A high-power ATX power supply module

Abstract

The present invention relates to the technical field of computer power supplies, and specifically provides a high-power ATX power supply module, which includes a power supply body. A power interface is provided at one end of the power supply body, and an output interface is provided at the other end. A heat sink plate is horizontally arranged inside the power supply body. The evaporation end of one end of the heat sink plate is in contact with the heat-generating components inside the power supply body, and the condensation end of the other end is away from the heat-generating components. A capillary plate and support columns are arranged inside the heat sink plate. A tapered opening is provided at the bottom of the support column, with the large end of the tapered opening facing downwards, and a plurality of flow holes are provided on the side wall of the tapered opening, so that the liquid working medium evaporated at the bottom of the support column is not affected by the support column. Compared with traditional support columns, the support column of the present invention has less influence on the steam flow, making the temperatures at both ends of the heat sink plate similar, thereby improving the heat conduction effect of the heat sink plate and further improving the overall heat dissipation effect of the power supply module.

Description

Technical Field

[0001] The present invention relates to the technical field of computer power supplies, and particularly to a high-power ATX power supply module. Background Art

[0002] A power supply module refers to a module that converts electrical energy into the required voltage or current and is applicable to various electronic devices. A high-power power supply module refers to a power supply module that can output a relatively large current and power and is commonly found in devices or systems that require high power, such as servers, communication devices, industrial automation devices, etc.

[0003] For example, in an assembled desktop computer, the power supply module of the computer is an important component for powering the computer, and its interior often requires a heat dissipation structure to ensure its normal operation. Chinese Patent CN113207264A discloses a power supply heat dissipation device and a power supply. This solution is provided with a heat pipe, enabling the heat on the power supply board to be quickly transferred and diffused to the heat dissipation structure and the cooling pipeline, thereby reducing the heat flux density on the power supply board.

[0004] Support columns are arranged inside the heat pipe in the above solution. The support columns are used to support the upper and lower plates of the heat pipe. However, the arrangement of the support columns will hinder the flow of liquid and gas in the steam chamber, resulting in a relatively large temperature difference at both ends of the heat pipe. Moreover, the heat conduction effect at the position where the support columns are located is relatively poor compared to other positions, which is not conducive to the heat dissipation of the power supply module. Summary of the Invention

[0005] Based on this, in view of the problem of a relatively large temperature difference at both ends of the heat pipe and poor overall heat dissipation effect in the current heat dissipation of the power supply module, it is necessary to provide a high-power ATX power supply module.

[0006] The above object is achieved by the following technical solutions:

[0007] A high-power ATX power supply module includes:

[0008] A power supply body, with a plurality of output interfaces arranged at one end of the power supply body, and a power supply interface arranged at the other end of the power supply body;

[0009] A heat dissipation component, which includes a heat pipe and a capillary plate. The heat pipe is installed inside the power supply body. The interior of the heat pipe is hollow and in a negative pressure state. The interior of the heat pipe is filled with a liquid working medium. One end of the heat pipe is an evaporation end, and the other end is a condensation end. The evaporation end absorbs heat and gradually transfers it to the condensation end. The capillary plate is located inside the heat pipe, and the capillary plate can transport the liquid working medium from the condensation end to the evaporation end to form a cycle;

[0010] Support column, the support column is located inside the heat sink plate, the bottom of the support column has a conical opening with the small end facing upward and the large end facing downward, and a flow hole is provided on the side wall of the conical opening. The large end of the conical opening at the bottom of the support column abuts against the capillary plate, and the upper end of the support column abuts against the inner wall of the heat sink plate.

[0011] Further, the heat sink plate includes an upper shell plate and a lower shell plate, the upper shell plate and the lower shell plate are attached to each other to form a sealed cavity. A conical groove is provided on the upper surface of the upper shell plate, the conical groove penetrates downward through the bottom of the upper shell plate and protrudes downward with a conical tip. The small end of the conical tip is connected to the support column, the upper end of the support column cooperates with the conical tip, and the diameter of the support column gradually decreases from bottom to top.

[0012] Further, the material of the support column is copper.

[0013] Further, there are several support columns, and several support columns are evenly distributed inside the heat sink plate. A connecting rod is provided between adjacent support columns, and the connecting rod connects several support columns into a whole.

[0014] Further, the capillary plate is a copper powder sintered capillary plate.

[0015] Further, the heat dissipation assembly further includes a heat dissipation fan and heat dissipation fins. The heat dissipation fins are located near the heat sink plate, the heat dissipation fan is located above the heat dissipation fins and the heat sink plate, and the heat dissipation fan can blow out the heat inside the power supply body.

[0016] Further, a fence through groove is provided on the upper end surface of the power supply body, and the heat blown out by the heat dissipation fan passes through the fence through groove.

[0017] Further, one end surface where the power interface on the power supply body is located is a dust-proof net plate.

[0018] Further, the dust-proof net plate is detachably installed on the power supply body.

[0019] Further, a switch is provided on the power supply body, and the switch can control the on-off of the power supply.

[0020] The beneficial effects of the present invention are:

[0021] In the present invention, a conical opening is provided at the bottom position where the support column contacts the capillary plate. The large end of the conical opening faces downward, and a plurality of circulation holes are provided on the side wall of the conical opening. Thus, the liquid working medium evaporated at the bottom of the support column is not affected by the support column. The steam formed by the liquid working medium passes through the conical opening at the bottom of the support column and then enters the cavity of the heat pipe through the circulation holes. Compared with the traditional support column, the support column of the present invention has less influence on the steam flow, making the temperatures at both ends of the heat pipe similar, thereby improving the heat conduction effect of the heat pipe and further enhancing the overall heat dissipation effect of the power supply module.

[0022] In the present invention, a groove is provided on the upper shell plate, increasing the contact area between the upper surface of the upper shell plate and the air, enabling more heat to be dissipated into the air through convection, conduction, and radiation. The larger surface area can accelerate the diffusion of heat from the upper shell plate to the surrounding air, thereby further improving the heat dissipation efficiency.

[0023] The diameter of the support column of the present invention gradually decreases from bottom to top. Compared with the cylindrical support column in the prior art, the influence of the support column on the steam flow is further reduced. Description of the Drawings

[0024] Figure 1 is a schematic structural diagram of a high-power ATX power supply module provided by an embodiment of the present invention;

[0025] Figure 2 is a schematic structural diagram of another angle of a high-power ATX power supply module provided by an embodiment of the present invention;

[0026] Figure 3 is a schematic diagram of a partial internal structure of a high-power ATX power supply module provided by an embodiment of the present invention;

[0027] Figure 4 is a schematic structural diagram of the heat pipe of a high-power ATX power supply module provided by an embodiment of the present invention;

[0028] Figure 5 is a schematic diagram of the cross-section of the heat pipe of a high-power ATX power supply module provided by an embodiment of the present invention;

[0029] Figure 6 is Figure 5 a partially enlarged view of part X of the heat pipe of a high-power ATX power supply module provided by an embodiment in

[0030] Wherein:

[0031] 100, power supply body; 110, power supply interface; 120, output interface; 130, circuit board; 140, fence through slot; 150, dust-proof net plate; 160, switch;

[0032] 200, heat pipe; 201, evaporation end; 202, condensation end; 210, upper shell plate; 211, groove; 212, conical tip; 220, lower shell plate; 221, sealed cavity; 230, capillary plate; 240, support column; 250, conical opening; 251, circulation hole; 260, connecting rod;

[0033] 300, cooling fan; 310, cooling fins. Detailed implementation manner

[0034] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0035] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meanings. The "connection" and "coupling" mentioned in the present invention, unless otherwise clearly specified and defined, both include direct and indirect connections (couplings). In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0036] In the present invention, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0037] The following refers to Figures 1 - 6 to describe a high-power ATX power supply module provided by the present invention.

[0038] A high-power ATX power supply module, suitable for power supply of a computer, includes a power supply body 100. One end of the power supply body 100 is provided with a power interface 110, and the power interface 110 is connected to a 220V power supply line. The other end of the power supply body 100 is provided with a plurality of output interfaces 120, and the output interfaces 120 are connected to various electrical components of the computer, such as a computer motherboard, a central processing unit (CPU), a graphics card, etc. The voltage output by the output interfaces 120 is the voltage required by each electrical component. A circuit board 130 is provided inside the power supply body 100, and various components (not shown in the figure) are provided on the circuit board 130 to perform different functions. These components on the circuit board 130 will generate heat during normal operation, and a heat dissipation component is also provided inside the power supply body 100. The heat dissipation component is used to dissipate the heat generated by these components from the power supply body 100, thereby preventing the temperature from being too high and affecting the normal operation of the power supply body 100.

[0039] The heat dissipation component includes a heat pipe 200 and a wick 230. The heat pipe 200 is located inside the power supply body 100 and is horizontally installed on the circuit board 130. The bottom of the heat pipe 200 is various heat-generating components. The inside of the heat pipe 200 is hollow and in a negative pressure state. The inside of the heat pipe 200 is filled with a liquid working medium, and the liquid working medium is generally pure water. The negative pressure state is to lower the boiling point of the liquid working medium, so that the liquid working medium can evaporate at a lower temperature. In this way, even at a relatively low working temperature (such as the temperature when the components generate heat), the liquid working medium can quickly evaporate and transfer heat. One end of the two ends of the heat pipe 200 is an evaporation end 201, and the other end is a condensation end 202. The evaporation end 201 of the heat pipe 200 is in contact with the heat-generating components, while the condensation end 202 is far from the heat-generating components. The evaporation end 201 absorbs the heat of the heat-generating components, and the liquid working medium inside the evaporation end 201 evaporates to generate steam. The steam forms a higher pressure in this area. Since the pressure at the evaporation end 201 is higher than that at the condensation end 202, the steam flows from the evaporation end 201 to the condensation end 202 along the pressure gradient. After reaching the condensation end 202, the steam encounters a lower temperature and condenses back into the liquid working medium, releasing heat. At the same time, a wick 230 is provided inside the heat pipe 200, and the function of the wick 230 is to return the condensed liquid working medium to the evaporation end 201, thereby completing the cycle and enabling the heat pipe 200 to continuously absorb and release heat.

[0040] A support column 240 is also provided inside the heat pipe 200. The function of the support column 240 is to support the cavity inside the heat pipe 200. Since the inside of the heat pipe 200 is in a negative pressure state, the side walls inside the heat pipe 200 tend to approach each other. By providing the support column 240, the side walls are prevented from contacting each other and thus hindering the flow of steam. A tapered opening 250 is formed at the bottom of the support column 240 of the present invention. The large end of the tapered opening 250 faces downward and the small end faces upward. A plurality of flow holes 251 are formed on the side wall of the tapered opening 250. The flow holes 251 can allow gas or liquid working medium to pass through. The bottom of the support column 240 is supported on the capillary plate 230, and the upper end of the support plate abuts against the inner wall of the heat pipe 200.

[0041] It should be noted that the tapered opening 250 at the bottom of the support column 240 of the present invention does not hinder the evaporation of the liquid working medium in the capillary plate 230. If it is an ordinary support column 240, the bottom surface of the support column 240 is flat and fits on the capillary plate 230. When the liquid working medium in the capillary plate 230 at the contact position of the bottom surface of the support column 240 is heated, the liquid working medium will be blocked by the support column 240 and the evaporation efficiency will be reduced. Moreover, the evaporated steam needs to flow through other positions, resulting in a reduction in the steam flow efficiency. However, due to the tapered opening 250 at the bottom of the support column 240 of the present invention, the contact area between the bottom of the support column 240 and the capillary plate 230 is smaller, so that the liquid working medium at the bottom of the support column 240 can evaporate normally. And the flow holes 251 are formed on the side wall of the tapered opening 250, so that the steam can enter the tapered opening 250 and be discharged from the flow holes 251, without hindering the flow of the steam. Thus, the steam flow effect inside the heat pipe 200 is better, the temperatures at both ends of the heat pipe 200 are similar, and further the heat conduction effect of the heat pipe 200 is improved, and the overall heat dissipation effect of the power supply module is also improved, and the power supply body 100 can supply power stably.

[0042] Specifically, the heat pipe 200 in this embodiment includes an upper shell plate 210 and a lower shell plate 220. The upper shell plate 210 and the lower shell plate 220 are mutually attached to form a sealed cavity 221. A tapered groove 211 is formed on the upper surface of the upper shell plate 210, which can increase the contact area between the upper shell plate 210 and the air. It can be understood that, compared with not forming the groove 211 on the upper surface of the upper shell plate 210, the groove 211 increases the total contact area of the upper surface of the upper shell plate 210, so that more heat can be dissipated into the air through convection, conduction and radiation. The larger surface area can accelerate the diffusion of heat from the upper shell plate 210 to the surrounding air, thereby further improving the heat dissipation efficiency.

[0043] Meanwhile, the groove 211 penetrates downward, thereby forming a downwardly protruding conical tip 212 at the bottom of the upper shell plate 210. The upper end of the support column 240 has a recess that mates with the conical tip 212. When the upper shell plate 210 and the lower shell plate 220 are connected to each other, the conical tip 212 of the upper shell plate 210 will be inserted into the upper end of the support column 240. After the upper shell plate 210 and the lower shell plate 220 are connected, the internal sealed cavity 221 needs to be evacuated. At this time, the support column 240 supports the upper shell plate 210 and the lower shell plate 220. Specifically, the capillary plate 230 is attached to the upper surface of the lower shell plate 220, and the support column 240 is located on the upper surface of the capillary plate 230. The upper end of the support column 240 mates with the conical tip 212 to support the upper shell plate 210 and the lower shell plate 220, preventing the sealed cavity 221 from being affected by the negative pressure environment. Moreover, the diameter of the support column 240 gradually decreases from bottom to top. Compared with the cylindrical support column 240 in the prior art, the influence of the support column 240 on the steam flow is further reduced.

[0044] It can be understood that the support column 240 of the present invention not only plays a supporting role, but also has a small influence on the steam flow, thereby ensuring smooth steam flow in the heat pipe 200.

[0045] More specifically, the material of the support column 240 in the present invention is copper. Copper has excellent thermal conductivity. Copper has a very high thermal conductivity coefficient and can effectively conduct the heat of the evaporation end 201. Using copper as the material of the support column 240 can help transfer the heat from the evaporation end 201 to the condensation end 202, further improving the overall thermal conductivity of the heat pipe 200, reducing the temperature difference, and improving the heat dissipation efficiency. At the same time, copper has good mechanical strength and toughness, and can provide stable support inside the heat pipe 200 to prevent deformation. Even in a high-temperature or cyclic thermal stress environment, the support column 240 made of copper can maintain the stability of its shape and function, extending the service life of the heat pipe 200. Moreover, in a sealed vacuum cavity, copper has excellent antioxidant and anti-corrosion properties and is not prone to corrosion, oxidation and other reactions, which helps to keep the inside of the heat pipe 200 clean and the working medium pure, ensuring long-term stable thermal conductivity.

[0046] It should be noted that the material of the support column 240 in the present invention is not limited to copper. Other materials with more excellent properties can also be used, and no specific limitation is made here.

[0047] In a further embodiment, there are a plurality of support columns 240, which are evenly distributed on the capillary plate 230. A connecting rod 260 is arranged between adjacent support columns 240. The connecting rod 260 connects the plurality of support columns 240 into a whole. A plurality of connecting rods 260 form a framework to fix the positions of the plurality of support columns 240. Thus, when the upper shell plate 210 and the lower shell plate 220 are installed, the framework formed by the plurality of connecting rods 260 can fix the positions of the support columns 240, facilitating the connection between the conical tip 212 of the upper shell plate 210 and the support columns 240 and improving the assembly efficiency.

[0048] Specifically, the capillary plate 230 in the embodiment of the present invention is a capillary plate 230 sintered with copper powder. The capillary plate 230 sintered with copper powder has a porous structure, and the porous structure has good capillary force, which can effectively adsorb and transport the liquid working medium. Inside the heat pipe 200, the capillary plate 230 can quickly return the liquid working medium at the condensation end 202 to the evaporation end 201, ensuring the continuity of the liquid working medium circulation and the efficient operation of the heat pipe 200. At the same time, copper has excellent thermal conductivity. The capillary plate 230 sintered with copper powder can not only provide capillary action, but also effectively conduct heat through the heat conduction path between metal copper particles. In this way, the capillary plate 230 can help to evenly distribute the heat at the evaporation end 201 and the condensation end 202 to a certain extent, improving the overall heat conduction efficiency.

[0049] It should be noted that the pore channels of the capillary plate 230 sintered with copper powder are uniform, which can keep the separation of the liquid working medium and the steam flow channel, reduce the interference between the liquid working medium and the steam, and make the steam flow more smoothly. This can improve the heat transfer effect of the heat pipe 200 and make the heat conduction efficiency more efficient.

[0050] In a further embodiment, the heat dissipation assembly further includes a heat dissipation fan 300 and heat dissipation fins 310. The heat dissipation fins 310 are located near the heat pipe 200. The heat dissipation fins 310 can absorb the heat of the heat pipe 200. At the same time, the heat dissipation fan 300 is arranged above the heat dissipation fins 310 and the heat pipe 200. The heat dissipation fan 300 discharges the heat of the heat dissipation fins 310 and the heat pipe 200 from the power supply body 100, thereby reducing the heat accumulation inside the power supply body 100.

[0051] Specifically, a plurality of fence through grooves 140 are formed on the upper end surface of the power supply body 100, and the heat dissipation fan 300 is located below the fence through grooves 140. When the heat dissipation fan 300 rotates, the heat dissipation fan 300 discharges the heat inside the power supply body 100. The fence through grooves 140 can allow the heat to pass through, and the fence through grooves 140 can also prevent other sundries from falling into the power supply body 100, thereby protecting the heat dissipation fan 300 and the power supply body 100.

[0052] More specifically, on one end face of the power supply body 100 where the power supply interface 110 is provided, there is a detachable dust-proof net plate 150. The dust-proof net plate 150 can intercept solid impurities in the external air and prevent the solid impurities from entering the interior of the power supply body 100. It should be noted that when the cooling fan 300 is started, the external air enters the power supply body 100 through the dust-proof net plate 150 and then is discharged from the power supply body 100 through the fence through-hole 140, thus forming an air duct. The solid impurities in the external air can be intercepted by the dust-proof net plate 150. The dust-proof net plate 150 can be detached regularly, cleaned, and then reinstalled on the power supply body 100, which can avoid the heat dissipation problem caused by the blockage of the dust-proof net plate 150 after long-term use.

[0053] Specifically, a switch 160 is provided below the power supply interface 110 in this embodiment. The switch 160 is used to control the on / off of the power supply interface 110. When the power supply interface 110 is connected to a 220V power cord, the switch 160 can control whether the power supply interface 110 is connected to the internal power supply body 100. When not in use for a long time, it is recommended to turn off the switch 160 and unplug the 220V power cord from the power supply interface 110 to avoid unnecessary safety problems.

[0054] The installation and heat dissipation process of a high-power ATX power supply module provided by the present invention will be described in combination with the above embodiments:

[0055] Installation:

[0056] First, connect the wiring terminals of each component inside the computer to the output interface 120 on the power supply body 100. Subsequently, install the power supply body 100 inside the computer case by bolts. After installation, turn off the switch 160 at the lower end of the power supply interface 110, then connect the 220V power cord, and then the switch 160 can be turned on, and the high-power ATX power supply module starts to supply power.

[0057] Heat dissipation:

[0058] After the power is turned on and the switch 160 is turned on, the cooling fan 300 is powered on. When the cooling fan 300 rotates, the outside air enters the inside of the power supply body 100 through the dust-proof mesh plate 150 and then is discharged through the fence through-hole 140 to form an air flow path. Each component inside the high-power ATX power supply module starts to work. When these components work, they will generate heat. This heat is first absorbed by the evaporation end 201 of the heat pipe 200. The liquid working medium in the evaporation end 201 absorbs heat and evaporates. Due to the specially arranged support column 240 of the present invention, the bottom surface of the support column 240 has a tapered opening 250, so that the liquid working medium on the bottom surface of the support column 240 is not affected by the support column 240 when evaporating into steam. The formed steam enters the tapered opening 250 at the bottom surface of the support column 240, and then enters the cavity of the heat pipe 200 through the circulation hole 251 on the side wall of the tapered opening 250, thus avoiding the obstruction of the steam by the support column 240.

[0059] After the liquid working medium in the steam end evaporates, the pressure in the evaporation end 201 increases. Under the action of the pressure difference, these steams gradually flow from the evaporation end 201 to the condensation end 202. When the steam reaches the condensation end 202, it condenses into a liquid working medium again after encountering a lower temperature. At this time, heat is released and the heat is absorbed by the upper shell plate 210. The groove 211 of the upper shell plate 210 increases the contact area between the upper shell plate 210 and the air, so that the upper shell plate 210 can absorb more heat per unit time, thereby increasing the heat exchange efficiency between the upper shell plate 210 and the air. The heat is discharged through the heat dissipation fins 310 and the cooling fan 300. The liquid working medium condensed in the condensation end 202 is transported to the evaporation end 201 under the capillary action of the capillary plate 230, so that the heat can be continuously and evenly dissipated in a cycle.

[0060] After the power supply is used for a period of time, it needs to be removed, and the dust-proof mesh plate 150 is disassembled and cleaned or a new dust-proof mesh plate 150 is replaced to avoid affecting heat dissipation after the dust-proof mesh plate 150 is blocked.

[0061] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0062] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A high-power ATX power supply module, characterized in that, Comprising: A power supply body, with a plurality of output interfaces provided at one end of the power supply body, and a power supply interface provided at the other end of the power supply body; A heat dissipation component, the heat dissipation component includes a heat pipe, the heat pipe includes a wick board, the heat pipe is installed inside the power supply body, the inside of the heat pipe is hollow and in a negative pressure state, the inside of the heat pipe is filled with a liquid working medium, one end of the heat pipe is an evaporation end, the other end of the heat pipe is a condensation end, the evaporation end absorbs heat and gradually transfers it to the condensation end, the wick board is located inside the heat pipe, and the wick board can transport the liquid working medium from the condensation end to the evaporation end to form a cycle; Support columns, the support columns are located inside the heat pipe, the bottom of the support column has a conical opening with the small end facing up and the large end facing down, and a circulation hole is provided on the side wall of the conical opening. The large end of the conical opening at the bottom of the support column abuts against the wick board, the upper end of the support column abuts against the inner wall of the heat pipe. The heat pipe includes an upper shell plate and a lower shell plate, and the upper shell plate and the lower shell plate are mutually attached to form a sealed cavity. A conical groove is provided on the upper surface of the upper shell plate, the conical groove penetrates through the bottom of the upper shell plate downward and protrudes a conical tip downward. The small end of the conical tip is connected to the support column, the upper end of the support column cooperates with the conical tip, and the diameter of the support column gradually decreases from bottom to top; The steam formed by the liquid working medium enters the cavity of the heat pipe through the circulation hole after passing through the conical opening at the bottom of the support column.

2. The high-power ATX power supply module according to claim 1, wherein, The material of the support column is copper.

3. The high-power ATX power supply module according to claim 1, wherein There are a plurality of the support columns, and the plurality of support columns are evenly distributed inside the heat pipe. A connecting rod is provided between adjacent support columns, and the connecting rod connects the plurality of support columns into a whole.

4. The high-power ATX power supply module according to claim 1, characterized in that, The wick board is a copper powder sintered wick board.

5. The high-power ATX power supply module according to claim 1, wherein The heat dissipation component further includes a heat dissipation fan and heat dissipation fins. The heat dissipation fins are located near the heat pipe, and the heat dissipation fan is located above the heat dissipation fins and the heat pipe. The heat dissipation fan can blow out the heat inside the power supply body.

6. The high-power ATX power supply module according to claim 5, wherein, A fence through groove is provided on the upper end surface of the power supply body, and the heat blown out by the heat dissipation fan passes through the fence through groove.

7. The high-power ATX power supply module according to claim 1, characterized in that The end surface where the power supply interface on the power supply body is located is a dust-proof net board.

8. The high-power ATX power supply module according to claim 7, wherein, The dust-proof net board is detachably installed on the power supply body.

9. The high-power ATX power supply module according to claim 1, wherein A switch is provided on the power supply body, and the switch can control the on and off of the power supply.

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