Silicon wafer processing equipment

Abstract

The invention provides silicon wafer processing equipment, and belongs to the technical field of semiconductors. Comprising a grinding wheel internally provided with a containing space, at least one groove is formed in the inner wall of the grinding wheel in a concave mode, and the cross section of each groove is round and parallel to the horizontal plane; the positioning workbench is arranged in the accommodating space, the positioning workbench is used for fixing a silicon wafer to be processed, and the edge of the silicon wafer extends into one of the grooves; the first driving mechanism is connected with the positioning workbench; the control mechanism is connected with the first driving mechanism; wherein the control mechanism is used for sending a first signal to the first driving mechanism, and the first signal is used for controlling the first driving mechanism to drive the positioning workbench to rotate on the horizontal plane and drive the silicon wafer to rotate, so that the edge of the silicon wafer and the groove are subjected to opposite grinding. According to the technical scheme, the problem that the uniformity of the edge morphology of the silicon wafer is difficult to guarantee in the existing silicon wafer processing can be solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to silicon wafer processing equipment. Background Art

[0002] At present, the mainstream method of silicon wafer chamfering is to set a grinding wheel with a groove to grind against the silicon wafer, and copy the shape of the groove to the silicon wafer. However, in this processing method, due to the limited contact area between the silicon wafer and the grinding wheel during grinding, it is difficult to ensure that the edge morphology of the silicon wafer is completely uniform during grinding, and the edge morphology of the same silicon wafer may also be uneven.

[0003] With the development of the chip field, the chip's requirements for the physical dimensions of the silicon wafer edge morphology have also increased. The uniformity of the silicon wafer edge morphology has become a huge pain point in the chamfering process. Summary of the invention

[0004] The invention provides a silicon wafer processing device, which solves the problem that it is difficult to ensure the uniformity of the edge morphology of the silicon wafer in the existing silicon wafer processing.

[0005] In order to achieve the above object, the technical solution adopted in the embodiment of the present invention is:

[0006] A silicon wafer processing device, comprising:

[0007] A grinding wheel, wherein a containing space is provided inside, and the inner wall of the grinding wheel is concavely provided with at least one groove, and the cross section of each groove is circular, and the cross section is parallel to the horizontal plane;

[0008] A positioning workbench, disposed in the accommodating space, the positioning workbench is used to fix the silicon wafer to be processed, and the edge of the silicon wafer extends into one of the grooves;

[0009] A first driving mechanism connected to the positioning workbench;

[0010] A control mechanism connected to the first driving mechanism;

[0011] The control mechanism is used to send a first signal to the first driving mechanism, and the first signal is used to control the first driving mechanism to drive the positioning workbench to rotate on the horizontal plane, thereby driving the silicon wafer to rotate so that the edge of the silicon wafer is rubbed against the groove.

[0012] In some embodiments, the number of the grooves is greater than or equal to, and the diameters of the cross sections of different grooves are different.

[0013] In some embodiments, the inner wall of the grinding wheel is in the shape of a truncated cone and gradually narrows from top to bottom in a direction perpendicular to the horizontal plane.

[0014] In some embodiments, the first driving mechanism is further used to drive the positioning workbench to move in a direction perpendicular to the horizontal plane.

[0015] In some embodiments, the silicon wafer processing equipment further comprises:

[0016] The silicon wafer conveying mechanism is used to transport the silicon wafer so that the edge of the silicon wafer is placed in one of the grooves or is separated from the groove.

[0017] In some embodiments, the silicon wafer transport mechanism includes:

[0018] A bracket, a mechanical arm, a telescopic assembly, a connecting piece, a transport workbench and a second driving mechanism;

[0019] Wherein, the mechanical arm is mounted on the bracket;

[0020] The telescopic assembly and the connecting member are fixedly mounted on the robot arm, one end of the telescopic assembly is connected to a first position point on the transport workbench, one end of the connecting member is connected to a second position point on the transport workbench, and a line connecting the first position point and the second position point passes through the center point of the transport workbench;

[0021] The transport workbench is used to fix the silicon wafer;

[0022] The second driving mechanism is connected to the control mechanism and the robotic arm respectively, and the control mechanism is also used to: send a second signal to the second driving mechanism, and the second signal is used to control the second driving mechanism to drive the robotic arm to move, so as to drive the silicon wafer fixed on the transport workbench to move.

[0023] In some embodiments, a retractable end of the retractable assembly is connected to the first position point;

[0024] The telescopic component is connected to the control mechanism, and the control mechanism is also used to: send a third signal to the telescopic component, and the third signal is used to adjust the length of the telescopic component so that the silicon wafer fixed on the transport workbench forms an angle with the horizontal plane.

[0025] In some embodiments, the telescopic assembly includes:

[0026] hydraulic rods and pumps;

[0027] Wherein, the retractable end of the hydraulic rod is connected to the first position point;

[0028] The pump is an air pump or a hydraulic pump, and the pump is connected to the hydraulic rod and the control mechanism respectively. The pump is used to receive the third signal and adjust the length of the hydraulic rod according to the third signal.

[0029] In some embodiments, the transport workbench fixes the silicon wafer by adsorption.

[0030] In some embodiments, the positioning workbench fixes the silicon wafer by adsorption.

[0031] The beneficial effects of the present invention are:

[0032] In this embodiment, a circular groove is concavely formed on the inner wall of the grinding wheel, and the silicon wafer to be processed is fixed on the positioning workbench, and the edge of the silicon wafer extends into the groove. The control mechanism sends a first signal to the first driving mechanism, thereby controlling the first driving mechanism to drive the positioning workbench to rotate on a horizontal plane, driving the silicon wafer to rotate, so that the edge of the silicon wafer is ground against the groove. In this way, when the edge of the silicon wafer is ground against the groove, the edge of the silicon wafer is surrounded in the groove, so the uniformity of the edge morphology of the silicon wafer after processing can be well guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram showing a silicon wafer chamfering process in the prior art;

[0034] Figure 2 A schematic structural diagram of a silicon wafer processing device according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0036] like Figure 1 As shown, in the prior art, during the chamfering process of silicon wafers, a grinding wheel 01 with a specific groove shape is used to grind against a silicon wafer 02. The grinding wheel 01 and the silicon wafer 02 rotate simultaneously, and the groove of the grinding wheel 01 is copied to the edge of the silicon wafer 02. In this processing method, since the contact area between the silicon wafer 02 and the grinding wheel 01 is small, during the processing, the grinding wheel 01 and the silicon wafer 02 are in high-speed rotation, and it is difficult to ensure the processing accuracy, so the edge morphology of the same silicon wafer 02 is uneven.

[0037] In order to solve the above technical problems, an embodiment of the present invention provides a silicon wafer processing device, which can solve the problem that it is difficult to ensure the uniformity of the edge morphology of the silicon wafer in the existing silicon wafer processing.

[0038] like Figure 2As shown, an embodiment of the present invention provides a silicon wafer processing device, including: a grinding wheel 1, a positioning workbench 2, a first driving mechanism 4 and a control mechanism.

[0039] The grinding wheel 1 has an accommodating space inside, and the inner wall of the grinding wheel 1 is concavely provided with at least one groove, each of the grooves has a circular cross section, and the cross section is parallel to the horizontal plane.

[0040] It should be noted that the groove is a groove formed by being recessed inwardly on the inner wall of the grinding wheel 1, and its specific size (such as depth and curvature) can be determined according to actual production requirements. The main function of the groove is to grind the edge of the silicon wafer 3, thereby realizing the processing and control of the edge morphology of the silicon wafer 3. In some specific embodiments, a shaping sheet with a specific groove shape can be used to replicate the target morphology in a groove of a target diameter.

[0041] The positioning workbench 2 is arranged in the accommodating space, and is used to fix the silicon wafer 3 to be processed, and the edge of the silicon wafer 3 extends into one of the grooves. Specifically, the positioning workbench 2 can fix the silicon wafer 3 by adsorption.

[0042] The first driving mechanism 4 is connected to the positioning workbench 2 , and the first driving mechanism 4 is used to drive the positioning workbench 2 .

[0043] The control mechanism is connected to the first driving mechanism 4. The control mechanism is used to send a first signal to the first driving mechanism 4, and the first signal is used to control the first driving mechanism 4 to drive the positioning table 2 to rotate on the horizontal plane, driving the silicon wafer 3 to rotate, so that the edge of the silicon wafer 3 is rubbed against the groove.

[0044] It should be noted that, since the silicon wafer processing equipment expands the contact area between the silicon wafer 3 and the grinding wheel 1 during the processing of the silicon wafer 3, the edge of the silicon wafer 3 is surrounded by the inner circle of the grinding wheel 1 (that is, a circle of grooves arranged on the inner wall of the grinding wheel 1), thereby greatly improving the uniformity of the edge of the silicon wafer after grinding, and avoiding damage that may be caused by inconsistent silicon wafer edges during the chip manufacturing process.

[0045] In this embodiment, the inner wall of the grinding wheel 1 is concavely provided with a circular groove, the silicon wafer 3 to be processed is fixed on the positioning workbench 2, the edge of the silicon wafer 3 extends into the groove, and the control mechanism sends a first signal to the first driving mechanism 4, thereby controlling the first driving mechanism 4 to drive the positioning workbench 2 to rotate on a horizontal plane, driving the silicon wafer 3 to rotate, so that the edge of the silicon wafer 3 is ground against the groove, so that the edge of the silicon wafer 3 forms a specific morphology. In this way, when the edge of the silicon wafer 3 is ground against the groove, the edge of the silicon wafer 3 is surrounded in the groove, so that the uniformity of the edge morphology of the silicon wafer after processing can be well guaranteed.

[0046] In some embodiments, the inner wall of the grinding wheel 1 is in the shape of a truncated cone and gradually narrows from top to bottom in a direction perpendicular to the horizontal plane.

[0047] In some specific embodiments, Figure 2 As shown, the grinding wheel 1 may be a hollow truncated cone or a funnel-shaped one. Specifically, the structural features of the grinding wheel 1 may include: in the vertical direction (i.e., in the direction perpendicular to the horizontal plane), it is wide at the top and gradually narrows from top to bottom.

[0048] In some specific embodiments, the number of the grooves is greater than or equal to 2, and the diameters of the cross sections of different grooves are different.

[0049] That is to say, the grinding wheel 1 is provided with a plurality of grooves of different sizes in sequence from top to bottom in the vertical direction, so that silicon wafers 3 of different diameters can be processed through the grooves of different sizes.

[0050] In some embodiments, the first driving mechanism 4 is further used to drive the positioning workbench 2 to move in a direction perpendicular to the horizontal plane.

[0051] That is to say, in addition to driving the positioning table 2 to perform rotational motion, the first driving mechanism 4 can also drive the positioning table 2 to perform linear motion in the vertical direction (the direction perpendicular to the horizontal plane). The rotational motion of the positioning table 2 can drive the silicon wafer 3 to move relative to the grinding wheel 1 inside the grinding wheel 1, thereby grinding against the groove to chamfer the edge of the silicon wafer 3; the linear motion of the positioning table 2 in the vertical direction can adaptively match the silicon wafer 3 to grooves of different diameters (that is, grooves located at different positions on the inner wall of the grinding wheel 1). In this way, the silicon wafer 3 is processed in grooves of different diameters respectively until the silicon wafer 3 reaches the target diameter.

[0052] In some embodiments, the silicon wafer processing equipment further includes: a silicon wafer conveying mechanism 5 for conveying the silicon wafer so that an edge of the silicon wafer is placed into one of the grooves or is separated from the groove.

[0053] It should be noted that when the silicon wafer 3 needs to be processed, the silicon wafer conveying mechanism 5 can take the silicon wafer 3 from the place where the silicon wafer 3 to be processed is stored, and transport it to the grinding wheel 1. An opening is provided above the grinding wheel 1. The silicon wafer conveying mechanism 5 transports the silicon wafer 3 from the opening to the accommodating space of the grinding wheel 1, and places the silicon wafer 3 into a groove provided on the inner wall of the grinding wheel 1 so that the silicon wafer 3 can be processed using the groove.

[0054] It should also be noted that if multiple grooves are provided in the grinding wheel 1, the sizes of the multiple grooves decrease in sequence from top to bottom in the vertical direction, that is, the diameter of the cross section of the upper groove is greater than the diameter of the cross section of the lower groove. In this way, by designing grooves with multiple levels of diameters in the grinding wheel 1, after the upper groove is used to process the silicon wafer 3, the silicon wafer conveying mechanism 5 can take out the silicon wafer 3 from the groove and place it in the lower groove to continue processing the silicon wafer 3 until the silicon wafer 3 reaches the target diameter.

[0055] In some embodiments, the silicon wafer transport mechanism 5 includes: a bracket 501, a mechanical arm 502, a telescopic component 503, a connecting piece 504, a transport workbench 505 and a second driving mechanism.

[0056] Among them, the robotic arm 502 is installed on the bracket 501; the telescopic component 503 and the connecting member 504 are fixedly installed on the robotic arm 502, one end of the telescopic component 503 is connected to the first position point A on the conveying workbench 505, and one end of the connecting member 504 is connected to the second position point B on the conveying workbench 505, and the connecting line between the first position point A and the second position point B passes through the center point of the conveying workbench 505.

[0057] The transport workbench 505 is used to fix the silicon wafer 3. Specifically, the transport workbench 505 can fix the silicon wafer 3 by adsorption.

[0058] The second driving mechanism is connected to the control mechanism and the robot arm 502 respectively, and the control mechanism is also used to: send a second signal to the second driving mechanism, and the second signal is used to control the second driving mechanism to drive the robot arm 502 to move, so as to drive the silicon wafer 3 fixed on the transport workbench 505 to move.

[0059] In this embodiment, the control mechanism can control the second driving mechanism to drive the robot arm 502 to move, so as to drive the telescopic component 503 and the connecting part 504 installed on the robot arm 502 to move, and the transport workbench 505 is connected to the robot arm 502 through the telescopic component 503 and the connecting part 504, so the transport workbench 505 will also move with the robot arm 502, and the transport workbench 505 can absorb the silicon wafer 3, so that the silicon wafer 3 can be taken and placed.

[0060] For example, the control mechanism can control the second driving mechanism to drive the robot arm 502 to move to the place where the silicon wafer 3 to be processed is stored. After the transport workbench 505 adsorbs the silicon wafer 3, the control mechanism controls the second driving mechanism to drive the robot arm 502 to move to the position of the grinding wheel 1 to take away the silicon wafer 3; after the silicon wafer 3 is transported to the grinding wheel 1, the control mechanism controls the second driving mechanism to drive the robot arm 502 to descend, and the transport workbench 505 adsorbs the silicon wafer 3 and descends, enters the accommodating space of the grinding wheel 1 from the opening above the grinding wheel 1, and places the silicon wafer 3 into a groove set on the inner wall of the grinding wheel 1, so as to use the groove to process the silicon wafer 3.

[0061] In some embodiments, the retractable end of the telescopic component 503 is connected to the first position point A; the telescopic component 503 is connected to the control mechanism, and the control mechanism is also used to: send a third signal to the telescopic component 503, and the third signal is used to adjust the length of the telescopic component 503 so that the silicon wafer 3 fixed on the transport workbench 505 forms an angle with the horizontal plane.

[0062] It should be noted that the telescopic component 503 is telescopic. Figure 2 As shown, when the transporting workbench 505 is placed horizontally, if the telescopic component 503 is controlled to shorten, the transporting workbench 505 will tilt to a certain extent, and the end where the first position point A is located will tilt upward. Since the silicon wafer 3 is adsorbed on the transporting workbench 505, the silicon wafer 3 will also tilt along with the transporting workbench 505. In this way, the silicon wafer 3 can be smoothly placed in the groove or taken out of the groove in an inclined manner. For example, after the silicon wafer 3 is placed in the groove, the telescopic component 503 can be controlled to extend until the transporting workbench 505 is horizontal.

[0063] Similarly, when the transport workbench 505 is placed horizontally, if the telescopic component 503 is extended, the transport workbench 505 will tilt to a certain extent, the end where the first position point A is located will be pressed downward, and the silicon wafer 3 will also tilt with the transport workbench 505 to facilitate taking and placing the silicon wafer 3. The specific process will not be repeated here.

[0064] In some embodiments, the telescopic assembly 503 includes: a hydraulic rod and a pump; wherein, the telescopic end of the hydraulic rod is connected to the first position point A; the pump is an air pump or a hydraulic pump, and the pump is respectively connected to the hydraulic rod and the control mechanism, and the pump is used to receive the third signal and adjust the length of the hydraulic rod according to the third signal.

[0065] In this embodiment, the inner wall of the grinding wheel 1 is concavely provided with circular grooves of different sizes from top to bottom, and the control mechanism can control the silicon wafer conveying mechanism 5 to transport the silicon wafer 3 to be processed to the grinding wheel 1 and place it in the groove, so that the edge of the silicon wafer 3 extends into the groove; the control mechanism controls the first driving mechanism 4 to drive the positioning table 2 to move in the vertical direction to the position of the silicon wafer 3, and the positioning table 2 absorbs the silicon wafer 3. The control mechanism controls the first driving mechanism 4 to drive the positioning table 2 to rotate on the horizontal plane, driving the silicon wafer 3 to rotate, so that the edge of the silicon wafer 3 is ground against the groove, so that the edge of the silicon wafer 3 forms a specific morphology. In this way, when the edge of the silicon wafer 3 is ground against the groove, the edge of the silicon wafer 3 is surrounded in the groove, so that the uniformity of the edge morphology of the silicon wafer after processing can be well guaranteed.

[0066] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0067] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0068] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0069] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0070] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A silicon wafer processing equipment, characterized in that: include: A grinding wheel (1) having an accommodating space therein, wherein the inner wall of the grinding wheel (1) is concavely provided with at least one groove, each of the grooves having a circular cross section and the cross section being parallel to a horizontal plane; A positioning workbench (2) is arranged in the accommodating space, the positioning workbench (2) is used to fix a silicon wafer (3) to be processed, and an edge of the silicon wafer (3) extends into one of the grooves; A first driving mechanism (4) connected to the positioning workbench (2); A control mechanism connected to the first driving mechanism (4); The control mechanism is used to send a first signal to the first drive mechanism (4), and the first signal is used to control the first drive mechanism (4) to drive the positioning workbench (2) to rotate on the horizontal plane, thereby driving the silicon wafer (3) to rotate, so that the edge of the silicon wafer (3) is rubbed against the groove.

2. The silicon wafer processing equipment according to claim 1, characterized in that: The number of the grooves is greater than or equal to 2, and the diameters of the cross sections of different grooves are different.

3. The silicon wafer processing equipment according to claim 1 or 2, characterized in that: The inner wall of the grinding wheel (1) is in the shape of a truncated cone and gradually narrows from top to bottom in a direction perpendicular to the horizontal plane.

4. The silicon wafer processing equipment according to claim 2, characterized in that: The first driving mechanism (4) is also used to drive the positioning workbench (2) to move in a direction perpendicular to the horizontal plane.

5. The silicon wafer processing equipment according to claim 1, characterized in that: Also includes: The silicon wafer conveying mechanism (5) is used for conveying the silicon wafer so that the edge of the silicon wafer is placed in one of the grooves or is separated from the groove.

6. The silicon wafer processing equipment according to claim 5, characterized in that: The silicon wafer conveying mechanism (5) comprises: A support (501), a mechanical arm (502), a telescopic assembly (503), a connecting piece (504), a transport workbench (505) and a second driving mechanism; Wherein, the mechanical arm (502) is installed on the bracket (501); The telescopic component (503) and the connecting member (504) are fixedly mounted on the mechanical arm (502), one end of the telescopic component (503) is connected to a first position point on the transport workbench (505), one end of the connecting member (504) is connected to a second position point on the transport workbench (505), and a line connecting the first position point and the second position point passes through a center point of the transport workbench (505); The transport workbench (505) is used to fix the silicon wafer (3); The second driving mechanism is connected to the control mechanism and the robotic arm (502) respectively, and the control mechanism is also used to: send a second signal to the second driving mechanism, and the second signal is used to control the second driving mechanism to drive the robotic arm (502) to move, so as to drive the silicon wafer (3) fixed on the transport workbench (505) to move.

7. The silicon wafer processing equipment according to claim 6, characterized in that: A retractable end of the retractable component (503) is connected to the first position point; The telescopic component (503) is connected to the control mechanism, and the control mechanism is also used to: send a third signal to the telescopic component (503), and the third signal is used to adjust the length of the telescopic component (503) so that the silicon wafer (3) fixed on the transport workbench (505) forms an angle with the horizontal plane.

8. The silicon wafer processing equipment according to claim 7, characterized in that: The telescopic assembly (503) comprises: hydraulic rods and pumps; Wherein, the retractable end of the hydraulic rod is connected to the first position point; The pump is an air pump or a hydraulic pump, and the pump is connected to the hydraulic rod and the control mechanism respectively. The pump is used to receive the third signal and adjust the length of the hydraulic rod according to the third signal.

9. The silicon wafer processing equipment according to claim 6, characterized in that: The transport workbench (505) fixes the silicon wafer (3) by adsorption.

10. The silicon wafer processing equipment according to claim 1, characterized in that: The positioning workbench (2) fixes the silicon wafer (3) by adsorption.

Images