Heat dissipation cold plate
By adopting arc-shaped structure and alternating channel design in the heat dissipation cold plate, the disturbance capacity of the coolant is improved, and the problems of low heat exchange efficiency and uneven temperature distribution in the existing technology are solved, which significantly improves the Thermal dissipation performance of airborne electronic equipment.
Patent Information
- Application Number
- CN202411370471.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-01-17
AI Technical Summary
The existing heat dissipation cold plates have low heat exchange efficiency on airborne electronic equipment and are unevenly distributed on the surface temperature, making it difficult to effectively dissipate heat.
A cooling cold plate including an arc-shaped structure is designed. By transporting coolant inside the cold plate and using the tapered and gradually expanding alternate structure of the arc-shaped channel, the disturbance capacity of the coolant is enhanced, thereby improving the heat exchange efficiency and realizing the temperature. uniformity of distribution.
It improves the heat exchange efficiency and temperature distribution uniformity of the cooling plate, significantly improves the performance of airborne electronic equipment, and is suitable for the heat dissipation problems of high-power electronic equipment.
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Figure CN119325210A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of thermal design of electronic equipment, and in particular relates to a heat dissipation cold plate. Background Art
[0002] With the development of microelectronics technology, many high-performance devices are increasingly used in airborne electronic devices. Modern microelectronic devices have the characteristics of multi-function, high-density packaging, high-speed operation, etc., and their power density will inevitably increase accordingly, thus generating more heat. At the same time, the arrangement of airborne electronic devices is becoming more and more dense, and the heat generated by high-power devices accumulates in large quantities and is difficult to discharge. How to dissipate the large amount of heat generated by airborne electronic equipment is the prerequisite for ensuring reliable and stable operation of the equipment.
[0003] As an efficient heat dissipation structure, the heat dissipation cold plate is widely used in airborne electronic equipment. At present, the domestic heat dissipation cold plate adopts a straight-through heat dissipation method, which has low heat exchange efficiency and uneven surface temperature distribution. Summary of the invention
[0004] In view of this, the heat dissipation cold plate of the present invention improves the heat exchange efficiency while making the temperature distribution more uniform, thereby effectively improving the performance of the onboard electronic equipment.
[0005] A heat dissipation cold plate, suitable for heat dissipation of high-power electronic equipment, comprises a body and a heat dissipation structure arranged in an arc structure in the body, wherein:
[0006] Cooling liquid is transported in the body;
[0007] The heat dissipation structure can improve the disturbance capability of the coolant flowing through the body to increase the heat exchange efficiency.
[0008] Beneficial Effects
[0009] In view of the common problems of low heat exchange efficiency and uneven surface temperature distribution in current heat dissipation cold plates, the heat dissipation structure is set to achieve uniform distribution of coolant in the cold plate flow channel and sufficient heat exchange, thereby improving the heat dissipation efficiency of the cold plate. The liquid cold plate has a compact structure and stable performance. It can be used to solve the heat dissipation problem of airborne electronic equipment and other similar products with high heat generation and high heat density. While improving the heat exchange efficiency, it can ensure a more uniform temperature distribution, thereby effectively improving the performance of airborne electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0011] Figure 1 is a perspective view of the main body;
[0012] Figure 2 is a side view of the main body;
[0013] Figure 3 A three-dimensional diagram of a first arc portion and a second arc portion;
[0014] Figure 4 Schematic diagram for setting the third channel, where:
[0015] 1. Main body; 11. First diamond-shaped channel; 12. Second diamond-shaped channel; 13. Third channel; 14. First arc-shaped portion; 15. Second arc-shaped portion; 16. First spoiler hole group; 17. Second spoiler hole group; 2. Liquid inlet; 3. Liquid outlet. DETAILED DESCRIPTION
[0016] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
[0017] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.
[0018] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.
[0019] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present disclosure, and only show the components related to the present disclosure rather than being drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout type may also be more complicated.
[0020] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, one skilled in the art will appreciate that aspects may be practiced without these specific details.
[0021] like Figures 1 to 4 The heat dissipation cold plate shown is suitable for heat dissipation of high-power electronic devices, such as antennas or chassis, and is used for heat dissipation of TR components in antennas. It includes a body 1 and a heat dissipation structure arranged in an arc structure in the body 1, and a liquid inlet 2 and a liquid outlet 3 are respectively arranged on both sides of the body 1, and the liquid inlet 2 and the liquid outlet 3 are both connected to the heat dissipation structure, wherein a coolant is transported in the body 1, and the heat dissipation structure can improve the disturbance ability of the coolant flowing through the body 1 to increase the heat exchange efficiency. Preferably, the heat dissipation structure includes a plurality of continuously arranged combined channels, which are arranged along the width direction of the body 1 and include adjacent first diamond channels 11 and second diamond channels 12. The number of combined channels is determined according to the signal of the high-power electronic device, and the cross-sectional size of the first diamond channel 11 is larger than the cross-sectional size of the second diamond channel 12, so as to adjust the heat exchange efficiency by distributing the flow parameters of the coolant.
[0022] As a specific implementation method provided in this case, Figure 3 As shown, the first rhombus channel 11 is arranged along the width direction of the body 1 and is symmetrically provided with the first arc-shaped portion 14 on both sides of the axial direction; the second rhombus channel 12 is arranged along the width direction of the body 1 and is symmetrically provided with the second arc-shaped portion 15 on both sides of the axial direction. It should be pointed out that: the first arc-shaped portion 14 and the second arc-shaped portion 15 are preferably arranged in a continuous manner, and the shape of the inner walls on both sides of the body 1 is adapted to the shape of the first arc-shaped portion 14 or the second arc-shaped portion 15 in contact, and the first arc-shaped portion 14 and the second arc-shaped portion 15 are arranged in a staggered manner. Specifically,
[0023] The first arc-shaped portion 14 is continuously arranged along the axial direction of the first diamond-shaped channel 11 in an alternating manner of gradually expanding and gradually contracting (generally, the length of the continuous arrangement is slightly shorter than the length of the first diamond-shaped channel 11 to facilitate the manufacturing process);
[0024] The second arc-shaped portion 15 is continuously arranged along the axial direction of the second rhombus-shaped channel 12 in an alternating manner of gradual contraction and gradual expansion (the maximum angle of the structure after gradual expansion or contraction is 120°-150°, for example, a wave crest structure and a wave trough structure constitute a first arc-shaped portion 14). The traditional method allows the fluid to pass through in a straight-through manner, which has low heat exchange efficiency. The present invention uses two arc-shaped portions arranged in an alternating manner of gradual contraction and gradual expansion and an alternating manner of gradual expansion and gradual contraction, so that the coolant flushes the inner wall surface of the first rhombus-shaped channel 11 in a manner in which the flow parameters are constantly changing, which can improve the heat exchange efficiency between the coolant and the body 1.
[0025] Furthermore, the cross-sections of the first diamond-shaped channel 11 and the second diamond-shaped channel 12 are both X-shaped, and the two are adjacently arranged and their respective cross-sections can form a cross-section including X when combined.
[0026] In some or all of the above schemes, the outer wall surface of the first diamond channel 11 and the second diamond channel 12 and the inner wall surface of the body 1 form a third channel 13, the first diamond channel 11 is symmetrically provided with a first spoiler hole group 16, the number of which is generally 2, and the second diamond channel 12 is symmetrically provided with a second spoiler hole group 17, wherein the first spoiler hole group 16 and the second spoiler hole group 17 are arranged in a straight line, or in an interlaced manner, and the arrangement manner is not limited. The first spoiler hole group 16 and the second spoiler hole group 17 are used to mix the coolant in the third channel 13 with the coolant in the first diamond channel 11 and the second diamond channel 12 or stir them in a flowing manner.
[0027] As a specific implementation method provided in this case, Figure 4 As shown, the first diamond channel 11 and the second diamond channel 12 are arranged in the main body 1 by "additive manufacturing process", wherein the angles between the diamond sides of the first diamond channel 11 and the second diamond channel 12 and the main body 1 in the width direction and the thickness direction are respectively the first angle and the second angle, and the angles of the first angle and the second angle are 40°-60°. Preferably, the first angle is 45° and the second angle is 45°, so as to solve the problem that the CNC machine tool cannot process the X-section channel in the main body 1. When the additive manufacturing process selects a 45° angle, the molding method can be carried out from two directions, and there is no need to add a support structure, thereby reducing the difficulty of processing.
[0028] It should be pointed out that the above cross section is diamond-shaped, which can enhance the two-dimensional bearing capacity of the cold plate.
[0029] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A heat dissipation cold plate, suitable for heat dissipation of high-power electronic equipment, characterized in that: It comprises a main body and a heat dissipation structure arranged in an arc-shaped structure in the main body, wherein: Cooling liquid is transported in the body; The heat dissipation structure can improve the disturbance capability of the coolant flowing through the body to increase the heat exchange efficiency.
2. The heat dissipation cold plate according to claim 1, characterized in that: The heat dissipation structure includes a plurality of continuously arranged combined channels, wherein the combined channels are arranged along the width direction of the body and include a first diamond-shaped channel and a second diamond-shaped channel that are adjacently arranged, wherein: The cross-sectional size of the first diamond-shaped channel is greater than the cross-sectional size of the second diamond-shaped channel, so as to adjust the heat exchange efficiency by distributing the flow parameters of the coolant.
3. The heat dissipation cold plate according to claim 2, characterized in that: The first rhombus channel is arranged along the width direction of the body and has first arc portions symmetrically arranged on both sides of the axial direction; the second rhombus channel is arranged along the width direction of the body and has second arc portions symmetrically arranged on both sides of the axial direction, wherein: The first arc-shaped portion and the second arc-shaped portion are arranged in a staggered manner.
4. The heat dissipation cold plate according to claim 3, characterized in that: The first arc-shaped portions are continuously arranged along the axial direction of the first rhombus-shaped channel in an alternating manner of gradually expanding and gradually contracting; The second arc-shaped portions are continuously arranged along the axial direction of the second rhombus-shaped channel in an alternating manner of gradually contracting and gradually expanding.
5. The heat dissipation cold plate according to claim 4, characterized in that: The cross-sections of each of the first diamond-shaped channel and the second diamond-shaped channel can form a cross-section including X.
6. The heat dissipation cold plate according to claim 4, characterized in that: The outer wall surface of the first diamond-shaped channel and the second diamond-shaped channel and the inner wall surface of the body form a third channel, the first diamond-shaped channel is symmetrically provided with a first spoiler hole group, and the second diamond-shaped channel is symmetrically provided with a second spoiler hole group, wherein, The first spoiler hole group and the second spoiler hole group are arranged in a straight line, or in an interlaced manner. The first spoiler hole group and the second spoiler hole group are used to mix the coolant in the third channel with the coolant in the first diamond channel and the second diamond channel or stir them in a flowing manner.
7. The heat dissipation cold plate according to claim 6, characterized in that: A liquid inlet and a liquid outlet are respectively arranged on both sides of the body, and both the liquid inlet and the liquid outlet are communicated with the heat dissipation structure.
8. The heat dissipation cold plate according to claim 7, characterized in that: The first diamond-shaped channel and the second diamond-shaped channel are arranged in the body by an additive manufacturing process, wherein: The angles between the first rhombus channel and the second rhombus channel and the body in the width direction and thickness direction are respectively the first angle and the second angle, and the angle between the first angle and the second angle is 40° -60°。 9. The heat dissipation cold plate according to claim 8, characterized in that: The first angle is 45° and the second angle is 45°.