Display panel, display module and display equipment

Abstract

The invention relates to the technical field of display panels, and particularly discloses a display panel, a display module and display equipment, and one side of an interlayer dielectric layer is provided with a display area; the dam is arranged on the interlayer dielectric layer and is arranged around the peripheral side of the display area; the metal layer group is arranged on one side of the interlayer dielectric layer, one end of the metal layer group is located in the display area, the other end of the metal layer group is located at the edge of the interlayer dielectric layer, and the metal layer group is located between the dam and the interlayer dielectric layer; the anti-etching layer is located between the dam and the edge of the interlayer dielectric layer, and the anti-etching layer covers partial areas of the two side walls of the metal layer group. The blocking dam formed at the position where the anti-etching layer is attached just blocks the etching channel formed by etching the portion where the anti-etching layer is not attached, so that external water vapor cannot enter the display area through the etching channel, and the problem of black spots is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of display panels, and in particular to a display panel, a display module and a display device. Background Art

[0002] Organic light emitting diode (OLED) display is one of the display solutions commonly used in electronic devices such as mobile phones, tablet computers, smart wearable devices, and large-screen display devices.

[0003] At present, there is a common failure phenomenon in OLED displays, namely black spots. Black spots are caused by the failure of OLED packaging, water and oxygen entering and corroding the OLED's light-emitting layer and cathode evaporation layer. Summary of the invention

[0004] The purpose of the present invention is to provide a display panel, a display module and a display device to solve the problem in the related art that due to the failure of the display panel packaging, water and oxygen enter and corrode the light-emitting layer and the cathode evaporation layer of the OLED, thereby forming black spots.

[0005] In one aspect, the present invention provides a display panel, comprising:

[0006] An interlayer dielectric layer, one side of which has a display area;

[0007] A dam, the dam is arranged on the interlayer dielectric layer and around the periphery of the display area;

[0008] a metal layer group, arranged on one side of the interlayer dielectric layer, one end of the metal layer group being located in the display area, the other end being located at the edge of the interlayer dielectric layer, and the metal layer group being located between the dam and the interlayer dielectric layer;

[0009] An anti-etching layer is located between the dam and the edge of the interlayer dielectric layer, and the anti-etching layer covers partial areas of two side walls of the metal layer group.

[0010] As a preferred technical solution of the display panel, the anti-etching layer includes a plurality of anti-etching strips, and the plurality of anti-etching strips are arranged at intervals on the side walls of the metal layer group.

[0011] As a preferred technical solution of the display panel, along the thickness direction of the metal layer group, the anti-etching layer penetrates through the two side walls of the metal layer group.

[0012] As a preferred technical solution of the display panel, the anti-etching layer includes a first anti-etching portion and a second anti-etching portion, the first anti-etching portion is arranged on one of the side walls, and the second anti-etching portion is arranged on the other side wall.

[0013] As a preferred technical solution of the display panel, one end of the first anti-etching portion is arranged on the interlayer dielectric layer.

[0014] And / or one end of the second anti-etching portion is arranged on the interlayer dielectric layer.

[0015] As a preferred technical solution of the display panel, the other end of the first anti-etching portion is arranged on the top wall of the metal layer group.

[0016] And / or the other end of the second anti-etching portion is arranged on the top wall of the metal layer group.

[0017] As a preferred technical solution of the display panel, the extension direction of the first anti-etching portion located on the side wall is arranged at an angle with the thickness direction of the metal layer group.

[0018] And / or the extension direction of the second anti-etching portion located on the side wall is arranged at an angle with the thickness direction of the metal layer group.

[0019] As a preferred technical solution of the display panel, the display panel further includes an inorganic film layer, and the inorganic film layer is arranged on the interlayer dielectric layer and covers the metal layer group.

[0020] On the other hand, the present invention provides a display module, comprising the display panel in any of the above solutions.

[0021] In yet another aspect, the present invention provides a display device, comprising the display module in any of the above solutions.

[0022] The beneficial effects of the present invention are:

[0023] The present invention provides a display panel, a display module and a display device. The display panel includes an interlayer dielectric layer, a metal layer group and an anti-etching layer. A dam arranged around the periphery of a display area is arranged on one side of the interlayer dielectric layer. When the outer side of the dam of the display panel is packaged, if the two side walls in the metal layer group along the length direction from one end to the other end of the metal layer group are not protected, side etching is likely to occur, thereby forming an etching channel, causing packaging failure, resulting in black spots in the display panel. To avoid this problem, the anti-etching layer is attached to the two side walls along the length direction of the metal layer group, which blocks the direct contact between the area where the side wall is attached with the anti-etching layer and the outside world, so that the upper PLN development and subsequent processes will not cause etching to the side wall where the anti-etching layer is attached. Therefore, external water vapor cannot enter the interior of the display panel through the etching channel and cannot reach the display area, thereby avoiding the adverse result of causing black spots. Furthermore, since the anti-etching layer only covers part of the side wall, it can provide more direct contact areas between the interlayer dielectric layer and the inorganic film layer while blocking external water vapor, so the packaging is more stable and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural diagram of a display panel in the prior art;

[0025] Figure 2 It is a structural schematic diagram of a display panel in the prior art;

[0026] Figure 3 A cross-sectional view of a display panel in the prior art Figure 1 ;

[0027] Figure 4 A cross-sectional view of a display panel in the prior art Figure 2 ;

[0028] Figure 5 This is a view showing the inorganic film layer warping after the outer packaging of the dam of the display panel fails in the prior art;

[0029] Figure 6 is a schematic diagram of the structure of the display panel in this embodiment;

[0030] Figure 7 is a cross-sectional view of the display panel in this embodiment;

[0031] Figure 8 FIG. 4 is a cross-sectional view showing a panel in another embodiment.

[0032] In the figure:

[0033] 100, dam; 200, display area; Y, extension direction;

[0034] 1. Interlayer dielectric layer;

[0035] 2. Metal layer group; 21. First titanium layer; 22. Aluminum layer; 221. Etched channel; 222. Exposed surface; 223. First boundary; 224. Second boundary; 23. Second titanium layer;

[0036] 3. Anti-etching layer; 31. First anti-etching portion; 32. Second anti-etching portion;

[0037] 4. Inorganic film layer; 41. First chemical deposition layer; 42. Inkjet printing layer; 43. Second chemical deposition layer;

[0038] 51. First substrate; 52. Insulating layer; 53. Second substrate; 54. Buffer insulating layer; 55. Gate insulating layer; 56. Intermetallic dielectric layer. DETAILED DESCRIPTION

[0039] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0043] Currently, OLED displays are commonly used in electronic devices such as mobile phones, tablets, smart wearable devices, and large-screen display devices. OLED displays have a common failure phenomenon, namely black spots. Black spots are caused by the failure of the display panel package, which allows water and oxygen to enter and corrode the OLED's light-emitting layer and cathode evaporation layer.

[0044] The known causes of OLED package failure in the prior art include package foreign matter, package layer cracks, etc. Among them, package foreign matter often appears in the package process of the display panel. Due to improper human operation, foreign matter on the surface of the device or in the environment is packaged in the display panel, resulting in package failure; package layer cracks are caused by the edge of the display panel being easily impacted by external forces during the cutting process of the display panel. The cracks will affect the package and may spread into the effective display area of ​​the display panel, resulting in package failure.

[0045] The inventor of this application has discovered a reason for the failure of the display panel packaging due to design defects, which is completely different from the black spot cause caused by improper operation during the production process known to those skilled in the art. The discovery of this technical problem is not obvious to those skilled in the art. Figure 1-Figure 5 As shown, the bottom of the display panel generally includes a dam 100, and the dam 100 is a DAM. When the titanium-aluminum-titanium metal layer group 2 of the source and drain near the dam 100 undergoes lateral etching of the exposed surface of the aluminum layer 22 under the action of the anode etching solution, an etching channel 221 is formed, which will cause the subsequently manufactured pixel definition layer (pixel define layer, PDL) material to remain in the etching channel 221. In this way, water vapor from the outside of the display panel can sequentially pass through the dam 100 along the etching channel 221 outside the dam 100 and enter the display area 200 of the display panel, causing the light-emitting function of the light-emitting layer to fail and form black spots.

[0046] The reason why black spots are formed by side engraving of the aluminum layer 22 is further explained below with reference to the accompanying drawings. Figure 1 and Figure 2This is a schematic diagram of the structure of a current OLED display panel. The display panel is provided with a dam 100, the interior of the dam 100 is used as a display area 200, and a display panel driver IC (DDIC) and a flexible printed circuit (FPC) are provided at the bottom of the display panel and outside the dam 100. In addition, the display panel also includes a light-emitting layer and a metal layer group 2, such as an ELVSS power line and an ELVDD power line, wherein a portion of the ELVSS power line and the ELVDD power line are located in the display area inside the dam 100, and the other portion passes through the dam 100 and extends outside the display area 200.

[0047] For the specific structure of the display panel, such as Figure 2-Figure 4 As shown, the display panel includes a first substrate 51, an insulating layer 52, a second substrate 53, a buffer insulating layer 54, a gate insulating layer 55, an intermetallic dielectric layer 56, an interlayer dielectric layer 1 and an inorganic film layer 4 stacked in sequence, wherein the inorganic film layer 4 includes a first chemical vapor deposition layer 41, an inkjet printing layer 42 and a second chemical vapor deposition layer 43 arranged from bottom to top. Since the function of the dam 100 is to block the inkjet printing layer 42, the inkjet printing layer 42 needs to be sealed by the first chemical vapor deposition layer 41 and the second chemical vapor deposition layer 43 near the dam 100, so as to directly contact and encapsulate the inorganic film layer 4 and the inorganic layer below. Therefore, no organic layer is allowed above and below the metal layer group 2 near the dam 100. In this way, the inorganic film layer above the metal layer group 2 will directly contact the interlayer dielectric layer 1 below the metal layer group 2 to form a water and oxygen impermeable encapsulation bonding surface.

[0048] like Figure 3 As shown, since the metal layer group 2 has no protective layer, when the anodic etching operation is performed, the anodic etching solution will side-etch the exposed surface of the aluminum layer 22 of the metal layer group 2, thereby forming an etching channel 221 on the side wall of the metal layer group 2. When the PDL is subsequently coated, the PDL material will penetrate into the etching channel 221. Since the PDL material that penetrates into the etching channel 221 cannot be exposed, the developer cannot develop the PDL material here, thereby forming organic residues in the etching channel 221. Since water and oxygen can be transmitted in the organic layer, water vapor can enter the display area 200 of the display panel along the water and oxygen channel formed by the etching channel 221, resulting in black spots.

[0049] In order to solve the problem of black spots caused by packaging failure caused by the above reasons, Figure 6 and Figure 7As shown, this embodiment provides a display panel, which includes an interlayer dielectric layer 1, a metal layer group 2, an anti-etching layer 3 and an inorganic film layer 4, wherein one side of the interlayer dielectric layer 1 has a display area 200; the dam 100 is arranged on the interlayer dielectric layer 1 and is arranged around the outer peripheral side of the display area 200; the metal layer group 2 is arranged on one side of the interlayer dielectric layer, one end of the metal layer group 2 is located in the display area 200, and the other end is located at the edge of the interlayer dielectric layer 1; and the metal layer group 2 is located between the dam 100 and the interlayer dielectric layer 1; the anti-etching layer 3 is located between the dam 100 and the edge of the interlayer dielectric layer 1, and along the length direction Y from one end to the other end of the metal layer group 2, the two side walls of the metal layer group 2 are provided with the anti-etching layer 3, and the anti-etching layer 3 covers part of the side walls of the metal layer group 2. The metal layer group 2 includes at least one metal layer and a protective layer stacked on the interlayer dielectric layer 1. Relative to the metal layer, the protective layer has the highest etching selectivity. Therefore, when there is one metal layer, the protective layer is sandwiched between the metal layer and the interlayer dielectric layer 1. When there are two or more metal layers, the protective layer is sandwiched between the metal layer and the interlayer dielectric layer 1 or between two adjacent metal layers. The protective layer has two exposed surfaces 222 extending along the length direction Y of the metal layer group 2; the two exposed surfaces 222 are respectively located on the two side walls of the metal layer group 2, and the anti-etching layer 3 is located between the dam 100 and the edge of the interlayer dielectric layer 1, and is attached to part of the side walls of the two metal layer groups 2 to partially cover the two exposed surfaces 222; the anti-etching layer 3 is attached to the side walls of the metal layer group 2, which blocks the direct contact between the exposed surface 222 of the protective layer and the area where the anti-etching layer 3 is attached and the outside world, so that the upper PLN development and subsequent processes will not cause etching to the protective layer at the position where the anti-etching layer 3 is attached, so the protective layer at the position where the anti-etching layer 3 is attached forms a blocking dam, which just blocks the etching channel 221 formed by etching at the part where the anti-etching layer 3 is not attached, so the external water vapor cannot enter the interior of the display panel through the etching channel 221, and cannot reach the display area 200, thereby reducing the probability of packaging failure and avoiding black spots.

[0050] Optionally, the inorganic film layer 4 is attached to the interlayer dielectric layer 1 and covers the metal layer group 2. Compared with the embodiment in which the anti-etching layer 3 covers the entire sidewall of the metal layer group 2 between the dam 100 and the edge of the interlayer dielectric layer 1 along the length direction Y of the metal layer group 2, the anti-etching layer 3 is only attached to the sidewall of part of the metal layer group 2 along the length direction Y of the metal layer group 2. Therefore, while blocking external water vapor, it can provide more direct contact areas between the interlayer dielectric layer 1 and the inorganic film layer 4, so the packaging is more stable and reliable.

[0051] As for the material of the anti-etching layer 3, the anti-etching layer 3 may be a metal piece with the same polarity as the metal layer group 2. In this embodiment, the metal piece with the same polarity will not affect the electrical signal in the metal layer group 2 (such as changing the magnetic field of the electrical signal, etc.), so the anti-etching layer 3 is a metal piece with the same polarity as the metal layer group 2. Specifically, the anti-etching layer 3 may be an aluminum-titanium alloy.

[0052] Optionally, the anti-etching layer 3 includes a plurality of anti-etching strips, which are arranged at intervals along the length direction Y of the metal layer group 2. In this embodiment, along the length direction Y of the metal layer group 2, on the exposed surface 222 of the protective layer, the plurality of anti-etching strips and the region corresponding to the protective layer are not etched, so the protective layer at the position where the anti-etching strips are attached forms a blocking dam, which just blocks the etching channel 221 formed by the etching, and the plurality of blocking dams can provide multiple guarantees, further preventing external water vapor from entering the interior of the display panel through the etching channel 221, thereby improving the packaging performance of the packaging structure.

[0053] like Figure 7 and Figure 8 As shown, optionally, along the thickness direction of the metal layer group 2, the anti-etching layer 3 penetrates through the two side walls of the metal layer group 2. In this embodiment, along the thickness direction of the metal layer group 2, the exposed surface 222 of the anti-etching layer 3 has a first boundary 223 and a second boundary 224. If the anti-etching layer 3 only extends from the first boundary 223 of the exposed surface 222 to the second boundary 224, the etching liquid may enter the gap between the protective layer and the metal layer of the metal layer group 2 from both sides of the anti-etching layer 3 along the thickness direction of the protective layer, thereby etching the protective layer in the area covered by the anti-etching layer 3. To avoid this phenomenon, therefore, along the thickness direction of the metal layer group 2, the anti-etching layer 3 penetrates through the two side walls of the metal layer group 2 with the exposed surface 222. In this way, the anti-etching layer 3 is not only attached to the exposed surface 222 of the protective layer along the thickness direction of the metal layer group 2, but also attached to other metal layers, thereby improving the protective ability of the anti-etching layer 3 to the protective layer of the covered part.

[0054] like Figure 7As shown, optionally, the anti-etching layer 3 includes a first anti-etching portion 31 and a second anti-etching portion 32, the first anti-etching portion 31 is arranged on one side wall, and the second anti-etching portion 32 is arranged on the other side wall. In this embodiment, the above-mentioned setting is to attach the first anti-etching portion 31 to one side wall of the metal layer group 2, and the second anti-etching portion 32 to the other side wall of the metal layer group 2, and they can be attached separately without interfering with each other. Compared with the anti-etching layer 3 being a whole strip layer, which requires the anti-etching layer 3 to go from one side of the metal layer group 2, pass through the top wall of the metal layer group 2 away from the interlayer dielectric layer 1, and finally be wound around the other side of the metal layer group 2, the above-mentioned setting attaches the two side walls of the metal layer group 2 separately, and the anti-etching layer 3 is not a whole strip layer. Due to the length of the anti-etching layer 3, when the two boundaries of one exposed surface 222 are covered, the two boundaries of the other exposed surface 222 cannot be completely covered. In addition, part of the material of the anti-etching layer 3 located at the top wall of the metal layer group 2 far away from the interlayer dielectric layer 1 is saved, thereby saving the material of the anti-etching layer 3 and reducing the cost.

[0055] Optionally, the cross-sections of the first anti-etching portion 31 and the second anti-etching portion 32 may be trapezoidal, triangular or semicircular; the inorganic film layer 4 is disposed around the periphery of the anti-etching layer 3. In the present embodiment, taking the case where the cross-sections of the first anti-etching portion 31 and the second anti-etching portion 32 are semicircular as an example, the rectangular bottom surface of the anti-etching layer 3 is attached to the metal layer group 2. Since the inorganic film layer 4 is disposed around the periphery of the anti-etching layer 3, the arc surface of the anti-etching layer 3 is stacked with the inorganic film layer 4. Since the inorganic film layer 4 is encapsulated with the interlayer dielectric layer 1, the inorganic film layer 4 can exert a force on the anti-etching layer 3 directed toward the metal layer group 2, thereby preventing the anti-etching layer 3 from detaching from the metal layer group 2, and avoiding etching of the exposed surface of the aluminum layer 22 attached with the anti-etching layer 3.

[0056] Optionally, one end of the first anti-etching portion 31 is disposed on the interlayer dielectric layer 1, and / or one end of the second anti-etching portion 32 is disposed on the interlayer dielectric layer 1. In this embodiment, the above arrangement can, on the one hand, increase the distance between the etching liquid on the interlayer dielectric layer 1 and the side wall covered by the anti-etching layer 3 to enhance the protection of the barrier dam, and on the other hand, can make the anti-etching layer 3 more firmly attached to the metal layer group 2.

[0057] Optionally, the other end of the first anti-etching portion 31 is disposed on the top wall of the metal layer group 2 away from the interlayer dielectric layer 1, and / or the other end of the second anti-etching portion 32 is disposed on the top wall of the metal layer group 2 away from the interlayer dielectric layer 1. In this embodiment, the above arrangement can increase the distance between the etching liquid on the top wall of the interlayer dielectric layer 1 and the side wall covered by the anti-etching layer 3 to enhance the protection of the barrier dam, and can make the anti-etching layer 3 more firmly attached to the metal layer group 2.

[0058] Optionally, the extension direction of the first anti-etching portion 31 located on the side wall is set at an angle to the thickness direction of the protective layer, and / or the extension direction of the second anti-etching portion 32 located on the side wall is set at an angle to the thickness direction of the protective layer. In this embodiment, the above-mentioned settings can increase the coverage area of ​​the first anti-etching portion 31 on the corresponding side wall, increase the coverage area of ​​the second anti-etching portion 32 on the corresponding side wall, and further increase the thickness of the blocking dam along the length direction Y of the metal layer group 2, thereby improving the blocking effect on the etching channel 221, so as to prevent external water vapor from entering the display area 200 through the etching channel 221.

[0059] Optionally, the angle between the extension direction of the first anti-etching part 31 attached to the side wall and the thickness direction of the protective layer is a, 0°<a<90°, and the angle between the extension direction of the second anti-etching part 32 attached to the side wall and the thickness direction of the protective layer is b, 0°<b<90°.

[0060] like Figure 8 As shown, in other embodiments, the anti-etching layer 3 is a whole strip-shaped attachment layer, which requires the anti-etching layer 3 to start from one side wall of the metal layer group 2 and end at the other side wall of the metal layer group 2. The above setting operation is simple and can be completed in one time.

[0061] Optionally, the metal layer group 2 includes a first titanium layer 21, an aluminum layer 22, and a second titanium layer 23 stacked in sequence on the interlayer dielectric layer 1, and the aluminum layer 22 is a protective layer. In this embodiment, according to the different etching selectivities of the metals, the aluminum layer 22 with a high etching selectivity is selected as the protective layer. Since the aluminum layer 22 is located between the first titanium layer 21 and the second titanium layer 23, it is only necessary to avoid etching of the exposed surfaces 222 of the aluminum layer 22 on both sides extending along the length direction Y of the metal layer group 2. Therefore, in this embodiment, it is only necessary to attach the anti-etching layer 3 to the two side walls of the metal layer group 2, so that the barrier dam formed by the protective layer at the attachment position of the anti-etching layer 3 can effectively block the etching channel 221.

[0062] In this embodiment, titanium-aluminum-titanium (Ti-Al-Ti) is selected to form the metal layer group 2. In other embodiments, the metal layer group 2 can also be selected from molybdenum-aluminum-molybdenum (Mo-Al-Mo) or titanium-aluminum (Ti-Al) or molybdenum-aluminum (Mo-Al). The anti-etching layer 3 can be attached to the sidewalls of the metal layer group 2 to cover the exposed surface 222 of the metal layer with a relatively high etching selectivity.

[0063] This embodiment also provides a display module, including the display panel in the above solution.

[0064] This embodiment also provides a display device, including the display module in the above solution. Specifically, the display device can be a computer monitor, a television, etc.

[0065] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A display panel, characterized in that: include: An interlayer dielectric layer, one side of which has a display area; A dam, the dam is arranged on the interlayer dielectric layer and around the periphery of the display area; a metal layer group, arranged on one side of the interlayer dielectric layer, one end of the metal layer group being located in the display area, the other end being located at the edge of the interlayer dielectric layer, and the metal layer group being located between the dam and the interlayer dielectric layer; An anti-etching layer is located between the dam and the edge of the interlayer dielectric layer, and the anti-etching layer covers partial areas of two side walls of the metal layer group.

2. The display panel according to claim 1, characterized in that: The anti-etching layer includes a plurality of anti-etching strips, and the plurality of anti-etching strips are arranged on the sidewalls of the metal layer group at intervals.

3. The display panel according to claim 1, characterized in that: Along the thickness direction of the metal layer group, the anti-etching layer penetrates through the side wall of the metal layer group.

4. The display panel according to claim 1, characterized in that: The anti-etching layer includes a first anti-etching portion and a second anti-etching portion, wherein the first anti-etching portion is disposed on one of the side walls, and the second anti-etching portion is disposed on the other side wall.

5. The display panel according to claim 4, characterized in that: One end of the first anti-etching portion is disposed on the interlayer dielectric layer, And / or one end of the second anti-etching portion is arranged on the interlayer dielectric layer.

6. The display panel according to claim 5, characterized in that: The other end of the first anti-etching portion is disposed on the top wall of the metal layer group, And / or the other end of the second anti-etching portion is arranged on the top wall of the metal layer group.

7. The display panel according to claim 4, characterized in that: The extending direction of the first anti-etching portion located on the side wall is arranged at an angle with the thickness direction of the metal layer group. And / or the extension direction of the second anti-etching portion located on the side wall is arranged at an angle with the thickness direction of the metal layer group.

8. The display panel according to claim 1, characterized in that: The display panel further includes an inorganic film layer, which is disposed on the interlayer dielectric layer and covers the metal layer group.

9. A display module, characterized in that: A display panel comprising any one of claims 1 to 8.

10. A display device, characterized in that: Comprising the display module described in claim 9.

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