Intelligent contact detection method and device for memory bank

Abstract

The invention relates to the technical field of memory bank detection data processing, and particularly discloses an intelligent contact detection method and device for a memory bank, and the method comprises the steps: based on each extended metal pin installed at the two ends of a memory slot and each original metal pin on the surface of the memory slot, carrying out the insertion operation of the memory bank in the memory slot; according to the method, the elastic sheets of the original metal pins are converted from a normally-open state to a normally-closed state, the elastic sheets of the expanded metal pins are converted from a normally-closed state to a normally-open state, and meanwhile, due to the display result that the metal pins drive the LED lamps at the front ends of the memory slots, the actual insertion detection result of the memory bank is finally obtained. The method does not depend on the power-on operation of the computer system, greatly reduces the detection time, enables the detection result of the memory bank to be more comprehensive and effective, guarantees that the memory bank is reliably applied to the computer system, and guarantees the data transmission accuracy of the computer system.

Description

Technical Field

[0001] The present invention relates to the technical field of memory bar detection data processing, in particular to an intelligent contact detection method and device for a memory bar. Background Art

[0002] Memory is a key component in computer systems and will directly affect the data transmission function of the system. As the operation of computer systems becomes more and more complex, the demand for the stability and maintenance of memory sticks is also increasing. Therefore, new requirements are put forward for the contact detection of memory sticks. The current contact detection method is to perform multiple detection tests during the power-on process of the computer system, and eliminate memory sticks with poor contact in a high-probability form. However, this method not only increases the detection time, but also still complies with the small probability event of poor contact. There is still the possibility that a small number of intact memory sticks will be filtered out, and the contact detection of the memory stick cannot be guaranteed to be accurate.

[0003] For example, the invention patent with announcement number CN117539703B is a device and method for preventing reverse insertion of memory sticks. The device includes: a memory slot module, an MCU single-chip module, a host power-on control module, an alarm module, and an auxiliary power supply module; wherein the memory slot module, the host control module, and the alarm module are all connected to the MCU single-chip module; the memory slot module, the MCU single-chip module, the host power-on control module, and the alarm module are all connected to the auxiliary power supply module. When the device detects that the memory stick is reversely inserted or not installed in place, it can control the host not to start, and emits a beeping alarm sound through a buzzer to alert the operator, effectively avoiding damage to the memory stick.

[0004] For example, the invention patent with announcement number CN107066362B is a method for automatically handling faulty memory sticks. Each DIMM slot is provided with an LED indicator light. The negative pole of each LED indicator light is grounded, and the positive pole of each LED indicator light is connected to the CPLD. The system south bridge PCH is connected to the CPLD through GPIO. During the system startup process, the CPLD controls the indicator light status of the DIMM slot, performs in-situ detection of the memory, and initializes the memory stick. If problems such as a memory stick failure or an unsupported memory stick type are found, the software program will prohibit the faulty memory stick, indicate the corresponding faulty memory stick through the set indicator light, and the program will initialize the next memory stick until all memory sticks are initialized and the system is started. With this technical solution, the system will not shut down due to the presence of a faulty memory stick, and will not affect the normal use of the system. At the same time, the faulty memory stick will be identified through the indicator light.

[0005] In combination with the above technical solutions, it is found that the current technical solutions for contact detection of memory sticks mainly rely on the detection results of the computer system during the power-on process to determine whether the memory stick is intact or damaged. However, the applicable conditions of this detection method are limited, and the detection time is relatively long, which will make the detection results of the memory stick have a large degree of inaccuracy, affecting the reliability and accuracy of data transmission in the computer system. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a method and device for intelligent contact detection of a memory stick, which can effectively solve the problems involved in the above-mentioned background technology.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: The first aspect of the present invention provides an intelligent contact detection method for a memory stick, including based on the extended metal pins installed at both ends of the memory slot and the original metal pins originally on the surface of the memory slot, through the insertion operation of the memory stick in the memory slot, the shrapnel state conversion process of each original metal pin and the shrapnel state conversion process of each extended metal pin are obtained, and the shrapnel state conversion completion degree of each original metal pin and the shrapnel state conversion completion degree of each extended metal pin are analyzed respectively; according to the insertion operation of the memory stick in the memory slot, the display result of the LED light at the front end position of the memory slot is obtained, and the shrapnel state conversion completion degree of each original metal pin and the shrapnel state conversion completion degree of each extended metal pin are comprehensively considered, and finally the insertion detection result of the memory stick is obtained, and the insertion detection result of the memory stick is fed back.

[0008] As a further method, the completion degree of the spring state conversion of each original metal pin is analyzed in the following specific process: Based on the conversion of the shrapnel of each original metal pin from the normally open state to the normally closed state, the contact time of the shrapnel of each original metal pin during the insertion operation cycle is identified and obtained from the shrapnel state conversion process, and the ratio is processed with the time corresponding to the insertion operation cycle to obtain the contact time ratio of each original metal pin; the number of times the shrapnel of each original metal pin is ejected during the insertion operation cycle is identified and obtained, and the data is processed with the defined number of shrapnel ejections defined in the memory stick detection library to obtain the shrapnel operation impact value of each original metal pin; the contact time ratio of each original metal pin and the shrapnel operation impact value of each original metal pin are comprehensively analyzed to obtain the shrapnel state conversion completion degree of each original metal pin.

[0009] As a further method, the completion degree of the spring state conversion of each extended metal pin is analyzed in the following specific process: Based on the conversion of the shrapnel of each extended metal pin from the normally closed state to the normally open state, the pop-up time of the shrapnel of each extended metal pin during the insertion operation cycle is identified and obtained from the shrapnel state conversion process, and the ratio is processed with the time corresponding to the insertion operation cycle to obtain the pop-up time ratio of each extended metal pin; the pop-up time ratio of each extended metal pin is compared with the pop-up time definition ratio preset in the memory stick detection library to obtain the completion degree of the shrapnel state conversion of each extended metal pin.

[0010] As a further method, the insertion detection result of the memory stick is obtained, and the specific process is as follows: Based on the display result of the LED light at the front end of the memory slot, a first display result, a second display result, a third display result, and a fourth display result are obtained, and are matched in turn with the memory stick insertion impact values ​​corresponding to each display result preset in the memory stick detection library to obtain the first memory stick insertion impact value, the second memory stick insertion impact value, the third memory stick insertion impact value, and the fourth memory stick insertion impact value; the first memory stick insertion impact value is comprehensively processed with the shrapnel state conversion completion degree of each original metal pin and the shrapnel state conversion completion degree of each extended metal pin to obtain the first insertion detection result of the memory stick; the second memory stick insertion impact value, the third memory stick insertion impact value, and the fourth memory stick insertion impact value are comprehensively processed with the shrapnel state conversion completion degree of each original metal pin and the shrapnel state conversion completion degree of each extended metal pin to obtain the second insertion detection result of the memory stick.

[0011] As a further method, the specific processing conditions of the first display result, the second display result, the third display result, and the fourth display result are respectively: The processing conditions for the first display result are as follows:

[0012] Where L is the distance between the memory bars. The distance defined for the preset position interval in the memory bar detection library, H is the placement deviation height of the memory bar, Define the height for the placement deviation preset in the memory module detection library, is the tilt angle of the memory bar, Define the tilt angles preset in the memory bar detection library. represents the logical symbol AND; the first display result, i.e., the position interval distance of the memory bar is equal to the position interval defining distance, the placement deviation height of the memory bar is equal to the placement deviation defining height, and the inclination angle of the memory bar is equal to the inclination defining angle, indicates that the insertion state of the memory bar is in a normal insertion state; wherein the processing conditions of the second display result are as follows:

[0013] In the formula, is a non-negative real number; the second display result, that is, the position interval distance of the memory bar is not equal to the position interval definition distance, the placement deviation height of the memory bar is equal to the placement deviation definition height, and the inclination angle of the memory bar is equal to the inclination definition angle, indicating that the center position point of the upper elevation of the memory bar does not coincide with the center position point of the upper elevation of the memory slot; wherein the processing conditions of the third display result are as follows:

[0014] The third display result, i.e., the position spacing distance of the memory bar is equal to the position spacing definition distance, the placement deviation height of the memory bar is not equal to the placement deviation definition height, and the inclination angle of the memory bar is equal to the inclination definition angle, indicates that the horizontal height of the memory bar is not equal to the horizontal height of the memory slot; wherein the processing conditions of the fourth display result are as follows:

[0015] The fourth display result, i.e., the position spacing distance of the memory stick is equal to the position spacing definition distance, the placement deviation height of the memory stick is equal to the placement deviation definition height, and the inclination angle of the memory stick is not equal to the inclination definition angle, indicates that the center line of the upper end surface of the memory stick and the horizontal plane of the bottom plate of the memory slot do not overlap.

[0016] As a further method, the insertion detection result of the memory stick is fed back, and the specific feedback process is: The first insertion detection result of the memory stick and the second insertion detection result of the memory stick are compared with the preset first insertion detection definition result and second insertion detection definition result respectively. If the first insertion detection result of the memory stick is greater than or equal to the first insertion detection definition result, or the second insertion detection result of the memory stick is less than the second insertion detection definition result, the insertion detection result of the memory stick is fed back.

[0017] The second aspect of the present invention provides a device for an intelligent contact detection method for a memory stick, comprising: a memory slot, an extended metal pin, an original metal pin, a memory stick, an LED light, and a processor; the surface of the memory slot is connected to the extended metal pin and the original metal pin; the extended metal pin and the original metal pin are used to work together with the LED light to detect the insertion result of the memory stick; the processor is used to analyze the completion degree of the shrapnel state conversion of each original metal pin, the completion degree of the shrapnel state conversion of each extended metal pin, and the display result of the LED light, and finally feedback the insertion detection result of the memory stick.

[0018] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects: (1) The present invention provides a method and device for intelligent contact detection of a memory stick. First, the memory stick is inserted into the memory slot, and the display result of the LED light at the front end of the memory slot is integrated to finally obtain the actual insertion detection result of the memory stick. The method is independent of the power-on operation of the computer system, greatly reducing the detection time and facilitating the reduction of the deviation between the detection result and the actual result. Finally, the memory stick can be reliably applied to the computer system, ensuring the accurate data transmission of the computer system.

[0019] (2) The present invention is based on the extended metal pins installed at both ends of the memory slot and the original metal pins on the surface of the memory slot. Through the insertion operation of the memory stick in the memory slot, the springs of the original metal pins are converted from the normally open state to the normally closed state, and the springs of the extended metal pins are converted from the normally closed state to the normally open state. At the same time, due to the display result of the LED light driven by the metal pins at the front end of the memory slot, an accurate result of the insertion detection of the memory stick is finally obtained, so as to accurately judge whether the memory stick is intact and eliminate the memory stick with poor contact, thereby ensuring the stable transmission of data of the computer system.

[0020] (3) The present invention uses the insertion detection result of the memory stick to ultimately provide a multi-dimensional data basis for feeding back the insertion detection result of the memory stick, thereby making the contact detection of the memory stick more comprehensive and effective. Through an accurate contact detection scheme, it is beneficial to the comprehensive utilization of the memory stick. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0022] Figure 1 The figure is a schematic flow chart of the method steps of the present invention.

[0023] Figure 2 It is a schematic diagram of the metal pin involved in the present invention.

[0024] Figure 3 This is a schematic diagram of the state transition of the metal pin involved in the present invention.

[0025] Figure 4 This is a schematic diagram of the position spacing distance involved in the present invention.

[0026] Figure 5 It is a schematic diagram of the tilt angle involved in the present invention.

[0027] Figure markings: 1. Extended metal pin, 2. Original metal pin, 3. Center point of the upper vertical surface of the memory stick, 4. Center point of the upper vertical surface of the memory slot, 5. Center line of the upper end surface of the memory stick, 6. Horizontal plane of the bottom plate of the memory slot, 7. Tilt angle, 8. LED light. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] Reference Figure 1 As shown, the first aspect of the present invention provides an intelligent contact detection method for a memory stick, comprising: based on the extended metal pins installed at both ends of the memory slot and the original metal pins originally on the surface of the memory slot, through the insertion operation of the memory stick in the memory slot, the shrapnel state conversion process of each original metal pin and the shrapnel state conversion process of each extended metal pin are obtained, and the shrapnel state conversion completion degree of each original metal pin and the shrapnel state conversion completion degree of each extended metal pin are analyzed respectively.

[0030] In this example embodiment, the above-mentioned memory slot is a slot for placing a memory stick, and its main function is to store the memory capacity of the computer system. The design of the memory slot makes it easy to replace or upgrade the memory, and the user can replace different capacities and types according to needs to facilitate the utilization of the memory capacity. In this example, a single memory slot is analyzed without affecting the application of adjacent memory slots. That is, if there is a problem with the memory in a memory slot, other memory slots can still work normally, which can protect the computer system from the impact of single point failures to a large extent and ensure the long-term availability of the computer system.

[0031] like Figure 2 As shown, the extended metal pins 1 are placed at both ends of the memory slot, with a total of 4 extended metal pins, that is, there are 2 extended metal pins at each end; the original metal pins 2 refer to the metal pins originally existing in the memory slot, which are also placed at both ends of the memory slot, and there are 288 in this example; the LED light 8 is placed at the front end of the memory slot to display the detection results of the memory stick.

[0032] like Figure 3 As shown, it is a schematic diagram of the state transition of the metal pin. From the figure, it can be seen that the normally closed state of the spring of the metal pin refers to the state in which the springs in the metal pin are in contact, and the normally open state of the spring refers to the state in which the springs in the metal pin are open.

[0033] In this example embodiment, the operation of inserting the memory stick into the above-mentioned memory slot can cause the spring clip of the original metal pin to be converted from a normally open state to a normally closed state, and the spring clip of the extended metal pin to be converted from a normally closed state to a normally open state. The purpose of the state conversion is to provide a device basis for subsequent contact detection using LED lights.

[0034] Specifically, the completion degree of the spring state conversion of each original metal pin is analyzed in the following process: Based on the conversion of the shrapnel of each original metal pin from the normally open state to the normally closed state, the contact time of the shrapnel of each original metal pin during the insertion operation cycle is identified and obtained from the shrapnel state conversion process. This is because during the process of inserting the memory stick into the memory slot, the contact sensor senses the contact change corresponding to the shrapnel of the metal pin, and by measuring the contact change, the contact time length is obtained, which is the contact time length; wherein the insertion operation cycle is the time required for the memory stick to be inserted from the beginning to the complete insertion accurately recorded by the counter sensor, which is the insertion operation cycle.

[0035] The contact time ratio of each original metal pin is obtained by performing ratio processing with the time corresponding to the insertion operation cycle.

[0036] Identify and obtain the number of times the shrapnel pops open for each original metal pin during the insertion operation cycle. Since the shrapnel will vibrate when it impacts or collides, the vibration sensor can detect the vibration of the shrapnel, thereby obtaining the number of times the shrapnel pops open. Data processing is performed with the defined number of shrapnel pop-up times defined in the memory stick detection library to obtain the shrapnel operation impact value of each original metal pin.

[0037] The contact time ratio of each original metal pin and the impact value of the shrapnel operation of each original metal pin are comprehensively analyzed to obtain the shrapnel state conversion completion degree of each original metal pin. The specific analysis formula is as follows:

[0038] in,

[0039] In the formula, is the completion degree of the shrapnel state conversion of the ath original metal pin. In this embodiment, during the process of inserting the memory stick into the memory slot, the role of the original metal pin of the memory slot is that the shrapnel itself is converted from a non-contact state to a contact state. Therefore, by analyzing the contact time of the shrapnel and whether the shrapnel is ejected, and at the same time, this expression uses the continuity of data to accurately and stably obtain whether the normally closed state of the original metal pin of the memory slot is maintained accordingly, providing detailed data basis for subsequent judgment of the insertion status of the memory stick.

[0040] is the contact time ratio of the ath original metal pin, which refers to the ratio of the spring contact time of the original metal pin to the total insertion time during the memory slot insertion process.

[0041] It is the impact factor corresponding to the unit value of the contact time ratio preset in the memory stick detection library. The fitting curve corresponding to the contact time ratio is fitted through the correspondence between the historical contact time, the historical time corresponding to the insertion operation cycle, and the contact time ratio. The real-time contact time and the time corresponding to the insertion operation cycle are brought into the fitting curve corresponding to the contact time ratio to obtain the impact factor corresponding to the unit value of the contact time ratio in this example. At the same time, the value range in this example is [0, 1].

[0042] is the impact value of the spring operation of the ath original metal pin, which is obtained by comprehensive analysis of the number of spring bounces and the number of spring bounce limits.

[0043] The number of times the shrapnel is bounced is defined, which refers to the maximum number of times the shrapnel is bounced.

[0044] is the number of times the spring sheet of the ath original metal pin bounces off during the insertion operation cycle, which refers to the number of times the spring sheet of the original metal pin bounces off during the insertion process of the memory slot.

[0045] It is the correction factor corresponding to the number of times the shrapnel pops up preset in the memory stick detection library. The fitting curve corresponding to the number of times the shrapnel pops up is fitted through the correspondence between the historical pressure and operating temperature of the metal pin and the number of times the shrapnel pops up, and the real-time pressure and operating temperature are brought into the fitting curve corresponding to the number of times the shrapnel pops up to obtain the correction factor corresponding to the number of times the shrapnel pops up in this example. At the same time, the value range in this example is (0, 1).

[0046] exp is an exponential function with e as the base, a is the number of each original metal pin, , q is the total number of original metal pins.

[0047] The impact factor corresponding to the unit value of the contact time ratio is defined as 1, the correction factor corresponding to the number of spring-opening times is defined as 0.5, the number of spring-opening times is defined as 10 times, and the duration of the insertion operation cycle is defined as 10 seconds. Then, the change value of the completion degree of the spring state conversion is obtained through the change of the contact time ratio and the number of spring-opening times, as shown in Table 1: Table 1. Completion degree of shrapnel state conversion and corresponding parameter changes

[0048] It can be seen from Table 1 above that the larger the ratio of the contact time to the insertion operation cycle, that is, the closer the contact time is to the insertion operation cycle, the larger the value of the contact time ratio is. At the same time, if the number of times the shrapnel is ejected is close to the defined number of times the shrapnel is ejected, the smaller the value of the shrapnel state conversion completion of the original metal pin is, which is not conducive to the state conversion of the metal pin; conversely, the better the state conversion of the metal pin is, the more conducive it is to the subsequent insertion analysis of the memory stick.

[0049] Furthermore, the completion degree of the state conversion of the springs of each extended metal pin is analyzed in the following specific process: Based on the conversion of the shrapnel of each extended metal pin from the normally closed state to the normally open state, the pop-up time of the shrapnel of each extended metal pin during the insertion operation cycle is identified and obtained from the shrapnel state conversion process, and the displacement of the shrapnel relative to the memory slot is measured by a displacement sensor. When the shrapnel pops up, its displacement will have a jump. The displacement sensor can obtain the pop-up time by tracking this displacement change; and the ratio is processed with the time corresponding to the insertion operation cycle to obtain the proportion of the pop-up time of each extended metal pin.

[0050] The proportion of the pop-up time of each extended metal pin is analyzed with the preset pop-up time definition proportion in the memory stick detection library to obtain the completion degree of the shrapnel state conversion of each extended metal pin.

[0051] It should be explained that the specific data analysis process of the completion degree of the state conversion of the springs of the above-mentioned extended metal pins is as follows: The ratio of the pop-up time ratio of each extended metal pin is processed with the pop-up time definition ratio preset in the memory stick detection library to obtain the pop-up time ratio influence value of each extended metal pin, and then multiplied with the influence factor corresponding to the unit value of the pop-up time ratio influence value preset in the memory stick detection library to finally obtain the shrapnel state conversion completion degree of each extended metal pin.

[0052] In this embodiment, the influence factor corresponding to the unit value of the above-mentioned pop-up time proportion influence value can be fitted through the correspondence between the historical wear speed of the shrapnel, the historical vibration frequency of the shrapnel pop-up and the echo duration to obtain the fitting curve corresponding to the influence value of the pop-up time proportion, and the real-time shrapnel wear speed and shrapnel pop-up vibration frequency are brought into the fitting curve corresponding to the influence value of the pop-up time proportion to obtain the influence factor corresponding to the unit value of the influence value of the pop-up time proportion in this example. At the same time, the value range in this example is (0, 1).

[0053] According to the insertion operation of the memory stick in the memory slot, the display result of the LED light at the front end of the memory slot is obtained, and the completion degree of the shrapnel state conversion of each original metal pin and the completion degree of the shrapnel state conversion of each extended metal pin are comprehensively considered to finally obtain the insertion detection result of the memory stick and feed back the insertion detection result of the memory stick.

[0054] In a specific embodiment, the present invention is based on the extended metal pins installed at both ends of the memory slot and the original metal pins originally on the surface of the memory slot, and through the insertion operation of the memory stick in the memory slot, the springs of the original metal pins are converted from the normally open state to the normally closed state, and the springs of the extended metal pins are converted from the normally closed state to the normally open state. At the same time, due to the display result of the LED light driven by the metal pins at the front end of the memory slot, an accurate result of the insertion detection of the memory stick is finally obtained, so as to accurately judge whether the memory stick is intact, and eliminate the memory stick with poor contact, to ensure stable data transmission of the computer system.

[0055] In the present example embodiment, after the memory stick is inserted into the memory slot, a large amount of detection time can be saved because the insertion problem of the memory stick is discovered before the computer system is powered on. Otherwise, once the power is turned on for testing, the cycle is hours or even days, and the test result of the memory stick cannot be known until the test is completed; therefore, the metal pins are extended to push open the pin springs, and the separation of the springs will drive the LED light to make the LED light work. The function of the LED light is to determine the insertion status of the memory stick through the display result of the LED light; at the same time, the springs of the original metal pins remain in a normally closed state, which will enable the original metal pins to detect whether the memory stick has completed the insertion operation, that is, if the memory stick has completed the insertion operation, the springs of these metal pins will close, and at the same time, they can play a buffering role when the memory stick is inserted to prevent damage caused by improper insertion force.

[0056] Specifically, the display result of the LED light at the front end of the memory slot is obtained, and the specific data acquisition process is as follows: By inserting the memory stick into the memory slot, the spacing distance between the center position point of the upper surface of the memory stick and the center position point of the upper surface of the memory slot is located and extracted, which is recorded as the position spacing distance L of the memory stick.

[0057] It should be explained that the center point of the upper surface of the memory bar and the center point of the upper surface of the memory slot are as follows: Figure 4 As shown, by designing the edge contour line in the memory slot, the upper vertical center position point 3 of the memory stick and the upper vertical center position point 4 of the memory slot are located, and the straight-line distance between the upper vertical center position point of the memory stick and the upper vertical center position point of the memory slot is measured by a measuring tool such as a ruler, which is the position interval distance of the memory stick.

[0058] The horizontal height of the memory bar and the horizontal height of the memory slot are obtained, and difference processing is performed to obtain the placement deviation height H of the memory bar.

[0059] It should be explained that the horizontal height of the above-mentioned memory stick and the horizontal height of the memory slot are usually relative to the bottom plane of the computer case. During the design and manufacturing stage, the height of the memory slot is accurately calculated and fixed by the manufacturer. When the memory stick is inserted into the memory slot, the height relative to the bottom plane of the computer case can be accurately measured by a vernier caliper.

[0060] Get the minimum angle between the center line of the upper end surface of the memory bar and the horizontal plane of the bottom plate of the memory slot, which is recorded as the tilt angle of the memory bar .

[0061] It should be explained that the minimum angle between the center line of the upper end surface of the memory bar and the horizontal plane of the bottom plate of the memory slot is, Figure 5 As shown, by designing the edge contour line in the memory slot, the center line 5 of the upper end surface of the memory bar and the horizontal plane 6 of the bottom plate of the memory slot are located, and based on the measurement of the laser level, the minimum angle value between the center line of the upper end surface of the memory bar and the horizontal plane of the bottom plate of the memory slot is obtained, which is the inclination angle 7 of the memory bar.

[0062] Extract the position interval definition distance from the memory bar detection library , Placement deviation defines height And the tilt angle In this example, the value of the position interval defining the distance is set to 0, the value of the placement deviation defining the height is set to 0, and the value of the tilt defining the angle is set to 0.

[0063] In this example, the display result of the LED light at the front end of the memory slot is as follows: Based on the spacing distance L of the memory bars, the placement deviation height H of the memory bars, and the tilt angle of the memory bars , and the display result of the LED light is obtained by processing, and the display result of the LED light is recorded as ,in ; In the formula, To display the results first, For the second display result, For the third display result, Display results for the fourth.

[0064] In this example, the display results of the LED light are divided into three situations: bright yellow, dim yellow, and off. That is, the four display results correspond to three color display states: 1) The memory stick is not inserted into the memory slot. For example, it is placed between two memory slots, or lightly placed in the memory slot without pressing down. The LED light is off. 2) The memory stick is inserted into the memory slot, but it is not pressed flat. One side is higher than the other side. The LED light is dark yellow. 3) The memory stick is inserted into the slot normally. The LED light is bright yellow.

[0065] Furthermore, the specific processing conditions of the first display result, the second display result, the third display result, and the fourth display result are respectively: The processing conditions for the first display result are as follows:

[0066] Where L is the distance between the memory bars. The distance defined for the preset position interval in the memory bar detection library, H is the placement deviation height of the memory bar, Define the height for the placement deviation preset in the memory module detection library, is the tilt angle of the memory bar, Define the tilt angles preset in the memory bar detection library. Represents the logical symbol AND.

[0067] The first display result, i.e., the position spacing distance of the memory stick is equal to the position spacing definition distance, the placement deviation height of the memory stick is equal to the placement deviation definition height, and the inclination angle of the memory stick is equal to the inclination definition angle, indicates that the insertion status of the memory stick is in a normal insertion status.

[0068] In this example, through the first display result, it can be known that the memory stick is normally inserted into the memory slot, that is, the corresponding LED light shows bright yellow.

[0069] The processing conditions for the second display result are as follows:

[0070] In the formula, is a non-negative real number.

[0071] The second display result, i.e., the position spacing distance of the memory stick is not equal to the position spacing definition distance, the placement deviation height of the memory stick is equal to the placement deviation definition height, and the inclination angle of the memory stick is equal to the inclination definition angle, indicates that the center position point of the upper vertical surface of the memory stick does not coincide with the center position point of the upper vertical surface of the memory slot.

[0072] In this example, through the second display result, it can be known that the center point of the upper surface of the memory stick is not at the same position as the center point of the upper surface of the memory slot, and it is not inserted in the memory slot, and may be placed between the two memory slots, so the LED light is off.

[0073] The processing conditions for the third display result are as follows:

[0074] The third display result, i.e., the position spacing distance of the memory stick is equal to the position spacing definition distance, the placement deviation height of the memory stick is not equal to the placement deviation definition height, and the inclination angle of the memory stick is equal to the inclination definition angle, indicates that the horizontal height of the memory stick is not equal to the horizontal height of the memory slot.

[0075] In this example, through the third display result, it can be known that the memory stick is not inserted into the memory slot. It may be placed lightly in the memory slot but not pressed down, and the LED light shows the state of off.

[0076] The processing conditions for the fourth display result are as follows:

[0077] The fourth display result, i.e., the position spacing distance of the memory stick is equal to the position spacing definition distance, the placement deviation height of the memory stick is equal to the placement deviation definition height, and the inclination angle of the memory stick is not equal to the inclination definition angle, indicates that the center line of the upper end surface of the memory stick and the horizontal plane of the bottom plate of the memory slot do not overlap.

[0078] In this example, through the fourth display result, it can be known that the memory stick is inserted into the memory slot, but the level is not flattened, one side is higher than the other side, corresponding to the above-mentioned LED light showing dark yellow.

[0079] The distance L between the memory bars, the height H of the memory bar and the tilt angle of the memory bar are used to determine the distance between the memory bars. The display result of the LED light can be obtained by changing the value of the LED light, and a table can be used to express it intuitively, as shown in Table 2: Table 2. LED light display results and corresponding parameter changes

[0080] It can be intuitively found from Table 2 that the memory stick can be inserted into the memory slot intact only when the position spacing distance, placement deviation height and tilt angle are all 0, that is, there is no spacing and no height difference between the memory stick and the memory slot, and the placement of the memory stick is not tilted.

[0081] Specifically, the process of obtaining the insertion detection result of the memory stick is as follows: Based on the display result of the LED light at the front end of the memory slot, the first display result, the second display result, the third display result, and the fourth display result are obtained, and are matched with the memory bar insertion impact values ​​corresponding to the preset display results in the memory bar detection library in turn to obtain the memory bar insertion first impact value 、Memory stick inserted into the second impact value 、Memory stick inserted into the third impact value 、Memory stick inserted into the fourth impact value .

[0082] It should be explained that the matching process of the memory bank insertion impact values ​​corresponding to the above display results is as follows: The display results of the above-mentioned memory stick correspond to four situations, and the various display results of the memory stick correspond to different degrees of influence. Therefore, the four display results of the memory stick correspond to four influence intervals. In this embodiment, the main analysis is whether the memory stick is inserted into the memory slot intact. Therefore, four influence values ​​need to be matched as the data basis for the subsequent memory stick insertion results, that is, the four display results of the memory stick are matched to four memory stick insertion influence values ​​respectively; the purpose of the above-mentioned matching to obtain the memory stick insertion influence value is to be able to perform data processing with the completion degree of the spring state conversion of the metal pin in the subsequent process, and to make the final memory stick insertion result obtained by the processing more accurate.

[0083] Insert the memory stick into the first impact value The first insertion detection result of the memory stick is obtained by comprehensive processing with the completion degree of the shrapnel state conversion of each original metal pin and the completion degree of the shrapnel state conversion of each extended metal pin, and marked as .

[0084] Insert the memory stick into the second impact value 、Memory stick inserted into the third impact value 、Memory stick inserted into the fourth impact value , and the completion degree of the shrapnel state conversion of each original metal pin and the completion degree of the shrapnel state conversion of each extended metal pin are comprehensively processed to obtain the second insertion detection result of the memory bar, which is marked as .

[0085] In this example, the insertion test results of the above memory modules are , Memory module insertion test results , the specific process is as follows:

[0086]

[0087] In the formula, Insert the first impact value for the memory stick, Insert the second impact value for the memory stick, Insert the third impact value for the memory stick, Insert the fourth impact value for the memory stick.

[0088] An influence factor of a unit value of the first influence value of the memory stick inserted is preset in the memory stick detection library. A fitting curve corresponding to the first influence value of the memory stick insertion is obtained by fitting through the correspondence between the historical insertion force of the memory stick and the first influence value of the memory stick insertion. The real-time insertion force is brought into the fitting curve corresponding to the first influence value of the memory stick insertion to obtain the influence factor of the unit value of the first influence value of the memory stick insertion in this example. Meanwhile, the value range in this example is (0, 1).

[0089] It is the influencing factor of the unit value of the shrapnel state conversion completion degree of the metal pin preset in the memory stick detection library. The fitting curve corresponding to the shrapnel state conversion completion degree is fitted through the correspondence between the historical pop-up time of the metal pin and the shrapnel state conversion completion degree, and the real-time pop-up time is brought into the fitting curve corresponding to the shrapnel state conversion completion degree to obtain the influencing factor of the unit value of the shrapnel state conversion completion degree of the metal pin in this example. Meanwhile, the value range in this example is (0, 1).

[0090] The influence factor of the unit value of the memory stick insertion influence value preset in the memory stick detection library is obtained by fitting the fitting curve corresponding to the memory stick insertion influence value through the correspondence between the historical insertion angle of the memory stick and the memory stick insertion influence value, and the real-time insertion angle is brought into the fitting curve corresponding to the memory stick insertion influence value to obtain the influence factor of the unit value of the memory stick insertion influence value in this example. Meanwhile, the value range in this example is (0, 1).

[0091] is the completion degree of the state conversion of the spring of the b-th extended metal pin, which is obtained by comprehensively analyzing the proportion of the spring-opening time of each extended metal pin and the proportion of the spring-opening time definition.

[0092] b is the number of each extended metal pin, , n is the total number of extended metal pins.

[0093] is the completion degree of the shrapnel state conversion of the ath original metal pin, which is obtained by comprehensively analyzing the contact time proportion of each original metal pin and the shrapnel operation influence value of each original metal pin.

[0094] a is the number of each original metal pin, , q is the total number of original metal pins.

[0095] Furthermore, the insertion detection result of the memory stick is fed back, and the specific feedback process is as follows: The first insertion detection result of the memory stick and the second insertion detection result of the memory stick are compared with the preset first insertion detection definition result and second insertion detection definition result respectively. If the first insertion detection result of the memory stick is greater than or equal to the first insertion detection definition result, or the second insertion detection result of the memory stick is less than the second insertion detection definition result, the insertion detection result of the memory stick is fed back.

[0096] It should be explained that the above-mentioned first insertion detection definition result and second insertion detection definition result are preset in the memory stick detection library. Specifically, the first insertion detection definition result and the second insertion detection definition result are obtained by statistical methods based on the historical insertion results of the memory stick and the expert opinion report.

[0097] It further needs to be explained that the above-mentioned feedback of the insertion detection result of the memory stick is specifically because the insertion detection result of the memory stick is either normal or abnormal. Therefore, if the first insertion detection result of the memory stick is the value corresponding to the normal result, then the first insertion detection boundary result represents the minimum value corresponding to the normal result. Therefore, the first insertion detection result of the memory stick is greater than or equal to the first insertion detection boundary result, indicating that the insertion detection result of the memory stick is correct and feedback can be performed. Similarly, if the second insertion detection result of the memory stick is the value corresponding to the abnormal result, then the second insertion detection boundary result represents the maximum value corresponding to the abnormal result. Therefore, the second insertion detection result of the memory stick is less than the second insertion detection boundary result, indicating that the insertion detection result of the memory stick is correct and feedback can be performed.

[0098] It should be explained that if the first insertion test result of the memory stick is less than the first insertion test definition result, or the second insertion test result of the memory stick is greater than or equal to the second insertion test definition result, it indicates that the insertion result of the memory stick is an incorrect result and it is necessary to re-insertion test. At the same time, the failure lessons of the test results should be summarized to provide data experience for subsequent tests.

[0099] In a specific embodiment, the present invention uses the insertion detection results of the memory stick to ultimately provide a multi-dimensional data basis for feeding back the insertion detection results of the memory stick, thereby making the contact detection of the memory stick more comprehensive and effective. Through an accurate contact detection scheme, it is beneficial to the comprehensive utilization of the memory stick.

[0100] It should be explained that the insertion status of the memory stick can also be detected by another detection method of the embodiment, that is, a contact test operation is performed on the memory stick by a contact test system of the memory stick to obtain a contact test result of the memory stick.

[0101] In another embodiment, the contact testing system is a system for acquiring the detection process data of the memory stick in real time.

[0102] Specifically, according to the contact test system of the memory stick, the contact test equipment in the contact test system is extracted, and the contact test operation is performed on the memory stick to obtain the test pressure data of the contact test equipment on the memory stick and the memory slot during the contact test cycle.

[0103] It should be explained that the above-mentioned contact detection device in another embodiment is specifically KT-5SLT (KT-5SLT memory diagnostic card), which is a memory test card whose main function is to check and verify the working status and performance of the memory stick installed in the memory slot of the computer motherboard; the contact test cycle refers to the process of the contact test device testing the memory stick, and the time from the start of the test to the completion of the test by the contact test device is measured by a meter.

[0104] The test pressure data of the memory stick and the memory slot during the contact test cycle specifically include the withstand pressure value of the memory stick at each contact test time point and the contact pressure value of the memory slot at each contact test time point, wherein each contact test time point is obtained by evenly dividing the contact test cycle; the withstand pressure value and the contact pressure value are obtained by means of a pressure sensor.

[0105] The pressure value of the memory stick at each contact test time point is subtracted from the contact pressure value of the memory slot at each contact test time point to obtain the pressure test difference of the contact test device at each contact test time point, and the pressure test differences are sorted in order from large to small to select the pressure test difference ranked first, which is recorded as the maximum pressure test difference of the contact test device during the contact test cycle.

[0106] The maximum pressure test difference of the contact test device within the contact test cycle is processed with the pressure test allowable difference preset in the memory stick detection library to obtain the test pressure impact value of the contact test device.

[0107] It should be explained that the test pressure influence value of the above contact test equipment is specifically processed as follows: The maximum pressure test difference of the contact test device during the contact test cycle is ratioed with the allowable pressure test difference preset in the memory stick detection library to obtain the pressure test difference ratio of the contact test device during the contact test cycle, and multiply it with the influence factor of the unit value of the pressure test difference ratio preset in the memory stick detection library to finally obtain the test pressure impact value of the contact test device.

[0108] The influencing factor of the unit value of the pressure test difference ratio preset in the above-mentioned memory stick detection library is fitted to obtain a fitting curve corresponding to the pressure test difference ratio through the correspondence between the historical pressure of the memory stick, the historical contact pressure of the memory slot and the pressure test difference ratio, and the real-time memory stick pressure and memory slot contact pressure are brought into the fitting curve corresponding to the pressure test difference ratio to obtain the influencing factor of the unit value of the pressure test difference ratio in another embodiment. At the same time, the value range in another embodiment is (0, 1).

[0109] Furthermore, the maximum test pressure impact threshold of the metal pin is evaluated, and the specific evaluation process is as follows: The test pressure impact threshold corresponding to each shrapnel state conversion completion interval is extracted from the memory stick detection library, and the test pressure impact threshold of each original metal pin is matched according to the shrapnel state conversion completion of each original metal pin. The specific matching process is as follows: The above-mentioned spring state conversion completion intervals are divided into three intervals, which correspond to three test pressure impact thresholds; the first spring state conversion completion interval, the value range is [0, 10], corresponding to the first test pressure impact threshold; the second spring state conversion completion interval, the value range is (10, 100), corresponding to the second test pressure impact threshold; the remaining values ​​are all the third spring state conversion completion interval, corresponding to the third test pressure impact threshold; through the numerical changes in Table 1 above, if the spring state conversion completion of the original metal pin is 148.91, it belongs to the third spring state conversion completion interval, and then the third test pressure impact threshold is matched.

[0110] The test pressure impact threshold values ​​are sorted in descending order, and the first-ranked test pressure impact threshold value is selected and recorded as the maximum test pressure impact threshold value of the metal pin.

[0111] Specifically, the contact test result of the memory module is obtained by: Obtain the contact test result of the memory bar in the contact test device, and compare the test pressure impact value of the contact test device and the maximum test pressure impact threshold of the metal pin. If the test pressure impact value of the contact test device is less than or equal to the maximum test pressure impact threshold of the metal pin, the contact test result of the memory bar is recorded as If the test pressure impact value of the contact test equipment is greater than the maximum test pressure impact threshold of the metal pin, the contact test result of the memory stick is recorded as .

[0112] It should be explained that the above-mentioned obtaining of the contact test result of the memory stick in the contact test device is that the contact test device transmits the contact test result of the memory stick to the contact test system via a wireless network, thereby directly obtaining the contact test result of the memory stick via the contact test system.

[0113] Compare the memory stick contact test results with the memory stick insertion test results. , then the memory module insertion detection status is normal. , then the memory module insertion detection status is abnormal. If or , the memory stick insertion result obtained by the contact test system may cause an erroneous insertion result due to the power-on influence of the computer system.

[0114] To sum up, since another embodiment performs memory stick insertion detection through a contact test system, during this process, due to various influencing factors of the computer system, such as the response time of the computer system, the aging degree of other performance devices, etc., the insertion result of the memory stick may not be accurate. At the same time, the increase in detection time will greatly affect the detection efficiency of the memory stick. Therefore, the innovation of this embodiment is to detect the insertion result of the memory stick before the computer system is powered on, which will not only shorten the detection time of the memory stick, but also will not reduce the detection accuracy of the memory stick due to various external factors, further improving the insertion detection efficiency of the memory stick, and ultimately helping to improve the data transmission function of the computer system.

[0115] The second aspect of the present invention provides a device for an intelligent contact detection method for a memory stick, comprising a memory slot, an extended metal pin, an original metal pin, a memory stick, an LED lamp, a contact testing system, and a processor; the surface of the memory slot is connected to the extended metal pin and the original metal pin; the extended metal pin drives the LED lamp at the front end of the memory slot; the extended metal pin is converted from a normally closed state to a normally open state, and acts together with the LED lamp on the insertion detection result of the memory stick; the original metal pin is converted from a normally open state to a normally closed state, and acts together with the contact testing system on the contact test result of the memory stick; the processor is used to analyze the completion degree of the shrapnel state conversion of each original metal pin and the completion degree of the shrapnel state conversion of each extended metal pin, to provide feedback on the contact detection state of the memory stick, and to feed back the feedback result to the contact testing system via a wireless network.

[0116] In a specific embodiment, the present invention provides a method and device for intelligent contact detection of a memory stick. First, the memory stick is inserted into the memory slot, and the display result of the LED light at the front end of the memory slot is integrated to finally obtain the actual insertion detection result of the memory stick. This method is independent of the power-on operation of the computer system, greatly reduces the detection time, and is beneficial to reducing the deviation between the detection result and the actual result. Ultimately, the memory stick can be reliably used in the computer system to ensure accurate data transmission of the computer system.

[0117] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A method for detecting intelligent contact of a memory stick, characterized in that: include: Based on the extended metal pins installed at both ends of the memory slot and the original metal pins on the surface of the memory slot, the state conversion process of the shrapnel of each original metal pin and the state conversion process of each extended metal pin are obtained through the insertion operation of the memory stick in the memory slot, and the completion degree of the shrapnel state conversion of each original metal pin and the completion degree of the shrapnel state conversion of each extended metal pin are analyzed respectively; According to the insertion operation of the memory stick in the memory slot, the display result of the LED light at the front end of the memory slot is obtained, and the completion degree of the shrapnel state conversion of each original metal pin and the completion degree of the shrapnel state conversion of each extended metal pin are comprehensively considered to finally obtain the insertion detection result of the memory stick and feed back the insertion detection result of the memory stick.

2. The method for detecting the intelligent contact of a memory stick according to claim 1, characterized in that: The shrapnel state conversion process of each original metal pin and the shrapnel state conversion process of each extended metal pin are specifically that the shrapnel of each original metal pin is converted from a normally open state to a normally closed state, and the shrapnel of each extended metal pin is converted from a normally closed state to a normally open state.

3. The method for detecting intelligent contact of a memory stick according to claim 1, characterized in that: The specific analysis process of the completion degree of the spring state conversion of each original metal pin is as follows: Based on the conversion of the spring pieces of each original metal pin from the normally open state to the normally closed state, the contact time of the spring pieces of each original metal pin in the insertion operation cycle is identified and obtained from the spring piece state conversion process, and the ratio is processed with the time corresponding to the insertion operation cycle to obtain the contact time ratio of each original metal pin; Identify and obtain the number of times that the springs of each original metal pin are ejected during the insertion operation cycle, and perform data processing with the number of springs defined in the memory stick detection library to obtain the spring operation impact value of each original metal pin; The contact time ratio of each original metal pin and the shrapnel operation influence value of each original metal pin are comprehensively analyzed to obtain the shrapnel state conversion completion degree of each original metal pin.

4. The method for detecting intelligent contact of a memory stick according to claim 1, characterized in that: The specific analysis process of the completion degree of the spring state conversion of each extended metal pin is as follows: Based on the conversion of the springs of each extended metal pin from the normally closed state to the normally open state, the spring-opening time of each extended metal pin in the insertion operation cycle is identified and obtained from the spring state conversion process, and the ratio is processed with the time corresponding to the insertion operation cycle to obtain the proportion of the spring-opening time of each extended metal pin; The proportion of the pop-up time of each extended metal pin is analyzed with the preset pop-up time definition proportion in the memory stick detection library to obtain the completion degree of the shrapnel state conversion of each extended metal pin.

5. The method for detecting intelligent contact of a memory stick according to claim 1, characterized in that: The specific data acquisition process of obtaining the display result of the LED light at the front end of the memory slot is as follows: By inserting the memory stick into the memory slot, the distance between the center position point of the upper surface of the memory stick and the center position point of the upper surface of the memory slot is located and extracted, and recorded as the position distance of the memory stick; Obtain the horizontal height of the memory bar and the horizontal height of the memory slot, and perform difference processing to obtain the placement deviation height of the memory bar; The minimum angle between the center line of the upper end surface of the memory bar and the horizontal plane of the bottom plate of the memory slot is obtained, and recorded as the inclination angle of the memory bar.

6. The method for detecting intelligent contact of a memory stick according to claim 5, characterized in that: The display result of the LED light at the front end of the memory slot is as follows: Based on the position spacing distance of the memory bar, the placement deviation height of the memory bar and the tilt angle of the memory bar, the display result of the LED light is obtained by processing, and the display result of the LED light is recorded as ,in ; In the formula, To display the results first, For the second display result, For the third display result, Display results for the fourth.

7. The method for detecting intelligent contact of a memory stick according to claim 1, characterized in that: The specific process of obtaining the insertion detection result of the memory stick is as follows: Based on the display result of the LED light at the front end of the memory slot, a first display result, a second display result, a third display result, and a fourth display result are obtained, and are matched in sequence with the memory bar insertion impact values ​​corresponding to the respective display results preset in the memory bar detection library to obtain a first memory bar insertion impact value, a second memory bar insertion impact value, a third memory bar insertion impact value, and a fourth memory bar insertion impact value; Comprehensively processing the first impact value of the memory bar insertion, the completion degree of the spring state conversion of each original metal pin, and the completion degree of the spring state conversion of each extended metal pin to obtain a first insertion detection result of the memory bar; The memory stick is inserted into the second impact value, the memory stick is inserted into the third impact value, and the memory stick is inserted into the fourth impact value, and the shrapnel state conversion completion degree of each original metal pin and the shrapnel state conversion completion degree of each extended metal pin are comprehensively processed to obtain the second insertion detection result of the memory stick.

8. The method for intelligent contact detection of a memory stick according to claim 7, characterized in that: The specific processing conditions of the first display result, the second display result, the third display result, and the fourth display result are: The processing conditions for the first display result are as follows: Where L is the distance between the memory bars. The distance defined for the preset position interval in the memory bar detection library, H is the placement deviation height of the memory bar, Define the height for the placement deviation preset in the memory module detection library, is the tilt angle of the memory bar, Define the tilt angles preset in the memory bar detection library. Represents the logical symbol and; The first display result, i.e., the position spacing distance of the memory stick is equal to the position spacing definition distance, the placement deviation height of the memory stick is equal to the placement deviation definition height, and the inclination angle of the memory stick is equal to the inclination definition angle, indicates that the insertion state of the memory stick is in a normal insertion state; The processing conditions for the second display result are as follows: In the formula, is a non-negative real number; The second display result, i.e., the position interval distance of the memory bar is not equal to the position interval definition distance, the placement deviation height of the memory bar is equal to the placement deviation definition height, and the inclination angle of the memory bar is equal to the inclination definition angle, indicates that the center position point of the upper elevation of the memory bar does not coincide with the center position point of the upper elevation of the memory slot; The processing conditions for the third display result are as follows: The third display result, i.e., the position interval distance of the memory bar is equal to the position interval definition distance, the placement deviation height of the memory bar is not equal to the placement deviation definition height, and the inclination angle of the memory bar is equal to the inclination definition angle, indicates that the horizontal height of the memory bar is not equal to the horizontal height of the memory slot; The processing conditions for the fourth display result are as follows: The fourth display result, i.e., the position spacing distance of the memory stick is equal to the position spacing definition distance, the placement deviation height of the memory stick is equal to the placement deviation definition height, and the inclination angle of the memory stick is not equal to the inclination definition angle, indicates that the center line of the upper end surface of the memory stick and the horizontal plane of the bottom plate of the memory slot do not overlap.

9. The method for intelligent contact detection of a memory stick according to claim 1, characterized in that: The specific feedback process of the memory module insertion detection result is as follows: The first insertion detection result of the memory stick and the second insertion detection result of the memory stick are compared with the preset first insertion detection definition result and second insertion detection definition result respectively. If the first insertion detection result of the memory stick is greater than or equal to the first insertion detection definition result, or the second insertion detection result of the memory stick is less than the second insertion detection definition result, the insertion detection result of the memory stick is fed back.

10. A device using the intelligent contact detection method of a memory stick according to any one of claims 1 to 9, characterized in that: include: Memory slot, extended metal pins, original metal pins, memory stick, LED light, processor; The surface of the memory slot is connected to the extended metal pins and the original metal pins; The extended metal pins and the original metal pins are used to work together with the LED light to detect the insertion result of the memory stick; The processor is used to analyze the completion degree of the shrapnel state conversion of each original metal pin, the completion degree of the shrapnel state conversion of each extended metal pin, and the display result of the LED light, and finally feed back the insertion detection result of the memory stick.

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