Wafer bonding device

Abstract

The invention provides a wafer bonding device. The wafer bonding device comprises a bonding chamber, and a first carrying table, a second carrying table, a wafer fixing assembly and a driving assembly which are located in the bonding chamber. The first carrying table and the second carrying table are oppositely arranged, the first carrying table is provided with a carrying disc, the carrying disc comprises a first fixing surface used for fixing a wafer, the wafer fixing assembly is arranged on the first carrying table, and the wafer fixing assembly comprises a second fixing surface used for fixing the wafer. The driving assembly comprises a first driving part, and the first driving part is used for driving the carrying disc and / or the wafer fixing assembly to drive the fixed wafer to move relative to the other wafer, so that the wafer fixed by the second fixing surface is aligned with the wafer fixed by the first fixing surface. The driving assembly further comprises a second driving piece, and the second driving piece drives the first carrying table or the second carrying table to move towards the other carrying table so that the two wafers can be bonded.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer bonding device. Background Art

[0002] Wafer bonding device is a special equipment used to tightly bond wafers and is widely used in semiconductor manufacturing, microelectronics, micro-electromechanical systems and other fields.

[0003] In the existing wafer bonding process, two wafers are usually aligned outside the bonding chamber and then transferred into the bonding chamber for bonding. During the transfer process, the relative positions of the wafers may shift, resulting in reduced bonding accuracy. Summary of the invention

[0004] The present application provides a wafer bonding device, which includes a bonding chamber and a first carrier, a second carrier, a wafer fixing component and a driving component located in the bonding chamber;

[0005] The first stage and the second stage are arranged opposite to each other; the first stage is provided with a carrier, and the carrier includes a first fixing surface for fixing the wafer; the wafer fixing assembly is arranged on the first stage, and the wafer fixing assembly includes a second fixing surface for fixing the wafer;

[0006] The driving assembly comprises a first driving member, and the first driving member is used to drive the carrier and / or the wafer fixing assembly to drive the wafer fixed thereto to move relative to another wafer, so that the wafer fixed on the second fixing surface is aligned with the wafer fixed on the first fixing surface;

[0007] The driving assembly further includes a second driving member, which drives the first carrier or the second carrier to move toward the other carrier to bond the two wafers.

[0008] In one embodiment, the wafer fixing assembly includes a plurality of fixing parts arranged at intervals along the circumferential direction, each of the fixing parts is used to fix the wafer; the driving assembly also includes a first driving part, and the first driving part is used to drive the fixing part to move in the vertical direction.

[0009] In one embodiment, the wafer fixing assembly includes a plurality of fixing parts arranged at intervals along the circumferential direction, each of the fixing parts is used to fix the wafer; the driving assembly also includes a plurality of second driving parts, each of the second driving parts is used to drive the fixing part to move in a horizontal direction so as to move the fixing part away from the carrier.

[0010] In one embodiment, the wafer bonding device also includes a controller and an image sensor assembly, wherein the image sensor assembly is used to detect relative position information of the wafer fixed on the first fixing surface and the wafer fixed on the second fixing surface; the controller is used to control the first driving member to drive the carrier and / or the wafer fixing assembly to move according to the relative position information.

[0011] In one embodiment, the first driving member is only drivingly connected to the wafer fixing assembly; the image sensor assembly includes at least one image sensor disposed on the second stage; the relative position information includes a first angle, a second angle, at least three first distances and at least three second distances;

[0012] The controller is used to: control each of the image sensors to acquire a first image after the wafer is fixed on the first fixing surface and the wafer is not fixed on the second fixing surface, and control each of the image sensors to acquire a second image after the wafer is fixed on both the first fixing surface and the second fixing surface; determine the first angle and each of the first distances according to the first image, and determine the second angle and each of the second distances according to the second image; control the first driving member to drive the wafer fixing assembly to rotate according to the difference between the first angle and the second angle; determine the first fixing surface according to the first distances and the position of the center of the circle of the first fixing surface determining a first relative coordinate of the center of the wafer fixed on the second fixing surface and the center of the first fixing surface according to the second distances and the position of the center of the first fixing surface; determining a third relative coordinate of the center of the wafer fixed on the second fixing surface and the center of the wafer fixed on the first fixing surface according to the first relative coordinates and the second relative coordinates, and controlling the first driving member to drive the wafer fixing assembly to move according to the third relative coordinates, so that the center of the wafer fixed on the second fixing surface is aligned with the center of the wafer fixed on the first fixing surface;

[0013] Among them, the first distance is the distance between the first intersection and the second intersection, the first intersection is the intersection of the first straight line passing through the center of the first fixed surface and the edge of the first fixed surface; the second intersection is the intersection of the first straight line and the edge of the orthographic projection of the wafer fixed by the first fixed surface on the first fixed surface; the positions of the first intersections corresponding to different first distances are different; the first angle is the angle between the first connecting line and the second straight line extending along the set direction and passing through the center of the wafer fixed by the first fixed surface, and the first connecting line is the connecting line between the cut of the wafer fixed by the first fixed surface and the center of the wafer;

[0014] The second distance is the distance between the third intersection and the fourth intersection, the third intersection is the intersection of the third straight line passing through the center of the first fixed surface and the edge of the first fixed surface; the fourth intersection is the intersection of the third straight line and the edge of the positive projection of the wafer fixed by the second fixed surface on the first fixed surface; the positions of the third intersections corresponding to different second distances are different; the second angle is the angle between the second connecting line and the fourth straight line extending along the set direction and passing through the center of the wafer fixed by the second fixed surface, and the second connecting line is the line connecting the incision of the wafer fixed by the second fixed surface and the center of the wafer.

[0015] In one embodiment, the first angle and at least one of the first distances are detected by the same image sensor; or, the first angle and any of the first distances are detected by different image sensors respectively;

[0016] The second angle and at least one of the second distances are detected by the same image sensor; or, the second angle and any of the second distances are detected by different image sensors respectively.

[0017] In one embodiment, the third relative coordinate includes the distance between the center of the wafer fixed to the first fixing surface and the center of the wafer fixed to the second fixing surface in the first direction and the second direction; the first direction is perpendicular to the second direction;

[0018] The first driving member includes a third driving part, a fourth driving part, a rotating part arranged around the carrier and a fifth driving part; the wafer fixing assembly is connected to the rotating part so as to be relatively movably connected; the third driving part drives the wafer fixing assembly to move relative to the rotating part in the first direction, and the fourth driving part drives the wafer fixing assembly to move relative to the rotating part in the second direction; the fifth driving part drives the rotating part to rotate, so that the rotating part drives the wafer fixing assembly to rotate.

[0019] In one embodiment, the wafer fixing assembly includes a plurality of fixing parts arranged at intervals along the circumferential direction, each of the fixing parts is used to fix the wafer, and each of the fixing parts is connected to the rotating part so as to be relatively movably connected; the driving assembly also includes a plurality of second driving parts, each of the second driving parts is drivingly connected to one of the fixing parts, and each of the second driving parts is used to drive the fixing part drivingly connected thereto to move along a straight line parallel to the first fixing surface, so that the fixing part is away from the carrier;

[0020] Part of the second driving unit is multiplexed as the third driving unit, and part of the second driving unit is multiplexed as the fourth driving unit.

[0021] In one embodiment, the third driving unit includes a first lead screw and a first motor extending along the first direction; the fourth driving unit includes a second lead screw and a second motor extending along the second direction; the fifth driving unit includes a third lead screw and a third motor; each of the first lead screws is respectively connected to one of the fixed parts and the first motor, and the first motor drives the first lead screw to rotate and drives the fixed part connected thereto to move along the first direction; each of the second lead screws is respectively connected to one of the fixed parts and the second motor, and the second motor drives the second lead screw to rotate and drives the fixed part connected thereto to move along the second direction; the third motor drives the third lead screw to rotate and drives the rotating part to rotate.

[0022] In one embodiment, the first driving member is only connected to the carrier; the image sensor assembly includes at least one image sensor disposed on the second carrier; the relative position information includes at least three first distances and at least three second distances;

[0023] The controller is used to: control each of the image sensors to acquire a third image after wafers are fixed on both the first fixing surface and the second fixing surface; determine each of the first distances and each of the second distances according to the third image; determine a first relative coordinate between the center of the wafer fixed on the first fixing surface and the center of the first fixing surface according to each of the first distances and the position of the center of the first fixing surface, determine a second relative coordinate between the center of the wafer fixed on the second fixing surface and the center of the first fixing surface according to each of the second distances and the position of the center of the first fixing surface, determine a third relative coordinate between the center of the wafer fixed on the second fixing surface and the center of the wafer fixed on the first fixing surface according to the first relative coordinate and the second relative coordinate, and control the first driving member to drive the wafer fixing assembly to move according to the third relative coordinate so that the center of the wafer fixed on the second fixing surface is aligned with the center of the wafer fixed on the first fixing surface;

[0024] The first distance is the distance between the first intersection point and the second intersection point, the first intersection point is the intersection point of a first straight line passing through the center of the first fixing surface and the edge of the first fixing surface; the second intersection point is the intersection point of the first straight line and the edge of the orthographic projection of the wafer fixed to the first fixing surface on the first fixing surface; different first distances correspond to different positions of the first intersection points;

[0025] The second distance is the distance between the third intersection and the fourth intersection, the third intersection being the intersection of a third straight line passing through the center of the first fixed surface and the edge of the first fixed surface; the fourth intersection being the intersection of the third straight line and the edge of the positive projection of the wafer fixed to the second fixed surface on the first fixed surface; the positions of the third intersections corresponding to different second distances are different.

[0026] In one embodiment, the image sensor is also used to detect the overlapping area of ​​the cut of the wafer fixed on the first fixed surface and the cut of the wafer fixed on the second fixed surface based on the third image, and determine the relative offset angle between the wafer fixed on the first fixed surface and the wafer fixed on the second fixed surface based on the overlapping area; and control the first driving member to drive the carrier to rotate based on the relative offset angle.

[0027] In one embodiment, the first drive member comprises a piezoelectric motor.

[0028] In one embodiment, the first carrier is located directly below the second carrier; the wafer bonding device further comprises an air suspension mechanism, and the air suspension mechanism can spray air to separate the bottom of the carrier from the first carrier.

[0029] In one embodiment, the wafer bonding device further includes a wafer separation assembly, and the drive assembly further includes a third drive member;

[0030] The third driving member is configured to: before wafer alignment, drive the wafer separation assembly to extend to the side of the wafer fixed on the first fixing surface away from the carrier; after wafer alignment and before two wafers are bonded, drive the wafer separation assembly to move to the side of the carrier.

[0031] In one embodiment, the first stage is located directly below the second stage;

[0032] And / or, at least one of the carrier plate, the first carrier, and the second carrier is provided with a heating device;

[0033] And / or, the first carrier is provided with a receiving groove, and at least a part of the structure of the driving component is arranged in the receiving groove.

[0034] The wafer bonding device provided in the embodiment of the present application has a wafer fixing assembly located in the bonding chamber. After two wafers are respectively fixed on the first fixing surface and the second fixing surface, the wafer alignment can be achieved in the bonding chamber by driving the carrier or the wafer fixing assembly to move through the first driving member. Compared with the method in the related art of completing wafer alignment outside the bonding chamber and then transferring the wafer to the bonding chamber for bonding, the reduction in bonding accuracy caused by the relative position of the wafer shifting during the transfer process can be avoided, which is beneficial to improving the bonding quality. At the same time, the alignment and bonding of the wafer bonding device of the present application are completed in one chamber, which can simplify the process flow and improve production efficiency.

[0035] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0037] Figure 1 A schematic structural diagram of a wafer bonding device provided in one embodiment of the present application;

[0038] Figure 2 A schematic structural diagram of a wafer bonding device provided in another embodiment of the present application;

[0039] Figure 3 for Figure 1 and Figure 2 A bottom view of the second stage of the wafer bonding apparatus provided in the illustrated embodiment;

[0040] Figure 4 A schematic diagram of a first image acquired by an image sensor provided in an embodiment of the present application;

[0041] Figure 5 A schematic diagram of a second image acquired by an image sensor provided in an embodiment of the present application;

[0042] Figure 6 A schematic diagram of a third image acquired by an image sensor provided by an embodiment of the present application;

[0043] Figure 7 for Figure 1 A top view of a first stage of a wafer bonding apparatus provided in the illustrated embodiment;

[0044] Figure 8 for Figure 2 The illustrated embodiment provides a top view of a first stage of a wafer bonding apparatus. DETAILED DESCRIPTION

[0045] Here, the technical solutions in the embodiments (or "implementations") of the present application will be described clearly and completely in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0046] If there are terms involving directional indications or positional relationships in the embodiments of the present application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first", "second", etc. involved in the embodiments of the present application are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance.

[0047] The wafer bonding device of the embodiment of the present application is described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can complement or combine with each other.

[0048] The present application embodiment provides a wafer bonding device, such as Figure 1 and Figure 2 As shown, the wafer bonding apparatus includes a bonding chamber 100 and a first carrier 10 , a second carrier 20 , a wafer fixing assembly 30 and a driving assembly 40 located in the bonding chamber 100 .

[0049] The first stage 10 and the second stage 20 are arranged opposite to each other. The first stage 10 is provided with a carrier plate 11, and the carrier plate 11 includes a first fixing surface 111 for fixing a wafer. The wafer fixing assembly 30 is arranged on the first stage 10, and the wafer fixing assembly 30 includes a second fixing surface 301 for fixing a wafer.

[0050] The driving assembly 40 includes a first driving member 41, which is used to drive the carrier 11 or the wafer fixing assembly 30 to drive the wafer fixed thereon to move relative to another wafer, or the first driving member 41 drives the carrier 11 and the wafer fixing assembly 30 to drive the wafer fixed thereon to move simultaneously, so that the wafer fixed on the second fixing surface 301 is aligned with the wafer fixed on the first fixing surface 111.

[0051] The driving assembly 40 further includes a second driving member 42, and the second driving member 42 drives the first stage 10 or the second stage 20 to move toward the other stage to bond two wafers.

[0052] In the wafer bonding device provided in the embodiment of the present application, the wafer fixing assembly 30 is located in the bonding chamber 100. After the two wafers are respectively fixed on the first fixing surface 111 and the second fixing surface 301, the wafer alignment can be achieved in the bonding chamber 100 by driving the carrier 11 or the wafer fixing assembly 30 to move through the first driving member 41. Compared with the method in the related art of completing the wafer alignment outside the bonding chamber and then transferring the wafer to the bonding chamber for bonding, the reduction in bonding accuracy caused by the relative position of the wafer shifting during the transfer process can be avoided, which is beneficial to improving the bonding quality. At the same time, the alignment and bonding of the wafer bonding device of the present application are completed in one chamber, which can simplify the process flow and improve production efficiency.

[0053] In one embodiment, the first fixing surface 111 is parallel to the second fixing surface 301. This helps to make the wafer fixed on the first fixing surface 111 and the wafer fixed on the second fixing surface 301 parallel to each other.

[0054] In one embodiment, the wafer bonding apparatus further includes a controller that can control the driving component 40 .

[0055] In one embodiment, Figure 1 and Figure 2 As shown, the wafer bonding device further includes an air pump 50, which is connected to the bonding chamber 100. Before wafer alignment and bonding, the air pump 50 can be used to extract the air in the bonding chamber 100 and fill the bonding chamber 100 with an inert gas, so that a clean and stable bonding environment is formed in the bonding chamber 100, thereby preventing the wafer surface from being contaminated, and facilitating the improvement of the purity of the bonding interface. In some embodiments, the air pump 50 can be a molecular pump or a dry pump.

[0056] In one embodiment, Figure 1 and Figure 2 As shown, the second stage 20 may include a carrier plate 21, and the carrier plate 21 is arranged parallel to the carrier plate 11. During the wafer bonding process, the second driving member 42 drives the first stage 10 or the second stage 20 to move toward the other stage, so that the carrier plate 21 moves toward the first stage 10 until it contacts the wafer and exerts a force on the wafer, thereby completing the wafer bonding.

[0057] In one embodiment, at least one of the carrier plate 11, the carrier plate 21, the first carrier 10 and the second carrier 20 is provided with a heating device, and the heating device can be used to heat the wafer, thereby achieving thermal compression bonding of the wafer.

[0058] Furthermore, if Figure 1 and Figure 2As shown, the first stage 10 is provided with a receiving groove, and at least part of the structure of the driving assembly 40 is arranged in the receiving groove. When the bonding method of the wafer is thermal compression bonding, during the bonding process, the temperature in the bonding chamber 100 is relatively high. The driving assembly 40 is arranged in the receiving groove, which can prevent the driving assembly 40 from being affected by the high temperature, and is conducive to extending the service life of the driving assembly 40 and reducing its maintenance requirements.

[0059] In one embodiment, the first stage 10 is located directly below the second stage 20. The wafer and the wafer fixing assembly 30 are arranged above the first stage 10, so that the wafer can be stably fixed above the first stage 10, and the wafer can be accurately aligned by the wafer fixing assembly 30. Moreover, the bonding of the two wafers can be achieved by moving the first stage 10 or the second stage 20 in the longitudinal direction, and the operation is simple and convenient.

[0060] In one embodiment, Figure 1 and Figure 2 As shown, the wafer fixing assembly 30 includes a plurality of fixing parts 31 arranged at intervals along the circumferential direction, each of the fixing parts 31 is used to fix the wafer, and the driving assembly 40 also includes a first driving part 411, and the first driving part 411 is used to drive the fixing part 31 to move in the vertical direction. By providing a plurality of fixing parts 31, the stability of the wafer being fixed on the wafer fixing assembly can be improved.

[0061] Furthermore, before the wafers are aligned, the first driving part 411 can control the fixing part 31 to pick up the wafer facing the second carrier 20 among the two wafers, and drive the fixing part 31 to move in a direction perpendicular to the first fixing surface 111 of the first carrier 10 to separate the two wafers, thereby realizing relative movement of the two wafers to realize alignment; after the wafer alignment is completed, the fixing part 31 is driven to move toward the carrier 11 to make the two wafers contact for bonding.

[0062] In one embodiment, the first driving part 411 includes a hydraulic rod connected to a hydraulic cylinder and the fixing part 31, and drives the fixing part 31 to move up and down through hydraulic transmission.

[0063] In one embodiment, each fixing portion 31 is provided with at least one adsorption hole on the surface facing the carrier 11. When the wafer fixing assembly 30 fixes the wafer, the adsorption hole of the fixing portion 31 fits with the surface of the wafer, and the wafer is fixed by vacuum adsorption. Vacuum adsorption can flexibly pick up and lower the wafer, and can prevent the surface of the wafer from being scratched.

[0064] In one embodiment, Figure 1 and Figure 2As shown, the driving assembly 40 also includes a plurality of second driving parts 412, each of which is used to drive the fixing part 31 to move in the horizontal direction so that the fixing part 31 is away from the carrier 11. During the wafer bonding process, the second driving part 42 drives the first stage 10 or the second stage 20 to move toward the other stage so that the two wafers are bonded. The second driving part 412 drives the fixing part 31 away from the carrier 11, which can prevent the fixing part 31 from obstructing the contact between the second stage 20 and the wafer, thereby ensuring the smooth wafer bonding. In some embodiments, the second driving part 412 drives the fixing part 31 to move in a direction parallel to the first fixing surface 111 of the carrier 11.

[0065] In one embodiment, the fixing portion 31 is L-shaped, one end of the fixing portion 31 is movably connected to the first stage 10, and the other end extends toward the carrier plate 11. The second driving portion 412 can drive the fixing portion 31 to translate in a direction parallel to the first fixing surface 111, and can also drive the fixing portion 31 to rotate around the end connected to the first stage 10, so that the orthographic projection of the fixing portion 31 on the first stage 10 is located outside the orthographic projection of the carrier plate 11 on the first stage 10, so as to prevent the fixing portion 31 from affecting the wafer bonding.

[0066] In one embodiment, after the second driving part 412 drives the fixing part 31 away from the carrier 11, the first driving part 411 can drive the fixing part 31 to move toward the first carrier 10 until the fixing part 31 is lower than the first fixing surface 111 of the carrier 11 to avoid the fixing part 31 affecting the contact between the second carrier 20 and the wafer.

[0067] In one embodiment, Figure 1 and Figure 2 As shown, the wafer bonding device further includes a wafer separation assembly 60, and the driving assembly 40 further includes a third driving member 43, and the third driving member 43 is configured to: before wafer alignment, drive the wafer separation assembly 60 to extend to the side of the wafer fixed on the first fixing surface 111 away from the carrier 11; after wafer alignment and before the two wafers are bonded, drive the wafer separation assembly 60 to move to the side of the carrier 11. Before wafer bonding, the wafer separation assembly 60 extends between the two wafers to avoid adhesion of the surfaces of the two wafers, so as to facilitate the wafer fixing assembly 30 to pick up the wafer; and when the bonding chamber 100 is evacuated, the wafer separation assembly 60 can separate the upper and lower wafers by a certain distance, so as to facilitate the extraction of all the air between the upper and lower wafers, so as to avoid bubbles between the two wafers affecting the wafer bonding quality.

[0068] In one embodiment, Figures 1 to 3As shown, the wafer bonding device also includes an image sensor assembly 70, and the image sensor assembly 70 is used to detect the relative position information of the wafer fixed by the first fixing surface 111 and the wafer fixed by the second fixing surface 301, and the controller is used to control the first driving member 41 to drive the carrier 11 or the wafer fixing assembly 30 to move according to the relative position information. The relative position information obtained by the image sensor assembly 70 may include the relative distance and relative angle between the wafer and the carrier 11. The controller is responsible for processing the information data collected by the image sensor assembly 70 and issuing instructions to the first driving member 41 according to the processing results. The first driving member 41 adjusts the position of the carrier 11 or the wafer fixing assembly 30 according to the instructions, thereby driving the wafer to move to an aligned state. The wafer alignment process is completed in the bonding chamber, which is conducive to improving bonding accuracy and production efficiency.

[0069] In one embodiment, Figure 1 , Figure 4 and Figure 5 As shown, the first driving member 41 is only driven and connected to the wafer fixing assembly 30, the image sensor assembly 70 includes at least one image sensor arranged on the second carrier 20, and the relative position information includes a first angle C1, a second angle C2, at least three first distances A1~A3 and at least three second distances B1~B3.

[0070] The controller is used to: control each image sensor to acquire a first image (such as Figure 4 As shown), after the first fixing surface 111 and the second fixing surface 301 are both fixed with wafers, each of the image sensors is controlled to acquire a second image (as shown Figure 5 shown).

[0071] The first angle C1 and the first distances A1-A3 are determined according to the first image, and the second angle C2 and the second distances B1-B3 are determined according to the second image. The first driving member 41 is controlled to drive the wafer fixing assembly 30 to rotate according to the difference between the first angle C1 and the second angle C2.

[0072] The first relative coordinates between the center of the wafer 200 fixed by the first fixing surface 111 and the center of the first fixing surface 111 are determined according to the first distances A1 to A3 and the position of the center of the first fixing surface 111 .

[0073] The second relative coordinates of the center of the wafer 200 ′ fixed on the second fixing surface and the center of the first fixing surface 111 are determined according to the second distances B1 to B3 and the position of the center of the first fixing surface 111 .

[0074] The third relative coordinates of the center of the wafer 200' fixed on the second fixing surface 301 and the center of the wafer 200 fixed on the first fixing surface are determined according to the first relative coordinates and the second relative coordinates, and the first driving member 41 is controlled according to the third relative coordinates to drive the wafer fixing assembly 30 to move so that the center of the wafer 200' fixed on the second fixing surface 301 is aligned with the center of the wafer 200 fixed on the first fixing surface 111.

[0075] Among them, the first distance A1~A3 is the distance between the first intersection points M1~M3 and the second intersection points M1'~M3', and the first intersection points M1~M3 are the intersection points of the first straight line L1 passing through the center of the first fixed surface 111 and the edge of the first fixed surface 111. The second intersection points M1'~M3' are the intersection points of the first straight line L1 and the edge of the orthographic projection of the wafer 200 fixed by the first fixed surface 111 on the first fixed surface 111. The positions of the first intersection points corresponding to different first distances are different. The first angle C1 is the angle between the first connecting line l1 and the second straight line L2 extending along the set direction and passing through the center of the wafer 200 fixed by the first fixed surface 111. The first connecting line l1 is the connecting line between the cutout 201 of the wafer 200 fixed by the first fixed surface 111 and the center of the wafer.

[0076] exist Figure 4 In the illustrated embodiment, the first intersections M1, M3 and the second intersections M1', M3' are located on the same first straight line L1, the first intersection M1 and the second intersection M1' are located on the same side of the wafer 200, the first intersection M3 and the second intersection M3' are located on the same side of the wafer 200, the first intersection M2 and the second intersection M2' are located on another first straight line L1, and the two first straight lines are perpendicular to each other. In some other embodiments, the first intersections M1, M2 and M3 are respectively located on three first straight lines in different directions.

[0077] The second distances B1 to B3 are the distances between the third intersections N1 to N3 and the fourth intersections N1' to N3', and the third intersections N1 to N3 are the intersections of the third straight line L3 passing through the center of the first fixed surface 111 and the edge of the first fixed surface 111. The fourth intersections N1' to N3' are the intersections of the third straight line L3 and the edge of the orthographic projection of the wafer 200' fixed by the second fixed surface on the first fixed surface 111. The positions of the third intersections corresponding to different second distances are different. The second angle C2 is the angle between the second connecting line l2 and the fourth straight line L4 extending along the set direction and passing through the center of the wafer 200' fixed by the second fixed surface, and the second connecting line l2 is the connecting line between the cutout 201' of the wafer 200' fixed by the second fixed surface and the center of the wafer.

[0078] exist Figure 5 In the illustrated embodiment, the third intersections N1, N3 and the fourth intersections N1', N3' are located on the same third straight line L3, the third intersection N1 and the fourth intersection N1' are located on the same side of the wafer 200, the third intersection N3 and the fourth intersection N3' are located on the same side of the wafer 200, the third intersection N2 and the fourth intersection N2' are located on another third straight line L3, and the two third straight lines L3 are perpendicular to each other. In some other embodiments, the third intersections N1, N2 and N3 are respectively located on three third straight lines with different directions.

[0079] Before the wafer is aligned, the center of the first fixed surface 111 is opposite to the center of the second fixed surface 301, and the wafer fixed by the first fixed surface 111 and the wafer fixed by the second fixed surface 301 are pre-aligned, so that the center of the wafer 200 carried by the first fixed surface 111 of the carrier 11 coincides with the center of the first fixed surface 111, or the distance between the two is very small (generally less than 300μm), and the center of the wafer 200' carried by the second fixed surface 301 coincides with the center of the second fixed surface 121, or the distance between the two is very small (generally less than 300μm). During the alignment process, after the first driving member 41 drives the wafer fixing assembly 30 to rotate the difference between the first angle C1 and the second angle C2, the cuts of the wafer 200 and the wafer 200' can be basically aligned to meet the precision requirements of the process; then the first driving member 41 drives the wafer fixing assembly 30 to move according to the third relative coordinate to align the edges of the wafer 200 and the wafer 200'.

[0080] Through the above settings, the image sensor component 70 can accurately determine the position information of the two wafers, and achieve alignment between the wafers by adjusting the position and angle of the wafer fixing component 30, which is beneficial to improve the bonding accuracy and ensure the reliability of wafer bonding. There is no need to transfer the wafers to external equipment for alignment, and the operation is simple and quick.

[0081] In one embodiment, the first angle and at least one of the first distances are detected by the same image sensor. This arrangement can reduce the number of image sensors required, which is beneficial to reducing the cost and complexity of the wafer alignment assembly. In some embodiments, Figure 3 and Figure 4 As shown, the image sensor assembly 70 includes a first image sensor 71, a second image sensor 72, a third image sensor 73 and a fourth image sensor 74. The first image sensor 71 is used to detect the first distance A1, the second image sensor 72 is used to detect the first distance A2, the third image sensor 73 is used to detect the first distance A3, and the fourth image sensor A4 is used to detect the first distance A4 and the first angle C1.

[0082] In some other embodiments, the first angle and any of the first distances may be detected by different image sensors, respectively.

[0083] In one embodiment, the second angle and at least one of the second distances are detected by the same image sensor. Figure 3 and Figure 5 As shown, the image sensor assembly 70 includes a first image sensor 71, a second image sensor 72, a third image sensor 73 and a fourth image sensor 74. The first image sensor 71 is used to detect the second distance B1, the second image sensor 72 is used to detect the first distance B2, the third image sensor 73 is used to detect the first distance B3, and the fourth image sensor A4 is used to detect the first distance B4 and the first angle C2.

[0084] In some other embodiments, the second angle and any second distance can be detected by different image sensors respectively.

[0085] In one embodiment, Figure 4 and Figure 5 As shown, the third relative coordinate includes the distance between the center of the wafer 200 fixed on the first fixing surface 111 and the center of the wafer 200 ′ fixed on the second fixing surface in the first direction X and the second direction Y, and the first direction X is perpendicular to the second direction Y.

[0086] like Figure 7 As shown, the first driving member includes a third driving part 413, a fourth driving part 414, a rotating part 410 arranged around the carrier 11 and a fifth driving part 415, the wafer fixing assembly 30 is connected to the rotating part 410 so as to be relatively movably connected, the third driving part 413 drives the wafer fixing assembly 30 to move relative to the rotating part 410 in the first direction X, the fourth driving part 414 drives the wafer fixing assembly 30 to move relative to the rotating part 410 in the second direction Y, and the fifth driving part 415 drives the rotating part 410 to rotate, so that the rotating part 410 drives the wafer fixing assembly 30 to rotate.

[0087] In this embodiment, the fifth driving unit 415 drives the rotating unit 410 to rotate, thereby driving the wafer fixing assembly 30 to rotate, so that the wafer 200' rotates to achieve the alignment of the incision directions of the two wafers. Then the third driving unit 413 drives the wafer fixing assembly 30 to drive the wafer 200' to move in the first direction X, and the fourth driving unit 414 drives the wafer fixing assembly 30 to drive the wafer 200' to move in the second direction Y, and finally achieves the alignment of the edges and incisions of the two wafers. This can facilitate the control of the movement of the wafer, which is conducive to achieving precise alignment of the wafer. In some embodiments, the first driving unit 411 can be connected to the rotating unit 410. Figure 1 In the illustrated embodiment, the first driving portion 411 is located above the rotating portion 410 , and the first driving portion 411 drives the fixing portion 31 to move in a vertical direction.

[0088] exist Figure 4 and Figure 7 In the illustrated embodiment, the extension direction of the first straight line L1 passing through the first intersections M1 and M3 coincides with the first direction X, and the extension direction of the first straight line L1 passing through the first intersections M2 and M4 coincides with the second direction Y. In other embodiments, the extension direction of the first straight line L1 may also be different from the first direction X and the second direction Y. Figure 5 In the illustrated embodiment, the extension direction of the third straight line L3 passing through the third intersection points N1 and N3 coincides with the first direction X, and the extension direction of the third straight line L3 passing through the third intersection points N2 and N4 coincides with the second direction Y. In other embodiments, the extension direction of the third straight line L3 may also be different from the first direction X and the second direction Y.

[0089] In one embodiment, Figure 1 , Figure 4 and Figure 7 As shown, each of the fixed parts 31 is connected to the rotating part 410 so as to be relatively movably connected, and the driving assembly 40 also includes a plurality of second driving parts 412, each of the second driving parts 412 is drivingly connected to one of the fixed parts 31, and each of the second driving parts 412 is used to drive the fixed part 31 drivingly connected thereto to move along a straight line parallel to the first fixed surface 111 of the carrier 11 so as to move the fixed part 31 away from the carrier 11, and some of the second driving parts 412 are reused as the third driving parts 413, and some of the second driving parts 412 are reused as the fourth driving parts 414.

[0090] In this embodiment, the second driving unit 412 is reused as the third driving unit 413 and the fourth driving unit 414. The second driving unit 412 can drive the fixing unit 31 away from the carrier 11 to avoid interference between the fixing unit 31 and the carrier or the stage during wafer bonding, and can also drive the fixing unit 31 to move the wafer 200' to achieve alignment between the two wafers. This can simplify the structural complexity of the wafer bonding device and reduce the manufacturing cost.

[0091] In one embodiment, Figure 7 As shown, the third driving part 413 includes a first lead screw 4131 extending along the first direction X and a first motor, the fourth driving part 414 includes a second lead screw 4141 extending along the second direction Y and a second motor, and the fifth driving part 415 includes a third lead screw 4151 and a third motor. Each of the first lead screws 4131 is respectively connected to one of the fixing parts 31 and the first motor, the first motor drives the first lead screw 4131 to rotate and drives the fixing part 31 connected thereto to move along the first direction X, each of the second lead screws 4141 is respectively connected to one of the fixing parts 31 and the second motor, the second motor drives the second lead screw 4141 to rotate and drives the fixing part connected thereto to move along the second direction Y, and the third motor drives the third lead screw 4151 to rotate and drives the rotating part 410 to rotate. During the wafer alignment process, the fifth driving unit 415 drives the rotating unit 410 to rotate the angle of the difference between the first angle C1 and the second angle C2, the third driving unit 413 drives the fixed unit 31 connected thereto to move along the first lead screw 4131 according to the third relative coordinate, and the fourth driving unit 414 drives the fixed unit 31 connected thereto to move along the second lead screw 4141 according to the third relative coordinate, so that the wafer edge and the cutout can be aligned. The lead screw facilitates precise control of the fixed unit 31, and the control process is simple, with low implementation difficulty.

[0092] It can be understood that, in this embodiment, the first lead screw 4131 and the second lead screw 4141 are both connected to the rotating part 410, and the first lead screw 4131 and the second lead screw 4141 are driven to rotate by driving the rotating part 410 to rotate, thereby driving the fixed part 31 to rotate. The first direction X is the same as the extension direction of the first lead screw 4131, and the second direction Y is the same as the extension direction of the second lead screw 4141.

[0093] In one embodiment, Figure 1 As shown, the rotating part 410 is installed on the first carrier 10, and a roller 4101 is provided between the rotating part 410 and the first carrier 10. The roller 4101 can reduce the friction between the rotating part 410 and the first carrier 10, so as to facilitate the rotation of the rotating part 410 relative to the first carrier 10.

[0094] In one embodiment, Figure 2 , Figure 3 and Figure 6 As shown, the first driving member 41 is only drivingly connected to the carrier plate 11, the image sensor assembly 70 includes at least one image sensor arranged on the second carrier 20, and the relative position information includes at least three first distances A1~A3 and at least three second distances B1~B3.

[0095] The controller is used to: control each of the image sensors to acquire a third image after wafers are fixed on the first fixing surface 111 and the second fixing surface, and determine each of the first distances A1-A3 and each of the second distances B1-B3 according to the third image.

[0096] The first relative coordinates between the center of the wafer 200 fixed by the first fixing surface 111 and the center of the first fixing surface 111 are determined according to the first distances A1 to A3 and the position of the center of the first fixing surface 111, and the second relative coordinates between the center of the wafer 200' fixed by the second fixing surface and the center of the first fixing surface 111 are determined according to the second distances B1 to B3 and the position of the center of the first fixing surface 111. The third relative coordinates between the center of the wafer 200 fixed by the first fixing surface and the center of the wafer 200' fixed by the second fixing surface are determined according to the first relative coordinates and the second relative coordinates, and the first driving member 41 is controlled to drive the wafer fixing assembly 30 to move according to the third relative coordinates, so that the center of the wafer 200' fixed by the second fixing surface is aligned with the center of the wafer 200 fixed by the first fixing surface.

[0097] The first distance is the distance between the first intersection points M1-M3 and the second intersection points M1'-M3', and the first intersection points M1-M3 are the intersection points of the first straight line L1 passing through the center of the first fixed surface and the edge of the first fixed surface. The second intersection points M1'-M3' are the intersection points of the first straight line L1 and the edge of the orthographic projection of the wafer 200 fixed to the first fixed surface on the first fixed surface. The positions of the first intersection points corresponding to different first distances are different.

[0098] The second distance is the distance between the third intersection points N1-N3 and the fourth intersection points N1'-N3', and the third intersection points N1-N3 are the intersection points of the third straight line L3 passing through the center of the first fixed surface and the edge of the first fixed surface. The fourth intersection points N1'-N3' are the intersection points of the third straight line L3 and the edge of the orthographic projection of the wafer 200' fixed to the second fixed surface on the first fixed surface 111. The positions of the third intersection points corresponding to different second distances are different.

[0099] exist Figure 6In the illustrated embodiment, the first straight line L1 passing through the first intersections M1 and M3 coincides with the third straight line L3 passing through the third intersections N1 and N3, and the first straight line L1 passing through the first intersection M2 coincides with the third straight line L3 passing through the third intersection N2. In other embodiments, the first straight line L1 and the third straight line L3 may extend in different directions, respectively.

[0100] In one embodiment, Figure 3 and Figure 6 As shown, the image sensor is also used to detect the overlap area of ​​the cutout 201 of the wafer 200 fixed on the first fixing surface and the cutout 201' of the wafer 200' fixed on the second fixing surface according to the third image, and determine the relative offset angle between the wafer 200 fixed on the first fixing surface and the wafer 200' fixed on the second fixing surface according to the overlap area. The first driving member 41 is controlled to drive the carrier 11 to rotate according to the relative offset angle.

[0101] Before wafer alignment, the centers of the first fixed surface 111 and the second fixed surface 301 are opposite, and the wafer fixed by the first fixed surface 111 and the wafer fixed by the second fixed surface 301 are pre-aligned, so that the center of the wafer 200 carried by the first fixed surface 111 of the carrier 11 coincides with the center of the first fixed surface 111, or the distance between the two is very small (generally less than 300μm), and the center of the wafer 200' carried by the second fixed surface 301 coincides with the center of the second fixed surface 121, or the distance between the two is very small (generally less than 300μm). During the alignment process, the first driving member 41 drives the wafer fixing assembly 30 to move according to the third relative coordinate, so that the edges of the wafer 200 and the wafer 200' are aligned, and at this time, the cutout 201 of the wafer 200 fixed by the first fixed surface and the cutout 201' of the wafer 200' fixed by the second fixed surface partially overlap. Since the image actually captured by the image sensor is the front side of the wafer 200 and the back side of the wafer 200 ′, the positions and overlapping areas of the cutouts 201 and 201 ′ can be clearly identified.

[0102] In one embodiment, Figure 2 and Figure 8 As shown, the first driving member 41 includes a piezoelectric motor 416. During the wafer alignment process, the piezoelectric motor 416 drives the carrier 11 to rotate and move, so as to achieve alignment between the wafer edge and the cutout. The piezoelectric motor 416 can be used to perform fine control on the carrier 11, and the control process is simple and the implementation difficulty is relatively low.

[0103] In one embodiment, Figure 2As shown, the first stage 10 is located directly below the second stage 20, and the wafer bonding apparatus further includes an air suspension mechanism 80, which can spray air to separate the bottom of the carrier 11 from the first stage 10. During the wafer alignment process, the separation of the carrier 11 from the first stage 10 can reduce the friction between the carrier 11 and the first stage 10, making it easier to accurately control the position of the carrier 11.

[0104] In this embodiment, the first carrier 10 is provided with a groove, and the wafer bonding device further includes a bearing portion 12 for mounting the carrier 11, the bearing portion 12 is located in the groove and there is a gap between the bearing portion 12 and the first carrier 10, and the bearing portion 12 can drive the carrier 11 to move relative to the first carrier 10. The air suspension mechanism 80 sprays airflow to separate the bearing portion 12 from the bottom of the groove.

[0105] In the case where the first driving member is only drivingly connected to the wafer fixing assembly, the process of bonding the wafer using the wafer bonding device provided in the embodiment of the present application is as follows:

[0106] First, a wafer is placed on a carrier, a wafer separation assembly is inserted above the wafer, and a first image is acquired using an image sensor assembly;

[0107] Then, another wafer is placed on the wafer separation assembly, and the wafer is fixed by the wafer fixing assembly, and the wafer is moved toward the second stage;

[0108] Subsequently, the image sensor assembly is used to acquire a second image, and the controller drives the first driving member to move the carrier according to the first image and the second image, so as to align the two wafers;

[0109] Subsequently, the wafer separation component withdraws from between the two wafers, the wafer fixing component releases the wafer, and the second driving component drives the carrier to move to bond the two wafers.

[0110] In the case where the first driving member is only connected to the carrier drive, the process of bonding the wafer using the wafer bonding device provided in the embodiment of the present application is as follows:

[0111] First, a wafer is placed on a carrier, and a wafer separation assembly is inserted above the wafer;

[0112] Then, another wafer is placed on the wafer separation assembly, and the wafer is fixed by the wafer fixing assembly, and the wafer is moved toward the second stage;

[0113] Subsequently, the image sensor assembly is used to acquire a third image, and the controller drives the first driving member to move the carrier according to the third image, so that the two wafers are aligned;

[0114] Subsequently, the wafer separation component withdraws from between the two wafers, the wafer fixing component releases the wafer, and the second driving component drives the carrier to move to bond the two wafers.

[0115] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without causing conflicts. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the drawings; all modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application should be included in the scope of protection of this application.

Claims

1. A wafer bonding device, characterized in that: The wafer bonding device comprises a bonding chamber and a first carrier, a second carrier, a wafer fixing component and a driving component located in the bonding chamber; The first stage and the second stage are arranged opposite to each other; the first stage is provided with a carrier, and the carrier includes a first fixing surface for fixing the wafer; the wafer fixing assembly is arranged on the first stage, and the wafer fixing assembly includes a second fixing surface for fixing the wafer; The driving assembly comprises a first driving member, and the first driving member is used to drive the carrier and / or the wafer fixing assembly to drive the wafer fixed thereto to move relative to another wafer, so that the wafer fixed on the second fixing surface is aligned with the wafer fixed on the first fixing surface; The driving assembly further includes a second driving member, which drives the first carrier or the second carrier to move toward the other carrier to bond the two wafers.

2. The wafer bonding device according to claim 1, characterized in that: The wafer fixing assembly includes a plurality of fixing parts arranged at intervals along the circumferential direction, each of the fixing parts is used to fix the wafer; the driving assembly also includes a first driving part, and the first driving part is used to drive the fixing part to move in the vertical direction.

3. The wafer bonding device according to claim 1, characterized in that: The wafer fixing assembly includes a plurality of fixing parts arranged at intervals along the circumferential direction, each of the fixing parts is used to fix the wafer; the driving assembly also includes a plurality of second driving parts, each of the second driving parts is used to drive the fixing part to move in a horizontal direction so as to move the fixing part away from the carrier.

4. The wafer bonding device according to claim 1, characterized in that: The wafer bonding device also includes a controller and an image sensor assembly, wherein the image sensor assembly is used to detect relative position information of the wafer fixed on the first fixing surface and the wafer fixed on the second fixing surface; the controller is used to control the first driving member to drive the carrier and / or the wafer fixing assembly to move according to the relative position information.

5. The wafer bonding device according to claim 4, characterized in that: The first driving member is only drivingly connected to the wafer fixing assembly; the image sensor assembly includes at least one image sensor arranged on the second stage; the relative position information includes a first angle, a second angle, at least three first distances and at least three second distances; The controller is used to: control each of the image sensors to acquire a first image after the wafer is fixed on the first fixing surface and the wafer is not fixed on the second fixing surface, and control each of the image sensors to acquire a second image after the wafer is fixed on both the first fixing surface and the second fixing surface; determine the first angle and each of the first distances according to the first image, and determine the second angle and each of the second distances according to the second image; control the first driving member to drive the wafer fixing assembly to rotate according to the difference between the first angle and the second angle; determine the first fixing surface according to the first distances and the position of the center of the circle of the first fixing surface determining a first relative coordinate of the center of the wafer fixed on the second fixing surface and the center of the first fixing surface according to the second distances and the position of the center of the first fixing surface; determining a third relative coordinate of the center of the wafer fixed on the second fixing surface and the center of the wafer fixed on the first fixing surface according to the first relative coordinates and the second relative coordinates, and controlling the first driving member to drive the wafer fixing assembly to move according to the third relative coordinates, so that the center of the wafer fixed on the second fixing surface is aligned with the center of the wafer fixed on the first fixing surface; Among them, the first distance is the distance between the first intersection and the second intersection, the first intersection is the intersection of the first straight line passing through the center of the first fixed surface and the edge of the first fixed surface; the second intersection is the intersection of the first straight line and the edge of the orthographic projection of the wafer fixed by the first fixed surface on the first fixed surface; the positions of the first intersections corresponding to different first distances are different; the first angle is the angle between the first connecting line and the second straight line extending along the set direction and passing through the center of the wafer fixed by the first fixed surface, and the first connecting line is the connecting line between the cut of the wafer fixed by the first fixed surface and the center of the wafer; The second distance is the distance between the third intersection and the fourth intersection, the third intersection is the intersection of the third straight line passing through the center of the first fixed surface and the edge of the first fixed surface; the fourth intersection is the intersection of the third straight line and the edge of the positive projection of the wafer fixed by the second fixed surface on the first fixed surface; the positions of the third intersections corresponding to different second distances are different; the second angle is the angle between the second connecting line and the fourth straight line extending along the set direction and passing through the center of the wafer fixed by the second fixed surface, and the second connecting line is the line connecting the incision of the wafer fixed by the second fixed surface and the center of the wafer.

6. The wafer bonding device according to claim 5, characterized in that: The first angle and at least one of the first distances are detected by the same image sensor; or, the first angle and any of the first distances are detected by different image sensors respectively; The second angle and at least one of the second distances are detected by the same image sensor; or, the second angle and any of the second distances are detected by different image sensors respectively.

7. The wafer bonding device according to claim 5, characterized in that: The third relative coordinate includes the distance between the center of the wafer fixed to the first fixing surface and the center of the wafer fixed to the second fixing surface in the first direction and the second direction; the first direction is perpendicular to the second direction; The first driving member includes a third driving part, a fourth driving part, a rotating part arranged around the carrier, and a fifth driving part; the wafer fixing assembly is connected to the rotating part so as to be relatively movable; The third driving unit drives the wafer fixing assembly to move relative to the rotating unit in the first direction, and the fourth driving unit drives the wafer fixing assembly to move relative to the rotating unit in the second direction; the fifth driving unit drives the rotating unit to rotate, so that the rotating unit drives the wafer fixing assembly to rotate.

8. The wafer bonding device according to claim 7, characterized in that: The wafer fixing assembly includes a plurality of fixing parts arranged at intervals along the circumferential direction, each of the fixing parts is used to fix the wafer, and each of the fixing parts is connected to the rotating part so as to be relatively movable; the driving assembly also includes a plurality of second driving parts, each of the second driving parts is drivingly connected to one of the fixing parts, and each of the second driving parts is used to drive the fixing part drivingly connected thereto to move along a straight line parallel to the first fixing surface, so that the fixing part is away from the carrier; Part of the second driving unit is multiplexed as the third driving unit, and part of the second driving unit is multiplexed as the fourth driving unit.

9. The wafer bonding device according to claim 8, characterized in that: The third driving unit includes a first lead screw and a first motor extending along the first direction; the fourth driving unit includes a second lead screw and a second motor extending along the second direction; the fifth driving unit includes a third lead screw and a third motor; each of the first lead screws is respectively connected to one of the fixed parts and the first motor, and the first motor drives the first lead screw to rotate and drives the fixed part connected thereto to move along the first direction; each of the second lead screws is respectively connected to one of the fixed parts and the second motor, and the second motor drives the second lead screw to rotate and drives the fixed part connected thereto to move along the second direction; the third motor drives the third lead screw to rotate and drives the rotating part to rotate.

10. The wafer bonding device according to claim 4, characterized in that: The first driving member is only connected to the carrier plate; the image sensor assembly includes at least one image sensor arranged on the second carrier; the relative position information includes at least three first distances and at least three second distances; The controller is used to: control each of the image sensors to acquire a third image after wafers are fixed on both the first fixing surface and the second fixing surface; determine each of the first distances and each of the second distances according to the third image; determine a first relative coordinate between the center of the wafer fixed on the first fixing surface and the center of the first fixing surface according to each of the first distances and the position of the center of the first fixing surface, determine a second relative coordinate between the center of the wafer fixed on the second fixing surface and the center of the first fixing surface according to each of the second distances and the position of the center of the first fixing surface, determine a third relative coordinate between the center of the wafer fixed on the second fixing surface and the center of the wafer fixed on the first fixing surface according to the first relative coordinate and the second relative coordinate, and control the first driving member to drive the wafer fixing assembly to move according to the third relative coordinate so that the center of the wafer fixed on the second fixing surface is aligned with the center of the wafer fixed on the first fixing surface; The first distance is the distance between the first intersection point and the second intersection point, the first intersection point is the intersection point of a first straight line passing through the center of the first fixing surface and the edge of the first fixing surface; the second intersection point is the intersection point of the first straight line and the edge of the orthographic projection of the wafer fixed to the first fixing surface on the first fixing surface; different first distances correspond to different positions of the first intersection points; The second distance is the distance between the third intersection and the fourth intersection, the third intersection being the intersection of a third straight line passing through the center of the first fixed surface and the edge of the first fixed surface; the fourth intersection being the intersection of the third straight line and the edge of the positive projection of the wafer fixed to the second fixed surface on the first fixed surface; the positions of the third intersections corresponding to different second distances are different.

11. The wafer bonding device according to claim 10, characterized in that: The image sensor is also used to detect the overlapping area of ​​the cut of the wafer fixed on the first fixed surface and the cut of the wafer fixed on the second fixed surface based on the third image, determine the relative offset angle between the wafer fixed on the first fixed surface and the wafer fixed on the second fixed surface based on the overlapping area; and control the first driving member to drive the carrier to rotate based on the relative offset angle.

12. The wafer bonding device according to claim 10, characterized in that: The first driving member includes a piezoelectric motor.

13. The wafer bonding device according to claim 12, characterized in that: The first carrier is located directly below the second carrier; the wafer bonding device further comprises an air suspension mechanism, which can spray air to separate the bottom of the carrier from the first carrier.

14. The wafer bonding device according to claim 1, characterized in that: The wafer bonding device further includes a wafer separation component, and the driving component further includes a third driving member; The third driving member is configured to: before wafer alignment, drive the wafer separation assembly to extend to the side of the wafer fixed on the first fixing surface away from the carrier; after wafer alignment and before two wafers are bonded, drive the wafer separation assembly to move to the side of the carrier.

15. The wafer bonding device according to claim 1, characterized in that: The first stage is located directly below the second stage; And / or, at least one of the carrier plate, the first carrier, and the second carrier is provided with a heating device; And / or, the first carrier is provided with a receiving groove, and at least a part of the structure of the driving component is arranged in the receiving groove.

Images