Load / Unload Chamber for Semiconductor Processing Equipment and Semiconductor Processing Equipment

Abstract

The application discloses a loading and unloading chamber of a semiconductor process equipment and the semiconductor process equipment, and relates to the semiconductor field. The loading and unloading chamber of the semiconductor process equipment comprises a mounting main plate, a sealing cover and a lock releasing mechanism. The sealing cover is movably arranged on one side of the mounting main plate in a first direction. A sealing shell is arranged in the sealing cover, and the sealing shell is movable relative to the sealing cover in a second direction. The lock releasing mechanism comprises a lock releasing component, the lock releasing component is arranged in the sealing shell, and a lock releasing end of the lock releasing component extends out of the sealing shell and is used for cooperating with a door plate of a wafer box. The first direction is parallel to the mounting main plate, and the second direction is perpendicular to the mounting main plate. The application can at least solve the problem that particles in a FIMS enter a FOUP and cause particle pollution.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a loading and unloading chamber for semiconductor process equipment and semiconductor process equipment. Background Technology

[0002] Vertical thermal processing equipment is widely used in semiconductor manufacturing processes, and the front-opening interface mechanical standard (FIMS) is an important structure within it. Currently, the semiconductor industry often uses front-opening wafer pods (FOUPs) as wafer storage containers. The role of the FIMS is to open the FOUP, allowing wafers to be cleanly transferred in or out of the FOUP.

[0003] With the development of semiconductor manufacturing processes, wafers are becoming increasingly sensitive to particle size, which in turn places more stringent requirements on particle control in vertical heat treatment equipment. Under normal operating conditions, the wafer loading area and the interior of the FOUP (Front-of-Place Upholstery) within the vertical heat treatment equipment are generally considered clean.

[0004] To open or close the FOUP, multiple structures undergo relative movement during operation to achieve the FIMS's unlocking, opening, sealing, and lateral movement functions. During these actions, friction between the components inevitably generates tiny particles, which are dispersed into the surrounding gaseous environment. Figure 1 and Figure 2 In this situation, when the FIMS opens the FOUP, the movement and changes in air pressure can cause particles from the FIMS to enter the FOUP, resulting in particulate contamination and potentially leading to product quality issues. Summary of the Invention

[0005] The purpose of this application is to provide a loading and unloading chamber for semiconductor process equipment and semiconductor process equipment, which can at least solve the problem of particle contamination caused by particles entering the FOUP from inside the FIMS.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows:

[0007] This application provides a loading and unloading chamber for semiconductor process equipment, used to transfer wafers between a wafer cassette and a process chamber of the semiconductor process equipment. The loading and unloading chamber includes: a motherboard mounting unit, a sealing cover, and an unlocking mechanism.

[0008] The sealing cover is movably disposed on one side of the mounting motherboard in a first direction, and a sealing housing is provided inside the sealing cover, the sealing housing being movable relative to the sealing cover in a second direction;

[0009] The unlocking mechanism includes an unlocking component, which is disposed within the sealed housing, and the unlocking end of the unlocking component extends out of the sealed housing for engaging with the door panel of the wafer cassette.

[0010] Wherein, the first direction is parallel to the mounting motherboard, and the second direction is perpendicular to the mounting motherboard.

[0011] This application also provides a semiconductor process apparatus, including a process chamber and the aforementioned loading / unloading chamber, wherein the loading / unloading chamber is used to transfer wafers between the process chamber and the wafer cassette.

[0012] In this embodiment, a sealing shell is provided inside the sealing cover, and the unlocking component is located inside the sealing shell. The sealing shell can surround the unlocking component and separate the unlocking component from the inner cavity of the sealing cover. In this way, even if particles are generated during the operation of the unlocking component, these particles will be trapped in the inner cavity of the sealing shell and will not be able to enter the inner cavity of the sealing cover. This can effectively prevent particles from entering the inner cavity of the wafer cassette from the inner cavity of the sealing cover after the door panel is opened, thereby preventing contamination of the wafer and ensuring the cleanliness of the inner cavities of the wafer cassette and the sealing cover. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of FIMS and wafer carrier in related technologies;

[0014] Figure 2 This is a schematic diagram of particle movement during the opening of the wafer carrier cell in FIMS in related technologies;

[0015] Figure 3 This is a first structural schematic diagram of the loading / unloading chamber and wafer cassette disclosed in an embodiment of this application;

[0016] Figure 4 This is a schematic diagram of the second structure of the loading / unloading chamber and wafer cassette disclosed in an embodiment of this application;

[0017] Figure 5 This is a schematic diagram of the third structure of the loading / unloading chamber and wafer cassette disclosed in an embodiment of this application;

[0018] Figure 6 This is a first structural schematic diagram of the loading and unloading chamber, wafer cassette, and microenvironment chamber disclosed in an embodiment of this application;

[0019] Figure 7 This is a second structural schematic diagram of the loading / unloading chamber, wafer cassette, and microenvironment chamber disclosed in an embodiment of this application;

[0020] Figure 8This is a schematic diagram illustrating the confinement of particles during the opening of the wafer cassette in the loading / unloading chamber, as disclosed in an embodiment of this application.

[0021] Figure 9 This is a first structural schematic diagram of another form of sealing shell and sealing cover disclosed in the embodiments of this application;

[0022] Figure 10 This is a schematic diagram of a second structure of a sealing cover and sealing shield of another form disclosed in an embodiment of this application.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100 - Motherboard mounting; 110 - Guide hole; 120 - Second guide component;

[0025] 200 - Sealing cover; 210 - Frame; 220 - Cover plate;

[0026] 300 - Unlocking mechanism; 310 - Unlocking component; 320 - First driving component; 330 - First guide component; 340 - First sliding component;

[0027] 410 - Sealed housing; 411 - Panel; 412 - First cover;

[0028] 420 - Second cover; 421 - First enclosure plate; 422 - First base plate;

[0029] 430 - Third enclosure; 431 - Second enclosure panel; 432 - Second base plate;

[0030] 440 - Fourth casing;

[0031] 451 - Third enclosure panel; 452 - Third base panel;

[0032] 500 - Wafer box; 510 - Door panel;

[0033] 600 - Lateral movement mechanism; 610 - Second drive component; 611 - First linear module; 612 - Second sliding member; 613 - Second linear module; 620 - Lateral movement component;

[0034] 700-Microenvironment Chamber;

[0035] A - First sealing space; B - Second sealing space; C - Third sealing space; D - Fourth sealing space; E - Fifth sealing space. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0038] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0039] refer to Figures 3 to 10 This application discloses a loading / unloading chamber for semiconductor process equipment, used to transfer wafers between the process chamber of the semiconductor process equipment and a wafer cassette 500. The loading / unloading chamber may include an interface device, which can be a front-opening interface mechanical unit, i.e., a FIMS, which can be applied in vertical heat treatment equipment to allow the wafer cassette 500 (FOUP) to be sealed and assembled into the vertical heat treatment equipment via the FIMS, thereby achieving wafer transfer while meeting process requirements. Furthermore, the interface device can also isolate the loading area environment inside the semiconductor process equipment chamber (e.g., a microenvironment chamber 700) from the external atmospheric environment to meet process requirements.

[0040] The disclosed loading and unloading chamber includes a motherboard 100, a sealing cover 200, and an unlocking mechanism 300. The wafer box 500 may include a box body and a door panel 510. The box body provides storage space for the wafers, while the door panel 510 serves to secure and seal the wafers. When the wafer box 500 is locked and the door is closed, the space enclosed by the box body and the door panel 510 is isolated from particles in the external atmosphere, ensuring the cleanliness of the wafer surfaces inside the wafer box 500.

[0041] The mounting motherboard 100 serves as a basic mounting component, providing support and a mounting base for the sealing cover 200, unlocking mechanism 300, and other components. In some embodiments, the mounting motherboard 100 can be installed into the chamber of the semiconductor process equipment using fasteners such as bolts and screws. Based on this, the entire interface device can be securely installed into the chamber using the mounting motherboard 100. Furthermore, to facilitate wafer transfer, the mounting motherboard 100 may have a window for convenient wafer transfer. It should be noted that the window can be opened when wafer transfer is needed and closed when wafer transfer is not required.

[0042] The sealing cover 200 can, to some extent, seal the window where the motherboard 100 is mounted. When wafer transfer is required, the sealing cover 200 moves to a position offset from the window to open it; when wafer transfer is not required, the sealing cover 200 moves to a position opposite the window to seal it. In some embodiments, the sealing cover 200 is movably disposed on the side where the motherboard 100 is mounted in a first direction. In practice, the sealing cover 200 is located inside the cavity, while the wafer cassette 500 is located outside the cavity. When wafer transfer is required, the door panel 510 of the wafer cassette 500 opens, and the sealing cover 200 moves to the position where the window is opened, so that the inner cavity of the wafer cassette 500 and the inner cavity of the cavity are connected through the window to facilitate wafer transfer.

[0043] For example, the first direction can be parallel to the mounting motherboard 100. For instance, the sealing cover 200 can move horizontally along the extension direction of the mounting motherboard 100 so that the sealing cover 200 is misaligned or opposite to the window. Of course, it can also move in other directions, which are not specifically limited here.

[0044] The unlocking mechanism 300 is used to lock or unlock the door panel 510 of the wafer cassette 500 to meet the wafer transfer requirements. Specifically, before opening the door panel 510, the unlocking mechanism 300 can unlock the door panel 510 to facilitate its opening; after the wafer transfer is completed, the door panel 510 is closed, and the unlocking mechanism 300 locks the door panel 510 to prevent it from opening, ensuring that the internal environment of the wafer cassette 500 meets the wafer storage requirements. In some embodiments, the unlocking mechanism 300 may include an unlocking component 310, which can unlock or lock the door panel 510.

[0045] Since the unlocking mechanism 300 is located inside the sealing cover 200, and the unlocking component 310 is prone to generating tiny particles during operation due to friction between the structures, these particles can easily diffuse within the sealing cover 200. Thus, after the unlocking component 310 opens the door panel 510 of the wafer cassette 500, the inner cavity of the wafer cassette 500 is connected to the inner cavity of the sealing cover 200, causing particles inside the sealing cover 200 to easily diffuse into the wafer cassette 500, resulting in wafer contamination.

[0046] Based on the above, in this embodiment of the application, a sealing shell 410 is provided inside the sealing cover 200, and the unlocking component 310 is disposed inside the sealing shell 410. The sealing shell 410 can surround the unlocking component 310 and separate the unlocking component 310 from the inner cavity of the sealing cover 200. In this way, even if particles are generated during the operation of the unlocking component 310, these particles will be bound inside the sealing shell 410 and will not be able to enter the inner cavity of the sealing cover 200, thus ensuring the cleanliness of the internal space of the sealing cover 200. This can effectively prevent particles from entering the inner cavity of the wafer cassette 500 from the inner cavity of the sealing cover 200 after the door panel 510 is opened, thereby preventing contamination of the wafer and ensuring the cleanliness of the inner cavities of the wafer cassette 500 and the sealing cover 200.

[0047] To unlock or lock the door panel 510 of the wafer cassette 500, the unlocking end of the unlocking component 310 extends into a sealing housing 410, which engages with the door panel 510 of the wafer cassette 500 to facilitate unlocking or locking of the door panel 510. It should be noted that the specific structure of the unlocking component 310 and its unlocking or locking working principle are consistent with relevant technologies and international standards, and will not be elaborated upon here.

[0048] Additionally, the sealing housing 410 is movable relative to the sealing cover 200 in a second direction, allowing the sealing housing 410 to move away from the wafer cassette 500 to facilitate opening the door panel 510. This second direction may be perpendicular to the mounting motherboard 100. In some embodiments, a portion of the sealing housing 410 may engage with the door panel 510 so that the door panel 510 moves synchronously when the sealing housing 410 moves in the second direction.

[0049] For example, the sealing housing 410 may be provided with an adsorption element, which can adsorb the door panel 510 so that the door panel 510 can move synchronously with the sealing housing 410. Of course, other matching methods can also be used, which are not specifically limited here.

[0050] refer to Figure 3In some embodiments, the sealed housing 410 may include a panel 411 and a first cover 412, wherein the first cover 412 is disposed on the side of the panel 411 opposite to the mounting motherboard 100, and the first cover 412 and the panel 411 form a first sealed space A. Exemplarily, the first cover 412 may include a frame 210 and a cover, wherein the frame 210 may be a square frame, a circular frame, etc., and the cover has the same shape as the frame 210 and is disposed on the other side of the frame 210 opposite to the panel 411, thus the other side of the frame 210 can be sealed by the cover.

[0051] The unlocking component 310 is located within the first sealed space A and fixed to the panel 411, with its unlocking end passing through the panel 411. This allows the unlocking end of the unlocking component 310 to engage with the panel 411 of the wafer cassette 500, facilitating unlocking or locking of the panel 411. For example, the panel 411 may have a first clearance hole, through which the unlocking end of the unlocking component 310 can pass and engage with the panel 411.

[0052] To ensure sealing, a sealing element, such as a sealing ring or sealing ring, can be provided at the first clearance hole to achieve a seal between the unlocking end and the first clearance hole, preventing particles generated during the operation of the unlocking component 310 from spreading out through the first clearance hole.

[0053] To drive the sealing housing 410 to move, so as to open or close the door panel 510 via the sealing housing 410, the unlocking mechanism 300 may further include a first driving component 320. The driving end of the first driving component 320 is connected to the sealing housing 410 and is used to drive the sealing housing 410 to move in the second direction. Exemplarily, the first driving component 320 may be a linear driving component, including a linear module, a cylinder, a hydraulic cylinder, an electric cylinder, etc., as long as it can drive the sealing housing 410 to move in the second direction, and the specific form is not limited.

[0054] In this embodiment, the first driving component 320 is located inside the sealing cover 200. Considering that the first driving component 320 may generate particles during operation, to prevent particles from spreading within the sealing cover 200 and continuing to diffuse into the wafer cassette 500 after the door panel 510 is opened, in this embodiment, a second cover 420 may be provided inside the sealing cover 200. The second cover 420 and at least a portion of the wall surface of the sealing cover 200 form a second sealed space B. The first driving component 320 is disposed within the second sealed space B. Thus, the second sealed space B can be separated from the inner cavity of the sealing cover 200 through the second cover 420, thereby achieving the enclosure of the first driving component 320. The first driving component 320 is separated from the inner cavity of the sealing cover 200. Even if particles are generated during the operation of the first driving component 320, these particles will be confined in the second sealing space B and isolated from the inner space of the sealing cover 200, thus preventing them from entering the inner cavity of the sealing cover 200. This effectively prevents particles from entering the inner cavity of the wafer cassette 500 from the inner cavity of the sealing cover 200 after the door panel 510 is opened, thereby contaminating the wafer and ensuring the cleanliness of the inner cavities of the wafer cassette 500 and the sealing cover 200.

[0055] To drive the sealing housing 410, the driving end of the first driving component 320 extends into the second sealing space B and connects with the sealing housing 410, so as to drive the sealing housing 410 to move in the second direction, thereby driving the door panel 510 to open or close through the sealing housing 410.

[0056] To ensure that the sealing housing 410 can move along a preset trajectory and improve the moving accuracy of the sealing housing 410, the unlocking mechanism 300 may further include a first guide member 330 and a first sliding member 340. The first sliding member 340 is slidably connected to the first guide member 330 and is also connected to the sealing housing 410. Based on this, under the driving action of the first driving component 320, the sealing housing 410 can move along the axial direction of the first guide member 330 via the first sliding member 340. The sliding cooperation between the first sliding member 340 and the first guide member 330 ensures the moving accuracy of the sealing housing 410 and prevents the sealing housing 410 from shaking arbitrarily, thus affecting the normal opening or closing of the door panel 510.

[0057] For example, the first guide member 330 can be a linear bearing, guide sleeve, or other components, and the first sliding member 340 can be a sliding rod, sliding column, or other components. In this embodiment, the first guide member 330 can ensure the smooth sliding of the first sliding frame, and the first sliding member 340 can be restricted in the direction perpendicular to the sliding direction to ensure the smoothness and stability of the sliding.

[0058] In this embodiment, the first guide member 330 and the first sliding member 340 are respectively located inside the sealing cover 200. Considering that particles may be generated during the sliding of the first sliding member 340 along the first guide member 330, in order to prevent particles from spreading inside the sealing cover 200 and causing particles to continue to spread into the wafer cassette 500 after the door panel 510 is opened, in this embodiment, a third cover 430 may be provided inside the sealing cover 200. The third cover 430 and at least a portion of the wall surface of the sealing cover 200 form a third sealing space C. The first guide member 330 and the first sliding member 340 are respectively disposed in the third sealing space C. In this way, the third sealing space C can be separated from the inner cavity of the sealing cover 200 by the third cover 430, thereby realizing the control of the first guide member 330 and the first sliding member 340. The moving part 340 surrounds and separates the first guide part 330 and the first sliding part 340 from the inner cavity of the sealing cover 200. Even if particles are generated during the sliding of the first sliding part 340 along the first guide part 330, these particles will be bound in the third sealing space C and will not be able to enter the inner cavity of the sealing cover 200. This can effectively prevent particles from entering the inner cavity of the wafer cassette 500 from the inner cavity of the sealing cover 200 after the door panel 510 is opened, thus preventing contamination of the wafer and ensuring the cleanliness of the inner cavities of the wafer cassette 500 and the sealing cover 200.

[0059] To guide the sealed housing 410, the first guide member 330 is completely disposed within the third sealed space C, while the first sliding member 340 is at least partially disposed within the third sealed space C, with one end of the first sliding member 340 extending out of the third sealed space C and connecting to the sealed housing 410. Based on this, under the driving action of the first driving member 320 and the limiting action of the first sliding member 340 and the first guide member 330, the smoothness and stability of the movement of the sealed housing 410 can be ensured, as well as the accuracy of movement.

[0060] In order for the first sliding member 340 to extend out of the third sealing space C, the side wall of the third cover 430 may be provided with a second clearance hole, through which one end of the first sliding member 340 can pass through the second clearance hole and connect with the sealing housing 410.

[0061] To ensure sealing, a sealing element, such as a sealing ring or sealing ring, can be provided at the second clearance hole to achieve a seal between the first sliding member 340 and the second clearance hole, preventing particles generated during the operation of the first sliding member 340 from spreading out through the second clearance hole.

[0062] To facilitate wafer transfer, the window of the mounting motherboard 100 needs to be opened to allow wafers to be loaded or unloaded. The loading / unloading chamber may also include a traversing mechanism 600 connected to the mounting motherboard 100. The traversing end of the traversing mechanism 600 is connected to a sealing cover 200, which drives the sealing cover 200 to move in a first direction. Therefore, under the driving action of the traversing mechanism 600, the sealing cover 200 can move to a position opposite to the window to seal the window, or it can move to a position offset from the window to open the window.

[0063] Considering that the transverse mechanism 600 may generate particles during operation, in order to prevent the particles from spreading inside the sealing cover 200 and causing the particles to continue to spread into the wafer cassette 500 after the door panel 510 is opened, in this embodiment of the application, the transverse mechanism 600 is located outside the sealing cover 200, specifically on the side of the motherboard 100 that is away from the sealing cover 200. In this way, the particles generated by the transverse mechanism 600 will not spread inside the sealing cover 200, thereby alleviating the problem of particles spreading from the sealing cover 200 to the wafer cassette 500.

[0064] The above-described configuration places the transverse mechanism 600 outside the chamber, i.e., in the external atmospheric environment. To prevent the external atmospheric environment from adversely affecting the operation of the transverse mechanism 600, a fourth cover 440 is provided on the side of the mounting main board 100 away from the sealing cover 200. The fourth cover 440 and the mounting main board 100 form a fourth sealed space D, and the transverse mechanism 600 is located in the fourth sealed space D. In this way, the fourth cover 440 can separate the transverse mechanism 600 from the external atmospheric environment, thereby enclosing the transverse mechanism 600 and protecting it from the influence of the external environment. In addition, it can also prevent particles generated during the operation of the transverse mechanism 600 from spreading randomly in the external atmospheric environment.

[0065] In addition, the transverse end of the transverse mechanism 600 passes through the mounting motherboard 100 and is connected to the sealing cover 200 so as to drive the sealing cover 200 to move in the first direction through the transverse end.

[0066] In some embodiments, the lateral movement mechanism 600 may include a second driving component 610 and a lateral movement member 620 as the lateral movement end. One end of the lateral movement member 620 is connected to the driving end of the second driving component 610, and the other end of the lateral movement member 620 is connected to the sealing cover 200. Thus, under the driving action of the second driving component 610, the lateral movement member 620 can drive the sealing cover 200 to move in a first direction, so as to align the sealing cover 200 with the window on which the motherboard 100 is mounted to block the window, or to make the sealing cover 200 misaligned with the window to open the window.

[0067] Considering that the horizontal sliding mechanism 600 and the sealing cover 200 are located on opposite sides of the mounting motherboard 100, to prevent the mounting motherboard 100 from obstructing the movement of the horizontal sliding member 620, the mounting motherboard 100 may be provided with a guide hole 110 extending in the first direction, and the horizontal sliding member 620 is movably disposed in the guide hole 110. Based on this, under the driving action of the second driving component 610, the horizontal sliding member 620 can move along the guide hole 110 in the first direction, thereby driving the sealing cover 200 to move in the first direction, so as to adjust the position of the sealing cover 200, thereby realizing the opening or blocking of the window of the mounting motherboard 100.

[0068] It should be noted that when the interface device is installed into the chamber of the semiconductor process equipment, the sealing cover 200 is located inside the chamber, and the transverse mechanism 600 is located outside the chamber, i.e., inside the fourth sealing space D. However, the fourth sealing space D is connected to the inner cavity of the chamber through the guide hole 110, which may allow particles generated during the operation of the transverse mechanism 600 to enter the chamber through the guide hole 110, thereby causing particle contamination inside the chamber.

[0069] Based on the above, a flexible seal can be provided at the guide hole 110. This flexible seal can seal the guide hole 110. Furthermore, when the transverse member 620 moves within the guide hole 110, the flexible seal will be compressed by the transverse member 620 and undergo flexible deformation, thus not affecting the movement of the transverse member 620 along the guide hole 110. Therefore, by providing a flexible seal, the guide hole 110 can be sealed to prevent particles generated by the transverse mechanism 600 from entering the cavity through the guide hole 110, while also ensuring that the transverse member 620 can move freely to achieve the position switching of the sealing cover 200.

[0070] For example, the flexible seal may include two elongated portions extending along a first direction, one elongated portion connected to one side of the guide hole 110 in the width direction, and the other elongated portion connected to the other side of the guide hole 110 in the width direction. The two elongated portions are tightly joined near each other's edges, and the transverse member 620 is located between the two elongated portions. Based on this, when the transverse member 620 moves to any position, the edges of the two elongated portions surround the transverse member 620, thereby achieving a seal on the guide hole 110. As the transverse member 620 moves, the two elongated portions in front of the transverse member 620 are compressed and continuously separated, while the two elongated portions behind the transverse member 620 are not compressed and continuously join together. Therefore, the free movement of the transverse member 620 can be guaranteed, and the seal on the guide hole 110 can be achieved.

[0071] In some embodiments, the second driving component 610 may include a first linear module 611 and a second sliding member 612. The first linear module 611 is disposed on the mounting motherboard 100, the second sliding member 612 is connected to the first linear module 611, and the transverse member 620 is connected to the second sliding member 612. Additionally, a second guide member 120 extending along a first direction is provided on the side of the mounting motherboard 100 opposite to the sealing cover 200, and the second sliding member 612 is slidably connected to the second guide member 120. With this configuration, the first linear module 611 can drive the second sliding member 612 to move along the second guide member 120, and the second sliding member 612 can drive the transverse member 620 to move in the first direction, thereby facilitating the switching of the sealing cover 200 position.

[0072] For example, the first linear module 611 can be in the form of a pneumatic cylinder, hydraulic cylinder, electric cylinder, etc.; the second guide 120 can be a guide rail, and the second slider 612 can be a slider. Furthermore, the first linear module 611 and the second guide 120 can be respectively assembled onto the mounting mainboard 100 using threaded fasteners for easy assembly and disassembly. The transverse component 620 can be threadedly connected to the second slider 612.

[0073] To achieve sealing and desealing of the sealing cover 200 relative to the mounting motherboard 100, the sealing cover 200 can be moved closer to or further away from the mounting motherboard 100 in the second direction. Based on this, the second driving component 610 in this embodiment may further include a second linear module 613, which is disposed on the second sliding member 612 and connected to the transverse member 620, for driving the transverse member 620 to move in the second direction. With this arrangement, under the driving action of the second linear module 613, the transverse member 620 can drive the sealing cover 200 to move in the second direction, so that the sealing cover 200 can abut against the side of the mounting motherboard 100 to achieve a seal, or cause the sealing cover 200 to disengage from the side of the mounting motherboard 100 to deseal; furthermore, the second linear module 613 can also move with the second sliding member 612 in the first direction.

[0074] For example, the first linear module 611 can be in the form of a pneumatic cylinder, hydraulic cylinder, electric cylinder, etc. In addition, the second linear module 613 can be connected to the transverse moving member 620 by means of a threaded connection.

[0075] In some embodiments, the sealing cover 200 may include a frame 210 and a cover plate 220. One side of the frame 210 faces the mounting motherboard 100, and the cover plate 220 is located on the side of the frame 210 facing away from the mounting motherboard 100. Thus, the cover plate 220 can shield the side of the frame 210 facing away from the mounting motherboard 100, forming an inner cavity of the sealing cover 200, thereby providing accommodating space for the sealing housing 410, the second cover 420, the third cover 430, etc. Furthermore, the side of the frame 210 facing the mounting motherboard 100 can move towards the mounting motherboard 100 and fit tightly against the side of the mounting motherboard 100 to achieve a seal. Alternatively, the frame 210 can be moved away from the mounting motherboard 100 to release the seal, facilitating the movement of the sealing cover 200 to a position offset from the window, allowing the window to open and enabling wafer transfer.

[0076] For example, the frame 210 can adopt a square frame, a circular frame, or other structures, and its shape is not limited. In addition, the cover plate 220 can be fixedly connected to the frame 210 or detachably connected, for example, by welding, bonding, riveting, fastener connection, snap-fit, plug-in, etc., and the specific connection method is not limited.

[0077] To form the second sealed space B, the second housing 420 may include a first surrounding plate 421 and a first bottom plate 422. The first surrounding plate 421 is connected at both ends in a first direction to the inner walls of the frame 210 on both sides in the first direction. One end of the first surrounding plate 421 extends in a second direction to connect with the cover plate 220, and the other end connects with the first bottom plate 422. At least a portion of the edge of the first bottom plate 422 is connected to the frame 210. Based on this, the multiple inner walls of the frame 210, the cover plate 220, the first surrounding plate 421, and the first bottom plate 422 can collectively form the second sealed space B, thereby enclosing the first driving component 320 within the second sealed space B. This effectively prevents particles generated during the operation of the first driving component 320 from entering the inner cavity of the sealing cover 200, thus alleviating the problem of particles entering the wafer cassette 500 from the sealing cover 200 after the door panel 510 of the wafer cassette 500 is opened.

[0078] To form the third sealed space C, the third housing 430 may include a second surrounding plate 431 and a second bottom plate 432. The second surrounding plate 431 is connected at both ends in the first direction to the inner walls of the frame 210 on both sides in the first direction, and one end of the second surrounding plate 431 extends in the second direction to connect with the cover plate 220, while the other end connects with the second bottom plate 432. At least a portion of the edge of the second bottom plate 432 is connected to the frame 210. Based on this, the multiple inner walls of the frame 210, the cover plate 220, the second surrounding plate 431, and the second bottom plate 432 can collectively form the third sealed space C, thereby enclosing at least a portion of the first guide member 330 and the first sliding member 340 within the third sealed space C. This effectively prevents particles generated during the sliding of the first sliding member 340 relative to the first guide member 330 from entering the inner cavity of the sealing cover 200, thus alleviating the problem of particles entering the wafer cassette 500 from the sealing cover 200 after the door panel 510 of the wafer cassette 500 is opened.

[0079] In some embodiments, the second sealing space B and the third sealing space C are independent of each other to seal the first driving component 320 and the cooperating first sliding member 340 and first guide member 330, respectively.

[0080] refer to Figure 9 and Figure 10 In other embodiments, the second sealing space B and the third sealing space C may also be interconnected to simultaneously seal the first driving component 320 and the cooperating first sliding member 340 and first guide member 330.

[0081] Specifically, the sealing cover 200 may be provided with a third surrounding plate 451 and a third bottom plate 452. The third surrounding plate 451 surrounds the periphery of the sealing housing 410 and is spaced apart from the respective inner walls of the frame 210. One end of the third surrounding plate 451 is connected to the cover plate 220 in the second direction, and the other end is connected to the third bottom plate 452. At least a portion of the edge of the third bottom plate 452 is connected to the inner wall of the frame 210. Based on this, the inner wall of the frame 210, the cover plate 220, the third surrounding plate 451, and the third bottom plate 452 can jointly form a fifth sealing space E, which is located outside the first sealing space A.

[0082] In addition, the unlocking mechanism 300 includes a first driving component 320, a first guide 330, and a first sliding component 340. The first driving component 320 is disposed within the fifth sealed space E, and the driving end of the first driving component 320 extends out of the fifth sealed space E and is connected to the sealing housing 410 for driving the sealing housing 410 to move in the second direction. The first guide 330 is disposed within the fifth sealed space E, and the first sliding component 340 is slidably connected to the first guide 330, and the first sliding component 340 extends out of the fifth sealed space E and is connected to the sealing housing 410.

[0083] Based on the above configuration, at least a portion of the first driving component 320, the first guide 330, and the first sliding component 340 can be enclosed within the fifth sealed space E, thereby effectively preventing particles generated during the operation of the first driving component 320 and during the sliding of the first sliding component 340 relative to the first guide 330 from entering the inner cavity of the sealing cover 200. This can alleviate the problem of particles entering the wafer cassette 500 from the sealing cover 200 after the door panel 510 of the wafer cassette 500 is opened.

[0084] For example, the third enclosure 451 can completely surround the periphery of the sealing housing 410. Alternatively, the third enclosure 451 can surround only a portion of the periphery of the sealing housing 410. For instance, when the sealing housing 410 is rectangular, the third enclosure 451 can also be rectangular, completely surrounding the periphery of the sealing housing 410. In this case, the third enclosure 451 and the inner wall of the frame 210 form an annular fifth sealing space E. Alternatively, the third enclosure 451 can be concave, surrounding three sides of the sealing housing 410, with both ends of the third enclosure 451 connected to the inner wall of the frame 210. In this case, the third enclosure 451 and the inner wall of the frame 210 form a concave fifth sealing space E. Other forms are also possible, and are not specifically limited here.

[0085] In this embodiment, due to the limited internal space of the loading and unloading chamber and the stringent requirements for the safe distance between moving parts as the window of the interface device serves as a transmission channel for the wafer, the thickness of the interface device is limited to a certain range. To allow space for the sealing structure added to improve the sealing performance of the interface device, the power and transmission structure of the interface device has been specifically laid out and designed to ensure that the original functions of the interface device are realized normally while improving the sealing performance.

[0086] Specifically, since the sealing structure occupies the space of the driving and transmission parts for opening and closing the wafer gate 510, the driving and transmission parts need to be rearranged. For example, the first driving component 320 and its cooperating first guide 330 and first sliding component 340 are respectively located on the upper and lower sides of the sealing housing 410. Since the first driving component 320 and its cooperating first guide 330 and first sliding component 340 occupy the space of the original lateral movement part, the lateral movement mechanism 600 is located on the outside of the interface device to ensure that the overall size of the interface device does not exceed the safety range and to retain the original function of the interface device.

[0087] Based on the above settings, this application also discloses a semiconductor process apparatus, which includes a process chamber and the loading / unloading chamber, wherein the loading / unloading chamber is used to transfer wafers between the process chamber and the wafer cassette.

[0088] The loading and unloading chamber is the microenvironment chamber 700 of the semiconductor process equipment, which is used to process the wafers. The transfer stage is used to carry and transfer the wafer cassette 500 so that the wafer cassette 500 can be brought closer to or away from the loading and unloading chamber. The interface device of the loading and unloading chamber can maintain the sealing between the wafer and the microenvironment chamber 700 and the external environment, so that the wafer in the wafer cassette 500 can be processed by the subsequent equipment in the microenvironment chamber 700 while isolating the external atmospheric environment.

[0089] In the initial state, the transfer stage carries the wafer cassette 500 to the docking position, so that the wafer cassette 500 is in close contact with the mounting motherboard 100, and the sealing cover 200 is in tight contact with the mounting motherboard 100, ensuring the sealing of the wafer loading area in the microenvironment chamber 700.

[0090] When the door is opened, the sealing housing 410 and the unlocking component 310 move toward the wafer loading area. The door panel 510 of the wafer box 500 moves toward the wafer loading area along with the panel 411 via the unlocking mechanism 300 to open the wafer box 500. Then, the sealing cover 200 is moved away from the mounting motherboard 100 by the second driving component 610 to release the seal. For example, the second driving component 610 moves the sealing cover 200 to a position 5mm away from the mounting motherboard. Finally, the sealing cover 200 is moved laterally by the first driving component 320 to open the window.

[0091] It should be noted that the specific structure and working principle of semiconductor process equipment can be found in relevant technologies, and will not be elaborated here.

[0092] In summary, the embodiments of this application surround and seal each moving part, so that the particles generated by each moving part are sealed in the corresponding sealed space, thereby preventing the particles from diffusing into the sealing cover 200 of the loading and unloading chamber. As a result, particles will not enter the wafer cassette 500 from the sealing cover 200 when the door panel 510 of the wafer cassette 500 is opened, ensuring the cleanliness of the particles in the wafer cassette 500, and thus ensuring the quality of the wafer surface.

[0093] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A loading / unloading chamber for a semiconductor process apparatus, used for transferring wafers between a wafer cassette (500) and a process chamber of the semiconductor process apparatus, characterized in that, The loading and unloading chamber includes: a main board (100), a sealing cover (200), and an unlocking mechanism (300); The sealing cover (200) is movably disposed on one side of the mounting motherboard (100) in a first direction, and a sealing housing (410) is provided inside the sealing cover (200). The sealing housing (410) is movable relative to the sealing cover (200) in a second direction. The unlocking mechanism (300) includes an unlocking component (310), which is disposed inside the sealing housing (410), and the unlocking end of the unlocking component (310) extends out of the sealing housing (410) for cooperating with the door panel (510) of the wafer cassette (500). Wherein, the first direction is parallel to the mounting motherboard (100), and the second direction is perpendicular to the mounting motherboard (100).

2. The loading and unloading chamber according to claim 1, characterized in that, The sealed housing (410) includes a panel (411) and a first cover (412); The first cover (412) is disposed on the side of the panel (411) away from the mounting motherboard (100), and the first cover (412) and the panel (411) form a first sealed space (A); The unlocking component (310) is located within the first sealed space (A) and fixed to the panel (411), and the unlocking end of the unlocking component (310) passes through the panel (411).

3. The loading and unloading chamber according to claim 1, characterized in that, The sealing cover (200) is provided with a second cover (420), and the second cover (420) and at least a portion of the wall surface of the sealing cover (200) form a second sealing space (B); The unlocking mechanism (300) further includes a first driving component (320), which is disposed in the second sealed space (B). The driving end of the first driving component (320) extends out of the second sealed space (B) and is connected to the sealed housing (410) for driving the sealed housing (410) to move in the second direction.

4. The loading and unloading chamber according to claim 1, characterized in that, The sealing cover (200) is provided with a third cover (430), and the third cover (430) and at least a portion of the wall surface of the sealing cover (200) form a third sealing space (C); The unlocking mechanism (300) further includes a first guide (330) and a first sliding member (340) respectively disposed in the third sealed space (C). The first sliding member (340) is slidably connected to the first guide (330), and one end of the first sliding member (340) extends out of the third sealed space (C) and is connected to the sealing housing (410).

5. The loading and unloading chamber according to claim 1, characterized in that, The mounting motherboard (100) has a fourth cover (440) on the side opposite to the sealing cover (200), and the fourth cover (440) and the mounting motherboard (100) form a fourth sealing space (D); The loading and unloading chamber further includes a lateral movement mechanism (600), which is located in the fourth sealed space (D) and connected to the mounting main board (100). The lateral movement end of the lateral movement mechanism (600) passes through the mounting main board (100) and is connected to the sealing cover (200) to drive the sealing cover (200) to move in the first direction.

6. The loading and unloading chamber according to claim 5, characterized in that, The lateral movement mechanism (600) includes a second drive component (610) and a lateral movement member (620) as the lateral movement end; The mounting motherboard (100) is provided with a guide hole (110) extending along the first direction. The transverse member (620) is movably disposed in the guide hole (110), and one end of the transverse member (620) is connected to the driving end of the second driving component (610), and the other end of the transverse member (620) is connected to the sealing cover (200).

7. The loading and unloading chamber according to claim 6, characterized in that, The second driving component (610) includes a first linear module (611) and a second slider (612); The first linear module (611) is disposed on the mounting motherboard (100), the second sliding member (612) is connected to the first linear module (611), and the transverse member (620) is connected to the second sliding member (612). The mounting motherboard (100) is provided with a second guide (120) extending along the first direction on the side opposite to the sealing cover (200), and the second sliding member (612) is slidably connected to the second guide (120).

8. The loading and unloading chamber according to claim 7, characterized in that, The second driving component (610) further includes a second linear module (613), which is disposed on the second sliding member (612) and connected to the transverse member (620) for driving the transverse member (620) to move in the second direction.

9. The loading and unloading chamber according to claim 3, characterized in that, The sealing cover (200) includes a frame (210) and a cover plate (220). One side of the frame (210) faces the mounting motherboard (100), and the cover plate (220) is located on the side of the frame (210) away from the mounting motherboard (100). The second cover (420) includes a first enclosure (421) and a first bottom plate (422). The first enclosure (421) is spaced apart from the inner wall of the frame (210). The two ends of the first enclosure (421) in the first direction are respectively connected to the inner walls of the frame (210) in the first direction. One end of the first enclosure (421) in the second direction is connected to the cover plate (220), and the other end is connected to the first bottom plate (422). At least a portion of the edge of the first bottom plate (422) is connected to the frame (210). The inner wall of the frame (210), the cover plate (220), the first surrounding plate (421) and the first bottom plate (422) together form the second sealed space (B).

10. The loading and unloading chamber according to claim 4, characterized in that, The sealing cover (200) includes a frame (210) and a cover plate (220). One side of the frame (210) faces the mounting motherboard (100), and the cover plate (220) is located on the side of the frame (210) away from the mounting motherboard (100). The third cover (430) includes a second enclosure (431) and a second bottom plate (432). The second enclosure (431) is spaced apart from the inner wall of the frame (210). The two ends of the second enclosure (431) in the first direction are respectively connected to the inner walls of the frame (210) in the first direction. One end of the second enclosure (431) in the second direction is connected to the cover plate (220), and the other end is connected to the second bottom plate (432). At least a portion of the edge of the second bottom plate (432) is connected to the frame (210). The inner wall of the frame (210), the cover plate (220), the second enclosure plate (431) and the second bottom plate (432) together form the third sealed space (C).

11. The loading and unloading chamber according to claim 2, characterized in that, The sealing cover (200) includes a frame (210) and a cover plate (220). One side of the frame (210) faces the mounting motherboard (100), and the cover plate (220) is located on the side of the frame (210) away from the mounting motherboard (100). The sealing cover (200) is provided with a third enclosure plate (451) and a third bottom plate (452). The third enclosure plate (451) surrounds the periphery of the sealing housing (410) and is spaced apart from each of the corresponding inner walls of the frame (210). One end of the third enclosure plate (451) in the second direction is connected to the cover plate (220), and the other end is connected to the third bottom plate (452). At least a portion of the edge of the third bottom plate (452) is connected to the inner wall of the frame (210). The inner wall of the frame (210), the cover plate (220), the third enclosure plate (451), and the third bottom plate (452) together form a fifth sealing space (E). The fifth sealing space (E) is located outside the first sealing space (A). The unlocking mechanism (300) further includes a first driving component (320), a first guide (330), and a first sliding component (340). The first driving component (320) is disposed within the fifth sealed space (E), and the driving end of the first driving component (320) extends out of the fifth sealed space (E) and is connected to the sealed housing (410) for driving the sealed housing (410) to move in the second direction. The first guide (330) and the first sliding component (340) are respectively disposed within the fifth sealed space (E). The first sliding component (340) is slidably connected to the first guide (330), and one end of the first sliding component (340) extends out of the fifth sealed space (E) and is connected to the sealed housing (410).

12. A semiconductor process apparatus, characterized in that, It includes a process chamber and a loading / unloading chamber as described in any one of claims 1 to 11, the loading / unloading chamber being used to transfer wafers between the process chamber and the wafer cassette.

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