion is provided on the test motherboard, and the test motherboard is suitable for testing a gate drive chip; a test daughter board, a second plug-in electrical connection portion is provided on one side of the first direction of the test daughter board, one of the first plug-in electrical connection portion and the second plug-in electrical connection portion is a plug hole, and the other is a plug pin, and the plug hole and the plug pin are detachably plugged and electrically connected; a gate drive chip mounting seat, the gate drive chip mounting seat is arranged on the other side of the first direction of the test daughter board and is electrically connected to the test daughter board, and a plug-in portion is provided on the gate drive chip mounting seat, and the plug-in portion is suitable for detachably plugging and electrically connecting with the gate drive chip.

[0006] Therefore, by setting a gate drive chip mounting seat, the gate drive chip mounting seat is set on the other side of the first direction of the test sub-board and electrically connected to the test sub-board, and a plug-in portion is set on the gate drive chip mounting seat, so that the gate drive chip can be detachably connected to the test device, thereby reducing the inconvenience caused by welding and disassembly, facilitating the installation and replacement of the gate drive chip, and improving the convenience of testing.

[0007] In some examples of the present invention, the first plug-in electrical connection portion is the plug-in hole, the second plug-in electrical connection portion is the plug-in pin, a plug socket is provided on the test mother board, a plurality of the plug-in holes arranged at intervals are provided on the plug socket, a plurality of the plug-in pins are provided on the test sub-board, and the plurality of the pins are plug-in electrically connected with the plurality of the plug-in holes in a one-to-one correspondence.

[0008] In some examples of the present invention, there are two sockets, and the two sockets are spaced apart in the second direction.

[0009] In some examples of the present invention, a custom pin adapter and a pin configuration socket are provided on the test motherboard, the custom pin adapter includes a plurality of adapter pin sockets, and the plurality of adapter pin sockets are suitable for being electrically connected one-to-one with a plurality of pins of a gate drive chip, and the pin configuration socket includes a plurality of pin pin sockets with different functions, and at least one of the plurality of pin pin sockets with different functions is selectively electrically connected with at least one of the plurality of adapter pin sockets to selectively define the functions of a plurality of pins on the gate drive chip.

[0010] In some examples of the present invention, the custom pin adapter includes a control side input pin adapter, the pin configuration seat includes a control side input pin configuration seat, the control side input pin adapter includes a plurality of control side input adapter pin seats, the plurality of control side input adapter pin seats are suitable for being electrically connected to a plurality of control side input pins of a gate drive chip, the control side input pin configuration seat includes a plurality of control side input pin sockets with different functions, at least one of the plurality of control side input pin sockets with different functions is selectively electrically connected to at least one of the plurality of control side input adapter pin seats to selectively define the functions of the plurality of control side input pins of the gate drive chip.

[0011] In some examples of the present invention, the custom pin adapter includes a driving side output pin adapter, the pin configuration seat includes a driving side output pin configuration seat, the driving side output pin adapter includes a plurality of driving side output adapter needle seats, the plurality of driving side output adapter needle seats are suitable for being electrically connected to a plurality of driving side output pins of a gate driving chip, the driving side output pin configuration seat includes a plurality of driving side output pin needle seats with different functions, at least one of the plurality of driving side output pin needle seats with different functions is selectively electrically connected to at least one of the plurality of driving side output adapter needle seats to selectively define the functions of the plurality of driving side output pins of the gate driving chip.

[0012] In some examples of the present invention, the test device of the gate drive chip also includes at least one first electrical connection line, a first socket is provided at one end of the first electrical connection line, and the first socket is selectively plugged and electrically connected to at least one of the control side input pin sockets with multiple different functions, and the other end of the first electrical connection line is provided with a second socket, and the second socket is selectively plugged and electrically connected to at least one of the multiple control side input adapter needle sockets; and / or also includes at least one second electrical connection line, a third socket is provided at one end of the second electrical connection line, and the third socket is selectively plugged and electrically connected to at least one of the drive side output pin sockets with multiple different functions, and the other end of the second electrical connection line is provided with a fourth socket, and the fourth socket is selectively plugged and electrically connected to at least one of the multiple drive side output adapter needle sockets.

[0013] In some examples of the present invention, the control-side input pin adapters are spaced apart on one side of the second direction of the two sockets, and the drive-side output pin adapters are spaced apart on the other side of the second direction of the two sockets.

[0014] In some examples of the present invention, there are multiple control side input pin adapters, which are spaced apart in the second direction and electrically connected to each other; there are multiple drive side output pin adapters, which are spaced apart in the second direction and electrically connected to each other.

[0015] In some examples of the present invention, a power supply pin socket is provided on the test motherboard, and the power supply pin socket includes a control side input power supply pin socket and a drive side output power supply pin socket, the control side input power supply pin socket is suitable for supplying power to the control side input of the gate drive chip, and the drive side output power supply pin socket is suitable for supplying power to the drive side output of the gate drive chip.

[0016] In some examples of the present invention, the control side input power supply pin socket and the drive side output power supply pin socket are spaced apart in the third direction, and the power supply pin sockets are spaced apart on the side of the control side input pin adapter in the second direction away from the drive side output pin adapter.

[0017] In some examples of the present invention, a load mounting area is provided on the test motherboard, the load mounting area is suitable for mounting a load, and the load mounting area is selectively electrically connected to at least one of the control side input pin adapter and the drive side output pin adapter.

[0018] In some examples of the present invention, the load installation area is arranged at a distance from the two sockets on one side of the third direction.

[0019] In some examples of the present invention, load external needle sockets are provided on both sides of the third direction of the load installation area, and the load external needle sockets on both sides of the second direction of the load installation area are respectively suitable for electrically connecting to the positive and negative poles of the load, and the load external needle sockets on both sides of the second direction of the load installation area are selectively electrically connected to the control side input pin adapter at the same time; and / or the load external needle sockets on both sides of the second direction of the load installation area are selectively electrically connected to the drive side output pin adapter at the same time.

[0020] In some examples of the present invention, the gate drive chip mounting seat is fixed to the test sub-board by welding.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 is a partial schematic diagram of a testing device and a gate driving chip according to an embodiment of the present invention;

[0024] Figure 2 is a test circuit diagram of a test device according to an embodiment of the present invention

[0025] Figure 3 is a partial schematic diagram of a test device for a gate driving chip according to an embodiment of the present invention;

[0026] Figure 4 is a schematic diagram of a test motherboard according to an embodiment of the present invention;

[0027] Figure 5 is a schematic diagram of a test sub-board according to an embodiment of the present invention;

[0028] Figure 6 is a schematic diagram of a gate driver chip mounting base according to an embodiment of the present invention;

[0029] Figure 7 Schematic diagram of the packaging of a gate driver chip according to an embodiment of the present invention.

[0030] Reference numerals:

[0031] 100. Testing device;

[0032] 10. Test the motherboard;

[0033] 11. Plug socket; 111. first plug electrical connection portion;

[0034] 12. Custom pin adapter; 121. Control side input pin adapter; 1211. Control side input adapter pin seat; 122. Drive side output pin adapter; 1221. Drive side output adapter pin seat; 123. Adapter pin seat;

[0035] 13. Pin configuration seat; 131. Control side input pin configuration seat; 1311. Control side input pin needle seat; 132. Drive side output pin configuration seat; 1321. Drive side output pin needle seat; 133. Pin needle seat;

[0036] 14. Power supply pin socket; 141. Control side input power supply pin socket; 142. Drive side output power supply pin socket;

[0037] 15. Load installation area;

[0038] 16. Load external pin socket;

[0039] 17. Ground pin socket;

[0040] 20. Test the daughter board;

[0041] 30. Gate drive chip mounting seat; 31. Plug-in unit;

[0042] 40. first electrical connection line; 41. first plug hole; 42. second plug hole;

[0043] 200, gate drive chip; 201, control side; 202, drive side; 203, pin; 2031, control side input pin; 2032, drive side output pin;

[0044] 300. Load. DETAILED DESCRIPTION

[0045] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0046] Reference below Figure 1-Figure 7 A test device 100 for a gate driving chip 200 according to an embodiment of the present invention is described.

[0047] Combination Figure 1-Figure 7 As shown, the test device 100 of the gate driving chip 200 according to the present invention may mainly include: a test motherboard 10 , a test daughterboard 20 and a gate driving chip mounting seat 30 .

[0048] Among them, a first plug-in electrical connection portion 111 is provided on the test motherboard 10, and the test motherboard 10 is suitable for testing the gate drive chip 200. A second plug-in electrical connection portion is provided on one side of the first direction of the test daughter board 20, one of the first plug-in electrical connection portion 111 and the second plug-in electrical connection portion is a plug hole, and the other is a plug pin, and the plug hole and the plug pin are detachably plugged and electrically connected, and the gate drive chip mounting seat 30 is provided on the other side of the first direction of the test daughter board 20 and is electrically connected to the test daughter board 20, and a plug-in portion 31 is provided on the gate drive chip mounting seat 30, and the plug-in portion 31 is suitable for detachably plugging and electrically connecting with the gate drive chip 200.

[0049] Specifically, when the testing device 100 is working, it is necessary to electrically connect the testing motherboard 10 and the testing sub-board 20, and then electrically connect the gate driving chip 200 to the testing sub-board 20, so that the testing motherboard 10 provides basic support and services, and the testing sub-board 20 is used to lead out the pin 203 of the gate driving chip 200. The testing sub-board 20 is responsible for performing specific testing tasks, so that the testing device 100 can be used to test the gate driving parameters, realize the preliminary screening of the gate driving chip 200, and identify unqualified gate driving chips 200.

[0050] By providing a first plug-in electrical connection portion 111 on the test motherboard 10 and a second plug-in electrical connection portion on one side of the first direction of the test daughter board 20, a detachable plug-in electrical connection between the test motherboard 10 and the test daughter board 20 can be achieved through the plug-in cooperation between the first plug-in electrical connection portion 111 and the second plug-in electrical connection portion, which not only ensures the stability of the electrical connection and improves the reliability of the test device 100, but also facilitates the dismantling of the test motherboard 10 and the test daughter board 20, and facilitates replacement and upgrading.

[0051] Among them, one of the first plug-in electrical connection part 111 and the second plug-in electrical connection part can be a plug-in hole, and the other can be a plug-in pin. In this way, the plug-in connection between the first plug-in electrical connection part 111 and the second plug-in electrical connection part can be achieved by only inserting the plug-in pin into the plug-in hole. This can not only improve the speed and accuracy, and improve the assembly efficiency of the test device 100, but also improve the stability and reliability, and improve the reliability of the test device 100.

[0052] Furthermore, different from the prior art in which the gate drive chip 200 is directly welded to the test sub-board 20, the present application sets a gate drive chip mounting seat 30, sets the gate drive chip mounting seat 30 on the other side of the first direction of the test sub-board 20 and electrically connected to the test sub-board 20, and sets a plug-in portion 31 on the gate drive chip mounting seat 30, so that only the plug-in portion 31 and the gate drive chip 200 need to be detachably plugged and electrically connected, so as to achieve quick plug-in and pull-out cooperation between the gate drive chip mounting seat 30 and the gate drive chip 200, that is, the detachable electrical connection of the gate drive chip 200 on the test sub-board 20 and even the test device 100 can be achieved, thereby reducing the inconvenience caused by welding and disassembly, facilitating the installation and replacement of the gate drive chip 200, and improving the convenience of testing.

[0053] Therefore, by setting the gate drive chip mounting seat 30, the gate drive chip mounting seat 30 is set on the other side of the first direction of the test sub-board 20 and electrically connected to the test sub-board 20, and a plug-in portion 31 is set on the gate drive chip mounting seat 30, so that the gate drive chip 200 can be detachably electrically connected to the test device 100, thereby reducing the inconvenience caused by welding and disassembly, facilitating the installation and replacement of the gate drive chip 200, and improving the convenience of testing.

[0054] Combination Figure 1-Figure 4 As shown, the first plug-in electrical connection part 111 is a plug-in hole, the second plug-in electrical connection part is a pin, a plug socket 11 is provided on the test motherboard 10, a plurality of plug-in holes arranged at intervals are provided on the plug socket 11, a plurality of pins are provided on the test daughter board 20, and the plurality of pins are plug-in electrically connected with the plurality of plug-in holes in a one-to-one correspondence.

[0055] Specifically, considering that the gate drive chip 200 has multiple pins 203, the multiple pins 203 need to be electrically connected to the test sub-board 20. By setting a socket 11 on the test motherboard 10, a plurality of spaced-apart socket holes are provided on the socket 11, and a plurality of pins are provided on the test sub-board 20. The multiple pins are plugged and electrically connected with the multiple socket holes one by one, and the multiple pins are then electrically connected with the multiple pins 203 of the gate drive chip 200 accordingly. The gate drive chip 200 can be correctly set on the test device 100 to ensure the normal progress of the test.

[0056] Furthermore, combined with Figure 1-Figure 4As shown, there are two sockets 11, and the two sockets 11 are spaced apart in the second direction. In this way, on the one hand, the two sockets 11 can be plugged and matched with the test sub-board 20, and can both play the role of supporting the test sub-board 20, so that the force on the test sub-board 20 is more uniform, and the setting stability of the test sub-board 20 is improved. On the other hand, the two sockets 11 can be adapted to the multiple pins 203 on the left and right sides of the gate drive chip 200 in the second direction, which is convenient for connecting the test circuit.

[0057] Combination Figure 1-Figure 4 As shown, a custom pin adapter 12 and a pin configuration seat 13 are provided on the test motherboard 10. The custom pin adapter 12 may include a plurality of adapter needle seats 123. The plurality of adapter needle seats 123 are suitable for being electrically connected to a plurality of pins 203 of the gate driver chip 200 in a one-to-one correspondence. The pin configuration seat 13 may include a plurality of pin needle seats 133 with different functions. At least one of the plurality of pin needle seats 133 with different functions is selectively electrically connected to at least one of the plurality of adapter needle seats 123 to selectively define the functions of the plurality of pins 203 on the gate driver chip 200.

[0058] Specifically, the gate driver chip 200 is usually developed in the form of SOP28 (Small Outline Package with 28 pins) packaging, as a product form or quick-sealed sample for functional and reliability testing. Due to the diversity of gate driver chips 200 and to facilitate wafer bonding, the pins 203 of the device have different functions, and need to be matched one by one with the test motherboard 10 during the functional test process. If multiple test motherboards 10 are developed for matching, it will cause waste of the test motherboards 10.

[0059] Considering that the pin 203 of the gate driver chip 200 has a unique function, but the type of the pin 203 is unique. By setting a custom pin adapter 12 and a pin configuration seat 13 on the test motherboard 10, the multiple pins 203 of the gate driver chip 200 are electrically connected to the multiple adapter needle seats 123 on the custom pin adapter 12 in a one-to-one correspondence, and at least one of the pin needle seats 133 with multiple different functions of the pin configuration seat 13 is selectively electrically connected to at least one of the multiple adapter needle seats 123, so that the functions of the multiple pins 203 on the gate driver chip 200 can be selectively defined, so as to adapt to the pin 203 design of different gate driver chips 200, so that the test motherboard 10 and even the test device 100 have universality, the convenience of testing can be improved, and the design of the gate driver chip 200 can be facilitated.

[0060] Combination Figure 1-Figure 4As shown, the custom pin adapter 12 may include a control side input pin adapter 121, the pin configuration seat 13 may include a control side input pin configuration seat 131, the control side input pin adapter 121 may include a plurality of control side input adapter needle seats 1211, the plurality of control side input adapter needle seats 1211 are suitable for being electrically connected to a plurality of control side input pins 2031 of the gate drive chip 200, the control side input pin configuration seat 131 may include a plurality of control side input pin needle seats 133 with different functions, at least one of the plurality of control side input pin needle seats 133 with different functions is selectively electrically connected to at least one of the plurality of control side input adapter needle seats 1211, so that the functions of the plurality of control side input pins 2031 of the gate drive chip 200 can be selectively defined.

[0061] Furthermore, combined with Figure 1-Figure 4 As shown, the test device 100 of the gate drive chip 200 may also include at least one first electrical connection line 40, one end of the first electrical connection line 40 is provided with a first jack 41, the first jack 41 is selectively plugged and electrically connected to at least one of a plurality of control side input pin sockets 133 with different functions, and the other end of the first electrical connection line 40 is provided with a second jack 42, the second jack 42 is selectively plugged and electrically connected to at least one of a plurality of control side input adapter sockets 1211.

[0062] In this way, it is only necessary to selectively plug and electrically connect one end of the first electrical connection line 40 with at least one of the control side input pin needle holders 133 with multiple different functions, and selectively plug and electrically connect the other end of the first electrical connection line 40 with at least one of the multiple control side input adapter needle holders 1211, so as to achieve the electrical connection between the control side input pin needle holder 133 and the control side input pin adapter 121, thereby facilitating the electrical connection between the control side input pin needle holder 133 and the control side input pin adapter 121, and facilitating the definition of the functions of the multiple control side input pins 2031 of the gate drive chip 200, thereby improving the convenience of testing and facilitating the design of the gate drive chip 200.

[0063] Combination Figure 1-Figure 4As shown, the custom pin adapter 12 may include a driving side output pin adapter 122, the pin configuration seat 13 may include a driving side output pin configuration seat 132, the driving side output pin adapter 122 may include a plurality of driving side output adapter needle seats 1221, and the plurality of driving side output adapter needle seats 1221 are suitable for being electrically connected to a plurality of driving side output pins 2032 of the gate driving chip 200, and the driving side output pin configuration seat 132 may include a plurality of driving side output pin needle seats 133 with different functions, and at least one of the plurality of driving side output pin needle seats 133 with different functions is selectively electrically connected to at least one of the plurality of driving side output adapter needle seats 1221, so that the functions of the plurality of driving side output pins 2032 of the gate driving chip 200 can be selectively defined.

[0064] Furthermore, combined with Figure 1-Figure 4 As shown, the test device 100 of the gate drive chip 200 may also include at least one second electrical connection line, one end of the second electrical connection line is provided with a third jack, the third jack is selectively plugged and electrically connected to at least one of a plurality of drive side output pin needle holders 133 with different functions, and the other end of the second electrical connection line is provided with a fourth jack, the fourth jack is selectively plugged and electrically connected to at least one of a plurality of drive side output adapter needle holders 1221.

[0065] In this way, it is only necessary to selectively plug and electrically connect one end of the second electrical connection line with at least one of the driving side output pin needle holders 133 with multiple different functions, and selectively plug and electrically connect the other end of the second electrical connection line with at least one of the multiple driving side output adapter needle holders 1221, so as to achieve the electrical connection between the driving side output pin needle holder 133 and the driving side output pin adapter 122, thereby facilitating the electrical connection between the driving side output pin needle holder 133 and the driving side output pin adapter 122, and facilitating the definition of the functions of the multiple driving side output pins 2032 of the gate driving chip 200, so that the test motherboard 10 and even the test device 100 have universality, improve the convenience of testing, and facilitate the design of the gate driving chip 200.

[0066] Combination Figure 1-Figure 4 As shown, the control-side input pin adapters 121 are arranged at intervals on one side of the two sockets 11 in the second direction, and the drive-side output pin adapters 122 are arranged at intervals on the other side of the two sockets 11 in the second direction.

[0067] Specifically, it can be understood that the custom pin adapter 12 needs to be electrically connected to the pin 203 of the gate drive chip 200 through the socket 11, the test sub-board 20 and the gate drive chip mounting socket 30 in sequence. Since the gate drive chip 200 is provided with a plurality of pins 203 spaced apart in the third direction on both sides of the second direction, by spaced apart the control side input pin adapter 121 on one side of the second direction of the two sockets 11, and spaced apart the drive side output pin adapter 122 on the other side of the second direction of the two sockets 11, it is convenient to transfer the control side input pin adapter 121 between the control side input pin configuration seat 131 and the control side input pin 2031 of the gate drive chip 200, and it is convenient to transfer the drive side output pin adapter 122 between the drive side output pin configuration seat 132 and the drive side output pin 2032, thereby optimizing the layout of the test motherboard 10 and improving the convenience and reliability of the test device 100.

[0068] Furthermore, combined with Figure 1-Figure 4 As shown, there are multiple control-side input pin adapters 121, which are spaced apart in the second direction and electrically connected to each other, so that the definition of more control-side input pins 2031 of the gate driving chip 200 can be met. Also, there are multiple drive-side output pin adapters 122, which are spaced apart in the second direction and electrically connected to each other, so that the definition of more drive-side output pins 2032 of the gate driving chip 200 can be met.

[0069] Combination Figure 1-Figure 4 As shown, a power supply pin socket 14 is provided on the test motherboard 10, and the power supply pin socket 14 may include a control side input power supply pin socket 141 and a drive side output power supply pin socket 142. Among them, the control side input power supply pin socket 141 is the positive terminal of the drive power supply, which is suitable for inputting power to the control side 201 of the gate drive chip 200, and the drive side output power supply pin socket 142 is the positive terminal of the working power supply of the gate drive chip 200, which is suitable for outputting power to the drive side 202 of the gate drive chip 200. In this way, through the setting of the control side input power supply pin socket 141 and the drive side output power supply pin socket 142, the test circuit can selectively connect the control side input power supply pin socket 141 and the drive side output power supply pin socket 142 to realize the power supply to the test circuit, ensure the normal operation of the test device 100, and ensure the normal progress of the test.

[0070] Furthermore, combined with Figure 1-Figure 4As shown, the control side input power supply needle seat 141 and the drive side output power supply needle seat 142 are arranged at intervals in the third direction, and the power supply needle seat 14 is arranged at intervals on the side of the control side input pin adapter 121 away from the drive side output pin adapter 122 in the second direction. In this way, the space on the side of the control side input pin adapter 121 away from the drive side output pin adapter 122 in the second direction can be fully utilized, so that the power supply needle seat 14 is located at the edge position of the second direction of the test motherboard 10, avoiding the control side input power supply needle seat 141 and the drive side output power supply needle seat 142 being located between the control side input pin adapter 121 and the drive side output pin adapter 122, resulting in the crossing and confusion of the electrical connection lines, so that the setting positions of the control side input power supply needle seat 141 and the drive side output power supply needle seat 142 can be further optimized, the layout of the test motherboard 10 can be optimized, and the reliability of the test device 100 can be improved.

[0071] Combination Figure 1-Figure 4 As shown, a load installation area 15 is provided on the test motherboard 10 , and the load installation area 15 is suitable for installing a load 300 . The load installation area 15 is selectively electrically connected to at least one of the control-side input pin adapter 121 and the drive-side output pin adapter 122 .

[0072] Specifically, in order to ensure the accuracy of the test and the safety of the test device 100 , a load 300 needs to be set when performing a performance test on the gate driving chip 200 .

[0073] Different from the prior art, in which the load is placed at the pin of the gate drive chip, the present application sets a load installation area 15 on the test motherboard 10, and the load installation area 15 is selectively electrically connected to at least one of the control side input pin adapter 121 and the drive side output pin adapter 122, so that an installation position can be reserved for the load 300. In this way, when the test device 100 is working, it is only necessary to set the load 300 in the load installation area 15, and then connect the load 300 to the pin 203 of the gate drive chip 200, which can avoid the redundancy of the pin 203 position of the gate drive chip 200, and make the structure of the test device 100 simpler and more reliable. Among them, the load 300 can be a capacitive load, a resistive load or an inductive load, and can be set in the load installation area 15 according to the actual situation.

[0074] In addition, when the signal needs to be pulled up or down, it can also be connected through the load installation area 15.

[0075] Furthermore, combined with Figure 1-Figure 4As shown, the load installation area 15 is arranged at intervals on one side of the third direction of the two sockets 11. Specifically, by arranging the load installation area 15 at intervals on one side of the third direction of the two sockets 11, not only can the space in the third direction of the two sockets 11 be fully utilized, the straight-line distance between the load installation area 15 and the gate drive chip 200 can be shortened, and the connection between the load installation area 15 and the pins 203 of the gate drive chip 200 is facilitated, but also the load installation area 15 can be prevented from being located between the custom pin adapter 12 and the pin configuration seat 13, and the crossing and confusion of the electrical connection lines can be avoided, so that the setting position of the load installation area 15 can be optimized, the layout of the test motherboard 10 can be optimized, and the reliability of the test device 100 can be improved.

[0076] Combination Figure 1-Figure 4 As shown, load external needle sockets 16 are provided on both sides of the third direction of the load installation area 15, and the load external needle sockets 16 on both sides of the second direction of the load installation area 15 are respectively suitable for electrically connecting to the positive and negative poles of the load, so that the positive and negative poles of the load can be respectively led out through the load external needle sockets 16 on both sides of the second direction of the load installation area 15, and the test circuit only needs to be electrically connected to the load external needle sockets 16 on both sides of the second direction of the load installation area 15 to connect the load to the test circuit. Under the premise of ensuring the accuracy and safety of the test, the circuit connection of the test device 100 can be made simpler and more reliable.

[0077] Optionally, the load external pin sockets 16 on both sides of the load installation area 15 in the second direction are selectively electrically connected to the control-side input pin adapter 121 at the same time.

[0078] Optionally, the load external pin sockets 16 on both sides of the load installation area 15 in the second direction are selectively electrically connected to the drive-side output pin adapter 122 at the same time.

[0079] In addition, at least one grounding pin holder 17 is also provided on the test motherboard 10, so as to facilitate the grounding of the signal.

[0080] In some embodiments of the present invention, the gate drive chip mounting seat 30 is fixed to the test sub-board 20 by welding. Specifically, the gate drive chip mounting seat 30 can be fixed to the test sub-board 20 by welding, so that no additional improvements are made to the gate drive chip mounting seat 30 and the test sub-board 20, and only an electric soldering iron and solder wire are needed to achieve the electrical connection between the gate drive chip mounting seat 30 and the test sub-board 20, which can not only improve the stability of the electrical connection between the gate drive chip mounting seat 30 and the test sub-board 20, but also make the gate drive chip mounting seat 30 and the test sub-board 20 simple in structure.

[0081] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0082] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0083] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A test device for a gate driver chip, characterized in that: include: A test motherboard (10), wherein a first plug-in electrical connection portion (111) is provided on the test motherboard (10), and the test motherboard (10) is suitable for testing a gate drive chip (200); A test sub-board (20), wherein a second plug-in electrical connection portion is provided on one side of the test sub-board (20) in a first direction, wherein one of the first plug-in electrical connection portion (111) and the second plug-in electrical connection portion is a plug-in hole, and the other is a plug-in pin, wherein the plug-in hole and the plug-in pin are detachably plug-connected and electrically connected; A gate drive chip mounting seat (30), the gate drive chip mounting seat (30) being arranged on the other side of the test sub-board (20) in the first direction and being electrically connected to the test sub-board (20), the gate drive chip mounting seat (30) being provided with a plug-in portion (31), the plug-in portion (31) being suitable for being detachably plugged and electrically connected to the gate drive chip (200).

2. The gate driver chip testing device according to claim 1, characterized in that: The first plug-in electrical connection part (111) is the plug-in hole, the second plug-in electrical connection part is the plug-in pin, the test motherboard (10) is provided with a plug socket (11), the plug socket (11) is provided with a plurality of the plug-in holes arranged at intervals, the test daughter board (20) is provided with a plurality of plug-in pins, and the plurality of the plug-in pins are plug-in-electrically connected with the plurality of the plug-in holes in a one-to-one correspondence.

3. The gate driver chip testing device according to claim 2, characterized in that: There are two plug sockets (11), and the two plug sockets (11) are arranged at intervals in the second direction.

4. The gate driver chip testing device according to claim 3, characterized in that: The test motherboard (10) is provided with a custom pin adapter (12) and a pin configuration seat (13); the custom pin adapter (12) comprises a plurality of adapter pin seats (123); the plurality of adapter pin seats (123) are suitable for being electrically connected to a plurality of pins (203) of a gate drive chip (200) in a one-to-one correspondence; the pin configuration seat (13) comprises a plurality of pin pin seats (133) with different functions; at least one of the plurality of pin pin seats (133) with different functions is selectively electrically connected to at least one of the plurality of adapter pin seats (123) to selectively define the functions of the plurality of pins (203) on the gate drive chip (200).

5. The gate driver chip testing device according to claim 4, characterized in that: The custom pin adapter (12) comprises a control side input pin adapter (121), the pin configuration seat (13) comprises a control side input pin configuration seat (131), the control side input pin adapter (121) comprises a plurality of control side input adapter needle seats (1211), the plurality of control side input adapter needle seats (1211) are suitable for being electrically connected to a plurality of control side input pins (203) of a gate drive chip (200), the control side input pin configuration seat (131) comprises a plurality of control side input pin needle seats (133) with different functions, at least one of the plurality of control side input pin needle seats (133) with different functions is selectively electrically connected to at least one of the plurality of control side input adapter needle seats (1211) to selectively define the functions of the plurality of control side input pins (2031) of the gate drive chip (200).

6. The gate driver chip testing device according to claim 5, characterized in that: The custom pin adapter (12) comprises a drive side output pin adapter (122), the pin configuration seat (13) comprises a drive side output pin configuration seat (132), the drive side output pin adapter (122) comprises a plurality of drive side output adapter needle seats (1221), the plurality of drive side output adapter needle seats (1221) are suitable for being electrically connected to a plurality of drive side output pins (203) of a gate drive chip (200), the drive side output pin configuration seat (132) comprises a plurality of drive side output pin needle seats (133) with different functions, at least one of the plurality of drive side output pin needle seats (133) with different functions is selectively electrically connected to at least one of the plurality of drive side output adapter needle seats (1221) to selectively define the functions of the plurality of drive side output pins (2032) of the gate drive chip (200).

7. The gate driver chip testing device according to claim 6, characterized in that: It also includes at least one first electrical connection line (40), one end of which is provided with a first jack (41), the first jack (41) being selectively plugged and electrically connected to at least one of the control-side input pin sockets (133) with multiple different functions, and the other end of which is provided with a second jack (42), the second jack (42) being selectively plugged and electrically connected to at least one of the multiple control-side input adapter sockets (1211); and / or The invention also comprises at least one second electrical connection line, one end of which is provided with a third plug hole, and the third plug hole is selectively plugged and electrically connected with at least one of the plurality of drive side output pin sockets (133) with different functions, and the other end of the second electrical connection line is provided with a fourth plug hole, and the fourth plug hole is selectively plugged and electrically connected with at least one of the plurality of drive side output adapter sockets (1221).

8. The gate driver chip testing device according to claim 6, characterized in that: The control side input pin adapter (121) is arranged at intervals on one side of the second direction of the two sockets (11), and the drive side output pin adapter (122) is arranged at intervals on the other side of the second direction of the two sockets (11).

9. The gate driver chip testing device according to claim 8, characterized in that: There are a plurality of control side input pin adapters (121), and the plurality of control side input pin adapters (121) are arranged at intervals in the second direction and are electrically connected to each other; There are a plurality of drive side output pin transfer seats (122), and the plurality of drive side output pin transfer seats (122) are arranged at intervals in the second direction and are electrically connected to each other.

10. The gate driver chip testing device according to claim 8, characterized in that: The test motherboard (10) is provided with a power supply pin socket (14), and the power supply pin socket (14) comprises a control side input power supply pin socket (141) and a drive side output power supply pin socket (142), the control side input power supply pin socket (141) is suitable for inputting power to the control side (201) of the gate drive chip (200), and the drive side output power supply pin socket (142) is suitable for outputting power to the drive side (202) of the gate drive chip (200).

11. The gate driver chip testing device according to claim 10, characterized in that: The control side input power supply needle seat (141) and the drive side output power supply needle seat (142) are arranged at intervals in the third direction, and the power supply needle seat (14) is arranged at intervals on a side of the control side input pin adapter (121) away from the drive side output pin adapter (122) in the second direction.

12. The gate driver chip testing device according to claim 8, characterized in that: The test motherboard (10) is provided with a load installation area (15), the load installation area (15) is suitable for installing a load (300), and the load installation area (15) is selectively electrically connected to at least one of the control side input pin adapter (121) and the drive side output pin adapter (122).

13. The gate driver chip testing device according to claim 12, characterized in that: The load installation area (15) is arranged at intervals on one side of the two sockets (11) in the third direction.

14. The gate driver chip testing device according to claim 13, characterized in that: Load external needle seats (16) are arranged on both sides of the load installation area (15) in the third direction, the load external needle seats (16) on both sides of the load installation area (15) in the second direction are respectively suitable for being electrically connected to the positive and negative poles of the load, and the load external needle seats (16) on both sides of the load installation area (15) in the second direction are selectively electrically connected to the control side input pin adapter (121) at the same time; and / or The load external pin seats (16) on both sides of the load installation area (15) in the second direction are selectively electrically connected to the drive side output pin transfer seat (122) at the same time.

15. The gate driver chip testing device according to claim 1, characterized in that: The gate drive chip mounting seat (30) is fixed to the test sub-board (20) by welding.

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