Polishing and grinding turntable and polishing and grinding device

Abstract

The present invention discloses a polishing and grinding turntable, comprising a marble platform and a polishing disc. The marble platform is provided with a mounting frame, and a hollow direct-drive motor connected to the polishing disc is provided on the mounting frame. A hollow tube is also provided inside the motor rotor, fixedly connected to the polishing disc and connected to a magnetic ring at the bottom. A reading sensor is provided at the bottom of the mounting frame, and the reading sensor and the magnetic ring cooperate to form a magnetic ring encoder. A plurality of air-floating support blocks are evenly arranged on the marble platform in the peripheral direction of the mounting frame. The top end faces of the air-floating support blocks are arranged below the polishing disc. A flow channel is provided in the air-floating support blocks, one end of the flow channel is connected to an air source, and an air outlet of the flow channel is located on the top end face of the air-floating support block. A polishing pad is provided on the surface of the polishing disc. The magnetic ring encoder is used to detect the runout of the polishing disc during rotation, and the air source controls the air supply pressure according to the runout. The present invention has good stability during processing, greatly reduces runout during use, and improves polishing quality.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor preparation, in particular to a polishing and grinding turntable and a polishing and grinding device. Background Art

[0002] The wafer polishing platform is a key equipment used for wafer surface flattening in semiconductor manufacturing. The wafer polishing platform mainly removes different materials on the wafer surface at the micron / nano level through a combination of chemical action and mechanical grinding technology, achieving nanoscale flattening of the wafer surface and wafer thinning, preparing for the next step of the lithography process.

[0003] The polishing disc on the polishing platform cooperates with the carrier head to squeeze the wafer in the middle for polishing or thinning. At the same time, the polishing platform is also provided with a liquid supply device to provide polishing liquid used in the processing process. During the processing, the force of the carrier head will be applied to the polishing disc and located on one side of the polishing disc surface. Under the premise of the applied force, the tiny gaps between the various components of the polishing platform will cause jumping during the rotation. During the processing, the jumping degree will cause thermal deformation and vibration, resulting in a decrease in the quality of the processed surface and an increase in roughness, which greatly affects the processing quality. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a polishing and grinding turntable and a polishing and grinding device, which have good stability during processing, greatly reduce the vibration during use, and improve the polishing quality.

[0005] In order to solve the above technical problems, the present invention provides a polishing and grinding turntable, comprising a marble platform and a polishing disc, wherein a mounting frame is provided on the marble platform, a hollow direct-drive motor is provided on the mounting frame, and the rotor end surface of the hollow direct-drive motor is connected to the bottom of the polishing disc;

[0006] A hollow tube is further provided inside the rotor, the top of the hollow tube is fixedly connected to the polishing disc, the bottom of the hollow tube passes through the hollow direct drive motor and is connected to the mounting base, a magnetic ring is provided on the mounting base, and a reading sensor is provided at the bottom of the mounting frame, and the reading sensor cooperates with the magnetic ring to form a magnetic ring encoder;

[0007] A plurality of air-floating support blocks are evenly arranged on the marble platform in the peripheral direction of the mounting frame, the top end surface of the air-floating support block is arranged below the polishing plate, a flow channel is arranged in the air-floating support block, one end of the flow channel is connected to the air source, and the air outlet of the flow channel is located on the top end surface of the air-floating support block;

[0008] A polishing pad is provided on the surface of the polishing disc;

[0009] The magnetic ring encoder is used to detect the amount of runout when the polishing disc rotates, and the air source controls the air supply pressure according to the amount of runout.

[0010] Furthermore, the polishing plate includes an upper fixed plate and a lower cooling plate, a middle portion of the lower cooling plate is provided with an avoidance hole, a cooling channel is provided in the lower cooling plate, the cooling channel and the inlet and outlet are all provided in the avoidance hole and are installed with pipe joints.

[0011] Furthermore, the cooling channel includes a plurality of fan-shaped grooves, an inlet channel is provided on the side wall of the fan-shaped groove close to the avoidance hole, and an outlet channel is provided on the side wall away from the avoidance hole. A return channel is provided in the lower cooling plate below the fan-shaped groove, one end of the return channel is connected with the avoidance hole, and a connecting channel is provided between the other end of the return channel and the outflow channel.

[0012] Furthermore, a mounting hole is provided on the upper fixed plate, and a mounting groove is provided on the lower cooling plate. A thickness gauge is fixed in the mounting hole. The data line of the thickness gauge is arranged along the mounting groove, the avoidance hole and the hollow tube. The detection window of the thickness gauge is highly consistent with the surface of the upper fixed plate.

[0013] Furthermore, a gas-electric slip ring is provided at the bottom of the installation base plate, and the data line and the pipe joint of the thickness gauge are connected to the gas-electric slip ring.

[0014] Furthermore, a screw rod is provided at the bottom of the air-floating support block, an internal thread base is provided on the marble platform, and the screw rod is fixedly connected to the internal thread base via a nut.

[0015] Furthermore, a liquid receiving baffle ring is provided on the outer periphery of the polishing disc, and a liquid receiving groove is provided at the bottom of the liquid receiving baffle ring.

[0016] Furthermore, at least two lifting cylinders are arranged between the bottom of the liquid receiving baffle ring and the marble platform, and the lifting cylinders drive the liquid receiving baffle ring to rise and fall. A guide slider is fixedly installed on one side of the lifting cylinder, and a horizontal support arm is provided on the top of the guide slider. The horizontal support arm is connected to the bottom of the liquid receiving baffle through an adapter, and the horizontal support arm is also connected to the telescopic rod of the lifting cylinder.

[0017] Furthermore, a gas pressure regulating valve is provided between the gas source and each air-floating support block. The gas pressure regulating valve controls the gas supply pressure of the corresponding air-floating support block, and adjusts the polishing disc's vibration by the gas supply pressure. The adjustment method includes the following steps:

[0018] Step 1: Multiple gas pressure regulating valves supply gas at the same base pressure P and perform rotation detection. The rotation detection includes driving the polishing disc to rotate n times by a hollow direct-drive motor. The polishing disc drives the magnetic ring to rotate synchronously. The reading sensor reads the detection value of the magnetic ring in each circle and calculates the average runout value after n circles. If the average runout value meets the requirements, the adjustment is completed. If the average runout value does not meet the requirements, continue with the following steps:

[0019] Step 2: Perform boost adjustment on one of the gas pressure regulating valves, and supply gas to the base pressure P for the other gas pressure regulating valves. Perform rotation detection to obtain the average monotonic pressure fluctuation value. Each gas pressure regulating valve corresponds to a monotonic pressure average fluctuation value. When the monotonic pressure average fluctuation value obtained from one rotation detection meets the requirements, the adjustment is completed. If the monotonic pressure average fluctuation value does not meet the requirements, continue with the following steps:

[0020] Step 3: Group multiple gas pressure regulating valves, perform boost adjustment on the gas pressure regulating valves in a single group, and supply gas to the base pressure P for the remaining gas pressure regulating valves. Perform rotation detection to obtain a multi-pressure average jitter value. Each group of gas pressure regulating valves corresponds to a multi-pressure average jitter value. When the multi-pressure average jitter value obtained from one rotation detection meets the requirements, the adjustment is completed. If the single pressure average jitter value does not meet the requirements, a manual intervention operation is prompted.

[0021] The calculation method of the above rotation detection is as follows: the detection value of the magnetic ring in each circle is read by a reading sensor, and the maximum and minimum values ​​of each circle are recorded. The average value of the n maximum values ​​is obtained to obtain the jump height MAX, and the average value of the n minimum values ​​is obtained to obtain the jump height MIN, and the difference between the jump height MAX and the jump height MIN is calculated.

[0022] A polishing and grinding device comprises any one of the wafer polishing platforms described above, wherein a carrier head, a cleaning brush and a liquid supply device are arranged above the wafer polishing platform.

[0023] Beneficial effects of the present invention:

[0024] 1. A hollow direct drive motor is used as the driving power source. It is simple to connect with the polishing disc. Reducing the number of connecting parts can effectively reduce the difficulty of component assembly and improve assembly accuracy.

[0025] 2. Multiple air-floating support blocks are evenly distributed across the bottom of the polishing pad and apply force. Because the air-floating support blocks utilize air pressure as a floating force, they avoid contact with the polishing pad during support, preventing friction that can exacerbate vibration. The air pressure of each air-floating support block is independently adjustable, so a magnetic ring encoder effectively controls the air pressure at each support block, effectively suppressing vibration during polishing pad rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a schematic diagram of the structure of the present invention located at the lower part of the marble platform;

[0028] Figure 3 It is a schematic diagram of the cross-sectional structure of the present invention;

[0029] Figure 4 This is a schematic diagram of the air-floating support block structure of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of a turntable with a liquid-connecting baffle ring according to the present invention;

[0031] Figure 6 This is a schematic diagram of the structure of the lifting drive portion of the liquid-connecting baffle ring of the present invention;

[0032] Figure 7 It is a structural schematic diagram of the lower cooling plate of the present invention;

[0033] Figure 8 It is a schematic structural diagram of the polishing and grinding device of the present invention;

[0034] Figure 9 It is a block diagram of the air circuit of the air-floating support block of the present invention.

[0035] Explanation of the numbers in the figure: 1. Marble platform; 2. Polishing plate; 3. Mounting frame; 4. Hollow direct drive motor; 5. Hollow tube; 6. Wafer polishing platform; 7. Mounting base; 8. Magnetic ring; 9. Reading sensor; 10. Air float support block; 11. Flow channel; 12. Polishing pad; 13. Upper fixed plate; 14. Lower cooling plate; 15. Avoidance hole; 16. Cooling channel; 17. Pipe joint; 18. Sector groove; 1 9. Inflow channel; 20. Outflow channel; 21. Return channel; 22. Connecting channel; 23. Mounting hole; 24. Mounting slot; 25. Thickness gauge; 27. Pneumatic slip ring; 28. Screw; 29. ​​Internal thread base; 30. Liquid receiving ring; 31. Liquid receiving slot; 32. Lifting cylinder; 33. Guide slider; 34. Horizontal support arm; 35. Adapter; 36. Carrying head; 37. Cleaning brush; 38. Liquid supply device. DETAILED DESCRIPTION

[0036] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0037] Reference Figures 1 to 4As shown, an embodiment of the polishing and grinding turntable of the present invention includes a marble platform 1 and a polishing disk 2, a mounting frame 3 is provided on the marble platform, a hollow direct-drive motor 4 is provided on the mounting frame, and the rotor end face of the hollow direct-drive motor is connected to the bottom of the polishing disk; the stator of the hollow direct-drive motor is fixed on the mounting frame and does not rotate, and the mounting frame is fixed on the marble platform, which can provide higher flatness to reduce vibration during operation, and the rotor of the hollow direct-drive motor directly drives the polishing disk to rotate to reduce connecting components, thereby reducing vibration during operation.

[0038] During operation, since it is difficult to detect the amount of runout on the periphery of the polishing disc, a hollow tube 5 is further provided inside the rotor. The top of the hollow tube is fixedly connected to the polishing disc, and the bottom of the hollow tube passes through the hollow direct-drive motor and is connected to the mounting base 7. A magnetic ring 8 is provided on the mounting base. The hollow tube is used to connect the magnetic ring and the polishing disc into an integrated structure, and can rotate synchronously. A reading sensor 9 is provided at the bottom of the mounting frame, and the reading sensor and the magnetic ring cooperate to form a magnetic ring encoder; the reading sensor obtains position information by detecting changes in the magnetic field and converts it into an electrical signal output, that is, when the magnetic ring rotates, the reading sensor can sense the change in the magnetic field, thereby generating a corresponding voltage signal. The phase difference of these voltage signals is used to calculate the rotation angle of the magnetic ring, so that the height difference and the amount of runout during the rotation process can be obtained. The runout can meet the requirements when it is less than 10μm.

[0039] Based on the ability to conveniently detect the amount of runout during rotation, a plurality of air-floating support blocks 10 are evenly arranged on the marble platform in the peripheral direction of the mounting frame. The top end surface of the air-floating support block is arranged below the polishing disc. The two do not contact each other and there is a gap. The gap size is between 3-5 μm, so that the gas can be output to achieve the effect of air flotation. Specifically, a flow channel 11 is provided in the air-floating support block. Figure 4 As shown, one end of the flow channel is connected to the air source, which can be an independent air supply pump or a centrally supplied high-pressure gas; the air outlet of the flow channel is located on the top end face of the air-floating support block to release high-pressure gas to the bottom of the polishing platform, and the entire polishing plate is forced upward by the high-pressure gas to suppress the rotation and vibration of the polishing plate.

[0040] Specifically, the magnetic ring encoder is used to detect the amount of runout during the rotation of the polishing disc. The air source controls the air supply pressure according to the runout to ensure that the polishing disc rotates stably through the appropriate air supply pressure. A high-precision air pressure regulating valve can be set between the air source and each air-floating support block. The air pressure regulating valve can be a precision pressure reducing valve or an electric proportional valve, or a precision pressure reducing valve and an electric proportional valve can be used in combination, so that the outlet pressure of each air-floating support block can be independently adjusted. Figure 9As shown, according to the number of air-floating support blocks, the polishing disc is divided into multiple areas with independently adjustable force, and then the area is adjusted according to the detected runout to achieve a stable rotation effect.

[0041] A polishing pad 12 is provided on the surface of the polishing disc for polishing and grinding;

[0042] Reference Figure 1 、 Figure 3 and Figure 7 As shown, the polishing plate includes an upper fixed plate 13 and a lower cooling plate 14. An avoidance hole 15 is provided in the middle of the lower cooling plate. A cooling channel 16 is provided in the lower cooling plate. The cooling channel and the inlet and outlet are all provided in the avoidance hole and are installed with a pipe joint 17. The pipe joint is connected to the liquid inlet and outlet connecting pipe to supply the coolant into the cooling channel and guide the coolant to flow back for cooling and take away the heat, so that the temperature of the upper fixed plate is controlled during the processing, that is, the temperature on the polishing pad is taken away to ensure that the grinding and polishing are within the appropriate temperature range.

[0043] Reference Figure 7 As shown, the above-mentioned cooling channel includes a plurality of fan-shaped grooves 18, an inlet channel 19 is provided on the side wall of the fan-shaped groove close to the avoidance hole, and an outflow channel 20 is provided on the side wall away from the avoidance hole. A return channel 21 is provided in the lower cooling plate below the fan-shaped groove, one end of the return channel is connected with the avoidance hole, and a connecting channel 22 is provided between the other end of the return channel and the outflow channel. The coolant enters the fan-shaped groove from the inflow channel. The fan-shaped groove has a larger space to increase the contact area between the coolant and the upper fixed plate. The coolant is then discharged from the fan-shaped groove through the outflow channel, the connecting channel and the return channel, and the purpose of continuous temperature control is achieved through circulation.

[0044] Reference Figure 3 As shown, a mounting hole 23 is provided on the upper fixed plate, and the mounting hole is located on the path of the polished wafer. A mounting groove 24 is provided on the lower cooling plate, and a thickness gauge 25 is fixed in the mounting hole. The data line of the thickness gauge is arranged along the mounting groove, the avoidance hole and the hollow tube. The detection window of the thickness gauge is highly consistent with the surface of the upper fixed plate to ensure the flatness of the polishing pad after installation. During the rotation process, the thickness gauge can effectively detect the thickness of the wafer after processing. It is an online detection method to improve preparation efficiency and quality.

[0045] Since the polishing disc rotates during use, in order to facilitate the setting of pipelines and connecting lines, a gas-electric slip ring 27 is also provided at the bottom of the installation base plate. The data line of the thickness gauge and the pipe joint are connected to the gas-electric slip ring. The pipe joint is the joint for liquid supply and discharge. Therefore, it can be understood here that the liquid inlet and outlet connecting pipes on the pipe joint are connected to the gas-electric slip ring.

[0046] A screw 28 is provided at the bottom of the above-mentioned air-floating support block, and an internal thread base 29 is provided on the marble platform. The screw is fixedly connected to the internal thread base through a nut. By rotating the screw, the gap value between the air-floating support block and the bottom of the polishing disk can be effectively adjusted, and the assembly is convenient and reliable.

[0047] Reference Figure 3 、 Figure 5 and Figure 6 As shown, a liquid receiving baffle ring 30 is provided on the periphery of the polishing disk, and a liquid receiving groove 31 is provided at the bottom of the liquid receiving baffle ring. During the processing, the polishing liquid will move from the polishing pad to the periphery and splash during the rotation of the polishing disk, and will eventually be blocked by the liquid receiving baffle ring, and slide down along its inner wall into the liquid receiving groove for collection, and finally be discharged from the outlet at the bottom of the liquid receiving groove.

[0048] In order to effectively catch the splashing polishing liquid, the liquid receiving baffle ring needs to be a certain distance higher than the polishing disc. This setting will cause the auxiliary components that move horizontally and laterally to interfere with it. Therefore, the existing auxiliary components all use a lifting mechanism to assist in avoidance. The auxiliary components are lifted by the lifting mechanism and then moved horizontally and laterally. This type of lifting mechanism requires a large stroke, which increases the equipment preparation cost and occupies too much internal space, making the space compact. Therefore, at least two lifting cylinders 32 are provided between the bottom of the liquid receiving baffle ring and the marble platform. The lifting cylinder drives the liquid receiving baffle ring to rise and fall. A guide slider 33 is fixedly installed on one side of the lifting cylinder. A transverse support arm 34 is provided on the top of the guide slider. The transverse support arm is connected to the bottom of the liquid receiving baffle through an adapter 35. The transverse support arm is also connected to the telescopic rod of the lifting cylinder. The lifting cylinder provides lifting power and ensures the stability of the lifting through the guide slider. The direction is clear, and the adapter provides a stable connection support effect. When the auxiliary component needs to move horizontally to above the polishing pad for work, the lifting cylinder drives the liquid receiving baffle ring to descend for avoidance. After moving into place, the lifting cylinder drives the liquid receiving baffle ring to rise, meeting the use requirements. The liquid receiving baffle ring that can be raised and lowered also facilitates the replacement of the polishing pad, making the operation more convenient.

[0049] In one embodiment, a gas pressure regulating valve is provided between the gas source and each air-floating support block. The gas pressure regulating valve controls the air supply pressure of the corresponding air-floating support block, and adjusts the polishing disc's vibration by the air supply pressure. The adjustment method mainly adopts single-stage adjustment and multi-stage adjustment to adjust gradually to determine the final adjustment plan.

[0050] First, multiple gas pressure regulating valves divide the polishing disc into multiple areas. The number of gas pressure regulating valves is at least 4 to ensure the adjustment accuracy. For the basis of adjustment, multiple gas pressure regulating valves are supplied with gas at the base pressure P before adjustment. Under this working condition, the original runout value after the current assembly can be measured. First, according to the single-stage adjustment, it is determined whether the pressure output adjustment of a single gas pressure regulating valve can meet the requirements, and the original runout value is adjusted to the runout range value that meets the requirements. Single-stage adjustment is to adjust the pressure of a single gas pressure regulating valve, and then detect the overall adjusted runout value. If the requirements are met, the adjustment can be completed. In some assembly situations, there may be a situation where the output pressure value of a single gas pressure regulating valve cannot meet the requirements. Therefore, the gas supply pressure can be adjusted simultaneously by multiple gas pressure regulating valves to work together to apply pressure to the polishing disc, which is multi-stage adjustment. At this time, the runout value of the polishing disc can basically be adjusted to the range that meets the requirements. If it still cannot be met, there may be a large deviation in the assembly, and reassembly and adjustment are required.

[0051] Specifically, multiple gas pressure regulating valves are first used to supply gas at the same base pressure P, and rotation detection is performed. The rotation detection includes a hollow direct-drive motor driving the polishing disk to rotate n circles, and the polishing disk drives the magnetic ring to rotate synchronously. The detection value of the magnetic ring in each circle is read by a reading sensor and the average jump value after rotating n circles is calculated; if the average jump value meets the requirements, it means that the rotation stability can be guaranteed by the base pressure P after assembly, that is, the adjustment is completed, and if the average jump value does not meet the requirements, it means that the jump is large and further adjustment needs to be tried.

[0052] First, one of the gas pressure regulating valves is pressurized to determine whether the pulsation can be reduced after the gas pressure regulating valve increases the gas supply pressure. After the single gas pressure regulating valve is pressurized, the remaining multiple gas pressure regulating valves still supply gas at the basic pressure P. The average pulsation value is continued to be measured through the above-mentioned rotation detection to obtain the monotonic pressure average pulsation value. Each gas pressure regulating valve is pressurized and tested once in the above-mentioned manner, that is, each gas pressure regulating valve corresponds to a monotonic pressure average pulsation value. When the monotonic pressure average pulsation value obtained by one of the rotation tests meets the requirements, the adjustment is completed. If the monotonic pressure average pulsation value does not meet the requirements, the pressurization scheme is continued to be changed to multi-stage adjustment.

[0053] If single-stage regulation does not meet the requirements, multi-stage regulation can be performed, that is, multiple gas pressure regulating valves are grouped, and the gas pressure regulating valves in a single group are subjected to boost regulation. The remaining gas pressure regulating valves supply gas at the base pressure P and perform rotation detection to obtain a multi-pressure regulation average jump value. Each group of gas pressure regulating valves corresponds to a multi-pressure regulation average jump value. When the multi-pressure regulation average jump value obtained by one rotation detection meets the requirements, the adjustment is completed. If the single pressure regulation average jump value does not meet the requirements, manual intervention is prompted.

[0054] For the above-mentioned boosting method, the pressure value increased during boosting is a constant value, so that the pressure value after boosting becomes P+1. If the average fluctuation value of a single pressure adjustment in the detection result tends to meet the requirements, the boosting can continue, and the pressure value is P+1+1, and the pressure values ​​of the remaining gas pressure regulating valves are all P; in the multi-stage adjustment process, the pressure values ​​of the first group of gas pressure regulating valves can all be P+1+1, and the pressure values ​​of adjacent gas pressure regulating valves are all P; based on the multi-stage adjustment scheme, boosting can also be performed in the form of a gradient in a group of gas pressure regulating valves currently being adjusted. For example, if the group has three gas pressure regulating valves, the pressure value of the middle gas pressure regulating valve is P+1+1, the pressure values ​​of the remaining two gas pressure regulating valves are P+1, and the pressure values ​​of the remaining gas pressure regulating valves outside the group are P.

[0055] The calculation method of the above rotation detection is as follows: the detection value of the magnetic ring in each circle is read by a reading sensor, and the maximum and minimum values ​​of each circle are recorded. The average value of the n maximum values ​​is obtained to obtain the jump height MAX, and the average value of the n minimum values ​​is obtained to obtain the jump height MIN, and the difference between the jump height MAX and the jump height MIN is calculated.

[0056] In one embodiment, referring to Figure 8 As shown, the present application also discloses a polishing and grinding device, which adopts the above-mentioned wafer polishing platform 6. A carrier head 36, a cleaning brush 37 and a liquid supply device 38 are arranged above the wafer polishing platform. The carrier head is used to adsorb and press the wafer on the polishing pad of the wafer polishing platform, and can drive the wafer to rotate at the same time. The liquid supply device provides polishing liquid and supplies the heated polishing liquid to the polishing pad. After the polishing pad rotates, the polishing liquid is brought under the carrier head and participates in polishing and grinding. The cleaning brush is used to clean the particles dropped during the polishing process to ensure the polishing quality.

[0057] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or modification made by those skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A polishing and grinding turntable, characterized in that: It includes a marble platform and a polishing disc, wherein a mounting frame is provided on the marble platform, a hollow direct-drive motor is provided on the mounting frame, and the rotor end surface of the hollow direct-drive motor is connected to the bottom of the polishing disc; A hollow tube is further provided inside the rotor, the top of the hollow tube is fixedly connected to the polishing disc, the bottom of the hollow tube passes through the hollow direct drive motor and is connected to the mounting base, a magnetic ring is provided on the mounting base, and a reading sensor is provided at the bottom of the mounting frame, and the reading sensor cooperates with the magnetic ring to form a magnetic ring encoder; A plurality of air-floating support blocks are evenly arranged on the marble platform in the peripheral direction of the mounting frame, the top end surface of the air-floating support block is arranged below the polishing plate, a flow channel is arranged in the air-floating support block, one end of the flow channel is connected to the air source, and the air outlet of the flow channel is located on the top end surface of the air-floating support block; A polishing pad is provided on the surface of the polishing disc; The magnetic ring encoder is used to detect the amount of runout when the polishing disc rotates, and the air source controls the air supply pressure according to the amount of runout.

2. The polishing and grinding turntable according to claim 1, characterized in that: The polishing plate includes an upper fixed plate and a lower cooling plate. The middle of the lower cooling plate is provided with an avoidance hole. A cooling channel is provided in the lower cooling plate. The cooling channel and the inlet and outlet are all provided in the avoidance hole and are installed with pipe joints.

3. The polishing and grinding turntable according to claim 2, characterized in that: The cooling channel includes a plurality of fan-shaped grooves, an inlet channel is provided on the side wall of the fan-shaped groove close to the avoidance hole, and an outlet channel is provided on the side wall away from the avoidance hole. A return channel is provided in the lower cooling plate below the fan-shaped groove, one end of the return channel is connected with the avoidance hole, and a connecting channel is provided between the other end of the return channel and the outflow channel.

4. The polishing and grinding turntable according to claim 2, wherein: The upper fixed plate is provided with a mounting hole, the lower cooling plate is provided with a mounting groove, a thickness gauge is fixed in the mounting hole, the data line of the thickness gauge is arranged along the mounting groove, the avoidance hole and the hollow tube, and the detection window of the thickness gauge is highly consistent with the surface of the upper fixed plate.

5. The polishing and grinding turntable according to claim 4, characterized in that: A gas-electric slip ring is also provided at the bottom of the installation base plate, and the data line and the pipe joint of the thickness gauge are connected to the gas-electric slip ring.

6. The polishing and grinding turntable according to claim 1, wherein: A screw rod is provided at the bottom of the air-floating support block, an internal thread base is provided on the marble platform, and the screw rod is fixedly connected to the internal thread base via a nut.

7. The polishing and grinding turntable according to claim 1, wherein: A liquid receiving baffle ring is provided on the outer periphery of the polishing disc, and a liquid receiving groove is provided at the bottom of the liquid receiving baffle ring.

8. The polishing and grinding turntable according to claim 7, wherein: At least two lifting cylinders are arranged between the bottom of the liquid receiving baffle ring and the marble platform. The lifting cylinders drive the liquid receiving baffle ring to rise and fall. A guide slider is fixedly installed on one side of the lifting cylinder. A horizontal support arm is provided on the top of the guide slider. The horizontal support arm is connected to the bottom of the liquid receiving baffle through an adapter, and the horizontal support arm is also connected to the telescopic rod of the lifting cylinder.

9. The polishing and grinding turntable according to claim 1, wherein: A gas pressure regulating valve is set between the gas source and each air-floating support block. The gas pressure regulating valve controls the gas supply pressure of the corresponding air-floating support block, and adjusts the polishing disc's runout by the gas supply pressure. The adjustment method includes the following steps: Step 1: Multiple gas pressure regulating valves supply gas at the same base pressure P and perform rotation detection. The rotation detection includes driving the polishing disc to rotate n times by a hollow direct-drive motor. The polishing disc drives the magnetic ring to rotate synchronously. The reading sensor reads the detection value of the magnetic ring in each circle and calculates the average runout value after n circles. If the average runout value meets the requirements, the adjustment is completed. If the average runout value does not meet the requirements, continue with the following steps: Step 2: Perform boost adjustment on one of the gas pressure regulating valves, and supply gas to the base pressure P for the other gas pressure regulating valves. Perform rotation detection to obtain the average monotonic pressure fluctuation value. Each gas pressure regulating valve corresponds to a monotonic pressure average fluctuation value. When the monotonic pressure average fluctuation value obtained from one rotation detection meets the requirements, the adjustment is completed. If the monotonic pressure average fluctuation value does not meet the requirements, continue with the following steps: Step 3: Group multiple gas pressure regulating valves, perform boost adjustment on the gas pressure regulating valves in a single group, and supply gas to the base pressure P for the remaining gas pressure regulating valves. Perform rotation detection to obtain a multi-pressure average jitter value. Each group of gas pressure regulating valves corresponds to a multi-pressure average jitter value. When the multi-pressure average jitter value obtained from one rotation detection meets the requirements, the adjustment is completed. If the single pressure average jitter value does not meet the requirements, a manual intervention operation is prompted. The calculation method of the above rotation detection is as follows: the detection value of the magnetic ring in each circle is read by a reading sensor, and the maximum and minimum values ​​of each circle are recorded. The average value of the n maximum values ​​is obtained to obtain the jump height MAX, and the average value of the n minimum values ​​is obtained to obtain the jump height MIN, and the difference between the jump height MAX and the jump height MIN is calculated.

10. A polishing and grinding device, characterized in that: It comprises the polishing and grinding turntable according to any one of claims 1 to 8, wherein a carrying head, a cleaning brush and a liquid supply device are arranged above the polishing and grinding turntable.

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