Cover plate manufacturing method, cover plate and electronic device

Abstract

The invention discloses a manufacturing method of a cover plate, the cover plate and an electronic device. The manufacturing method of the cover plate provided by the embodiment of the invention comprises the following steps: providing a base material; photoresist is arranged on the base material; exposing and developing the photoresist to form a texture pattern; and etching the material at the texture pattern to form the three-dimensional texture. According to the manufacturing method provided by the embodiment of the invention, the texture pattern and the three-dimensional texture are formed in sequence by arranging the photoresist on the substrate and exposing and developing the photoresist, so that the three-dimensional texture etched subsequently has relatively high precision, and the appearance and the hand feeling of the cover plate are further improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and in particular to a method for manufacturing a cover plate, a cover plate, and an electronic device. Background Art

[0002] With the continuous development of the electronic technology industry, users have higher requirements for the appearance and feel of electronic devices. Among them, the back cover is the key to the appearance and feel design of smartphones.

[0003] In the related art, the substrate for manufacturing the cover plate is directly etched with chemicals, or the substrate for manufacturing the cover plate is processed by laser engraving, so that the texture appears on the manufactured back cover plate, in order to obtain an eye-catching appearance and a comfortable feel. However, the texture produced by the above method has low precision, is not delicate in appearance, and has the problem of abrasive feeling in the feel. Summary of the invention

[0004] The present application provides a method for manufacturing a cover plate, a cover plate, and an electronic device.

[0005] The manufacturing method of the cover plate of the embodiment of the present application includes:

[0006] providing a substrate;

[0007] Disposing a photoresist on the substrate;

[0008] exposing and developing the photoresist to form a texture pattern;

[0009] The material at the texture pattern is etched to form a three-dimensional texture.

[0010] In the manufacturing method of the embodiment of the present application, by setting a photoresist on the substrate and exposing and developing the photoresist, the texture pattern and the three-dimensional texture are formed in sequence, so that the subsequently etched three-dimensional texture has higher precision, thereby improving the appearance and feel of the cover.

[0011] The cover plate of the embodiment of the present application is manufactured by using the manufacturing method described in the above embodiment.

[0012] The cover plate of the embodiment of the present application includes a body, which includes a first surface and a second surface opposite to the first surface, the first surface is formed with a three-dimensional texture, the three-dimensional texture has multiple microscopic crystal forms, and the width and depth ratio of the microscopic crystal forms ranges from 3 to 6.

[0013] The electronic device according to the embodiment of the present application includes the cover plate described in the above embodiment.

[0014] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 is a schematic flow chart of a method for manufacturing a cover plate according to an embodiment of the present application;

[0017] Figure 2 is a schematic diagram of a manufacturing process of a cover plate according to an embodiment of the present application;

[0018] Figure 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0019] Figure 4 is a schematic flow chart of a method for manufacturing a cover plate according to an embodiment of the present application;

[0020] Figure 5 is a schematic flow chart of a method for manufacturing a cover plate according to an embodiment of the present application;

[0021] Figure 6 is a schematic structural diagram of a cover plate according to an embodiment of the present application;

[0022] Figure 7 It is a cross-sectional view of a cover plate according to one embodiment of the present application.

[0023] Description of reference numerals:

[0024] Cover plate 100 ; substrate 10 ; photoresist 200 ; pattern chrome plate 300 ; cover plate original sheet 11 ; electronic device 1000 ; body 20 ; first surface 21 ; second surface 22 ; three-dimensional texture 30 ; microscopic crystal type 31 ; functional layer 40 . DETAILED DESCRIPTION

[0025] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0029] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0030] See also Figure 1 and Figure 2 , the manufacturing method of the cover plate 100 of the embodiment of the present application includes:

[0031] S10, providing a substrate 10;

[0032] S20, disposing a photoresist 200 on the substrate 10;

[0033] S30, exposing and developing the photoresist 200 to form a texture pattern;

[0034] S40, etching the material at the texture pattern to form a three-dimensional texture.

[0035] In the manufacturing method of the embodiment of the present application, by setting a photoresist 200 on the substrate 10 and exposing and developing the photoresist 200, the texture pattern and the three-dimensional texture are formed in sequence, so that the subsequently etched three-dimensional texture has higher precision, thereby improving the appearance and feel of the cover 100.

[0036] Specifically, see Figure 3 The cover plate 100 of the embodiment of the present application is prepared by the manufacturing method described in the above embodiment. The cover plate 100 is suitable for an electronic device 1000. The electronic device 1000 may be, but is not limited to, a mobile phone, a laptop computer, a tablet computer, a smart watch, etc. For ease of description, the back cover of the electronic device 1000 is used as the cover plate 100 of the embodiment of the present application.

[0037] The substrate 10 may be a glass plate, such as high-aluminum glass, soda-lime glass, etc. Taking the substrate 10 as high-aluminum glass as an example, a large piece of high-aluminum glass may be cut into a plurality of middle pieces of glass of a preset size by a diamond knife, and then each middle piece of glass is subjected to edge grinding and chamfering.

[0038] Furthermore, the dirt such as grease, sweat, dust, impurities, etc. on the middle glass can be washed away by ultrasonic cleaning with a 5% alkaline cleaning agent. After cleaning, the middle glass is dried at a temperature of 80° C. or other temperature that can gasify the liquid on the surface of the middle glass without damaging the middle glass, thereby obtaining the substrate 10.

[0039] See also Figure 4 , the photoresist 200 can be disposed on the substrate 10 by a coating process. In some embodiments, disposing the photoresist 200 on the substrate 10 (step S20) includes:

[0040] S21, coating a photoresist 200 solution on the substrate 10 by using a slit coating process or a spin coating process;

[0041] S22, curing the photoresist 200 molten material.

[0042] The slit coating process or the spin coating process can quickly deposit a thin and uniform photoresist 200 film on the substrate 10 with high precision. In addition, during the coating process, the utilization rate of the photoresist 200 solvent is high. In addition, the equipment operation cost required by the process is low. At the same time, the cured photoresist 200 solvent is not easy to fall off, thereby reducing the loss of the photoresist 200 during the process flow in the production process.

[0043] Specifically, the photoresist 200 can be an acid-resistant photoresist 200, and the acid resistance of the photoresist 200 requires that it can be in a 3% HF solution for 20 minutes without falling off. Then the substrate 10 coated with the photoresist 200 can be placed in a curing furnace, the furnace temperature can be set to 80°C to 100°C, the actual furnace temperature can fluctuate by 2°C, and the curing time can be 10min to 15min. The above values ​​can be set according to actual needs, based on the fact that the surface of the glue layer of the photoresist 200 after curing is not sticky and the glue falls off when touched by hand.

[0044] In some embodiments, the thickness of the photoresist 200 coated on the substrate 100 is 5 μm ± 0.15 μm. For example, the thickness of the photoresist 200 can be 4.85 μm to 5.05 μm, 4.95 μm to 5.05 μm, 4.98 μm to 5.04 μm, 5 μm to 5.10 μm, 5 μm to 5.15 μm, etc. The thickness of the photoresist 200 can be 4.85 μm, 4.95 μm, 5.04 μm, 5.10 μm, 5.15 μm, etc. Within this range, the probability of poor appearance such as shrinkage cavities and cracks on the substrate 10 coated with the photoresist 200 is reduced.

[0045] When the thickness of the photoresist 200 is less than 4.85 μm, during the coating process of the photoresist 200, shrinkage holes may appear on the surface of the substrate 10 due to surface tension; when the thickness of the photoresist 200 is greater than 5.15 μm, it is not conducive to the curing of the photoresist 200, and the curing time of the photoresist 200 is longer, resulting in low manufacturing efficiency.

[0046] Then, see Figure 2 , use a photolithography machine to expose and develop the photoresist 200, the exposure direction is as shown by the arrow, and the exposure energy of the photolithography machine can be set to 100mj / cm 3 ~300mj / cm 3 . Optionally, the photoresist 200 can be exposed and developed using a patterned chrome plate 300, and a portion of the photoresist 200 can be removed by heating an alkaline solution, for example, a 2% tetramethylammonium hydroxide aqueous solution heated to 60°C is used to spray the photoresist 200 for 3 minutes to remove a portion of the photoresist 200 to form a texture pattern. Among them, the patterned chrome plate 300 can be preset with various patterns according to needs, and the cost of processing patterns on the patterned chrome plate 300 is low and the precision is high, which makes the texture pattern exposed and developed more refined and can improve manufacturing efficiency.

[0047] Furthermore, the photoresist 200 after exposure and development is post-processed to make the photoresist 200 more solidified, so that the photoresist 200 can be closely attached to the substrate 10, thereby improving the subsequent etching resistance stability and consistency. The post-processing can be to place the substrate 10 coated with the photoresist 200 after exposure and development into a curing furnace for further curing, and the curing temperature can be 170°C, and the temperature can fluctuate up and down by 2°C. The above values ​​can be set according to actual needs, subject to the photoresist 200 not falling off during the subsequent etching process.

[0048] Then, the material at the texture pattern is etched, the middle glass is placed in the etching station, and the middle glass is etched with an acidic solution. For example, an etching solution prepared with a mixed acid such as hydrofluoric acid, sulfuric acid, and citric acid is used to etch the middle glass to form a three-dimensional texture. The etching temperature can be 5°C to 10°C. Through different solution configurations and etching temperatures, the three-dimensional texture can present different shapes, which makes the three-dimensional texture designable and controllable.

[0049] In some embodiments, the depth of the three-dimensional texture formed by etching is greater than or equal to 10 μm, so that the cover 100 can provide a comfortable feel; when the depth of the three-dimensional texture is less than 10 μm, the distance between the highest point and the lowest point of the three-dimensional texture is too small, and the user's perception of the texture is not obvious when touching.

[0050] See also Figure 2 and Figure 5In certain embodiments, the manufacturing method comprises:

[0051] S50, removing the photoresist 200 remaining on the substrate 10;

[0052] S60 , performing a splitting process on the substrate 10 having the three-dimensional texture to obtain a plurality of cover plate original sheets 11 .

[0053] In this way, the influence of the photoresist 200 on the subsequent processes is reduced, and the influence of the photoresist 200 on the appearance and feel of the substrate 10 is reduced; at the same time, the split sheet can make the substrate 10 adapt to the cover plates 100 of different shapes and regions. It can be understood that the cover plate 100 of the actual product has multiple planes or curved surfaces with a certain angle, and the split sheet can adapt to these planes or curved surfaces. The split sheet can reduce the other aforementioned processes and form multiple cover plate original sheets 11 at one time, thereby improving manufacturing efficiency.

[0054] Specifically, the photoresist 200 can be removed by heating an alkaline solution, for example, heating a 5% tetramethylammonium hydroxide solution to 60° C. to remove the photoresist 200. The substrate 10 with a three-dimensional texture can be split by laser cutting to obtain a plurality of cover substrate original sheets 11.

[0055] In some embodiments, before trimming and polishing the edge of the cover plate original sheet 11, the manufacturing method further includes:

[0056] A protective layer is applied on the surface of the cover plate original sheet 11 .

[0057] In this way, the protective layer can reduce the probability of the surface of the cover plate original film 11 being corroded in the subsequent polishing process, thereby reducing the poor appearance of the cover plate original film 11.

[0058] Specifically, the protective layer can be UV protective ink, thermosetting protective ink, etc. For example, the surface of the cover plate original sheet 11 is covered with UV protective ink by a sprayer, the ink thickness is about 30±5μm, and then the ink is irradiated for 60s to 120s by a 2000mJ / cm3 high pressure mercury lamp to complete the curing.

[0059] For another example, a sprayer is used to cover the surface of the cover plate original sheet 11 with thermosetting protective ink, the ink thickness is about 30±5 μm, and then the thermosetting protective ink is heated to 160° C. and maintained for 30 minutes to complete the curing.

[0060] In certain embodiments, the method of manufacturing comprises:

[0061] The edge of the cover plate original sheet 11 is trimmed and polished.

[0062] In this way, the edge of the trimmed and polished cover plate original sheet 11 has high assembly properties and is less likely to experience stress concentration, thereby less likely to cause fatigue cracks or fractures.

[0063] Specifically, the cover plate original sheet 11 can be trimmed by a grinding wheel, for example, using a 800# grinding wheel to roughly open the shape and a 1200# grinding wheel to grind, so that the cover plate original sheet 11 initially has the shape of the back cover. Then the middle glass can be laminated, and the edge of the laminated middle glass can be polished by an edge polishing machine. The polishing time can be 20 minutes to 30 minutes, and the removal amount can be 1c to 1.5c.

[0064] After that, the protective ink can be removed by heating the alkaline solution. For example, a 5% NaOH solution is heated to 60°C to 70°C, and the cover plate original sheet 11 is immersed in it. The demoulding time can be 3 minutes, and the appearance requires no residual protective ink.

[0065] In order to repair the knife marks and spot damage on the straight edge, a 10% HF chemical polishing solution is used for immersion reaction. The removal amount can be determined according to actual needs, and the thickness and strength of the final cover plate original sheet 11 shall meet the product requirements.

[0066] According to the design requirements of the cover plate 100, the cover plate original sheet 11 can be heat-bent using a heat-bending mold. For example, the cover plate original sheet 11 is heat-bent using a contoured graphite heat-bending mold, and the temperature during heat-bending can be 780°C to 830°C, and the pressure can be 0.3Mpa to 0.4Mpa, so as to form the flat-shaped cover plate original sheet 11 into a 3D shape. When the heat-bending collapses the three-dimensional texture, a mold imprint will appear. When the haze is within the range of 60% to 90%, the mold imprint can be covered, thereby reducing the impact of the mold imprint on the appearance.

[0067] Then, the straight edge knife marks and spot damage on the cover plate original sheet 11 can be repaired by using a chemical polishing solution to treat the cover plate original sheet 11. For example, the cover plate original sheet 11 is immersed in a 10% HF chemical polishing solution for reaction, and the removal amount can be determined according to actual needs, so that the thickness and strength of the final cover plate original sheet 11 meet the product requirements.

[0068] In certain embodiments, the method of manufacturing comprises:

[0069] The polished cover plate original sheet 11 is subjected to strengthening treatment.

[0070] In this way, the strength of the cover plate original sheet 11 is enhanced, and it can bear a certain impact load and pass a drop test from a certain height.

[0071] Specifically, the cover plate original sheet 11 can be strengthened by chemical ion exchange, dealkalization, or surface crystallization. For example, K+ in molten salt can be used to replace NA+ in glass, then Na+ in molten salt can be used to replace Li+ in glass, and finally K+ in molten salt can be used to replace Na+ in glass.

[0072] Furthermore, black ink may be sprayed on at least a portion of the side of the cover plate original sheet 11 opposite to the side where the three-dimensional texture is formed, and the ink may be baked for 30 minutes at 150° C. to solidify it.

[0073] Then, a fully automatic laminating machine can be used to partially attach the explosion-proof film to the cover plate original sheet 11 . The exposed white size of the edge of the cover plate original sheet 11 is required to be within 0.3 mm, that is, the maximum outline size of the explosion-proof film is smaller than the maximum outline size of the cover plate original sheet 11 .

[0074] Finally, stick the large adhesive, foam and decorative parts according to the design on the drawing to complete the back cover.

[0075] See also Figure 6 and Figure 7 The cover plate 100 of the embodiment of the present invention includes a body 20, the body 20 includes a first surface 21 and a second surface 22 opposite to the first surface 21, the first surface 21 is formed with a three-dimensional texture 30, the three-dimensional texture 30 has a plurality of microscopic crystal forms 31, and the ratio of the width W to the depth H of the microscopic crystal form 31 is in the range of 3-6.

[0076] In the cover plate 100 of the embodiment of the present invention, the three-dimensional texture 30 can provide a comfortable touch feeling, and the multiple microscopic crystal forms 31 can produce different reflection and refraction effects under different light, thereby creating a unique visual effect.

[0077] The number of microcrystalline forms 31 can be two, three, four or even more. The ratio of the width W to the depth H of each microcrystalline form 31 can range from 3-3.5, 3.5-4, 4-4.5, 4.5-5, 5-6, etc.; the ratio of the width W to the depth H of each microcrystalline form 31 can be 3, 3.5, 4, 4.5, 5, 6, etc. When the ratio of the width W to the depth H of the microcrystalline form 31 is within the range of 3-6, the look and feel of the cover plate 100 is balanced and coordinated, thereby enhancing the visual appeal and sense of quality. Ratios beyond the appropriate range may cause visual and tactile imbalances, affect user experience, and increase the difficulty and cost of production.

[0078] Specifically, the three-dimensional texture 30 can be formed in a partial area of ​​the first surface 21, or the three-dimensional texture 30 can be formed in the entire area of ​​the first surface 21. The three-dimensional texture 30 can be a regular shape or an irregular shape. In some embodiments, the microscopic crystal form 31 is roughly hemispherical, which can make the visual effect, texture and touch of the cover better.

[0079] It can be understood that the hemispherical microcrystalline form 31 can focus or scatter light to a specific area. This effect can produce unique reflection and refraction effects, so that the cover 100 presents rich light and shadow changes under different light. The hemispherical microcrystalline form 31 can add a three-dimensional sense and texture to the cover 100. The hemispherical microcrystalline form 31 can provide a smooth and rounded touch, thereby enhancing the tactile experience of the cover. The hemispherical microcrystalline form 31 can have special optical effects. For example, when light is irradiated on the hemispherical microcrystalline form 31, a focusing or scattering effect can be produced to form a unique light spot or halo.

[0080] See also Figure 6 and Figure 7 In some embodiments, the width W of the microscopic crystal form 31 ranges from 40 μm to 60 μm. For example, the width W of the microscopic crystal form 31 can range from 40 μm to 44 μm, 44 μm to 48 μm, 48 μm to 52 μm, 52 μm to 56 μm, 56 μm to 60 μm, etc.; the width W of the microscopic crystal form 31 can be 40 μm, 44 μm, 48 μm, 52 μm, 56 μm, 60 μm, etc.

[0081] Thus, a suitable width W of the microscopic crystal form 31 can enhance the visual effect and texture of the cover plate 100 and create a unique optical effect. A width W beyond a suitable range may lead to an imbalance in visual and tactile effects and a reduction in optical effects.

[0082] It can be understood that the appropriate width W of the microcrystalline form 31 can produce reflection and refraction effects under light, enhancing the visual effect of the cover 100. The change in width W can affect the propagation and reflection path of light, thereby producing rich light and shadow changes, making the appearance of the cover 100 more eye-catching. The appropriate width W can add texture to the cover 100. The change in the width W of the microcrystalline form 31 can provide a delicate touch when touched, thereby improving the tactile experience of the cover 100. The width W of the microcrystalline form 31 can affect the scattering and refraction of light within a certain range, producing specific optical effects. These effects can enhance the visual appeal of the cover 100 and create unique visual effects such as light spots and halos.

[0083] See also Figure 7In some embodiments, the depth H of the microscopic crystal form 31 ranges from 10 μm to 40 μm. For example, the depth H of the microscopic crystal form 31 can range from 10 μm to 18 μm, 18 μm to 26 μm, 26 μm to 34 μm, 34 μm to 38 μm, 38 μm to 40 μm, etc.; the depth H of the microscopic crystal form 31 can range from 10 μm to 18 μm, 26 μm, 34 μm, 42 μm, etc.

[0084] Thus, a suitable depth H of the microscopic crystal form 31 can enhance the visual effect and texture of the cover and create a unique optical effect. A depth H beyond the suitable range may lead to an imbalance in vision and touch, and a reduction in optical effect.

[0085] It can be understood that an appropriate depth H of the microscopic crystal form 31 can produce reflection and refraction effects under light, enhancing the visual effect of the cover plate 100. The change in depth H can affect the propagation and reflection path of light, produce rich light and shadow changes, and make the cover plate 100 more eye-catching. Too large or too small a depth H may cause uneven distribution of reflection and refraction effects, making the visual effect of the cover plate 100 appear uncoordinated or unnatural.

[0086] The appropriate depth H can add texture to the cover 100. The change in the depth H of the microcrystalline form 31 can provide a more delicate touch when touched, enhancing the tactile experience of the cover 100. Too large or too small a depth H may cause discomfort to the touch. If the depth H of the microcrystalline form 31 is too large, it may cause an uncomfortable feeling to the touch, and may even cause a sharp or tingling touch. On the contrary, if the depth H of the microcrystalline form 31 is too small, the touch may be too flat and lack sufficient tactile feedback.

[0087] The depth H of the microscopic crystal form 31 can affect the scattering and refraction of light within a certain range, producing specific optical effects. These effects can enhance the visual appeal of the cover plate 100 and create unique visual effects such as light spots and halos. Depth H beyond the appropriate range may cause the optical effect to be reduced or disappear. Too small or too large a depth H may not produce the desired optical effect, thereby affecting the visual appeal of the cover plate 100.

[0088] See also Figure 6 In some embodiments, the length L of the microscopic crystal form 31 ranges from 40 μm to 60 μm. For example, the length L of the microscopic crystal form 31 can range from 40 μm to 45 μm, 45 μm to 50 μm, 50 μm to 55 μm, 55 μm to 60 μm, etc.; the length L of the microscopic crystal form 31 can range from 40 μm to 45 μm, 50 μm, 55 μm, 60 μm, etc.

[0089] Thus, a suitable length L of the microscopic crystal form 31 can enhance the visual effect and texture of the cover plate 100 and create a unique optical effect. A length L beyond a suitable range may lead to an imbalance in visual and tactile effects and a reduction in optical effects.

[0090] It can be understood that the appropriate length L of the microcrystalline form 31 can produce reflection and refraction effects under light, enhancing the visual effect of the cover 100. The change in length L can affect the propagation and reflection path of light, thereby producing rich light and shadow changes, making the appearance of the cover 100 more eye-catching. The appropriate length L can add texture to the cover 100. The change in the length L of the microcrystalline form 31 can provide a delicate touch when touched, thereby improving the tactile experience of the cover 100. The length L of the microcrystalline form 31 can affect the scattering and refraction of light within a certain range, producing specific optical effects. These effects can enhance the visual appeal of the cover 100 and create unique visual effects such as light spots and halos.

[0091] It is worth noting that the depth H, width W and length L of different microscopic crystal forms 31 may be the same or different.

[0092] In some embodiments, the haze of the first surface 21 ranges from 60% to 95%. For example, the haze of the first surface 21 can range from 60% to 70%, 70% to 80%, 80% to 85%, 85% to 90%, 90% to 95%; the haze of the first surface 21 can range from 60%, 70%, 80%, 85%, 90%, 95%, etc.

[0093] In this way, the right amount of haze can optimize visual effects, reduce the visibility of fingerprints and stains, and enhance the tactile experience.

[0094] It can be understood that a suitable haze can optimize the visual effect, make the light on the surface of the cover plate 100 scattered evenly, and reduce the appearance of reflection and light spots. This can make the cover plate 100 provide a clearer and more transparent visual experience. Too high or too low haze may lead to a decrease in visual quality. Too high haze may make the vision blurred. Too low haze may make the surface too transparent, and the reflection and light spots are more obvious, affecting the visual effect.

[0095] A higher haze can effectively cover up these marks, making the surface of the cover plate 100 look cleaner and more flawless. Appropriate haze can improve the tactile experience. Appropriate haze can provide moderate friction when touching the cover plate 100, increase the contact between the finger and the surface, and thus provide better tactile feedback. Too high or too low haze may affect the tactile experience. Too high haze may make the surface too rough, causing an uncomfortable feeling to the touch. Too low haze may make the surface too smooth, reducing the friction between the finger and the surface and reducing the tactile feedback.

[0096] In addition, appropriate haze can reduce the visibility of fingerprints, stains and other marks on the surface of the cover plate 100.

[0097] See also Figure 6 In some embodiments, the spacing D between two adjacent microscopic crystal forms 31 ranges from 10 μm to 15 μm. For example, the spacing D between two adjacent microscopic crystal forms 31 may range from 10 μm to 11 μm, 11 μm to 12 μm, 12 μm to 13 μm, 13 μm to 14 μm, or 14 μm to 15 μm; the spacing D between two adjacent microscopic crystal forms 31 may range from 10 μm to 11 μm, 12 μm, 13 μm, 14 μm, or 15 μm.

[0098] Thus, a suitable spacing D between the microscopic crystal forms 31 can enhance the visual effect, spatial sense and optical effect of the cover plate 100. A spacing D beyond a suitable range may cause visual imbalance, limited tactile sense and limited optical effect.

[0099] It can be understood that a suitable spacing D between the microscopic crystal forms 31 can enhance the visual effect of the back cover of the mobile phone. Appropriate spacing D can produce more uniform reflection and refraction effects under light, create a more layered light and shadow change, and make the appearance of the cover plate 100 more attractive. Too large or too small spacing D may lead to uneven or uncoordinated visual effects. Too large spacing D may cause the blank area between the microscopic crystal forms 31 to be too large, making the visual effect appear sparse or incomplete. Too small spacing D may make the pattern between the microscopic crystal forms 31 too dense, and the visual effect is too crowded or chaotic.

[0100] The appropriate spacing D can increase the sense of space between the microscopic crystal forms 31. The change in spacing D between the microscopic crystal forms 31 can allow the observer to perceive the textures of different levels and depths H, bringing a more three-dimensional effect to the cover plate 100.

[0101] The appropriate spacing D between the microscopic crystal forms 31 can optimize the optical effect. The appropriate spacing D can adjust the propagation and scattering path of light, produce the desired optical effects, such as reflection, refraction, diffuse reflection, etc., and enhance the visual appeal of the back cover of the mobile phone. Spacing D beyond the appropriate range may reduce the expressiveness of the optical effect. Spacing D that is too large or too small may not produce the desired optical effect, resulting in reduced visual appeal and special effects.

[0102] A suitable spacing D can provide the cover plate 100 with a comfortable touch experience, while a too small spacing D may limit the touch. If the spacing D between the microscopic crystal forms 31 is too small, it may be difficult to distinguish or feel the texture changes of the microscopic crystal forms 31 when touching, and the touch experience is limited.

[0103] It is worth noting that, among the multiple microscopic crystal forms 31 , the distance D between two different adjacent microscopic crystal forms 31 may be the same or different.

[0104] See also Figure 6 In some embodiments, the cover plate 100 includes a functional layer 40 disposed on the second surface 22. The second functional layer 40 may be an ink layer, a heat dissipation layer, etc., to improve the service life of the cover plate 100.

[0105] Specifically, the second functional layer 40 can be disposed on the second surface 22 by spraying, attaching, or the like.

[0106] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0107] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for manufacturing a cover plate, characterized in that: include: providing a substrate; Disposing a photoresist on the substrate; exposing and developing the photoresist to form a texture pattern; The material at the texture pattern is etched to form a three-dimensional texture.

2. The manufacturing method according to claim 1, characterized in that: The step of providing a photoresist on the substrate comprises: Applying a photoresist solution on the substrate by using a slit coating process or a spin coating process; The photoresist solution is cured.

3. The manufacturing method according to claim 1, characterized in that: The thickness of the photoresist is 5 μm±0.15 μm.

4. The manufacturing method according to claim 1, characterized in that: The manufacturing method comprises: removing the photoresist remaining on the substrate; The substrate with the three-dimensional texture is subjected to a splitting process to obtain a plurality of cover plate original sheets.

5. The manufacturing method according to claim 4, characterized in that: The manufacturing method comprises: The edge of the cover plate original sheet is trimmed and polished.

6. The manufacturing method according to claim 5, characterized in that: Before trimming and polishing the edge of the cover plate original sheet, the manufacturing method further includes: A protective layer is coated on the surface of the cover plate original sheet.

7. The manufacturing method according to claim 5, characterized in that: The manufacturing method comprises: The polished cover plate original sheet is subjected to strengthening treatment.

8. A cover plate, characterized in that: The cover plate is manufactured by the manufacturing method according to any one of claims 1 to 7.

9. A cover plate, characterized in that: The invention comprises a main body, wherein the main body comprises a first surface and a second surface opposite to the first surface, wherein a three-dimensional texture is formed on the first surface, wherein the three-dimensional texture has a plurality of microscopic crystal forms, and a ratio of a width to a depth of the microscopic crystal forms ranges from 3 to 6.

10. The cover plate according to claim 9, characterized in that: The width of the microscopic crystal is in the range of 40 μm to 60 μm.

11. The cover plate according to claim 9, characterized in that: The depth of the microscopic crystal form ranges from 10 μm to 40 μm.

12. The cover plate according to claim 9, characterized in that: The length of the microscopic crystal is in the range of 40 μm to 60 μm.

13. The cover plate according to claim 9, characterized in that: The haze of the first surface ranges from 60% to 95%.

14. The cover plate according to claim 9, characterized in that: The distance between two adjacent microscopic crystal forms ranges from 10 μm to 15 μm.

15. The cover plate according to claim 9, characterized in that: The microscopic crystal is roughly hemispherical.

16. The cover plate according to claim 9, characterized in that: The cover plate includes a functional layer disposed on the second surface.

17. An electronic device, characterized in that: The cover plate comprises the cover plate according to any one of claims 8 to 16.

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