A kind of constant high and low temperature chip testing equipment

Abstract

The present invention discloses a constant high and low temperature chip testing device, which includes a device main body and a preheating plate assembly, a loading manipulator assembly, a boat assembly, a testing arm assembly and an unloading manipulator assembly arranged on the device main body. The loading manipulator assembly is used to transfer room temperature chips onto the boat assembly or the preheating plate assembly. The preheating plate assembly preheats the chips into high temperature chips or precools the chips into low temperature chips. The loading manipulator assembly is also used to transfer the high temperature chips or low temperature chips on the preheating plate assembly onto the boat assembly. The boat assembly is used to convey chips. The testing arm assembly is used to take out the chips on the boat assembly for testing and then put them back to the original position. The unloading manipulator assembly is used to take out the chips on the boat assembly. By adopting such a design method, the preheating, precooling, testing of chips and the taking out of chips after testing can be realized automatically, thereby improving the automation degree, reducing the working intensity of workers and improving the production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip sorting and storage, and particularly to a constant high and low temperature chip testing device. Background Art

[0002] With the rapid development of the integrated circuit industry, the demand for chips is increasing. When producing chips, it is necessary to simulate different working temperatures according to the working environment of the chips for testing to detect the performance of the chips at different working temperatures. In the prior art, when it is necessary to preheat and precool the chips, it is necessary to manually assist in putting the chips into a heating device or a cooling device for heating or cooling. When it is necessary to test the temperature of the chips, the worker needs to put the chips into a testing machine, and after the test is completed, the worker needs to take out the chips. Therefore, the existing method has low automation, high working intensity of workers, and low production efficiency, which is not conducive to mass production. Summary of the Invention

[0003] In order to overcome at least one of the above-mentioned defects of the prior art, the present invention provides a constant high and low temperature chip testing device to solve the problems of low automation and low production efficiency when the existing chips are subjected to constant high and low temperature tests, which is not conducive to mass production.

[0004] The technical solution adopted by the present invention to solve its problems is that an embodiment of the present invention discloses a constant high and low temperature chip testing device, including a device main body and a preheating plate assembly, a loading manipulator assembly, a boat assembly, a testing arm assembly, and an unloading manipulator assembly provided on the device main body. The loading manipulator assembly is used to transport room-temperature chips to the station corresponding to the loading manipulator assembly on the boat assembly, or to transport room-temperature chips to the preheating plate assembly. The preheating plate assembly preheats the chips into high-temperature chips or precools the chips into low-temperature chips. The loading manipulator assembly is also used to transport the high-temperature chips or low-temperature chips on the preheating plate assembly to the station corresponding to the loading manipulator assembly on the boat assembly. The boat assembly is used to transport the chips corresponding to the station of the loading manipulator assembly to the station corresponding to the testing arm assembly and to transport the chips corresponding to the station of the testing arm assembly to the station corresponding to the unloading manipulator assembly. The testing arm assembly is used to take out the chips corresponding to the station of the testing arm assembly on the boat assembly for testing and to put the tested chips back to the station corresponding to the testing arm assembly on the boat assembly. The unloading manipulator assembly is used to take out the chips corresponding to the station of the unloading manipulator assembly on the boat assembly.

[0005] As an alternative embodiment, in the embodiment of the present invention, the preheating plate assembly includes a heating component having a cavity, a refrigerant pipe, and a first chip positioning plate. The refrigerant pipe is communicated with the cavity of the heating component for supplying refrigerant to the heating component. The first chip positioning plate is in contact with the heating component, and the heating component is used to heat the first chip positioning plate or to cool the first chip positioning plate when the refrigerant pipe supplies refrigerant.

[0006] As an alternative embodiment, in the embodiment of the present invention, the heating component is a plate-like structure with a shape and size consistent with that of the first chip positioning plate. The first chip positioning plate is disposed on the upper surface of the heating component, and the refrigerant pipe is connected to the side of the heating component.

[0007] As an alternative embodiment, in the embodiment of the present invention, the loading robot arm assembly includes a first robotic arm, a second robotic arm, a first lifting platform, and a first suction nozzle assembly. The second robotic arm is connected to the first robotic arm. The first lifting platform is disposed on the second robotic arm, and the first suction nozzle assembly is disposed on the first lifting platform. The first robotic arm drives the second robotic arm to move in a first horizontal direction to drive the first suction nozzle assembly to move in the first horizontal direction. The second robotic arm drives the first lifting platform to move in a second horizontal direction to drive the first suction nozzle assembly to move in the second horizontal direction. The first lifting platform drives the first suction nozzle assembly to move in a first vertical direction;

[0008] Wherein, the second horizontal direction is different from the first horizontal direction.

[0009] As an alternative embodiment, in the embodiment of the present invention, the loading robot arm assembly further includes a second driving component, a third driving component, and a fourth driving component. The second driving component is disposed on the first robotic arm and drives in the first horizontal direction to drive the second robotic arm to move in the first horizontal direction. The third driving component is disposed on the second robotic arm and drives in the second horizontal direction to drive the first lifting platform to move in the second horizontal direction. The fourth driving component is disposed on the first lifting platform to drive the first suction nozzle assembly to move in the first vertical direction.

[0010] As an alternative embodiment, in the embodiment of the present invention, the second driving component includes a second transmission belt and a second driving motor. The second driving motor is arranged on the first robotic arm, and the second transmission belt is arranged on the second driving motor. The second transmission belt drives the second robotic arm to move under the drive of the second driving motor. The third driving component includes a third transmission belt and a third driving motor. The third driving motor is arranged on the second robotic arm, and the third transmission belt is arranged on the third driving motor. The third transmission belt drives the first lifting platform to move under the drive of the third driving motor. The fourth driving component includes a fourth transmission belt and a fourth driving motor. The fourth driving motor is arranged on the first lifting platform, and the fourth transmission belt is arranged on the fourth driving motor. The fourth transmission belt drives the first lifting platform to move under the drive of the fourth driving motor.

[0011] As an alternative embodiment, in the embodiment of the present invention, the boat component includes a boat main body, a fifth driving component and a second chip positioning plate arranged on the boat main body. The boat main body is provided with a station corresponding to the loading manipulator component, a station corresponding to the testing arm component, and a station corresponding to the unloading manipulator component. The fifth driving component is used to drive the second chip positioning plate to move among the station corresponding to the loading manipulator component, the station corresponding to the testing arm component, and the station corresponding to the unloading manipulator component.

[0012] As an alternative embodiment, in the embodiment of the present invention, the fifth driving component includes a fifth transmission belt and a fifth driving motor. The fifth driving motor is arranged on the boat main body, and the fifth transmission belt is arranged on the fifth driving motor. The fifth transmission belt drives the second chip positioning plate to move under the drive of the fifth driving motor.

[0013] As an alternative embodiment, in the embodiment of the present invention, the testing arm component includes a testing arm main body, a sixth driving component, a seventh driving component and a second suction nozzle component arranged on the testing arm main body. The sixth driving component is used to drive the second suction nozzle component to move along the third horizontal direction, and the seventh driving component is used to drive the second suction nozzle component to move along the second vertical direction.

[0014] As an alternative embodiment, in the embodiment of the present invention, the sixth driving component includes a sixth driving motor and a sixth transmission screw rod. The sixth transmission screw rod drives the second suction nozzle component to move along the third horizontal direction under the drive of the sixth driving motor. The seventh driving component includes a seventh driving motor and a seventh transmission screw rod. The seventh transmission screw rod drives the second suction nozzle component to move along the second vertical direction under the drive of the seventh driving motor.

[0015] As an alternative embodiment, in the embodiment of the present invention, there is one set of the sixth driving components, two sets of the seventh driving components and the second suction nozzle components. One set of the sixth driving components drives the two sets of the second suction nozzle components to move along the third horizontal direction, and the two sets of the seventh driving components respectively drive the two sets of the second suction nozzle components to move along the second vertical direction.

[0016] As an alternative embodiment, in the embodiment of the present invention, the blanking manipulator assembly includes a third robotic arm, a fourth robotic arm, a second lifting platform and a third suction nozzle component. The fourth robotic arm is connected to the third robotic arm. The second lifting platform is disposed on the fourth robotic arm. The third suction nozzle component is disposed on the second lifting platform. The third robotic arm drives the fourth robotic arm to move along a fourth horizontal direction so as to drive the third suction nozzle component to move along the fourth horizontal direction. The fourth robotic arm drives the second lifting platform to move along a fifth horizontal direction so as to drive the third suction nozzle component to move along the fifth horizontal direction. The second lifting platform drives the third suction nozzle component to move along a third vertical direction;

[0017] Wherein, the fifth horizontal direction is different from the fourth horizontal direction.

[0018] As an alternative embodiment, in the embodiment of the present invention, the blanking manipulator assembly further includes an eighth driving component, a ninth driving component and a tenth driving component. The eighth driving component is disposed on the third robotic arm and drives along the fourth horizontal direction to drive the fourth robotic arm to move along the fourth horizontal direction. The ninth driving component is disposed on the fourth robotic arm and drives along the fifth horizontal direction to drive the second lifting platform to move along the fifth horizontal direction. The tenth driving component is disposed on the second lifting platform to drive the third suction nozzle component to move along the third vertical direction.

[0019] As an alternative embodiment, in the embodiment of the present invention, the eighth driving component includes an eighth transmission belt and an eighth driving motor. The eighth driving motor is disposed on the third robotic arm. The eighth transmission belt is disposed on the eighth driving motor. The eighth transmission belt drives the fourth robotic arm to move under the drive of the eighth driving motor. The ninth driving component includes a ninth transmission belt and a ninth driving motor. The ninth driving motor is disposed on the fourth robotic arm. The ninth transmission belt is disposed on the ninth driving motor. The ninth transmission belt drives the second lifting platform to move under the drive of the ninth driving motor. The tenth driving component includes a tenth transmission belt and a tenth driving motor. The tenth driving motor is disposed on the second lifting platform. The tenth transmission belt is disposed on the tenth driving motor. The tenth transmission belt drives the second lifting platform to move under the drive of the tenth driving motor.

[0020] As an alternative implementation manner, in the embodiment of the present invention, the constant high and low temperature chip testing device further includes a loading conveyor line assembly for conveying a tray containing chips at normal temperature, and a loading manipulator assembly for transferring the chips on the tray of the loading conveyor line assembly to the preheating tray assembly.

[0021] As an alternative implementation manner, in the embodiment of the present invention, the loading conveyor line assembly includes a loading conveyor line main body and a first driving assembly disposed on the loading conveyor line main body. The loading conveyor line main body is provided with a loading area and a first working area, and the preheating tray assembly is disposed close to the first working area. The first driving assembly is used for conveying the tray in the loading area to the first working area, and the loading manipulator assembly is used for transferring the chips on the tray in the first working area to the preheating tray assembly.

[0022] As an alternative implementation manner, in the embodiment of the present invention, the first driving assembly includes a first driving motor and a first conveyor belt. The first driving motor is disposed on the loading conveyor line main body, and the first conveyor belt is disposed on the first driving motor. The first driving motor is used for driving the first conveyor belt, and the first conveyor belt is used for conveying the tray in the loading area to the first working area.

[0023] As an alternative implementation manner, in the embodiment of the present invention, the loading conveyor line assembly further includes a first positioning cylinder for positioning the tray when the tray is transported to the first working area.

[0024] As an alternative implementation manner, in the embodiment of the present invention, the loading conveyor line assembly further includes a first limiting member disposed at one end of the loading conveyor line main body where the first working area is located, and the first limiting member is used for restricting the movement of the tray along the movement direction of the first conveyor belt.

[0025] As an alternative implementation manner, in the embodiment of the present invention, the constant high and low temperature chip testing device further includes a receiving conveyor line assembly and a defective product tray assembly. The unloading manipulator assembly is used for placing the qualified chips on the tray of the receiving conveyor line assembly and the unqualified chips on the defective product tray assembly according to the test results of the test arm assembly.

[0026] As an alternative implementation, in the embodiment of the present invention, the receiving conveyor line assembly includes a receiving conveyor line main body and an eleventh driving assembly disposed on the receiving conveyor line main body. The receiving conveyor line main body is provided with a second working area and a receiving area. The second working area is disposed close to the boat component. The blanking manipulator assembly is configured to place the qualified chips on the trays in the second working area. The eleventh driving assembly is configured to convey the trays in the second working area to the receiving area.

[0027] As an alternative implementation, in the embodiment of the present invention, the eleventh driving assembly includes an eleventh driving motor and an eleventh transmission belt. The eleventh driving motor is disposed on the receiving conveyor line main body. The eleventh transmission belt is disposed on the eleventh driving motor. The eleventh driving motor is configured to drive the eleventh transmission belt. The eleventh transmission belt is configured to convey the trays in the second working area to the receiving area.

[0028] As an alternative implementation, in the embodiment of the present invention, the defective product tray assembly includes a plurality of defective product trays, and the plurality of defective product trays are arranged side by side.

[0029] As an alternative implementation, in the embodiment of the present invention, the constant high and low temperature chip testing device further includes a tray gripper assembly and an empty tray conveying line assembly. The tray gripper assembly is configured to grab and transfer the empty trays after the chips are taken from the loading conveyor line assembly to the empty tray conveying line assembly.

[0030] As an alternative implementation, in the embodiment of the present invention, the tray gripper assembly includes a fifth robotic arm, a sixth robotic arm, and an empty tray clamping component. The sixth robotic arm is connected to the fifth robotic arm. The empty tray clamping component is disposed on the sixth robotic arm. The fifth robotic arm drives the sixth robotic arm to move in a sixth horizontal direction or in a fourth vertical direction, so as to drive the empty tray clamping component to move in a sixth direction or in a fourth vertical direction.

[0031] As an alternative implementation, in the embodiment of the present invention, the tray gripper assembly further includes a twelfth driving assembly and a thirteenth driving assembly. The twelfth driving assembly is disposed on the fifth robotic arm and moves in the sixth horizontal direction to drive the sixth robotic arm to move in the sixth horizontal direction. The thirteenth driving assembly is disposed on the fifth robotic arm and moves in the fourth vertical direction.

[0032] As an alternative embodiment, in the embodiment of the present invention, the twelfth driving assembly includes a twelfth transmission belt and a twelfth driving motor. The twelfth driving motor is disposed on the fifth robotic arm, and the twelfth transmission belt is disposed on the twelfth driving motor. The twelfth transmission belt drives the sixth robotic arm to move along the sixth horizontal direction under the drive of the twelfth driving motor. The thirteenth driving assembly includes a thirteenth transmission screw and a thirteenth driving motor. The thirteenth driving motor is disposed on the fifth robotic arm, and the thirteenth transmission screw is disposed on the thirteenth driving motor. The thirteenth transmission screw drives the sixth robotic arm to move along the fourth vertical direction under the drive of the thirteenth driving motor.

[0033] As an alternative embodiment, in the embodiment of the present invention, the empty tray clamping component includes an empty tray clamping body, a clamping cylinder, and a tray gripper. The empty tray clamping body is disposed on the sixth robotic arm, and both the clamping cylinder and the tray gripper are disposed on the empty tray clamping body. The tray gripper clamps an empty tray under the drive of the clamping cylinder.

[0034] As an alternative embodiment, in the embodiment of the present invention, the empty tray receiving conveyor assembly includes an empty tray receiving conveyor main body and a fourteenth driving assembly disposed on the empty tray receiving conveyor main body. The empty tray receiving conveyor main body is provided with a third working area and an empty tray receiving area. The tray gripper assembly is used to grab the empty tray after taking the chips on the loading conveyor assembly and transport it to the third working area of the empty tray receiving conveyor assembly. The fourteenth driving assembly is used to transport the empty tray in the third working area to the empty tray receiving area.

[0035] As an alternative embodiment, in the embodiment of the present invention, the fourteenth driving assembly includes a fourteenth driving motor and a fourteenth transmission belt. The fourteenth driving motor is disposed on the empty tray receiving conveyor main body, and the fourteenth transmission belt is disposed on the fourteenth driving motor. The fourteenth driving motor is used to drive the fourteenth transmission belt, and the fourteenth transmission belt is used to transport the empty tray in the third working area to the empty tray receiving area.

[0036] As an alternative embodiment, in the embodiment of the present invention, the equipment main body includes a bracket and a support plate disposed on the bracket. The preheating tray assembly, the loading manipulator assembly, the boat assembly, the test arm assembly, and the unloading manipulator assembly are all disposed on the support plate. The support plate is provided with a heating component, and the heating component is used to heat the support plate.

[0037] As an alternative embodiment, in the embodiment of the present invention, the heating component includes a first heating pad, a second heating pad, and a third heating pad. The first heating pad is disposed on the lower surface of the support plate corresponding to the position of the preheating plate assembly, the second heating pad is disposed on the lower surface of the support plate corresponding to the position of the boat assembly, and the third heating pad is disposed on the lower surface of the support plate corresponding to the position of the test arm assembly.

[0038] As an alternative embodiment, in the embodiment of the present invention, the constant high and low temperature chip testing device further includes a housing covering the preheating plate assembly, the loading manipulator assembly, the boat assembly, the test arm assembly, and the unloading manipulator assembly. The housing includes a first inner layer and a first outer layer, and a first heat insulation space is formed between the first inner layer and the first outer layer.

[0039] As an alternative embodiment, in the embodiment of the present invention, a heat dissipation channel penetrating the first inner layer and the first outer layer is provided on the housing, and a first sealing door is provided on the housing. The first sealing door is movably disposed outside the first outer layer and can be moved to open or close the heat dissipation channel.

[0040] As an alternative embodiment, in the embodiment of the present invention, a safety door is provided on the housing. The safety door includes a second inner layer and a second outer layer, and a second heat insulation space is formed between the second inner layer and the second outer layer.

[0041] As an alternative embodiment, in the embodiment of the present invention, the constant high and low temperature chip testing device further includes a housing covering the preheating plate assembly, the loading manipulator assembly, the boat assembly, the test arm assembly, and the unloading manipulator assembly. First and second partition layers are arranged at intervals in the housing. The first and second partition layers divide the inner cavity of the housing into a loading cavity, a testing cavity, and an unloading cavity. At least one first dry air inlet is provided on the loading cavity. After the loading cavity is filled with dry air, a high-pressure area is formed. A first through hole capable of conducting the loading cavity and the testing cavity is provided on the first partition layer, and a second through hole capable of conducting the testing cavity and the unloading cavity is provided on the second partition layer.

[0042] As an alternative embodiment, in the embodiment of the present invention, a second sealing door for opening and closing the first through hole and a first power mechanism for controlling the opening and closing of the second sealing door are provided on the first partition layer.

[0043] As an alternative embodiment, in the embodiment of the present invention, a third sealing door for opening and closing the second through hole and a second power mechanism for controlling the opening and closing of the third sealing door are provided on the second partition layer.

[0044] Implementing the embodiments of the present invention will have the following beneficial effects:

[0045] In the present invention, by providing an equipment main body and a preheating plate assembly, a loading manipulator assembly, a boat assembly, a test arm assembly, and an unloading manipulator assembly disposed on the equipment main body, the loading manipulator assembly is used to transfer room-temperature chips to the station corresponding to the loading manipulator assembly on the boat assembly, or to transfer room-temperature chips to the preheating plate assembly. The preheating plate assembly preheats the chips into high-temperature chips or precools the chips into low-temperature chips. The loading manipulator assembly is also used to transfer the high-temperature chips or low-temperature chips on the preheating plate assembly to the station corresponding to the loading manipulator assembly on the boat assembly. The boat assembly is used to transport the chips at the station corresponding to the loading manipulator assembly to the station corresponding to the test arm assembly and to transport the chips at the station corresponding to the test arm assembly to the station corresponding to the unloading manipulator assembly. The test arm assembly is used to take out the chips at the station corresponding to the test arm assembly on the boat assembly for testing and to put the tested chips back to the station corresponding to the test arm assembly on the boat assembly. The unloading manipulator assembly is used to take out the chips at the station corresponding to the unloading manipulator assembly on the boat assembly. By adopting such a design, the constant high and low temperature chip testing equipment can automatically realize the preheating, precooling, testing of chips, and the taking out of chips after testing, thereby improving the automation degree, reducing the working intensity of workers, and improving the production efficiency. Description of the Drawings

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0047] Figure 1 It is a schematic structural diagram of the constant high and low temperature chip testing equipment in the embodiments of the present invention;

[0048] Figure 2 It is a schematic structural diagram of the loading conveyor line assembly in the embodiments of the present invention;

[0049] Figure 3 It is a schematic structural diagram of the preheating plate assembly in the embodiments of the present invention;

[0050] Figure 4 It is a schematic structural diagram of the loading manipulator assembly in the embodiments of the present invention;

[0051] Figure 5 It is a schematic structural diagram of the boat assembly in the embodiments of the present invention;

[0052] Figure 6 Schematic diagram of the structure of the test arm assembly in the embodiment of the present invention Figure 1 ;

[0053] Figure 7 Schematic diagram of the structure of the test arm assembly in the embodiment of the present invention Figure 2 ;

[0054] Figure 8 is Figure 7 Partial enlarged view at position B in

[0055] Figure 9 Schematic diagram of the structure of the blanking manipulator assembly in the embodiment of the present invention;

[0056] Figure 10 Schematic diagram of the structure of the material receiving conveyor line assembly in the embodiment of the present invention;

[0057] Figure 11 Schematic diagram of the structure of the defective product tray assembly in the embodiment of the present invention;

[0058] Figure 12 Schematic diagram of the structure of the tray gripper assembly in the embodiment of the present invention;

[0059] Figure 13 Schematic diagram of the structure of the empty tray conveying line assembly in the embodiment of the present invention;

[0060] Figure 14 Schematic diagram of the structure of the support plate in the embodiment of the present invention;

[0061] Figure 15 Schematic diagram of the structure of the outer shell in the embodiment of the present invention Figure 1 ;

[0062] Figure 16 Schematic diagram of the structure of the outer shell in the embodiment of the present invention Figure 2 ;

[0063] Figure 17 is Figure 16 Partial enlarged view at position C in

[0064] Figure 18 Schematic diagram of the structure of the outer shell in the embodiment of the present invention Figure 3 ;

[0065] Figure 19 Schematic diagram of the structure of the outer shell in the embodiment of the present invention Figure 4 ;

[0066] Figure 20 Schematic diagram of the structure of the first partition layer and the second partition layer in the embodiment of the present invention Figure 1 ;

[0067] Figure 21 Structural schematic of the first separation layer and the second separation layer in the embodiments of the present invention Figure 2 ;

[0068] Figure 22 is Figure 21 Structural schematic diagram after removing the second sealing plate.

[0069] Among them, the meanings of the reference numerals are as follows:

[0070] 1A - Equipment main body; 01 - Bracket; 02 - Support plate; 03 - Second heating component; 031 - First heating pad; 032 - Second heating pad; 033 - Third heating pad; 2A - Loading conveyor line assembly; 1 - Loading conveyor line main body; 2 - Loading area; 3 - First working area; 4 - First driving motor; 5 - First conveyor belt; 6 - First positioning cylinder; 7 - First limiting part; 3A - Preheating plate assembly; 8 - First heating component; 9 - Refrigerant pipe; 10 - First chip positioning plate; 4A - Loading manipulator assembly; 11 - First robotic arm; 12 - Second robotic arm; 13 - First lifting platform; 14 - First suction nozzle; 15 - Second conveyor belt; 16 - Second driving motor; 17 - Third conveyor belt; 18 - Third driving motor; 19 - Fourth conveyor belt; 20 - Fourth driving motor; 5A - Boat component; 21 - Boat main body; 22 - Fifth conveyor belt; 23 - Fifth driving motor; 24 - Second chip positioning plate; 6A - Testing arm assembly; 25 - Testing arm main body; 26 - Sixth driving motor; 27 - Sixth transmission lead screw; 28 - Seventh driving motor; 29 - Seventh transmission lead screw; 30 - Second suction nozzle; 7A - Unloading manipulator assembly; 31 - Third robotic arm; 32 - Fourth robotic arm; 33 - Second lifting platform; 34 - Third suction nozzle; 35 - Eighth conveyor belt; 36 - Eighth driving motor; 37 - Ninth conveyor belt; 38 - Ninth driving motor; 39 - Tenth conveyor belt; 40 - Tenth driving motor; 8A - Receiving conveyor line assembly; 41 - Receiving conveyor line main body; 42 - Second working area; 43 - Receiving area; 44 - Eleventh driving motor; 45 - Eleventh conveyor belt; 9A - Defective product tray assembly; 46 - Defective product tray; 10A - Tray gripper assembly; 47 - Fifth robotic arm; 48 - Sixth robotic arm; 49 - Empty tray clamping part; 50 - Clamping cylinder; 51 - Tray gripper; 52 - Twelfth conveyor belt; 53 - Twelfth driving motor; 54 - Thirteenth transmission screw; 55 - Thirteenth driving motor; 11A - Empty tray receiving conveyor line assembly; 56 - Empty tray receiving conveyor line main body; 57 - Third working area; 58 - Empty tray receiving area; 59 - Fourteenth driving motor; 60 - Fourteenth conveyor belt; 61 - Tray; 62 - Empty tray main body; 63 - Second positioning cylinder; 12A - Outer shell; 13A - First inner layer; 14A - First outer layer; 15A - Heat dissipation channel; 16A - First sealing door; 17A - Safety door; 18A - First partition layer; 19A - Second sealing door; 20A - First power mechanism; 21A - Second partition layer; 22A - Third sealing door; 23A - Second power mechanism; 24A - Loading chamber; 25A - Testing chamber; 26A - Unloading chamber. Detailed implementation manners

[0071] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0072] In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0073] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to the specific circumstances.

[0074] In addition, the terms "mount", "set", "provided with", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0075] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0076] The technical solutions of the present invention will be further described below in conjunction with the embodiments and the drawings.

[0077] Please refer to Figure 1, embodiments of the present invention disclose a constant high and low temperature chip testing device, including a device main body 1A and a preheating plate assembly 3A, a loading manipulator assembly 4A, a wafer boat assembly 5A, a testing arm assembly 6A, and an unloading manipulator assembly 7A disposed on the device main body 1A. The loading manipulator assembly 4A is used to transfer room temperature chips to the station corresponding to the loading manipulator assembly 4A on the wafer boat assembly 5A, or to transfer room temperature chips to the preheating plate assembly 3A. The preheating plate assembly 3A preheats the chips into high temperature chips or precools the chips into low temperature chips. The loading manipulator assembly 4A is also used to transfer the high temperature chips or low temperature chips on the preheating plate assembly 3A to the station corresponding to the loading manipulator assembly 4A on the wafer boat assembly 5A. The wafer boat assembly 5A is used to transport the chips at the station corresponding to the loading manipulator assembly 4A to the station corresponding to the testing arm assembly 6A and to transport the chips at the station corresponding to the testing arm assembly 6A to the station corresponding to the unloading manipulator assembly 7A. The testing arm assembly 6A is used to take out the room temperature, high temperature or low temperature chips at the station corresponding to the testing arm assembly 6A on the wafer boat assembly 5A for testing and to put the tested chips back to the station corresponding to the testing arm assembly 6A on the wafer boat assembly 5A. The unloading manipulator assembly 7A is used to take out the chips at the station corresponding to the unloading manipulator assembly 7A on the wafer boat assembly 5A. With such a design, the constant high and low temperature chip testing device can automatically realize the preheating and precooling of chips, the testing of chips at room temperature, high temperature and low temperature, and the taking out of chips after testing, thereby improving the degree of automation, reducing the working intensity of workers, and improving production efficiency.

[0078] Among them, the constant high and low temperature chips in the constant high and low temperature chip testing device include room temperature chips, high temperature chips and low temperature chips. Room temperature chips refer to the natural temperature of the chips in the environment where they are located. High temperature chips refer to the chips heated to a temperature higher than the natural temperature and lower than 150 °, and the temperature can be 50 °, 70 °, 80 °, 120 °, etc., which are not limited here. Low temperature chips refer to the chips cooled to a temperature lower than the natural temperature and higher than - 55 °, and the temperature can be 20 °, 10 °, 0 °, - 20 °, - 35 °, etc., which are not limited here.

[0079] In some embodiments, in order to continuously supply room temperature chips for the loading manipulator assembly to pick up, the constant high and low temperature chip testing device further includes a loading conveyor line assembly 2A. The loading conveyor line assembly 2A is used to convey a tray 61 containing room temperature chips, and the loading manipulator assembly 4A is used to transfer the chips on the tray 61 of the loading conveyor line assembly 2A to the preheating plate assembly 3A.

[0080] In some embodiments, in order to classify the qualified and unqualified chips after chip testing, the constant high and low temperature chip testing equipment further includes a receiving conveyor line assembly 8A and a defective product tray assembly 9A. The blanking manipulator assembly 7A is used to place the qualified chips on the tray 61 of the receiving conveyor line assembly 8A and the unqualified chips on the defective product tray assembly 9A according to the test results of the test arm assembly 6A.

[0081] In some embodiments, in order to remove the empty tray 61 from which chips have been taken on the loading conveyor assembly so that the loading conveyor assembly can continuously convey the empty trays 61 loaded with chips, the constant high and low temperature chip testing equipment further includes a tray gripper assembly 10A and an empty tray receiving conveyor line assembly 11A. The tray gripper assembly 10A is used to grab and transfer the empty tray 61 from which chips have been taken on the loading conveyor line assembly 2A to the empty tray receiving conveyor line assembly 11A, and the empty tray receiving conveyor line assembly 11A then transports the empty tray 61 away.

[0082] In order for the entire constant high and low temperature chip testing equipment to operate more efficiently, preferably, the loading conveyor line assembly 2A, the preheating tray assembly 3A, the susceptor assembly 5A, the defective product tray assembly 9A, the receiving conveyor line assembly 8A, and the empty tray receiving conveyor line assembly 11A are sequentially arranged in a loop on the tabletop of the equipment main body 1A. Among them, the loading manipulator assembly 4A is arranged between the loading conveyor line assembly 2A and the susceptor assembly 5A, and between the preheating tray assembly 3A and the susceptor assembly 5A, so as to transfer the chips on the tray 61 of the loading conveyor line assembly 2A to the preheating tray assembly 3A and transfer the chips on the preheating tray assembly 3A to the corresponding station of the susceptor assembly 5A for the loading manipulator assembly 4A; the test arm assembly 6A is arranged above the susceptor assembly 5A, so as to take out the chips at the station corresponding to the test arm assembly 6A on the susceptor assembly 5A for testing and put the tested chips back to the station corresponding to the test arm assembly 6A on the susceptor assembly 5A; the blanking manipulator assembly 7A is arranged between the susceptor assembly 5A and the receiving conveyor line assembly 8A and between the defective product tray assembly 9A and the receiving conveyor line assembly 8A, so as to take out the chips at the station corresponding to the blanking manipulator assembly 7A on the susceptor assembly 5A, and place the qualified chips on the tray 61 of the receiving conveyor line assembly 8A and the unqualified chips on the defective product tray assembly 9A according to the test results of the test arm assembly 6A; the tray gripper assembly 10A is arranged between the loading conveyor line assembly 2A and the empty tray receiving conveyor line assembly 11A to facilitate the tray gripper assembly 10A to grab the empty tray 61 on the loading conveyor line assembly 2A and place the empty tray 61 on the empty tray receiving conveyor line assembly 11A. With such a design method, on the one hand, the testing and packaging of chips can be carried out in a pipeline-like manner for rapid flow mounting, improving the efficiency of chip testing and packaging; on the other hand, the structure of the entire constant high and low temperature chip testing equipment can be made more compact.

[0083] Specifically, the tabletop of the equipment main body 1A is a rectangular tabletop. The loading conveyor line assembly 2A, the unloading conveyor line assembly 8A, and the empty tray conveyor line assembly 11A are located on one side of the rectangular tabletop and are arranged in sequence along the length direction. The boat assembly 5A is located on the other side of the rectangular tabletop. The preheating tray assembly 3A is located at one end of the rectangular tabletop. The defective product tray assembly 9A and the unloading conveyor line assembly 8A are located at the other end of the rectangular tabletop and are arranged in sequence along the width direction.

[0084] The normal high and low temperature chip testing equipment of this solution is used to test 32 chips simultaneously. It can be understood that in other embodiments, it can also be designed to test 16 chips or 48 chips simultaneously, and no limitation is imposed here.

[0085] Please refer to Figure 2 , in some embodiments, in order for the loading conveyor line assembly 2A to convey the tray 61 from the loading place to be taken away by the loading manipulator assembly 4A, the loading conveyor line assembly 2A includes a loading conveyor line main body 1 and a first driving assembly provided on the loading conveyor line main body 1. A loading area 2 and a first working area 3 are provided on the loading conveyor line main body 1. The preheating tray assembly 3A is arranged close to the first working area 3. Workers place the tray 61 loaded with chips into the loading area 2. The first driving assembly is used to convey the tray 61 with chips placed on the loading area 2 to the first working area 3. The loading manipulator assembly 4A is used to transfer the chips on the tray 61 in the first working area 3 to the preheating tray assembly 3A.

[0086] Specifically, the loading conveyor line main body 1 is a long strip frame structure. The loading area 2 and the first working area 3 are respectively located at both ends of the loading conveyor line main body 1 in the length direction. The tray 61 moves from the loading area 2 to the first working area 3 along the length direction of the loading conveyor line main body 1.

[0087] Furthermore, in order for the first driving assembly to drive the tray 61, the first driving assembly includes a first driving motor 4 and a first transmission belt 5. The first driving motor 4 is provided on the loading conveyor line main body 1. The first transmission belt 5 is provided on the first driving motor 4. The first driving motor 4 is used to drive the first transmission belt 5. The first transmission belt 5 is used to convey the tray 61 in the loading area 2 to the first working area 3. Specifically, the first driving motor 4 is provided at the end where the loading area 2 is located. There are two first transmission belts 5. The two first transmission belts 5 are respectively located on the two inner sides in the length direction of the loading conveyor line main body 1. During operation, the tray 61 is directly placed on the two first transmission belts 5, and the two first transmission belts 5 drive the tray 61 to move from the loading area 2 to the first working area 3.

[0088] Further, in order to ensure that the tray 61 can be stably positioned in the first working area 3 after being conveyed thereto, facilitating the pickup of the chips by the loading manipulator assembly 4A, the loading conveyor assembly 2A further includes a first positioning cylinder 6, which is configured to position the tray 61 when it is transported to the first working area 3.

[0089] Further, to prevent the tray 61 from continuing to move in the direction of the first conveyor belt 5 and dropping after moving to the first working area 3, the loading conveyor assembly 2A further includes a first limiting member 7, which is provided at one end of the loading conveyor main body 1 where the first working area 3 is located, and the first limiting member 7 is configured to restrict the movement of the tray 61 in the movement direction of the first conveyor belt 5.

[0090] Please refer to Figure 3 , in some embodiments, to achieve preheating and precooling of the chips so that the chips reach the high and low temperatures required for testing, the preheating plate assembly 3A includes a first heating member 8 having a cavity, a refrigerant pipe 9, and a first chip positioning plate 10. The refrigerant pipe 9 is connected to the cavity of the first heating member 8 and is configured to supply refrigerant to the first heating member 8. The first chip positioning plate 10 is in contact with the first heating member 8, and the first heating member 8 is configured to heat the first chip positioning plate 10 to heat the chips, or to cool the first chip positioning plate 10 when the refrigerant pipe 9 supplies refrigerant to cool the chips. With this design, the loading manipulator assembly 4A is used to pick up the chips on the tray 61 in the first working area 3 and store them on the first chip positioning plate 10. During preheating, the first heating member 8 heats up to make the first chip positioning plate 10 reach the set high temperature, and then the first chip positioning plate 10 heats the chips. During precooling, the refrigerant pipe 9 supplies refrigerant to the first heating member 8, and the first heating member 8 cools the first chip positioning plate 10 to make the first chip positioning plate 10 reach the set low temperature, and then the first chip positioning plate 10 cools the chips, so that the chips reach the high and low temperatures required for testing.

[0091] Preferably, the first heating member 8 is a plate-like structure having the same shape and size as the first chip positioning plate 10. The first chip positioning plate 10 is provided on the upper surface of the first heating member 8, and the refrigerant pipe 9 is connected to the side of the first heating member 8. With this design, on the one hand, the contact area between the first chip positioning plate 10 and the first heating member 8 can be increased, thereby improving the heat exchange efficiency between the first chip positioning plate 10 and the first heating member 8, and thus enhancing the heating efficiency and cooling efficiency of the chips; on the other hand, the structure of the entire preheating plate assembly 3A can be made more compact.

[0092] Among them, the number of chip placement positions on the first chip positioning plate 10 is much larger than 32, so that the first chip positioning plate 10 can place much more than 32 chips, that is, the preheating plate assembly 3A can heat or cool much more than 32 chips simultaneously, thereby reducing energy consumption.

[0093] Please refer to Figure 4 , in some embodiments, in order for the loading manipulator assembly 4A to transfer the chips on the tray 61 of the loading conveyor assembly 2A to the preheating plate assembly 3A, and to transfer the chips on the preheating plate assembly 3A to the corresponding station of the loading manipulator assembly 4A on the boat assembly 5A, the loading manipulator assembly 4A includes a first robotic arm 11, a second robotic arm 12, a first lifting platform 13 and a first suction nozzle assembly. The second robotic arm 12 is connected to the first robotic arm 11. The first lifting platform 13 is disposed on the second robotic arm 12, and the first suction nozzle assembly is disposed on the first lifting platform 13. The first robotic arm 11 drives the second robotic arm 12 to move along a first horizontal direction (such as Figure 4 shown by the arrow x1 in Figure 4 ) to drive the first suction nozzle assembly to move along the first horizontal direction. The second robotic arm 12 drives the first lifting platform 13 to move along a second horizontal direction (such as Figure 4It moves along the direction indicated by arrow y1; wherein, the second horizontal direction is different from the first horizontal direction. With such a design, when it is necessary to transfer the chips on the tray 61 of the loading conveyor component 2A to the preheating tray component 3A, the first robotic arm 11 drives the second robotic arm 12 to move along the first horizontal direction and the second robotic arm 12 drives the first lifting platform 13 to move along the second horizontal direction to move to the first working area 3 of the loading conveyor component 2A. The first lifting platform 13 drives the first suction nozzle component to move down along the first vertical direction to suck the chips in the first working area 3 and drives the chips to lift, then moves the second robotic arm 12 to drive the first lifting platform 13 to move along the reverse direction of the second horizontal direction to the preheating tray component 3A. The first lifting platform 13 drives the first suction nozzle component to move down along the first vertical direction to place the chips on the tray 61 of the preheating tray component 3A; when it is necessary to transfer the chips on the preheating tray component 3A to the corresponding station of the loading manipulator component 4A on the boat component 5A, the first robotic arm 11 drives the second robotic arm to move along the first horizontal direction to the preheating tray component 3A. The first lifting platform 13 drives the first suction nozzle component to move down along the first vertical direction to suck the chips on the tray 61 of the preheating tray component 3A and drives the chips to lift. Then the first robotic arm 11 drives the second robotic arm 12 to move along the reverse direction of the first horizontal direction to the corresponding station of the loading manipulator component 4A on the boat component 5A. The first lifting platform 13 drives the first suction nozzle component to move down along the first vertical direction to place the chips on the tray 61 of the boat component 5A.

[0094] Specifically, the first robotic arm 11 is located at the outer edge of one end of the rectangular tabletop and extends along the width direction of the rectangular tabletop, so that the first robotic arm 11 can drive the second robotic arm 12 to move along the width direction of the rectangular tabletop, that is, the first robotic arm 11 can drive the second robotic arm 12 to move between the loading conveyor component 2A, the preheating tray component 3A and the boat component 5A. The second robotic arm 12 is vertically connected to the first robotic arm 11 and extends along the length direction of the rectangular tabletop, that is, the first lifting platform 13 can move between the loading conveyor component 2A and the preheating tray component 3A and between the preheating tray component 3A and the boat component 5A.

[0095] In addition, the second robotic arm 12, the first lifting platform 13 and the first suction nozzle component are all located above the loading conveyor component 2A, the preheating tray component 3A and the boat component 5A, so that when the second robotic arm 12, the first lifting platform 13 and the first suction nozzle component move relative to the first robotic arm 11, they will not interfere with the loading conveyor component 2A, the preheating tray component 3A and the boat component 5A.

[0096] Further, in order to move the second robotic arm 12 and the first lifting platform 13, the loading manipulator assembly 4A further includes a second driving assembly, a third driving assembly, and a fourth driving assembly. The second driving assembly is disposed on the first robotic arm 11 and drives along a first horizontal direction to drive the second robotic arm 12 to move along the first horizontal direction. The third driving assembly is disposed on the second robotic arm 12 and drives along a second horizontal direction to drive the first lifting platform 13 to move along the second horizontal direction. The fourth driving assembly is disposed on the first lifting platform 13 to drive the first suction nozzle assembly to move along a first vertical direction.

[0097] Furthermore, the second driving assembly includes a second transmission belt 15 and a second driving motor 16. The second driving motor 16 is disposed on the first robotic arm 11, and the second transmission belt 15 is disposed on the second driving motor 16. The second transmission belt 15 drives the second robotic arm 12 to move under the drive of the second driving motor 16. The third driving assembly includes a third transmission belt 17 and a third driving motor 18. The third driving motor 18 is disposed on the second robotic arm 12, and the third transmission belt 17 is disposed on the third driving motor 18. The third transmission belt 17 drives the first lifting platform 13 to move under the drive of the third driving motor 18. The fourth driving assembly includes a fourth transmission belt 19 and a fourth driving motor 20. The fourth driving motor 20 is disposed on the first lifting platform 13, and the fourth transmission belt 19 is disposed on the fourth driving motor 20. The fourth transmission belt 19 drives the first lifting platform 13 to move under the drive of the fourth driving motor 20.

[0098] As can be seen from the above, the constant high and low temperature chip testing equipment is used to test 32 chips simultaneously. The first suction nozzle assembly includes 32 first suction nozzles 14, and one first suction nozzle 14 is used to pick up one chip.

[0099] Please refer to Figure 5 , in some embodiments, in order for the boat assembly 5A to transport the chips at the corresponding station of the loading manipulator assembly 4A to the corresponding station of the testing robotic arm assembly 6A and to transport the chips at the corresponding station of the testing robotic arm assembly 6A to the corresponding station of the unloading manipulator assembly 7A, the boat assembly 5A includes a boat body 21, a fifth driving assembly disposed on the boat body 21, and a second chip positioning plate 24. The boat body 21 is provided with stations corresponding to the loading manipulator assembly 4A, the testing robotic arm assembly 6A, and the unloading manipulator assembly 7A. The fifth driving assembly is used to drive the second chip positioning plate 24 to move among the stations corresponding to the loading manipulator assembly 4A, the testing robotic arm assembly 6A, and the unloading manipulator assembly 7A.

[0100] Specifically, the material ship body 21 is located on the other side of the rectangular tabletop and extends along the length direction of the rectangular tabletop. The workstations corresponding to the loading manipulator assembly 4A, the testing arm assembly 6A, and the unloading manipulator assembly 7A are arranged on one side from the direction near the preheating plate assembly 3A to the direction near the defective product plate assembly 9A, so that the chips can flow linearly on the material ship assembly 5A.

[0101] Specifically, there are two second chip positioning plates 24, and the two second chip positioning plates 24 are arranged side by side. Driven by the fifth driving component, the second chip positioning plate 24 has two states: in one state, one of the second chip positioning plates 24 is located at the workstation corresponding to the loading manipulator assembly 4A, and the other second chip positioning plate 24 corresponds to the workstation of the testing arm assembly 6A. At this time, the loading manipulator assembly 4A can transfer the chips on the preheating plate assembly 3A to the workstation corresponding to the loading manipulator assembly 4A on the material ship assembly 5A, and the testing arm assembly 6A can take out the chips at the workstation corresponding to the testing arm assembly 6A on the material ship assembly 5A for testing simultaneously; in the other state, one of the second chip positioning plates 24 is located at the workstation corresponding to the testing arm assembly 6A, and the other second chip positioning plate 24 corresponds to the workstation of the unloading manipulator assembly 7A. At this time, the testing arm assembly 6A can take out the chips at the workstation corresponding to the testing arm assembly 6A on the material ship assembly 5A for testing, and the unloading manipulator assembly 7A can take out and classify the chips at the workstation corresponding to the unloading manipulator assembly 7A on the material ship assembly 5A simultaneously, thereby improving the detection and classification efficiency of the constant high and low temperature chip testing equipment.

[0102] As can be seen from the above, the constant high and low temperature chip testing equipment is used to test 32 chips simultaneously, and both of the two second chip positioning plates 24 are provided with 32 chip placement positions.

[0103] Further, in order for the fifth driving component to drive the second chip positioning plate 24, the fifth driving component includes a fifth transmission belt 22 and a fifth driving motor 23. The fifth driving motor 23 is arranged on the material ship body 21, the fifth transmission belt 22 is arranged on the fifth driving motor 23, and the fifth transmission belt 22 drives the second chip positioning plate 24 to move under the drive of the fifth driving motor 23.

[0104] Please refer to Figures 6 to 8 , in some embodiments, in order for the testing arm assembly 6A to take out the chips at the workstation corresponding to the testing arm assembly 6A on the material ship assembly 5A for testing and put the tested chips back to the workstation corresponding to the testing arm assembly 6A on the material ship assembly 5A, the testing arm assembly 6A includes a testing arm main body 25 and a sixth driving component, a seventh driving component, and a second suction nozzle component arranged on the testing arm main body 25. The sixth driving component is used to drive the second suction nozzle component along the third horizontal direction (such as Figure 6The seventh driving assembly is used to drive the second nozzle assembly to move along the second vertical direction (as shown by the arrow x3 in the middle). Figure 6 When such a design is adopted, the sixth drive assembly drives the second suction nozzle assembly to move along the third horizontal direction to above the workstation corresponding to the test arm assembly 6A on the material boat assembly 5A, the seventh drive assembly drives the second suction nozzle assembly to move along the second vertical direction to suck the chip on the second chip positioning plate 24 of the material boat assembly 5A, the seventh drive assembly drives the second suction nozzle assembly to move in the opposite direction of the second vertical direction to locate the chip in the test position, and after the chip test is completed, the seventh drive assembly drives the second suction nozzle assembly to move along the second vertical direction to place the chip on the second chip positioning plate 24 of the material boat assembly 5A.

[0105] Specifically, the test arm body 25 is mounted above the material boat assembly 5A, the sixth drive assembly and the seventh drive assembly are arranged on the top table of the test arm body 25, and the second suction nozzle assembly is arranged at the bottom of the test arm body 25 and above the material boat assembly 5A, so that the second suction nozzle assembly can test the chip. In addition, the first lifting platform 13 needs to transport the chips on the pre-heating plate assembly 3A to the material boat assembly 5A. Preferably, the second mechanical arm 12 extends to the bottom of the test arm body 25, so that the first lifting platform 13 can be moved to the bottom of the test arm body 25.

[0106] Furthermore, in order for the sixth drive assembly and the seventh drive assembly to drive the second suction nozzle assembly, the sixth drive assembly includes a sixth drive motor 26 and a sixth transmission screw 27. The sixth transmission screw 27 drives the second suction nozzle assembly to move along the third horizontal direction under the drive of the sixth drive motor 26. The seventh drive assembly includes a seventh drive motor 28 and a seventh transmission screw 29. The seventh transmission screw 29 drives the second suction nozzle assembly to move along the second vertical direction under the drive of the seventh drive motor 28.

[0107] Among them, the sixth drive assembly is a group, the seventh drive assembly and the second suction nozzle assembly are two groups, one group of the sixth drive assembly drives the two groups of the second suction nozzle assemblies to move along the third horizontal direction, and the two groups of the seventh drive assemblies respectively drive the two groups of the second suction nozzle assemblies to move along the second vertical direction.

[0108] From the above, it can be seen that the high and low temperature chip testing equipment is used to test 32 chips at the same time, and the second nozzle assembly is two groups, so the second nozzle assembly includes 16 second nozzles 30, one second nozzle 30 is used to suck one chip, and two groups of second nozzle assemblies can suck 32 chips.

[0109] Preferably, the second suction nozzle 30 is a flexible suction nozzle. With such a design, the pressure test can be performed by controlling the flexible suction nozzle, so that the chip test is subjected to more uniform force and higher accuracy.

[0110] Please refer to Figure 9 , in some embodiments, in order for the blanking manipulator assembly 7A to take out the chips at the station corresponding to the blanking manipulator assembly 7A on the boat component 5A, and place the qualified chips on the tray 61 of the receiving conveyor assembly 8A according to the test results of the test arm assembly 6A, and place the unqualified chips on the defective product tray assembly 9A, the blanking manipulator assembly 7A includes a third robotic arm 31, a fourth robotic arm 32, a second lifting platform 33 and a third suction nozzle assembly. The fourth robotic arm 32 is connected to the third robotic arm 31. The second lifting platform 33 is provided on the fourth robotic arm 32. The third suction nozzle assembly is provided on the second lifting platform 33. The third robotic arm 31 drives the fourth robotic arm 32 to move along the fourth horizontal direction (such as Figure 9 shown by the arrow x4 in Figure 9 ), so as to drive the third suction nozzle assembly to move along the fourth horizontal direction. The fourth robotic arm 32 drives the second lifting platform 33 to move along the fifth horizontal direction (such as Figure 9 shown by the arrow x5 in ), so as to drive the third suction nozzle assembly to move along the fifth horizontal direction. The second lifting platform 33 drives the third suction nozzle assembly to move along the third vertical direction (such as Figure 9 shown by the arrow y3 in ); wherein, the fifth horizontal direction is different from the fourth horizontal direction. With such a design, when it is necessary to take out the chips at the station corresponding to the blanking manipulator assembly 7A on the boat component 5A and place them on the tray 61 of the receiving conveyor assembly 8A, the second lifting platform 33 drives the third suction nozzle assembly to move down along the third vertical direction to take out the chips on the boat component 5A and drive the chips to rise. The third robotic arm 31 drives the fourth robotic arm 32 to move along the fourth horizontal direction and the fourth robotic arm 32 drives the second lifting platform 33 to move along the fifth horizontal direction to move to the receiving conveyor assembly 8A. The second lifting platform 33 drives the third suction nozzle assembly to move down along the third vertical direction to place the chips on the tray 61 of the receiving conveyor assembly 8A; when it is necessary to take out the chips at the station corresponding to the blanking manipulator assembly 7A on the boat component 5A and place them on the defective product tray assembly 9A, the second lifting platform 33 drives the third suction nozzle assembly to move down along the third vertical direction to take out the chips on the boat component 5A and drive the chips to rise. The third robotic arm 31 drives the fourth robotic arm along the fourth horizontal direction to the defective product tray assembly 9A. The second lifting platform 33 drives the third suction nozzle assembly to move down along the third vertical direction to place the chips on the defective product tray assembly 9A.

[0111] Specifically, the third robotic arm 31 is located at the outer edge of the other end of the rectangular tabletop and extends along the width direction of the rectangular tabletop, so that the third robotic arm 31 can drive the fourth robotic arm 32 to move along the width direction of the rectangular tabletop, that is, so that the third robotic arm 31 can drive the fourth robotic arm 32 to move between the susceptor assembly 5A, the defective product tray assembly 9A, and the material receiving conveyor assembly 8A. The fourth robotic arm 32 is vertically connected to the third robotic arm 31 and extends along the length direction of the rectangular tabletop, that is, so that the second lifting platform 33 can move between the susceptor assembly 5A and the defective product tray assembly 9A, and between the susceptor assembly 5A and the material receiving conveyor assembly 8A.

[0112] In addition, the fourth robotic arm 32, the second lifting platform 33, and the third suction nozzle assembly are all located above the susceptor assembly 5A, the defective product tray assembly 9A, and the material receiving conveyor assembly 8A, so that when the fourth robotic arm 32, the second lifting platform 33, and the third suction nozzle assembly move relative to the third robotic arm 31, they will not interfere with the susceptor assembly 5A, the defective product tray assembly 9A, and the material receiving conveyor assembly 8A.

[0113] Furthermore, in order for the fourth robotic arm 32 and the second lifting platform 33 to achieve the above-mentioned movement, the blanking manipulator assembly 7A further includes an eighth driving assembly, a ninth driving assembly, and a tenth driving assembly. The eighth driving assembly is arranged on the third robotic arm 31 and drives along the fourth horizontal direction to drive the fourth robotic arm 32 to move along the fourth horizontal direction. The ninth driving assembly is arranged on the fourth robotic arm 32 and drives along the fifth horizontal direction to drive the second lifting platform 33 to move along the fifth horizontal direction. The tenth driving assembly is arranged on the second lifting platform 33 to drive the third suction nozzle assembly to move along the third vertical direction.

[0114] Even further, the eighth driving assembly includes an eighth transmission belt 35 and an eighth driving motor 36. The eighth driving motor 36 is arranged on the third robotic arm 31, and the eighth transmission belt 35 is arranged on the eighth driving motor 36. The eighth transmission belt 35 drives the fourth robotic arm 32 to move under the drive of the eighth driving motor 36. The ninth driving assembly includes a ninth transmission belt 37 and a ninth driving motor 38. The ninth driving motor 38 is arranged on the fourth robotic arm 32, and the ninth transmission belt 37 is arranged on the ninth driving motor 38. The ninth transmission belt 37 drives the second lifting platform 33 to move under the drive of the ninth driving motor 38. The tenth driving assembly includes a tenth transmission belt 39 and a tenth driving motor 40. The tenth driving motor 40 is arranged on the second lifting platform 33, and the tenth transmission belt 39 is arranged on the tenth driving motor 40. The tenth transmission belt 39 drives the second lifting platform 33 to move under the drive of the tenth driving motor 40.

[0115] As can be seen from the above, the constant high and low temperature chip testing equipment is used to test 32 chips simultaneously. The third suction nozzle assembly includes 32 third suction nozzles 34, and one third suction nozzle 34 is used to suck one chip.

[0116] Please refer to Figure 10 Figure 10 In some embodiments, in order for the material receiving conveyor line assembly 8A to convey the tray 61 from the material receiving location to the place where workers can pick up the materials, the material receiving conveyor line assembly 8A includes a material receiving conveyor line main body 41 and an eleventh driving assembly provided on the material receiving conveyor line main body 41. A second working area 42 and a material receiving area 43 are provided on the material receiving conveyor line main body 41. The second working area 42 is arranged close to the material boat assembly 5A. The blanking manipulator assembly 7A is used to place the qualified chips on the tray 61 in the second working area 42. The eleventh driving assembly is used to convey the tray 61 in the second working area 42 to the material receiving area 43, and then the worker takes away the tray 61 loaded with the qualified chips.

[0117]

[0117] Specifically, the material receiving conveyor line main body 41 is of a long strip frame structure. The second working area 42 and the material receiving area 43 are respectively located at both ends of the material receiving conveyor line main body 41 in the length direction. The tray 61 moves from the second working area 42 to the material receiving area 43 along the length direction of the material receiving conveyor line main body 41.

[0118]

[0118] Furthermore, in order for the eleventh driving assembly to drive the tray 61, the eleventh driving assembly includes an eleventh driving motor 44 and an eleventh transmission belt 45. The eleventh driving motor 44 is provided on the material receiving conveyor line main body 41, and the eleventh transmission belt 45 is provided on the eleventh driving motor 44. The eleventh driving motor 44 is used to drive the eleventh transmission belt 45, and the eleventh transmission belt 45 is used to convey the tray 61 in the second working area 42 to the material receiving area 43. Specifically, the eleventh driving motor 44 is provided at one end where the material receiving area 43 is located. There are two eleventh transmission belts 45, and the two eleventh transmission belts 45 are respectively located on the two inner sides of the material receiving conveyor line main body 41 in the length direction. During operation, the tray 61 is directly placed on the two eleventh transmission belts 45, and the two eleventh transmission belts 45 drive the tray 61 to move from the second working area 42 to the material receiving area 43.

[0119]

[0119] Even further, in order for the tray 61 loaded with qualified chips to be stable in the second working area 42 after being placed in the second working area 42, the material receiving conveyor line assembly 8A further includes a second positioning cylinder 63, and the second positioning cylinder 63 is used to position the tray 61 in the second working area 42.

[0120] Please refer to Figure 11, in some embodiments, considering that the number of unqualified chips is small, the defective tray assembly 9A includes a plurality of defective trays 46, and the plurality of defective trays 46 are arranged side by side. With such a design, the defective tray assembly 9A is placed on one side of the boat assembly 5A without the need for conveying. The unqualified chips are directly stored on the defective tray assembly 9A. When there are multiple defective tray assemblies 9A, they can be stacked in sequence and then taken away together. In addition, arranging the plurality of defective trays 46 side by side can increase the number of unqualified chips that can be placed on the defective trays 46, eliminating the need for workers to repeatedly remove them.

[0121] In this embodiment, an example is given where the defective tray assembly 9A includes three defective trays 46. It can be understood that in other embodiments, examples can also be given where the defective tray assembly 9A includes two defective trays 46 or more than three defective trays 46, and no limitation is imposed here.

[0122] Please refer to Figure 12 , in some embodiments, in order for the tray gripper assembly 10A to be able to grasp the empty tray 61 after the chips have been taken from the loading conveyor assembly 2A and transport it to the empty tray receiving conveyor assembly 11A, the tray gripper assembly 10A includes a fifth robotic arm 47, a sixth robotic arm 48, and an empty tray clamping component 49. The sixth robotic arm 48 is connected to the fifth robotic arm 47, and the empty tray clamping component 49 is provided on the sixth robotic arm 48. The fifth robotic arm 47 drives the sixth robotic arm 48 to move along the sixth horizontal direction (as shown by the arrow x6 in Figure 12 ) or along the fourth vertical direction, so as to drive the empty tray clamping component 49 to move along the sixth direction or along the fourth vertical direction (as shown by the arrow y4 in Figure 12 ). With such a design, when it is necessary to transport the empty tray 61 of the loading conveyor assembly 2A to the empty tray receiving conveyor assembly 11A, the fifth robotic arm 47 drives the sixth robotic arm 48 to move along the sixth horizontal direction to the position of the loading conveyor assembly 2A, and then the fifth robotic arm 47 drives the sixth robotic arm 48 to move along the fourth vertical direction to pick up the empty tray 61 on the loading conveyor assembly 2A. Then the fifth robotic arm 47 drives the sixth robotic arm 48 to move in the opposite direction of the fourth vertical direction, and drives the sixth robotic arm 48 to move in the opposite direction of the sixth horizontal direction to the position of the empty tray receiving conveyor assembly 11A. Finally, the fifth robotic arm 47 drives the sixth robotic arm 48 to move along the fourth vertical direction to place the empty tray 61 on the loading conveyor assembly 2A.

[0123] Specifically, the fifth robotic arm 47 is located at the outer edge of one side of the rectangular tabletop and extends along the length direction of the rectangular tabletop, so that the fifth robotic arm 47 can drive the sixth robotic arm 48 to move along the length direction of the rectangular tabletop, that is, so that the fifth robotic arm 47 can drive the sixth robotic arm 48 to move between the loading conveyor component 2A and the empty tray collecting conveyor component 11A. The fourth robotic arm 32 is vertically connected to the third robotic arm 31 and extends along the width direction of the rectangular tabletop, that is, so that the empty tray clamping component 49 can move between the loading conveyor component 2A and the empty tray collecting conveyor component 11A.

[0124] In addition, both the sixth robotic arm 48 and the empty tray clamping component 49 are located above the loading conveyor component 2A and the empty tray collecting conveyor component 11A, so that when the sixth robotic arm 48 and the empty tray clamping component 49 move relative to the fifth robotic arm 47, they will not interfere with the loading conveyor component 2A and the empty tray collecting conveyor component 11A.

[0125] Furthermore, in order for the fifth robotic arm 47 to drive the sixth robotic arm 48 to move, the tray gripper assembly 10A further includes a twelfth driving component and a thirteenth driving component. The twelfth driving component is disposed on the fifth robotic arm 47 and moves along the sixth horizontal direction to drive the sixth robotic arm 48 to move along the sixth horizontal direction. The thirteenth driving component is disposed on the fifth robotic arm 47 and moves along the fourth vertical direction.

[0126] Even further, the twelfth driving component includes a twelfth transmission belt 52 and a twelfth driving motor 53. The twelfth driving motor 53 is disposed on the fifth robotic arm 47, and the twelfth transmission belt 52 is disposed on the twelfth driving motor 53. The twelfth transmission belt 52 drives the sixth robotic arm 48 to move along the sixth horizontal direction under the drive of the twelfth driving motor 53. The thirteenth driving component includes a thirteenth transmission screw 54 and a thirteenth driving motor 55. The thirteenth driving motor 55 is disposed on the fifth robotic arm 47, and the thirteenth transmission screw 54 is disposed on the thirteenth driving motor 55. The thirteenth transmission screw 54 drives the sixth robotic arm 48 to move along the fourth vertical direction under the drive of the thirteenth driving motor 55.

[0127] Among them, in order to better grasp the empty tray 61, the empty tray clamping component 49 includes an empty tray clamping main body 62, a clamping cylinder 50 and a tray gripper 51. The empty tray clamping main body 62 is arranged on the sixth robotic arm 48, and both the clamping cylinder 50 and the tray gripper 51 are arranged on the empty tray clamping main body 62. The tray gripper 51 grabs the empty tray 61 under the drive of the clamping cylinder 50. Specifically, the empty tray clamping main body 62 is a plate-like structure sized to fit the empty tray 61. The top of the empty tray clamping main body 62 is connected to the sixth robotic arm 48. The clamping cylinder 50 is arranged on the top of the empty tray clamping main body 62. There are two tray grippers 51, and the two tray grippers 51 are respectively arranged at both ends of the empty tray clamping main body 62. Under the drive of the clamping cylinder 50, the two tray grippers 51 grab the tray 61.

[0128] Please refer to Figure 13 , in some embodiments, in order for the empty tray conveying line assembly 11A to be able to convey the empty tray 61 from the place where it is collected to a place where workers can take it away, the empty tray conveying line assembly 11A includes an empty tray conveying line main body 56 and a fourteenth driving component arranged on the empty tray conveying line main body 56. A third working area 57 and an empty tray collection area 58 are arranged on the empty tray conveying line main body 56. The tray gripper assembly 10A is used to grab the empty tray 61 that has finished taking chips on the loading conveying line assembly 2A and transport it to the third working area 57 of the empty tray conveying line assembly 11A. The fourteenth driving component is used to convey the empty tray 61 in the third working area 57 to the empty tray collection area 58.

[0129] Specifically, the empty tray conveying line main body 56 is a long strip frame structure. The third working area 57 and the empty tray collection area 58 are respectively located at both ends in the length direction of the empty tray conveying line main body 56. The tray 61 moves from the third working area 57 to the empty tray collection area 58 along the length direction of the empty tray conveying line main body 56.

[0130] Furthermore, the fourteenth driving component includes a fourteenth driving motor 59 and a fourteenth transmission belt 60. The fourteenth driving motor 59 is arranged on the empty tray conveying line main body 56, and the fourteenth transmission belt 60 is arranged on the fourteenth driving motor 59. The fourteenth driving motor 59 is used to drive the fourteenth transmission belt 60, and the fourteenth transmission belt 60 is used to convey the empty tray 61 in the third working area 57 to the empty tray collection area 58. Specifically, the fourteenth driving motor 59 is arranged at one end where the empty tray collection area 58 is located. There are two fourteenth transmission belts 60, and the two fourteenth transmission belts 60 are respectively located on the two inner sides in the length direction of the empty tray conveying line main body 56. During operation, the tray 61 is directly placed on the two fourteenth transmission belts 60, and the two fourteenth transmission belts 60 drive the tray 61 to move from the third working area 57 to the empty tray collection area 58.

[0131] Please refer to Figures 14 to 17, in some embodiments, the device body 1A includes a bracket 01 and a support plate 02 provided on the bracket 01. The preheating plate assembly 3A, the loading manipulator assembly 4A, the boat assembly 5A, the test arm assembly 6A, and the unloading manipulator assembly 7A are all provided on the support plate 02. Considering that the temperatures of the preheating plate assembly 3A, the boat assembly 5A, and the test arm assembly 6A will be lower than the outside temperature during operation, in order to prevent the preheating plate assembly 3A, the boat assembly 5A, and the test arm assembly 6A from transferring their temperatures to the support plate 02, resulting in the support plate 02 having too low a temperature and condensing dew when contacting the outside, a second heating component 03 is provided on the support plate 02. The second heating component 03 is used to heat the support plate 02. With such a design, the second heating component 03 can provide a heat source to offset the heat dissipation at the support plate 02, thus preventing external condensation.

[0132] Further, the second heating component 03 includes a first heating pad 031, a second heating pad 032, and a third heating pad 033. The first heating pad 031 is provided at a position on the lower surface of the support plate 02 corresponding to the preheating plate assembly 3A, the second heating pad 032 is provided at a position on the lower surface of the support plate 02 corresponding to the boat assembly 5A, and the third heating pad 033 is provided at a position on the lower surface of the support plate 02 corresponding to the test arm assembly 6A. With such a design, the heating pads are directly arranged corresponding to the components with temperature reduction, which can better supplement the temperature of the support plate 02 and prevent low temperature from being transferred to other areas.

[0133] Furthermore, considering that if there are gaps between the first heating pad 031, the second heating pad 032, and the third heating pad 033 and the support plate 02, it is easy to cause the heating pads to burn out due to dry burning. Preferably, the first heating pad 031, the second heating pad 032, and the third heating pad 033 are respectively pressed against the support plate 02 by a first pressing plate, a second pressing plate, and a third pressing plate, thus preventing gaps from existing between the heating pads and the support plate 02.

[0134] Furthermore, temperature detection sensors are provided on the first heating pad 031, the second heating pad 032, and the third heating pad 033. With such a design, the temperatures of the first heating pad 031, the second heating pad 032, and the third heating pad 033 can be controlled by the temperature detection sensors, thus meeting different usage requirements.

[0135] In some embodiments, the constant high and low temperature chip testing device further includes a housing 12A covering the preheating plate assembly 3A, the loading manipulator assembly 4A, the boat assembly 5A, the testing arm assembly 6A, and the unloading manipulator assembly 7A. The housing 12A includes a first inner layer 13A and a first outer layer 14A, and a first heat insulation space is formed between the first inner layer 13A and the first outer layer 14A. With such a design, the first inner layer 13A is in direct contact with the internal space of the device, the first outer layer 14A is in direct contact with the external space of the device, and a hollow heat insulation space is formed between the first inner layer 13A and the first outer layer 14A, effectively isolating the temperature conduction from the first inner layer 13A to the first outer layer 14A and avoiding condensation on the outer layer.

[0136] Preferably, the contact surface of the first inner layer 13A in contact with the internal space of the device is covered with a heat insulation material to better isolate the temperature.

[0137] In some embodiments, a heat dissipation channel 15A penetrating the first inner layer 13A and the first outer layer 14A is provided on the housing 12A, and a first sealing door 16A is provided on the housing 12A. The first sealing door 16A is movably provided outside the first outer layer 14A and can be moved to open or close the heat dissipation channel 15A. With such a design, when sealing is required at low temperature, the first sealing door 16A can be closed to close the heat dissipation channel 15A; when heat dissipation is required at high temperature, the first sealing door 16A can be opened to open the heat dissipation channel 15A for heat dissipation, thus ensuring both the sealing state at low temperature and the heat dissipation state at high temperature.

[0138] Furthermore, an exhaust fan is provided in the heat dissipation channel 15A, which can achieve the effect of actively exhausting heat when opened.

[0139] In some embodiments, a safety door 17A is provided on the housing 12A. The safety door 17A includes a second inner layer and a second outer layer, and a second heat insulation space is formed between the second inner layer and the second outer layer. With such a design, a hollow heat insulation space is also formed between the inner and outer layers, avoiding the conduction of internal low temperature from the inner layer to the outer layer.

[0140] Among them, both the second inner layer and the second outer layer of the safety door 17A are made of transparent materials, so that the operation inside the device can be clearly observed even when it is closed.

[0141] Please refer to Figures 18 to 22, in some embodiments, to solve the problem of frosting and condensation during low-temperature testing, a first partition layer 18A and a second partition layer 21A are arranged at intervals inside the housing 12A. The first partition layer 18A and the second partition layer 21A divide the inner cavity of the housing 12A into a loading cavity 24A, a testing cavity 25A, and an unloading cavity 26A. The loading conveyor assembly 2A and the preheating plate assembly 3A are both located in the loading cavity 24A. The loading manipulator assembly 4A penetrates through the loading cavity 24A and the testing cavity 25A. The boat assembly 5A and the testing arm assembly 6A are both located in the testing cavity 25A. The unloading manipulator assembly 7A penetrates through the testing cavity 25A and the unloading cavity 26A. The unloading conveyor assembly 8A and the defective product tray assembly 9A are both located in the unloading cavity 26A. At least one first dry air inlet is provided on the loading cavity 24A. After the loading cavity 24A is filled with dry air, a high-pressure area is formed. A first through hole for communicating the loading cavity 24A and the testing cavity 25A is provided on the first partition layer 18A. The first through hole allows the loading manipulator assembly 4A to move. A second through hole for communicating the testing cavity 25A and the unloading cavity 26A is provided on the second partition layer 21A. The second through hole allows the unloading manipulator assembly 7A to move. The inner cavity of the housing 12A is divided into three relatively independent areas: the loading cavity 24A, the testing cavity 25A, and the unloading cavity 26A. A large number of first dry air inlets are provided on the inner wall surface of the loading cavity 24A. After filling with dry air, the pressure in the loading cavity 24A rises to form a high-pressure area. Using the pressure difference between the loading cavity 24A, the testing cavity 25A, and the unloading cavity 26A, the dry air can be accelerated to flow directionally into the testing cavity 25A and the unloading cavity 26A, and finally discharged outside the device, reducing the device drying time and ensuring the device drying effect.

[0142] In some embodiments, a second sealing door 19A for opening and closing the first through hole and a first power mechanism 20A for controlling the opening and closing of the second sealing door 19A are provided on the first partition layer 18A. When the second sealing door 19A closes the first through hole, the dry air filled into the loading cavity 24A can quickly fill the entire loading cavity 24A, making it form a high pressure. At this time, the pressure difference between the loading cavity 24A and the testing cavity 25A is large. Then, the first power mechanism 20A drives the second sealing door 19A to open the first through hole, and the dry air in the loading cavity 24A can quickly enter the testing cavity 25A through the first through hole until the testing cavity 25A is filled, so that a high pressure is also formed in the testing cavity 25A.

[0143] Further, the first power mechanism 20A includes a first air cylinder or a first electric lead screw or a first electric pulley. Preferably, the first power mechanism 20A is a first air cylinder, and the output end of the first air cylinder is connected to the second sealing door 19A, so that the first air cylinder can drive the second sealing door 19A to move.

[0144] Specifically, the second sealing door 19A can be a monolithic door, and the opening and closing of the first through-hole are realized by driving the second sealing door 19A to move through a first air cylinder; the second sealing door 19A can also be composed of a plurality of first sealing plates, and each first sealing plate is driven by a plurality of first air cylinders respectively. The shapes of each first sealing plate can be the same or different, and the driving directions of each first air cylinder can be the same or different.

[0145] In some embodiments, a third sealing door 22A for realizing the opening and closing of the second through-hole and a second power mechanism 23A for controlling the opening and closing of the third sealing door 22A are provided on the second separation layer 21A. When the third sealing door 22A closes the second through-hole, the dry air entering the test chamber 25A can quickly fill the entire test chamber 25A, making it also form a high-pressure chamber. Then, the second power mechanism 23A drives the third sealing door 22A to open the second through-hole. By using the pressure difference between the test chamber 25A and the blanking chamber 26A, the dry air in the test chamber 25A can quickly enter the blanking chamber 26A through the second through-hole, achieving the effect of drying the equipment and improving the drying efficiency.

[0146] Furthermore, the second power mechanism 23A includes a second air cylinder or a second electric lead screw or a second electric pulley. Preferably, the second power mechanism 23A is a second air cylinder, and the output end of the second air cylinder is connected to the third sealing door 22A, enabling the second air cylinder to drive the third sealing door 22A to move.

[0147] Specifically, the third sealing door 22A can be a monolithic door, and the opening and closing of the second through-hole are realized by driving the third sealing door 22A to move through a second air cylinder; see Figure 22 , the third sealing door 22A can also be composed of a plurality of second sealing plates, and each second sealing plate is driven by a plurality of second air cylinders respectively. The shapes of each second sealing plate can be the same or different, and the driving directions of each second air cylinder can be the same or different.

[0148] In some embodiments, at least one second dry air inlet is provided in the test chamber 25A, and the number of second dry air inlets is less than the number of first dry air inlets. Most of the dry air in the test chamber 25A flows in from the dry air in the loading chamber 24A. When the dew point rises after the dry air passes through the loading chamber 24A, a small amount of dry air is filled into the test chamber 25A through the second dry air inlet, so that the dry air flowing out of the loading chamber 24A can be compensated to a certain extent at the test chamber 25A, causing the dew point to drop again and ensuring the dryness.

[0149] Optionally, a trace amount of third dry air inlets are provided on the blanking chamber 26A, and the number of the third dry air inlets is less than that of the second dry air inlets, which is conducive to forming a pressure difference between the test chamber 25A and the blanking chamber 26A.

[0150] It should be noted that the first dry air inlet, the second dry air inlet, and the third dry air inlet are all micropores capable of blowing dry air, and are respectively distributed on the inner walls around the feeding chamber 24A, the test chamber 25A, and the blanking chamber 26A. The first dry air inlet, the second dry air inlet, and the third dry air inlet are all connected to the trachea to blow dry air into the device.

[0151] In some embodiments, an exhaust port capable of exhausting air to the outside is provided on the blanking chamber 26A. Compared with the feeding chamber 24A and the test chamber 25A, the blanking chamber 26A is a low-pressure area. However, in fact, some dry gas also fills the blanking chamber 26A, making the pressure in the blanking chamber 26A greater than the atmospheric pressure outside the sorter. There is a pressure difference between the blanking chamber 26A and the external environment, and the gas in the blanking chamber 26A can be discharged from the exhaust port to the external environment.

[0152] In some embodiments, a first low-temperature structure for reducing the internal temperature of the feeding chamber 24A is provided in the feeding chamber 24A. The first low-temperature structure is arranged in the feeding chamber 24A, and the feeding chamber 24A is a high-pressure area, and air in other areas is not easily introduced into the feeding chamber 24A, which can ensure the dryness in the feeding chamber 24A and ensure that frosting does not occur.

[0153] Similarly, a second low-temperature structure for reducing the internal temperature of the test chamber 25A is provided in the test chamber 25A. After the dry air enters the test chamber 25A, the pressure in the test chamber 25A also rises, making the pressure in the test chamber 25A greater than the pressure in the blanking chamber 26A. The air in the blanking chamber 26A is not easily introduced into the test chamber 25A, which can ensure the dryness in the test chamber 25A. Arranging the second low-temperature structure in the test chamber 25A can ensure that frosting does not occur. A normal-temperature structure is provided in the blanking chamber 26A, which can effectively improve the drying speed of the device.

[0154] In some embodiments, there is a first gap between the first partition layer 18A and the outer shell 12A, and a second gap between the second partition layer 21A and the outer shell 12A. The dry air in the feeding chamber 24A can enter the test chamber 25A from the first gap, and the dry air in the test chamber 25A can enter the blanking chamber 26A from the second gap. It should be noted that both the first gap and the second gap are tiny gaps, and only a trace amount of dry gas can pass through. In this case, most of the dry air between the chambers still flows through the first through-hole and the second through-hole, and only a trace amount of dry air flows through the first gap and the second gap.

[0155] A constant high and low temperature chip testing device provided by the present invention includes a device main body 1A and a preheating plate assembly 3A, a loading manipulator assembly 4A, a wafer boat assembly 5A, a testing arm assembly 6A, and an unloading manipulator assembly 7A arranged on the device main body 1A. The loading manipulator assembly 4A is used to transfer room-temperature chips to the station corresponding to the loading manipulator assembly 4A on the wafer boat assembly 5A, or to transfer room-temperature chips to the preheating plate assembly 3A. The preheating plate assembly 3A preheats the chips into high-temperature chips or precools the chips into low-temperature chips. The loading manipulator assembly 4A is also used to transfer the high-temperature chips or low-temperature chips on the preheating plate assembly 3A to the station corresponding to the loading manipulator assembly 4A on the wafer boat assembly 5A. The wafer boat assembly 5A is used to transport the chips at the station corresponding to the loading manipulator assembly 4A to the station corresponding to the testing arm assembly 6A and to transport the chips at the station corresponding to the testing arm assembly 6A to the station corresponding to the unloading manipulator assembly 7A. The testing arm assembly 6A is used to take out the chips at the station corresponding to the testing arm assembly 6A on the wafer boat assembly 5A for testing and to put the tested chips back to the station corresponding to the testing arm assembly 6A on the wafer boat assembly 5A. The unloading manipulator assembly 7A is used to take out the chips at the station corresponding to the unloading manipulator assembly 7A on the wafer boat assembly 5A. With such a design, the constant high and low temperature chip testing device can automatically realize the preheating and precooling of chips, the testing of chips at room temperature, high temperature and low temperature, and the taking out of chips after testing, thereby improving the automation degree, reducing the working intensity of workers, and improving the production efficiency.

[0156] The above has introduced in detail a constant high and low temperature chip testing device disclosed in the embodiments of the present invention. In this article, specific examples are used to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand a constant high and low temperature chip testing device of the present invention and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A constant high and low temperature chip testing device, characterized in that, It includes a device main body (1A), a preheating plate assembly (3A), a loading manipulator assembly (4A), a susceptor assembly (5A), a test arm assembly (6A) and an unloading manipulator assembly (7A) provided on the device main body (1A). The loading manipulator assembly (4A) is used to transfer room-temperature chips to the station corresponding to the loading manipulator assembly (4A) on the susceptor assembly (5A), or to transfer room-temperature chips to the preheating plate assembly (3A). The preheating plate assembly (3A) preheats the chips into high-temperature chips or precools the chips into low-temperature chips. The loading manipulator assembly (4A) is also used to transfer the high-temperature chips or low-temperature chips on the preheating plate assembly (3A) to the station corresponding to the loading manipulator assembly (4A) on the susceptor assembly (5A). The susceptor assembly (5A) is used to transport the chips corresponding to the station of the loading manipulator assembly (4A) to the station corresponding to the test arm assembly (6A) and to transport the chips corresponding to the station of the test arm assembly (6A) to the station corresponding to the unloading manipulator assembly (7A). The test arm assembly (6A) is used to take out the chips corresponding to the station of the test arm assembly (6A) on the susceptor assembly (5A) for testing and to put the tested chips back to the station corresponding to the test arm assembly (6A) on the susceptor assembly (5A). The unloading manipulator assembly (7A) is used to take out the chips corresponding to the station of the unloading manipulator assembly (7A) on the susceptor assembly (5A). The susceptor assembly (5A) includes a susceptor main body (21) and a second chip positioning plate (24) provided on the susceptor main body (21). The susceptor main body (21) is provided with a station corresponding to the loading manipulator assembly (4A), a station corresponding to the test arm assembly (6A) and a station corresponding to the unloading manipulator assembly (7A). The second chip positioning plates (24) are two pieces, and the two second chip positioning plates (24) are arranged side by side. The second chip positioning plate (24) has two states: one state is that one of the second chip positioning plates (24) is located at the station corresponding to the loading manipulator assembly (4A) and the other second chip positioning plate (24) corresponds to the station of the test arm assembly (6A); the other state is that one of the second chip positioning plates (24) is located at the station corresponding to the test arm assembly (6A) and the other second chip positioning plate (24) corresponds to the station of the unloading manipulator assembly (7A). The device body includes a bracket (01) and a support plate (02) provided on the bracket (01). The preheating plate assembly (3A), the loading manipulator assembly (4A), the boat assembly (5A), the test arm assembly (6A), and the unloading manipulator assembly (7A) are all provided on the support plate (02). A second heating component (03) is provided on the support plate (02), and the second heating component (03) is used to heat the support plate (02); the second heating component (03) includes a first heating pad (031), a second heating pad (032), and a third heating pad (033). The first heating pad (031) is provided on the lower surface of the support plate (02) corresponding to the position of the preheating plate assembly (3A), the second heating pad (032) is provided on the lower surface of the support plate (02) corresponding to the position of the boat assembly (5A), and the third heating pad (033) is provided on the lower surface of the support plate (02) corresponding to the position of the test arm assembly (6A). The constant high and low temperature chip testing device further includes a housing (12A) covering the preheating plate assembly (3A), the loading manipulator assembly (4A), the boat assembly (5A), the test arm assembly (6A), and the unloading manipulator assembly (7A). The housing (12A) includes a first inner layer (13A) and a first outer layer (14A), and a first heat insulation space is formed between the first inner layer (13A) and the first outer layer (14A). The constant high and low temperature chip testing device further includes a housing (12A) covering the preheating plate assembly (3A), the loading manipulator assembly (4A), the boat assembly (5A), the test arm assembly (6A), and the unloading manipulator assembly (7A). A first partition layer (18A) and a second partition layer (21A) are arranged at intervals in the housing (12A). The first partition layer (18A) and the second partition layer (21A) divide the inner cavity of the housing (12A) into a loading chamber (24A), a testing chamber (25A), and an unloading chamber (26A). At least one first dry air inlet is provided on the loading chamber (24A). After the loading chamber (24A) is filled with dry air, a high-pressure area is formed. A first through hole capable of communicating the loading chamber (24A) with the testing chamber (25A) is provided on the first partition layer (18A), and a second through hole capable of communicating the testing chamber (25A) with the unloading chamber (26A) is provided on the second partition layer (21A). At least one second dry air inlet is provided in the testing chamber (25A), and the number of second dry air inlets is less than the number of first dry air inlets. A small amount of third dry air inlets are provided on the unloading chamber (26A), and the number of third dry air inlets is less than the number of second dry air inlets. A first low-temperature structure for reducing the internal temperature of the loading chamber (24A) is provided in the loading chamber (24A). A second low-temperature structure for reducing the internal temperature of the test chamber (25A) is provided inside the test chamber (25A).

2. The constant high and low temperature chip testing device according to claim 1, characterized in that: The preheating plate assembly (3A) includes a first heating component (8) having a cavity, a refrigerant pipe (9), and a first chip positioning plate (10). The refrigerant pipe (9) communicates with the cavity of the first heating component (8) for supplying refrigerant to the first heating component (8). The first chip positioning plate (10) is in contact with the first heating component (8). The first heating component (8) is used to heat the first chip positioning plate (10) or to cool the first chip positioning plate (10) when the refrigerant pipe (9) supplies refrigerant.

3. The constant high and low temperature chip testing device according to claim 2, wherein: The first heating component (8) is a plate-like structure with the same shape and size as the first chip positioning plate (10). The first chip positioning plate (10) is disposed on the upper surface of the first heating component (8), and the refrigerant pipe (9) is connected to the side of the first heating component (8).

4. The constant high and low temperature chip testing device according to claim 1, wherein: The loading robot arm assembly (4A) includes a first robotic arm (11), a second robotic arm (12), a first lifting platform (13), and a first suction nozzle assembly. The second robotic arm (12) is connected to the first robotic arm (11). The first lifting platform (13) is disposed on the second robotic arm (12). The first suction nozzle assembly is disposed on the first lifting platform (13). The first robotic arm (11) drives the second robotic arm (12) to move in a first horizontal direction to drive the first suction nozzle assembly to move in the first horizontal direction. The second robotic arm (12) drives the first lifting platform (13) to move in a second horizontal direction to drive the first suction nozzle assembly to move in the second horizontal direction. The first lifting platform (13) drives the first suction nozzle assembly to move in a first vertical direction; wherein the second horizontal direction is different from the first horizontal direction.

5. The constant high and low temperature chip testing device according to claim 4, characterized in that: The loading robot arm assembly (4A) further includes a second drive assembly, a third drive assembly, and a fourth drive assembly. The second drive assembly is disposed on the first robotic arm (11) and drives in the first horizontal direction to drive the second robotic arm (12) to move in the first horizontal direction. The third drive assembly is disposed on the second robotic arm (12) and drives in the second horizontal direction to drive the first lifting platform (13) to move in the second horizontal direction. The fourth drive assembly is disposed on the first lifting platform (13) to drive the first suction nozzle assembly to move in the first vertical direction.

6. The constant high and low temperature chip testing device according to claim 5, wherein: The second driving component includes a second transmission belt (15) and a second driving motor (16). The second driving motor (16) is arranged on the first robotic arm (11). The second transmission belt (15) is arranged on the second driving motor (16). The second transmission belt (15) drives the second robotic arm (12) to move under the drive of the second driving motor (16). The third driving component includes a third transmission belt (17) and a third driving motor (18). The third driving motor (18) is arranged on the second robotic arm (12). The third transmission belt (17) is arranged on the third driving motor (18). The third transmission belt (17) drives the first lifting platform (13) to move under the drive of the third driving motor (18). The fourth driving component includes a fourth transmission belt (19) and a fourth driving motor (20). The fourth driving motor (20) is arranged on the first lifting platform (13). The fourth transmission belt (19) is arranged on the fourth driving motor (20). The fourth transmission belt (19) drives the first lifting platform (13) to move under the drive of the fourth driving motor (20).

7. The constant high and low temperature chip testing device according to claim 1, wherein: The material ship component (5A) includes a fifth driving component arranged on the material ship main body (21). The fifth driving component is used to drive the second chip positioning plate (24) to move among the stations corresponding to the loading manipulator component (4A), the testing arm component (6A), and the unloading manipulator component (7A).

8. The constant high and low temperature chip testing device according to claim 7, wherein: The fifth driving component includes a fifth transmission belt (22) and a fifth driving motor (23). The fifth driving motor (23) is arranged on the material ship main body (21). The fifth transmission belt (22) is arranged on the fifth driving motor (23). The fifth transmission belt (22) drives the second chip positioning plate (24) to move under the drive of the fifth driving motor (23).

9. The constant high and low temperature chip testing device according to claim 1, wherein: The testing arm component (6A) includes a testing arm main body (25), a sixth driving component, a seventh driving component, and a second suction nozzle component arranged on the testing arm main body (25). The sixth driving component is used to drive the second suction nozzle component to move along the third horizontal direction. The seventh driving component is used to drive the second suction nozzle component to move along the second vertical direction.

10. The constant high and low temperature chip testing device according to claim 9, characterized in that: The sixth driving component includes a sixth driving motor (26) and a sixth transmission screw rod (27). The sixth transmission screw rod (27) drives the second suction nozzle component to move along the third horizontal direction under the drive of the sixth driving motor (26). The seventh driving component includes a seventh driving motor (28) and a seventh transmission screw rod (29). The seventh transmission screw rod (29) drives the second suction nozzle component to move along the second vertical direction under the drive of the seventh driving motor (28).

11. The constant high and low temperature chip testing device according to claim 9, characterized in that: The sixth driving component is a set, the seventh driving component and the second suction nozzle component are two sets. One set of the sixth driving component drives the two sets of the second suction nozzle components to move along the third horizontal direction, and the two sets of the seventh driving component respectively drive the two sets of the second suction nozzle components to move along the second vertical direction.

12. The constant high and low temperature chip testing device according to claim 1, characterized in that: The blanking manipulator assembly (7A) includes a third robotic arm (31), a fourth robotic arm (32), a second lifting platform (33) and a third suction nozzle component. The fourth robotic arm (32) is connected to the third robotic arm (31). The second lifting platform (33) is arranged on the fourth robotic arm (32). The third suction nozzle component is arranged on the second lifting platform (33). The third robotic arm (31) drives the fourth robotic arm (32) to move along the fourth horizontal direction so as to drive the third suction nozzle component to move along the fourth horizontal direction. The fourth robotic arm (32) drives the second lifting platform (33) to move along the fifth horizontal direction so as to drive the third suction nozzle component to move along the fifth horizontal direction. The second lifting platform (33) drives the third suction nozzle component to move along the third vertical direction. Wherein, the fifth horizontal direction is different from the fourth horizontal direction.

13. The constant high and low temperature chip testing device according to claim 12, characterized in that: The blanking manipulator assembly (7A) further includes an eighth driving component, a ninth driving component and a tenth driving component. The eighth driving component is arranged on the third robotic arm (31) and drives along the fourth horizontal direction to drive the fourth robotic arm (32) to move along the fourth horizontal direction. The ninth driving component is arranged on the fourth robotic arm (32) and drives along the fifth horizontal direction to drive the second lifting platform (33) to move along the fifth horizontal direction. The tenth driving component is arranged on the second lifting platform (33) to drive the third suction nozzle component to move along the third vertical direction.

14. The constant high and low temperature chip testing device according to claim 13, characterized in that: The eighth driving component includes an eighth transmission belt (35) and an eighth driving motor (36). The eighth driving motor (36) is arranged on the third robotic arm (31). The eighth transmission belt (35) is arranged on the eighth driving motor (36). The eighth transmission belt (35) drives the fourth robotic arm (32) to move under the drive of the eighth driving motor (36). The ninth driving component includes a ninth transmission belt (37) and a ninth driving motor (38). The ninth driving motor (38) is arranged on the fourth robotic arm (32). The ninth transmission belt (37) is arranged on the ninth driving motor (38). The ninth transmission belt (37) drives the second lifting platform (33) to move under the drive of the ninth driving motor (38). The tenth driving component includes a tenth transmission belt (39) and a tenth driving motor (40). The tenth driving motor (40) is arranged on the second lifting platform (33). The tenth transmission belt (39) is arranged on the tenth driving motor (40). The tenth transmission belt (39) drives the second lifting platform (33) to move under the drive of the tenth driving motor (40).

15. The constant high and low temperature chip testing device according to any one of claims 1 to 14, characterized in that: The constant high and low temperature chip testing equipment further includes a loading conveyor line assembly (2A). The loading conveyor line assembly (2A) is used to convey a tray (61) containing chips at normal temperature. The loading manipulator assembly (4A) is used to transfer the chips on the tray (61) of the loading conveyor line assembly (2A) to the preheating tray assembly (3A).

16. The constant high and low temperature chip testing device according to claim 15, wherein: The loading conveyor line assembly (2A) includes a loading conveyor line main body (1) and a first driving assembly provided on the loading conveyor line main body (1). A loading area (2) and a first working area (3) are provided on the loading conveyor line main body (1). The preheating tray assembly (3A) is arranged close to the first working area (3). The first driving assembly is used to convey the tray (61) in the loading area (2) to the first working area (3). The loading manipulator assembly (4A) is used to transfer the chips on the tray (61) in the first working area (3) to the preheating tray assembly (3A).

17. The constant high and low temperature chip testing device according to claim 16, wherein: The first driving assembly includes a first driving motor (4) and a first conveyor belt (5). The first driving motor (4) is provided on the loading conveyor line main body (1). The first conveyor belt (5) is arranged on the first driving motor (4). The first driving motor (4) is used to drive the first conveyor belt (5). The first conveyor belt (5) is used to convey the tray (61) in the loading area (2) to the first working area (3).

18. The constant high and low temperature chip testing device according to claim 17, characterized in that: The loading conveyor line assembly (2A) further includes a first positioning cylinder (6). The first positioning cylinder (6) is used to position the tray (61) when the tray (61) is conveyed to the first working area (3).

19. The constant high and low temperature chip testing device according to claim 17, wherein: The loading conveyor line assembly (2A) further includes a first limiting member (7). The first limiting member (7) is provided at one end of the loading conveyor line main body (1) where the first working area (3) is located. The first limiting member (7) is used to limit the movement of the tray (61) along the movement direction of the first conveyor belt (5).

20. The constant high and low temperature chip testing device according to any one of claims 1 to 14, characterized in that: The constant high and low temperature chip testing equipment further includes a receiving conveyor line assembly (8A) and a defective product tray assembly (9A). The unloading manipulator assembly (7A) is used to place the qualified chips on the tray (61) of the receiving conveyor line assembly (8A) according to the test results of the test arm assembly (6A), and place the unqualified chips on the defective product tray assembly (9A).

21. The constant high and low temperature chip testing device according to claim 20, wherein: The receiving conveyor line assembly (8A) includes a receiving conveyor line main body (41) and an eleventh driving assembly provided on the receiving conveyor line main body (41). A second working area (42) and a receiving area (43) are provided on the receiving conveyor line main body (41). The second working area (42) is arranged close to the boat assembly (5A). The unloading manipulator assembly (7A) is used to place the qualified chips on the tray (61) in the second working area (42). The eleventh driving assembly is used to convey the tray (61) in the second working area (42) to the receiving area (43).

22. The constant high and low temperature chip testing device according to claim 21, characterized in that: The eleventh driving assembly includes an eleventh driving motor (44) and an eleventh transmission belt (45). The eleventh driving motor (44) is arranged on the main body (41) of the material receiving conveyor line. The eleventh transmission belt (45) is arranged on the eleventh driving motor (44). The eleventh driving motor (44) is used to drive the eleventh transmission belt (45), and the eleventh transmission belt (45) is used to convey the tray (61) in the second working area (42) to the material receiving area (43).

23. The constant high and low temperature chip testing device according to claim 20, characterized in that: The defective product tray assembly (9A) includes a plurality of defective product trays (46), and the plurality of defective product trays (46) are arranged side by side.

24. The constant high and low temperature chip testing device according to any one of claims 1 to 14, characterized in that: The constant high and low temperature chip testing equipment further includes a tray gripper assembly (10A) and an empty tray conveyor line assembly (11A). The tray gripper assembly (10A) is used to grab the empty tray (61) after taking the chips on the loading conveyor line assembly (2A) and transfer it to the empty tray conveyor line assembly (11A).

25. The constant high and low temperature chip testing device according to claim 24, characterized in that: The tray gripper assembly (10A) includes a fifth robotic arm (47), a sixth robotic arm (48) and an empty tray clamping component (49). The sixth robotic arm (48) is connected to the fifth robotic arm (47). The empty tray clamping component (49) is arranged on the sixth robotic arm (48). The fifth robotic arm (47) drives the sixth robotic arm (48) to move along the sixth horizontal direction or along the fourth vertical direction, so as to drive the empty tray clamping component (49) to move along the sixth direction or along the fourth vertical direction.

26. The constant high and low temperature chip testing device according to claim 25, wherein: The tray gripper assembly (10A) further includes a twelfth driving assembly and a thirteenth driving assembly. The twelfth driving assembly is arranged on the fifth robotic arm (47) and moves along the sixth horizontal direction to drive the sixth robotic arm (48) to move along the sixth horizontal direction. The thirteenth driving assembly is arranged on the fifth robotic arm (47) and moves along the fourth vertical direction.

27. The constant high and low temperature chip testing device according to claim 26, characterized in that: The twelfth driving assembly includes a twelfth transmission belt (52) and a twelfth driving motor (53). The twelfth driving motor (53) is arranged on the fifth robotic arm (47). The twelfth transmission belt (52) is arranged on the twelfth driving motor (53). Driven by the twelfth driving motor (53), the twelfth transmission belt (52) drives the sixth robotic arm (48) to move along the sixth horizontal direction. The thirteenth driving assembly includes a thirteenth transmission screw (54) and a thirteenth driving motor (55). The thirteenth driving motor (55) is arranged on the fifth robotic arm (47). The thirteenth transmission screw (54) is arranged on the thirteenth driving motor (55). Driven by the thirteenth driving motor (55), the thirteenth transmission screw (54) drives the sixth robotic arm (48) to move along the fourth vertical direction.

28. The constant high and low temperature chip testing device according to claim 25, wherein: The empty tray component (49) includes an empty tray main body (62), a clamping cylinder (50) and a tray gripper (51). The empty tray main body (62) is arranged on the sixth robotic arm (48). The clamping cylinder (50) and the tray gripper (51) are both arranged on the empty tray main body (62). The tray gripper (51) clamps an empty tray (61) under the drive of the clamping cylinder (50).

29. The constant high and low temperature chip testing device according to claim 24, characterized in that: The empty tray conveyor line assembly (11A) includes an empty tray conveyor line main body (56) and a fourteenth drive assembly arranged on the empty tray conveyor line main body (56). A third working area (57) and an empty tray collection area (58) are arranged on the empty tray conveyor line main body (56). The tray gripper assembly (10A) is used to grab and transfer the empty tray (61) after taking chips on the loading conveyor line assembly (2A) to the third working area (57) of the empty tray conveyor line assembly (11A). The fourteenth drive assembly is used to convey the empty tray (61) in the third working area (57) to the empty tray collection area (58).

30. The constant high and low temperature chip testing device according to claim 29, characterized in that: The fourteenth drive assembly includes a fourteenth drive motor (59) and a fourteenth transmission belt (60). The fourteenth drive motor (59) is arranged on the empty tray conveyor line main body (56). The fourteenth transmission belt (60) is arranged on the fourteenth drive motor (59). The fourteenth drive motor (59) is used to drive the fourteenth transmission belt (60). The fourteenth transmission belt (60) is used to convey the empty tray (61) in the third working area (57) to the empty tray collection area (58).

31. The constant high and low temperature chip testing device according to any one of claims 1 to 14, characterized in that: A heat dissipation channel (15A) passing through the first inner layer (13A) and the first outer layer (14A) is arranged on the outer shell (12A). A first sealing door (16A) is arranged on the outer shell (12A). The first sealing door (16A) is movably arranged outside the first outer layer (14A) and can be moved to open or close the heat dissipation channel (15A).

32. The constant high and low temperature chip testing device according to any one of claims 1 to 14, characterized in that: A safety door (17A) is arranged on the outer shell (12A). The safety door (17A) includes a second inner layer and a second outer layer. A second heat insulation space is formed between the second inner layer and the second outer layer.

33. The constant high and low temperature chip testing device according to any one of claims 1 to 14, characterized in that: A second sealing door (19A) for opening and closing the first through hole and a first power mechanism (20A) for controlling the opening and closing of the second sealing door (19A) are arranged on the first partition layer (18A).

34. The constant high and low temperature chip testing device according to any one of claims 1 to 14, characterized in that: A third sealing door (22A) for opening and closing the second through hole and a second power mechanism (23A) for controlling the opening and closing of the third sealing door (22A) are arranged on the second partition layer (21A).

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