Thermal control system for mesh network device and associated mesh network device

Abstract

The invention discloses a thermal control system of a mesh network device and an associated mesh network device. This document describes a thermal control system (110) and an associated mesh network device that can be integrated into a mesh network device (102). The thermal control system (110) may include a heat sink (112), a plurality of fins (114, 118), and a thermal barrier (116) such that heat (106) originating from an IC device filling a printed circuit board (104) of the mesh network device (102) may be transferred to a housing assembly (108) of the mesh network device (102) for external dissipation to maintain a desired heat distribution of the mesh network device (102).

Description

Description of the case

[0001] This application is a divisional application of Chinese invention patent application 202080070310.4, with a filing date of October 8, 2020. Technical Field

[0002] The present disclosure relates to thermal control systems for mesh network devices and associated mesh network devices. Background Art

[0003] A mesh network is a network that includes multiple nodes linked together to improve network performance and network accessibility. As an example, a mesh network that supports a wireless local area network (WLAN) may include multiple wireless nodes linked together across an area. Each wireless node, or mesh network device, can provide access to the WLAN to wireless devices and exchange network information with other mesh network devices. In general, the aggregation function of the multiple mesh network devices improves connectivity with the WLAN across the area and improves the efficiency of data exchange.

[0004] In some cases, the mesh network device may be a range extension mesh network device. The mesh network device may be small in size and include multiple electronic subsystems that generate heat. Examples of such electronic subsystems include a printed circuit board (PCB) populated with various integrated circuit (IC) devices.

[0005] To dissipate heat from the electronic subsystem and avoid degradation of the electronic subsystem, a thermal control system may be used. The design and architecture of an efficient and effective thermal control system that maintains a small size presents multiple challenges. Summary of the invention

[0006] This document describes a thermal control system integrated into a mesh network device and an associated mesh network device. The thermal control system may include a heat sink, a plurality of heat spreaders, and a thermal barrier so that heat originating from an IC device (which populates a PCB of the mesh network device) can be transferred to a housing assembly of the mesh network device for external dissipation, thereby maintaining a desired thermal profile of the mesh network device.

[0007] In some aspects, a device is described. The device includes a PCB populated with one or more IC devices and generally circular about a central axis. The device further includes a thermal control system to transfer heat generated by the one or more IC devices to a housing assembly of the device for external dissipation. The thermal control system includes a heat sink that is generally cylindrical and centered on the central axis. The heat sink includes an inner disk-shaped body that is substantially orthogonal to the central axis and is in thermal contact with at least one of the IC devices. The thermal control system also includes (i) a first heat sink that is generally planar and attached to a first surface of the inner disk-shaped body; and (ii) a thermal barrier that faces a second opposite surface of the inner disk-shaped body.

[0008] In other aspects, an apparatus is described. The apparatus includes a housing assembly having an interior cavity region that is generally concave and symmetrical about a central axis. The apparatus further includes a thermal control system configured to be positioned within the housing assembly and to transfer heat generated by one or more IC devices to the housing assembly for external dissipation.

[0009] The thermal control system includes a heat sink that is generally cylindrical and centered about a central axis and includes a disk-shaped body. The disk-shaped body is substantially orthogonal to the central axis, includes a first surface facing an internal cavity area of ​​the housing assembly, and is in thermal contact with at least one of the one or more IC devices. The thermal control system also includes a fan mechanism located between the internal cavity area and the first surface of the heat sink. The fan mechanism has one or more blades that rotate about the central axis. The thermal control system also includes a heat sink that (i) is generally planar, (ii) is attached to the first surface of the heat sink, and (iii) is located between the one or more blades and the first surface of the heat sink.

[0010] The details of one or more implementations are set forth in the accompanying drawings and the following description. Other features and advantages will be apparent from the description, drawings, and claims. This Summary is provided to introduce the subject matter that is further described in the Detailed Description and the drawings. Thus, the reader should not view this Summary as describing essential features, nor as limiting the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The following describes details of one or more aspects of a thermal control system for a mesh network device and associated mesh network devices. The same reference numerals may be used in different instances of the description and drawings to indicate the same elements:

[0012] Figure 1 Example details including a front isometric view and an exploded view of the mesh network device 102 are shown.

[0013] Figure 2 An exploded isometric view of an example heat sink that may be included in a thermal control system of a mesh network device is shown.

[0014] Figure 3 An exploded isometric view of a heat sink and thermal barrier that may be included in a thermal control system for a mesh network device is shown.

[0015] Figure 4 A top plan view of an example PCB that may be included in a mesh network device is shown.

[0016] Figure 5 Shown from Figure 4 Bottom plan view of the example PCB.

[0017] Figure 6 An isometric cross-sectional view of an example mesh network device including a thermal control system according to one or more aspects is shown.

[0018] Figure 7 A side cross-sectional view of an example mesh network device including an example fan mechanism incorporated as part of a thermal control system is shown.

[0019] Figure 8 Another example heat transfer path that may be implemented by a thermal control system of a mesh network device is shown. DETAILED DESCRIPTION

[0020] This document describes a thermal control system integrated into a mesh network device. The architecture of the thermal control system allows heat to be conducted from the IC devices populating the PCB to other components, such as to the housing components of the mesh network device for dissipation, thereby maintaining a desired thermal profile of the mesh network device.

[0021] Heat transfer is energy that is generally transferred due to a temperature difference. If one or more temperature differences exist across components of a system (such as a mesh network device), heat (e.g., energy measured in Joules (J)) will be transferred from the higher temperature area to the lower temperature area to reduce the temperature difference. There are several mechanisms for heat transfer across system components to reduce the temperature difference, including convection, radiation, and conduction.

[0022] Convection, or the transfer of heat from a surface due to the movement of molecules within a fluid (such as gases and liquids), can be quantified by the following equation (1): (1)

[0023] For equation (1), q convis the rate at which heat is transferred from the surface by convection (e.g., in joules per second or watts (W)), and h is the convective heat transfer coefficient (e.g., in watts per square meter (W / m 2 ) as a unit), T s represents the surface temperature (for example, in Kelvin (K) or Celsius (ºC)), while T ∞ The term A represents the area of ​​the surface (e.g., in m 2 as units).

[0024] Radiation, or heat transfer from a surface by electromagnetic radiation, can be quantified by the following equation (2): (2)

[0025] For equation (2), q rad is the rate of heat transfer by radiation (e.g., in W), ɛ is the emissivity (dimensionless), and σ is the Stefen-Boltzmann constant (e.g., σ = 5.67 x 10 - 8 W / (m 2 ·K 4 ))、T s represents the temperature of the surface (e.g. in K or °C), while T surr The term A represents the area of ​​the surface (e.g., in m 2 as units).

[0026] Conduction, or the transfer of heat through a solid via the action of atoms and molecules, can be quantified by the following equation (3): (3)

[0027] For equation (3), q cond represents the rate of heat transfer by conduction in a solid material (e.g., in W), k represents the thermal conductivity of the solid material (e.g., in W / (m·K)), and dT / dx represents the temperature gradient through the solid material (e.g., in K / m or ºC / m). The term A represents the cross-sectional area of ​​the solid material (e.g., in m 2 as units).

[0028] In the case of heat transfer from one physical body to another, the physical bodies may be in thermal contact through one or more of a convective heat transfer mechanism, a radiative heat transfer mechanism, or a conductive heat transfer mechanism. In some cases, this may include direct physical contact between the bodies or between materials (e.g., thermal interface materials or TIMs) located between the bodies, thereby enabling conduction-based heat transfer between the bodies. In other cases, this may include an air gap between the bodies that enables convection-based and / or radiation-based heat transfer between the bodies.

[0029] The mesh network device may include a thermal control system that transfers heat using one or more of the above-described heat transfer mechanisms. In general, according to equations (1) and (2), the rate and / or amount of heat transfer can be changed by increasing or decreasing the surface area of ​​convection and / or radiation within the mesh network device (e.g., increasing or decreasing the surface area of ​​a planar heat sink). According to equation (3) and within the thermal control system of the mesh network device, the rate and / or amount of heat transfer can also be changed by introducing one or more TIMs having high thermal conductivity between surfaces.

[0030] Through conduction heat transfer mechanisms, convection heat transfer mechanisms, and radiation heat transfer mechanisms, as described and quantified by equations (1)-(3) above, the thermal control system can transfer heat originating from heat-generating electronic devices within the mesh network device to the interior surface of the housing assembly of the mesh network device. The exterior surface of the housing assembly can then dissipate the heat to the external environment through convection and / or radiation, effectively preventing degradation of electronic subsystems that may include heat-generating electronic devices.

[0031] While the features and concepts of the thermal control system may be implemented in any number of different environments, devices, and / or in various configurations, various aspects are described in the context of the following examples.

[0032] Figure 1 An example detail 100 is shown including a front isometric view and an exploded view of a mesh network device 102. The mesh network device 102 includes a plurality of electronic subsystems, including a PCB 104 populated with one or more IC devices. The mesh network device 102 can be used as a node of a wireless mesh network (e.g., a WLAN network conforming to the IEEE 802.11 communication protocol (Wi-Fi)). In general, the mesh network device 102 can wirelessly couple other wireless devices (e.g., wireless phones, laptops) to the wireless mesh network.

[0033] Typically, and when performing operations (eg, wirelessly coupling to other devices, transmitting data, etc.), the one or more IC devices populating PCB 104 may generate an internal heat load 106 (eg, q i, measured in W). To manage internal heat load 106 within mesh network device 102 (eg, to prevent thermal runaway or damage to electronic subsystems of mesh network device 102), internal heat load 106 may be dissipated externally by elements of mesh network device 102 (eg, housing assembly 108).

[0034] The thermal control system 110 may include multiple elements, including a heat sink 112 and heat sink fins 114. In addition, the thermal control system may include a thermal barrier 116 and a thermal barrier fin 118. In some cases, the thermal control system 110 may include additional features that facilitate heat transfer, such as one or more TIMs and / or fans. In addition, and depending on the configuration of the thermal control system 110, the portions of the internal heat load 106 that are transferred to the housing assembly 108 may vary.

[0035] The heat sink 112 may be substantially cylindrical in shape and die-cast from a metal material (e.g., an aluminum material, a magnesium material). The heat sink fins 114 may be substantially circular or elliptical in shape and substantially conform to the shape of the surface of the heat sink 112 to which the heat sink fins 114 are to be mounted. The heat sink fins 114 may also be substantially planar and formed from one or more sheets of graphite material.

[0036] The components of thermal control system 110 (eg, heat sink 112, heat sink fins 114, thermal barrier 116, thermal barrier fins 118) transfer the internal heat load 106 (eg, heat transfer rate q in Watts) to the heat sink 114. i ) is conducted, diffused, and transferred to the housing assembly 108 of the mesh network device 102. In some cases, the thermal barrier 116 can include a plastic material that blocks heat transfer to the base 120 of the mesh network device, forcing the heat to transfer to the housing assembly 108. The housing assembly 108 can then dissipate the internal heat load 106 (e.g., using a convective heat transfer mechanism and / or a radiative heat transfer mechanism) to the external environment.

[0037] In general, the thickness and / or length of one or more sidewalls of the housing assembly 108 and / or the base 120 may vary. Such variations in the sidewalls of the housing assembly and / or the base may alter the heat transfer characteristics of the thermal control system 110.

[0038] The thermal control system 110 further maintains a desired thermal profile for the mesh network device 102. As an example, with the mesh network device 102 operating under an ambient condition of 25°C, the conduction, diffusion, and transfer of the internal heat load 106 by the thermal control system 110 may maintain the surface temperature of the housing assembly 108 at or below a temperature of approximately 67 degrees Celsius (°C). The thermal control system 110 may also maintain the junction temperature of the IC devices populating the PCB 104 at or below different respective temperature thresholds.

[0039] Figure 2 An isometric view of heat sink 112 and heat sink fins 114 is shown. In some cases, heat sink 112 and heat sink fins can be used as mesh network devices (e.g., Figure 1 The mesh network device 102 is included as a part of the mesh network device 102.

[0040] As shown, the heat sink 112 includes a body 202 that is generally disk-shaped (e.g., a middle region of the heat sink 112) and radially extends from a central axis 204 to define a perimeter. The body 202 includes a first surface 206 (located at a position substantially orthogonal to the central axis 204). Figure 2 The first surface 206 may be substantially planar.

[0041] Heat sink fins 114 may be attached to first surface 206 of body 202 (e.g., using thermally conductive epoxy). Further, heat sink fins 114 may be coaxially positioned with heat sink 112 according to central axis 204. In some cases, heat sink fins 114 may include holes, cutouts, and / or reliefs to avoid interfering with features that may be included as part of first surface 206.

[0042] In some cases, the heat sink fins 114 may use a conductive heat transfer mechanism to spread and transfer heat to the body 202. In other cases, the heat sink fins 114 may use a convective heat transfer mechanism and / or a radiative heat transfer mechanism to spread and transfer heat to the surrounding environment (e.g., Figure 1 For example, the heat sink fins 114 can spread and transfer heat in a generally outward direction away from the first surface 206 of the body 202 of the heat sink 112.

[0043] Heat sink fin 114 may include one or more sheets of thermally conductive material (e.g., multiple layers), such as a graphite material. Heat sink fin 114 may also include a pressure sensitive adhesive (PSA) material. In addition, different types of materials may be selected to increase or decrease emissivity ( ) and change the radiation characteristics of the heat sink 114.

[0044] Heat sink 112 may include one or more fin regions 208. Each fin region 208 may extend from the perimeter of body 202 in one or more directions substantially parallel to central axis 204. In addition, each fin region 208 may include an interior surface 210 and an opposing exterior surface 212. In some cases, each fin region 208 may transfer heat to the surrounding environment (e.g., to the heat source) using one or more of a conductive heat transfer mechanism, a convective heat transfer mechanism, and / or a radiative heat transfer mechanism. Figure 1 housing assembly 108, or to an internal cavity area within housing assembly 108).

[0045] The heat sink may also include a second surface 214 (at Figure 2 2. In general, second surface 214 may be substantially planar and opposite first surface 206. In some cases, second surface 214 may include one or more pedestals (protrusions) that facilitate establishing thermal contact with a heat generating device such as an IC device.

[0046] Figure 3 A thermal control system that can be used as a mesh network device (e.g., Figure 1 An exploded isometric view 300 of a thermal barrier 116 and a thermal barrier heat sink 118 as part of a thermal control system 110 of a mesh network device 102. Figure 3 Also shown in FIG. 1 is PCB 104. In some cases, the shape of PCB 104 can be generally circular or oval. PCB 104 can also be generally symmetrical about central axis 204.

[0047] As shown, PCB 104 may include multiple IC devices (e.g., as an example, SoC IC device 302 is identified). In some cases, a corresponding TIM (e.g., TIM 304) may be located on a base that may be included as part of a heat sink (e.g., may be provided from the PCB 104). Figure 1 As an example, the TIM 304 may be located between the SoC IC device 302 and the corresponding base of the heat sink 112 ( Figure 3 ) to create thermal contact between the SoC IC device 302 and the heat sink.

[0048] Typically, the PCB 104 may include multiple IC devices with multiple TIMs. Typically, the multiple corresponding TIMs may reduce air gaps and / or bond wire gaps to provide a thermal conduction path between the multiple IC devices and the heat sink. In some cases, one or more of the multiple corresponding TIMs may include a thermally conductive pad material. In other cases, one or more of the multiple corresponding TIMs may include a thermally conductive gel material or a thermally conductive grease material.

[0049] Electromagnetic interference (EMI) shield 306 may surround one or more of the plurality of IC devices included on PCB 104. In some cases, EMI shield 306 may be located between thermally conductive foam 308 and PCB 104. Thermally conductive foam 308 may be configured to engage with a surface or base of a heat sink. Thus, thermally conductive foam 308 creates thermal contact between EMI shield 306 and the heat sink in thermal contact.

[0050] As shown, thermal barrier heat sink 118 may be located between thermal barrier 116 and PCB 104, including IC devices that may populate PCB 104. In some cases, a TIM (e.g., thermally conductive gel material, thermally conductive grease material) may be located between thermal barrier heat sink 118 and PCB 104.

[0051] The thermal barrier heat sink 118 may include a substantially straight edge 310 that, when assembled into a mesh network device (e.g., Figure 1 When the straight edge 310 is a portion of the mesh network device 102 of the embodiment of the present invention, the straight edge is parallel to the straight edge 312 of the thermal barrier 116. The straight edge 310 can allow spacing within the mesh network device for other components or features (such as one or more Ethernet ports 314) that can be mounted to the PCB 104. The Ethernet port(s) 314 can extend from the PCB 104 and in a direction substantially parallel to the central axis 204.

[0052] Figure 4 An example PCB that may be included in a mesh network device (e.g., Figure 1400 of a top plan view of a PCB 104 of a mesh network device. PCB 104 may be a multi-layer PCB including a glass reinforced epoxy laminate material (e.g., FR-4) and multiple layers of conductive traces. PCB 104 may also be a "double-sided" PCB, where different IC devices may be mounted to opposite surfaces of PCB 104 using surface mount (SMT) soldering techniques. In some cases, traces within multiple layers of PCB 104 may include conductive materials. For example, traces within multiple layers of PCB 104 may include copper materials. PCB 104 may also include one or more ground planes (e.g., copper ground planes), each of which may absorb, spread, and transfer heat within PCB 104.

[0053] A first surface (eg, first surface 402) of PCB 104 may be populated with a first set of IC devices 404. First surface 402 may face a heat sink (eg, Figure 1 The first group of IC devices 404 may include, for example, one or more memory IC devices, such as double data rate dynamic random access memory (DDR DRAM) devices. In some cases, the first group of IC devices 404 may also include Figure 3 The first group of IC devices 404 may also include an embedded multimedia card (eMMC) IC device. In some cases, the EMI barrier (e.g., Figure 3 EMI shield) can surround one or more planar regions 406 of the first surface 402 containing one or more of the first set of IC devices 404. In some cases, a corresponding TIM (e.g., Figure 3 One or more of the TIMs 304) may be located in the first group of IC devices 404 and one or more of the heat sinks (e.g., included in Figure 1 between the first set of IC 404 devices and the heat sink 112), creating thermal contact between the first set of IC 404 devices and the heat sink.

[0054] Each of the first set of IC devices 404 can be electrically connected to the PCB 104 using solder connections produced by surface mount (SMT) manufacturing techniques. Generally, the first set of IC devices 404 that populate the first surface 402 of the PCB 104 can facilitate mesh network devices (e.g., Figure 1 The heat load within the mesh network device 102 (e.g., Figure 1 internal heat load 106).

[0055] Figure 5 Shown from Figure 4 A PCB that may be included in a mesh network device (e.g., Figure 1A bottom plan view 500 of a PCB 104 of a mesh network device 102 is shown. A second surface of the PCB 104 (eg, Figure 4 The second surface 502 opposite the first surface 402 may face a thermal barrier (eg, Figure 1 The thermal barrier 116 of the mesh network device 102).

[0056] The second surface 502 of the PCB 104 may be populated with a second set of IC devices 504. Examples of the second set of IC devices 504 include front end module (FEM) IC devices (e.g., 5 GHz FEM) and radio frequency (RF) IC devices (e.g., 5 GHz RF) that may be associated with wireless communications for a wireless local area network (WLAN).

[0057] In some cases, one or more of the second set of IC devices 504 may be coupled to a heat sink (e.g., Figure 1 The heatsink 118 may be in thermal contact with the thermal barrier of the second group of IC devices 504. In some cases, a TIM (eg, thermal grease, thermally conductive gel) may be located between one or more of the second group of IC devices 504 and the heatsink.

[0058] Each of the second set of IC devices 504 can be electrically connected to the PCB 104 using solder connections produced by SMT manufacturing techniques. In general, the second set of IC devices 404 that populate the second surface 502 of the PCB 104 may facilitate mesh network devices (e.g., Figure 1 The heat load within the mesh network device 102 (e.g., Figure 1 internal heat load 106).

[0059] Figure 6 An isometric cross-sectional view 600 of a mesh network device 102 is shown according to one or more aspects. The mesh network device 102 includes a thermal control system (e.g., Figure 1 The components of the thermal control system 110 include a heat sink 112, a heat sink fin 114, a thermal barrier 116, and a thermal barrier fin 118.

[0060] As shown, the PCB 104 is located between the heat sink 112 and the thermal barrier 116. A first surface 402 of the PCB 104 faces the heat sink 112, while a second surface 502 of the PCB 104 faces the thermal barrier 116.

[0061] exist Figure 6204. The housing assembly 108 is also shown in FIG. In some aspects, the housing assembly 108 can serve as a radome for one or more antennas 602 located in the interior cavity region 604. In some cases, the one or more antennas 602 can extend substantially parallel to the central axis 204. The heat sink fin 114 can include a layer of polyethylene terephthalate (PET) film having high emissivity properties to efficiently transfer heat (e.g., radiated heat) to the interior cavity region 604.

[0062] Additionally, and in some cases, the air gap region 606 can separate the perimeter surface of the heat sink 112 from the complementary interior surface of the housing assembly 108. The air gap region 606 can also separate the interior surface of the housing assembly 108 from the exterior surface of the fin region that can be part of the heat sink 112 (e.g., Figure 2 In some cases, the air gap region 606 may have a nominal size measured between approximately 0.5 millimeters (mm) and 2.0 mm, effectively “tuning” the thermal convection and / or thermal radiation heat transfer characteristics between the heat sink 112 and the housing assembly 108 .

[0063] Figure 7 The invention is shown to include a thermal control system (e.g., Figure 1 1 ). In general, the fan mechanism 702 may include one or more blades 704 configured to rotate about the central axis 204. In some cases, the one or more blades 704 may be located between the interior cavity region 604 and the first surface 206 of the heat sink 112. In addition, the heat sink (e.g., Figure 1 The heat sink 114 of the heat sink 112 can be located between the first surface 206 of the heat sink 112 and the one or more blades 704. The fan mechanism 702 can circulate air within the interior cavity area 604 when activated. In some cases, the circulation of air within the interior cavity area 604 can improve the convective heat transfer mechanism characteristics within the mesh network device 102.

[0064] Figure 8 An example detail 800 of a heat transfer path within an example mesh network device 102 is shown. The example detail 800 includes several instances of an isometric cross-sectional view of the mesh network device 102, including instances 802, 804, and 806.

[0065] Figure 8 The top view of the example 802 shows that the example 802 includes a first heat transfer path 808 that allows a portion of the internal heat load (e.g., from the filling Figure 1A portion of the internal heat load 106 of the multiple IC devices of the PCB 104 is transferred through the heat sink 112. As shown, the first heat transfer path 808 can transfer a portion of the internal heat load to the heat sink 112 using a conductive heat transfer mechanism, a convective heat transfer mechanism, and / or a radiative heat transfer mechanism. The heat sink 112 can then transfer the heat laterally relative to the central axis to the housing assembly 108 using a convective heat transfer mechanism, a conductive heat transfer mechanism, and / or a radiative heat transfer mechanism. The housing assembly 108 can then transfer the heat received through the first heat transfer path 808 to the surrounding environment using a convective heat transfer mechanism and / or a radiative heat transfer mechanism.

[0066] Figure 8 The middle view of FIG. 8 provides an enlarged view 810 of the example 804 within the mesh network device 102. As shown, the second heat transfer path 812 transfers another portion of the internal heat load to the heat sink 112 using a conductive heat transfer mechanism. As part of the second heat transfer path 812, the TIM 304 transfers heat from one of the one or more IC devices 404 to the base of the heat sink 112 using thermal conduction. The heat transferred through the second heat transfer path 812 can be "combined" with the heat of the first heat transfer path 808 to be transferred to the surrounding environment through the housing assembly 108.

[0067] Figure 8 The bottom view of the PCB 104 provides an example 806. The third heat transfer path 814 can transfer another portion of the internal heat load (e.g., another portion of the internal heat load 106 originating from the plurality of IC devices populating the PCB 104) to the housing assembly 108 using a convective heat transfer mechanism and / or a radiative heat transfer mechanism. The third heat transfer path 814 including the heat sink fins 114 can transfer heat to the interior cavity region 604 using a convective heat transfer mechanism and / or a radiative heat transfer mechanism. The housing assembly 108 can transfer heat received through the third heat transfer path 814 to the surrounding environment using a convective heat transfer mechanism and / or a thermal heat-transfer mechanism.

[0068] Several examples are described in the following paragraphs.

[0069] Example 1: A device comprises: a printed circuit board, which is generally circular around a central axis and is populated with one or more integrated circuit devices; a thermal control system, which is used to transfer heat generated by the one or more integrated circuit devices to a housing assembly of the device for external dissipation, the thermal control system comprising: a heat sink, which is generally cylindrical and centered on the central axis, the heat sink comprising an inner disk-shaped body, which is substantially orthogonal to the central axis and is in thermal contact with at least one of the one or more integrated circuit devices; a first heat sink, which is generally planar and attached to a first surface of the inner disk-shaped body; and a thermal barrier, which faces a second surface of the inner disk-shaped body, the second surface being opposite to the first surface.

[0070] Example 2: The device of Example 1, wherein the printed circuit board is located between the thermal barrier and the second surface of the inner disk-shaped body.

[0071] Example 3, a device according to Example 1 or 2, wherein a second heat sink is located between the thermal barrier and the printed circuit board.

[0072] Example 4: The apparatus of Example 3, wherein a thermal interface material is located between the second heat sink and the printed circuit board.

[0073] Example 5: The device of any one of Examples 1 to 4, wherein the first surface of the inner disc-shaped body faces an inner cavity region of a housing component of the device.

[0074] Example 6: The device according to Example 5 further includes one or more antennas, wherein the one or more antennas are located in the internal cavity area, and each of the one or more antennas extends in a direction substantially parallel to the central axis.

[0075] Example 7: The apparatus of any one of Examples 1 to 6, wherein: the heat sink includes a peripheral surface; and the peripheral surface of the heat sink is separated from a complementary interior surface of the housing assembly.

[0076] Example 8: The device of any one of Examples 1 to 7, wherein the first heat sink comprises a high-emissivity polyethylene terephthalate film.

[0077] Example 9: The apparatus of any of Examples 1 to 8, further comprising a thermal interface material between at least one of the one or more integrated circuit devices and the heat sink.

[0078] Example 10: The device of any of Examples 1 to 9, wherein the thermal barrier comprises a substantially straight edge.

[0079] Example 11: A device, comprising: a housing assembly, the housing assembly including an internal cavity area, the internal cavity area being generally concave and symmetrical about a central axis; a thermal control system, the thermal control system being within the housing assembly, the thermal control system being configured to transfer heat generated by one or more integrated circuit devices to the housing assembly of the device for external dissipation, the thermal control system comprising: a heat sink, the heat sink being generally cylindrical and centered on the central axis, the heat sink comprising an internal disk-shaped body, the internal disk-shaped body being: substantially orthogonal to the central axis; including a first surface facing the internal cavity area; and being in thermal contact with at least one of the one or more integrated circuit devices; a fan mechanism, the fan mechanism being located between the first surface and the internal cavity area, the fan mechanism having one or more blades that rotate about the central axis; and a first heat sink, the first heat sink being: generally planar; attached to the first surface; and located between the one or more blades of the fan mechanism and the first surface of the heat sink.

[0080] Example 12: The device of Example 11, wherein the first heat sink comprises a high-emissivity polyethylene terephthalate film.

[0081] Example 13: A device according to Example 11 or 12, wherein the housing component accommodates one or more antennas within an internal cavity region of the device, and the one or more antennas extend in a direction substantially parallel to the central axis.

[0082] Example 14: The device of any one of Examples 11 to 13, further comprising a thermal barrier facing a second surface of the inner disk-shaped body, the second surface being opposite to the first surface.

[0083] Example 15: The apparatus of Example 14, further comprising a printed circuit board including the one or more integrated circuit devices, the printed circuit board being generally circular and positioned between the thermal barrier and the second surface of the inner disk-shaped body.

[0084] Although techniques and apparatus for a thermal control system for a mesh network device and associated mesh network devices have been described, it should be understood that the subject matter of the appended claims is not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed as example ways in which a thermal control system for a mesh network device and associated mesh network devices may be implemented.

Claims

1. A device, comprising: a printed circuit board populated with one or more integrated circuit devices; A thermal control system configured to transfer heat generated by the one or more integrated circuit devices to a housing assembly of the apparatus for external dissipation, the thermal control system comprising: a heat sink, the heat sink being generally cylindrical and centered about a central axis, the heat sink being in thermal contact with at least one of the one or more integrated circuit devices; a first heat sink attached to a first surface of the heat sink; and A thermal barrier faces a second surface of the heat sink, the second surface being opposite to the first surface.

2. The device according to claim 1, wherein: The printed circuit board is generally circular about the central axis; and The printed circuit board is located between the thermal barrier and the second surface of the heat sink.

3. The device according to claim 2, wherein: A second heat sink is located between the thermal barrier and the printed circuit board.

4. The device according to claim 3, wherein: A thermal interface material is located between the second heat sink and the printed circuit board.

5. The device according to claim 1, wherein: The heat sink includes an inner disc-shaped body substantially orthogonal to the central axis; The first surface of the heat sink faces an interior cavity region of the housing assembly of the device.

6. The apparatus of claim 5, further comprising one or more antennas located within the interior cavity region, each of the one or more antennas extending in a direction substantially parallel to the central axis.

7. The device according to claim 1, wherein: The heat sink includes a peripheral surface; and The peripheral surface of the heat sink is separated from a complementary interior surface of the housing assembly.

8. The device according to claim 1, wherein: The first heat sink includes a high emissivity polyethylene terephthalate film.

9. The apparatus of claim 1, further comprising a thermal interface material between at least one of the one or more integrated circuit devices and the heat sink.

10. The device according to claim 1, wherein: The thermal barrier comprises a plastic material.

11. An apparatus comprising: a housing assembly including an interior cavity region that is generally concave; A thermal control system configured to transfer heat generated by one or more integrated circuit devices to the housing assembly of the apparatus for external dissipation, the thermal control system comprising: A heat sink, the heat sink being generally cylindrical and centered on a central axis, the heat sink comprising a first surface facing the interior cavity region and in thermal contact with at least one of the one or more integrated circuit devices; a fan mechanism located between the first surface and the interior cavity region, the fan mechanism having one or more blades configured to rotate; and A first heat sink, wherein the first heat sink: attached to the first surface; and Located between the one or more blades of the fan mechanism and the first surface of the heat sink.

12. The device according to claim 11, wherein The heat sink includes an inner disk-shaped body substantially orthogonal to the central axis.

13. The device according to claim 11, wherein: The housing assembly houses one or more antennas within the interior cavity region of the device, the one or more antennas extending in a direction substantially parallel to the central axis.

14. The apparatus of claim 11, further comprising a thermal barrier facing a second surface of the inner disk-shaped body, the second surface being opposite the first surface.

15. The apparatus of claim 14, further comprising a printed circuit board including the one or more integrated circuit devices, the printed circuit board being generally circular and positioned between the thermal barrier and the second surface of the inner disk-shaped body.

16. The apparatus of claim 15, further comprising an electromagnetic interference barrier surrounding at least one of the one or more integrated circuit devices, the electromagnetic interference barrier being positioned between the printed circuit board and a thermally conductive foam, the thermally conductive foam being configured to create thermal contact between the electromagnetic interference barrier and the heat sink.

17. The device according to claim 15, wherein: A second heat sink is located between the thermal barrier and the printed circuit board.

18. The device according to claim 17, wherein: A thermal interface material is located between the second heat sink and the printed circuit board.

19. The device according to claim 18, wherein: The thermal barrier is configured to prevent heat transfer to the base and facilitate heat transfer to the housing assembly.

20. The device according to claim 19, wherein The fan mechanism is further configured to circulate air within the interior cavity region to increase convective heat transfer within the device.

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