Matrix screen and preparation method

Abstract

The embodiment of the invention provides a matrix screen and a preparation method, the method is used for preparing the provided matrix screen through three times of mold pressing, and the provided matrix screen comprises an insulating substrate, a plurality of light emitting units, a plurality of first packaging adhesives, a first light shielding layer, a plurality of second packaging adhesives and a second light shielding layer. The light-emitting units are arranged on the insulating substrate in a matrix mode to form an LED array. Each first packaging adhesive is packaged outside each light emitting unit; the first light shielding layer is arranged on the insulating substrate, and the first packaging adhesive is located in the first light shielding layer; the second packaging adhesive is packaged on the first packaging adhesive and located in the second shading layer, and the area of the projection of the second packaging adhesive on the insulating substrate is larger than that of the projection of the first packaging adhesive on the insulating substrate; the second light shielding layer is arranged on the first light shielding layer; when the multiple light-emitting units emit light, the first light shielding layer and the second light shielding layer can shield light emitted by the light-emitting units from being emitted from the side face, and the light is emitted out of the second through hole.

Description

Technical Field

[0001] The present application relates to the field of LED technology, and in particular to a matrix screen and a preparation method thereof. Background Art

[0002] The matrix screen is composed of multiple independent small LED display modules. Each small module is an independent unit and can be controlled separately. By controlling the brightness or color of each unit, images or text are formed. The matrix screen can be monochrome or full color, static or dynamic.

[0003] However, as the resolution of current images and videos becomes higher and higher, the display accuracy requirements for matrix screens are also increasing, and there is an urgent need for a matrix screen with high display accuracy. Summary of the invention

[0004] The present application provides a matrix screen and a preparation method thereof, aiming to solve the problem that the display accuracy of the existing matrix screen cannot meet the current resolution requirements for images and videos.

[0005] In a first aspect, an embodiment of the present application provides a matrix screen, including: Insulating substrate; A plurality of light-emitting units, the light-emitting units are arranged on an insulating substrate, the plurality of light-emitting units are arranged in a matrix to form an LED array, the light-emitting units include pins, a light-emitting chip arranged on the pins, and a driving chip for driving the light-emitting chip to emit light; A plurality of first packaging glues, each of which is packaged outside each light-emitting unit; A first light shielding layer, the first light shielding layer is arranged on the insulating substrate, the first light shielding layer comprises a plurality of first through holes, and the first packaging glue is located in the first through holes; A plurality of second packaging glues, each second packaging glue is packaged on each first packaging glue, wherein the area of ​​the second packaging glue projected on the insulating substrate is larger than the area of ​​the first packaging glue projected on the insulating substrate; A second light shielding layer, the second light shielding layer is arranged on the first light shielding layer, the second light shielding layer comprises a plurality of second through holes, and the second packaging glue is located in the second through holes; When the plurality of light-emitting units emit light, the first light-shielding layer and the second light-shielding layer can block the light emitted by the light-emitting units from being emitted from the side, and make the light emitted from the second through hole.

[0006] The matrix screen first forms an LED array by arranging multiple light-emitting units in a matrix. Each light-emitting unit contains a light-emitting chip and a driver chip. Then the light-emitting unit is wrapped with the first and second layers of packaging glue to protect it. At the same time, the through-hole design of the first and second shading layers is used to realize the front light projection. Finally, two layers of shading layers are used to ensure that the light is emitted from the through-hole, reducing the scattering of the side light.

[0007] Furthermore, the provided matrix screen uses a multi-layer shading layer and encapsulation glue design to ensure that light is emitted only from the front, preventing light from being emitted from the side, thereby improving the luminous effect. At the same time, the two layers of shading layers block unnecessary light leakage from the side, reducing light interference between different light-emitting units and optimizing the display effect. The shading layer design prevents cross-interference of light between light-emitting units, and the multi-layer encapsulation glue design protects the light-emitting units, thereby improving the stability and durability of the matrix screen.

[0008] In a second aspect, an embodiment of the present application provides a method for preparing a matrix screen, comprising: Providing an insulating substrate, the insulating substrate comprising a plurality of light-emitting units, the plurality of light-emitting units being arranged in a matrix to form an LED array, the light-emitting units comprising pins, a light-emitting chip arranged on the pins, and a driving chip for driving the light-emitting chip to emit light; Performing a first molding on the insulating substrate to form a plurality of first packaging glues on the outer sides of a plurality of light-emitting units disposed on the insulating substrate; Performing a second molding according to the shape and position of the first packaging glue to obtain a first light shielding layer, wherein the first light shielding layer includes a plurality of first through holes; The first light shielding layer is disposed on the insulating substrate, and the first packaging glue is located in the first through hole; Performing a third molding on the first light-shielding layer to form a target adhesive layer on the first light-shielding layer; Cutting the target glue layer to obtain a plurality of second packaging glues and glue flow paths; wherein the plurality of second packaging glues are respectively arranged on the plurality of first packaging glues, and the area of ​​the second packaging glue projected on the insulating substrate is greater than the area of ​​the first packaging glue projected on the insulating substrate; A second light shielding layer is arranged on the outer side of the second packaging glue through the glue flow channel, the second light shielding layer includes a plurality of second through holes, and the second packaging glue is located in the second through holes.

[0009] The provided method first forms a first encapsulation glue, a first shading layer, and a second encapsulation glue respectively through three molding processes to ensure the precise matching of the encapsulation and the shading layer. Then, the setting position of the second shading layer is precisely controlled by using a flow glue channel to ensure that the light is emitted positively from the through hole. Then, the target glue layer is cut to form a second encapsulation glue, and its area is ensured to be larger than that of the first encapsulation glue, so as to further optimize the light control and the protection of the light-emitting unit. Finally, by using a design of two shading layers and two encapsulation glue layers, the light is emitted from the front through the through hole structure, while avoiding the leakage of light from the side.

[0010] In summary, the method provided can precisely control the encapsulation and light emission direction of the light-emitting unit through multiple molding and the design of the glue flow path, ensuring that the light is emitted from the front. At the same time, the molding process ensures the precise positioning of the encapsulation and the light-shielding layer, reduces light interference, and improves the luminous efficiency. It solves the problem of precise matching between the encapsulation glue and the light-shielding layer, avoids light leakage from the side, and reduces interference between light-emitting units.

[0011] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0013] Figure 1 is a schematic diagram of the structure of the matrix screen provided in the embodiment of the present application; Figure 2 yes Figure 1 The main view corresponding to the provided matrix screen; Figure 3 yes Figure 1 The exploded schematic diagram corresponding to the provided matrix screen; Figure 4 yes Figure 1 A schematic block diagram of the structure of a single light-emitting unit corresponding to the provided matrix screen; Figure 5 yes Figure 1 A schematic block diagram of the structure of the first conductive sheet, the second conductive sheet and the signal input unit corresponding to the provided matrix screen; Figure 6 yes Figure 1 A schematic block diagram of the structure of the protection board corresponding to the provided matrix screen; Figure 7 yes Figure 1 A schematic structural diagram of a first light shielding layer and a first packaging adhesive corresponding to the provided matrix screen; Figure 8 It is a schematic flow chart of the steps of the preparation method provided in the examples of the present application.

[0014] Description of main components and symbols: 10. Matrix screen.

[0015] 11. Insulating substrate; 111. Conductive through hole.

[0016] 12, light-emitting unit; 121, driving chip; 122, light-emitting chip; 123, pin; 1231, ground pin; 1232, power pin; 1233, signal input pin; 1234, signal output pin.

[0017] 13. The first packaging glue.

[0018] 14. A first light shielding layer; 141. A first through hole.

[0019] 15. Second packaging glue.

[0020] 16. A second light shielding layer; 161. A second through hole.

[0021] 17. A first conductive sheet.

[0022] 18. Second conductive sheet.

[0023] 19. SMD board.

[0024] 10a. Conductive column.

[0025] 10b, signal input unit; 10b1, signal input terminal; 10b2, signal input interface.

[0026] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0029] It should be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0030] It should be understood that in order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second" and the like are used to distinguish between the same items or similar items with substantially the same functions and effects. For example, the first encapsulation glue and the second encapsulation glue are only used to distinguish between different support members, and do not limit their order. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like do not necessarily limit them to be different.

[0031] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0032] The matrix screen is composed of multiple independent small LED display modules. Each small module is an independent unit and can be controlled separately. By controlling the brightness or color of each unit, images or text are formed. The matrix screen can be monochrome or full color, static or dynamic.

[0033] However, as the resolution of current images and videos becomes higher and higher, the display accuracy requirements for matrix screens are also increasing, and there is an urgent need for a matrix screen with high display accuracy.

[0034] Please refer to Figures 1 to 7 . The embodiment of the present application provides a matrix screen 10, including an insulating substrate 11, a plurality of light-emitting units 12, a plurality of first encapsulation glues 13, a first light-shielding layer 14, a plurality of second encapsulation glues 15, and a second light-shielding layer 16. The light-emitting units 12 are arranged on the insulating substrate 11, and the plurality of light-emitting units 12 are arranged in a matrix to form an LED array. The light-emitting units 12 include pins 123, a light-emitting chip 122 arranged on the pins 123, and a driving chip 121 for driving the light-emitting chip 122 to emit light. Each first encapsulation glue 13 is encapsulated outside each light-emitting unit 12. The first light-shielding layer 14 is arranged on the insulating substrate 11, and the first light-shielding layer 14 includes a plurality of first through holes 141, and the first encapsulation glue 13 is located in the first through holes 141. Each second encapsulation glue 15 is encapsulated on each first encapsulation glue 13, wherein the area of ​​the second encapsulation glue 15 projected on the insulating substrate 11 is greater than the area of ​​the first encapsulation glue 13 projected on the insulating substrate 11. The second light shielding layer 16 is disposed on the first light shielding layer 14, and the second light shielding layer 16 includes a plurality of second through holes 161, and the second encapsulation glue 15 is located in the second through holes 161. When the plurality of light emitting units 12 emit light, the first light shielding layer 14 and the second light shielding layer 16 can block the light emitted by the light emitting unit 12 from being emitted from the side, and make the light emitted from the second through holes 161.

[0035] Specifically, the provided matrix screen 10 comprises an insulating substrate 11, a plurality of light-emitting units 12 (forming an LED array), a plurality of first encapsulation glues 13, a first light-shielding layer 14, a plurality of second encapsulation glues 15 and a second light-shielding layer 16. The light-emitting units 12 include pins 123, light-emitting chips 122 and driving chips 121 and are arranged in a matrix. Each light-emitting unit 12 is encapsulated by the first encapsulation glue 13, and the second encapsulation glue 15 is encapsulated on the first encapsulation glue 13, and the projection area of ​​the second encapsulation glue 15 relative to the insulating substrate 11 is larger. The first encapsulation glue 13 is then located in the first through hole 141 of the first light-shielding layer 14, and the second encapsulation glue 15 is located in the second through hole 161 of the second light-shielding layer 16. The first light-shielding layer 14 and the second light-shielding layer 16 are able to shield the side light of the light-emitting unit 12, and the light is mainly emitted from the second through hole 161. By controlling the light emission direction, the clarity and contrast of the display of the matrix screen 10 are improved. The scattering of light is reduced, and the light interference between screens is reduced. At the same time, the double-layer packaging and shading design improve the protection effect and service life of the LED. By controlling the direction of light, the loss of invalid light is reduced, and the energy utilization efficiency can be improved accordingly. In summary, the matrix screen 10 design provided in the embodiment of the present application achieves precise control of LED light emission through multi-layer packaging and shading structure, which is expected to improve display quality, reduce light pollution, and bring improvements in energy efficiency and lifespan.

[0036] In some embodiments, Figure 2 , Figure 3 and Figure 7 As shown, the shape of the first packaging glue 13 is adapted to the shape of the first through hole 141, and the shape of the second packaging glue 15 is adapted to the shape of the second through hole 161; wherein the shape of the first packaging glue 13 projected on the insulating substrate 11 is different from the shape of the second packaging glue 15 projected on the insulating substrate 11.

[0037] In the above embodiment, the first encapsulation glue 13 of the provided matrix screen 10 is adapted to the shape of the first through hole 141, and the second encapsulation glue 15 is adapted to the shape of the second through hole 161. By making the projection shapes of the first encapsulation glue 13 and the second encapsulation glue 15 on the substrate different. The design of the shading layer and the through hole effectively blocks the light from being emitted from the side, so that the light is mainly emitted from the second through hole 161, reduces the scattering of light, improves the directionality and uniformity of the light emission, and enhances the display effect. And through the design of double-layer packaging and different projection shapes, the emission path of the light is controlled, the display brightness and contrast are improved, and the interference or light pollution caused by the overflow of light is reduced. At the same time, the multi-layer structure of the first encapsulation glue 13 and the second encapsulation glue 15 provides better physical protection for the light-emitting unit 12, helps to extend the service life of the LED, and enhances the ability to resist environmental influences. This embodiment optimizes the luminous effect and service life of the LED matrix screen 10 through innovative packaging and shading design, and effectively improves the display quality.

[0038] For example, Figure 2 , Figure 3 and Figure 7 As shown, the shape of the projection of the first encapsulant 13 on the insulating substrate 11 is circular, and the shape of the projection of the second encapsulant 15 on the insulating substrate 11 is rectangular. The provided matrix screen 10 optimizes the diffusion and focusing effects of light by adopting a combination design of a circle and a rectangle for the first encapsulant 13 and the second encapsulant 15, respectively, and improves the uniformity and clarity of display. The design of the rectangle inside the circle provides better light guidance and protection effects.

[0039] It should be noted that, in some embodiments, the rectangle is located inside the circle, and the center of the rectangle coincides with the center of the circle. Thus, the symmetry of the light output of the matrix screen 10 is ensured by the center coincidence design.

[0040] In some embodiments, the type of the first packaging glue 13 is different from the type of the second packaging glue 15. The type of the first packaging glue 13 is any one of transparent glue and diffusion glue, and the type of the second packaging glue 15 is another type of transparent glue or diffusion glue different from the type of the first packaging glue 13.

[0041] The transparent glue has a high light transmittance, which can effectively transmit the light of the light emitting unit 12, and improve the brightness and color purity of the emitted light. The diffusion glue can effectively scatter the light, make the light more uniform, reduce bright spots or dark spots, and improve the uniformity of the display effect. Through the combined use of different packaging glues, the high light transmittance of the transparent glue and the uniform light distribution effect of the diffusion glue can be combined, so that the light emitting unit 12 can do its best under different levels of packaging, and optimize the overall display effect. The different selections of the first packaging glue 13 and the second packaging glue 15 can more accurately control the emission and scattering paths of light in the design, increase the flexibility of the design, and help to achieve the best display effect. The use of different types of packaging glue also helps to improve the heat dissipation performance of the light emitting unit 12. Some colloids have higher thermal conductivity and can effectively dissipate heat, thereby extending the life of the light emitting unit 12. At the same time, the combined use of different types of packaging glues provides more design options, so that engineers have greater flexibility in designing and adjusting optical performance. By reasonably selecting the types of transparent glue and diffusion glue, it is possible to reduce light interference to surrounding components while improving the light effect, and further optimize the overall performance of the optical system. The provided matrix screen 10 can be adapted to different usage scenarios and customer needs. In some cases, a higher brightness light output is required, while in other cases a more uniform light distribution is required. This measure can flexibly adjust product characteristics according to needs.

[0042] In summary, by using different types of encapsulation glue (transparent glue and diffusion glue) in the design of the matrix screen 10 to optimize the optical performance at different levels, not only the display effect and optical performance of the LED matrix screen 10 are enhanced, but also greater design flexibility and adaptability are provided. At the same time, the reliability and service life of the product can be effectively improved to meet the needs of different application scenarios.

[0043] In some embodiments, the thickness of the first through hole 141 is greater than or equal to the thickness of the first encapsulant 13. This ensures that the first encapsulant 13 is completely surrounded by the first through hole 141, which helps to better control the initial diffusion and direction of the light. It also provides sufficient space for the first encapsulant 13 to prevent the encapsulant from overflowing or being squeezed, thereby protecting the integrity of the light-emitting unit 12. By providing additional space for heat dissipation, it helps to improve the heat dissipation performance of the LED. A certain amount of tolerance is provided during the production process to facilitate the injection and molding of the encapsulant.

[0044] In some embodiments, the thickness of the second through hole 161 is greater than or equal to the thickness of the second encapsulant 15. This ensures that the second encapsulant 15 is completely located in the second through hole 161, and further accurately controls the exit path and angle of the light. It also prevents the second encapsulant 15 from protruding from the surface of the second light shielding layer 16, maintains the flatness of the screen surface, and improves the display quality. At the same time, the second through hole 161 completely covers the second encapsulant 15, maximizes the effect of the light shielding layer, and reduces light leakage. Sufficient space is provided for the second encapsulant 15 to enhance the stability and durability of the overall structure.

[0045] In some embodiments, the thickness of the first encapsulant 13 is greater than or equal to the thickness of the second encapsulant 15. Thus, the thicker first encapsulant 13 helps to initially diffuse and homogenize the light, while the thinner second encapsulant 15 can further finely control the light emission. The thicker first encapsulant 13 provides better physical protection and insulation for the light-emitting unit 12. The thicker first encapsulant 13 helps to better disperse and manage heat, and improve the life and performance of the LED. This thickness configuration provides more possibilities for optical design, and the light output characteristics can be optimized by adjusting the thickness ratio of the two layers of encapsulant. The thicker first encapsulant 13 is easier to manufacture and mold, while the thinner second encapsulant 15 is conducive to fine adjustment and surface treatment.

[0046] In summary, any combination of the above three embodiments according to the requirements not only optimizes the optical performance and structural stability of the matrix screen 10, but also improves the manufacturing feasibility and durability of the product. The present application achieves precise control of light output through a carefully designed thickness configuration, while providing sufficient protection and heat dissipation conditions for the matrix screen 10.

[0047] In some embodiments, the insulating substrate 11 and the first light shielding layer 14 are BT resin substrates. BT (Bismaleimide Triazine) resin is used as the material of the insulating substrate 11 and the first light shielding layer 14. Since BT resin has excellent heat resistance, it can maintain stable performance in a high temperature environment. At the same time, since it has a low dielectric constant, it is beneficial to reduce signal interference and improve circuit performance. It also has low hygroscopicity, which can reduce the impact of moisture on the circuit and improve the reliability of the product. It can also enhance the stability and durability of the overall structure and ensure effective isolation between circuit elements.

[0048] In some embodiments, the second light shielding layer 16 is a light shielding adhesive layer, which provides better adaptability and processing convenience, effectively controls light scattering in unexpected directions, and reduces light interference between devices.

[0049] For example, the color of the light-shielding adhesive layer is black. Figure 1As shown in Figure 1, black materials can effectively absorb light of various wavelengths and greatly reduce light leakage. The black background enhances the visual effect of LED light emission and improves display contrast.

[0050] It should be noted that, in some embodiments, the color of the insulating substrate 11 and the first light shielding layer 14 is white. The white surface can reflect the light emitted by the LED, thereby improving the light utilization rate. At the same time, the reflection effect increases the overall brightness output of the matrix screen 10, thereby improving the display effect. The white surface helps to reflect heat, improve heat distribution, and help to evenly diffuse light, thereby improving display uniformity. It can also increase light output through reflection, thereby improving overall energy efficiency.

[0051] The above embodiments create an efficient, high-contrast display system by combining them according to requirements. The BT resin substrate provides good electrical and mechanical properties, the black light-shielding adhesive layer ensures precise light control and high contrast, and the white insulating substrate 11 and the first light-shielding layer 14 optimize light utilization and thermal management. This design not only improves display quality and energy efficiency, but also enhances the overall performance and reliability of the device.

[0052] In some embodiments, Figure 3 and Figure 4 As shown, the insulating substrate 11 includes a first surface and a second surface relative to each other, and a plurality of rows of pin groups 123 are arranged on the first surface of the insulating substrate 11 at intervals, and each row of pin groups 123 includes a plurality of pin pairs 123; each pin pair 123 includes a power pin 1232, a ground pin 1231, a signal input pin 1233 and a signal output pin 1234, the light-emitting chip 122 and the driving chip 121 are electrically connected to the power pin 1232, and the driving chip 121 is electrically connected to the ground pin 1231, the signal input pin 1233 and the signal output pin 1234 respectively; wherein the power pins 1232 of the plurality of pin pairs 123 are integrally formed, and the ground pins 1231 of the plurality of pin pairs 123 are integrally formed.

[0053] like Figure 3 and 4As shown, the design of the provided pin 123 group optimizes space utilization and improves integration. The integrated power supply and ground pin 1231 simplifies the circuit layout, reduces resistance, improves power supply efficiency, improves power distribution, and helps maintain a stable voltage supply. At the same time, the integrated pin 123 increases the heat conduction area and helps to dissipate heat. By adopting independent signal input and output pins 123, it helps to reduce signal interference and improve signal integrity. The integrated molding of pins 123 simplifies the manufacturing and assembly process and improves production efficiency. And reduces the number of independent pins 123, reduces the risk of connection failure, and the simplified design reduces material and manufacturing costs. At the same time, the independent signal input and output pins 123 provide flexibility for different control schemes. It helps to reduce electromagnetic interference through a unified power supply and grounding design. This embodiment, by optimizing electrical connections and structural layout, improves the performance, reliability and production efficiency of the matrix screen 10, and also provides convenience for future expansion and maintenance.

[0054] It should be noted that Figure 3 The number of light-emitting chips 122 and driving chips 121 is only for illustration, and whether the pins 123 are fully covered is set according to time requirements, and the embodiment of the present application does not limit this.

[0055] For example, Figure 3 and Figure 5 As shown, the matrix screen 10 also includes a first conductive sheet 17 and a second conductive sheet 18 arranged on the second surface of the insulating substrate 11; the first conductive sheet 17 includes a first conductive strip along the extension direction of the power pin 1232 and a plurality of first electrode fingers arranged at intervals on the first conductive strip; the second conductive sheet 18 includes a second conductive strip along the extension direction of the ground pin 1231 and a plurality of second electrode fingers arranged at intervals on the second conductive strip; wherein the first conductive strip and the second conductive strip are arranged opposite to each other, the plurality of first electrode fingers and the plurality of second electrode fingers are arranged alternately, at least one first electrode finger is electrically connected to the power pin 1232, and at least one second electrode finger is electrically connected to the ground pin 1231.

[0056] The above-mentioned embodiments provide a larger contact area by providing a comb-shaped conductive sheet, thereby improving the distribution of power and ground. At the same time, the alternatingly arranged electrode fingers form an interlocking structure, which helps to reduce electromagnetic interference. The special conductive sheet design helps to optimize the impedance characteristics of the signal transmission line. The increased metal area helps to dissipate heat and improve the overall heat dissipation performance. It also reduces the distributed resistance of the power supply and grounding, and improves the electrical performance. The optimized power supply and grounding distribution helps to maintain signal integrity. In addition, the alternating arrangement design of the above-mentioned embodiments improves space utilization efficiency. The design of the electrode fingers provides flexibility for different connection requirements, and the multi-point connection increases the redundancy of the system and improves the overall reliability. The increased conductive area also improves the power handling capacity of the system, and the alternatingly arranged structure produces a distributed capacitance effect, which helps filtering.

[0057] In summary, this design optimizes the distribution structure of power and ground, improves electrical performance, heat dissipation and signal integrity, and also facilitates manufacturing and future expansion. This structure is specially developed and designed for the high-performance, high-integration matrix screen 10 application provided.

[0058] It should be noted that, in some embodiments, multiple first electrode fingers are electrically connected to the power pin 1232, and the multiple first electrode fingers electrically connected to the power pin 1232 are arranged at equal intervals; multiple second electrode fingers are electrically connected to the ground pin 1231, and the multiple second electrode fingers electrically connected to the ground pin 1231 are arranged at equal intervals.

[0059] By setting the first conductive sheet 17 and the second conductive sheet 18 on the second surface of the insulating substrate 11, combined with the design of alternately arranged electrode fingers, the power distribution, heat dissipation, signal integrity and other aspects of the entire system are significantly optimized. This layout not only improves the electrical performance, but also enhances the anti-electromagnetic interference and heat dissipation capabilities, while providing better support for manufacturing processes and equipment reliability. These technical features work together to make the overall performance of the matrix screen 10 more efficient, stable and reliable.

[0060] It should be noted that if Figure 3 As shown, the insulating substrate 11 includes a plurality of conductive through holes 111 , and the provided matrix screen 10 also includes a plurality of conductive pillars 10 a (such as copper pillars), which are arranged in the conductive through holes 111 to achieve electrical connection between the first electrode finger and the power pin 1232 .

[0061] For example, Figure 3 , 4As shown in Figure 5, the matrix screen 10 also includes: a signal input unit 10b arranged on one side of the second surface of the insulating substrate 11, the signal input unit 10b includes a plurality of signal input terminals 10b1 and a signal input interface 10b2 arranged on one side of the second surface, the signal input interface 10b2 is electrically connected to the plurality of signal input terminals 10b1; a patch board, the patch board 19 is arranged on the second surface of the insulating seat, the patch board 19 includes an input slot, and the signal input unit 10b is located in the input slot; wherein, the signal input pin 1233 located on one side of the insulating substrate 11 is electrically connected to the signal input terminal 10b1, in each pin 123 group, the signal input pin 1233 and the signal output pin 1234 of adjacent pin 123 pairs are integrally formed, the control signal is input to the signal input pin 1233 via the signal input unit 10b, and each driving chip 121 controls the corresponding light-emitting chip 122 to emit light according to the control signal.

[0062] The above embodiment centrally processes the signal input through the signal input unit 10b, simplifies the signal transmission path, and improves the stability and efficiency of signal transmission. The patch board design makes the signal input unit 10b stable and takes up less space, which helps to improve the integration of the system and reduce complex wiring. The design of the signal input pin 1233 and the output pin 123 is integrated, which reduces the connection nodes in the signal transmission, thereby reducing signal interference and helping to maintain signal integrity. The design of the patch board and the input slot makes the installation and fixation of the signal input unit 10b simpler, which is convenient for the assembly and maintenance of the equipment. At the same time, each driver chip 121 independently controls the light-emitting unit 12 according to the input control signal, provides precise control of the light-emitting state, and improves the display effect of the matrix screen 10. By reducing the connection of the individual pins 123, the integrated design reduces the risk of disconnection or poor contact and improves the reliability of the equipment. The integrated pin 123 design simplifies the manufacturing process, reduces the number of components required, and reduces production costs. In summary, the above signal input and transmission design not only simplifies the system structure, but also improves the efficiency, stability and reliability of signal transmission, and is suitable for the application scenario of the high-performance LED matrix screen 10.

[0063] The matrix screen provided in the embodiment of the present application has at least the following beneficial effects: a) Light control: The first light shielding layer and the second light shielding layer can shield the side light of the light emitting unit; the light mainly emerges from the second through hole, b) Improve display effect: Improve display clarity and contrast by controlling the direction of light emission.

[0064] c) Prevent light pollution: Reduce light scattering and reduce light interference between screens.

[0065] d) Structural optimization: Double-layer packaging and shading design improve the protection effect and service life of LEDs.

[0066] e) Improved energy efficiency: By controlling the direction of light, the loss of ineffective light is reduced and energy utilization efficiency is improved.

[0067] In summary, the matrix screen design provided achieves precise control of LED light emission through multi-layer packaging and shading structure, which is expected to improve display quality, reduce light pollution, and bring improvements in energy efficiency and lifespan.

[0068] Please refer to Figure 8 , Figure 8 is a schematic flow chart of the steps of the preparation method provided in the examples of the present application. The provided method is used to prepare Figure 1-7 The matrix screen corresponding to any embodiment. Figure 8 As shown, the provided method includes steps S201 to S207.

[0069] Step S201. Provide an insulating substrate, the insulating substrate comprising a plurality of light-emitting units, the plurality of light-emitting units are arranged in a matrix to form an LED array, the light-emitting units comprising pins, a light-emitting chip arranged on the pins, and a driving chip for driving the light-emitting chip to emit light.

[0070] Specifically, an insulating substrate with a plurality of light-emitting units is provided. The light-emitting units are arranged in a matrix to form an LED array. Each light-emitting unit includes a pin, a light-emitting chip and a driver chip. The provision of the initial substrate builds the foundation of the entire preparation process, and the standardization and consistency of the array are ensured by the pre-arranged light-emitting units.

[0071] Step S202: Perform a first molding on the insulating substrate to form a plurality of first packaging glues on the outer sides of the plurality of light-emitting units disposed on the insulating substrate.

[0072] Specifically, by performing the first molding on the insulating substrate, a plurality of first packaging glues are formed on the outer sides of the plurality of light-emitting units. Through the first molding process, each light-emitting unit is encapsulated to protect it from environmental pollution and mechanical damage, thereby improving the durability and reliability of the light-emitting unit.

[0073] Step S203: Perform a second molding according to the shape and position of the first packaging glue to obtain a first light shielding layer, wherein the first light shielding layer includes a plurality of first through holes.

[0074] Specifically, a second molding is performed according to the position and shape of the first packaging glue to form a first light shielding layer including a plurality of first through holes. The precise molding process ensures that the position and size of the through holes of the first light shielding layer match the first packaging glue, which not only improves the light shielding effect, but also reduces the side light leakage.

[0075] Step S204: Dispose a first light shielding layer on the insulating substrate, and the first packaging glue is located in the first through hole.

[0076] Specifically, by arranging the first light shielding layer on the insulating substrate, the first packaging glue is ensured to be located in the first through hole. By arranging the first light shielding layer, the non-forward emitted light is effectively shielded, thereby improving the light extraction efficiency and display effect of the LED array.

[0077] Step S205: Perform a third molding process on the first light shielding layer to form a target adhesive layer on the first light shielding layer.

[0078] Specifically, a target glue layer is formed by performing a third molding on the first light shielding layer, and the third molding further encapsulates and protects the lower layer components while forming a new encapsulation layer to prepare for the next cutting step.

[0079] Step S206. Cut the target glue layer to obtain multiple second packaging glues and glue flow paths; wherein the multiple second packaging glues are respectively arranged on the multiple first packaging glues, and the area of ​​the second packaging glue projected on the insulating substrate is larger than the area of ​​the first packaging glue projected on the insulating substrate.

[0080] Specifically, by cutting the target glue layer, a plurality of second packaging glues and glue flow paths are obtained. The second packaging glues are respectively arranged on the first packaging glue, and their projected area on the insulating substrate is larger than that of the first packaging glue. Through precise cutting, the area and position of each second packaging glue are ensured, the protection performance and the control of the emission direction of light are enhanced, and preparation is made for further setting of the light shielding layer.

[0081] Step S207: a second light shielding layer is provided on the outer side of the second packaging glue through a glue flow channel, wherein the second light shielding layer comprises a plurality of second through holes, and the second packaging glue is located in the second through holes.

[0082] Specifically, a second shading layer is arranged on the outside of the second encapsulation glue through a glue flow channel, the second shading layer includes a plurality of second through holes, and the second encapsulation glue is located in the second through holes. By setting the second shading layer, the light emitted from the side is further shielded, ensuring that the light is emitted only from the second through hole, improving the directionality and uniformity of the light output, and enhancing the anti-interference ability of the device. The provided method encapsulates and protects the light-emitting unit layer by layer through multiple molding and the setting of the shading layer, thereby effectively improving the structural integrity, optical performance and durability of the LED array. By precisely controlling the position and size of the encapsulation glue and the shading layer, the effective emission direction of the light is ensured, the display effect is optimized, and good environmental adaptability and anti-interference ability are provided. The entire process is highly integrated and automated, which helps to improve production efficiency and yield rate and reduce manufacturing costs.

[0083] In some embodiments, the shape of the first packaging glue matches the shape of the first through hole, and the shape of the second packaging glue matches the shape of the second through hole; wherein the shape of the first packaging glue projected on the insulating substrate is different from the shape of the second packaging glue projected on the insulating substrate.

[0084] In the above embodiment, the first encapsulation glue of the provided matrix screen is adapted to the shape of the first through hole, and the second encapsulation glue is adapted to the shape of the second through hole. By making the projection shapes of the first encapsulation glue and the second encapsulation glue on the substrate different. The design of the shading layer and the through hole effectively blocks the light from being emitted from the side, so that the light is mainly emitted from the second through hole, reducing the scattering of light, improving the directionality and uniformity of the light emission, and improving the display effect. And through the design of double-layer packaging and different projection shapes, the emission path of the light is controlled, the display brightness and contrast are improved, and the interference or light pollution caused by the overflow of light is reduced. At the same time, the multi-layer structure of the first encapsulation glue and the second encapsulation glue provides better physical protection for the light-emitting unit, helps to extend the service life of the LED, and enhances the ability to resist environmental influences. This embodiment optimizes the luminous effect and service life of the LED matrix screen through innovative packaging and shading design, and effectively improves the display quality.

[0085] Exemplarily, the shape of the projection of the first encapsulant on the insulating substrate is circular, and the shape of the projection of the second encapsulant on the insulating substrate is rectangular. The provided matrix screen optimizes the diffusion and focusing effects of light by adopting a combination design of a circle and a rectangle for the first encapsulant and the second encapsulant, respectively, and improves the uniformity and clarity of the display. The design of the rectangle inside the circle provides better light guidance and protection effects.

[0086] It should be noted that, in some embodiments, the rectangle is located inside the circle, and the center of the rectangle coincides with the center of the circle, thereby ensuring the symmetry of the light output of the matrix screen through the center coincidence design.

[0087] In some embodiments, the type of the first packaging glue is different from the type of the second packaging glue. The type of the first packaging glue is any one of transparent glue and diffusion glue, and the type of the second packaging glue is another one of transparent glue and diffusion glue that is different from the type of the first packaging glue. Transparent glue has a high light transmittance and can effectively transmit the light of the light-emitting unit, thereby improving the brightness and color purity of the emitted light. Diffusion glue can effectively scatter light, make the light more uniform, reduce bright spots or dark spots, and improve the uniformity of the display effect. By combining different packaging glues, the high light transmittance of transparent glue and the uniform light distribution effect of diffusion glue can be combined, so that the light-emitting units can do their best under different levels of packaging and optimize the overall display effect. The different selections of the first packaging glue and the second packaging glue can more accurately control the emission and scattering paths of light in the design, increase the flexibility of the design, and help achieve the best display effect. The use of different types of packaging glue also helps to improve the heat dissipation performance of the light-emitting unit. Some colloids have higher thermal conductivity and can effectively dissipate heat, thereby extending the life of the light-emitting unit. At the same time, the combined use of different types of packaging glue provides more design options, giving engineers greater flexibility in designing and adjusting optical performance. By reasonably selecting the types of transparent glue and diffusion glue, the light interference to surrounding components can be reduced while improving the light effect, further optimizing the overall performance of the optical system. This enables the provided matrix screen to adapt to different usage scenarios and customer needs. In some cases, a brighter light output is required, while in other cases a more even light distribution is required. This measure allows the product characteristics to be flexibly adjusted according to requirements.

[0088] In summary, by using different types of encapsulation glue (transparent glue and diffusion glue) in the design of the matrix screen to optimize the optical performance at different levels, not only the display effect and optical performance of the LED matrix screen are enhanced, but also greater design flexibility and adaptability are provided. At the same time, it can effectively improve the reliability and service life of the product and meet the needs of different application scenarios.

[0089] In some embodiments, the thickness of the first through hole is greater than or equal to the thickness of the first encapsulant. This ensures that the first encapsulant is completely surrounded by the first through hole, which helps to better control the initial diffusion and direction of the light. It also provides sufficient space for the first encapsulant to prevent the encapsulant from overflowing or being squeezed, thereby protecting the integrity of the light-emitting unit. By providing additional space for heat dissipation, it helps to improve the heat dissipation performance of the LED. A certain amount of tolerance is provided during the production process to facilitate the injection and molding of the encapsulant.

[0090] In some embodiments, the thickness of the second through hole is greater than or equal to the thickness of the second encapsulant. This ensures that the second encapsulant is completely located in the second through hole, further accurately controlling the exit path and angle of the light. It also prevents the second encapsulant from protruding from the surface of the second light shielding layer, maintains the flatness of the screen surface, and improves the display quality. At the same time, the second through hole completely covers the second encapsulant, maximizes the effect of the light shielding layer, and reduces light leakage. Sufficient space is provided for the second encapsulant to enhance the stability and durability of the overall structure.

[0091] In some embodiments, the thickness of the first encapsulant is greater than or equal to the thickness of the second encapsulant. Thus, the thicker first encapsulant helps to initially diffuse and homogenize the light, while the thinner second encapsulant can further finely control the light emission. The thicker first encapsulant provides better physical protection and insulation for the light-emitting unit. The thicker first encapsulant helps to better disperse and manage heat, and improve the life and performance of the LED. This thickness configuration provides more possibilities for optical design, and the light output characteristics can be optimized by adjusting the thickness ratio of the two layers of encapsulant. The thicker first encapsulant is easier to manufacture and mold, while the thinner second encapsulant is conducive to fine adjustment and surface treatment.

[0092] In summary, any combination of the above three embodiments according to requirements not only optimizes the optical performance and structural stability of the matrix screen, but also improves the manufacturing feasibility and durability of the product. The present application achieves precise control of light output through a carefully designed thickness configuration, while providing sufficient protection and heat dissipation conditions for the matrix screen.

[0093] In some embodiments, the insulating substrate and the first light shielding layer are BT resin substrates. By using BT (Bismaleimide Triazine) resin as the material of the insulating substrate and the first light shielding layer. Since BT resin has excellent heat resistance, it can maintain stable performance in a high temperature environment. At the same time, since it has a low dielectric constant, it is beneficial to reduce signal interference and improve circuit performance. And it also has low hygroscopicity, which can reduce the impact of moisture on the circuit and improve the reliability of the product. It can also enhance the stability and durability of the overall structure and ensure effective isolation between circuit elements.

[0094] In some embodiments, the second light shielding layer is a light shielding adhesive layer. The adhesive layer provides better adaptability and processing convenience, effectively controls light scattering in unexpected directions, and reduces light interference between devices.

[0095] For example, the color of the light-shielding adhesive layer is black. Figure 1 As shown in Figure 1, black materials can effectively absorb light of various wavelengths and greatly reduce light leakage. The black background enhances the visual effect of LED light emission and improves display contrast.

[0096] It should be noted that in some embodiments, the color of the insulating substrate and the first light shielding layer is white. The white surface can reflect the light emitted by the LED, thereby improving the light utilization rate. At the same time, the reflection effect increases the overall brightness output of the matrix screen, thereby improving the display effect. The white surface helps to reflect heat, improve heat distribution, and help to evenly diffuse light, thereby improving display uniformity. It can also increase light output through reflection, thereby improving overall energy efficiency.

[0097] The above embodiments create an efficient, high-contrast display system by combining them according to requirements. The BT resin substrate provides good electrical and mechanical properties, the black light-shielding adhesive layer ensures precise light control and high contrast, while the white insulating substrate and the first light-shielding layer optimize light utilization and thermal management. This design not only improves display quality and energy efficiency, but also enhances the overall performance and reliability of the device.

[0098] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0099] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0100] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A matrix screen, characterized in that: include: Insulating substrate; A plurality of light-emitting units, wherein the light-emitting units are arranged on the insulating substrate, the plurality of light-emitting units are arranged in a matrix to form an LED array, and the light-emitting units include pins, a light-emitting chip arranged on the pins, and a driving chip for driving the light-emitting chip to emit light; A plurality of first packaging glues, each of which is packaged outside each of the light-emitting units; A first light shielding layer, wherein the first light shielding layer is disposed on the insulating substrate, the first light shielding layer comprises a plurality of first through holes, and the first packaging glue is located in the first through holes; A plurality of second packaging glues, each of the second packaging glues is packaged on each of the first packaging glues, wherein the area of ​​the second packaging glue projected on the insulating substrate is larger than the area of ​​the first packaging glue projected on the insulating substrate; A second light shielding layer, wherein the second light shielding layer is disposed on the first light shielding layer, the second light shielding layer comprises a plurality of second through holes, and the second packaging glue is located in the second through holes; When the plurality of light-emitting units emit light, the first light-shielding layer and the second light-shielding layer can block the light emitted by the light-emitting units from being emitted from the side, and allow the light to be emitted from the second through hole.

2. The matrix screen according to claim 1, characterized in that: The shape of the first packaging glue is adapted to the shape of the first through hole, and the shape of the second packaging glue is adapted to the shape of the second through hole; wherein the shape of the first packaging glue projected on the insulating substrate is different from the shape of the second packaging glue projected on the insulating substrate.

3. The matrix screen according to claim 2, characterized in that: The shape of the projection of the first packaging glue on the insulating substrate is circular, and the shape of the projection of the second packaging glue on the insulating substrate is rectangular.

4. The matrix screen according to claim 3, characterized in that: The rectangle is located inside the circle, and the center of the rectangle coincides with the center of the circle.

5. The matrix screen according to claim 1, characterized in that: The type of the first packaging glue is different from the type of the second packaging glue. The type of the first packaging glue is any one of transparent glue and diffusion glue, and the type of the second packaging glue is another one of transparent glue and diffusion glue that is different from the type of the first packaging glue.

6. The matrix screen according to claim 1, characterized in that: The thickness of the first through hole is greater than or equal to the thickness of the first packaging glue; and / or, The thickness of the second through hole is greater than or equal to the thickness of the second packaging glue; and / or, The thickness of the first packaging glue is greater than or equal to the thickness of the second packaging glue.

7. The matrix screen according to claim 1, characterized in that: The insulating substrate and the first light-shielding layer are BT resin substrates; and / or the second light-shielding layer is a light-shielding adhesive layer.

8. The matrix screen according to claim 7, characterized in that: The color of the light-shielding adhesive layer is black.

9. The matrix screen according to claim 8, characterized in that: The insulating substrate and the first light shielding layer are white in color.

10. The matrix screen according to claim 1, characterized in that: The insulating substrate comprises a first surface and a second surface opposite to each other, a plurality of rows of pin groups are arranged at intervals on the first surface of the insulating substrate, and each row of the pin groups comprises a plurality of pin pairs; Each of the pin pairs includes a power pin, a ground pin, a signal input pin and a signal output pin. The light-emitting chip and the driver chip are electrically connected to the power pin, and the driver chip is electrically connected to the ground pin, the signal input pin and the signal output pin respectively; wherein the power pins of multiple pin pairs are integrally formed, and the ground pins of multiple pin pairs are integrally formed.

11. The matrix screen according to claim 10, characterized in that: The matrix screen also includes: A first conductive sheet and a second conductive sheet disposed on the second surface of the insulating substrate; The first conductive sheet comprises a first conductive strip along the extension direction of the power pin and a plurality of first electrode fingers arranged on the first conductive strip at intervals; The second conductive sheet comprises a second conductive strip along the extending direction of the ground pin and a plurality of second electrode fingers arranged at intervals on the second conductive strip; The first conductive strip and the second conductive strip are arranged opposite to each other, a plurality of the first electrode fingers and a plurality of the second electrode fingers are arranged alternately, at least one of the first electrode fingers is electrically connected to the power pin, and at least one of the second electrode fingers is electrically connected to the ground pin.

12. The matrix screen according to claim 11, characterized in that: A plurality of the first electrode fingers are electrically connected to the power pin, and the plurality of the first electrode fingers electrically connected to the power pin are arranged at equal intervals; A plurality of the second electrode fingers are electrically connected to the ground pin, and the plurality of the second electrode fingers electrically connected to the ground pin are arranged at equal intervals.

13. The matrix screen according to claim 10, characterized in that: The matrix screen also includes: A signal input unit disposed on one side of the second surface of the insulating substrate, the signal input unit comprising a plurality of signal input terminals and a signal input interface disposed on one side of the second surface, the signal input interface being electrically connected to the plurality of signal input terminals; A patch board, the patch board is arranged on the second surface of the insulating seat, the patch board comprises an input slot, and the signal input unit is located in the input slot; Among them, the signal input pin located on one side of the insulating substrate is electrically connected to the signal input terminal. In each of the pin groups, the signal input pin and the signal output pin of the adjacent pin pair are integrally formed, and the control signal is input to the signal input pin through the signal input unit. Each of the driving chips controls the corresponding light-emitting chip to emit light according to the control signal.

14. A method for preparing a matrix screen, characterized in that: include: Providing an insulating substrate, the insulating substrate comprising a plurality of light-emitting units, the plurality of light-emitting units being arranged in a matrix to form an LED array, the light-emitting units comprising pins, a light-emitting chip disposed on the pins, and a driving chip for driving the light-emitting chip to emit light; Performing a first molding on the insulating substrate to form a plurality of first packaging glues on the outer sides of a plurality of light-emitting units disposed on the insulating substrate; Performing a second molding according to the shape and position of the first packaging glue to obtain a first light shielding layer, wherein the first light shielding layer includes a plurality of first through holes; The first light shielding layer is disposed on the insulating substrate, and the first packaging glue is located in the first through hole; Performing a third molding process on the first light-shielding layer to form a target adhesive layer on the first light-shielding layer; The target glue layer is cut to obtain a plurality of second packaging glues and glue flow paths; wherein the plurality of second packaging glues are respectively arranged on the plurality of first packaging glues, and the area of ​​the second packaging glue projected on the insulating substrate is larger than the area of ​​the first packaging glue projected on the insulating substrate; A second light shielding layer is arranged on the outer side of the second packaging glue through the glue flow channel, the second light shielding layer includes a plurality of second through holes, and the second packaging glue is located in the second through holes.

15. The method according to claim 14, characterized in that The shape of the first packaging glue is adapted to the shape of the first through hole, and the shape of the second packaging glue is adapted to the shape of the second through hole; wherein the shape of the first packaging glue projected on the insulating substrate is different from the shape of the second packaging glue projected on the insulating substrate.

16. The method according to claim 15, characterized in that The shape of the projection of the first packaging glue on the insulating substrate is circular, and the shape of the projection of the second packaging glue on the insulating substrate is rectangular.

17. The method according to claim 16, characterized in that The rectangle is located inside the circle, and the center of the rectangle coincides with the center of the circle.

18. The method according to claim 14, characterized in that The type of the first packaging glue is different from the type of the second packaging glue. The type of the first packaging glue is any one of transparent glue and diffusion glue, and the type of the second packaging glue is another one of transparent glue and diffusion glue that is different from the type of the first packaging glue.

19. The method according to claim 14, characterized in that The thickness of the first through hole is greater than or equal to the thickness of the first packaging glue; and / or, The thickness of the second through hole is greater than or equal to the thickness of the second packaging glue; and / or, The thickness of the first packaging glue is greater than or equal to the thickness of the second packaging glue.

20. The method according to claim 14, characterized in that The insulating substrate and the first light-shielding layer are BT resin substrates; and / or the second light-shielding layer is a light-shielding adhesive layer.

21. The method according to claim 20, characterized in that The color of the light-shielding adhesive layer is black.

22. The method according to claim 21, characterized in that The insulating substrate and the first light shielding layer are white in color.

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