Cooling device, electronic equipment and vehicle

Abstract

The invention discloses a cooling device, electronic equipment and a vehicle, the cooling device is used for cooling a heating device, the heating device is provided with a first heating part, and the cooling device is provided with a heat exchange surface in heat exchange contact with the heating device; the cooling device comprises a first cooling flow channel and a second cooling flow channel, cooling fluid flows through the first cooling flow channel and the second cooling flow channel, and under the unit area of the heat exchange face, the heat dissipation capacity of the first cooling flow channel is higher than that of the second cooling flow channel. Wherein the first cooling flow channel at least can cool the first heating component; the second cooling flow channel at least can cool the first part, not provided with the first heating component, of the heating device.

Description

Technical Field

[0001] The present application relates to the technical field of cooling equipment, and in particular to a cooling device, an electronic device and a vehicle. Background Art

[0002] With the development of technology, the heat dissipation requirements of some electronic components of equipment have increased. For example, with the rapid development of automobiles, users and the market have higher and higher demands for autonomous driving of vehicles, which has led to higher and higher requirements for the computing power and performance of autonomous driving module chips, thus putting forward higher requirements for the cost and thermal design of autonomous driving modules. Summary of the invention

[0003] In view of this, the present application provides a cooling device.

[0004] To achieve the above objectives, this application provides the following technical solutions:

[0005] A cooling device for cooling a heat generating device, the heat generating device having a first heat generating component, the cooling device having a heat exchange surface for heat exchange contact with the heat generating device;

[0006] The cooling device comprises:

[0007] A first cooling channel and a second cooling channel for a cooling fluid to flow through, wherein the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel per unit area of ​​the heat exchange surface;

[0008] in,

[0009] The first cooling channel is capable of cooling at least the first heat-generating component;

[0010] The second cooling channel can at least cool a first portion of the heat generating device where the first heat generating component is not disposed.

[0011] Optionally, in the above cooling device, the cooling device includes at least one of the following:

[0012] Under the unit area of ​​the heat exchange surface, the contact surface area of ​​the first cooling channel for contacting the cooling fluid is larger than the contact surface area of ​​the second cooling channel for contacting the cooling fluid;

[0013] The thermal conductivity of the first material used to make the first cooling channel is greater than the thermal conductivity of the second material used to make the second cooling channel.

[0014] Optionally, in the above cooling device, the first cooling channel is connected to the second cooling channel;

[0015] The cooling fluid can flow between the first cooling channel and the second cooling channel.

[0016] Optionally, in the above cooling device, the cooling device comprises:

[0017] A main body, wherein the main body has a flow channel body;

[0018] A cover plate, the cover plate is connected to the body to close the flow channel body to form a cooling flow channel group;

[0019] in,

[0020] The cooling channel group includes the first cooling channel and the second cooling channel.

[0021] Optionally, in the above cooling device, the body comprises:

[0022] A shovel tooth structure, the shovel tooth structure comprising a bottom plate for exchanging heat with the first heat-generating component and shovel teeth arranged on the bottom plate;

[0023] A tank structure, wherein the tank structure has the flow channel tank, and the flow channel tank comprises a first tank section and a second tank section;

[0024] Wherein, the trough structure has a hollow structure penetrating the first trough section, the bottom plate is connected to the trough structure to close the hollow structure, and the shovel teeth are located in the first trough section;

[0025] The first slot body section, the skived tooth structure and the cover plate constitute the first cooling channel, and the second slot body section and the cover plate constitute the second cooling channel.

[0026] Optionally, in the above cooling device, the thermal conductivity of the first material used to make the scraped tooth structure is greater than the thermal conductivity of the second material used to make the slot structure.

[0027] Optionally, in the above cooling device, the cooling device further comprises a heat exchange component connected to the shovel-tooth structure and used for contacting and exchanging heat with the first heat-generating part, and the heat exchange efficiency of the heat exchange component is higher than the heat exchange efficiency of the shovel-tooth structure.

[0028] Optionally, in the above cooling device, the trough body structure is a die-cast plate, and the flow channel trough body is processed on the die-cast plate through a die-casting process.

[0029] The present application also provides an electronic device, comprising a heat generating device and a cooling device for cooling the heat generating device, wherein the heat generating device has a first heat generating component, and the cooling device has a heat exchange surface for heat exchange contact with the heat generating device;

[0030] The cooling device comprises:

[0031] A first cooling channel and a second cooling channel for a cooling fluid to flow through, wherein the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel per unit area of ​​the heat exchange surface;

[0032] in,

[0033] The first cooling channel is capable of cooling at least the first heat-generating component;

[0034] The second cooling channel can at least cool a first portion of the heat generating device where the first heat generating component is not disposed.

[0035] The present application also provides a vehicle, comprising a driving system capable of controlling the driving of the vehicle, wherein the driving system has a heating device;

[0036] The vehicle further comprises a cooling device for cooling the heat generating device, the heat generating device comprising a first heat generating component, the cooling device comprising a heat exchanging surface for heat exchanging contact with the heat generating device;

[0037] The cooling device comprises:

[0038] A first cooling channel and a second cooling channel for a cooling fluid to flow through, wherein the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel per unit area of ​​the heat exchange surface;

[0039] in,

[0040] The first cooling channel is capable of cooling at least the first heat-generating component;

[0041] The second cooling channel can at least cool a first portion of the heat generating device where the first heat generating component is not disposed. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 A schematic diagram of the internal structure of a cooling device provided in an embodiment of the present application;

[0044] Figure 2 A schematic diagram of a first back structure of a cooling device provided in an embodiment of the present application;

[0045] Figure 3 A schematic diagram of a first structure of an electronic device provided in an embodiment of the present application;

[0046] Figure 4 A schematic diagram of a second back structure of the cooling device provided in an embodiment of the present application;

[0047] Figure 5 A second structural diagram of an electronic device provided in an embodiment of the present application;

[0048] Figure 6 A first structural schematic diagram of a vehicle provided in an embodiment of the present application;

[0049] Figure 7 A second structural schematic diagram of a vehicle provided in an embodiment of the present application. DETAILED DESCRIPTION

[0050] The present application discloses a cooling device to meet the heat dissipation requirement. The present application also provides an electronic device and a vehicle.

[0051] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0052] like Figure 1 , Figure 2 and Figure 4 As shown, an embodiment of the present application provides a cooling device for cooling a heating device 5, wherein the heating device 5 has a first heating component 500, and the cooling device has a heat exchange surface for heat exchange contact with the heating device 5; wherein the heat exchange surface of the cooling device is in heat exchange contact with the heating device 5, and the heating device 5 can be cooled by heat exchange.

[0053] Taking the heating device 5 as an example, the first heating component 500 may be a chip on the circuit board. Specifically, the heating device 5 is an automatic driving module for controlling the automatic driving of the vehicle, and the first heating component 500 may be a high heat flux density chip of the automatic driving module. The heating device 5 is a motherboard of a computer device or a mobile phone, and the first heating component 500 may be a CPU (Central Processing Unit / Processor) of the motherboard. The heating device 5 may also be other structures, such as a server, etc., and the first heating component 500 may also be a capacitor, a resistor, or other components.

[0054] The first heat-generating component 500 belongs to the heat-generating device 5, and the cooling device can at least cool down the first heat-generating component 500. The first heat-generating component 500 can be a component with the highest or higher heat dissipation in the heat-generating device 5, and the heat dissipation requirement of the first heat-generating component 500 is higher than the heat dissipation requirement of other parts or components in the heat-generating device 5; the first heat-generating component 500 can also be a component with a lower or lowest operating temperature, and the operating temperature of the first heat-generating component 500 is at least lower than the operating temperature of other parts or components in the heat-generating device 5.

[0055] The inventors have found that with the development of technology, the heat dissipation requirements of the first heat generating component 500 have also increased (for example, the first heat generating component 500 is a high heat flux density chip of the autonomous driving module, and its computing power and performance requirements are getting higher and higher, which increases its heat dissipation requirements). In the process of using a conventional cooling device (such as a die-cast liquid cold plate) to cool down the heat generating device 5, due to the higher heat dissipation requirements of the first heat generating component 500 or the lower operating temperature requirements of the first heat generating component 500, the cooling device may be unable to meet the heat dissipation requirements of the first heat generating component 500 when cooling down the heat generating device 5.

[0056] In order to meet the heat dissipation requirements of the first heat-generating component 500, the cooling device includes a first cooling channel and a second cooling channel for the cooling fluid to flow through. Under the unit area of ​​the heat exchange surface, the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel. The unit area of ​​the heat exchange surface is the unit area of ​​the area corresponding to the cooling device and the heat-generating device 5, that is, the heat dissipation capacity per unit area of ​​the first area of ​​the cooling device having the first cooling channel is higher than the heat dissipation capacity per unit area of ​​the second area of ​​the cooling device having the second cooling channel. Through the above arrangement, the temperature or thermal conductivity and other factors of the first area of ​​the cooling device having the first cooling channel and the second area of ​​the cooling device having the second cooling channel are different, so that the heat dissipation capacity is different.

[0057] The first cooling channel can at least cool the first heat-generating component 500, and the second cooling channel can at least cool the first portion of the heat-generating device 5 where the first heat-generating component 500 is not provided. The first portion of the heat-generating device 5 where the first heat-generating component 500 is not provided may include a second heat-generating component having a lower heat dissipation requirement than the first heat-generating component 500, or may not include a heat-generating component.

[0058] Since the heat dissipation capacity of the first cooling channel is higher than that of the second cooling channel, the heat dissipation capacity of the first cooling channel can be improved by changing the material or structure, so that the first cooling channel can cool the first heat-generating component 500 to meet the heat dissipation demand of the first heat-generating component 500; and the first part of the heating device 5 (where the first heat-generating component 500 is not set) is cooled by the second cooling channel whose heat dissipation capacity is lower than that of the first cooling channel.

[0059] The above arrangement avoids the situation where the overall improvement of the heat dissipation capacity of the cooling device leads to higher costs, and the first heat-generating component 500 is cooled by the first cooling channel with higher heat dissipation capacity to meet the heat dissipation requirements of the first heat-generating component 500 .

[0060] In the cooling device provided by the embodiment of the present application, under the unit area of ​​the heat exchange surface, the contact surface area of ​​the first cooling channel used for contacting with the cooling fluid is greater than the contact surface area of ​​the second cooling channel used for contacting with the cooling fluid. Based on the certain contact surface of the second cooling channel used for contacting with the cooling fluid, the above-mentioned configuration increases the contact surface area of ​​the cooling fluid and the first cooling channel, that is, increases the heat exchange area between the cooling fluid and the first region of the cooling device having the first cooling channel, thereby improving the heat transfer efficiency between the cooling fluid and the first region, and then can improve the cooling effect of the first cooling channel on the first heat-generating component 500, thereby meeting the heat dissipation requirements of the first heat-generating component 500.

[0061] The same process can be used to process the first cooling channel in the first area and the second cooling channel in the second area. For example, a die-cast liquid cold plate is used as a cooling device, and the contact surface area of ​​the first cooling channel for contacting with the cooling fluid per unit area of ​​the heat exchange surface of the cooling device is increased by increasing the density of the first cooling channel in the first area (including reducing the spacing between adjacent channel segments in the first cooling channel), while the density of the second cooling channel in the second area (including the spacing between adjacent channel segments in the first cooling channel) remains unchanged, so that the contact surface area of ​​the first cooling channel for contacting with the cooling fluid is greater than the contact surface area of ​​the second cooling channel for contacting with the cooling fluid.

[0062] Of course, due to the limitation of the die-casting process, it will be more difficult to process the first cooling channel (the channel with a larger heat dissipation area) in the first area. The material of the first area can be replaced or other processes can be used to process the first cooling channel in the first area. For example, a commonly used material is used as the second material for making the second cooling channel, and a material that is easier to die-cast is used as the first material for making the first cooling channel. Alternatively, the first area and the second area are made of the same material, the second cooling channel is made in the second area by die-casting, and the first cooling channel is made in the first area by turning and other processing techniques.

[0063] The above-mentioned change in the structure of the first cooling channel to increase the area of ​​the contact surface with the cooling fluid and thus improve the heat dissipation capacity of the first cooling channel can also make the flow rate of the cooling fluid in the first cooling channel higher than the flow rate of the cooling fluid in the second cooling channel, or, make different cooling fluids used in the first cooling channel and the second cooling channel.

[0064] Of course, the material used to make the first cooling channel can also be changed so that the cooling device is made of at least two materials with different thermal conductivities. Among them, the thermal conductivity of the first material used to make the first cooling channel is greater than the thermal conductivity of the second material used to make the second cooling channel. That is, the second region of the cooling device can use conventional die-casting materials (such as ADC12 or A360 in aluminum alloy materials), and the first region of the cooling device uses copper metal or aluminum metal with a thermal conductivity higher than the above conventional die-casting materials. Since the thermal conductivity of copper metal is about 3 to 4 times that of the above conventional die-casting materials, and the thermal conductivity of aluminum metal is 1.5 to 2 times that of the above conventional die-casting materials, by using the first material with a higher thermal conductivity to make the first cooling channel, the conduction thermal resistance and diffusion thermal resistance of the first cooling channel can be effectively reduced, thereby effectively improving the heat dissipation capacity of the first cooling channel, and achieving the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel.

[0065] In some embodiments, in order to simplify the structure, the first cooling channel is connected to the second cooling channel, so that the cooling fluid can flow between the first cooling channel and the second cooling channel. Through the above arrangement, a cooling fluid flows in from the inlet of the cooling device and flows out from the outlet of the cooling device. Therefore, a set of inlets and outlets can be processed on the cooling device to meet the flow of the cooling fluid. The cooling fluid flowing in the first cooling channel is the same as that flowing in the second cooling channel.

[0066] The first cooling channel and the second cooling channel may also be relatively independent, that is, the cooling device has at least two sets of relatively independent inlets and outlets. The cooling fluid flowing in the first cooling channel and the second cooling channel may be the same or different.

[0067] like Figure 1-Figure 5 As shown, in some embodiments, the cooling device includes a body 100 and a cover plate 200, the body 100 has a flow channel body 110; the cover plate 200 is connected to the body 100 to close the flow channel body 110 to form a cooling flow channel group;

[0068] The cooling channel group includes a first cooling channel and a second cooling channel. The above arrangement facilitates the processing of the cooling channel group.

[0069] like Figure 1 As shown, the flow channel body 110 of the main body 100 includes a first channel body section 111 and a second channel body section 112, wherein the first channel body section 111 cooperates with the plate surface of the cover plate 200 facing the main body 100 to form a first cooling channel, and the second channel body section 112 cooperates with the plate surface of the cover plate 200 facing the main body 100 to form a second cooling channel.

[0070] The first cooling channel and the second cooling channel can also be directly processed inside a whole body through casting and other processes. No specific restrictions are made here and they are all within the scope of protection.

[0071] In this embodiment, the first cooling channel and the second cooling channel are connected in series, that is, the first tank body section 111 is connected to the second tank body section 112 .

[0072] In some embodiments, the cooling device body 100 includes a shovel structure 101 and a slot structure 102.

[0073] The shovel structure 101 includes a bottom plate 1011 for exchanging heat with the first heat generating component 500 and shovel teeth 1012 disposed on the bottom plate 1011; wherein, a plurality of shovel teeth 1012 are disposed on the bottom plate 1011, and the plurality of shovel teeth 1012 are arranged along the width direction of the first slot section 111 and the extension direction (length direction) of the shovel teeth 1012 is arranged along the flow direction of the cooling fluid, so that a shovel channel for the cooling fluid to pass through is formed between two adjacent shovel teeth 1012. That is, the first slot section 111 has a plurality of shovel channels arranged side by side (in parallel) (a plurality of shovel channels are arranged along the width direction of the first slot section 111). Figure 1 in the upper and lower directions).

[0074] The trough structure 102 has a flow channel trough 110, and the flow channel trough 110 includes a first trough section 111 and a second trough section 112; wherein, the trough structure 102 has a hollow structure that penetrates the first trough section 111, the bottom plate 1011 is connected to the trough structure 102 to close the hollow structure, and the shovel teeth 1012 are located in the first trough section 111.

[0075] The bottom plate 1011 and the tank structure 102 can be connected by bolts and other connectors, and the connection between the bottom plate 1011 and the tank structure 102 can be filled with sealant or provided with a sealing structure 700 such as a sealing gasket to ensure that the bottom plate 1011 closes the hollow structure and ensures the sealing of the first cooling channel. In addition, the above-mentioned operation of assembling the bottom plate 1011 and the tank structure 102 can reduce the demand for space size, thereby facilitating operation.

[0076] Of course, the bottom plate 1011 and the tank structure 102 may also be connected by welding.

[0077] In this embodiment, the hollow structure is located at the bottom surface of the flow channel body 110, the bottom plate 1011 and the body structure 102, so that the bottom surface of the first body section 111 includes the bottom plate 1011. Of course, the hollow structure can also be located at the side surface of the flow channel body 110.

[0078] Since the first cooling channel is connected to the second cooling channel, that is, the first slot body section 111 and the second slot body section 112 are connected, the channel slot body 110 can be processed on the slot body structure 102, and a hollow structure is processed on the slot bottom surface or the slot side surface of the channel slot body 110, and the shovel tooth structure 101 and the slot body structure 102 are arranged so that the shovel tooth structure 101 and the hollow structure are arranged correspondingly to form a part of the first cooling channel. That is, the first slot body section 111, the shovel tooth structure 101 and the cover plate 200 constitute the first cooling channel, and the second slot body section 112 and the cover plate 200 constitute the second cooling channel. Since the first cooling channel has the shovel tooth structure 101, the contact surface area of ​​the first cooling channel for contacting with the cooling fluid per unit area of ​​the heat exchange surface of the cooling device is effectively increased. For example, by setting the shovel tooth structure 101, the shovel tooth flow channel is added to increase the heat exchange area (usually 8 to 10 times that of a conventional die casting flow channel (such as the second cooling flow channel)), which can greatly increase the heat exchange area between the cooling fluid and the first cooling flow channel, thereby improving the cooling effect.

[0079] Furthermore, the thermal conductivity of the first material used to make the scraping structure 101 is greater than the thermal conductivity of the second material used to make the slot structure 102. By using copper metal or aluminum metal as the first material to make the scraping structure 101 and aluminum alloy material as the second material to make the slot structure 102, the cost can be effectively controlled on the basis of further improving the heat dissipation effect of the first cooling channel. That is, the slot structure 102 is made by a die-casting process, which can effectively reduce the cost. Combined with the processing of the scraping structure 101 corresponding to the first cooling channel, the heat dissipation efficiency of the first cooling channel can be effectively improved without significantly increasing the cost.

[0080] The cooling device provided in the embodiment of the present application further includes a heat exchange component connected to the scraper tooth structure 101 and used for heat exchange with the first heat generating component 500 . The heat exchange efficiency of the heat exchange component is higher than that of the scraper tooth structure 101 .

[0081] A thermal interface material 600 may be disposed between the heat exchange component and the first heat generating component 500 to further improve the heat exchange efficiency.

[0082] like Figure 2 and Figure 3 As shown, in some embodiments, the cooling device further includes a heat exchange component, which is a temperature averaging plate 300 (such as a VC plate (Vapor Chamber)). The temperature averaging plate 300 can be connected to the bottom plate 1011 of the shovel tooth structure 101 by welding (soldering) or bolting. The side of the bottom plate 1011 facing away from the shovel tooth 1012 is connected to the temperature averaging plate 300. The thermal conductivity of the temperature averaging plate 300 is 150 to 200 times that of conventional die-casting materials, which can further reduce the diffusion thermal resistance.

[0083] like Figure 4 and Figure 5 As shown, in other embodiments, the cooling device further includes a heat exchange component which is a heat pipe 400. The heat pipe 400 can be connected to the bottom plate 1011 of the skiving structure 101 by welding (soldering) or bolting. The side of the bottom plate 1011 facing away from the skiving teeth 1012 is connected to the temperature equalizing plate 300. The thermal conductivity of the heat pipe 400 in the plane direction (the arrangement direction of the bottom plate 1011 and the first heat generating component 500) is 150 to 200 times that of conventional die-casting materials, which can further reduce the diffusion thermal resistance.

[0084] In order to reduce the number of layers, the trough structure 102 is a die-cast plate, and the flow channel trough 110 is processed on the die-cast plate through a die-casting process.

[0085] The embodiment of the present application further provides an electronic device, including a heating device 5 and a cooling device 1 for cooling the heating device 5, wherein the heating device 5 has a first heating component 500, and the cooling device 1 has a heat exchange surface for heat exchange contact with the heating device 5;

[0086] The cooling device 1 comprises:

[0087] A first cooling channel and a second cooling channel for cooling fluid to flow through, wherein the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel per unit area of ​​the heat exchange surface;

[0088] in,

[0089] The first cooling channel can at least cool the first heat-generating component 500;

[0090] The second cooling channel can cool at least the first portion of the heat generating device 5 where the first heat generating component 500 is not provided.

[0091] In the electronic device provided by the embodiment of the present application, under the unit area of ​​the heat exchange surface of the cooling device 1, the contact surface area of ​​the first cooling channel for contacting with the cooling fluid is greater than the contact surface area of ​​the second cooling channel for contacting with the cooling fluid. Based on the certain contact surface of the second cooling channel for contacting with the cooling fluid, the above-mentioned arrangement increases the contact surface area of ​​the cooling fluid and the first cooling channel, that is, increases the heat exchange area between the cooling fluid and the first region of the cooling device 1 having the first cooling channel, thereby improving the heat transfer efficiency between the cooling fluid and the first region, and then can improve the cooling effect of the first cooling channel on the first heat-generating component 500, thereby meeting the heat dissipation requirements of the first heat-generating component 500. Through the above-mentioned arrangement, the normal operation of the heat-generating device 5 is ensured, and then the normal operation of the electronic device is ensured.

[0092] The electronic device may be a mobile device such as a mobile phone or a laptop computer, or a device such as a desktop computer or a server, or an automatic driving module used in a vehicle.

[0093] The electronic equipment cooling device 1 in this embodiment can be used as a back cover. The cooling device 1 (back cover) is connected to the front cover 3 via connecting components such as connecting bolts 4. A cavity for accommodating the heating device 5 is formed in the back cover and the front cover 3.

[0094] like Figure 6 and Figure 7 As shown, the present application also provides a vehicle, including a driving system 6 capable of controlling the driving of the vehicle, and the driving system 6 has a heating device 5. The driving system 6 may include an automatic driving module for controlling the automatic driving of the vehicle, or an auxiliary driving module for assisting the driving of the vehicle.

[0095] The vehicle further comprises a cooling device 1 for cooling the heat generating device 5, the heat generating device 5 comprising a first heat generating component 500, and the cooling device 1 comprising a heat exchanging surface for heat exchanging contact with the heat generating device 5;

[0096] The cooling device 1 comprises:

[0097] A first cooling channel and a second cooling channel for cooling fluid to flow through, wherein the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel per unit area of ​​the heat exchange surface;

[0098] in,

[0099] The first cooling channel can at least cool the first heat-generating component 500;

[0100] The second cooling channel can cool at least the first portion of the heat generating device 5 where the first heat generating component 500 is not provided.

[0101] Similarly, through the above arrangement, the heat dissipation demand of the first heat generating component 500 is met, thereby ensuring the normal operation of the driving system 6 and improving the safety of the vehicle driving process.

[0102] like Figure 6 As shown, in some embodiments, the driving system 6 is arranged on the main body 7 of the vehicle, wherein the cooling device 1 is relatively independent of the driving system 6, and by arranging the cooling device 1 on the main body 7, the heat exchange surface of the cooling device 1 is in heat exchange contact with the heating device 5 of the driving system 6, and the first cooling channel of the cooling device 1 can cool the first heating component 500 of the heating device 5 to meet the heat dissipation demand of the first heating component 500.

[0103] like Figure 7As shown, in other embodiments, the driving system 6 is arranged on the main body 7 of the vehicle, wherein the driving system 6 has a cooling device 1, that is, the cooling device 1 belongs to the structure of the driving system 6, and the cooling device 1 is arranged at the position of the driving system 6, so that the heat exchange surface of the cooling device 1 is in heat exchange contact with the heating device 5 of the driving system 6, and the first cooling channel of the cooling device 1 can cool the first heating component 500 of the heating device 5 to meet the heat dissipation demand of the first heating component 500.

[0104] The main body 7 of the vehicle may include a frame, wheels, and a driving device for driving the wheels to move.

[0105] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0106] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling device for cooling a heat generating device, wherein the heat generating device has a first heat generating component, and the cooling device has a heat exchange surface for heat exchange contact with the heat generating device; The cooling device comprises: A first cooling channel and a second cooling channel for a cooling fluid to flow through, wherein the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel per unit area of ​​the heat exchange surface; in, The first cooling channel is capable of cooling at least the first heat-generating component; The second cooling channel can at least cool a first portion of the heat generating device where the first heat generating component is not disposed.

2. The cooling device according to claim 1, wherein the cooling device comprises at least one of the following: Under the unit area of ​​the heat exchange surface, the contact surface area of ​​the first cooling channel for contacting the cooling fluid is larger than the contact surface area of ​​the second cooling channel for contacting the cooling fluid; The thermal conductivity of the first material used to make the first cooling channel is greater than the thermal conductivity of the second material used to make the second cooling channel.

3. The cooling device according to claim 1, wherein the first cooling channel is connected to the second cooling channel; The cooling fluid can flow between the first cooling channel and the second cooling channel.

4. The cooling device according to any one of claims 1 to 3, comprising: A main body, wherein the main body has a flow channel body; A cover plate, the cover plate is connected to the body to close the flow channel body to form a cooling flow channel group; in, The cooling channel group includes the first cooling channel and the second cooling channel.

5. The cooling device according to claim 4, wherein the body comprises: A shovel tooth structure, the shovel tooth structure comprising a bottom plate for exchanging heat with the first heat-generating component and shovel teeth arranged on the bottom plate; A tank structure, wherein the tank structure has the flow channel tank, and the flow channel tank comprises a first tank section and a second tank section; Wherein, the trough structure has a hollow structure penetrating the first trough section, the bottom plate is connected to the trough structure to close the hollow structure, and the shovel teeth are located in the first trough section; The first slot body section, the skived tooth structure and the cover plate constitute the first cooling channel, and the second slot body section and the cover plate constitute the second cooling channel. 6 . The cooling device according to claim 5 , wherein the thermal conductivity of the first material used to make the scraped tooth structure is greater than the thermal conductivity of the second material used to make the slot structure.

7. The cooling device according to claim 5, further comprising a heat exchange component connected to the shovel-tooth structure and used for heat exchange in contact with the first heat-generating part, wherein the heat exchange efficiency of the heat exchange component is higher than the heat exchange efficiency of the shovel-tooth structure.

8. The cooling device according to claim 5, wherein the trough structure is a die-cast plate, and the flow channel trough is processed on the die-cast plate by a die-casting process.

9. An electronic device, comprising a heat generating device and a cooling device for cooling the heat generating device, wherein the heat generating device comprises a first heat generating component, and the cooling device comprises a heat exchange surface for heat exchange contact with the heat generating device; The cooling device comprises: A first cooling channel and a second cooling channel for a cooling fluid to flow through, wherein the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel per unit area of ​​the heat exchange surface; in, The first cooling channel is capable of cooling at least the first heat-generating component; The second cooling channel can at least cool a first portion of the heat generating device where the first heat generating component is not disposed.

10. A vehicle, comprising a driving system capable of controlling the driving of the vehicle, wherein the driving system has a heating device; The vehicle further comprises a cooling device for cooling the heat generating device, the heat generating device comprising a first heat generating component, the cooling device comprising a heat exchanging surface for heat exchanging contact with the heat generating device; The cooling device comprises: A first cooling channel and a second cooling channel for a cooling fluid to flow through, wherein the heat dissipation capacity of the first cooling channel is higher than the heat dissipation capacity of the second cooling channel per unit area of ​​the heat exchange surface; in, The first cooling channel is capable of cooling at least the first heat-generating component; The second cooling channel can at least cool a first portion of the heat generating device where the first heat generating component is not disposed.

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