Method and device for optimizing layout rule of heat dissipation bottom plate

Abstract

The invention relates to the technical field of radiator layout optimization, and discloses a method and a device for optimizing a layout rule of a radiating bottom plate, and the method comprises the steps: calculating a flow velocity field distribution function of each radiating point through employing a lattice Boltzmann mode and a large eddy simulation mode; and the target layout rule of the plurality of elliptical regions is further optimized in combination with a preset optimization algorithm, so that the optimization speed and accuracy of the heat dissipation bottom plate can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of radiator layout optimization, and in particular to a method and device for optimizing the layout rules of a heat dissipation base plate. Background Art

[0002] The heat sink is an efficient heat dissipation structure, which is particularly suitable for the heat dissipation needs of high-performance electronic components, such as IGBT (insulated gate bipolar transistor). In recent years, mainstream products generally use Pinfin heat sinks, which contain many cylindrical or needle-shaped protrusions. These protrusions can increase the contact area between the radiator and the cooling medium flowing through its surface, thereby improving the heat exchange efficiency.

[0003] At present, due to the limitations of standardized packaging, the design and research of Pinfin heat sinks are still mainly based on the changes in geometric dimensions of regular layouts. The size and spacing of the Pinfin heat sinks are adjusted according to different application requirements to improve the heat dissipation performance. However, in most designs, the parameters of the heat dissipation holes of each Pinfin heat sink are exactly the same, and local details such as chip layout and coolant flow direction are not taken into account.

[0004] In the related art, in the layout scheme of the Pinfin heat sink, each Pinfin heat sink has the same size, shape, spacing, rotation angle and other parameters. The layout scheme of the Pinfin heat sink is usually optimized by using a thermal simulation CFD method or a formula method or a finite difference method or a conventional three-dimensional grid method. However, these methods are not suitable for the optimization of irregular Pinfin heat sinks. In addition, these methods can hardly guarantee the optimization speed and accuracy of the Pinfin heat sink. Summary of the invention

[0005] In view of this, the present invention provides a method and device for optimizing the layout rules of a heat dissipation base plate to solve the problem that the layout scheme of a traditional Pinfin heat dissipation base plate is not suitable for the optimization of an irregular Pinfin heat dissipation base plate, and it is difficult to ensure the optimization speed and accuracy of the Pinfin heat dissipation base plate.

[0006] In a first aspect, the present invention provides a method for optimizing the layout rules of a heat dissipation base plate, the method comprising:

[0007] Based on the preset layout rules of the multiple elliptical areas of the heat dissipation base plate, a target layout rule of the multiple elliptical areas is generated by randomly changing a plurality of layout parameters;

[0008] Arrange multiple heat dissipation points in each elliptical area according to the target layout rule, and calculate the velocity field distribution function of each heat dissipation point using the lattice Boltzmann method and the large eddy simulation method;

[0009] Based on the velocity field distribution function of each heat dissipation point, the water flow velocity and water flow pressure of each heat dissipation point are calculated;

[0010] Calculate the target evaluation temperature of the heat dissipation base plate based on the velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point;

[0011] The target evaluation temperature is used as the initial value of the preset optimization algorithm, and the target layout rules of multiple elliptical areas are gradually iterated and optimized until the target evaluation temperature meets the preset optimization requirements. The iteration is stopped, and the target layout rules of multiple elliptical areas corresponding to the optimal result are output. If the target evaluation temperature does not meet the preset requirements, the preset layout rules of multiple elliptical areas based on the heat dissipation base plate are returned, and the target layout rules of multiple elliptical areas are generated by randomly changing multiple layout parameters until the target evaluation temperature meets the preset requirements.

[0012] By executing the above implementation method, applying the lattice Boltzmann method and the large eddy simulation method to calculate the velocity field distribution function of each heat dissipation point, and further combining the preset optimization algorithm to optimize the target layout rules of multiple elliptical areas, the optimization speed and accuracy of the heat dissipation base can be improved.

[0013] In some optional implementations, multiple heat dissipation points are arranged in each elliptical area according to the target layout rule, and the velocity field distribution function of each heat dissipation point is calculated using the lattice Boltzmann method and the large eddy simulation method, including:

[0014] Arrange multiple heat dissipation points in each elliptical area according to the target layout rule to generate a layout plan for the heat dissipation base plate;

[0015] The velocity field distribution function of each heat dissipation point is calculated using the lattice Boltzmann method and the large eddy simulation method, and the velocity field distribution function of each heat dissipation point in the collision process and the flow process is calculated;

[0016] Based on the velocity field distribution function of each heat dissipation point in the collision process and the flow process, the velocity field distribution function of the boundary heat dissipation point of each elliptical area is calculated.

[0017] By executing the above implementation, the lattice Boltzmann method and the large eddy simulation method are applied to calculate the velocity field distribution function of each heat sink, so that the velocity field distribution function of each heat sink in the collision process and the flow process and the velocity field distribution function of the boundary heat sink of each elliptical area can be accurately calculated.

[0018] In some optional implementations, the velocity field distribution function of each heat dissipation point during the collision process and the flow process is calculated by the following formula:

[0019]

[0020] Among them, f k is the velocity field distribution function of any heat dissipation point x in each elliptical area at time t, is the velocity field equilibrium distribution function of any heat dissipation point x in each elliptical region at time t, k is the multiple velocity directions of each heat dissipation point in each elliptical region, τ is the relaxation time, and according to the eddy viscosity model in the large eddy simulation method, τ is,

[0021] v0 is the kinematic viscosity is the eddy viscosity, C is a constant, Δ is the filter size, is the modulus of the strain rate tensor.

[0022] By executing the above implementation, the velocity field distribution function of each heat dissipation point is specifically calculated using the lattice Boltzmann method and the large eddy simulation method, and the velocity field distribution function of each heat dissipation point in the collision process and the flow process can be accurately calculated.

[0023] In some optional embodiments, based on the velocity field distribution function of each heat dissipation point during the collision process and the flow process, the velocity field distribution function of the boundary heat dissipation point of each elliptical area is calculated, which is performed by the following formula:

[0024]

[0025] according to q The size of the heat dissipation point x at the boundary of each elliptical area can be obtained by s Velocity field distribution function;

[0026]

[0027] Among them, x w For each elliptical area boundary heat dissipation point, x s For each elliptical area, the distance from the boundary heat dissipation point is x w The nearest heat sink, x f For each elliptical area, the distance from the boundary heat dissipation point x w The nearest heat sink, x ff For each ellipse area, the distance x f Nearest cooling point, x f For each ellipse area, the distance x f The nearest heat dissipation point, q is the intermediate parameter, f k '(x s ,t) is the distance from the boundary heat dissipation point x in each elliptical area w Nearest heat sink x s Distribution function after the collision at time t.

[0028] By executing the above implementation, the velocity field distribution function of the boundary heat dissipation point of each elliptical area can be accurately calculated.

[0029] In some optional implementations, based on the velocity field distribution function of each heat dissipation point, the water flow velocity and water flow pressure of each heat dissipation point are calculated by the following formula:

[0030]

[0031]

[0032] Among them, c k is the unit flow velocity of each heat sink in each elliptical area, u is the water flow velocity of each heat sink in each elliptical area, p is the water flow pressure of each heat sink in each elliptical area, and f is the water flow velocity of each heat sink in each elliptical area. k is the velocity field distribution function of any heat dissipation point x in each elliptical area at time t.

[0033] By executing the above implementation, based on the velocity field distribution function of each heat dissipation point, the water flow velocity and water flow pressure of each heat dissipation point can be accurately calculated.

[0034] In some optional implementations, the target evaluation temperature of the heat dissipation base plate is calculated based on the velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point, including:

[0035] Obtain the cross-sectional area of ​​the water outlet of the heat dissipation base plate, the total water flow output pressure and the total water flow output flow of the heat dissipation pump;

[0036] Based on the water flow velocity and the cross-sectional area of ​​the water outlet at each heat dissipation point, the total water input flow rate of the heat dissipation base is calculated;

[0037] Based on the water flow pressure at each heat dissipation point, calculate the total water flow input pressure of the heat dissipation base;

[0038] Based on the total water flow input pressure and the total water flow input flow rate of the heat dissipation base plate, a first flow characteristic curve of the heat dissipation base plate is drawn;

[0039] Based on the total water output pressure and the total water output flow rate of the heat dissipation pump, a second flow characteristic curve of the heat dissipation pump is drawn;

[0040] Obtaining a curve intersection point between the first flow characteristic curve and the second flow characteristic curve, and using the curve intersection point as a target operating point of the heat dissipation base plate and the heat dissipation pump;

[0041] Based on the temperature field distribution function, the target evaluation temperature of the heat dissipation base plate corresponding to the target working point is calculated.

[0042] By executing the above implementation method, considering the target evaluation temperature of the heat sink corresponding to the target working point, in order to propose an automatic optimization algorithm for the irregular Pinfin layout scheme, not only the heat dissipation performance is improved, but also the optimization speed and optimization accuracy are improved.

[0043] In some optional implementations, based on the temperature field distribution function, the target evaluation temperature of the heat dissipation base plate corresponding to the target working point is calculated by the following formula:

[0044]

[0045] Among them, g k is the temperature field distribution function at x at time t, k is the multiple flow velocity directions of each heat dissipation point in each elliptical area, τ is the relaxation time, c k is the unit flow velocity of each heat dissipation point in each elliptical area, c s is the lattice sound speed in the lattice Boltzmann method, u is the water flow velocity at each heat dissipation point in each elliptical area, T is the target evaluation temperature of the heat dissipation base corresponding to the target working point, and w k is the lattice model weight in the lattice Boltzmann method, Δx is the distance between adjacent heat dissipation points, and Δt is the time advancement interval of each simulation using the lattice Boltzmann method.

[0046] By executing the above implementation method, the target evaluation temperature of the heat sink corresponding to the target working point is calculated, in order to propose an automatic optimization algorithm for the irregular Pinfin layout scheme, which not only improves the heat dissipation performance, but also improves the optimization speed and optimization accuracy.

[0047] In a second aspect, the present invention provides a device for optimizing the layout rules of a heat dissipation base plate, the device comprising:

[0048] A layout rule generation module, for generating target layout rules for the multiple elliptical areas based on the preset layout rules for the multiple elliptical areas of the heat dissipation base plate by randomly changing multiple layout parameters;

[0049] The velocity distribution calculation module is used to arrange multiple heat dissipation points in each elliptical area according to the target layout rules, and calculate the velocity field distribution function of each heat dissipation point by using the lattice Boltzmann method and the large eddy simulation method;

[0050] A water flow parameter calculation module is used to calculate the water flow velocity and water flow pressure of each heat dissipation point based on the flow velocity field distribution function of each heat dissipation point;

[0051] An evaluation temperature calculation module is used to calculate a target evaluation temperature of the heat dissipation base plate based on a velocity field distribution function of each heat dissipation point, a water flow velocity and a water flow pressure of each heat dissipation point;

[0052] The layout rule optimization module is used to use the target evaluation temperature as the initial value of the preset optimization algorithm, gradually iteratively optimize the target layout rules of multiple elliptical areas, until the target evaluation temperature meets the preset optimization requirements, stop the iteration, and output the target layout rules of multiple elliptical areas corresponding to the optimal result. If the target evaluation temperature does not meet the preset requirements, return to the preset layout rules of multiple elliptical areas based on the heat dissipation base plate, and generate the target layout rules of multiple elliptical areas by randomly changing multiple layout parameters until the target evaluation temperature meets the preset requirements.

[0053] In a third aspect, the present invention provides a computer device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the computer instructions to execute the method for optimizing the layout rules of the heat dissipation baseplate of the first aspect or any corresponding embodiment thereof.

[0054] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the method for optimizing the layout rules of the heat dissipation baseplate of the first aspect or any corresponding embodiment thereof.

[0055] In a fifth aspect, the present invention provides a computer program product, including computer instructions, which are used to enable a computer to execute the method for optimizing the layout rules of the heat dissipation baseplate of the first aspect or any corresponding embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0057] Figure 1 is a flow chart of a method for optimizing layout rules of a heat dissipation base plate according to an embodiment of the present invention;

[0058] Figure 2 Schematic diagram of different types of Pinfin heat dissipation base plates according to an embodiment of the present invention;

[0059] Figure 3 is a schematic diagram of a preset layout rule of multiple elliptical areas according to an embodiment of the present invention;

[0060] Figure 4 is a schematic diagram of changing from a preset layout rule to a target layout rule according to an embodiment of the present invention;

[0061] Figure 5 is a schematic diagram of multiple flow velocity directions of each heat dissipation point according to an embodiment of the present invention;

[0062] Figure 6 is a schematic diagram of a genetic algorithm optimization process according to an embodiment of the present invention;

[0063] Figure 7 is a schematic diagram of randomly generating primary generation DNA and progeny after crossover mutation according to an embodiment of the present invention;

[0064] Figure 8 is a flow chart of another method for optimizing the layout rule of a heat dissipation base plate according to an embodiment of the present invention;

[0065] Fig. 9 is a schematic diagram of processing the boundary of an elliptical area according to an embodiment of the present invention;

[0066] Fig.10 is a flow chart of another method for optimizing the layout rule of a heat dissipation base plate according to an embodiment of the present invention;

[0067] Fig.11 is a schematic diagram of a curve intersection point between a first flow characteristic curve and a second flow characteristic curve according to an embodiment of the present invention;

[0068] Fig.12 is a schematic structural diagram of a Pinfin radiator according to an embodiment of the present invention;

[0069] Fig.13 is a structural block diagram of a device for optimizing layout rules of a heat dissipation base plate according to an embodiment of the present invention;

[0070] Fig.14 It is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0071] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0072] According to an embodiment of the present invention, an embodiment of a method for optimizing the layout rules of a heat dissipation base plate is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0073] In this embodiment, a method for optimizing the layout rules of a heat dissipation base plate is provided, which can be used for computer devices such as mobile phones, tablet computers, desktop computers, portable notebooks, servers, etc. Figure 1 is a flow chart of a method for optimizing the layout rules of a heat dissipation base plate according to an embodiment of the present invention. Figure 1 As shown, the process includes the following steps:

[0074] Step S101 : Based on the preset layout rules of the multiple elliptical areas of the heat dissipation base plate, a plurality of layout parameters are randomly changed to generate target layout rules of the multiple elliptical areas.

[0075] Specifically, in recent years, mainstream products generally use Pinfin heat sinks, which contain many cylindrical or needle-shaped protrusions. These protrusions can increase the contact area between the radiator and the cooling medium flowing through its surface, thereby improving the heat exchange efficiency. At present, due to the limitations of standardized packaging, the design and research of Pinfin heat sinks are still mainly based on the geometric size changes of regular layouts. The size and spacing of the Pinfin heat sink are adjusted according to different application requirements to improve the heat dissipation performance, such as Figure 2 The figure shows schematic diagrams of different types of Pinfin heat sinks.

[0076] Furthermore, the preset layout rules of the multiple elliptical areas are layout schemes formed by layout in accordance with standard general rules. Figure 3 As shown in FIG. 1 , a schematic diagram of the preset layout rules of multiple elliptical areas is shown. Figure 3 In the example, the parameters of Pinfin in each elliptical area are basically the same. Figure 3 The target layout rule of multiple elliptical areas is a layout scheme formed by irregular layout.

[0077] In a specific example, based on the preset layout rules of the multiple elliptical areas of the heat dissipation base plate, by randomly changing multiple layout parameters, a target layout rule of the multiple elliptical areas is generated, including:

[0078] Step a1, obtaining multiple layout parameters, the multiple layout parameters including: a weight parameter of the order of arrangement of multiple elliptical regions, and an X-direction displacement parameter, a Y-direction displacement parameter, a major axis size parameter, and a rotation angle parameter of each elliptical region;

[0079] Step a2, based on the preset layout rules of the multiple elliptical areas of the heat dissipation base plate, randomly change the order weight parameters of the arrangement of the multiple elliptical areas, the X-direction displacement parameters, the Y-direction displacement parameters, the major axis size parameters and the rotation angle parameters of each elliptical area, and then generate the target layout rules of the multiple elliptical areas.

[0080] Specifically, Figure 4 As shown, the sequence weight parameters of the multiple elliptical areas in the preset layout rule are (1, 2, 3, 4, 5, 6, 7, 8), and after randomly changing the sequence weight parameters, the target layout rule for the multiple elliptical areas in the target layout rule is (7, 2, 1, 4, 8, 6, 3, 5); the X-direction displacement parameter of each elliptical area in the preset layout rule is (0, 0, 0, 0, 0, 0, 0), and after randomly changing the X-direction displacement parameter to (3, -1, 1, 0, -2, 0, 0, -1), the Y-direction displacement parameter of each elliptical area in the preset layout rule is (0, 0, 0, 0, 0, 0 , 0, 0), after random change of the Y direction displacement parameter is (1, -1, -1, 0, -2, 0, 0, -1), the major axis size parameter of each elliptical area in the preset layout rule is (6, 6, 6, 6, 6, 6, 6), after random change of the major axis size parameter is (7, 8, 8, 6, 8, 6, 6, 6), the rotation angle of each elliptical area in the preset layout rule is (0, 0, 0, 0, 0, 0, 0), after random change of the rotation angle parameter is (150, 0, 135, 90, 30, 0, 45, 150), the rotation angle parameter provides several different preset angles for selection.

[0081] In the process of actually generating the target layout rules for multiple elliptical areas, the displacement in the X direction and the Y direction are performed in turn according to the order weight parameters of the multiple elliptical areas, and then the major axis size and the rotation angle are changed. For simplicity, when the major axis size increases, the minor axis size also increases. The rotation angle provides several preset angles (150°, 0°, 135°, 90°, 30°) for selection, rather than all angles. When there is an elliptical position conflict, the elliptical area corresponding to the higher order weight is retained.

[0082] Step S102: Arrange a plurality of heat dissipation points in each elliptical area according to the target layout rule, and calculate the velocity field distribution function of each heat dissipation point by using the lattice Boltzmann method and the large eddy simulation method.

[0083] Specifically, the Lattice Boltzmann Method and the Large Eddy Simulation method are used to solve the velocity field of each elliptical region (each pinfin). The lattice model uses D2Q9 to calculate the convection term, such as Figure 5 As shown, it is a schematic diagram of the flow velocity direction of each heat dissipation point (each grid) in each elliptical area, wherein the red dot represents the target heat dissipation point (target grid) currently observed.

[0084] The velocity field distribution function of each heat dissipation point is calculated by the lattice Boltzmann method and the large eddy simulation method in order to further optimize the optimization speed and accuracy of the target layout rules of multiple elliptical areas.

[0085] Step S103, calculating the water flow velocity and water flow pressure of each heat dissipation point based on the flow velocity field distribution function of each heat dissipation point.

[0086] Specifically, under the constraint of the velocity field distribution function of each heat dissipation point, the accuracy of the calculation of the water flow velocity and the water flow pressure of each heat dissipation point in each elliptical area can be further guaranteed.

[0087] Step S104, calculating the target evaluation temperature of the heat dissipation base plate based on the velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point.

[0088] Specifically, based on the velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point, the target evaluation temperature of the heat dissipation base is further obtained. The target evaluation temperature is the junction temperature of the heat dissipation chip deployed on the heat dissipation base. The target evaluation temperature is used as the fitness of the target layout rules for evaluating multiple elliptical areas.

[0089] Step S105, taking the target evaluation temperature as the initial value of the preset optimization algorithm, gradually iteratively optimize the target layout rules of multiple elliptical areas until the target evaluation temperature meets the preset optimization requirements, stop the iteration, and output the target layout rules of multiple elliptical areas corresponding to the optimal result. If the target evaluation temperature does not meet the preset requirements, return to the preset layout rules of multiple elliptical areas based on the heat dissipation base plate, and generate the target layout rules of multiple elliptical areas by randomly changing multiple layout parameters until the target evaluation temperature meets the preset requirements.

[0090] Specifically, the preset optimization algorithm here can be a genetic algorithm, or other optimization algorithms. Here, the genetic algorithm is preferred. The specific flow chart is as follows: Figure 6As shown, the genetic algorithm will first randomly generate multiple first-generation DNAs (target layout rules for multiple elliptical areas), and then start iterating with the first generation as the starting point (taking the target evaluation temperature as the initial value). By comparing the fitness values, the genetic algorithm selects the better individuals among the individuals for reproduction, and the individuals with poor fitness are eliminated. During crossover, the individuals selected in the previous step will be subjected to the longest common subsequence crossover operation. During mutation, two mutation positions are randomly generated, and the DNA characters at the two positions are exchanged. It is worth noting that the mutation probability in the genetic algorithm is extremely low, generally around 1%. When the limit is reached, the optimization result is output. As shown Figure 7 The figure shows a schematic diagram of the random generation of primary DNA and offspring after crossover mutation.

[0091] The optimization method of the heat sink layout rules in the disclosed embodiment calculates the velocity field distribution function of each heat sink point by applying the lattice Boltzmann method and the large eddy simulation method, and further optimizes the target layout rules of multiple elliptical areas in combination with a preset optimization algorithm, thereby improving the optimization speed and accuracy of the heat sink.

[0092] In this embodiment, a method for optimizing the layout rules of a heat dissipation base plate is provided, which can be used for computer devices such as mobile phones, tablet computers, desktop computers, portable notebooks, servers, etc. Figure 8 is a flow chart of a method for optimizing the layout rules of a heat dissipation base plate according to an embodiment of the present invention. Figure 8 As shown, in step S102, multiple heat dissipation points are arranged in each elliptical area according to the target layout rule, and the velocity field distribution function of each heat dissipation point is calculated using the lattice Boltzmann method and the large eddy simulation method. The process includes the following steps:

[0093] Step S1021 , arranging a plurality of heat dissipation points in each elliptical area according to a target layout rule, and generating a layout plan of the heat dissipation base plate.

[0094] Specifically, the target layout rule is an irregular arrangement method formed by the order weights of multiple elliptical areas, the X-direction displacement parameters, the Y-direction displacement parameters, the major axis size parameters and the rotation angle parameters of each elliptical area. Based on the irregular arrangement method, multiple heat dissipation points are arranged in each elliptical area to form a layout plan for the heat dissipation base plate.

[0095] Step S1022, using the lattice Boltzmann method and the large eddy simulation method to calculate the velocity field distribution function of each heat dissipation point during the collision process and the flow process.

[0096] In a specific example, the velocity field distribution function of each heat dissipation point during the collision process and the flow process is calculated by the following formula (1);

[0097]

[0098] Among them, f k is the velocity field distribution function of any heat dissipation point x in each elliptical area at time t, is the velocity field equilibrium distribution function of any heat dissipation point x in each elliptical region at time t, k is the multiple velocity directions of each heat dissipation point in each elliptical region, Figure 5 In the equation, k is 9 different flow velocity directions, τ is the relaxation time, and according to the eddy viscosity model in the large eddy simulation method, τ is, v0 is the kinematic viscosity is the eddy viscosity, C is a constant, Δ is the filter size, is the modulus of the strain rate tensor.

[0099] Step S1023, based on the velocity field distribution function of each heat dissipation point in the collision process and the flow process, the velocity field distribution function of the boundary heat dissipation point of each elliptical area is calculated.

[0100] Specifically, when encountering obstacles with curved surfaces, the boundaries of these obstacles need to be replaced by interpolation, so the elliptical pinfin of each elliptical area needs additional surface boundary processing. Fig. 9 As shown, the grid point and wall distribution in two-dimensional flow is given.

[0101] In a specific example, based on the velocity field distribution function of each heat dissipation point during the collision process and the flow process, the velocity field distribution function of the boundary heat dissipation point of each elliptical area is calculated, which is performed by the following formula (2):

[0102]

[0103] According to the following formula (3), q The size of the heat dissipation point x at the boundary of each elliptical area can be obtained by s Velocity field distribution function;

[0104]

[0105] Among them, x w For each elliptical area boundary heat dissipation point, x s For each elliptical area, the distance from the boundary heat dissipation point is x w The nearest heat sink, x f For each elliptical area, the distance from the boundary heat dissipation point x w The nearest heat sink, x ff For each ellipse area, the distance x f The nearest heat sink, x f For each ellipse area, the distance x f The nearest heat dissipation point, q is the intermediate parameter, fk '(x s ,t) is the distance from the boundary heat dissipation point x in each elliptical area w Nearest heat sink x s Distribution function after the collision at time t.

[0106] The disclosed embodiment processes the boundary of each elliptical area and calculates the distance x from the boundary heat dissipation point in each elliptical area. w Nearest heat sink x s The distribution function after the collision at time t is still used to accurately determine the target layout rules for each elliptical area.

[0107] In some optional embodiments, based on the velocity field distribution function of each heat dissipation point, the water flow velocity and water flow pressure of each heat dissipation point are calculated by the following formula (4):

[0108]

[0109] Among them, c k is the unit flow velocity of each heat sink in each elliptical area, u is the water flow velocity of each heat sink in each elliptical area, p is the water flow pressure of each heat sink in each elliptical area, and f is the water flow velocity of each heat sink in each elliptical area. k is the velocity field distribution function of any heat dissipation point x in each elliptical area at time t.

[0110] The disclosed embodiment further calculates the water flow velocity and water flow pressure of each heat dissipation point in each elliptical area based on the flow velocity field distribution function of any heat dissipation point in each elliptical area, in order to evaluate whether the target layout rules of multiple elliptical areas are feasible.

[0111] In this embodiment, a method for optimizing the layout rules of a heat dissipation base plate is provided, which can be used for computer devices such as mobile phones, tablet computers, desktop computers, portable notebooks, servers, etc. Fig.10 is a flow chart of a method for optimizing the layout rules of a heat dissipation base plate according to an embodiment of the present invention. Fig.10 As shown, step S104, based on the velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point, calculate the target evaluation temperature of the heat dissipation base plate. The process includes the following steps:

[0112] Step S1041, obtaining the cross-sectional area of ​​the water outlet of the heat dissipation base plate, the total water output pressure and the total water output flow rate of the heat dissipation pump.

[0113] Specifically, the cross-sectional area of ​​the water outlet of the heat dissipation bottom plate is represented by S, the total water output pressure of the heat dissipation pump is represented by P1, and the total water output flow rate is represented by Q1.

[0114] Step S1042, calculating the total water input flow rate of the heat dissipation base plate based on the water flow velocity and the water outlet cross-sectional area of ​​each heat dissipation point.

[0115] Specifically, the water flow velocity of each heat dissipation point in each elliptical area is represented by u and calculated by the above formula (4). The total water flow input flow of the heat dissipation bottom plate is represented by Q2.

[0116] In a specific embodiment, based on the water flow velocity and the cross-sectional area of ​​the water outlet at each heat dissipation point, the total water flow input flow of the heat dissipation base plate is calculated by the following formula (5):

[0117] Q2=u×S (5)

[0118] Step S1043, calculating the total water flow input pressure of the heat dissipation base plate based on the water flow pressure of each heat dissipation point.

[0119] Specifically, the water flow pressure of each heat dissipation point in each elliptical area is represented by p, which is calculated specifically by the above formula (4). The total water flow input pressure of the heat dissipation base is obtained by multiplying the total number of heat dissipation points by the water flow pressure of each heat dissipation point in each elliptical area. Therefore, the total water flow input pressure of the heat dissipation base is represented by P2.

[0120] Step S1044: drawing a first flow characteristic curve of the heat dissipation base plate based on the total water input pressure and the total water input flow of the heat dissipation base plate.

[0121] Specifically, the total water flow input pressure of the heat dissipation base is P2, and the total water flow input flow rate of the heat dissipation base is Q2.

[0122] Based on the total water input pressure and total water input flow rate of the heat dissipation base plate, the first flow characteristic curve of the heat dissipation base plate is drawn, such as Fig.11 The red line is shown.

[0123] Step S1045: drawing a second flow characteristic curve of the heat dissipation pump based on the total water output pressure and the total water output flow of the heat dissipation pump.

[0124] Based on the total water flow output pressure of the heat pump being P1 and the total water flow output flow of the heat pump being Q1, the second flow characteristic curve of the heat pump is drawn, such as Fig.11 Black wire shown.

[0125] Step S1046, obtaining the intersection of the first flow characteristic curve and the second flow characteristic curve, and using the intersection of the curves as the target operating point of the heat dissipation base plate and the heat dissipation pump.

[0126] Step S1047, calculating the target evaluation temperature of the heat dissipation base plate corresponding to the target working point based on the temperature field distribution function.

[0127] Specifically, in Fig.11 In the figure, the red line is the characteristic curve of the pipeline obtained by the relevant parameters of the heat dissipation base plate, the black line is the flow characteristic curve of the pump, obtained by the relevant parameters of the pump, and point A is the working point. Therefore, when different radiator structures are selected, their working points are not at the same point. It is necessary to find the working point first and compare the fitness at the working point.

[0128] In some optional implementations, based on the temperature field distribution function, the target evaluation temperature of the heat dissipation base plate corresponding to the target working point is calculated by the following formula (6):

[0129]

[0130] Among them, g k is the temperature field distribution function at x at time t, k is the multiple flow velocity directions of each heat dissipation point in each elliptical area, τ is the relaxation time, c k is the unit flow velocity of each heat dissipation point in each elliptical area, c s is the lattice sound speed in the lattice Boltzmann method, u is the water flow velocity at each heat dissipation point in each elliptical area, T is the target evaluation temperature of the heat dissipation base corresponding to the target working point, and w k is the lattice model weight in the lattice Boltzmann method, Δx is the distance between adjacent heat dissipation points, and Δt is the time advancement interval of each simulation using the lattice Boltzmann method.

[0131] Specifically, using Fig.12 The 2.5-dimensional lattice Boltzmann method shown is used to solve the chip junction temperature. The lattice model D3Q7 is used to simulate the heat conduction process, and the lattice model D2Q9 plus the lattice model D2Q5 are used to solve the heat convection process.

[0132] The disclosed embodiment aims to reduce the thermal resistance of the power module and the temperature difference of the chip junction temperature. Taking into account the influence of chip size, position, and coolant flow direction, an automatic optimization algorithm for irregular Pinfin layout scheme is proposed, which not only improves the heat dissipation performance, but also improves the optimization speed and optimization accuracy.

[0133] In addition, conventional thermal simulation CFD methods, formula methods, finite difference methods, and conventional three-dimensional grid methods are not suitable for efficient evaluation of irregular layout Pinfin solutions, and it is difficult to carry out automatic optimization. The disclosed embodiment adopts the lattice Boltzmann method to make the optimization result closer to its actual heat dissipation performance, solving the problem that conventional heat dissipation simulation is difficult to balance simulation accuracy and simulation speed.

[0134] Secondly, determine the actual working point of the Pinfin, focus on improving the overall heat dissipation effect of the electric drive system, and further enhance the practicality of the Pinfin layout optimization.

[0135] In this embodiment, a device for optimizing the layout rules of a heat dissipation base plate is also provided, and the device is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware of a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0136] This embodiment provides a device for optimizing the layout rules of a heat dissipation base plate, such as Fig.13 As shown, including:

[0137] The layout rule generating module 130 is used to generate target layout rules for the multiple elliptical areas of the heat dissipation base plate by randomly changing multiple layout parameters based on the preset layout rules for the multiple elliptical areas.

[0138] The velocity distribution calculation module 131 is used to arrange the plurality of heat dissipation points in each elliptical area according to the target layout rule, and calculate the velocity field distribution function of each heat dissipation point by using the lattice Boltzmann method and the large eddy simulation method.

[0139] The water flow parameter calculation module 132 is used to calculate the water flow velocity and water flow pressure of each heat dissipation point based on the flow velocity field distribution function of each heat dissipation point.

[0140] The evaluation temperature calculation module 133 is used to calculate the target evaluation temperature of the heat dissipation base plate based on the flow velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point.

[0141] The layout rule optimization module 134 is used to use the target evaluation temperature as the initial value of the preset optimization algorithm, gradually iteratively optimize the target layout rules of the multiple elliptical areas, until the target evaluation temperature meets the preset optimization requirements, stop iteration, and output the target layout rules of the multiple elliptical areas corresponding to the optimal result. If the target evaluation temperature does not meet the preset requirements, return to the preset layout rules of the multiple elliptical areas based on the heat dissipation base plate, and generate the target layout rules of the multiple elliptical areas by randomly changing multiple layout parameters until the target evaluation temperature meets the preset requirements.

[0142] In some optional implementations, the flow velocity distribution calculation module 131 includes:

[0143] A layout scheme generating submodule is used to arrange a plurality of heat dissipation points in each elliptical area according to a target layout rule and generate a layout scheme for a heat dissipation base plate;

[0144] The first function calculation submodule is used to calculate the velocity field distribution function of each heat dissipation point during the collision process and the flow process by using the lattice Boltzmann method and the large eddy simulation method;

[0145] The second function calculation submodule is used to calculate the velocity field distribution function of the boundary heat dissipation point of each elliptical area based on the velocity field distribution function of each heat dissipation point in the collision process and the flow process.

[0146] In some optional implementations, the velocity field distribution function of each heat dissipation point during the collision process and the flow process is calculated using the above formula (1).

[0147] In some optional embodiments, the velocity field distribution function of the boundary heat dissipation point of each elliptical area is calculated based on the velocity field distribution function of each heat dissipation point during the collision process and the flow process through the above formulas (2)-(3).

[0148] In some optional implementations, the water flow velocity and water flow pressure at each heat dissipation point are calculated based on the flow velocity field distribution function of each heat dissipation point by using the above formula (4).

[0149] In some optional embodiments, the evaluation temperature calculation module 133 includes:

[0150] The first acquisition submodule is used to obtain the cross-sectional area of ​​the water outlet of the heat dissipation base plate, the total water flow output pressure and the total water flow output flow rate of the heat dissipation pump;

[0151] The first calculation submodule is used to calculate the total water input flow rate of the heat dissipation base plate based on the water flow velocity and the water outlet cross-sectional area of ​​each heat dissipation point;

[0152] The second calculation submodule is used to calculate the total water flow input pressure of the heat dissipation base plate based on the water flow pressure of each heat dissipation point;

[0153] A first drawing submodule, used for drawing a first flow characteristic curve of the heat dissipation base plate based on the total water flow input pressure and the total water flow input flow of the heat dissipation base plate;

[0154] A second drawing submodule is used to draw a second flow characteristic curve of the heat dissipation pump based on the total water flow output pressure and the total water flow output flow of the heat dissipation pump;

[0155] A second acquisition submodule is used to acquire a curve intersection point between the first flow characteristic curve and the second flow characteristic curve, and use the curve intersection point as a target operating point of the heat dissipation base plate and the heat dissipation pump;

[0156] The third calculation submodule is used to calculate the target evaluation temperature of the heat dissipation base plate corresponding to the target working point based on the temperature field distribution function.

[0157] In some optional implementations, the target evaluation temperature of the heat dissipation base plate corresponding to the target working point is calculated based on the temperature field distribution function using the above formula (6).

[0158] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0159] The device for optimizing the layout rules of the heat dissipation base plate in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0160] The embodiment of the present invention further provides a computer device having the above-mentioned device for optimizing the layout rule of the heat dissipation base plate.

[0161] See also Fig.14 , Fig.14 is a schematic diagram of the structure of a computer device provided by an optional embodiment of the present invention, such as Fig.14 As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Fig.14 A processor 10 is taken as an example.

[0162] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.

[0163] The memory 20 stores instructions executable by at least one processor 10, so that the at least one processor 10 executes the method shown in the above embodiment.

[0164] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0165] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.

[0166] The computer device further comprises a communication interface 30 for the computer device to communicate with other devices or a communication network.

[0167] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.

[0168] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.

[0169] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A method for optimizing the layout rules of a heat dissipation base plate, characterized in that: The method comprises: Based on the preset layout rules of the multiple elliptical areas of the heat dissipation base plate, a target layout rule of the multiple elliptical areas is generated by randomly changing a plurality of layout parameters; Arrange a plurality of heat dissipation points in each elliptical area according to the target layout rule, and calculate the velocity field distribution function of each heat dissipation point by using the lattice Boltzmann method and the large eddy simulation method; Calculating the water flow velocity and water flow pressure at each heat dissipation point based on the flow velocity field distribution function of each heat dissipation point; Calculating the target evaluation temperature of the heat dissipation base plate based on the velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point; The target evaluation temperature is used as the initial value of the preset optimization algorithm, and the target layout rules of the multiple elliptical areas are gradually iterated and optimized until the target evaluation temperature meets the preset optimization requirements. The iteration is stopped, and the target layout rules of the multiple elliptical areas corresponding to the optimal result are output. If the target evaluation temperature does not meet the preset requirements, the preset layout rules of the multiple elliptical areas based on the heat dissipation base plate are returned to, and the target layout rules of the multiple elliptical areas are generated by randomly changing multiple layout parameters until the target evaluation temperature meets the preset requirements.

2. The method according to claim 1, characterized in that Arranging the plurality of heat dissipation points in each elliptical area according to the target layout rule, and calculating the velocity field distribution function of each heat dissipation point by using the lattice Boltzmann method and the large eddy simulation method, including: Arranging the plurality of heat dissipation points in each elliptical area according to the target layout rule to generate a layout plan of the heat dissipation base plate; The velocity field distribution function of each heat dissipation point during the collision and flow process is calculated using the lattice Boltzmann method and large eddy simulation method. Based on the velocity field distribution function of each heat dissipation point in the collision process and the flow process, the velocity field distribution function of the boundary heat dissipation point of each elliptical area is calculated.

3. The method according to claim 2, characterized in that The velocity field distribution function of each heat dissipation point during the collision process and the flow process is calculated by the following formula; Among them, f k is the velocity field distribution function of any heat dissipation point x in each elliptical area at time t, is the velocity field equilibrium distribution function of any heat dissipation point x in each elliptical region at time t, k is the multiple velocity directions of each heat dissipation point in each elliptical region, τ is the relaxation time, and according to the eddy viscosity model in the large eddy simulation method, τ is, v0 is the kinematic viscosity is the eddy viscosity, C is a constant, Δ is the filter size, is the modulus of the strain rate tensor.

4. The method according to claim 3, characterized in that Based on the velocity field distribution function of each heat dissipation point during the collision process and the flow process, the velocity field distribution function of the boundary heat dissipation point of each elliptical area is calculated, which is performed by the following formula: according to q The size of the heat dissipation point x at the boundary of each elliptical area can be obtained by s Velocity field distribution function; Among them, x w is the boundary heat dissipation point of each elliptical area, x s The distance from the boundary heat dissipation point to the boundary in each elliptical area is x w The nearest heat sink, x f is the distance x from the boundary heat dissipation point outside each elliptical area w The nearest heat sink, x ff is the distance x outside each elliptical area f Nearest cooling point, x f is the distance x outside each elliptical area f The nearest heat dissipation point, q is the intermediate parameter, f k '(x s ,t) is the distance from the boundary heat dissipation point x in each elliptical area w Nearest heat sink x s Distribution function after the collision at time t.

5. The method according to claim 1, characterized in that Based on the velocity field distribution function of each heat dissipation point, the water flow velocity and water flow pressure of each heat dissipation point are calculated by the following formula: Among them, c k is the unit flow velocity of each heat dissipation point in each elliptical area, u is the water flow velocity of each heat dissipation point in each elliptical area, p is the water flow pressure of each heat dissipation point in each elliptical area, and f k is the velocity field distribution function of any heat dissipation point x in each elliptical area at time t.

6. The method according to claim 1, characterized in that Calculating the target evaluation temperature of the heat dissipation base plate based on the velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point, including: Obtaining the cross-sectional area of ​​the water outlet of the heat dissipation base plate, the total water flow output pressure and the total water flow output flow rate of the heat dissipation pump; Calculating the total water input flow rate of the heat dissipation bottom plate based on the water flow velocity of each heat dissipation point and the cross-sectional area of ​​the water outlet; Calculating the total water flow input pressure of the heat dissipation base plate based on the water flow pressure of each heat dissipation point; Based on the total water flow input pressure and the total water flow input flow rate of the heat dissipation base plate, drawing a first flow characteristic curve of the heat dissipation base plate; Based on the total water output pressure and the total water output flow rate of the heat dissipation pump, a second flow characteristic curve of the heat dissipation pump is drawn; Obtaining a curve intersection point between the first flow characteristic curve and the second flow characteristic curve, and using the curve intersection point as a target operating point of the heat dissipation base plate and the heat dissipation pump; Based on the temperature field distribution function, a target evaluation temperature of the heat dissipation base plate corresponding to the target working point is calculated.

7. The method according to claim 6, characterized in that Based on the temperature field distribution function, the target evaluation temperature of the heat dissipation base plate corresponding to the target working point is calculated by the following formula: Among them, g k is the temperature field distribution function at x at time t, k is the multiple flow velocity directions of each heat dissipation point in each elliptical area, τ is the relaxation time, c k is the unit flow velocity of each heat dissipation point in each elliptical area, c s is the lattice sound velocity in the lattice Boltzmann method, u is the water flow velocity of each heat dissipation point in each elliptical area, T is the target evaluation temperature of the heat dissipation base plate corresponding to the target working point, and w k is the lattice model weight in the lattice Boltzmann method, Δx is the distance between adjacent heat dissipation points, and Δt is the time advancement interval of each simulation using the lattice Boltzmann method.

8. A device for optimizing the layout rules of a heat dissipation base plate, characterized in that: The device comprises: A layout rule generating module, configured to generate target layout rules for the plurality of elliptical areas of the heat dissipation base plate by randomly changing a plurality of layout parameters based on the preset layout rules for the plurality of elliptical areas; A velocity distribution calculation module is used to arrange multiple heat dissipation points in each elliptical area according to the target layout rule, and calculate the velocity field distribution function of each heat dissipation point by using the lattice Boltzmann method and the large eddy simulation method; A water flow parameter calculation module, used to calculate the water flow velocity and water flow pressure of each heat dissipation point based on the flow velocity field distribution function of each heat dissipation point; An evaluation temperature calculation module, used for calculating the target evaluation temperature of the heat dissipation base plate based on the velocity field distribution function of each heat dissipation point, the water flow velocity and the water flow pressure of each heat dissipation point; The layout rule optimization module is used to use the target evaluation temperature as the initial value of the preset optimization algorithm, gradually iteratively optimize the target layout rules of the multiple elliptical areas, until the target evaluation temperature meets the preset optimization requirements, stop iteration, and output the target layout rules of the multiple elliptical areas corresponding to the optimal result. If the target evaluation temperature does not meet the preset requirements, return to the preset layout rules of the multiple elliptical areas based on the heat dissipation base plate, and generate the target layout rules of the multiple elliptical areas by randomly changing multiple layout parameters until the target evaluation temperature meets the preset requirements.

9. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the method for optimizing the layout rules of the heat dissipation base plate according to any one of claims 1 to 7 by executing the computer instructions.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the method for optimizing the layout rule of the heat dissipation base plate according to any one of claims 1 to 7.

11. A computer program product, characterized in that The method comprises computer instructions, wherein the computer instructions are used to enable a computer to execute the method for optimizing the layout rules of the heat dissipation base plate according to any one of claims 1 to 7.

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