Light guiding housing for micro spectrometer

Abstract

A spectrometer housing (116) configured to at least partially enclose at least one detector (112) and at least one emitter (114) of a spectrometer module (110) is disclosed. The spectrometer housing (116) comprises:-a frame element (130); -a cover element (132) connected to the frame element (130); -a separating element (134), which is arranged inside the frame element (130); -a reflector element (136) arranged on at least a portion of one or both of the cover element (132) and the frame element (130); and-an interface element (144). The entrance opening (138) is formed by at least the cover element (132) and the frame element (130). At least two mounting openings (124) are formed by at least the cover element (132) and the frame element (130) on the side opposite the entrance opening (138). The at least two mounting openings (124) are separated by a separating element (134). The frame element (130) and the separating element (134) are integrally formed from the same material, and the interface element (144) is configured to cover the entrance opening (138). Further, a spectrometer module (110), a method of manufacturing a spectrometer housing (116), and a method of manufacturing a spectrometer module (110) are disclosed.

Description

Technical Field

[0001] The present invention relates to a spectrometer housing, a spectrometer module, a method for manufacturing at least one spectrometer housing, and a method for manufacturing a spectrometer module. In general, such devices and methods can be used for various applications. They can be used specifically for investigation or monitoring purposes, specifically in the infrared (IR) spectral region, more specifically in the near infrared (NIR) spectral region. However, other types of applications may also be possible. Background Art

[0002] The complete spectrometer modules available on the market (in which the emitter, detector and all electronics are integrated) are typically still larger than 10 cm. 3 These spectrometer modules are usually not able to be integrated into consumer electronics products (e.g., they require a much smaller form factor (e.g., less than 1 cm 3 ) smartphones or wearable devices). Specifically, there is no commercially available device that can maximize the irradiance of the sample and can be assembled into a size less than 1 cm 3 The reflector in the spectrometer. Miniaturized spectrometer modules can be classified into small spectrometer modules, micro spectrometer modules and chip-sized spectrometer modules based on volume. Currently, the volume of a "chip-sized" spectrometer module is typically less than 1 cm 3 However, a chip-sized spectrometer module is still a subsystem that may not include emitters or electronics in its design. 3 The following are a few examples that are available but bulky and expensive.

[0003] As an example, miniaturized spectrometer modules are commercially available from Spectral Engines GmbH in Steinbach, Germany or from Insion GmbH in Obersulm, Germany. Thus, as an example, a spectrometer module is available using a tungsten lamp as a light source and having a housing providing interchangeable reflective optics. Other modules use, for example, micro-injection molding techniques for manufacturing gratings. However, the size of these commercially available spectrometer modules is still typically much larger than 1 cm 3 Or even within 10cm 3 In the case of a spectral imager, the spectral imager is a device that can be mounted on a surface of a 200-meter-high (100-meter) diameter and a 200-meter-high (100-meter-high) diameter. The spectral imager is a device that can be mounted on a surface of a 200-meter-high (100-meter-high ...

[0004] Despite the advantages implied by the above-described apparatus and methods, there is still a need for improvement. Specifically, the above examples are still too bulky to be integrated into a form factor suitable for consumer electronics products (such as smartphones or tablet computers). Further, there is still a need to reduce the cost of manufacturing and components.

[0005] Problem to be solved

[0006] Therefore, it is desirable to provide spectrometer modules and methods of manufacturing the same which at least substantially avoid the disadvantages of known devices and methods of this type. In particular, it is desirable to provide a miniaturized and cost-effective spectrometer housing for at least partially enclosing a spectrometer module, in particular for integration into consumer electronic products, such as into smartphones, wearable devices or tablet computers. Summary of the invention

[0007] This problem is solved by a spectrometer housing, a spectrometer module, a method for producing at least one spectrometer housing, and a method for producing a spectrometer module having the features of the independent claims. Advantageous embodiments are listed in the dependent claims and in the entire description, which can be realized individually or in any arbitrary combination.

[0008] In a first aspect of the present invention, a spectrometer housing is disclosed. As used herein, the term "spectrometer" is a broad term and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a device or system configured to determine spectral information (such as information about at least one spectrum of at least one object) by recording at least one measurement of at least one signal intensity associated with at least one corresponding signal wavelength of optical radiation and evaluating at least one measurement signal associated with the signal intensity. As used herein, the term "spectrum" (including any grammatical variants thereof) is a broad term and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a partition of optical radiation, wherein the spectrum is composed of optical signals defined by signal wavelengths and corresponding signal intensities. In particular, a spectrum may include spectral information associated with at least one measurement object, such as the type and composition of at least one material forming at least one measurement object, which spectral information may be determined by recording at least one spectrum associated with the at least one measurement object. As used herein, the term "spectrometer module" is a broad term and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a spectrometer as a system, specifically as part of a modular system (e.g. a smartphone), the modular system comprising a plurality of interacting and / or autonomously functioning modules. The spectrometer module may be configured to at least one of: perform at least one specific task within the system and communicate with further elements of the system. Further options may be feasible.

[0009] As used herein, the term "system" is a broad term and will be given its common and conventional meaning for a person of ordinary skill in the art, and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, any set of interacting or interdependent components or parts that form an entirety. Specifically, these components may interact with each other to achieve at least one common function. At least two components may be processed independently, or may be coupled or connectable. As used herein, the term "module" (including any grammatical variants thereof) is a broad term and will be given its common and conventional meaning for a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, at least one element of a system, such as exactly one element of a system. An element may be a subsystem comprising at least one additional element. At least two modules of a system may share elements, such as electronic devices (such as circuit boards). As an example, a system may be a smartphone and / or a wearable device (i.e., a smart watch) comprising a spectrometer module, a touch display module, and a circuit board, wherein both the spectrometer module and the touch display module may be controlled by using a circuit board. A variety of additional options are feasible and are generally known to technicians. A modular system may specifically facilitate the production and maintenance of a system. A module may be replaceable in the system, for example by another module of the same kind. Thus, in particular, as will be appreciated by the skilled person, the term "module" may refer to a functional unit that may form part of a system and may perform at least one function alone and / or in interaction with one or more other modules, and may be formed as a unit as an example.

[0010] As used herein, the term "housing" is a broad term and will be given its ordinary and conventional meaning for ordinary technicians in the field and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a mechanical cover configured to at least partially protect the elements in its interior. The housing may be specifically configured to at least partially protect the elements in its interior from external influences of mechanical nature, such as from collisions with other objects and / or from vibration. The housing may include at least one wall, specifically at least one solid and non-deformable wall. The housing may further be specifically configured to at least partially shield electromagnetic radiation, such as optical radiation or thermal radiation. The housing, specifically at least one wall of the housing, may include at least one opening, such as an opening through which optical radiation can pass. As an example, the housing may be made entirely or partially of at least one rigid material, such as made of at least one plastic material and / or at least one metal material. As will be further outlined in detail below, the housing may specifically be made entirely or partially of at least one molded plastic material.

[0011] As used herein, the term "spectrometer housing" is a broad term and will be given its ordinary and conventional meaning for a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a housing for at least one spectrometer, specifically for at least one spectrometer module. The spectrometer housing may be configured to cover the spectrometer module within a system (such as within a smartphone). The spectrometer housing may be configured to cover the spectrometer module outside the system (such as under ambient conditions, such as when the spectrometer module is removed for maintenance purposes). As will be further outlined in detail below, the spectrometer housing may be specifically configured to guide the optical radiation within the spectrometer module, specifically by using a reflector element, such as for limiting the radiation intensity angle, specifically for maximizing the irradiance of the measurement object. As will be further outlined in detail below, the spectrometer housing may be specifically a miniaturized spectrometer housing, for example, a miniaturized spectrometer housing configured to be integrated into at least one of a smartphone and a tablet computer.

[0012] The spectrometer housing is configured to at least partially enclose at least one detector and at least one emitter of the spectrometer module. Specifically, the spectrometer housing can be configured to enclose the entire spectrometer module. The spectrometer housing can be configured to enclose the entire detector of the spectrometer module. The spectrometer housing can be configured to enclose the entire emitter of the spectrometer module. The spectrometer housing can be configured to enclose only portions of the detector of the spectrometer module. The spectrometer housing can be configured to enclose only portions of the emitter of the spectrometer module. The spectrometer housing can be configured to enclose at least one additional optional component of the spectrometer module or at least a portion thereof.

[0013] As used herein, the term "detector" is a broad term and will be given its ordinary and conventional meaning to a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, an optical sensor configured to detect or measure optical radiation, such as for detecting illumination and / or a light spot generated by at least one light beam. The detector may specifically include at least one photosensitive area. The photosensitive area may be configured to be illuminated, or in other words, to receive optical radiation, and to generate at least one signal, such as an electronic signal, in response to the illumination. The photosensitive area may be located on the surface of the light detector. The photosensitive area may specifically be a single, enclosed, uniform photosensitive area. However, other options may also be feasible.

[0014] As used herein, the term "illumination" is a broad term and will be given its ordinary and conventional meaning for ordinary technicians in the field and is not limited to a special or custom meaning. The term can specifically refer to, but is not limited to, light radiation, specifically light radiation in at least one spectral range of the visible light spectrum, the ultraviolet spectrum, or the infrared spectrum. The term "ultraviolet light" generally refers to electromagnetic radiation with a wavelength of 1nm to 380nm, preferably 100nm to 380nm. Further, the term "visible light" generally refers to a wavelength of 380nm to 760nm. Further, the term "infrared" ("abbreviated as IR") generally refers to a wavelength of 760nm to 1000μm, wherein a wavelength of 760nm to 3μm is generally referred to as "near infrared" (abbreviated as "NIR"). Preferably, the illumination used for the typical purpose of the present invention is IR radiation, more preferably NIR radiation, especially radiation with a wavelength of 760nm to 3μm, preferably 1μm to 3μm. The illumination can specifically be light radiation that illuminates a photodetector or more specifically a photosensitive area. The term "illumination" may also be referred to herein as "optical radiation" or "light".

[0015] The illumination may be provided by at least one measurement object, wherein the provision may include at least one of reflection, transmission and emission. Specifically, before interacting with the measurement object, the optical radiation may be emitted, for example, by at least one emitter. As used herein, the term "emitter" is a broad term and will be given its ordinary and conventional meaning for a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a device configured to emit or emit optical radiation. The emitter may be configured to emit optical radiation, such as optical radiation in the form of a beam, toward the measurement object. The emitter may be configured to emit optical radiation isotopically (e.g., uniformly in all spatial directions), wherein only a portion of the emitted optical radiation may illuminate the measurement object. The emitter may include at least one of a semiconductor-based emitter or a thermal radiator. At least one semiconductor-based emitter may be selected from at least one of a light emitting diode (LED) or a laser (specifically a laser diode). The LED may include at least one fluorescent and / or phosphorescent material. The thermal radiator may include at least one of an incandescent lamp, a black body emitter, and a microelectromechanical system (MEMS) emitter. The emitter may be a modulated emitter. Other kinds of transmitters may also be possible.

[0016] The spectrometer housing includes:

[0017] - frame elements;

[0018] - a cover element connected to the frame element;

[0019] - a partition element, which is arranged within the frame element;

[0020] - a reflector element arranged on at least a portion of one or both of the cover element and the frame element; and

[0021] -Interface elements.

[0022] As used herein, the term "frame element" is a broad term and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a mechanical cover configured to at least partially protect, for example, at least one element, such as at least one adjacent element, from at least one side. The frame element may specifically be configured to at least partially protect at least one element from external influences of a mechanical nature, such as from collisions with other objects and / or from vibrations. The frame element may include at least one wall, specifically at least one solid and non-deformable wall. The wall may specifically surround at least one inner space in whole or in part, and at least one element may be arranged in the at least one inner space. The frame element may be configured to at least partially shield electromagnetic radiation, specifically optical radiation or thermal radiation. The frame element may be or may include a support structure configured to hold at least one other element, such as a reflector element.

[0023] As used herein, the term "cover element" is a broad term and will be given its ordinary and conventional meaning for ordinary technicians in the field and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a mechanical cover that is configured to, for example, at least partially protect at least one element, such as at least one adjacent element, from at least one side. The cover element may be specifically configured to at least partially protect at least one element from external influences of a mechanical nature, such as from collisions with other objects and / or from vibrations. The cover element may include at least one wall, specifically at least one solid and non-deformable wall. The wall may specifically surround at least one internal space completely or partially, and at least one element may be arranged in the at least one internal space. The cover element may be configured to at least partially shield electromagnetic radiation, specifically optical radiation or thermal radiation. The cover element may be or may include a support structure that is configured to hold at least one other element, such as a reflector element.

[0024] As indicated, the frame element and the cover element can be at least one of the following: completely or partially identical, completely or partially integrated with each other, separated from each other, and completely or partially of the same type. The frame element and the cover element can form a superordinate element together, such as a wall, a part of a wall, a surrounding wall or an outer wall of a spectrometer housing configured to at least partially surround the spectrometer module, such as two sides or three sides or more sides of the spectrometer module. As an example, the frame element can cover the left side and the rear side of the spectrometer module, and the cover element can cover the right side and the front side of the spectrometer module, so that the interior of the spectrometer module can be covered laterally from all sides. Other options may be feasible.

[0025] As indicated, the cover element is connected to the frame element. As used herein, the term "connection" (including any grammatical variations thereof) is a broad term, and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to special or custom meanings. The term specifically may refer to but is not limited to at least one of the following: at least two elements (specifically the cover element and the frame element) are linked, merged, assembled together and put together. The connection between the cover element and the frame element may be at least one of a form-fitting connection, an adhesive connection and a press-fit connection. The connection between the cover element and the frame element may be a fixed or rigid or permanent connection, at least except for destructive measures. The connection between the cover element and the frame element may be a loose or flexible connection. The cover element may be connected to the frame element at at least one point of the spectrometer housing and / or in at least one region. As an example, the cover element may be connected to the frame element at at least one corner and / or at least one edge of the spectrometer housing.

[0026] As used herein, the term "separator element" is a broad term and will be given its ordinary and conventional meaning for those of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, an element configured to disconnect or decouple or separate at least two entities, specifically at least two regions within a spectrometer module. Specifically, the separator element may be configured to completely or partially separate at least one first internal space of the spectrometer module or the housing of the spectrometer module from at least one second internal space of the spectrometer module. Specifically, the separator element may be configured to at least partially prevent light from at least one region of the first internal space from entering at least one region of the second internal space, or vice versa. Therefore, specifically, the separator element may be, for example, completely or partially optically opaque, absorptive or opaque within the sensitivity spectral range of the spectrometer module (e.g., within the visible spectrum and / or near infrared spectrum as defined above). Specifically, the separator element may be configured to separate the emitter of the spectrometer module from the detector module. The separator element may be configured to block (e.g., absorb) light radiation, specifically direct light radiation such as emitted by the emitter. The partition element may be configured to protect the detector from direct optical radiation from the emitter. The partition element may be configured to protect the detector from stray light, in particular stray light generated within the spectrometer module. Thus, the partition element may be configured to ensure that the detector is at least predominantly illuminated by optical radiation interacting with the measurement object.

[0027] As used herein, the term "reflector element" is a broad term and will be given its ordinary and conventional meaning to a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, an element configured to reflect or deflect optical radiation. The reflector element may be configured to diffusely and / or regularly reflect optical radiation, specifically light, more specifically light in the visible light spectral range and / or near infrared spectral range, for example, in one or more of the above-mentioned spectral ranges of the spectrometer module. The reflector element may be configured to deflect an incident light beam in a new propagation direction different from the incident propagation direction. The reflector element may have a reflective property for the incident optical radiation. The reflector element may include at least one reflective surface, such as a metal surface. The reflector element may specifically have a reflectivity of at least 50%, more specifically at least 60%, more specifically at least 80%, most specifically at least 90%, specifically in the visible light spectral range and / or near infrared spectral range. The reflector element can be configured to at least partially direct the optical radiation, such as towards the measurement object and / or around the separation element, in particular by at least partially reflecting the optical radiation. The reflector element can be configured to define a radiation intensity angle, such as for maximizing the irradiance of the measurement object. The reflector element can have any shape, such as a planar shape or a parabolic shape.

[0028] The entrance opening is formed by at least a cover element and a frame element. On the side opposite to the entrance opening, at least two mounting openings are formed by at least a cover element and a frame element. The at least two mounting openings are separated by a partition element. The frame element and the partition element are formed integrally from the same material.

[0029] As used herein, the term "incident opening" is a broad term and will be given its ordinary and conventional meaning for ordinary technicians in the field and is not limited to a special or custom meaning. The term can specifically refer to, but is not limited to, an aperture or hole for allowing light radiation to perform at least one of the following: enter an element or system, and leave an element or system. The aperture or hole can be completely open or alternatively can be completely or partially filled and / or covered with at least one transparent material. The incident opening can include or be formed in the spectrometer housing (such as in at least one wall of the spectrometer housing) An aperture or hole. The incident opening can allow light radiation to enter the interior of the spectrometer housing, specifically for irradiating a detector. Additionally or alternatively, the incident opening can allow light radiation to leave the interior of the spectrometer housing (specifically light radiation emitted by the emitter), such as for irradiating a measurement object. As an example, the cover element and the frame element can be combined to laterally enclose the emitter and the detector so that the incident opening is formed above the emitter and the detector. The detector and the emitter can be placed in the bottom portion of the spectrometer housing, specifically each placed in one of the two mounting openings.

[0030] As used herein, the term "mounting opening" is a broad term and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a port or hole configured for at least one of the following: receiving at least one element or system, and retaining at least one element or system. The mounting opening may be configured to allow at least one element to be added to a system or inserted into a system. The mounting opening may be or may provide at least one of a plug-in position and a slot. The mounting opening may be configured to receive and / or retain a detector of a spectrometer module. The form and / or size of the mounting opening may be adapted to the form and / or size of the detector. The mounting opening may be configured to receive and / or retain a transmitter of a spectrometer module. The form and / or size of the mounting opening may be adapted to the form and / or size of the transmitter. The spectrometer housing may include a mounting opening for receiving and / or retaining a detector and another mounting opening for receiving and / or retaining a transmitter. The mounting openings of the spectrometer housing may be identical, such as identical in form and / or size. Alternatively, the mounting openings may also have different forms and / or sizes. As an example, the mounting opening may be covered by an optical window (such as a window made of glass and / or SI, which window, for example, further includes a coating for controlling at least one optical property of the optical window).

[0031] As described, the frame element and the partition element are formed integrally from the same material. As further indicated before, the partition element is arranged in the frame element. The partition element can be connected to the frame element, for example, in at least one point, specifically permanently or inseparably connected to the frame element, at least except for destructive measures. The partition element and the frame element can be formed from the same material in a common manufacturing process, such as in a molding process (such as an injection molding process) or a printing process (such as 3D printing). The frame element and the partition element can form a superior element. Therefore, the frame element and the partition element can each correspond to a part of the superior element. Specifically, for example, from an external perspective, the frame element and the partition element can form an element. In other words, specifically to the outside, the frame element and the partition element can be an element or can appear as an element.

[0032] The reflector element can be fixed to one or both of the cover element and the frame element, specifically to the inner surface of one or both of the cover element and the frame element. The reflector element can be fixed by one or more of a form-fitting connection, an adhesive connection, and a press-fit connection. As used herein, the term "fixed" (including any grammatical variations thereof) is a broad term and will be given its ordinary and conventional meaning for ordinary technicians in the field and is not limited to a special or custom meaning. The term specifically may refer to but is not limited to at least one of the following ways: fixing, attaching, mounting, and fastening at least one element to at least one other element. The term may further refer to at least one of connecting, combining, and merging at least one element with at least one other element. A variety of different options for fixing the reflector element to one or both of the cover element and the frame element may be feasible and generally known to the technician. Additionally or alternatively, the reflector element may be or may include a metallized surface, which is applied to the cover element and / or the frame element, for example, by using one or more deposition techniques (such as sputtering, coating, and evaporation).

[0033] The cover element and the frame element can be formed integrally by the same material. The cover element can be connected to the frame element, for example, in at least one point, specifically permanently or inseparably connected to the frame element, at least except for destructive measures. The cover element and the frame element can be formed by the same material in a common manufacturing process, such as in a molding process (such as an injection molding process) or in a printing process (such as 3D printing). The frame element and the cover element can form a superior element. Therefore, the frame element and the cover element can each correspond to a part of the superior element. Specifically, for example, from an external perspective, the frame element and the cover element can form an element. In other words, specifically to the outside, the frame element and the cover element can be an element or can be expressed as an element. The cover element and the frame element can form an element or a cover, which is configured to at least partially cover the spectrometer module. As an example, the cover element and the frame element can form an element or a cover, which is configured to cover the spectrometer from all sides except the incident opening and at least two mounting openings.

[0034] The cover element may include at least one metallic material. The metallic material may include at least one surface, which is configured to at least partially reflect the optical radiation. Therefore, the cover element may be configured to at least partially reflect the optical radiation. Therefore, the cover element may be configured to guide the optical radiation, or in other words, to provide a light guiding function. As an example, at least one area of ​​at least one surface of the cover element may be configured to reflect the optical radiation. The cover element may include a reflector element. The cover element and the reflector element may be the same element. As an example, the cover element may be at least partially metallized to form a reflector element. Specifically, at least one surface of the cover element may be metallized to form a reflector element. The reflector element may include at least one metallic material selected from the group consisting of: gold, silver, aluminum, and any other metal (e.g., any alloy) suitable for producing a metallized surface. Specifically, the reflector element may be any metallic material having a high reflectivity of at least 50%, more specifically at least 60%, more specifically at least 80%, most specifically at least 90%, specifically in the visible light spectral range and / or the near infrared spectral range. As an example, the metallic material forming the reflector element may be applied to the cover element by using one or more deposition techniques such as sputtering, coating and evaporation.

[0035] The spectrometer housing further includes an interface element, wherein the interface element is configured to cover the incident opening. As used herein, the term "interface element" is a broad term, and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to a special or custom meaning. The term specifically may refer to, but is not limited to, an element configured for at least one of the following: coupling light radiation out of the spectrometer module, and for coupling light radiation into the spectrometer module. Specifically, the interface element may be configured to transmit light radiation at least within the spectral range emitted by the transmitter of the spectrometer module. The interface element may be or may include one or more of the following: a fully or partially transparent material, a glass material, a silicon material, a material having non-absorption characteristics in the infrared spectrum, a long pass filter material, a material having filtering characteristics in one or more spectrums in the visible spectrum and the ultraviolet spectrum. Other options are also feasible.

[0036] The frame element and the partition element and optionally the cover element may include at least one material selected from the group consisting of: polycarbonate material, epoxy resin material, metal material, and any other material that can be manufactured by molding or printing technology to form an element. At least one surface of the frame element and the partition element and optionally the cover element may be configured to reflect less than 6% of the light emitted by the emitter and irradiated on the surface. At least one surface may specifically show black or have a black color. As an example, the element or at least one surface may be coated or dyed, such as to resemble black. The partition element may be configured to block the light emitted from the emitter from transmitting through the partition element, specifically blocking the direct light path between the emitter and the detector, so that the transmission spectrum can be within a measurable noise level, that is, within a noise level that can be measured, more specifically, the transmittance T can be ≤10 -1 , more specifically 10 -1 ≤T≤10 -5 More specifically, 10 -2 ≤T≤10 -4 . In particular, the transmittance T may refer to the quotient of the spectral flux behind the partition element (i.e. on the detector side of the partition element) and the spectral flux in front of the partition element (i.e. on the emitter side of the partition element). The partition element may be arranged so that the direct beam path between the emitter and the detector is blocked. Thus, the partition element may prevent the optical radiation from reaching the detector before interacting with the measurement object (such as before reflection at the measurement object). The reflector element may be configured to at least partially reflect the light emitted by the emitter. The reflector element may be configured and / or arranged to reflect the light emitted by the emitter at least partially towards the interface element and further towards the measurement object. The reflector element may be configured to assist the optical radiation emitted by the emitter to bypass the partition element in order to reach the detector. The reflector element may be configured to at least partially guide the optical radiation, in particular around the partition element.

[0037] At least one first opening of at least two mounting openings may be configured to form a portion of a detector compartment for receiving a detector, and at least one second opening of at least two mounting openings may be configured to form a portion of a transmitter compartment for receiving a transmitter. As used herein, the term "compartment" is a broad term and will be given its ordinary and conventional meaning for a person of ordinary skill in the art and will not be limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a space configured to receive at least one element. The compartment may include at least one cavity for receiving at least one element or at least a portion of an element. The geometry of the compartment may be adapted to the geometry of the element, or at least to a portion of the element to be received. As an example, the compartment may be or include a partially open chamber, such as a chamber open to the top and / or bottom. As used herein, the term "detector compartment" is a broad term and will be given its ordinary and conventional meaning for a person of ordinary skill in the art and will not be limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a compartment configured to receive at least one detector. The detector compartment may include a geometry that matches the geometry of at least one detector so that the at least one detector can be specifically tightly integrated into the detector compartment. As used herein, the term "emitter compartment" is a broad term and will be given its ordinary and conventional meaning to a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a compartment configured to accommodate at least one emitter. The emitter compartment may include a geometry that matches the geometry of at least one emitter so that the at least one emitter can be specifically tightly integrated into the emitter compartment.

[0038] The dimensions of the spectrometer housing can be set to fit in a volume v ≤ 1.5 cm 3 , specifically v≤1.125cm 3 , more specifically v≤0.9cm 3 , more specifically v≤0.5cm 3 As an example, the spectrometer housing may have dimensions of 1.5 cm x 1.5 cm x 0.5 cm or 1 cm x 1 cm x 0.5 cm. Thus, the spectrometer housing may be a miniaturized spectrometer housing. Such dimensions may allow the spectrometer housing to be integrated into a consumer electronic product such as a smartphone, a wearable device, or a tablet computer. The spectrometer housing may be configured for integration into a consumer electronic product such as a smartphone, a wearable device, or a tablet computer.

[0039] In another aspect of the present invention, a spectrometer module is disclosed, comprising at least one detector, at least one emitter, and at least one spectrometer housing according to any one of the embodiments related to a spectrometer housing disclosed in further detail above or below.

[0040] The spectrometer module may further include at least one substrate, specifically a circuit carrier, more specifically a printed circuit board. Specifically, one or more of the emitter, detector, corresponding IC (such as a driver), filter, passive component and spectrometer housing may be arranged on the substrate. The emitter may be enclosed in a first mounting opening of at least two mounting openings of the spectrometer housing. The detector may be enclosed in a second mounting opening of at least two mounting openings of the spectrometer housing. As used herein, the term "substrate" is a broad term and will be given its ordinary and conventional meaning for ordinary technicians in the field and is not limited to a special or custom meaning. The term may specifically refer to but is not limited to any element designed to carry one or more other elements arranged thereon and / or therein. The substrate may be a planar substrate. Specifically, the substrate may have a planar shape (such as a rectangular plate (such as a printed circuit board) shape), for example, entirely or partially made of at least one electrically insulating material (such as at least one plastic material, such as a resin and / or a fiber reinforced plastic material). The substrate may generally have a thickness of less than 1 mm (such as 0.6 mm or less, or 0.4 mm or less). The substrate may comprise one or more layers, in particular thin layers, such as layers having a thickness of 0.5 mm or less. Other sizes and / or forms may also be possible.

[0041] As used herein, the term "circuit carrier" is a broad term and is to be given its ordinary and customary meaning for a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a substrate configured to carry conductive elements. The circuit carrier may specifically at least partially or even completely comprise at least one electrically insulating material, in particular in order to avoid unwanted currents between conductive elements carried by the circuit carrier. By way of example, the electrically insulating material may be selected from polyethylene terephthalate (PET) or polycarbonate (PC); however, other kinds of electrically insulating materials may also be feasible.

[0042] As used herein, the term "printed circuit board", typically abbreviated to "PCB", is a broad term and will be given its ordinary and customary meaning to a person of ordinary skill in the art and is not limited to a special or custom meaning. The term may specifically refer to, but is not limited to, a non-conductive planar substrate, also denoted "board", on which at least one sheet of conductive material (such as a copper layer) is applied, specifically laminated to the substrate, and which substrate further comprises one or more electronic components, electrical components and / or optical components. The board may be or may comprise at least one substrate and / or at least one circuit carrier as defined above and optionally one or more conductive paths (also referred to as tracks or traces) and / or one or more through holes arranged thereon and / or therein. Other terms referring to this type of circuit carrier are printed circuit assembly (abbreviated to "PCA"), printed circuit board assembly (abbreviated to "PCB assembly" or "PCBA"), circuit card assembly (abbreviated to "CCA" or simply "card"). In a PCB, the electrically insulating substrate may comprise a glass epoxy resin, wherein cotton paper impregnated with a phenolic resin (typically tan or brown) may also be used as a substrate material. Depending on the number of sheets, a printed circuit board may be a single-sided PCB, a double-layer or double-sided PCB or a multi-layer PCB, wherein different sheets may be connected to each other by using so-called "vias". A double-sided PCB may have metal on both sides, while a multi-layer PCB may be designed by sandwiching additional metal layers between additional layers of electrically insulating material. Further, by using two double-sided PCBs, a four-layer PCB or more may be produced. In a multi-layer PCB, the layers may be laminated together in an alternating manner, such as in the order of metal, substrate, metal, substrate, metal, etc., wherein each metal layer may be etched separately, and wherein any internal vias may be plated through before the multiple layers are laminated together. Further, the vias may be or include copper-plated holes, preferably, these copper-plated holes may be designed as electrical tunnels through the electrically insulating substrate. For this purpose, through-hole components may also be used, which may typically be mounted by leads passing through the substrate and soldered to tracks or traces on the other side.

[0043] The size of the spectrometer module can be set to fit in a volume v≤1.5cm 3 , specifically v≤1.125cm 3 , more specifically v≤0.9cm 3 , more specifically v≤0.864cm 3 , more specifically v≤0.5cm 3As an example, the spectrometer housing may have a size of 1.5 cm x 1.5 cm x 0.5 cm or 1 cm x 1 cm x 0.5 cm. Thus, the spectrometer module may be a miniaturized spectrometer module. Such a size may allow the spectrometer module to be integrated into a consumer electronic product such as a smartphone, a wearable device, or a tablet computer. The spectrometer module may be configured to be integrated into a consumer electronic product such as a smartphone, a wearable device, or a tablet computer.

[0044] The spectrometer may comprise at least one optical filter element. The optical filter element may be configured to filter the optical radiation or more specifically at least one selected spectral range of the optical radiation. The at least one optical filter element may specifically be positioned in the optical path before the detector.

[0045] For further definitions and embodiments of the spectrometer module, reference may be made to the above description of the spectrometer housing.

[0046] In another aspect of the present invention, a method of manufacturing at least one spectrometer housing is disclosed, the at least one spectrometer housing being configured to at least partially enclose a detector and an emitter of a spectrometer module. The method comprises:

[0047] a) integrally forming the frame element and the partition element;

[0048] b) providing a cover element, wherein the cover element and the frame element form an entrance opening and at least two mounting openings, and wherein the mounting openings are separated by a separation element;

[0049] c) depositing a reflector element on at least a portion of one or both of the cover element and the frame element.

[0050] The method steps may be performed in the order indicated. However, it should be noted that a different order is also possible. The method may include additional method steps that are not listed. Further, one or more of the method steps may be performed once or repeatedly. Further, two or more of the method steps may be performed simultaneously or in a time-overlapping manner.

[0051] In step a), the frame element and the partition element can be formed as one element. In other words, the frame element and the partition element can be formed in one piece. The partition element and the frame element can be formed from the same material in a common manufacturing process, such as in a molding process or a printing process (e.g., an injection molding process or a 3D printing process), as will be further outlined in detail below. In step b), the cover element can be arranged relative to the frame element so that the cover element and the frame element form an incident opening and at least two mounting openings. Further, the cover element can be arranged relative to the partition element so that the mounting openings are separated by the partition element. As an example, the cover element can be arranged so that the partition element is substantially located in the center of the spectrometer housing. In step c), the reflector element can be specifically deposited on at least one surface of one or both of the cover element and the frame element.

[0052] Step c) may further include fixing the reflector element to the inner surface of one or both of the cover element and the frame element. Step c) may include one or more of the following ways: molding, mounting and gluing the reflector element to one or both of the cover element and the frame element, specifically to the inner surface of one or both of the cover element and the frame element. Step c) may include at least partially metallizing the inner surface of one or both of the cover element and the frame element. Specifically, step c) may include selectively metallizing at least a portion of the inner surface of one or both of the cover element and the frame element. Metallization may include coating with at least one metal or alloy material. Metallization may include applying an external voltage or heat. Metallization may include vacuum deposition, such as chemical vapor deposition or physical vapor deposition. A variety of different deposition methods may be feasible and are generally known to technicians.

[0053] The cover element and the frame element can be formed integrally, specifically formed integrally by a molding process. As used herein, the term "molding process" is a broad term, and will be given its common and conventional meaning for those of ordinary skill in the art and is not limited to special or custom meanings. The term can specifically refer to but is not limited to the process of forming a liquid, a liquefied material or a pasty material by inserting (e.g., injecting) the liquid, a liquefied material or a pasty material into a rigid frame, wherein the rigid frame is typically referred to as a mold or matrix. As an example, the mold can be a hollowed-out block, and the hollowed-out block can be filled with a liquid material (e.g., a synthetic plastic material or a metal material), so that the liquid can harden inside the mold, thereby adopting a corresponding shape. A variety of different molding methods can be feasible and are generally known to technicians. One or more of step a) and step b) can include a molding process performed by the group consisting of the following: injection molding process, low pressure molding process, compression molding process, transfer molding process, film-assisted molding process (i.e., film-assisted selective molding process), thermoforming process, and rotational molding process. As an example, at least one of the frame element, the partition element and the cover element can be formed by using an injection molding process (e.g. a plastic injection molding process or a metal injection molding process). Step b) can further include providing a reflector element. The reflector element and the cover element can be the same element, can be completely or partially the same, or can be completely or partially integrated with each other. As indicated, at least one surface of the cover element can be metallized, for example.

[0054] The method may further comprise:

[0055] d) Providing an interface element and covering the entrance opening with the interface element.

[0056] The method may be configured for manufacturing a spectrometer housing according to any one of the embodiments relating to a spectrometer housing disclosed in further detail above or below.

[0057] For further definitions and embodiments of the method, reference may be made to the above description of the spectrometer housing or the spectrometer module.

[0058] In another aspect of the present invention, a method for manufacturing a spectrometer module is disclosed. The method comprises:

[0059] i) performing a method for manufacturing at least one spectrometer housing according to any one of the embodiments described above or below relating to a method for manufacturing a spectrometer housing;

[0060] ii) providing at least one emitter and at least one detector on at least one substrate, in particular on a circuit carrier, more particularly on a printed circuit board;

[0061] iii) arranging the spectrometer housing on at least one substrate such that the emitter is enclosed in a first mounting opening of at least two mounting openings of the spectrometer housing, specifically in the emitter compartment, and the detector is enclosed in a second mounting opening of at least two mounting openings of the spectrometer housing, specifically in the detector compartment.

[0062] The method steps may be performed in the order indicated. However, it should be noted that a different order is also possible. The method may include additional method steps that are not listed. Further, one or more of the method steps may be performed once or repeatedly. Further, two or more of the method steps may be performed simultaneously or in a time-overlapping manner.

[0063] Step iii) may specifically include fixing the spectrometer housing to the substrate by material bonding. Specifically, step iii) may further include fixing the spectrometer housing to the substrate by performing a bonding process selected from the group consisting of the following: gluing and welding. As used herein, the term "bonding process" is a broad term and will be given its common and conventional meaning for ordinary technicians in the field and is not limited to special or custom meanings. The term may specifically refer to but is not limited to a method for connecting or connecting at least two elements. The bonding process may include inserting at least one filling material (such as glue or filler metal (such as solder)) into the joint of the element. The bonding process may include heating these elements. The bonding process may include at least one pretreatment of these elements before connecting these elements, such as surface modification, such as cleaning or drying. A variety of different bonding processes may be feasible and are generally known to technicians.

[0064] The method may be configured for manufacturing a spectrometer module according to any one of the embodiments relating to a spectrometer module disclosed in further detail above or below.

[0065] For further definitions and embodiments regarding the method for manufacturing a spectrometer module, reference may be made to the above description of the method for manufacturing a spectrometer housing, the spectrometer housing or the spectrometer module.

[0066] The apparatus and method as disclosed herein have considerable advantages over the prior art. Specifically, the disclosed apparatus and method can allow the spectrometer module to be integrated into consumer electronic products (such as smart phones, wearable devices or tablet computers). The spectrometer module can be a miniaturized spectrometer module. The spectrometer housing of the spectrometer module can be a miniaturized spectrometer housing. The spectrometer housing can be suitable for chip-sized spectrometer modules. The spectrometer housing including a reflector element can be further configured to guide light radiation and limit the radiation intensity angle, such as for maximizing the irradiance of the measurement object. The spectrometer housing can be produced using large-scale production techniques (such as molding processes, such as injection molding processes). Therefore, the spectrometer module can also be cost-effective and flexible in design.

[0067] As used herein, the terms "having", "including" or "comprising" or any arbitrary grammatical variant thereof are used in a non-exclusive manner. Thus, these terms may refer to the absence of additional features in the entity described in this context in addition to the features introduced by these terms, or the presence of one or more additional features. As an example, the expressions "A has B", "A includes B" and "A contains B" may refer to the absence of other elements in A in addition to B (i.e., A consists only and solely of B), or the presence of one or more additional elements in entity A in addition to B (such as element C, elements C and D or even additional elements).

[0068] Further, it should be noted that the terms "at least one", "one or more", or similar expressions indicating that a feature or element may occur once or more than once are typically used only once when introducing the corresponding feature or element. In most cases, when referring to the corresponding feature or element, the expression "at least one" or "one or more" is not repeated, although in fact the corresponding feature or element may occur once or more than once.

[0069] Further, as used herein, the terms "preferably", "more preferably", "particularly", "more particularly", "specifically", "more specifically" or similar terms are used in conjunction with optional features without limiting the possibilities of alternatives. Therefore, the features introduced by these terms are optional features and are not intended to limit the scope of the claims in any way. As the skilled person will recognize, the present invention can be implemented by using alternative features. Similarly, the features introduced by "in an embodiment of the present invention" or similar expressions are intended to be optional features, without any limitation on alternative embodiments of the present invention, without any limitation on the scope of the present invention, and without any limitation on the possibility of combining the features introduced in this manner with other optional or non-optional features of the present invention.

[0070] Summarizing and without excluding further possible embodiments, the following embodiments may be envisaged:

[0071] Embodiment 1: A spectrometer housing configured to at least partially enclose at least one detector and at least one emitter of a spectrometer module, the spectrometer housing comprising:

[0072] - frame elements;

[0073] - a cover element connected to the frame element;

[0074] - a partition element, which is arranged within the frame element;

[0075] a reflector element arranged on at least a portion of one or both of the cover element and the frame element, and

[0076] - interface elements,

[0077] wherein the entrance opening is formed by at least the cover element and the frame element, wherein, on a side opposite to the entrance opening, at least two mounting openings are formed by at least the cover element and the frame element, the at least two mounting openings are separated by the partition element, and wherein the frame element and the partition element are integrally formed of the same material, wherein the interface element is configured to cover the entrance opening.

[0078] Embodiment 2: The spectrometer housing according to the preceding embodiment, wherein the reflector element is fixed to one or both of the cover element and the frame element, in particular to an inner surface of one or both of the cover element and the frame element.

[0079] Embodiment 3: The spectrometer housing according to the preceding embodiment, wherein the reflector element is fixed by one or more of a form-fitting connection, an adhesive connection and a press-fit connection.

[0080] Embodiment 4: The spectrometer housing according to any one of the preceding embodiments, wherein the cover element and the frame element are integrally formed of the same material.

[0081] Embodiment 5: The spectrometer housing according to any one of embodiments 1 to 3, wherein the cover element comprises at least one metal material.

[0082] Embodiment 6: The spectrometer housing according to the preceding embodiment, wherein the cover element and the reflector element are the same element.

[0083] Embodiment 7: The spectrometer housing according to any of the preceding embodiments, wherein the reflector element comprises a metallic material selected from the group consisting of: gold, silver, aluminum, and any other metal suitable for producing a metallized surface (eg, any alloy).

[0084] Embodiment 8: A spectrometer housing according to any one of the preceding embodiments, wherein the frame element and the partition element and optionally the cover element comprise at least one material selected from the group consisting of: polycarbonate material, epoxy resin material, metal material, and any other material that can be manufactured by molding or printing technology to form an element.

[0085] Embodiment 9: The spectrometer housing according to any of the preceding embodiments, wherein at least one surface of the frame element and the partition element and optionally the cover element is configured to reflect less than 6% of the light emitted by the emitter and impinging on the surface.

[0086] Embodiment 10: The spectrometer housing according to any one of the preceding embodiments, wherein the partition element is configured to block the light emitted from the emitter from transmitting through the partition element, specifically blocking the direct light path between the emitter and the detector, so that the transmission spectrum is within a measurable noise level, more specifically, the transmittance T≤10 -1 , more specifically 10 -1 ≤T≤10 -5 , more specifically 10 -2 ≤T≤10 -4 .

[0087] Embodiment 11: The spectrometer housing according to any one of the preceding embodiments, wherein the reflector element is configured to at least partially reflect light emitted by the emitter.

[0088] Embodiment 12: A spectrometer housing according to any one of the preceding embodiments, wherein a first mounting opening among the at least two mounting openings is configured to form a portion of a detector compartment for accommodating the detector, and a second mounting opening among the at least two mounting openings is configured to form a portion of an emitter compartment for accommodating the emitter.

[0089] Embodiment 13: The spectrometer housing according to any one of the preceding embodiments, wherein the size of the spectrometer housing is configured to fit within a volume v≤1.5 cm 3 , specifically v≤1.125cm 3 , more specifically v≤0.9cm 3 , more specifically v≤0.5cm 3 inside the cuboid.

[0090] Embodiment 14: A spectrometer module comprising at least one detector, at least one emitter, and at least one spectrometer housing according to any of the preceding embodiments relating to spectrometer housings.

[0091] Embodiment 15: The spectrometer module according to the previous embodiment, wherein the spectrometer module further comprises at least one substrate, specifically a circuit carrier, more specifically a printed circuit board, wherein the emitter, the detector and the spectrometer housing are arranged on the substrate, wherein the emitter is enclosed in a first mounting opening of the at least two mounting openings of the spectrometer housing, and wherein the detector is enclosed in a second mounting opening of the at least two mounting openings of the spectrometer housing.

[0092] Embodiment 16: A spectrometer module according to any one of the preceding embodiments relating to a spectrometer module, wherein the spectrometer module is dimensioned to fit within a volume v≤1.5 cm 3 , specifically v≤1.125cm 3 , more specifically v≤0.9cm 3 , more specifically v≤0.5cm 3 inside the cuboid.

[0093] Embodiment 17: A method of manufacturing at least one spectrometer housing configured to at least partially enclose a detector and an emitter of a spectrometer module, the method comprising:

[0094] a) integrally forming the frame element and the partition element;

[0095] b) providing a cover element, wherein the cover element and the frame element form an entrance opening and at least two mounting openings, and wherein the mounting openings are separated by a separation element;

[0096] c) depositing a reflector element on at least a portion of one or both of the cover element and the frame element.

[0097] Embodiment 18: The method according to the preceding embodiment, wherein step c) further comprises fixing the reflector element to an inner surface of one or both of the cover element and the frame element.

[0098] Embodiment 19: The method according to the previous embodiment, wherein step c) includes one or more of the following methods: molding, mounting and gluing the reflector element to one or both of the cover element and the frame element, specifically to the inner surface of one or both of the cover element and the frame element.

[0099] Embodiment 20: The method according to any one of the aforementioned method embodiments, wherein the cover element and the frame element are formed integrally, specifically integrally formed through a molding process.

[0100] Embodiment 21: A method according to any one of the aforementioned method embodiments, wherein one or more of steps a) and b) includes performing a molding process selected from the group consisting of: an injection molding process, a low-pressure molding process, a compression molding process, a transfer molding process, a membrane-assisted molding process (i.e., a membrane-assisted selective molding process), a thermoforming process, and a rotational molding process.

[0101] Embodiment 22: The method according to any one of Embodiments 18 to 20, wherein step b) further comprises providing the reflector element, wherein the reflector element and the cover element are the same element.

[0102] Embodiment 23: A method according to any one of the above method embodiments, wherein the method further comprises:

[0103] d) Providing an interface element and covering the entrance opening with the interface element.

[0104] Embodiment 24: The method according to any one of the above method embodiments, wherein the method is configured for manufacturing a spectrometer housing according to any one of the above embodiments relating to a spectrometer housing.

[0105] Embodiment 25: A method for manufacturing a spectrometer module, the method comprising:

[0106] i) performing the method for manufacturing at least one spectrometer housing according to any one of the preceding method embodiments;

[0107] ii) providing at least one emitter and at least one detector on at least one substrate, in particular on a circuit carrier, more particularly on a printed circuit board;

[0108] iii) arranging the spectrometer housing on the at least one substrate so that the emitter is enclosed in a first mounting opening of the at least two mounting openings of the spectrometer housing, in particular in an emitter compartment, and the detector is enclosed in a second mounting opening of the at least two mounting openings of the spectrometer housing, in particular in a detector compartment.

[0109] Embodiment 26: The method according to the preceding embodiment, wherein step iii) further comprises fixing the spectrometer housing to the substrate by performing a bonding process selected from the group consisting of: gluing and welding.

[0110] Embodiment 27: The method according to any one of the two preceding embodiments, wherein the method is configured to manufacture a spectrometer module according to any one of the preceding embodiments involving a spectrometer module. BRIEF DESCRIPTION OF THE DRAWINGS

[0111] Other optional features and embodiments are preferably disclosed in more detail in the subsequent description of the embodiments in conjunction with the dependent claims. Wherein, as the skilled person will recognize, the corresponding optional features can be implemented in an independent manner and in any arbitrary feasible combination. The scope of the present invention is not limited by the preferred embodiments. The embodiments are schematically depicted in the accompanying drawings. Wherein, the same reference numerals in these drawings represent the same or functionally equivalent elements.

[0112] In the attached picture:

[0113] Figure 1 A schematic diagram showing an exemplary embodiment of a spectrometer module is shown;

[0114] Figure 2 A schematic diagram showing another exemplary embodiment of a spectrometer module is shown;

[0115] Figure 3 An exemplary embodiment of a spectrometer housing is shown;

[0116] Figure 4 A flow chart illustrating an embodiment of a method of manufacturing a spectrometer housing; and

[0117] Figure 5 A flow chart illustrating an embodiment of a method of manufacturing a spectrometer is shown. DETAILED DESCRIPTION

[0118] Figure 1 1 shows a schematic diagram of an exemplary embodiment of a spectrometer module 110. The spectrometer module 110 includes at least one detector 112, at least one emitter 114, and at least one spectrometer housing 116 according to any of the embodiments related to the spectrometer housing 116 described in further detail above or below. With regard to the spectrometer housing 116 of the spectrometer module 110, reference may also be made to Figure 3 , which shows an exemplary embodiment of a spectrometer housing 116 in isolation. Figure 2 A schematic diagram of another exemplary embodiment of a spectrometer module 110 is shown. Thus, at least in many aspects, the Figure 1 and Figure 2 Further, in particular, with respect to the spectrometer housing 116, at least in many aspects, can and will be described together below. Figures 1 to 3 .

[0119] The spectrometer module 110 may further include at least one substrate 118, in particular a circuit carrier 120, more particularly a printed circuit board 122. The emitter 114, the detector 112 and optionally also the spectrometer housing 116 may be arranged on the substrate 118. The emitter 114 may be enclosed in a first mounting opening of at least two mounting openings 124 of the spectrometer housing 116, and the detector 112 may be enclosed in a second mounting opening of at least two mounting openings 124 of the spectrometer housing 116. The spectrometer module 110 may include at least one optical filter element 126 and / or any other type of wavelength selective element. The optical filter element 126 may be configured to filter the light 128 or more particularly at least one selected spectral range of the light 128. The at least one optical filter element 126 may be specifically positioned in the light path before the detector 112. Thus, the optical filter element 126 may at least partially cover the detector 112. The spectrometer module 110 may be sized to fit in a volume v≤1.5 cm 3 , specifically v≤1.125cm 3 , more specifically v≤0.9cm 3 , more specifically v≤0.5cm 3 As an example, the spectrometer housing may have dimensions of 1.5 cm x 1.5 cm x 0.5 cm or 1 cm x 1 cm x 0.5 cm. Thus, the spectrometer module 110 may be miniaturized. Such dimensions may specifically allow the spectrometer module 110 to be integrated into consumer electronics products such as smartphones, wearable devices, or tablet computers.

[0120] The spectrometer housing 116 is configured to at least partially enclose at least one detector 112 and at least one emitter 114 of the spectrometer module 110. The spectrometer housing 116 includes a frame element 130. The spectrometer housing 116 includes a cover element 132 connected to the frame element 130. The spectrometer housing 116 includes a partition element 134 arranged in the frame element 130. The spectrometer housing 116 includes a reflector element 136, which is arranged on at least a portion of one or both of the cover element 132 and the frame element 130. An entrance opening 138 is formed by at least the cover element 132 and the frame element 130. On the side opposite to the entrance opening 138, at least two mounting openings 124 are formed by at least the cover element 132 and the frame element 130. The at least two mounting openings 124 are separated by the partition element 134. The frame element 130 and the partition element 134 are integrally formed of the same material.

[0121] The cover member 132 and the frame member 130 may be integrally formed of the same material. Figure 3As shown, the frame element 130, the cover element 132 and the partition element 134 can be integrally formed from the same material, for example by using a molding process (such as an injection molding process), as will be described below. The frame element 130 and the partition element 134 and optionally the cover element 132 may include at least one material selected from the group consisting of: a polycarbonate material, an epoxy resin material, a metal material, or any other material that can be manufactured by molding or printing techniques to form an element. At least one surface of the frame element 130 and the partition element 134 and optionally the cover element 132 can be configured to reflect less than 6% of the light 128 emitted by the emitter 114 and impinging on the surface. The frame element 130 and the cover element 132 can laterally surround the detector 112 and the emitter 114 of the spectrometer module 110. Therefore, the frame element 130 and the cover element 132 can at least partially mechanically cover the spectrometer module 110. The partition element 134 can be centrally positioned in the spectrometer module 110, specifically between the detector 112 and the emitter 114, as shown in FIG. Figure 1 and Figure 2 The partition element 134 can be configured to block the light 128 emitted from the emitter 114 from being transmitted through the partition element 130, specifically blocking the direct light path between the emitter 114 and the detector 112, for example in such a way that the transmission spectrum is within a measurable noise level, for example, the transmittance T should be about 10 -2 Up to 10 -4 , that is 10 -2 ≤T≤10 -4 .

[0122] At least two mounting openings 124 may be formed by the frame element 130, the cover element 132, and the partition element 134, for example, by using the arrangement described above. A first mounting opening of the at least two mounting openings 124 may be configured to form a portion of a detector compartment 140 for receiving the detector 112, and a second mounting opening of the at least two mounting openings 124 may be configured to form a portion of an emitter compartment 142 for receiving the emitter 114. The spectrometer housing 116 may be sized to fit within a volume v≤1.5 cm 3 , specifically v≤1.125cm 3 , more specifically v≤0.9cm 3 , more specifically v≤0.5cm 3As an example, the spectrometer housing 116 may have dimensions of 1.5 cm x 1.5 cm x 0.5 cm or 1 cm x 1 cm x 0.5 cm. Thus, the spectrometer housing 116 may be miniaturized, in particular for integrating the spectrometer module 110 into consumer electronic products. The spectrometer housing 116 further includes an interface element 144 configured to cover the incident opening 138. In particular, the interface element may be positioned to directly contact the frame element 130, such as Figure 1 or may be positioned at a certain distance from the frame element 130, such as Figure 2 As an example, the interface element 144 may be part of the spectrometer module 110 in addition to being part of the spectrometer housing 116 , such as part of a cover glass on a smartphone, tablet or wearable device.

[0123] As described, the spectrometer housing 116 includes a reflector element 136. The reflector element 136 can be configured to at least partially reflect the light 128 emitted by the emitter 114. The reflector element 136 can include a metal material selected from the group consisting of: gold, silver, aluminum, and any alloy. The reflector element 136 can be fixed to one or both of the cover element 132 and the frame element 130, specifically to the inner surface of one or both of the cover element 132 and the frame element 130. The reflector element 136 can be fixed by one or more of a form-fitting connection, an adhesive connection, and a press-fit connection. Figure 1 As shown, the reflector element 136 can, for example, be connected to the inner surface of the cover element 132. Further, the cover element 132 and the reflector element 136 can be the same element, for example Figure 2 As shown. For example, in this case, the cover element 132 and the frame element 130 may not be integrally formed of the same material. The cover element 132 may include at least one metal material. As an example, the cover element 132 may be formed by using a metal material using a molding process, and the frame element 130 may be formed by using a synthetic plastic material using a molding process. As another example, the inner surface of the cover element 132 may be metallized.

[0124] about Figure 1 and Figure 2, the optical path of light 128 will be described below. Light 128 can be emitted by using emitter 114, specifically at least partially emitted toward reflector element 136. As already described, the direct optical path to detector 112 can be blocked by separator element 134. Light 128 can be reflected at least partially toward interface element 144 from reflector element 136. Light 128 can be at least partially transmitted through interface element 144. Light 128 can be at least partially reflected by interface element 144. Specifically, light 128 can interact with a measurement object, which can be located on top of interface element 144, i.e., on a surface of interface element 144 facing away from detector 112 and emitter 114. Specifically, light 128 that has at least partially interacted with the measurement object can indicate at least one physical property of the measurement object. As an example, the spectral absorption of light 128 can indicate the chemical composition of the measurement object. The measurement object can at least partially reflect light 128, specifically at least partially toward detector 112 covered by optical filter element 126. The detector 112 may transmit a corresponding signal (eg, an electronic signal) to the printed circuit board 122 for further processing, evaluation, and / or transmission to another device.

[0125] Figure 4 A flow chart of an embodiment of a method of manufacturing a spectrometer housing 116 configured to at least partially enclose a detector 112 and an emitter 114 of a spectrometer module 110 is shown. The method includes:

[0126] a) (indicated by reference numeral 148) integrally forming the frame element 130 and the partition element 134;

[0127] b) (indicated by reference numeral 150) providing a cover element 132, wherein the cover element 132 and the frame element 130 form an entrance opening 138 and at least two mounting openings 124, and wherein the mounting openings 124 are separated by separation elements 134;

[0128] c) (indicated by reference numeral 152 ) depositing a reflector element 136 on at least a portion of one or both of the cover element 132 and the frame element 130 .

[0129] The method steps may be performed in the order indicated. However, it should be noted that a different order is also possible. The method may include additional method steps that are not listed. Further, one or more of the method steps may be performed once or repeatedly. Further, two or more of the method steps may be performed simultaneously or in a time-overlapping manner.

[0130] Step c) may further include fixing the reflector element 136 to the inner surface of one or both of the cover element 132 and the frame element 130. Step c) may include one or more of the following ways: molding, mounting and gluing the reflector element 136 to one or both of the cover element 132 and the frame element 130, specifically to the inner surface of one or both of the cover element 132 and the frame element 130. Further, the cover element 132 and the frame element 130 may be integrally formed, specifically integrally formed by a molding process. One or more of steps a) and b) may include performing a molding process selected from the group consisting of: an injection molding process, a low pressure molding process, a compression molding process, a transfer molding process, a film assisted molding process (i.e., a film assisted selective molding process), a thermoforming process, and a rotational molding process. Step b) may further include providing the reflector element 136, wherein the reflector element 136 and the cover element 132 are the same element. The method may be configured to manufacture a spectrometer housing 116 according to any of the embodiments related to the spectrometer housing 116 described in further detail above or below. The method may further include:

[0131] d) (indicated by reference numeral 154 ) providing an interface element 144 and covering the entrance opening 138 with the interface element 144 .

[0132] Figure 5 A flow chart of an embodiment of a method of manufacturing a spectrometer module 110 is shown. The method comprises:

[0133] i) (indicated by reference numeral 156) performing a method for manufacturing a spectrometer housing 116 according to any one of the embodiments relating to a method for manufacturing a spectrometer housing 116 disclosed in further detail above or below;

[0134] ii) (indicated by reference numeral 158 ) providing at least one emitter 114 and at least one detector 112 on at least one substrate 118 , in particular on a circuit carrier 120 , more particularly on a printed circuit board 122 ;

[0135] iii) (indicated by reference numeral 160) the spectrometer housing 116 is arranged on at least one substrate 118 so that the emitter 114 is enclosed in a first mounting opening of at least two mounting openings 124 of the spectrometer housing 116, specifically in the emitter compartment 142, and the detector 112 is enclosed in a second mounting opening of at least two mounting openings 124 of the spectrometer housing 116, specifically in the detector compartment 140.

[0136] The method steps may be performed in the order indicated. However, it should be noted that a different order is also possible. The method may include additional method steps that are not listed. Further, one or more of the method steps may be performed once or repeatedly. Further, two or more of the method steps may be performed simultaneously or in a time-overlapping manner.

[0137] Step iii) may further comprise fixing the spectrometer housing 116 to the base plate 118 by performing a bonding process selected from the group consisting of: gluing and welding. The method may be configured for manufacturing a spectrometer module 110 according to any of the embodiments relating to the spectrometer module 110 described above or in further detail below.

[0138] List of Reference Numerals

[0139] 110 Spectrometer Module

[0140] 112 Detector

[0141] 114 Transmitter

[0142] 116 Spectrometer housing

[0143] 118 substrate

[0144] 120 Circuit carrier

[0145] 122 Printed Circuit Board

[0146] 124 Mounting opening

[0147] 126 Optical filter elements

[0148] 128 Light

[0149] 130 frame elements

[0150] 132 Cover element

[0151] 134 Separator

[0152] 136 reflector element

[0153] 138 Entrance opening

[0154] 140 Detector compartment

[0155] 142 Transmitter compartment

[0156] 144 Interface components

[0157] 148 Method step a)

[0158] 150 Method step b)

[0159] 152 Method step c)

[0160] 154 Method step d)

[0161] 156 Method step i)

[0162] 158 Method step ii)

[0163] 160 Method step iii)

Claims

1. A spectrometer housing (116) configured to at least partially enclose at least one detector (112) and at least one emitter (114) of a spectrometer module (110), the spectrometer housing (116) comprising: - a frame element (130); - a cover element (132) connected to the frame element (130); - a partition element (134) arranged within the frame element (130); a reflector element (136) arranged on at least a portion of one or both of the cover element (132) and the frame element (130), wherein the reflector element (136) comprises a metallic material selected from the group consisting of: gold, silver, aluminum, and any other metal suitable for producing a metallized surface, and -Interface components (144) The incident opening (138) is formed by at least the cover element (132) and the frame element (130), the frame element (130) and the cover element (132) are identical, at least two mounting openings (124) are formed by at least the cover element (132) and the frame element (130) on the side opposite to the incident opening (138), the at least two mounting openings (124) are separated by the partition element (134), and the frame element (130) and the partition element (134) are integrally formed of the same material, and the interface element (144) is configured to cover the incident opening (138).

2. The spectrometer housing (116) according to the preceding claim, wherein: The reflector element (136) is secured to one or both of the cover element (132) and the frame element (130).

3. The spectrometer housing (116) according to any one of the preceding claims, wherein: A first mounting opening of the at least two mounting openings (124) is configured to form a portion of a detector compartment (140) for receiving the detector (112), and a second mounting opening of the at least two mounting openings (124) is configured to form a portion of an emitter compartment (142) for receiving the emitter (114).

4. The spectrometer housing (116) according to any one of the preceding claims, wherein: The spectrometer housing (116) is dimensioned to fit within a volume v≤1.5 cm 3 inside the rectangular block.

5. A spectrometer module (110) comprising at least one detector (112), at least one emitter (114) and at least one spectrometer housing (116) according to any one of the preceding claims.

6. The spectrometer module (110) according to the preceding claim, wherein: The spectrometer module (110) further comprises at least one substrate (118), wherein the emitter (114), the detector (112) and the spectrometer housing (116) are arranged on the substrate (118), wherein the emitter (114) is enclosed in a first mounting opening of the at least two mounting openings (124) of the spectrometer housing (116), and wherein the detector (112) is enclosed in a second mounting opening of the at least two mounting openings (124) of the spectrometer housing (116).

7. The spectrometer module (110) according to any one of the preceding claims relating to a spectrometer module (110), wherein: The spectrometer module (110) is sized to fit within a volume v≤1.5 cm 3 inside the rectangular block.

8. A method of manufacturing at least one spectrometer housing (116), the at least one spectrometer housing being configured to at least partially enclose a detector (112) and an emitter (114) of a spectrometer module (110), the method comprising: a) integrally forming a frame member (130) and a partition member (134); b) providing a cover element (132), wherein the cover element (132) and the frame element (130) form an entrance opening (138) and at least two mounting openings (124), and wherein the mounting openings (124) are separated by the separation element (134), wherein the frame element (130) and the cover element (132) are identical; c) depositing a reflector element (136) on at least a portion of one or both of the cover element (132) and the frame element (130), wherein the reflector element (136) comprises a metallic material selected from the group consisting of: gold, silver, aluminum, and any other metal suitable for producing a metallized surface.

9. The method according to the preceding claim, wherein: Step c) further includes securing the reflector element (136) to an inner surface of one or both of the cover element (132) and the frame element (130).

10. The method according to the preceding claim, wherein: Step c) includes one or more of the following: molding, mounting and gluing the reflector element (136) to one or both of the cover element (132) and the frame element (130).

11. A method according to any one of the preceding method claims, wherein: The cover member (132) and the frame member (130) are integrally formed.

12. A method according to any one of the preceding method claims, wherein: The method further comprises: d) Providing an interface element (144) and covering the entrance opening (138) with the interface element (144).

13. A method of manufacturing a spectrometer module (110), the method comprising: i) carrying out the method for producing at least one spectrometer housing (116) according to any of the preceding method claims; ii) providing at least one emitter (114) and at least one detector (112) on at least one substrate (118); iii) arranging the spectrometer housing (116) on the at least one substrate (118) such that the emitter (114) is enclosed in a first mounting opening of the at least two mounting openings (124) of the spectrometer housing (116), and the detector (112) is enclosed in a second mounting opening of the at least two mounting openings (124) of the spectrometer housing (116).

14. The method according to the preceding claim, wherein: Step iii) further comprises fixing the spectrometer housing (116) to the base plate (118) by performing a bonding process selected from the group consisting of: gluing and welding.

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