Forced air cooling fin structure design method and device, radiator and equipment

Abstract

In order to solve the problem that in the prior art, a traditional rectangular fin structure in a forced air cooling heat dissipation system is low in performance due to low heat dissipation efficiency and redundant structure quality, the invention provides a forced air cooling fin structure design method and device, a radiator and equipment. The method comprises the following steps: designing matched basic parameters of the fin radiator; the positions of the fins are determined, fin base lines representing the distribution shapes of the fins are generated on the surface plane of the base plate, and contraction-expansion channels are formed between the adjacent fin base lines; all the fin base lines are expanded on the surface plane of the base plate to form fin base line bands, and the fin base line bands are cut off at intervals; and the fin array is pulled up and expanded in the direction perpendicular to the surface plane of the substrate to form a fin array in a three-dimensional space. By means of the method, the high-performance requirements of the fin radiator for light weight and improvement of the heat dissipation efficiency are met.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, in particular to the field of fin heat sinks, and specifically to a forced air-cooling fin structure design method, device, heat sink and equipment. Background Art

[0002] With the vigorous development of my country's aerospace industry, electronic equipment systems are developing towards high integration and high power, which puts higher requirements on the heat dissipation capacity and lightweight design of equipment cooling systems. Therefore, in order to further meet the index requirements of electronic equipment in terms of weight, heat dissipation performance and good temperature uniformity, the optimization design of heat dissipation structure faces a series of severe challenges.

[0003] Forced air cooling has become one of the most commonly used heat dissipation methods for electronic equipment due to its advantages of simple system, reliable structure, and easy access to cooling medium (air). The heat dissipation efficiency of forced air cooling radiators is related to factors such as fin form, arrangement, flow conditions, heat exchange area, fin material, and material thermal conductivity. At present, most of the forced air cooling systems in China use conventional rectangular fin radiators, which usually optimize the dimensional parameters of fin thickness and fin spacing, partially interrupt the rectangular fins, or punch holes on the fins to enhance turbulence. It is difficult to get rid of the two mutually restrictive factors of increasing the heat dissipation area and reducing the volume / mass. Specifically, when the cooling air flows along the fins in a straight line, the thickness of the velocity boundary layer and the thermal boundary layer gradually increase. The increase in the velocity boundary layer makes the fin wall thicker, resulting in an increase in flow resistance. The increase in the thermal boundary layer makes the fluid temperature gradient perpendicular to the fin direction smaller, resulting in a decrease in the heat exchange efficiency between the fin and the cold flow. Therefore, the heat dissipation efficiency is low, and the performance is difficult to improve. At the same time, the structural quality is redundant and the economy is reduced. Summary of the invention

[0004] In view of this, in order to solve the problems existing in the prior art, the present invention provides a forced air-cooled fin structure design method, device, equipment and storage medium to achieve the lightweight and high-performance design goals of a forced air-cooled fin radiator system.

[0005] A method for designing a forced air cooling fin structure, the specific technical solution includes: Step S100, designing matching basic parameters of fin heat sinks according to the functional requirements of different electronic devices for forced air cooling fin heat sinks; the basic parameters of fin heat sinks include fin thickness , Fin height , Number of fin rows ; Step S110, determining the position of the fins on the surface of the substrate where the fins are to be set, and generating a distribution shape of each fin. There are fin base lines, and contraction-expansion channels are formed between adjacent fin base lines; Step S120, all the fin base lines are extended along the normal line direction on the surface of the substrate to a thickness of fin baseline band; and by translating the fin baseline band on the surface plane of the substrate, the distance between two adjacent fin baseline bands is maintained at the original distance between the corresponding two fin baselines; Step S130, cutting the fin base band into intervals as a whole; Step S140, the fin base band that has been cut off at intervals is pulled up and expanded in a direction perpendicular to the surface plane of the substrate. The height of the three-dimensional space is The fin array completes the forced air cooling fin structure design.

[0006] Furthermore, in step S100, the basic parameters of the fin heat sink also include: heat sink dimensions, substrate thickness , the spacing between the fin starting positions In step S110, among the generated fin baselines, any two adjacent fin baselines do not intersect each other and are axially symmetrical.

[0007] Preferably, the number of fin rows In step S110, the fin baseline can be generated by using the sine function family. If the coordinate system is established with the substrate surface plane as the coordinate plane , the horizontal axis is Coordinate, the vertical coordinate is coordinates, assuming that the amplitude of the sinusoidal function family is , the period is , the fin starting position is set at At , the vertical translation difference of adjacent sinusoidal function curves is equal to the spacing between the starting positions of the fins. , the fin baseline determined using the sinusoidal function family is:

[0008] ,

[0009] in, is the sine function family located at Above the axis The fin baseline within the area, is the sine function family located at Below the axis Baseline of fins within the area.

[0010] Specifically, the radiator has a corresponding outer dimension of length×width×height of 120×30×9.5 mm 3, substrate thickness , fin thickness , fin height , the spacing between the starting positions of the fins is set to , then the maximum number of fin rows .

[0011] Further, according to step S110, the and Three fin base lines each, of which , a contraction-expansion channel is formed between the adjacent fin base lines; The six fin base lines are expanded into thickness according to step S120. The fin base band is formed on the substrate surface plane along the fin base band. Direction translation, so that the distance between two adjacent fin baselines remains the same as the distance between the two corresponding fin baselines; According to step S130, the fin base band is cut off at intervals as a whole, and the cut length is ; According to step S140, the fin baseline band after the interval is cut off is subjected to three-dimensional space Middle Edge The direction of the pull is expanded into a three-dimensional space with high The fin array completes the forced air cooling fin structure design.

[0012] The present invention also protects a forced air-cooled fin structure design device, characterized in that the device is used to implement the process of designing the fin structure in a forced air-cooled radiator using the above method, and the device specifically includes: The first module is used to design matching basic parameters of fin heat sinks according to the functional requirements of different electronic devices for forced air cooling fin heat sinks; the basic parameters of fin heat sinks include fin thickness , Fin height , Number of fin rows ; The second module is used to determine the position of the fins on the surface of the substrate where the fins are to be set, and to generate a distribution shape of each fin. There are fin base lines, and contraction-expansion channels are formed between adjacent fin base lines; The third module is used to expand all the fin base lines on the substrate surface along the normal direction to a thickness of fin baseline band; and by translating the fin baseline band on the surface plane of the substrate, the distance between two adjacent fin baseline bands is maintained at the original distance between the corresponding two fin baselines; The fourth module is used to perform interval truncation of the fin base band as a whole; The fifth module is used to pull and expand the fin base band that has been cut at intervals in a direction perpendicular to the surface plane of the substrate into The height of the three-dimensional space is The fin array completes the forced air cooling fin structure design.

[0013] The present invention provides a radiator, which has a fin array designed using the above-mentioned forced air cooling fin structure design method; the fin array is fixedly connected to the substrate to generate a contraction-expansion fin heat dissipator with a contraction-expansion fin channel.

[0014] The present invention protects a device, which includes a heat dissipation component. Specifically, the heat dissipation component includes a forced air-cooling fin structure designed using the aforementioned forced air-cooling fin structure design method.

[0015] The present invention also protects a device, which includes the above-mentioned contraction-expansion fin heat sink.

[0016] In summary, the present invention provides a forced air cooling fin structure design method, device, radiator and equipment. Compared with the prior art, the present invention has the following advantages and beneficial effects: 1. The fin shape and distribution are determined by means similar to the sine function family to construct a contraction-expansion channel, and the incoming gas is compressed and accelerated multiple times, which increases the turbulence of the fluid, reduces the thickness of the velocity boundary layer and the thermal boundary layer, and improves the heat exchange efficiency between the fin surface and the cooling fluid, thereby improving the performance of the corresponding fin radiator.

[0017] 2. The continuity of the fins is interrupted by interval truncation, which not only increases the secondary enhanced heat exchange caused by the gap flow of the fluid, but also reduces the weight of the fins, while achieving lightweight and high performance of the fin radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A flowchart of a method for designing a forced air-cooling fin structure in one embodiment; Figure 2 The coordinate plane in the fourth embodiment is Schematic diagram of the sinusoidal function curve of the internal generated fin baseline, where Counting the positive coordinates of the axis from bottom to top, (a) is the first sine function curve, (b) is the second sine function curve, and (c) is the third sine function curve; Figure 3 The coordinate plane in the fourth embodiment is Schematic diagram of the sinusoidal function curve of the internal generated fin baseline, where Counting from the top to the bottom of the negative axis, (d) is the first sine function curve, (e) is the second sine function curve, and (f) is the third sine function curve; Figure 4 A schematic diagram of the contraction-expansion channel generated by the fin baseline in the fourth embodiment; Figure 5 It is a schematic diagram of the fin base line being thickened into a fin base line band in the fourth embodiment; Figure 6 It is a schematic diagram of performing interval truncation on the fin base line band in the fourth embodiment; Figure 7 Schematic diagram of the fin array of the forced air cooling fin structure in the fourth embodiment, wherein degC is the unit of the fin surface temperature of the radiator, and m / s is the unit of the wind force velocity of the radiator section; Figure 8 It is a schematic diagram of the simulated temperature field and velocity profile distribution of a contraction-expansion fin heat sink designed by the method of the fourth embodiment. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0020] The present invention provides a forced air-cooling fin structure design method for designing a fin structure suitable for a forced air-cooling radiator to meet the high performance requirements of the fin radiator for light weight and improved heat dissipation efficiency.

[0021] In the first embodiment, if Figure 1 As shown, the present invention provides a method for designing a forced air cooling fin structure, and the method specifically comprises the following steps: Step S100, designing matching basic parameters of fin heat sinks according to the functional requirements of different electronic devices for forced air cooling fin heat sinks; the basic parameters of fin heat sinks include fin thickness , Fin height , Number of fin rows ; Step S110, determining the position of the fins on the surface of the substrate where the fins are to be set, and generating a distribution shape of each fin. There are fin base lines, and contraction-expansion channels are formed between adjacent fin base lines; Step S120, all the fin base lines are extended along the normal line direction on the surface of the substrate to a thickness of fin baseline band; and by translating the fin baseline band on the surface plane of the substrate, the distance between two adjacent fin baseline bands is maintained at the original distance between the corresponding two fin baselines; Step S130, cutting the fin base band into intervals as a whole; Step S140, the fin base band that has been cut off at intervals is pulled up and expanded in a direction perpendicular to the surface plane of the substrate. The height of the three-dimensional space is The fin array completes the forced air cooling fin structure design.

[0022] Specifically, in step S100, the basic parameters of the fin heat sink also include: heat sink dimensions, substrate thickness .

[0023] Preferably, in step S110, among the generated fin baselines, any two adjacent fin baselines do not intersect each other and are axially symmetrical.

[0024] In particular, in the second embodiment, in step S110, a fin baseline with a contraction-expansion channel can be generated using a sinusoidal function family. If the amplitude of the sinusoidal function family is , the period is , the adjacent vertical translation difference is , then the basic parameters of the radiator need to meet the following setting conditions: (i) In order to ensure the air volume at the air inlet of the contraction-expansion channel, the design ; (ii) In order to form a complete contraction-expansion channel, two adjacent sinusoidal function curves cannot intersect, so ; (iii) Arrange the fin baseline and the number of fin rows according to step S110 and conditions (i) and (ii). The restrictions on the surface size of the substrate caused by the radiator's external dimensions must be met.

[0025] Further, in step S110, the formation of the contraction-expansion channel is ensured by the axisymmetric property of the sinusoidal function family.

[0026] Preferably, in step S120, the axis of symmetry on the substrate surface plane parallel to the extension direction of the fin baseline is taken as the center line, and all the above-mentioned fin baseline bands are parallel moved in the direction perpendicular to the center line, and the distance between two adjacent fin baseline bands after the parallel movement remains the same as the distance between the original corresponding fin baselines.

[0027] Preferably, in step S130, the fin baseline is truncated at intervals as a whole, so that the subsequently generated fin structure is broken up as a whole, thereby destroying the velocity boundary layer and the thermal boundary layer, thereby enhancing the heat exchange between the fin and the air to improve the performance of the radiator.

[0028] In the third embodiment, the number of fin rows , establish a coordinate system with the substrate surface plane as the coordinate plane , the horizontal axis is Coordinate, the vertical coordinate is coordinates, in step S110, the fin starting position can be set at If , the fin baseline is determined by designing the following family of sinusoidal functions: (1) , (2) is the sine function family located at Above the axis The fin baseline within the area, is the sine function family located at Below the axis Fin baseline within area, period It is set according to actual design requirements such as specific material usage and heat sink size.

[0029] More specifically, in the fourth embodiment, the radiator has an overall dimension of 120×30×9.5 corresponding to length×width×height. mm 3 , substrate thickness , fin thickness , fin height , the spacing between the starting positions of the fins is set to .

[0030] If set , , since the length and width of the substrate are limited to 120×30 mm 2 In the range, the following formula is used: (3) Available The maximum value is 3, so , and the fin base line is along The straight line span in the direction does not exceed Therefore, using equations (1) and (2) in the third embodiment above, we can obtain There are 3 fin base lines above and below the shaft, and .

[0031] Specifically, Figure 2 As shown, the coordinate plane The sine function curve of the fin baseline is generated inside. The positive coordinates of the axis include the first sine function curve (a) from bottom to top: (4) The second sine function curve (b): (5) The third sine function curve (c): (6) like Figure 3 As shown, the coordinate plane The sine function curve of the fin baseline is generated inside. The negative coordinates of the axis include the first sine function curve (d) from top to bottom: (7) The second sine function curve (e): (8) The third sine function curve (f): , (9) Notice Figure 2 , Figure 3 The unit of the central axis is . Further, if Figure 4 As shown, a contraction-expansion channel is formed between the adjacent fin base lines.

[0032] The six fin base lines are expanded into thicknesses according to step S120. The fin base band is formed on the substrate surface plane along the fin base band. The distance between two adjacent fin baselines is kept the same as the distance between the two corresponding fin baselines. Figure 5 As shown, the translation does not change the axial symmetry between two adjacent fin base line bands.

[0033] like Figure 6 As shown, according to step S130, the fin base line band is cut off at intervals as a whole. Figure 6 The interval cutoff length selected is 1mm.

[0034] Further, the fin base line strip that has been cut off at intervals is subjected to three-dimensional space analysis according to step S140. The middle edge is perpendicular to the substrate surface Direction of pull, such as Figure 7As shown, it expands into a three-dimensional space with a height of The fin array completes the forced air cooling fin structure design.

[0035] The fin array and the thickness The substrate is as follows Figure 7 The connection is fixed in the manner shown.

[0036] Preferably, the truncation positions of the interval truncation are selected to maintain the symmetry within the period of each row of fin arrays as much as possible, and an appropriate truncation spacing is selected to maintain the wind cavity effect of the contraction-expansion channel for wind contraction-expansion.

[0037] In a fifth embodiment, a forced air cooling fin structure design device is provided, which is used to implement the process of designing the fin structure in a forced air cooling radiator using any one of the methods of the first to fourth embodiments, and the device specifically includes: The first module is used to design matching basic parameters of fin heat sinks according to the functional requirements of different electronic devices for forced air cooling fin heat sinks; the basic parameters of fin heat sinks include fin thickness , Fin height , Number of fin rows ; The second module is used to determine the position of the fins on the surface of the substrate where the fins are to be set, and to generate a distribution shape of each fin. There are fin base lines, and contraction-expansion channels are formed between adjacent fin base lines; The third module is used to expand all the fin base lines on the substrate surface along the normal direction to a thickness of fin baseline band; and by translating the fin baseline band on the surface plane of the substrate, the distance between two adjacent fin baseline bands is maintained at the original distance between the corresponding two fin baselines; The fourth module is used to perform interval truncation of the fin base band as a whole; The fifth module is used to pull and expand the fin base band that has been cut at intervals in a direction perpendicular to the surface plane of the substrate into The height of the three-dimensional space is The fin array completes the forced air cooling fin structure design.

[0038] A person of ordinary skill in the art can understand that all or part of the processes for implementing the above-mentioned embodiment methods can be completed by instructing related hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods.

[0039] In a sixth embodiment, the present invention provides a heat sink having a fin array designed and obtained by the method of any one of the first to fourth embodiments described above; the fin array is fixedly connected to the substrate to generate a contraction-expansion fin heat sink having a contraction-expansion fin channel.

[0040] The present invention also conducts simulation tests and result comparisons on the prior art (selecting a traditional rectangular fin heat sink) and the shrink-expansion fin heat sink designed by the method of the fourth embodiment, specifically including: (a) The same test conditions were set: the simulated heat source was evenly distributed on the bottom of the substrate, the total input power was 2.0W, and the wind inlet flow rate was V 0 is 1.15m / s, outlet static pressure is 0Pa, and ambient temperature is 26.0℃; (b) setting the same basic parameters of the fin heat sink as those of the third embodiment; (c) Two fin heat sinks were tested, and the shrink-expansion fin heat sink designed by the method of the third embodiment was simulated using CFD software, as shown in FIG. Figure 8 The comparison results are shown in Table 1.

[0041] Table 1 Comparison of heat dissipation test results under the same total heat source input power and wind inlet flow rate conditions

[0042] It can be seen from Table 1 that the fin structure of the contraction-expansion fin heat sink obtained by the method of the present invention is significantly better than the traditional rectangular fin structure in terms of heat dissipation capacity: when the fin weight reduction ratio is 41.7%, the maximum temperature rise on the chip surface drops from 9.3°C to 5.9°C, and the heat dissipation performance is improved by 36.6%.

[0043] In order to further illustrate that the performance of the contraction-expansion fin heat sink obtained by the method of the present invention is better than that of the traditional heat sink, other working conditions are tested, mainly for different total heat source input power or different wind inlet flow rate conditions, and the results are shown in Tables 2 and 3.

[0044] Table 2 Comparison of heat dissipation test results under the same wind inlet flow rate but different heat source input total power conditions

[0045] Table 3 Comparison of heat dissipation performance test results under the same total heat source input power but different wind inlet flow rate conditions

[0046] The data in Tables 2 and 3 show that under different total input powers or different wind inlet flow rates, the contraction-expansion fin radiator obtained by the method of the present invention still has obvious advantages in terms of lightweight processing of the radiator and improving heat exchange efficiency to improve the overall performance of the radiator.

[0047] In one embodiment, the present invention provides a device, which may be an electronic device, comprising a heat dissipation component. Specifically, the heat dissipation component comprises a forced air-cooling fin structure designed using the method described in any one of the first to fourth embodiments.

[0048] In another embodiment of the present invention, there is provided a device, wherein the device comprises the contraction-expansion fin heat sink of the sixth embodiment.

[0049] Those skilled in the art will appreciate that the description of the technical features of the devices in the above embodiments does not constitute a limitation on all devices to which the present invention is applied, and a specific device may include more or fewer components, or combine certain components, or have a different arrangement of components.

[0050] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for designing a forced air cooling fin structure, characterized in that: The method specifically comprises the following steps: Step S100, designing matching basic parameters of fin heat sinks according to the functional requirements of different electronic devices for forced air cooling fin heat sinks; the basic parameters of fin heat sinks include fin thickness , Fin height , Number of fin rows ; Step S110, determining the position of the fins on the surface of the substrate where the fins are to be set, and generating a distribution shape of each fin. There are fin base lines, and contraction-expansion channels are formed between adjacent fin base lines; Step S120, all the fin base lines are extended along the normal line direction on the surface of the substrate to a thickness of fin baseline band; and by translating the fin baseline band on the surface plane of the substrate, the distance between two adjacent fin baseline bands is maintained at the original distance between the corresponding two fin baselines; Step S130, cutting the fin base band into intervals as a whole; Step S140, the fin base band that has been cut off at intervals is pulled up and expanded in a direction perpendicular to the surface plane of the substrate. The height of the three-dimensional space is The fin array completes the forced air cooling fin structure design.

2. A forced air cooling fin structure design method according to claim 1, characterized in that: In step S100, the basic parameters of the fin heat sink also include: heat sink dimensions, substrate thickness , the spacing between the fin starting positions ; In the step S110, among the generated fin baselines, any two adjacent fin baselines do not intersect each other and are axisymmetric.

3. A forced air cooling fin structure design method according to claim 2, characterized in that: The number of fin rows ; In step S110, the fin baseline can be generated by using the sine function family. If the coordinate system is established with the substrate surface plane as the coordinate plane , the horizontal axis is Coordinate, the vertical coordinate is coordinates, let the amplitude of the sine function family be , the period is , the fin starting position is set at At , the vertical translation difference of adjacent sinusoidal function curves is equal to the spacing between the starting positions of the fins. , the fin baseline determined using the sinusoidal function family is: , in, is the sine function family located at Above the axis The fin baseline within the area, is the sine function family located at Below the axis Baseline of the fins within the area.

4. A forced air cooling fin structure design method according to claim 3, characterized in that: The radiator dimensions are 120×30×9.5 in length×width×height. mm 3 , substrate thickness , fin thickness , fin height , the spacing between the starting positions of the fins is set to , then the maximum number of fin rows can be calculated .

5. A forced air cooling fin structure design method according to claim 4, characterized in that: According to step S110, the and Three fin base lines each, of which , a contraction-expansion channel is formed between the adjacent fin base lines; The six fin base lines are expanded into thickness according to step S120. The fin base band is formed on the substrate surface plane along the fin base band. Direction translation, so that the distance between two adjacent fin baselines remains the same as the distance between the two corresponding fin baselines; According to step S130, the fin base band is cut off at intervals as a whole, and the cut length is ; According to step S140, the fin baseline band after the interval is cut off is subjected to three-dimensional space Middle Edge The direction of the pull is expanded into the height of the three-dimensional space The fin array completes the forced air cooling fin structure design.

6. A forced air cooling fin structure design device, characterized in that: The device is used to implement a process of designing a fin structure in a forced air cooling radiator using the method according to any one of claims 1 to 5, and the device specifically comprises: The first module is used to design matching basic parameters of fin heat sinks according to the functional requirements of different electronic devices for forced air cooling fin heat sinks; the basic parameters of fin heat sinks include fin thickness , Fin height , Number of fin rows ; The second module is used to determine the position of the fins on the surface of the substrate where the fins are to be set, and to generate a distribution shape of each fin. There are fin base lines, and contraction-expansion channels are formed between adjacent fin base lines; The third module is used to expand all the fin base lines on the substrate surface along the normal direction to a thickness of fin baseline band; and by translating the fin baseline band on the surface plane of the substrate, the distance between two adjacent fin baseline bands is maintained at the original distance between the corresponding two fin baselines; The fourth module is used to perform interval truncation of the fin base band as a whole; The fifth module is used to pull and expand the fin base band that has been cut at intervals in a direction perpendicular to the surface plane of the substrate into The height of the three-dimensional space is The fin array completes the forced air cooling fin structure design.

7. A radiator, characterized in that: The heat sink has a fin array designed using the forced air-cooling fin structure method described in any one of claims 1 to 5; the fin array is fixedly connected to the substrate to generate a contraction-expansion fin heat sink with a contraction-expansion fin channel.

8. A device, characterized in that: The device includes a heat dissipation component, and specifically the heat dissipation component includes a forced air-cooling fin structure designed using the method described in any one of claims 1-5.

9. A device, characterized in that: The device comprises the contraction-expansion fin heat sink of claim 7.

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