Device, system and method for wafer transfer

Abstract

An apparatus, system and method for wafer transfer, the apparatus comprising: a sealing assembly comprising a sealing transfer device and a connecting assembly, the connecting assembly comprising a connecting plate, the transfer assembly comprising a sealing plate, the transfer assembly being movable in a vertical direction to transfer a wafer and seal a second chamber, the sealing plate having first and second vacuum openings, the first and second vacuum openings being arranged in the sealing plate; the connecting plate is provided with a first vacuum pipe opening and a second vacuum pipe opening. The driving mechanism comprises a driving assembly and a transmission assembly, the transmission assembly is limited relative to the processing equipment and fixedly connected with the sealing plate, and the driving assembly and the transmission assembly abut against each other at the driving slope, so that the horizontal movement of the driving assembly drives the transmission assembly to move vertically; the vacuum assemblies comprise the first vacuum assembly and the second vacuum assembly, the first vacuum assembly comprises a rough pumping assembly communicated with the first vacuum opening and a first valve plate assembly used for sealing the first vacuum opening, and the second vacuum assembly comprises a fine pumping assembly and a second valve plate assembly used for sealing the second vacuum opening.

Description

Technical Field

[0001] The present disclosure generally relates to the field of silicon wafer processing technology. More specifically, the present disclosure relates to an apparatus, system and method for wafer transfer. Background Art

[0002] In the field of silicon wafer processing, processing equipment often needs to transfer wafers from the atmosphere into a vacuum chamber, and in this process, conveying devices such as manipulators for vertically transporting wafers are often used. Such devices may occupy a relatively large space in the vertical direction when they are set up. On the one hand, it occupies a large space in the production site, and on the other hand, it is not conducive to the installation and maintenance of production equipment.

[0003] In view of this, there is an urgent need to provide a device for wafer transfer so as to make the structure of the device for wafer transfer more compact. Summary of the invention

[0004] In order to at least solve one or more of the technical problems mentioned above, the present disclosure proposes a device, a system and a method for wafer transfer in multiple aspects.

[0005] In a first aspect, the present disclosure provides a device for wafer transfer, which is used to transfer wafers between a first chamber and a second chamber of a processing device, the device comprising: a sealing assembly, which comprises a sealing transfer device and a connecting assembly fixedly connected to the processing device, the connecting assembly comprising a connecting plate, the transfer assembly comprising a sealing plate spaced apart from the connecting plate in a vertical direction, the transfer assembly can move relative to the connecting assembly in a vertical direction to transfer the wafer and seal the second chamber relative to the first chamber, the sealing plate is provided with a first vacuum opening and a second vacuum opening penetrating the plate surface, the connecting plate is provided with a first vacuum pipe port and a second vacuum pipe port penetrating the plate surface; a driving mechanism, which comprises a driving assembly with and a transmission assembly, the transmission assembly is limited relative to the processing equipment along a first horizontal direction and is fixedly connected to the sealing plate, the driving assembly has a driving inclined surface inclined from the first horizontal direction toward the vertical direction, the driving assembly and the transmission assembly abut at the driving inclined surface, so that the movement of the driving assembly along the first horizontal direction drives the transmission assembly to move vertically; a vacuum assembly, which includes a first vacuum assembly and a second vacuum assembly, the first vacuum assembly respectively includes a rough pumping assembly connected to the first vacuum opening on the sealing plate, and a first valve plate assembly for closing the first vacuum opening, the second vacuum assembly includes a fine pumping assembly connected to the second vacuum opening, and a second valve plate assembly for closing the second vacuum opening.

[0006] In some embodiments, the driving assembly includes a driving member and a guide plate driven by the driving member to move along a first horizontal direction, the transmission assembly includes a follower wheel, and the guide plate is provided with a guide groove inclined from the first horizontal direction to the vertical direction and cooperating with the follower wheel, and the guide groove is used to drive the follower wheel to move in the vertical direction when the guide plate moves along the first horizontal direction.

[0007] In some embodiments, multiple transmission through holes are set on the connecting plate, the transmission assembly includes a relay and multiple transmission rods, the follower wheel is set on the side of the relay, one end of the multiple transmission rods is fixedly connected to the relay, and the other end passes through the transmission through hole and is fixedly connected to the sealing plate.

[0008] In some embodiments, the sealing plate includes a plurality of sealing rod holes extending through the plate surface, the first valve plate assembly includes a first valve plate and a plurality of sealing rods fixedly connected to the first valve plate, the second valve plate assembly includes a second valve plate and a plurality of sealing rods fixedly connected to the second valve plate, and the plurality of transmission rods each include a sealing through hole extending axially therethrough, the plurality of sealing rods are respectively inserted into the sealing through holes of the corresponding transmission rods, and are respectively passed through the sealing rod holes on the sealing plate and fixedly connected to the first valve plate and the second valve plate.

[0009] In some embodiments, the first valve plate assembly and the second valve plate assembly also include a plurality of single-acting cylinders arranged in a vertical direction, and compression springs fixedly arranged at the protruding ends of the single-acting cylinders. The fixed portion of the single-acting cylinders is fixedly connected to the relay component, and the upper ends of the plurality of compression springs are respectively abutted against the bottom of the transmission rod in the vertical direction.

[0010] In some embodiments, the vacuum assembly also includes a limit bracket fixedly connected to the relay, the limit bracket includes a limit block extending in the vertical direction, the first valve plate assembly and the second valve plate assembly each include two single-acting cylinders for driving the valve plate to move, the protruding ends of the two corresponding single-acting cylinders of the first valve plate assembly are fixedly connected to the first synchronous bracket, and the protruding ends of the two corresponding single-acting cylinders of the second valve plate assembly are fixedly connected to the second synchronous bracket, a buffer spring is arranged between the first synchronous bracket and the second synchronous bracket and the limit bracket, and the limit block limits the first synchronous bracket and the second synchronous bracket in the vertical direction.

[0011] In some embodiments, the sealing assembly also includes multiple bellows, one end of the bellows is fully welded to the upper surface of the connecting plate, and the other end is fully welded to the lower surface of the sealing plate, and the bellows are arranged corresponding to the transmission through hole and the sealing rod hole, the first vacuum opening and the first vacuum pipe port, the second vacuum opening and the second vacuum pipe port to surround and seal them.

[0012] In a second aspect, the present disclosure provides a system for wafer transfer, comprising: a wafer storage device, which is used to store, send out and receive wafers; a first transfer mechanism, which is used to transfer wafers between a second chamber and a third chamber of a processing device; and a device for wafer transfer according to any one of claims 1 to 4, which is used to perform at least the following operations: receiving wafers sent out by the wafer storage device; transferring wafers between the first chamber and the second chamber through a sealing assembly; and transferring wafers between the second chamber and the third chamber through the first transfer mechanism.

[0013] In the third aspect, the present disclosure provides a method for wafer transfer using the system according to the claim, comprising: positioning the sealing component at a corresponding position of the second chamber, the wafer storage device delivering the wafer to the second chamber, and the wafer being carried by the sealing component; causing the sealing component to evacuate the second chamber, and transferring the wafer to a relay position for waiting; causing the first transfer mechanism to extend into a transfer window connecting the second chamber and the third chamber, and move to under the wafer; causing the sealing component to move to a corresponding position of the first chamber, the first transfer mechanism receiving the wafer; and causing the first transfer mechanism to carry the wafer out of the transfer window.

[0014] In some embodiments, the method also includes: allowing the first transfer mechanism to carry the wafer to be sent out and move it into the first chamber through the transfer window; allowing the sealing component to move from the corresponding position of the first chamber to the relay position, and receive the wafer to be sent out; allowing the first transfer mechanism to move out from the transfer window; and allowing the sealing component to move from the relay position to the corresponding position of the second chamber, and the wafer storage device moves the wafer to be sent out from the second chamber.

[0015] Through the device for wafer conveying provided as above, the embodiment of the present disclosure sets a horizontally placed driving component, and makes the driving component abut against the transmission component by means of an inclined surface to drive the transmission component to move in a vertical direction. This can change the setting direction of the driving component and make the equipment layout more compact, which is conducive to the miniaturization of the wafer conveying equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By reading the detailed description below with reference to the accompanying drawings, the above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1 An exemplary perspective view of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown;

[0018] Figure 2 An exemplary perspective view of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown;

[0019] Figure 3 An exemplary perspective view of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown;

[0020] Figure 4 An exemplary perspective view showing a driving mechanism of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0021] Figure 5 An exemplary perspective view showing a combination of a sealing component and a vacuum component of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0022] Figure 6 An exemplary cross-sectional view showing a combination of a sealing component and a vacuum component of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0023] Figure 7 An exemplary perspective view showing a combination of a sealing component and a vacuum component of an apparatus for wafer transfer according to some embodiments of the present disclosure;

[0024] Figure 8 An exemplary side view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0025] Figure 9a An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0026] Figure 9b An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0027] Fig.9c An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown;

[0028] Fig.10a A top view showing a combination of a first transfer mechanism, a second transfer mechanism, and a device for wafer transfer in a system for wafer transfer according to some embodiments of the present disclosure;

[0029] Fig.10b A top view showing a combination of a first transfer mechanism, a second transfer mechanism, and a device for wafer transfer in a system for wafer transfer according to some embodiments of the present disclosure;

[0030] Fig.11 An exemplary flow chart of a method for wafer transfer according to some embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0032] It should be understood that the terms "include" and "comprising" used in the specification and claims of the present disclosure indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0033] It should also be understood that the terms used in this disclosure are only for the purpose of describing specific embodiments and are not intended to limit the disclosure. As used in this disclosure and claims, the singular forms of "a", "an", and "" are intended to include the plural forms unless the context clearly indicates otherwise. It should also be further understood that the term "and / or" used in this disclosure and claims refers to any combination of one or more of the associated listed items and all possible combinations, including these combinations.

[0034] As used in this specification and claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0035] The specific implementation of the present disclosure is described in detail below with reference to the accompanying drawings.

[0036] The disclosed embodiment provides a device for wafer conveying, which can change the setting direction of the drive component and make the equipment layout more compact by setting a horizontally placed drive component and making the drive component abut against the transmission component by means of an inclined surface to drive the transmission component to move in a vertical direction. This is conducive to the miniaturization of the wafer conveying equipment.

[0037] See also Figure 1 and Figure 8 , Figure 1 An exemplary perspective view of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown; Figure 8An exemplary side view of a system for wafer transfer according to some embodiments of the present disclosure is shown. In some embodiments, the device 100 for wafer transfer can be used to seal and evacuate a second chamber 220 connected to the first chamber 210 relative to the first chamber 210, thereby transferring the wafer 90 to a highly vacuum processing or testing space under a vacuum environment. The device for wafer transfer can include a sealing assembly 10 for sealing the chamber, a driving mechanism 20 for driving the sealing assembly 10 to perform related actions, and a vacuum assembly 30 for evacuating.

[0038] See also Figure 2 and Figure 3 , Figure 2 An exemplary perspective view of an apparatus for wafer transfer according to some embodiments of the present disclosure is shown; Figure 3 An exemplary stereogram of a device for wafer transfer according to some embodiments of the present disclosure is shown. Specifically, in some embodiments, the sealing assembly 10 may include a connection assembly 120 for connecting to a processing device 200, and a sealing transfer device 110 capable of moving relative to the connection assembly 120 to transfer wafers. The connection assembly 120 may, for example, include a connection plate 12 for fixedly connecting to the processing device 200, which may, for example, be fixedly connected to the bottom wall of the first chamber 210. The sealing transfer device 110 may include a sealing plate 11 spaced apart from the connection plate 12 in a vertical direction, the sealing plate 11 being capable of moving relative to the connection plate 12 in a vertical direction to transfer wafers, and being capable of sealing the second chamber 220 relative to the first chamber 210. To this end, an upper sealing groove 116 may be provided on the upper surface of the sealing plate 11, and an upper sealing ring 117 may be provided in the upper sealing groove 116 for fitting with a step surface 224 adjacent to the second chamber 220 and the first chamber 210.

[0039] The sealing plate 11 may be provided with a first vacuum opening 111 and a second vacuum opening 112 that penetrate the plate surface, and the connecting plate 12 may be provided with a first vacuum pipe opening 121 and a second vacuum pipe opening 122 that penetrate the plate surface. The first vacuum opening 111 and the second vacuum opening 112 may be connected to a corresponding vacuum pump, for example, so that when the sealing conveying device 110 seals the second chamber 220, the first vacuum opening 111 and the second vacuum opening 112 are connected to the second chamber 220 to evacuate it. A vacuum pipe for connecting a vacuum pump may be provided radially inside the first vacuum pipe opening 121 and the second vacuum pipe opening 122. In some embodiments, the first vacuum opening 111 may be aligned with the first vacuum pipe opening 121 in the vertical direction, and the second vacuum opening 112 may be aligned with the second vacuum pipe opening 122 to facilitate the installation of the vacuum pipe.

[0040] See also Figure 4 , Figure 4An exemplary stereogram of a drive mechanism of a device for wafer transfer in some embodiments of the present disclosure is shown, wherein components such as a transmission rod are hidden to clearly show its internal structure. The drive mechanism 20 may include a drive assembly and a transmission assembly, wherein the transmission assembly is limited relative to the processing device 200 along a first horizontal direction, and the transmission assembly is fixedly connected to the sealing plate 11 of the sealing conveying device 110. The drive assembly may include a drive inclined plane inclined from the first horizontal direction toward the vertical direction, and the drive assembly and the transmission assembly abut at the drive inclined plane, so that the horizontal movement of the drive assembly along the first horizontal direction drives the transmission assembly to move vertically. Thus, the drive mechanism 20 can drive the sealing conveying device 110 to rise in the vertical direction to seal the second chamber 220 through a drive member arranged in the horizontal direction, or descend in the vertical direction to communicate the first chamber 210 with the second chamber 220.

[0041] The vacuum assembly 30 may include a first vacuum assembly and a second vacuum assembly. The first vacuum assembly includes a roughing assembly 33 connected to the first vacuum opening 111 on the sealing plate 11 by means of a first vacuum tube 38, and a first valve plate assembly for sealing the first vacuum opening 111. The second vacuum assembly includes a fine pumping assembly 34 connected to the second vacuum opening 112 by means of a second vacuum tube 37, and a second valve plate assembly for sealing the second vacuum opening 112. The roughing assembly 33 may be, for example, a vacuum pipe connected to the first vacuum tube 38 and a centralized negative pressure generating device (not shown) of a factory connected to the vacuum pipe. The roughing assembly 33 provides a stable negative pressure source to the first vacuum opening 111, so as to perform preliminary vacuuming on the sealed second chamber 220, and the fine pumping assembly 34 may include, for example, a molecular pump, which is used to start working after the roughing assembly 33 performs preliminary vacuuming, and further vacuumize the second chamber 220, so as to achieve the target vacuum degree.

[0042] In some embodiments, the driving assembly of the driving mechanism 20 includes a driving member 22 and a guide plate 21 driven by the driving member 22 to move along the first horizontal direction, and the transmission assembly includes a follower wheel 222. The guide plate 21 is provided with a guide groove 211 formed by being recessed inwardly of the guide plate 21 in a transverse direction, and the guide groove 211 is inclined from the first horizontal direction to the vertical direction, and its inner side can cooperate with the follower wheel 222. The guide groove 211 is used to drive the follower wheel 222 to move in the vertical direction when the guide plate 21 moves in the first horizontal direction. The driving member 22 can be, for example, a rotating driving member such as a stepping motor or a servo motor, and provides precise driving along the first horizontal direction through a lead screw and a guide rail mechanism. In some embodiments, the driving member 22 can also be a linear driving member such as a linear motor or a cylinder, thereby directly providing driving along the first horizontal direction.

[0043] In some embodiments, the two inclined side walls of the guide groove 211 form two driving inclined surfaces that are arranged opposite to each other. When the driving member 22 drives the guide plate 21 to reciprocate along the first horizontal direction, the two driving inclined surfaces of the guide groove 211 can respectively contact with the follower wheel 222 and drive it to move in the vertical direction. The follower wheel 222 can extend into the guide groove 211 in whole or in part, and the circumferential side surface of the follower wheel 222 can contact with the two driving inclined surfaces of the guide groove 211 and roll along them. The diameter of the follower wheel 222 can match the width of the guide groove 211, so that there is a small gap between the follower wheel 222 and the driving inclined surface, so as to prevent the follower wheel 222 from jumping during the movement in the guide groove 211, causing the sealing conveyor 110 to vibrate and affect the wafer transportation.

[0044] In some embodiments, the guide groove 211 may include a plurality of sections. For example, it may include an inclined section 213 as described above for driving the follower wheel 222 to rise and fall. The portion near the upper end of the inclined section 213 is also provided with an adjustment section 214 and a holding section 215. The holding section 215 may be formed by the guide groove 211 extending from its end in the horizontal direction. For example, it may be formed at a relatively high end of the guide groove 211 in the vertical direction. The adjustment section 214 may be provided between the holding section 215 and the inclined section 213. It may be extended along a more gentle inclination angle than the inclined section 213. The holding section 215 may be used to carry the follower wheel 222 when it is necessary to maintain the sealing conveyor 110 at a high position, and the adjustment section 214 may be used to fine-tune the height. For example, when the sealing conveyor 110 is at a high position, the follower wheel 222 moves from the inclined section 213 to the adjustment section 214. At this time, since the inclination angle of the adjustment section 214 is more gentle, compared with when the driving wheel moves in the inclined section 213, when the driving member 22 drives the guide plate 21 to move the same distance along the first horizontal direction, the driving wheel moves a shorter distance in the vertical direction in the adjustment section 214. Therefore, the height of the sealing conveyor 110 can be finely adjusted to achieve a sealing effect that better meets the requirements.

[0045] In addition, an access port 216 may be provided on the upper side of the guide groove 211. The access port 216 may be a groove opened upward and laterally from the upper side of the guide groove 211. The access port 216 may be used for allowing the follower wheel 222 to fall into the guide groove 211 from top to bottom to facilitate the installation and replacement of the transmission assembly.

[0046] In some embodiments, the driving assembly may include two guide plates 21 arranged at intervals in a transverse direction perpendicular to the first horizontal direction, the bottoms of the two guide plates 21 may be fixedly connected to a guide base plate 217, and one end of the two guide plates 21 along the first horizontal direction may be fixedly connected to a driving support plate 218. The bottom of the guide base plate 217 may be connected to a guide rail assembly 29, which may be a guide rail slider assembly arranged along the first direction, and the bottom surface of the guide base plate 217 is fixedly connected to the slider of the guide rail slider assembly so as to be accurately guided by the guide rail. The driving support plate 218 may be fixedly connected to the output end of the driving assembly, so that it can reciprocate along the first horizontal direction under the drive of the driving member 22. The two guide plates 21, the guide base plate 217 and the driving support plate 218 together form a guide bracket, which enhances the stability of the driving assembly when transmitting the driving force.

[0047] See also Figure 5 and Figure 6 , Figure 5 An exemplary perspective view showing a combination of a sealing component and a vacuum component of an apparatus for wafer transfer according to some embodiments of the present disclosure; Figure 6 An exemplary cross-sectional view showing a combination of a sealing component and a vacuum component of a device for wafer transfer according to some embodiments of the present disclosure is shown, wherein Figure 5 and Figure 6 A plurality of transmission rods connected to the connection plate are also shown. The connection plate 12 may be provided with a plurality of transmission through holes 128, the transmission assembly may include a relay 23 and a plurality of transmission rods 24, the follower wheel 222 is connected to the side of the relay 23, one end of the plurality of transmission rods 24 is fixedly connected to the relay 23, and the other end passes through the transmission through hole 128 and is fixedly connected to the sealing plate 11. In some embodiments, a transmission limiter 129 is also fixedly provided on the lower side of the connection plate 12, and the transmission limiter 129 may be, for example, a hollow ball bearing sleeve or other limiting device, and the through hole on the radial inner side thereof surrounds the transmission through hole 128, so as to limit and guide the transmission rod 24 when the transmission rod 24 passes through the transmission through hole 128.

[0048] The relay 23 may be, for example, roughly in the shape of a hollow cuboid, the length direction of which may be consistent with the first horizontal direction, and the width direction of which may be set to be perpendicular to the first horizontal direction. The follower wheel 222 may, for example, include an axle and a wheel body that can rotate freely relative to the axle, and the axle may, for example, be fixed to the side of the relay 23 by bolt connection or the like, and enable the follower wheel 222 to roll on an inclined plane. In some embodiments, four follower wheels 222 may be provided on the relay 23, of which two follower wheels 222 are respectively provided on the two sides facing the guide plate 21. Correspondingly, the drive assembly includes two guide plates 21 that are respectively arranged on both sides of the relay 23 in the transverse direction, and each guide plate 21 is provided with two guide grooves 211 corresponding to the follower wheels 222.

[0049] In some embodiments, the sealing plate 11 may be roughly in the shape of a circular plate, and may include a plurality of sealing rod holes 118 penetrating the plate surface. The first valve plate assembly may include a first valve plate 31 and a plurality of sealing rods 351 fixedly connected to the first valve plate 31, and the second valve plate assembly may include a second valve plate 32 and a plurality of sealing rods 351 fixedly connected to the second valve plate 32. Both the first valve plate 31 and the second valve plate 32 may be formed into a roughly long and narrow plate shape, and the bottom sides of both ends thereof in the length direction are respectively provided with sealing connection holes 39 for fixed connection with the sealing rods 351. The plurality of transmission rods 24 may each include a sealing through hole 242 penetrating the transmission rod 24 in the axial direction, and the plurality of sealing rods 351 are respectively arranged in the sealing through holes 242 of the corresponding transmission rods 24, and respectively pass through the sealing rod holes 118 on the sealing plate 11 to be fixedly connected with the sealing connection holes 39 of the first valve plate 31 and the second valve plate 32. In some embodiments, a guide sleeve 241 is fixedly disposed in the sealing through hole 242. The guide sleeve 241 may be, for example, a ball bearing sleeve or other component that can guide the sealing rod 351 inside the sealing through hole 242 in the vertical direction. One or more guide sleeves may be disposed in the sealing through hole 242. For example, two guide sleeves 241 may be disposed. The two guide sleeves 241 are respectively located at positions close to both ends of the sealing through hole 242 in the vertical direction, so as to stably support and guide the sealing rod 351.

[0050] In some embodiments, the upper side of the sealing plate 11 is further formed with a first accommodating cavity 310 for accommodating the first valve plate 31, and a second accommodating cavity 320 for accommodating the second valve plate 32. The first valve plate 31 and the second valve plate 32 can be at least partially accommodated in the corresponding first accommodating cavity 310 and the second accommodating cavity 320 in the vertical direction. The first vacuum opening 111 can be opened in the portion of the sealing plate 11 corresponding to the center of the first accommodating cavity 310, and the second vacuum opening 112 can be opened in the portion of the sealing plate 11 corresponding to the center of the second accommodating cavity 320. Thus, the first valve plate 31 and the second valve plate 32 can move in the vertical direction in the corresponding first accommodating cavity 310 or the second accommodating cavity 320 during the operation of the equipment, and open or close the first vacuum opening 111 or the second vacuum opening 112. Without being too protruding in the vertical direction, which affects the transportation of the wafer. Furthermore, the provision of the first accommodating chamber 310 and the second accommodating chamber 320 also reduces the weight of the sealing plate 11 , thereby making the device lighter and saving energy costs.

[0051] In some embodiments, the bottom surface of the first valve plate 31 and the second valve plate 32 may be provided with a sealing flange 329 for enclosing the first vacuum opening 111 or the second vacuum opening 112, and the sealing flange 329 may be, for example, a circular annular protrusion protruding downward in the vertical direction. In some embodiments, the sealing flange 329 may also include a circular annular sealing groove facing downward in the vertical direction, and the sealing groove is used to cooperate with a sealing member such as a rubber sealing ring to enhance the sealing performance. In some embodiments, the outer periphery of the first vacuum opening 111 or the second vacuum opening 112 may also be provided with an opening boss 119 that radially surrounds the first vacuum opening 111 or the second vacuum opening 112. The opening boss 119 protrudes upward in the vertical direction, and its upper surface may be used to abut against the sealing flange 329 on the bottom side of the first valve plate 31 or the second valve plate 32, thereby reducing the distance that the first valve plate 31 and the second valve plate 32 need to move vertically when sealing.

[0052] The first valve plate assembly and the second valve plate assembly may also include a plurality of single-acting cylinders 35 arranged in the vertical direction, and a compression spring 353 arranged in the vertical direction between the protruding end of the single-acting cylinder 35 and the transmission rod 24. The fixing portion 359 of the single-acting cylinder 35 is fixedly connected to the relay plate 233, the relay plate 233 may be arranged at intervals with the relay member 23 in the vertical direction, and fixedly connected to each other by means of threaded connection or the like, and the protruding end 358 of the single-acting cylinder 35 is fixedly connected to the sealing rod 351. The upper ends of the plurality of compression springs 353 are respectively abutted against the bottom of the transmission rod 24 in the vertical direction, and the lower ends thereof are abutted against the upper side of the protruding end 358 of the single-acting cylinder 35, and the sealing rod 351 is penetrated through the radial inner side of the compression spring 353 and extends into the sealing through hole 242 of the transmission rod 24. Thus, the first valve plate 31 or the second valve plate 32 can be driven by the single-acting cylinder 35 to move upward in the vertical direction, and when the single-acting cylinder 35 is not driven, the protruding end of the single-acting cylinder 35 is pressed downward by the spring force of the compression spring 353.

[0053] In some embodiments, the central portion of the relay plate 233 is also provided with a plurality of pipeline through holes for passing through vacuum tubes, for example, it may include a first pipeline through hole 234 and a second pipeline through hole 235, the first pipeline through hole 234 may be used to pass through the first vacuum tube 38, and the second pipeline through hole 235 may be used to pass through the second vacuum tube 37. Thus, the connection portion between the rough pumping assembly 33 and the first vacuum tube 38 and the fine pumping assembly 34 may be arranged on the vertical lower side of the relay plate 233, and when the fixing portions of the plurality of single-acting cylinders 35 are also arranged on the vertical lower side of the relay plate 233, the staff can easily approach and maintain the relevant pneumatic pipelines, which significantly facilitates the use and maintenance of the equipment.

[0054] When the first valve plate 31 or the second valve plate 32 is driven to move upward by the single-acting cylinder 35, the first valve plate 31 or the second valve plate 32 is separated from the first vacuum opening 111 and the second vacuum opening 112 in the vertical direction, respectively, so as to open the first vacuum opening 111 and / or the second vacuum opening 112, and at this time, the second chamber 220 can be evacuated by the vacuum pump. When the single-acting cylinder 35 is not driven, the downward spring force applied by the compression spring 353 to the extended end of the single-acting cylinder 35 can drive the sealing rod 351 to move downward, so as to automatically seal the first vacuum opening 111 and the second vacuum opening 112. In this way, the sealing of the corresponding cavity can be maintained for a long time without consuming energy, so that the equipment can be more energy-efficient during the production and debugging process, and can cope with unexpected situations such as sudden pressure drops caused by sudden power outages or equipment failures.

[0055] The vacuum assembly 30 may also include a limit bracket 36 fixedly connected to the relay 23. The limit bracket 36 may be formed into a long strip with a roughly "L"-shaped cross section, for example. The limit bracket 36 may include a limit block 366 extending in the vertical direction, and a spring support portion 362 extending horizontally perpendicular to the vertical direction. In some embodiments, the first valve plate assembly and the second valve plate assembly each include two single-acting cylinders 35 for driving the valve plate to move. The first valve plate assembly also includes a first synchronous bracket 368. The protruding ends 358 of the two corresponding single-acting cylinders 35 of the first valve plate assembly are fixedly connected to the first synchronous bracket 368. Similarly, the second valve plate assembly also includes a second synchronous bracket 369. The protruding ends 358 of the two corresponding single-acting cylinders 35 of the second valve plate assembly are fixedly connected to the second synchronous bracket 369.

[0056] The first synchronous bracket 368 and the second synchronous bracket 369 can be formed into two semi-circular parts that can be fixed relative to each other, and the ends of the two semi-circular parts can be connected to form a circular ring. The hollow part of the circular ring can be used to avoid the first vacuum tube 38 or the second vacuum tube 37 and other parts located in the middle of the circular ring. The ends of the two sides of the circular ring that are connected to each other can also be used to clamp and fix with the extended ends of the two single-acting cylinders 35 respectively. In this way, the extension and retraction actions of the two single-acting cylinders 35 corresponding to the first valve plate assembly or the second valve plate assembly can be made more consistent, and the stability when driving in the vertical direction can be improved.

[0057] A buffer spring 365 may be provided between the first synchronous bracket 368 and the second synchronous bracket 369 and the limiting bracket 36, and the limiting block 366 limits the first synchronous bracket 368 and the second synchronous bracket 369 in the vertical direction. Specifically, in some embodiments, the upper side surfaces of the first synchronous bracket 368 and the second synchronous bracket 369 may be opposite to the limiting bracket 36 in the vertical direction, so that when the first synchronous bracket 368 and the second synchronous bracket 369 are driven and raised by the corresponding single-acting cylinder 35, the upper surfaces of the first synchronous bracket 368 and the second synchronous bracket 369 are close to the limiting bracket 36 in the vertical direction. When the first synchronous bracket 368 and the second synchronous bracket 369 rise to a predetermined height, the limiting block 366 extending in the vertical direction of the limiting bracket 36 may abut against the upper surface of the first synchronous bracket 368 and / or the second synchronous bracket 369. Thus, the lifting height of the first synchronous bracket 368 and the second synchronous bracket 369 can be limited in the vertical direction, thereby limiting the lifting height of the first valve plate 31 and the second valve plate 32. At the same time, the upper surface of the first synchronous bracket 368 and the second synchronous bracket 369 can also be opposite to the bottom surface of the spring support part 362 extending in the horizontal direction of the limiting bracket 36, and a buffer spring 365 extending in the vertical direction can be provided between the upper side of the first synchronous bracket 368 and the second synchronous bracket 369 and the lower side of the spring support part 362.

[0058] The spring force of the buffer spring 365 can act in the same direction as the compression spring 353, thereby further increasing the sealing pressure when the first valve plate 31 and the second valve plate 32 move downward to seal. In addition, the buffer spring 365 can be disposed, for example, on the lateral inner side of the two single-acting cylinders 35 arranged at intervals in the lateral direction, thereby vertically pressing down the first synchronous bracket 368 and the second synchronous bracket 369 near the center, so as to further compress the first synchronous bracket 368 and the second synchronous bracket 369 in the vertical direction, and prevent them from shaking or tilting and misaligning during operation due to lack of constraints.

[0059] See also Figure 7 , Figure 7An exemplary stereogram of the combination of the sealing component and the vacuum component of the device for wafer transfer in some embodiments of the present disclosure is shown, wherein a relay and other components are also shown to indicate the connection relationship. In some embodiments, the limit bracket 360 can also be configured to have only a substantially long strip-shaped main body, and the two ends of each limit bracket 360 are respectively fixedly connected to the top of two limit pillars 363 arranged in the vertical direction, and the bottom end of the limit pillar is fixedly connected to the limit support plate 361, and the limit support plate 361 is further fixedly connected to the relay 23. Thus, the limit bracket 360 is relatively fixed to the relay 23, and the limit bracket 360 is arranged on the upper side of the first synchronous bracket 368 and / or the second synchronous bracket 369 in the vertical direction, and can abut against the upper surface of the first synchronous bracket 368 and / or the second synchronous bracket 369 in the vertical direction when the first synchronous bracket 368 and the second synchronous bracket 369 rise to a predetermined height. Thus, it can also achieve the limit of the single-acting cylinder 35. In some embodiments, the limiting bracket 360 can be made of a material with relatively low hardness, such as engineering plastics, so that the sound generated when a collision occurs between the first synchronization bracket 368 and / or the second synchronization bracket 369 and the limiting bracket 360 is smaller, which is beneficial to noise reduction of the equipment.

[0060] See again Figure 6 In some embodiments, the sealing assembly 10 may further include a sealing connection assembly, which may include, for example, a plurality of bellows, at least one end of which may be fully welded to the connecting plate 12, and the other end may be fully welded to the sealing plate 11 or the first valve plate 31 and the second valve plate 32. Thus, the plurality of bellows may be firmly connected between the connecting plate 12, the sealing plate 11, the first valve plate 31 and the second valve plate 32, and will not loosen due to long-term high-frequency movement and vibration during production, thereby causing sealing failure. The plurality of bellows may be respectively arranged corresponding to the transmission through hole 128, the sealing rod hole 118 and the sealing connection hole 39, the first vacuum opening 111 and the first vacuum pipe port 121, the second vacuum opening 112 and the second vacuum pipe port 122, so as to surround and seal them.

[0061] Specifically, the multiple transmission through holes 128 on the connecting plate 12 can be aligned with the multiple sealing rod holes 118 on the sealing plate 11, respectively; the multiple sealing rod holes 118 on the sealing plate 11 can be aligned with the multiple sealing connection holes 39 on the first valve plate 31 and the second valve plate 32, respectively; the first vacuum pipe port 121 on the connecting plate 12 can be aligned with the first vacuum opening 111 on the sealing plate 11; the second vacuum pipe port 122 on the connecting plate 12 can be aligned with the second vacuum opening 112 on the sealing plate 11. One end of the multiple first bellows 141 can be welded to the connecting plate 12, and the other end can pass through the sealing rod hole 118 of the sealing plate 11 and be welded to the first valve plate 31 or the second valve plate 32. Thus, a plurality of first bellows 141 can be respectively arranged on the peripheries of a plurality of aligned transmission through holes 128, sealing rod holes 118, and sealing connection holes 39, so as to seal the gap between the transmission rod 24 and the transmission through hole 128, the gap between the sealing rod 351 and the sealing rod hole 118, and the gap between the sealing rod 351 and the sealing connection hole 39. Similarly, the second bellows 142 can be arranged on the peripheries of the aligned first vacuum pipe opening 121 and the first vacuum opening 111, and the third bellows 143 can be arranged on the peripheries of the aligned second vacuum pipe opening 122 and the second vacuum opening 112. Thus, the connection parts between the connection plate 12 and the sealing plate 11 are strictly sealed by the bellows welded to the connection plate 12 and the sealing plate 11, which significantly improves the airtightness of the sealing assembly 10 during use and prevents the airtightness from decreasing due to wear of components after long-term use.

[0062] In some embodiments, the first bellows 141, the second bellows 142 and the third bellows 143 can all be roughly cylindrical, including at least two connecting parts spaced apart in the axial direction, and a retractable bellows body arranged between two adjacent connecting parts. The connecting part can be made of a material such as metal that is easy to weld, and it can be roughly cylindrical, so as to at least partially extend into the corresponding hole to be welded along its axial direction. For example, the first bellows 141 can include three connecting parts spaced apart from each other in the axial direction, namely the first connecting part 141a, the second connecting part 141b and the third connecting part 141c. Among them, the first connecting part 141a can, for example, at least partially extend into the sealing connection hole 39 of the first valve plate 31 or the second valve plate 32, and be fully welded to the sealing connection hole 39. The second connecting part 141b can extend into the sealing rod hole 118 after the first bellows 141 passes through the sealing rod hole 118 of the sealing plate 11, and be fully welded to the sealing rod hole 118. Similarly, the third connection portion 141c can at least partially extend into the transmission through hole 128 of the connection plate 12, and be fully welded to the transmission through hole 128. Thus, the first bellows 141 can completely surround the connection gap corresponding to the transmission rod 24 and the sealing rod 351 in the circumferential direction. Similarly, the second bellows 142 and the third bellows 143 can respectively surround and seal the first vacuum opening 111 and the first vacuum pipe port 121, and the second vacuum opening 112 and the second vacuum pipe port 122 in a similar manner to the first bellows 141, thereby significantly improving the overall airtightness of the sealed transmission mechanism.

[0063] In the case where the first bellows 141 includes three connecting parts spaced apart in the axial direction, the first tube body between the first connecting part 141a and the second connecting part 141b can be located in the first accommodating cavity 310 or the second accommodating cavity 320 to seal the sealing rod hole 118 and the sealing connecting hole 39. The second tube body between the second connecting part 141b and the third connecting part 141c can be located between the connecting plate 12 and the sealing plate 11 to seal the transmission through hole 128 and the sealing rod hole 118. Thus, the two tube bodies of the first bellows 141 can realize the sealing function of two separated bellows, and because the two segments are formed as one body, there is no need to connect and seal the two tube bodies by welding or the like, so the sealing performance can be further ensured. It can be understood by those skilled in the art that the present disclosure does not limit the specific structure of the sealing tube. For example, when the welding sealing effect can be guaranteed, the first tube body and the second tube body can also be set as two separated bellows.

[0064] The sealed transmission mechanism of some embodiments disclosed herein utilizes a horizontally placed drive component, and enables the drive component to abut against the transmission component via an inclined surface to drive the transmission component to move in a vertical direction. This can change the setting direction of the drive component, making the equipment layout more compact, which is conducive to the miniaturization of wafer transfer equipment.

[0065] See also Figure 8 In some embodiments, the system 300 for wafer transfer may include some of the devices 100 for wafer transfer in the above-mentioned embodiments, and the system also includes a wafer storage device 400, and a processing device 200. The wafer storage device 400 may be, for example, a front end module (EFEM) of a device for wafer processing, which may include, for example, a wafer storage mechanism for storing multiple wafers, a wafer transfer mechanism for transferring wafers, and a wafer recovery mechanism for recovering wafers after processing or inspection. Among them, the wafer 90 enters and exits the wafer storage device 400 through the wafer transfer port 410. The processing device 200 may be, for example, a device for receiving wafers and performing inspection or processing on the wafers, which includes a first chamber 210 and a second chamber 220 stacked up and connected to each other, a wafer receiving opening 221 for communicating with the second chamber 220 to receive the wafer 90, and a third chamber 230 for performing corresponding processing on the wafer. The third chamber 230 is connected to the first chamber 210 through a transfer window 231, and a first transfer mechanism 70 for transferring wafers between the second chamber 220 and the third chamber 230 is also provided in the third chamber 230. The device 100 for transferring wafers described in some embodiments of the present disclosure can be connected to the wafer storage device 400, and receive the wafers sent out by the wafer storage device 400, and then use the sealed transfer device 110 to transfer the wafers between the first chamber 210 and the second chamber 220, and then move them out or send them back by the first transfer mechanism 70.

[0066] See also Figures 9a to 9c , Figure 9a An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein a sealing transfer device is located at a position corresponding to the second chamber; Figure 9b An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein a sealing transfer device is located at a relay position; Fig.9c An exemplary partial enlarged view of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein the sealing transfer device is located at a position corresponding to the first chamber. In some embodiments, the sealing transfer device 110 can be driven by the driving mechanism 20 to reciprocate in the vertical direction relative to the first chamber 210 and the second chamber 220, and can move to three preset positions, namely, a position corresponding to the first chamber, a position corresponding to the second chamber, and a relay position.

[0067] In some embodiments, when the sealing conveyor 110 is located at a position corresponding to the second chamber, the follower wheel 222 can be located, for example, at an upper position of the inclined section 213 of the guide groove 211, or at a position corresponding to the adjustment section 214, so that the sealing conveyor 110 is located at a high position in the vertical direction, so that the outer peripheral portion of the sealing plate 11 abuts against and seals the step surface 224 between the first chamber 210 and the second chamber 220. By setting the vertical height of the wafer support 115 on the upper side of the sealing plate 11, the wafer 90 can be received by the wafer storage device 400 through the wafer receiving opening 221.

[0068] When the sealing conveyor 110 is located at the relay position, the follower wheel 222 can be located at the middle position of the inclined section 213, so that the sealing plate 11 is out of contact with the step surface 224 and moves downward into the first chamber 210. By setting the vertical height of the relay position, the sealing conveyor 110 can correspond to the first transfer mechanism 70 at the relay position, so that the receiving part of the first transfer mechanism 70 can move below the wafer 90 carried by the sealing conveyor 110, or in another case, the receiving part of the first transfer mechanism 70 can transfer the wafer 90 from the third chamber 230 to the top of the sealing conveyor 110. In some embodiments, the driving member 22 can be a driving member with controllable output such as a stepping motor, so that by adjusting the output of the driving member 22, the guide plate 21 can stop after moving to the preset position and lock at the preset position. Therefore, by setting the preset position, the height of the sealing conveyor 110 at the relay position can be determined without making adaptive modifications to the guide plate structure for the relay position.

[0069] Furthermore, when the sealing conveyor 110 is located at the position corresponding to the first chamber, the follower wheel 222 can be located at the lower side of the inclined section 213, so that the sealing conveyor 110 is located at a low position along the vertical direction. If the sealing conveyor 110 is loaded with a wafer 90 when it is at the relay position, the wafer 90 is out of contact with the sealing conveyor 110 during the process of moving to the position corresponding to the first chamber, and is supported by the receiving portion of the first transfer mechanism 70, so that it can be transferred to the inside of the third chamber 230.

[0070] See also Fig.10a and Fig.10b , Fig.10a A top view of a combination of a first transfer mechanism, a second transfer mechanism, and a device for wafer transfer of a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein the wafer is placed on the upper side of the second transfer mechanism; Fig.10bA top view of a combination of a first transfer mechanism, a second transfer mechanism, and a device for wafer transfer in a system for wafer transfer according to some embodiments of the present disclosure is shown, wherein the wafer has been transferred to the upper side of a sealed transfer device by the second transfer mechanism.

[0071] In some embodiments, the system for wafer transfer further includes a second transfer mechanism 80, which is disposed in the third chamber 230, and is used to receive and transfer the wafer 90 transferred by the first transfer mechanism 70, and further move the wafer 90 to, for example, a processing position or a detection position. The second transfer mechanism 80, for example, may include a wafer transfer table driven by a driving device, and a plurality of wafer supports 115 may be provided on the wafer transfer table to stably support the wafer placed thereon. At the same time, the second transfer mechanism 80, for example, may include a lifting mechanism, which is used to drive the wafer transfer table to move between the preparation position and the receiving position. For example, when in the preparation position, the lifting mechanism falls, so that the receiving part carrying the wafer can move to the top of the wafer transfer table, and when in the receiving position, the wafer transfer table is lifted by the lifting mechanism, and the wafer on the receiving part is lifted by the wafer support mechanism on the wafer transfer table, and the receiving part can be moved away from under the wafer, and the second transfer mechanism 80 then transfers the wafer to the next position.

[0072] In some embodiments, the first transfer mechanism 70 may include a rotating mechanism (not shown) and a receiving portion. For example, the first transfer mechanism 70 may include a rotating shaft, one end of which is vertically downward and connected to the rotating mechanism, and the other end of the rotating shaft is connected to two oppositely arranged receiving portions, and the two receiving portions extend in opposite directions to each other. The rotating mechanism can drive the rotating shaft to rotate, and then drive the two receiving portions to rotate to the target position at a predetermined angle to receive the wafer. When one receiving portion is aligned with the wafer transfer stage, the other receiving portion can extend into the transfer window 231 and align with the wafer to be received above the sealing conveying device 110. In some embodiments, the receiving portion can be roughly sheet-shaped, and each receiving portion is provided with an avoidance groove for avoiding the wafer support 115 on the side, so that the receiving portion can be rotated to the bottom of the wafer to stably receive the wafer.

[0073] Fig.11 FIG. 9 is an exemplary flow chart of a method 900 for wafer transfer according to some embodiments of the present disclosure. It can be understood that the method can be combined with the above. Figure 8 The described system for wafer transfer is performed.

[0074] like Fig.11As shown in, in step S901, the sealed conveyor 110 is located at the corresponding position of the second chamber, and the wafer storage device 400 delivers the wafer to the second chamber 220 of the equipment through the wafer transfer port 410, and the wafer is carried by the sealed conveyor 110. In step S902, the vacuum assembly 30 evacuates the second chamber 220, and the sealed conveyor 110 transfers the wafer 90 to the relay position for waiting, and the relay position is located between the corresponding position of the first chamber and the corresponding position of the second chamber; in step S903, the first transfer mechanism 70 extends into the transfer window 231 to receive the wafer; in step S904, the sealed conveyor 110 moves to the corresponding position of the first chamber, and the first transfer mechanism 70 receives the wafer; in step S905, the first transfer mechanism 70 carries the wafer and moves it out of the transfer window 231.

[0075] It is understandable that, according to different application scenarios, the above method may also include additional steps, alternative steps or modified steps. Figures 9a to 10b Exemplary specific steps of a method for wafer transfer according to some embodiments of the present disclosure are described.

[0076] In some embodiments, when the processing device 200 includes a sealing gate valve 223 for sealing and isolating the wafer receiving opening 221 of the device from the outside, before step 1, that is, before the wafer storage device 400 sends the wafer 90 to the second chamber 220 of the processing device 200, the sealing gate valve 223 can be opened. At this time, the second chamber 220 can be filled with a protective gas such as nitrogen, and its gas pressure can be equal to the outside, such as standard atmospheric pressure, and the sealing gate valve 223 can be opened normally. At this time, the sealing conveying device 110 is located at the corresponding position of the second chamber, the sealing plate 11 closes the first vacuum opening 111, the first transfer mechanism 70 is located at the initial position, and the two receiving parts of the first transfer mechanism 70 are both located in the third chamber 230.

[0077] After step S901, that is, after the wafer 90 is transferred to the corresponding position of the second chamber, the sealing gate valve 223 can be closed to seal the second chamber 220 relative to the outside of the equipment. In some embodiments, when the equipment for wafer transfer includes a rough pumping component and a fine pumping component, the first valve plate 31 can be driven to move to open the first vacuum opening 111, and the rough pumping component 33 can be started to perform preliminary vacuum pumping on the second chamber 220, for example, to make the air pressure in the second chamber 220 reach 10Pa. Furthermore, in some embodiments, after the air pressure in the second chamber 220 reaches 10Pa, a further vacuum pumping step can be set, such as driving the second valve plate 32 to move and opening the second vacuum opening 112. And the fine pumping component 34 is started to further reduce the pressure of the second chamber 220, so that the air pressure in the second chamber 220 is reduced to 10 －3 Pa.

[0078] The pressure in the second chamber 220 is reduced to 10 －3 After Pa, the pressure between the vacuum first chamber 210 and the second chamber 220 is almost balanced, so that the next action in step S902 can be performed, that is, the wafer 90 is transferred to the relay position to wait. Figure 9b , that is, the sealing conveyor 110 conveys the wafer 90 to the relay position for waiting, and the relay position is located between the corresponding position of the first chamber and the corresponding position of the second chamber. By setting the height of the relay position, the upper surface of the carrying table of the sealing conveyor 110 for carrying the wafer can be at least partially lower than the transfer window 231 in the vertical direction, so that the transfer window 231 is at least partially aligned with the first chamber 210.

[0079] After step S902, that is, after the wafer 90 is moved to the relay position, step S903 may be performed. When the first transfer mechanism 70 of the device 100 for wafer transfer includes a rotating mechanism for sealing and isolating the device from the outside and a receiving part driven to rotate by the rotating mechanism, the receiving part may be driven to rotate into the first chamber 210 by the rotating mechanism. Fig.10b , that is, the rotating mechanism of the first transfer mechanism 70 is swung, for example, the receiving portion of the first transfer mechanism 70 is rotated 90° to enter the transfer window 231. At this time, the receiving portion of the first transfer mechanism 70 can be moved vertically below the wafer.

[0080] After step S903, step S904 may be performed, that is, the sealing and conveying device 110 is moved to a position corresponding to the first chamber (see Fig.9c The wafer is then removed from the receiving portion of the first transfer mechanism 70 and the wafer is received by the receiving portion of the first transfer mechanism 70. At this time, the wafer is out of contact with the wafer support member on the carrier plate of the sealing conveyor 110 and is carried by the receiving portion of the first transfer mechanism 70.

[0081] After step S904 , step S905 may be executed, that is, the rotating mechanism of the first transfer mechanism 70 drives the receiving portion to rotate, so that the first transfer mechanism 70 carries the wafer and moves it out of the transfer window 231 .

[0082] In addition, when the guide groove 211 of the driving assembly includes an adjustment section 214, an additional step S906 may be included before or at the same time as step S901. Before moving the sealing plate 11 to the corresponding position of the second chamber, the follower wheel 222 of the transmission assembly may be moved to the adjustment section 214, and the height of the sealing plate 11 may be fine-tuned by means of the contact between the adjustment section 214 and the follower wheel 222, so as to obtain an ideal sealing effect.

[0083] In some embodiments, the device 100 for wafer transfer includes a second transfer mechanism 80, and the first transfer mechanism 70 of the device includes a plurality of receiving parts, and when one receiving part is aligned with the wafer transfer table, another receiving part can extend into the transfer window 231 and align with the wafer to be received on the carrier. In this case, an additional step S907 may be included before or at the same time as step S905. When there is a wafer that needs to be sent out on the second transfer mechanism 80, before the first transfer mechanism 70 carries the wafer out of the transfer window 231 through step S905, the wafer transfer table of the second transfer mechanism 80 can move the wafer 90 from the receiving position to the preparatory position, so that the wafer is carried on the receiving part of the first transfer mechanism 70 facing the third chamber 230. Then, in step S905, the wafer carried on the other receiving part will be transferred to the top of the sealing transfer device 110.

[0084] Furthermore, after step S905, an additional step S908 may be included, in which after the wafer to be sent out is transferred to the upper part of the sealing conveyor 110, the sealing conveyor 110 moves to the relay position, and the wafer support 115 provided on the upper side thereof lifts the wafer 90 to separate from the receiving part of the first transfer mechanism 70. At the same time, the wafer transfer table on the second transfer mechanism 80 is lifted from the preparation position to the receiving position, so that the wafer on one side of the third chamber 230 is also separated from the receiving part, and the receiving part can be rotated and retracted.

[0085] Furthermore, after step S906, an additional step S909 may be included. After the receiving portion is retracted, the sealing conveying device 110 is further moved to the corresponding position of the second chamber, and the second chamber 220 is sealed relative to the first chamber 210. At this time, the first vacuum opening 111, the second vacuum opening 112, the rough pumping assembly 33, and the fine pumping assembly 34 can be closed, and then, for example, the air pressure in the second chamber 220 is increased by the uniform air structure until it is consistent with the outside of the device, and the sealing gate valve 223 can be opened to allow the wafer storage device 400 to retrieve the wafer to be sent out.

[0086] It can be understood by those skilled in the art that, in some embodiments, the above-mentioned additional steps S907, S908, and S909 can actually be performed crosswise with steps S901-S905 in the manner described above. That is, in step S905, the wafer to be received and the wafer to be sent out are respectively arranged on the two receiving parts of the first transfer mechanism 70. And with the help of the drive of the rotating mechanism, the two receiving parts carrying the wafers can complete the movement and exchange of the positions of the two wafers through one rotation action, and in the subsequent action of the sealing conveying device, the wafer to be sent out is sent out according to the reverse sequence of the action of the sealing conveying device, so that the feeding and sending of the wafers can be carried out in parallel, which significantly improves the production efficiency. In addition, it can be understood that steps S907, S908, and S909 can also be operated independently of steps S901-S905 to be used for unidirectional discharge of the remaining wafers in the processing or detection device. It is understandable that the present disclosure does not limit the order and number of executions of the multiple steps described above, and the specific steps to be adopted and the way in which they are combined shall be based on their ability to meet specific functional requirements.

[0087] Although multiple embodiments of the present disclosure have been shown and described herein, it is apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art may think of many changes, modifications, and alternatives without departing from the thought and spirit of the present disclosure. It should be understood that in the process of practicing the present disclosure, various alternatives to some embodiments of the present disclosure described herein may be adopted. The attached claims are intended to define the scope of protection of the present disclosure, and therefore cover equivalents or alternatives within the scope of these claims.

Claims

1. A device for wafer transfer, characterized in that: The device is used for transferring a wafer (90) between a first chamber (210) and a second chamber (220) of a processing device (200), and the device comprises: A sealing assembly (10), comprising a sealing conveying device (110) and a connecting assembly fixedly connected to a processing device (200), the connecting assembly comprising a connecting plate (12), the conveying assembly comprising a sealing plate (11) spaced apart from the connecting plate (12) in a vertical direction, the conveying assembly being able to move relative to the connecting assembly in a vertical direction to convey a wafer (90) and to seal a second chamber (220) relative to a first chamber (210), the sealing plate (11) being provided with a first vacuum opening (111) and a second vacuum opening (112) penetrating the plate surface, and the connecting plate (12) being provided with a first vacuum pipe opening and a second vacuum pipe opening penetrating the plate surface; A driving mechanism (20), comprising a driving component and a transmission component, wherein the transmission component is limited relative to the processing device (200) along a first horizontal direction and is fixedly connected to the sealing plate (11), wherein the driving component has a driving inclined surface inclined from the first horizontal direction toward the vertical direction, and the driving component and the transmission component abut against each other at the driving inclined surface, so that the movement of the driving component along the first horizontal direction drives the transmission component to move vertically; A vacuum assembly (30) comprises a first vacuum assembly and a second vacuum assembly, wherein the first vacuum assembly comprises a rough pumping assembly (33) connected to a first vacuum opening (111) on a sealing plate (11), and a first valve plate assembly for sealing the first vacuum opening (111), and the second vacuum assembly comprises a fine pumping assembly (34) connected to a second vacuum opening (112), and a second valve plate assembly for sealing the second vacuum opening (112).

2. The device according to claim 1, characterized in that The driving assembly comprises a driving member (22) and a guide plate (21) driven by the driving member (22) to move along a first horizontal direction, the transmission assembly comprises a follower wheel (222), the guide plate (21) is provided with a guide groove (211) which is inclined from the first horizontal direction to the vertical direction and cooperates with the follower wheel (222), and the guide groove (211) is used to drive the follower wheel (222) to move along the vertical direction when the guide plate (21) moves along the first horizontal direction.

3. The device according to claim 2, characterized in that The connecting plate (12) is provided with a plurality of transmission through holes, the transmission assembly comprises a relay (23) and a plurality of transmission rods (24), the follower wheel (222) is provided on the side of the relay (23), one end of the plurality of transmission rods (24) is fixedly connected to the relay (23), and the other end passes through the transmission through hole and is fixedly connected to the sealing plate (11).

4. The device according to claim 3, characterized in that The sealing plate (11) includes a plurality of sealing rod holes 118 penetrating the plate surface, the first valve plate assembly includes a first valve plate (31) and a plurality of sealing rods (351) fixedly connected to the first valve plate (31), the second valve plate assembly includes a second valve plate (32) and a plurality of sealing rods (351) fixedly connected to the second valve plate (32), the plurality of transmission rods (24) each include a sealing through hole (242) penetrating along the axial direction, the plurality of sealing rods (351) are respectively penetrated in the sealing through hole (242) of the corresponding transmission rod (24), and respectively penetrate through the sealing rod holes (118) on the sealing plate (11) to be fixedly connected to the first valve plate (31) and the second valve plate (32).

5. The device according to claim 4, characterized in that The first valve plate assembly and the second valve plate assembly also include a plurality of single-acting cylinders (35) arranged in a vertical direction, and a compression spring (353) fixedly arranged at the protruding end of the single-acting cylinder (35), the fixed portion (359) of the single-acting cylinder (35) is fixedly connected to the relay (23), and the upper ends of the plurality of compression springs (353) are respectively abutted against the bottom of the transmission rod (24) in the vertical direction.

6. The device according to claim 5, characterized in that The vacuum assembly (30) also includes a limit bracket (36) fixedly connected to the relay (23), and the limit bracket (36) includes a limit block (366) extending in the vertical direction. The first valve plate assembly and the second valve plate assembly each include two single-acting cylinders (35) for driving the valve plate to move. The two corresponding protruding ends (358) of the single-acting cylinders (35) of the first valve plate assembly are fixedly connected to the first synchronous bracket (368), and the two corresponding protruding ends (358) of the single-acting cylinders (35) of the second valve plate assembly are fixedly connected to the second synchronous bracket (369). A buffer spring (365) is provided between the first synchronous bracket (368) and the second synchronous bracket (369) and the limit bracket (36), and the limit block (366) limits the first synchronous bracket (368) and the second synchronous bracket (369) in the vertical direction.

7. The device according to claim 6, characterized in that The sealing assembly (10) further comprises a plurality of bellows, one end of the bellows being fully welded to the upper surface of the connecting plate (12), and the other end being fully welded to the lower surface of the sealing plate (11), and the bellows being arranged correspondingly to the transmission through hole and the sealing rod hole (118), the first vacuum opening (111) and the first vacuum pipe port, and the second vacuum opening (112) and the second vacuum pipe port, so as to surround and seal them.

8. A system for wafer transfer, characterized in that: include: A wafer storage device (400) for storing, sending out and receiving the wafer (90); A first transfer mechanism (70) for transferring a wafer (90) between a second chamber (220) and a third chamber (230) of a processing device (200); and The device for wafer transfer according to any one of claims 1 to 7, which is used to at least perform the following operations: receiving a wafer (90) sent from the wafer storage device (400); transferring the wafer (90) between the first chamber (210) and the second chamber (220) through the sealing assembly (10); and The wafer (90) is transferred between the second chamber (220) and the third chamber (230) by the first transfer mechanism (70).

9. A method for wafer transfer using the system according to claim 8, characterized in that: include: The sealing component (10) is located at a corresponding position of the second chamber (220), and the wafer storage device (400) sends the wafer (90) to the second chamber (220), and the wafer is carried by the sealing component (10); The sealing component (10) evacuates the second chamber (220) and transfers the wafer (90) to a relay position for waiting; The first transfer mechanism (70) extends into a transfer window (231) connecting the second chamber (220) and the third chamber (230), and moves to below the wafer (90); The sealing assembly (10) is moved to a corresponding position of the first chamber (210), and the first transfer mechanism (70) receives the wafer (90); and The first transfer mechanism (70) carries the wafer (90) and moves it out of the transfer window (231).

10. The method according to claim 9, characterized in that The method further comprises: Instructing the first transfer mechanism (70) to carry the wafer (90) to be transferred out to move from the transfer window (231) into the first chamber (210); The sealing component (10) is moved from a corresponding position of the first chamber (210) to a relay position, and receives the wafer (90) to be sent out; moving the first transfer mechanism (70) out of the transfer window (231); and The sealing component (10) is moved from the relay position to a corresponding position of the second chamber (220), and the wafer storage device (400) moves the wafer (90) to be sent out from the second chamber (220).

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