A kind of this pressure bonding equipment

Abstract

An embodiment of the present invention provides a hot pressing and bonding device, which relates to the technical field of thermal pressing and bonding of silicon-based micro-display products. The device includes a bracket, on which there are a bonding device for bonding a substrate and a PCB, a first alignment device for aligning the substrate and the PCB, a second alignment device, and a double-roll material device for buffering during bonding. The first alignment device is located in front of the bonding device, the second alignment device is located behind the bonding device, and the double-roll material device is located below the bonding device. By setting the double-roll material device, one or two layers of buffer materials can be selected according to the process requirements of the product. The bonding device includes a horizontal adjustment mechanism, which can conveniently adjust the flatness of the pressure head. It also includes a force measuring mechanism, which can perform a pressure test first and select the optimal pressure and temperature for bonding after a period of time or when different specifications of products are replaced. The first alignment device and the second alignment device are arranged front and back to perform high-precision alignment of the substrate and the PCB board, resulting in high final bonding accuracy.

Description

Technical Field

[0001] This application relates to the technical field of FOB bonding, and particularly to a press bonding device. Background Art

[0002] In the field of display panel manufacturing, an FOB bonder is a device that uses technologies such as machine vision alignment and precision motion control to bond a printed circuit board (PCB) and a flexible printed circuit (FPC) together through an anisotropic conductive film (ACF) under certain thermal pressing conditions to achieve fine-pitch bonding between the PCB and the FPC. Before bonding the PCB and the FPC, the FPC is connected to a glass substrate as a whole. During bonding, the glass substrate and a part of the PCB are adsorbed and fixed, and the exposed part of the PCB is made to correspond vertically to the PPC. The press head and the pressing table cooperate to complete the bonding.

[0003] However, for different specifications of glass substrates, FPCs, and PCBs, the temperatures and pressures required during bonding are different. Often, due to insufficient pressure, the bonding effect is poor, or due to excessive temperature, the product is scalded, resulting in batch defects. Therefore, generally during FOB press bonding, a layer of special material buffer such as Teflon is laid flat under the press head before the press head descends. Depending on different process requirements, one or two layers of buffer materials can be selected for buffering before the press head descends for bonding. Summary of the Invention

[0004] The present invention provides a press bonding device to solve the problems in the prior art that during the press bonding process of different specifications of display panels, the press head temperature is too high, causing scalding, or the pressure is insufficient, resulting in product defects. Therefore, one or two layers of buffer materials are selectively used for buffering before the press head descends for bonding. At the same time, the problems of uneven flatness of the press head plane and inappropriate pressure are solved.

[0005] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0006] A press bonding device includes a bracket. The bracket is provided with a bonding device for bonding a substrate and a PCB, a first alignment device for aligning the substrate and the PCB, a second alignment device, and a double-roll material device for buffering during bonding. The first alignment device is located in front of the bonding device, the second alignment device is located behind the bonding device, and the double-roll material device is located below the bonding device.

[0007] The double roll material device includes a left side plate, a right side plate, a first roll material unit and a second roll material unit that are independent of each other. The first roll material unit includes a first feeding mechanism for providing a first buffer material, a first driving mechanism for driving the first feeding mechanism, and a first recycling mechanism for recycling the first buffer material. The second roll material unit includes a second feeding mechanism for providing a second buffer material, a second driving mechanism for driving the second feeding mechanism, and a second recycling mechanism for recycling the second buffer material. The first buffer material or the second buffer material passes through the bonding device, or the first buffer material and the second buffer material pass through the bonding device in parallel at the same time.

[0008] As a further implementation manner described above, the first feeding mechanism includes a first roll tape shaft for installing the first buffer material and a first reel. The second feeding mechanism includes a second roll tape shaft for installing the second buffer material and a second reel. The first feeding mechanism and the second feeding mechanism are arranged between the left side plate and the right side plate.

[0009] As a further implementation manner described above, the first recycling mechanism includes a plurality of roll tape rods and a first recycling rod. The first recycling rod is provided with a first card slot. After the first buffer material bypasses the plurality of roll tape rods, the head end is clamped into the first card slot. The second recycling mechanism includes a plurality of roll tape rods and a second recycling rod. The second recycling rod is provided with a second card slot. After the second buffer material bypasses the plurality of roll tape rods, the head end is clamped into the second card slot.

[0010] As a further implementation manner described above, the first driving mechanism includes a first driving member, a first gear, a second gear and a second connecting plate. The first gear is fixedly arranged on the main shaft of the first driving member. The first driving member is fixed to the second connecting plate. The second connecting plate is arranged in parallel outside the left side plate. The second gear is connected to the left side of the first recycling rod. The first gear meshes with the second gear.

[0011] The second driving mechanism includes a second driving member, a third gear, a fourth gear and a third connecting plate. The second driving member is connected to the third gear. The second driving member is fixed to the third connecting plate. The third connecting plate is arranged in parallel outside the right side plate. The third gear is fixedly arranged on the main shaft of the second driving member. The fourth gear is connected to the left side of the second recycling rod. The third gear meshes with the fourth gear.

[0012] As a further implementation manner described above, a third bearing is sleeved at the fixing position of the right side of the second recovery rod and the right side plate, a third bearing seat is sleeved on the third bearing, the third bearing seat is clamped on the right side plate, a fourth bearing is sleeved at the fixing position of the left side of the second recovery rod and the left side plate, a fourth bearing seat is sleeved on the fourth bearing, and the fourth bearing seat is clamped on the left side plate.

[0013] As a further implementation manner described above, the first recovery mechanism includes a first detection component for detecting the used length of the first buffer material; the second recovery mechanism includes a second detection component for detecting the used length of the second buffer material.

[0014] As a further implementation manner described above, the bonding device includes a heating mechanism, a horizontal adjustment mechanism, a force measuring mechanism, a third driving mechanism, and a fourth driving mechanism. The heating mechanism includes a pressure head for bonding and a heating block fixed above the pressure head. Heat insulation plates are provided above and behind the heating block. A plurality of embedding holes are formed in the middle of the heating block, and a plurality of first adjustment holes are formed in the upper part of the heating block. A plurality of heating elements are embedded in the embedding holes; the horizontal adjustment mechanism includes a horizontal adjustment plate and a horizontal adjustment member. A plurality of second adjustment holes are formed in the horizontal adjustment plate. The first adjustment holes and the second adjustment holes correspond to each other in the vertical direction. The horizontal adjustment member passes through the second adjustment holes and is installed on the horizontal adjustment plate. The bottom of the second adjustment holes is embedded in the embedding holes and is connected to the heating block.

[0015] As a further implementation manner described above, the third driving mechanism includes a third driving member, a first guide rail, and a first mounting plate. The third driving member is arranged above the bracket, the first mounting plate is arranged on the front surface of the bracket, and the first guide rail is arranged on the first mounting plate; the fourth driving mechanism includes a fourth driving member, a second guide rail, a second mounting plate, a third mounting plate, a fourth mounting plate, and a fifth mounting plate. The second mounting plate is fixed on the first guide rail, the second guide rail is fixed on the second mounting plate, the third mounting plate is arranged in parallel above the heating block, the fourth mounting plate is arranged between the third mounting plate and the heating block and fixedly connects the third mounting plate and the heating block. The fourth driving member is fixed on the third mounting plate, the fifth mounting plate is fixed on the second guide rail, and the third mounting plate, the fourth mounting plate, and the heating block are fixed on the fifth mounting plate. The third driving member and the first guide rail drive the pressure head to perform a first vertical movement in the vertical direction, and the fourth driving member and the second guide rail drive the pressure head to perform a second vertical movement in the vertical direction.

[0016] As a further implementation manner described above, the force measuring mechanism includes a pressure seat, a pressure gauge, a third connecting rod, a sixth mounting plate, and a pressing member. The pressure seat is fixed on the first mounting plate and located above the fourth driving member. The pressure gauge is fixed on the pressure seat. The sixth mounting plate is provided above the pressure seat. The pressing member is fixed in the middle of the sixth mounting plate. The sixth mounting plate is arranged parallel to the fourth mounting plate in the vertical direction. The sixth mounting plate and the fourth mounting plate are fixedly connected by the third connecting rod. When measuring the pressure, the pressing member directly contacts the pressure gauge.

[0017] As a further implementation manner described above, the first alignment device includes a fifth driving mechanism and a first image processing mechanism. The fifth driving mechanism includes a fifth driving member and a third guide rail. The first image processing mechanism includes a first camera, a first light source, and a controller. The first camera is connected to the first light source. The first camera is fixedly connected to the third guide rail. The fifth driving member is connected to the third guide rail. The first camera captures the marking points of the substrate. The first light source provides light. The controller receives the image information. The second alignment device includes a second image processing mechanism and a sixth driving mechanism. The sixth driving mechanism includes a sixth driving member and a fourth guide rail. The second image processing mechanism includes a second light source and a second camera. The second light source is fixedly connected to the second camera. The fourth guide rail is connected to the sixth driving member. The second camera is connected to the fourth guide rail. The second light source provides light. The second camera captures the marking points of the PCB. The controller compensates for the relative positions of the PCB and the substrate and completes the calibration.

[0018] As a further implementation manner described above, a plurality of fifth guide rails are further provided at the bottom of the bracket. A seventh driving member is provided on the fourth connecting plate. A plurality of fifth connecting plates and sixth connecting plates are fixed on the fifth guide rails. The fifth connecting plates are connected to the second connecting plates. The sixth connecting plates are connected to the third connecting plates. A plurality of buffer members are further provided below the fifth guide rails. When the seventh driving member drives the fifth guide rails to move in the vertical direction, the bottoms of the fifth connecting plates and the sixth connecting plates directly contact the buffer members to perform a buffering action.

[0019] As a further implementation manner described above, the first feeding mechanism includes a blowing rod. A plurality of blowing holes are provided on the blowing rod. The blowing holes blow towards the bonding area between the substrate and the PCB.

[0020] As a further implementation manner described above, the first recovery mechanism includes a first limiting component, a second limiting component, and a third limiting component. The first limiting component and the second limiting component simultaneously limit the vertical movement of both ends of the first recovery rod; the third limiting component limits the front-back movement of the first recovery rod; the second recovery mechanism includes a fourth limiting component, a fifth limiting component, and a sixth limiting component. The fourth limiting component and the fifth limiting component limit the vertical movement of both ends of the second recovery rod; the sixth limiting component limits the front-back movement of the second recovery rod.

[0021] As a further implementation manner described above, a first damper is sleeved in the middle of the first tape winding shaft, and a first damper cover is provided on the first tape winding shaft. The first winding drum includes a plurality of first mounting holes and second mounting holes. The first damper and the first damper cover are connected through the first mounting holes. A plurality of first flat areas are provided on the outer surface of the first winding drum, and a first elastic member is provided on the first flat area. The first elastic member is fixed to the outer surface of the first winding drum through the second mounting hole.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] A main pressing and bonding device provided by the present invention can select to use one or two layers of buffer materials according to the process requirements of products by setting a double roll material device; the bonding device includes a horizontal adjustment mechanism, which can conveniently adjust the flatness of the pressing head, and also includes a force measuring mechanism, which can perform a pressure test first and select the optimal pressure and temperature bonding scheme when a period of time has passed or different specifications of products are replaced; a first alignment device and a second alignment device are provided at the front and back for high-precision alignment of the substrate and the PCB board, so that the final bonding accuracy is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions proposed by the present invention, the following will be described in detail with reference to the embodiments and the drawings. It should be understood that the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can make changes to these drawings under the concept of the present invention.

[0025] Figure 1 It is an assembled three-dimensional view of the main pressing and bonding device provided by the present invention;

[0026] Figure 2 It is another perspective partial assembled three-dimensional view of the main pressing and bonding device provided by the present invention;

[0027] Figure 3 It is a partial assembled three-dimensional view of the double roll material device provided by the present invention;

[0028] Figure 4Partial enlarged assembly perspective view of the dual coil device provided by the present invention;

[0029] Figure 5 Another perspective partial assembly perspective view of the dual coil device provided by the present invention;

[0030] Figure 6 Partial assembly perspective view of the dual coil device provided by the present invention;

[0031] Figure 7 Assembly perspective view of the first coil shaft provided by the present invention;

[0032] Figure 8 Assembly perspective view of the first reel provided by the present invention;

[0033] Figure 9 Assembly perspective view of the bracket provided by the present invention;

[0034] Figure 10 Assembly perspective view of the first alignment device provided by the present invention;

[0035] Figure 11 Assembly perspective view of the second alignment device provided by the present invention;

[0036] Figure 12 Assembly perspective view of the bonding device provided by the present invention.

[0037] 1. Bracket; 101. Fifth guide rail; 102. Seventh driving member; 103. Fifth connecting plate; 104. Sixth connecting plate; 105. Buffer member; 106. Left side plate; 1061. First connecting rod; 1062. Second connecting rod; 1063. First connecting plate; 107. Right side plate; 2. Double coil device; 201. First coil shaft; 2011. First mounting hole; 2012. Second mounting hole; 2013. First elastic member; 2014. First flat area; 2015. First buffer material; 202. First retaining ring; 203. First reel; 204. Second retaining ring; 205. First damping cover; 206. Third retaining ring; 207. First coil rod; 2071. Fourth retaining ring; 208. Second coil rod; 209. Blowing rod; 211. Third coil rod; 212. Fourth coil rod; 213. Fifth coil rod; 214. First recovery rod; 2141. First long groove; 2151. First stop block; 2152. First moving block; 2161. Second stop block; 2162. Second moving block; 2171. First limiting member; 2172. First damping guide rod; 2173. First damping seat; 2174. First elastic limiting member; 2181. First code disk; 2182. First detecting member; 221. First driving member; 222. First gear; 223. Second gear; 224. Second connecting plate; 225. Third connecting plate; 231. Second coil shaft; 2311. Second buffer material; 232. Second reel; 233. Sixth coil rod; 234. Seventh coil rod; 235. Eighth coil rod; 241. Ninth coil rod; 242. Tenth coil rod; 243. Second recovery rod; 2431. Second long groove; 2461. Second limiting member; 2462. Second damping guide rod; 2463. Second elastic limiting member; 2471. Second detecting member; 2472. Second code disk; 251. Second driving member; 252. Fourth gear; 253. Fourth connecting plate; 3. Bonding device; 301. Third driving member; 302. First guide rail; 303. First mounting plate; 311. Fourth driving member; 312. Second guide rail; 313. Second mounting plate; 314. Third mounting plate; 315. Fourth mounting plate; 316. Fifth mounting plate; 321. Heating block; 322. Heat insulation plate; 323. Heating member; 331. Horizontal adjusting plate; 332. Horizontal adjusting member; 341. Pressure seat; 342. Pressure gauge; 343. Third connecting rod; 344. Pressing member; 345. Sixth mounting plate; 4. First alignment device; 401. First light source; 402. First camera; 411. Fifth driving member; 412. Third guide rail; 5. Second alignment device; 501. Second light source; 502. Second camera; 511. Sixth driving member; 512. Fourth guide rail. Detailed implementation manner

[0038] A pressure bonding device provided by the present invention includes: a bracket 1, on which a bonding device 3 is provided for bonding a substrate to a PCB; a first alignment device 4 for alignment by photographing the fiducial points of the substrate; a second alignment device 5 for alignment by photographing the fiducial points of the PCB; a double roll material device 2 for buffering with one or two layers of buffer materials before the bonding device 3 performs bonding. The first alignment device 4 is arranged in front of the bonding device 3, the second alignment device 5 is arranged behind the bonding device 3, and the double roll material device 2 is arranged below the bonding device 3.

[0039] Please refer to Figures 1 - 2 simultaneously. In this embodiment, the double roll material device 2 includes a first roll material unit and a second roll material unit. The first roll material unit includes a first buffer material 2015, a first feeding mechanism for providing the first buffer material 2015, a first driving mechanism for driving the first feeding mechanism, and a first recycling mechanism for recycling the first buffer material 2015. The second roll material unit includes a second buffer material 2311, a second feeding mechanism for providing the second buffer material 2311, a second driving mechanism for driving the second feeding mechanism, and a second recycling mechanism for recycling the second buffer material 2311.

[0040] Please refer to Figures 7 - 8The left side plate 106 and the right side plate 107 are connected by a first connecting rod 1061, a second connecting rod 1062, and a first connecting plate 1063, and are fixed at the front section, the middle section, and the rear section respectively. When a layer of buffer material is selected to be used, the first tape reel 201 stuck between the left plate 106 and the right plate 107 is taken out, and the first reel 203 is installed on the first tape reel 201, and the first reel 201 and the first reel 203 are fixed by the first retaining ring 202 and the second retaining ring 204 to prevent the first reel 203 from moving axially along the first tape reel 201. The inner diameter of the first retaining ring 202 is larger than the diameter of the first tape reel 201 and the outer diameter is smaller than the inner diameter of the first reel 203. The inner diameter of the second retaining ring 204 is larger than the diameter of the first tape reel 201 and the outer diameter is smaller than the outer diameter of the first retaining ring 202. After the first retaining ring 202 is installed on both sides of the first reel 203, the second retaining ring 204 is inserted into both sides of the first tape reel 201 and fixed; a first damper is sleeved in the middle of the first tape reel 201, and a There is a first damping cover 205, the first reel 203 includes a plurality of second mounting holes 2012 and the second mounting holes 2012, the first damper is connected to the first damping cover 205 through the second mounting holes 2012, the outer surface of the first reel 203 is provided with a plurality of first grooves, the bottom surface of the first groove is provided with a first elastic member 2013, the first elastic member 2013 is fixedly installed on the bottom surface of the first groove through the second mounting holes 2012, and the first elastic member 2013 is slightly higher than the outer surface of the first reel 203, when the first buffer material 2015 is installed, the inner wall of the first buffer material 2015 is supported by the first elastic member 2013, and third retaining rings 206 for fixing the first buffer material 2015 are provided on both sides of the first reel 203, and the third retaining rings 206 can be adjusted in the X direction according to the width of the first buffer material 2015. A first damper is provided in the middle sleeve of the first winding shaft 201, a first damping cover 205 is provided on the first winding shaft 201, the first reel 203 includes a plurality of first mounting holes 2011 and second mounting holes 2012, the first damper and the first damping cover 205 are connected via the first mounting holes 2011, a plurality of first flat areas 2014 are provided on the outer surface of the first reel 203, a first elastic member 2013 is provided on the first flat area 2014, and the first elastic member 2013 is fixed to the outer surface of the first reel 203 via the second mounting holes 2012.

[0041] Please also read Figure 3 , Figure 5 , Figure 6, in this embodiment, the first feeding mechanism includes a blowing rod 209, a first tape winding rod 207, and a second tape winding rod 208. The first recycling mechanism includes a third tape winding rod 211, a fourth tape winding rod 212, a fifth tape winding rod 213, and a first recycling rod 214. A fourth retaining ring 2071 for limiting the first buffer material 2015 is sleeved on the first tape winding rod 207. When the first buffer material 2015 bypasses the first tape winding rod 207, according to the width of the first buffer material 2015, the position can be adjusted in the X direction on both sides of the first tape winding rod 207 through the fourth retaining ring 2071. A first elongated groove 2141 is formed in the first recycling rod 214. The starting section of the recycled first buffer material 2015 enters the first elongated groove 2141, and the first buffer material 2015 is wound and recycled through the first recycling rod 214; the first buffer material 2015 passes through the lower surfaces of the first tape winding rod 207 and the second tape winding rod 208, passes through the upper surface of the third tape winding rod 211, passes through the lower surface of the fourth tape winding rod 212, and passes through the upper surface of the fifth tape winding rod 213; a plurality of air blowing holes are provided on the blowing rod 209. By rotating the blowing rod 209, the blowing direction of the air blowing holes is adjusted, and the air blowing holes are directed towards the substrate and the PCB bonding area; the first tape winding rod 207 is located obliquely below the first reel 203, the blowing rod 209 is located below the first tape winding rod 207 and in front of the first tape winding rod 207, the second tape winding rod 208 is located behind the first tape winding rod 207 and higher than the first tape winding rod 207, the third tape winding rod 211 is located behind the second tape winding rod 208 and higher than the second tape winding rod 208, the fourth tape winding rod 212 is located behind the third tape winding rod 211 and higher than the third tape winding rod 211, the fifth tape winding rod 213 is located behind the fourth tape winding rod 212 and in front of the first recycling rod 214, and is higher than the fourth tape winding rod 212 and the first recycling rod 214; a first bearing is sleeved at the fixed part of the left side of the first recycling rod 214 and the left side plate 106, a first bearing seat is sleeved on the first bearing, and the first bearing seat is stuck on the left side plate 106. A second bearing is sleeved at the fixed part of the right side of the first recycling rod 214 and the right side plate 107, a second bearing seat is sleeved on the second bearing, and the second bearing seat is stuck on the right side plate 107;

[0042] The first driving mechanism includes a first driving member 221, a first gear 222, a second gear 223, and a second connecting plate 224. The first driving member 221 is connected to the first gear 222, the first driving member 221 is fixed to the second connecting plate 224, the second connecting plate 224 is arranged parallel to the outside of the left side plate 106, the second gear 223 is connected to the outer end of the first recycling rod 214, the first gear 222 is fixedly connected to the main shaft of the first driving member 221, and the first gear 222 meshes with the second gear 223 to drive the first recycling rod 214 to rotate clockwise to wind and recycle the used first buffer material 2015.

[0043] Please refer to Figure 4, the first recycling mechanism includes a first limiting component, a second limiting component, and a third limiting component. The first limiting component includes a first stop block 2151 and a first moving block 2152. The first stop block 2151 is fixed to the left side plate 106, and the first moving block 2152 is fixed to the first stop block 2151. The first moving block 2152 contacts and limits the first bearing seat and can adjust the contact area; the second limiting component includes a second stop block 2161 and a second moving block 2162. The second stop block 2161 is fixed to the right side plate 107, and the second moving block 2162 is fixed to the second stop block 2161. The second moving block 2162 contacts and limits the second bearing seat and can adjust the contact area. When the first buffer material 2015 is fed at a fixed length, the first limiting component and the second limiting component simultaneously limit both sides of the first recycling rod 214, which can prevent the first recycling rod 214 from having upward displacement and causing slippage; the third limiting component includes a first damping guide rod 2172, a first damping seat 2173, a first elastic limiting member 2174, and a first limiting member 2171. The first damping seat 2173 is fixed to the inner side of the right side plate 107. The first damping guide rod 2172 and the first elastic limiting member 2174 are fixed to the first damping seat 2173. The first elastic limiting member 2174 is vertically connected to the first damping guide rod 2172. One end of the first limiting member 2171 is fixed to the first connecting plate 1063. When the first recycling rod 214 recovers all of the first buffer material 2015 and is extracted, one end of the first elastic limiting member 2174 abuts against the first recycling rod 214, and the other end of the first limiting member 2171 abuts against the first damping guide rod 2172, preventing the first recycling rod 214 from having front-back displacement during material change, facilitating material change, and the relative distance between the first limiting member 2171 and the first damping guide rod 2172 is adjustable.

[0044] The first recycling mechanism includes a first detection component for detecting the used length of the first buffer material 2015. The first detection component includes a first code disk 2181 and a first detection member 2182. The first code disk 2181 is fixedly connected to the fifth winding rod 213 and is arranged on the left side of the left side plate 106. Above the first code disk 2181, there is a first detection member 2182 for reading the rotation amount of the first code disk 2181.

[0045] In this embodiment, when the double-layer buffer material is selected for use, on the basis that the first feeding mechanism is installed, the second reel shaft 231 stuck between the left side plate 106 and the right side plate 107 is taken out. On the second reel shaft 231, the second reel 232 is loaded. The second damping cover and the second damper are installed through the third mounting hole. The second elastic member is installed through the fourth mounting hole on the plurality of flat areas provided on the outer surface of the shaft of the second reel 232. The second reel shaft 231 and the second reel 232 are fixed with the fifth retaining ring and the sixth retaining ring. The second buffer material 2311 is loaded on the second reel 232. The second elastic member abuts against the inner wall of the second buffer material 2311 to prevent excessive space shaking inside. The seventh retaining ring fixes the second reel 232 and the second buffer material 2311 to prevent the second buffer material 2311 from shaking in the X direction.

[0046] After the second buffer material 2311 is installed, the second buffer material 2311 is wound around the upper surface of the sixth tape reel rod 233, around the lower surfaces of the seventh tape reel rod 234 and the eighth tape reel rod 235, around the upper surfaces of the ninth tape reel rod 241 and the tenth tape reel rod 242, and the starting end of the recovered second buffer material 2311 is wound into the second long groove 2431 and wound around the second recovery rod 243; a third bearing is sleeved at the fixing position of the right side of the second recovery rod 243 and the right side plate 107, a third bearing seat is sleeved on the third bearing, the third bearing seat is stuck on the right side plate 107, a fourth bearing is sleeved at the fixing position of the left side of the second recovery rod 243 and the left side plate 106, a fourth bearing seat is sleeved on the fourth bearing, and the fourth bearing seat is stuck on the left side plate 106; the second driving member 251 is fixed to the third connecting plate 225, the third connecting plate 225 is located outside the right side plate 107 and is parallel to the right side plate 107, the fourth gear 252 is connected to the left side of the second recovery rod 243, the third gear is fixedly installed on the main shaft of the second driving member 251, the third gear meshes with the fourth gear 252 for transmission, driving the second recovery rod 243 to rotate clockwise to wind and recover the used second buffer material 2311, and the second damper will generate a reaction force to tighten the laid second buffer material 2311; the third stop block is fixed on the right side plate 107, the third moving block is fixed on the third stop block, the third moving block contacts and limits the third bearing seat and the contact area can be adjusted, the fourth stop block is fixed on the left side plate 106, the fourth moving block is fixed on the fourth stop block, the fourth moving block contacts and limits the fourth bearing seat and the contact area can be adjusted, the second damper guide rod 2462 and the second elastic limiting member 2463 are fixed to the second damper seat, one end of the second elastic limiting member 2463 abuts against the second recovery rod 243, the second elastic limiting member 2463 is vertically connected to the second damper guide rod 2462, the second limiting member 2461 is arranged on the second connecting plate 224, and one end of the first limiting member 2171 abuts against the second damper guide rod 2462 to complete the three-step limiting; when the second buffer material 2311 is used up, when the operator pulls out the second buffer material 2311 from the second recovery rod 243, the second recovery rod 243 will not shift or loosen in position through the three-step limiting; a second code disc 2472 is fixed on one side of the ninth tape reel rod 241 and is arranged between the right side plate 107 and the third connecting plate 225, and the second detection member 2471 can feedback the used length of the second buffer material 2311 by reading the rotation amount of the second code disc 2472.

[0047] Please refer to Figure 9, in this embodiment, a plurality of fifth guide rails 101 are further provided at the bottom of the bracket 1, a seventh driving member 102 is provided on the fourth connecting plate 253, a plurality of fifth connecting plates 103 and sixth connecting plates 104 are fixed on the fifth guide rails 101, the fifth connecting plate 103 is connected to the second connecting plate 224, the sixth connecting plate 104 is connected to the third connecting plate 225, and a plurality of buffer members 105 are further provided below the fifth guide rails 101. When the seventh driving member 102 drives the fifth guide rails 101 to move in the vertical direction, the bottoms of the fifth connecting plate 103 and the sixth connecting plate 104 directly contact the buffer members 105 to perform a buffering action, reducing the vibration caused by the descent and affecting the use of the first buffer material 2015 and the second buffer material 2311, and adjusting the distance between the buffer material and the substrate and the pressing head through the fifth guide rails 101.

[0048] Please refer to Figure 12 , in this embodiment, the heating mechanism includes a pressing head for bonding and a heating block 321 fixed above the pressing head. Heat insulation plates 322 for heat insulation are provided above and behind the heating block 321. A plurality of embedding holes are formed in the middle of the heating block 321, and a plurality of first adjustment holes are formed in the upper part of the heating block 321. A plurality of heating elements 323 are embedded in the embedding holes, and the heating elements 323 generate heat and transfer the heat to the pressing head; the horizontal adjustment mechanism includes a horizontal adjustment plate 331 and a horizontal adjustment member 332. A plurality of second adjustment holes are formed in the horizontal adjustment plate 331. The first adjustment holes and the second adjustment holes correspond to each other in the vertical direction. The horizontal adjustment member 332 passes through the second adjustment holes and is installed on the horizontal adjustment plate 331. The bottom of the second adjustment holes is embedded in the embedding holes and is connected to the heating block 321.

[0049] Before bonding, the pressing head is quickly heated to the target temperature by the heating elements 323 embedded in the heating block 321, and the heat is transferred to the pressing head below. The periphery of the heating block 321 is insulated and kept warm by the heat insulation plates 322 to prevent excessive heat from affecting the surrounding components and further keep the heating block 321 warm to prevent heat dissipation.

[0050] The horizontal adjustment mechanism includes a horizontal adjustment plate 331 and a horizontal adjustment member 332. A plurality of second adjustment holes are formed in the horizontal adjustment plate 331. The first adjustment holes and the second adjustment holes correspond to each other in the vertical direction. The horizontal adjustment member 332 passes through the second adjustment holes and is installed on the horizontal adjustment plate 331. The bottom of the second adjustment holes is embedded in the embedding holes and is connected to the heating block 321.

[0051] When it is found that the bottom surface of the pressing head is not level, the levelness can be quickly adjusted by adjusting the height of the horizontal adjustment member 332. There is sufficient space above the horizontal adjustment member 332, which is convenient for the operator to adjust.

[0052] In this embodiment, the third driving mechanism includes a third driving member 301, a first guide rail 302, and a first mounting plate 303. The third driving member 301 is disposed above the bracket 1. The first mounting plate 303 is provided on the front surface of the bracket 1, and the first guide rail 302 is provided on the first mounting plate 303. The fourth driving mechanism includes a fourth driving member 311, a second guide rail 312, a second mounting plate 313, a third mounting plate 314, a fourth mounting plate 315, and a fifth mounting plate. The second mounting plate 313 is fixed on the first guide rail 302, and the second guide rail 312 is fixed on the second mounting plate 313. The third mounting plate 314 is disposed parallel above the heating block 321. The fourth mounting plate 315 is disposed between the third mounting plate 314 and the heating block 321 and is fixedly connected to the third mounting plate 314 and the heating block 321. The fourth driving member 311 is fixed on the third mounting plate 314, and the fifth mounting plate is fixed on the second guide rail 312. The third mounting plate 314, the fourth mounting plate 315, and the heating block 321 are fixed on the fifth mounting plate. A plurality of heat insulation plates 322 are further provided around the heating block 321, except at the connection of the heating block 321 and the indenter. The third driving member 301 and the first guide rail 302 drive the indenter to perform the first vertical movement in the vertical direction, and the fourth driving member 311 and the second guide rail 312 drive the indenter to perform the second vertical movement in the vertical direction.

[0053] In this embodiment, the force measuring mechanism includes a pressure seat 341, a pressure gauge 342, a third connecting rod 343, a sixth mounting plate 345, and a pressing member 344. The pressure seat 341 is fixed on the first mounting plate 303 and is located above the fourth driving member 311. The pressure gauge 342 is fixed on the pressure seat 341. The sixth mounting plate 345 is provided above the pressure seat 341, and the pressing member 344 is fixed in the middle of the sixth mounting plate 345. The sixth mounting plate 345 is disposed parallel to the fourth mounting plate 315 in the vertical direction, and the sixth mounting plate 345 and the fourth mounting plate 315 are fixedly connected by the third connecting rod 343. When measuring the pressure, the pressing member 344 directly contacts the pressure gauge 342. After a period of time or when replacing products of different specifications, the pressure seat 341 and the pressure gauge 342 are quickly fixed on the first mounting plate 303. When the third driving member 301 and the fourth driving member 311 drive the indenter to perform vertical movement, the pressing member 344 presses against the pressure gauge 342, and it can be observed whether the pressure value feedback by the pressure gauge 342 meets the requirements.

[0054] Please refer to Figures 10 - 11, in this embodiment, the first alignment device 4 includes a fifth driving mechanism and a first image processing mechanism. The fifth driving mechanism includes a fifth driving member 411 and a third guide rail 412. The first image processing mechanism includes a first camera 402, a first light source 401 and a controller. The first camera 402 is connected to the first light source 401, the first camera 402 is fixedly connected to the third guide rail 412, the fifth driving member 411 is connected to the third guide rail 412, the first camera 402 captures the fiducial points of the substrate, the first light source 401 provides light, and the controller receives the image information; the second alignment device 5 includes a second image processing mechanism and a sixth driving mechanism. The sixth driving mechanism includes a sixth driving member 511 and a fourth guide rail 512. The second image processing mechanism includes a second light source 501 and a second camera 502. The second light source 501 is fixedly connected to the second camera 502, the fourth guide rail 512 is connected to the sixth driving member 511, and the second camera 502 is connected to the fourth guide rail 512; the second light source 501 provides light, the second camera 502 captures the fiducial points of the PCB, and the controller compensates for the relative positions of the PCB and the substrate to complete the calibration.

[0055] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected", "fixed", etc. shall be construed broadly. For example, it may be a connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "under" and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0057] The above is the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A pressure bonding device, comprising a bracket (1), characterized in that: The bracket (1) is provided with a bonding device (3) for bonding the substrate and the PCB, a first alignment device (4) and a second alignment device (5) for aligning the substrate and the PCB, and a double-rolling device (2) for buffering during bonding; the first alignment device (4) is located in front of the bonding device (3), the second alignment device (5) is located behind the bonding device (3), and the double-rolling device (2) is located below the bonding device (3); The double-rolling device (2) comprises a left side plate (106), a right side plate (107) and a first roll unit and a second roll unit which are independent of each other, wherein the first roll unit comprises a first feeding mechanism for providing a first buffer material (2015), a first driving mechanism for driving the first feeding mechanism, and a first recovery mechanism for recovering the first buffer material (2015); the second roll unit comprises a second feeding mechanism for providing a second buffer material (2311), a second driving mechanism for driving the second feeding mechanism, and a second recovery mechanism for recovering the second buffer material (2311); the first buffer material (2015) or the second buffer material (2311) passes through the bonding device (3) or the first buffer material (2015) and the second buffer material (2311) pass through the bonding device (3) at the same time and in parallel; The bonding device (3) comprises a heating mechanism, a horizontal adjustment mechanism, a force measuring mechanism, a third driving mechanism, and a fourth driving mechanism. The heating mechanism comprises a pressure head for bonding and a heating block (321) fixed above the pressure head. A heat insulation plate (322) for heat insulation is provided above and behind the heating block (321). A plurality of embedding holes is provided in the middle of the heating block (321). A plurality of first adjustment holes is provided in the upper part of the heating block (321). A plurality of heating elements (323) are embedded in the embedding holes. The horizontal adjustment mechanism comprises a horizontal adjustment plate (331) and a horizontal adjustment element (332). A plurality of second adjustment holes are provided on the horizontal adjustment plate (331). The first adjustment holes correspond to the second adjustment holes in the vertical direction. The horizontal adjustment element (332) is installed on the horizontal adjustment plate (331) through the second adjustment holes. The bottom of the second adjustment hole is embedded in the embedding hole and connected to the heating block (321).

2. The pressure bonding device according to claim 1, characterized in that: The first feeding mechanism comprises a first winding shaft (201) and a first reel (203) on which the first buffer material (2015) is installed; the second feeding mechanism comprises a second winding shaft (231) and a second reel (232) on which the second buffer material (2311) is installed, and the first feeding mechanism and the second feeding mechanism are arranged between the left plate (106) and the right plate (107).

3. The pressure bonding device according to claim 2, characterized in that: The first recovery mechanism comprises a plurality of winding rods and a first recovery rod (214), the first recovery rod (214) being provided with a first card slot, and the head end of the first buffer material (2015) being inserted into the first card slot after passing around the plurality of winding rods; the second recovery mechanism comprises a plurality of winding rods and a second recovery rod (243), the second recovery rod (243) being provided with a second card slot, and the head end of the second buffer material (2311) being inserted into the second card slot after passing around the plurality of winding rods.

4. The pressure bonding device according to claim 3, characterized in that: The first driving mechanism comprises a first driving member (221), a first gear (222), a second gear (223) and a second connecting plate (224); the first gear (222) is fixedly arranged on the main shaft of the first driving member (221); the first driving member (221) is fixed to the second connecting plate (224); the second connecting plate (224) is arranged parallel to the outer side of the left side plate (106); the second gear (223) is connected to the left side of the first recovery rod (214); the first gear (222) is meshed with the second gear (223); The second driving mechanism comprises a second driving member (251), a third gear, a fourth gear (252) and a third connecting plate (225); the second driving member (251) is connected to the third gear; the second driving member (251) is fixed to the third connecting plate (225); the third connecting plate (225) is arranged parallel to the outer side of the right side plate (107); the third gear is fixed to the main shaft of the second driving member (251); the fourth gear is connected to the left side of the second recovery rod (243); and the third gear is meshed with the fourth gear (252).

5. The pressure bonding device according to claim 4, characterized in that: A third bearing is sleeved on the right side of the second recovery rod (243) where it is fixed to the right side plate (107), a third bearing seat is sleeved on the third bearing, and the third bearing seat is clamped on the right side plate (107); a fourth bearing is sleeved on the left side of the second recovery rod (243) where it is fixed to the left side plate (106), a fourth bearing seat is sleeved on the fourth bearing, and the fourth bearing seat is clamped on the left side plate (106).

6. The pressure bonding device according to claim 5, characterized in that: The first recovery mechanism comprises a first detection component for detecting the use length of the first buffer material (2015); the second recovery mechanism comprises a second detection component for detecting the use length of the second buffer material (2311).

7. The pressure bonding device according to claim 6, characterized in that: The third driving mechanism comprises a third driving member (301), a first guide rail (302), and a first mounting plate (303); the third driving member (301) is arranged above the bracket (1); the first mounting plate (303) is arranged on the front of the bracket (1); the first mounting plate (303) is arranged on the first mounting plate (303); the fourth driving mechanism comprises a fourth driving member (311), a second guide rail (312), a second mounting plate (313), a third mounting plate (314), a fourth mounting plate (315) and a fifth mounting plate (316); the second mounting plate (313) is fixed on the first guide rail (302); the second guide rail (312) is fixed on the second mounting plate (313); the third mounting plate (314) is arranged parallel to the heating block (321) ), the fourth mounting plate (315) is arranged between the third mounting plate (314) and the heating block (321), and fixedly connects the third mounting plate (314) and the heating block (321); the fourth driving member (311) is fixed on the third mounting plate (314), the fifth mounting plate (316) is fixed on the second guide rail (312), and the third mounting plate (314), the fourth mounting plate (315) and the heating block (321) are fixed on the fifth mounting plate (316); the third driving member (301) and the first guide rail (302) drive the pressure head to perform the first step of vertical movement in the vertical direction, and the fourth driving member (311) and the second guide rail (312) drive the pressure head to perform the second step of vertical movement in the vertical direction.

8. The pressure bonding device according to claim 7, characterized in that: The force measuring mechanism comprises a pressure seat (341), a pressure gauge (342), a third connecting rod (343), a sixth mounting plate (345), and a pressing piece (344); the pressure seat (341) is fixed on the first mounting plate (303) and is located above the fourth driving member (311); the pressure gauge (342) is fixed on the pressure seat (341); the sixth mounting plate (345) is provided above the pressure seat (341); the pressing piece (344) is fixed in the middle of the sixth mounting plate (345); the sixth mounting plate (345) is provided parallel to the fourth mounting plate (315) in a vertical direction; the sixth mounting plate (345) and the fourth mounting plate (315) are fixedly connected via the third connecting rod (343); when measuring pressure, the pressing piece (344) directly contacts the pressure gauge (342).

9. The pressure bonding device according to claim 8, characterized in that: The first alignment device (4) comprises a fifth driving mechanism and a first image processing mechanism, the fifth driving mechanism comprises a fifth driving member (411) and a third guide rail (412), the first image processing mechanism comprises a first camera (402), a first light source (401) and a controller, the first camera (402) is connected to the first light source (401), the first camera (402) is fixedly connected to the third guide rail (412), the fifth driving member (411) is connected to the third guide rail (412), the first camera (402) photographs a marking point on the substrate, the first light source (401) provides light, and the controller receives image information; the second alignment device The device (5) comprises a second image processing mechanism and a sixth driving mechanism, the sixth driving mechanism comprises a sixth driving member (511) and a fourth guide rail (512), the second image processing mechanism comprises a second light source (501) and a second camera (502), the second light source (501) is fixedly connected to the second camera (502), the fourth guide rail (512) is connected to the sixth driving member (511), and the second camera (502) is connected to the fourth guide rail (512); the second light source (501) provides light, the second camera (502) photographs the marking point of the PCB, and the controller receives the relative position of the PCB and the substrate for compensation to complete the correction.

10. The pressure bonding device according to claim 9, characterized in that: A plurality of fifth guide rails (101) are also provided at the bottom of the bracket (1), a seventh driving member (102) is provided on the fourth connecting plate (253), a plurality of fifth connecting plates (103) and a sixth connecting plate (104) are fixed on the fifth guide rail (101), the fifth connecting plate (103) is connected to the second connecting plate (224), the sixth connecting plate (104) is connected to the third connecting plate (225), and a plurality of buffer members (105) are also provided below the fifth guide rail (101), when the seventh driving member (102) drives the fifth guide rail (101) to move in a vertical direction, the bottoms of the fifth connecting plates (103) and the sixth connecting plates (104) directly contact the buffer members (105) to perform a buffering action.

11. The pressure bonding device according to claim 10, characterized in that: The first feeding mechanism comprises a blowing rod (209), the blowing rod (209) being provided with a plurality of blowing holes, the blowing holes blowing towards the bonding area between the substrate and the PCB.

12. The pressure bonding device according to claim 11, characterized in that: The first recovery mechanism comprises a first limiting assembly, a second limiting assembly and a third limiting assembly, wherein the first limiting assembly and the second limiting assembly simultaneously limit the vertical movement of both ends of the first recovery rod (214); the third limiting assembly limits the front-rear movement of the first recovery rod (214); the second recovery mechanism comprises a fourth limiting assembly, a fifth limiting assembly and a sixth limiting assembly, wherein the fourth limiting assembly and the fifth limiting assembly limit the vertical movement of both ends of the second recovery rod (243); the sixth limiting assembly limits the front-rear movement of the second recovery rod (243).

13. The pressure bonding device according to claim 12, characterized in that: A first damper is sleeved in the middle of the first winding shaft (201), a first damping cover (205) is provided on the first winding shaft (201), the first drum (203) comprises a plurality of first mounting holes (2011) and second mounting holes (2012), the first damper and the first damping cover (205) are connected via the first mounting holes (2011), a plurality of first flat areas (2014) are provided on the outer surface of the first drum (203), a first elastic member (2013) is provided on the first flat area (2014), and the first elastic member (2013) is fixed to the outer surface of the first drum (203) via the second mounting holes (2012).

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