Electroplating equipment and electroplating method

Abstract

The invention belongs to the technical field of electroplating, and discloses electroplating equipment and an electroplating method.The electroplating equipment comprises an electroplating power source, an electroplating bath, an anode piece, a conductive adhesive tape and a cathode connecting piece, the electroplating bath is used for containing electroplating liquid, the anode piece is arranged in the electroplating liquid, and the conductive adhesive tape is arranged on the cathode connecting piece; when the plated part is electroplated, at least the plated surface is located in the electroplating liquid, the plated surface can directly face the anode part, the anode part is electrically connected with a positive electrode of an electroplating power supply, one end of the cathode connecting part is electrically connected with a negative electrode of the electroplating power supply, and the other end of the cathode connecting part is connected with one end of the conductive adhesive tape; the other end of the conductive adhesive tape is connected with a plated surface on a plated part; the conductive adhesive tape is located in the electroplating liquid, and the other end of the cathode connecting piece is also located in the electroplating liquid, so that the length of the conductive adhesive tape is shortened.

Description

Technical Field

[0001] The present invention relates to the field of electroplating technology, and in particular to an electroplating device and an electroplating method. Background Art

[0002] Forming metal grid lines on battery cells by electroplating technology is one of the current mainstream technologies. The principle is to set an anode in the electroplating solution and connect the anode to the positive electrode of the electroplating power supply, put the battery cell into the electroplating solution and connect the battery cell to the negative electrode of the electroplating power supply, so that the battery cell is set near the anode or can be moved near the anode, and then an electric field is formed between the anode and the battery cell, and the metal cations in the electroplating solution are deposited on the battery cell to form metal grid lines through the action of the electric field. The battery cell in the electroplating solution is generally connected to the negative electrode of the power supply through a conductive connector, such as a conductive clip, a conductive lead, a conductive roller, a conductive probe, etc. During the electroplating process of the battery cell, the connection point between the conductive connector and the battery cell will be electroplated, and even the entire surface of the conductive connector immersed in the electroplating solution will be electroplated, which makes the battery cell and the conductive connector easy to be electroplated. The battery cell is easily broken when the battery cell and the conductive connector are separated after the electroplating is completed; after the battery cell and the conductive connector are separated, the conductive connector needs to be de-plated to prevent the conductive connector after electroplating from affecting the electroplating effect of the subsequent battery cell.

[0003] To this end, the applicant has developed a conductive tape to replace the existing conductive connector. The conductive tape and the battery cell are connected flexibly or elastically, which is different from the existing rigid connection and can reduce the fragmentation rate of the battery cell. However, the conductive tape is expensive and the amount used is large, so it is necessary to reduce the amount and cost of the conductive tape. Summary of the invention

[0004] The object of the present invention is to provide an electroplating device that at least solves one of the technical problems in the background technology.

[0005] In order to achieve the above technical objectives, the present invention adopts the following technical solutions.

[0006] An embodiment of the present invention provides an electroplating device, including an electroplating power supply, an electroplating tank, an anode component, a conductive tape and a cathode connector, wherein the electroplating tank is used to contain a plating solution, the anode component is arranged in the plating solution, and during electroplating, at least a surface of the component to be plated is located in the plating solution and the surface to be plated can face the anode component, the anode component is electrically connected to the positive pole of the electroplating power supply, one end of the cathode connector is electrically connected to the negative pole of the electroplating power supply, the other end of the cathode connector is connected to one end of the conductive tape, and the other end of the conductive tape is connected to the surface to be plated on the component to be plated; the conductive tape is located in the plating solution, and the other end of the cathode connector is also located in the plating solution.

[0007] In some embodiments, the cathode connector is a conductive rod; one end of the conductive rod is electrically connected to the negative electrode of the electroplating power source through a wire, and one end of the conductive tape is bonded and electrically connected to the other end of the conductive rod.

[0008] In some embodiments, both ends of the conductive rod are exposed, and the middle portion of the conductive rod is covered with an insulating material layer.

[0009] In some embodiments, the cathode connector is a clamp; the clamp includes a first clamping portion and a second clamping portion, at least one of the first clamping portion and the second clamping portion is a conductive clamping portion; a conductive contact is provided on the clamping end of the conductive clamping portion, the conductive contact is connected to the negative pole of the power supply through an external wire or a built-in wire of the conductive clamping portion, and the surface of the conductive clamping portion is an insulating material layer or the surface of the conductive clamping portion immersed in the electroplating solution is an insulating material layer.

[0010] In some embodiments, a first sealing member is further provided on the clamping end of the conductive clamping portion and is arranged outside the conductive contact; in a working state, the clamping end of the first clamping portion and the clamping end of the second clamping portion respectively abut against two sides on one end of the conductive tape to clamp the conductive tape; the first sealing member arranged outside the conductive contact abuts against one side of the conductive tape to form a sealed space, and the conductive contact abuts against one side of the conductive tape.

[0011] In some embodiments, the conductive contact is a retractable structure, or the head or the entire conductive contact is made of conductive rubber material.

[0012] In some embodiments, the clamping end of the first clamping portion is referred to as a first clamping end, and the clamping end of the second clamping portion is referred to as a second clamping end;

[0013] The first clamping end is provided with a conductive contact and a first sealing member surrounding the conductive contact, and the second clamping end is provided with an insulating contact;

[0014] Alternatively, the second clamping end is provided with a conductive contact and a first sealing member surrounding the conductive contact, and the first clamping end is provided with an insulating contact;

[0015] Alternatively, a conductive contact and a first sealing member surrounding the conductive contact are disposed on both the first clamping end and the second clamping end.

[0016] In some embodiments, the conductive clamping portion includes a clamping seat, a first countersunk hole is provided on the top of the clamping seat, a first mounting hole is provided on a side wall of the clamping seat, the conductive contact is provided in the first mounting hole and partially extends out of the first mounting hole, the first countersunk hole is connected to the first mounting hole, an external conductive member is provided in the first countersunk hole, and one end of the external conductive member is mechanically and electrically connected to the conductive contact.

[0017] In some embodiments, the conductive contact includes a mounting seat and a telescopic member, the mounting seat is provided with a second mounting hole, a compressible medium or an elastic member is provided in the second mounting hole, one end of the telescopic member is provided in the second mounting hole and abuts against the compressible medium or the elastic member, and the other end of the telescopic member extends out of the second mounting hole; the telescopic member is slidably connected to the second mounting hole, and the telescopic member is electrically connected to the mounting seat.

[0018] In some embodiments, the mounting seat includes a first shaft segment, a second shaft segment and a third shaft segment connected in sequence; the shaft diameters of the first shaft segment, the second shaft segment and the third shaft segment increase in sequence; a first mounting hole is provided on the side wall of the clamping seat and transversely passes through the clamping seat; the third shaft segment extends out of one opening of the first mounting hole, and the first shaft segment extends out of another opening of the first mounting hole; the telescopic member is provided on the first shaft segment;

[0019] A third mounting hole is arranged around the second shaft segment, a second sealing member is sleeved in the third mounting hole, the second sealing member is an annular ring structure, an inner ring of the second sealing member abuts against the bottom of the third mounting hole, and an outer ring of the second sealing member abuts against the inner wall of the first mounting hole;

[0020] One end of the external conductive member is a ring-shaped structure, and one end of the external conductive member is sleeved on the second shaft segment.

[0021] In some embodiments, a fourth mounting hole is provided on the clamping end of the conductive clamping portion, and the fourth mounting hole is arranged around an opening of the telescopic member extending out of the second mounting hole. The first sealing member is an annular structure, and the first sealing member is clamped in the fourth mounting hole, and the surface of the first sealing member extends out of the fourth mounting hole.

[0022] In some embodiments, when the first clamping portion or the second clamping portion is an insulating clamping portion, an elastic abutment member is protruding from the clamping end of the insulating clamping portion.

[0023] In some embodiments, both sides of the workpiece to be plated are the plated surfaces, there are multiple cathode connectors, a portion of the cathode connectors are connected to one plated surface of the workpiece to be plated through conductive tape, and another portion of the cathode connectors are connected to another plated surface of the workpiece to be plated through conductive tape.

[0024] In some embodiments, the conductive tape includes a conductive functional layer, a first protective layer is arranged on the upper surface of the conductive functional layer and / or a second protective layer is arranged on the lower surface of the conductive functional layer; the conductive functional layer includes at least a conductive material layer and a conductive adhesive layer, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive material layer, and the conductive adhesive layer covers the entire or partial area on the lower surface of the conductive material layer; the lower surface of the conductive adhesive layer is formed as the lower surface of the conductive functional layer, and when the second protective layer is arranged on the lower surface of the conductive adhesive layer, the second protective layer does not completely cover the lower surface of the conductive adhesive layer.

[0025] In some embodiments, when a first protective layer is provided on the upper surface of the conductive functional layer, the first protective layer includes a first shielding layer and a first connecting adhesive layer, and the first shielding layer is connected to the upper surface of the conductive functional layer through the first connecting adhesive layer, or the first protective layer includes a first insulating coating, and the first insulating coating is connected to the upper surface of the conductive functional layer; when a second protective layer is provided on the lower surface of the conductive functional layer, the second protective layer includes a second shielding layer and a second connecting adhesive layer, and the second shielding layer is connected to the lower surface of the conductive functional layer through the second connecting adhesive layer, or the second protective layer includes a second insulating coating, and the second insulating coating is connected to the lower surface of the conductive functional layer.

[0026] In some embodiments, the conductive adhesive layer includes an adhesive and a conductive filler, the adhesive includes epoxy resin, phenolic resin, polyimide, acrylic resin or polyurethane, and the conductive filler includes carbon, metal or metal oxide, wherein the metal includes at least Au, Ag, Cu or Ni.

[0027] In some embodiments, the conductive adhesive layer further includes one or more of a curing agent, a diluent, a plasticizer, a coupling agent and a defoaming agent. When a plasticizer is included, the plasticizer includes at least di-n-octyl phthalate or di-n-butyl phthalate.

[0028] In some embodiments, at least two portions of the conductive functional layer are exposed, one of which is used for bonding the first conductive component and is called a first exposed portion, and the other is used for bonding or connecting the second conductive component and is called a second exposed portion;

[0029] The first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the lower surface of the other end of the conductive functional layer; or, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the upper surface of the other end of the conductive functional layer; or, the first exposed portion is a glue dew groove connected to the lower surface of the conductive functional layer, and the second exposed portion is the lower surface of the conductive functional layer away from the glue dew groove.

[0030] In some embodiments, the conductive tape is cylindrical or prism-shaped, including a conductive functional layer located at the center of the cylinder or prism, and a third protective layer wrapped around the conductive functional layer, wherein the third protective layer only wraps the middle section of the conductive functional layer and exposes both ends of the conductive functional layer.

[0031] On the other hand, an embodiment of the present invention further provides an electroplating device, comprising an electroplating power supply, an electroplating tank, an anode component, a conductive tape and a cathode connector, wherein the electroplating tank is used to hold the electroplating solution, the anode component is arranged in the electroplating solution, the anode component is electrically connected to the positive pole of the electroplating power supply, one end of the cathode connector is electrically connected to the negative pole of the electroplating power supply, the other end of the cathode connector can extend into a preset position in the electroplating solution to connect to one end of the conductive tape in the electroplating solution, and the other end of the conductive tape is connected to a plated surface on the plated component; when electroplating, at least the plated surface of the plated component is located in the electroplating solution and the plated surface is arranged opposite to the anode component.

[0032] In another aspect, an embodiment of the present invention further provides an electroplating method, comprising the following steps:

[0033] placing the plated surface of the plated object into the electroplating solution;

[0034] The negative electrode of the electroplating power source is connected to the plated surface of the plated object through the cathode connector and the conductive tape in sequence;

[0035] The conductive tape and one end of the cathode connector connected to the conductive tape are placed in the electroplating solution to shorten the length of the conductive tape.

[0036] In some embodiments, the surface of the cathode connector is insulated, or the surface of the cathode connector immersed in the electroplating solution is insulated to expose a portion of the cathode connector for conductive connection;

[0037] The conductive tape is insulated to expose a portion of the conductive tape for conductive connection.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] In an embodiment of the present invention, the other end of the external conductive member extends into the electroplating solution or is located in the electroplating solution and connected to the conductive tape, which can shorten the length of the conductive tape and thereby reduce the amount and cost of the conductive tape during the electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Attached Figure 1 This is a schematic diagram of the first structure of the conductive tape in Example 1;

[0041] Attached Figure 2is a schematic diagram of the second structure of the conductive tape in Example 1;

[0042] Attached Figure 3 is a schematic diagram of the third structure of the conductive tape in Example 1;

[0043] Attached Figure 4 is a schematic diagram of the fourth structure of the conductive tape in Example 1;

[0044] Attached Figure 5 is a fifth structural schematic diagram of the conductive tape in Example 1;

[0045] Attached Figure 6 is a sixth structural schematic diagram of the conductive tape in Example 1;

[0046] Attached Figure 7 is a seventh structural schematic diagram of the conductive tape in Example 1;

[0047] Attached Figure 8 This is a schematic diagram of the first structure of the conductive tape in Example 2;

[0048] Attached Fig. 9 is a schematic diagram of the second structure of the conductive tape in Example 2;

[0049] Attached Fig.10 is a schematic diagram of the third structure of the conductive tape in Example 2;

[0050] Attached Fig.11 is a schematic diagram of the fourth structure of the conductive tape in Example 2;

[0051] Attached Fig.12 is a schematic diagram of the fifth structure of the conductive tape in Example 2;

[0052] Attached Fig.13 is a sixth structural schematic diagram of the conductive tape in Example 2;

[0053] Attached Fig.14 This is a schematic diagram of the first structure of the conductive tape in Example 3;

[0054] Attached Fig.15 is a schematic diagram of the second structure of the conductive tape in Example 3;

[0055] Attached Fig.16 is a schematic diagram of the third structure of the conductive tape in Example 3;

[0056] Attached Fig.17 is a schematic diagram of the fourth structure of the conductive tape in Example 3;

[0057] Attached Fig.18 is a fifth structural schematic diagram of the conductive tape in Example 3;

[0058] Attached Fig.19 is a sixth structural schematic diagram of the conductive tape in Example 3;

[0059] Attached Fig. 20 is a seventh structural schematic diagram of the conductive tape in Example 3;

[0060] Attached Fig.21 is a schematic diagram of the eighth structure of the conductive tape in Example 3;

[0061] Attached Fig. 22 This is a schematic diagram of the first structure of the conductive tape in Example 4;

[0062] Attached Fig.23 is a schematic diagram of the second structure of the conductive tape in Example 4;

[0063] Attached Fig.24 is a schematic diagram of the third structure of the conductive tape in Example 4;

[0064] Attached Fig.25 This is a schematic diagram of the first structure of the conductive tape in Example 5;

[0065] Attached Fig.26 is a schematic diagram of the second structure of the conductive tape in Example 5;

[0066] Attached Fig. 27 is a schematic diagram of the third structure of the conductive tape in Example 5;

[0067] Attached Fig.28 This is a schematic diagram of the first structure of the conductive tape in Example 6;

[0068] Attached Fig.29 is a schematic diagram of the second structure of the conductive tape in Example 6;

[0069] Attached Fig.30 is a schematic diagram of the third structure of the conductive tape in Example 6;

[0070] Attached Fig.31 is a schematic diagram of the fourth structure of the conductive tape in Example 6;

[0071] Attached Fig.32 is a fifth structural schematic diagram of the conductive tape in Example 6;

[0072] Attached Fig.33 is a sixth structural schematic diagram of the conductive tape in Example 6;

[0073] Attached Fig.34 This is a schematic diagram of the first structure of the conductive tape in Example 7;

[0074] Attached Fig.35is a schematic diagram of the second structure of the conductive tape in Example 7;

[0075] Attached Fig.36 is a schematic diagram of the third structure of the conductive tape in Example 7;

[0076] Attached Fig.37 is a schematic diagram of the fourth structure of the conductive tape in Example 7;

[0077] Attached Fig.38 is a fifth structural schematic diagram of the conductive tape in Example 7;

[0078] Attached Fig.39 is a sixth structural schematic diagram of the conductive tape in Example 7;

[0079] Attached Fig.40 is a seventh structural schematic diagram of the conductive tape in Example 7;

[0080] Attached Fig.41 This is a schematic diagram of the first structure of the conductive tape in Example 8;

[0081] Attached Fig.42 is a schematic diagram of the second structure of the conductive tape in Example 8;

[0082] Attached Fig.43 is a schematic diagram of the third structure of the conductive tape in Example 8;

[0083] Attached Fig.44 is a schematic diagram of the fourth structure of the conductive tape in Example 8;

[0084] Attached Fig.45 is a fifth structural schematic diagram of the conductive tape in Example 8;

[0085] Attached Fig.46 is a sixth structural schematic diagram of the conductive tape in Example 8;

[0086] Attached Fig.47 This is a schematic diagram of the first structure of the conductive tape in Example 9;

[0087] Attached Fig.48 This is a schematic diagram of the installation position of the release sheet in Example 9;

[0088] Attached Fig.49 is a schematic diagram of the second structure of the conductive tape in Example 9;

[0089] Attached Fig.50 is a schematic diagram of the third structure of the conductive tape in Example 9;

[0090] Attached Fig.51 This is a schematic diagram of the first structure of the conductive tape in Example 10;

[0091] Attached Fig.52 is a schematic diagram of a second structure of the conductive tape in Example 10;

[0092] Attached Fig.53 is a schematic diagram of the third structure of the conductive tape in Example 10;

[0093] Attached Fig.54 is a schematic diagram of the fourth structure of the conductive tape in Example 10;

[0094] Attached Fig.55 is a fifth structural schematic diagram of the conductive tape in Example 10;

[0095] Attached Fig.56 is a sixth structural schematic diagram of the conductive tape in Example 10;

[0096] Attached Fig.57 is a schematic cross-sectional view of a first structure of the conductive tape in Example 11;

[0097] Attached Fig.58 It is a left-side schematic diagram of the first structure of the conductive tape in Example 11;

[0098] Attached Fig.59 FIG. 1 is a left schematic diagram of the first structural deformation of the conductive tape in Example 11; FIG. Fig.60 is a schematic cross-sectional view of a second structure of the conductive tape in Example 11;

[0099] Attached Fig.61 It is a left-side schematic diagram of the second structure of the conductive tape in Example 11;

[0100] Attached Fig.62 is a schematic cross-sectional view of a third structure of the conductive tape in Example 11;

[0101] Attached Fig.63 It is a left schematic diagram of the third structure of the conductive tape in Example 11;

[0102] Attached Fig.64 This is a schematic diagram of the first structure of the conductive tape in Example 12;

[0103] Attached Fig.65 is a schematic diagram of a second structure of the conductive tape in Example 12;

[0104] Attached Fig.66 is a schematic diagram of the third structure of the conductive tape in Example 12;

[0105] Attached Fig.67 This is a schematic diagram of the first structure of the conductive tape assembly in Example 14;

[0106] Attached Fig.68This is a schematic diagram of the second structure of the conductive tape assembly in Example 14;

[0107] Attached Fig.69 This is a schematic diagram of the first arrangement structure of the conductive tape on the base film in Example 14;

[0108] Attached Fig.70 This is a schematic diagram of the second arrangement structure of the conductive tape on the base film in Example 14;

[0109] Attached Fig.71 This is a schematic diagram of the third arrangement structure of the conductive tape on the base film in Example 14;

[0110] Attached Fig.72 This is a schematic diagram of the first structure of a battery cell with a conductive tape in Example 15;

[0111] Attached Fig.73 A schematic diagram of a second structure of a battery cell with a conductive tape in Example 15;

[0112] Attached Fig.74 is a schematic diagram of the first structure of the electroplating equipment in Example 16;

[0113] Attached Fig.75 is a second structural schematic diagram of the electroplating equipment in Example 16;

[0114] Attached Fig.76 is a schematic diagram of the third structure of the electroplating equipment in Example 16;

[0115] Attached Fig.77 is a schematic diagram of a fourth structure of the electroplating equipment in Example 16;

[0116] Attached Fig.78 is a schematic diagram of a first structure of the clamp in Example 16;

[0117] Attached Fig.79 is a schematic diagram of a second structure of the clamp in Example 16;

[0118] Attached Fig.80 is a schematic structural diagram of the clamping seat in Example 16;

[0119] Attached Fig.81 is a schematic structural diagram of a conductive contact in Example 16;

[0120] The meanings of the reference numerals are as follows:

[0121] 1-conductive tape, 2-plated part;

[0122] 10-conductive functional layer, 11-conductive base layer, 12-conductive adhesive layer, 12a-hollow area, 12b-third connecting groove, 13-conductive coating; 20-first protective layer, 20b-first connecting groove, 21-first shielding layer, 22-first connecting adhesive layer, 23-first insulating coating; 30-second protective layer, 30a-exposure groove, 30b-second connecting groove, 31-second shielding layer, 32-second connecting adhesive layer, 33-second insulating coating;

[0123] 40 - conductive covering layer; 50 - base film, 51 - third connecting adhesive layer; 60 - release sheet; 70 - third protective layer, 71 - third shielding layer, 72 - third connecting adhesive layer, 73 - third insulating coating layer;

[0124] 100-clamp, 100a-conductive rod, 110-external conductive member, 120-clamping seat, 120a-first countersunk hole, 120b-first mounting hole, 120c-fourth mounting hole, 130-conductive contact, 1311-first shaft section, 1312-second shaft section, 1313-third shaft section, 131a-second mounting hole, 131b-third mounting hole, 132-telescopic member, 140-first sealing member, 150-second sealing member, 220-insulating clamping portion, 220a-annular groove, 221-elastic abutment member;

[0125] 310 - electroplating tank, 320 - anode piece, 331 - upper roller, 332 - lower roller. DETAILED DESCRIPTION

[0126] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0127] The embodiment of the present invention provides a conductive tape, comprising a conductive functional layer 10, wherein a first protective layer 20 is disposed on the upper surface of the conductive functional layer 10 and / or a second protective layer 30 is disposed on the lower surface of the conductive functional layer 10; the conductive functional layer 10 at least comprises a conductive material layer and a conductive adhesive layer 12, wherein the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive material layer, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive material layer; the lower surface of the conductive adhesive layer 12 is formed as the lower surface of the conductive functional layer 10, and when the second protective layer 30 is disposed on the lower surface of the conductive adhesive layer 12, the second protective layer 30 does not completely cover the lower surface of the conductive adhesive layer 12. The conductive tape in this embodiment is bonded and electrically connected to other conductive components through the exposed conductive adhesive layer 12, so that the conductive tape can be quickly connected and separated from other conductive components. Under the protection of the first protective layer 20 and / or the second protective layer 30, the covered area of ​​the conductive functional layer 10 can be prevented from being corroded or electroplated.

[0128] Among them, the conductive material layer may only include the conductive base layer 11, that is, the conductive functional layer 10 includes the conductive base layer 11 and the conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive base layer 11.

[0129] The conductive material layer may include a conductive base layer 11 and a conductive coating 13, that is, the conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13, the conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire or a partial area on the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire or a partial area on the lower surface of the conductive coating 13.

[0130] Example 1

[0131] like Figure 1-Figure 7As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive base layer 11. For example, the conductive adhesive layer 12 only covers the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive base layer 11. In order to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the conductive functional layer 10 from being corroded or electroplated.

[0132] The first structure of the conductive tape in this embodiment is as follows: Figure 1 As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.

[0133] The second structure of the conductive tape in this embodiment is as follows: Figure 2As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 is bonded to the area to be electroplated on the battery cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used for electroplating the battery cell can flow to the area to be electroplated on the battery cell through the conductive clip and the conductive tape in sequence; the lower surface of the right end of the conductive base layer 11 is not provided with the conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive base layer 11 from being bonded to the conductive clip and unable to be separated. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.

[0134] The third structure of the conductive tape in this embodiment is as follows: Figure 3 As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire lower surface of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.

[0135] The fourth structure of the conductive tape in this embodiment is as follows: Figure 4As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the lower surface of the conductive coating 13 and exposes the lower surface of the right end of the conductive coating 13. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating 13 is bonded to the area to be electroplated on the battery cell, and the right end of the exposed conductive coating 13 is connected to the conductive clip, so that the current used for electroplating the battery cell can flow to the area to be electroplated on the battery cell through the conductive clip and the conductive tape in sequence; the lower surface of the right end of the conductive coating 13 is not provided with the conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive coating 13 from being bonded to the conductive clip and unable to be separated. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.

[0136] The fifth structure of the conductive tape in this embodiment is as follows: Figure 5 As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating layer 13, the conductive coating layer 13 is coated on the lower surface of the conductive base layer 11, the conductive coating layer 13 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13, the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating layer 13, and keeps the lower surface of the right end of the conductive base layer 11 exposed. For example, the conductive adhesive layer 12 covering the lower surface of the conductive coating 13 is bonded to the area to be electroplated on the cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used to electroplate the cell can flow to the area to be electroplated on the cell through the conductive clip and the conductive tape in sequence; the lower surface of the right end of the conductive base layer 11 is not provided with a conductive coating 13 and a conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive base layer 11 from being bonded to the conductive clip and unable to be separated. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.

[0137] The sixth structure of the conductive tape in this embodiment is as follows: Figure 6As shown, the conductive tape includes a conductive functional layer 10, and a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.

[0138] The seventh structure of the conductive tape in this embodiment is as follows: Figure 7 As shown, the conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 is bonded to the area to be electroplated on the battery cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used for electroplating the battery cell can flow to the area to be electroplated on the battery cell through the conductive clip and the conductive tape in sequence; the lower surface of the right end of the conductive base layer 11 is not provided with a conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive base layer 11 from being bonded to the conductive clip and unable to be separated. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated.

[0139] Example 2

[0140] like Figure 8-Figure 13As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive base layer 11. For example, the conductive adhesive layer 12 only covers the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive base layer 11. In order to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the upper surface of the conductive functional layer 10 from being corroded or electroplated. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface in the middle of the conductive functional layer 10 is covered, and the lower surfaces at both ends of the conductive functional layer 10 are exposed but not covered. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection with other conductive components.

[0141] The first structure of the conductive tape in this embodiment is as follows: Figure 8As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of both ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0142] The second structure of the conductive tape in this embodiment is as follows: Fig. 9As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, the conductive adhesive layer 12 covers a partial area on the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 is bonded to the area to be electroplated on the battery cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used to electroplate the battery cell can flow to the area to be electroplated on the battery cell through the conductive clip and the conductive tape in sequence; the conductive adhesive layer 12 is not provided on the lower surface of the right end of the conductive base layer 11, which can prevent the lower surface of the right end of the conductive base layer 11 from being bonded to the conductive clip and unable to be separated. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0143] The third structure of the conductive tape in this embodiment is as follows: Fig.10As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire lower surface of the conductive base layer 11 (that is, the entire area on the lower surface). The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire lower surface of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of both ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0144] The fourth structure of the conductive tape in this embodiment is as follows: Fig.11As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13, the conductive coating 13 is coated on the lower surface of the conductive base layer 11, the conductive coating 13 covers the entire lower surface of the conductive base layer 11 (that is, the entire area on the lower surface), the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, the conductive adhesive layer 12 covers a partial area on the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the lower surface of the conductive coating 13 and exposes the lower surface of the right end of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0145] The fifth structure of the conductive tape in this embodiment is as follows: Fig.12 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, and the second insulating coating 33 covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the two ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0146] The sixth structure of the conductive tape in this embodiment is as follows: Fig.13As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, the conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11, and the lower surface of the right end of the conductive base layer 11 can be used for conductive connection with other conductive components. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, which covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the left end of the conductive adhesive layer 12, while keeping the lower surface of the right end of the conductive base layer 11 exposed. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0147] Example 3

[0148] like Figure 14-Figure 21As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a local area on the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of one or both ends of the conductive base layer 11, and exposes the lower surface of the middle part of the conductive base layer 11. In order to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer; the conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the conductive functional layer 10 from being corroded or electroplated. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10, and the lower surfaces of the two ends of the conductive functional layer 10 are exposed and not covered. Preferably, the second protective layer 30 covers the lower surface of the middle part of the conductive material layer and the part of the lower surface of the conductive adhesive layer 12 adjacent thereto. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection with other conductive components. Preferably, the conductive adhesive layer 12 covers the lower surface of both ends of the conductive material layer, exposing the lower surface of the middle part of the conductive material layer, the second protective layer 30 is disposed in the air below the lower surface of the middle part of the conductive material layer to form a hollow area 12a, and the second protective layer 30 covers the conductive adhesive layer 12 near the hollow area. In this embodiment, the conductive adhesive layer 12 is not disposed on the lower surface of the middle part of the conductive material layer, which can reduce the amount of the conductive adhesive layer 12, thereby reducing the overall price of the conductive tape.

[0149] The first structure of the conductive tape in this embodiment is as follows: Fig.14As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surface of the left and right ends of the conductive base layer 11, exposing the lower surface of the middle part of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive base layer 11 and part of the lower surface of the conductive adhesive layer 12 adjacent to the left and right sides thereof, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0150] The second structure of the conductive tape in this embodiment is as follows: Fig.15 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surface of the left end of the conductive base layer 11, exposing the lower surface of the middle part and the lower surface of the right end of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive base layer 11 and part of the lower surface of the conductive adhesive layer 12 adjacent to the left side thereof, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0151] The third structure of the conductive tape in this embodiment is as follows: Fig.16As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive coating 13, and the lower surface of the middle part of the conductive coating 13 is exposed. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive coating 13 and part of the lower surface of the conductive adhesive layer 12 adjacent to the left and right sides thereof, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0152] The fourth structure of the conductive tape in this embodiment is as follows: Fig.17 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the lower surface of the left end of the conductive coating 13, and exposes the lower surface of the middle part and the lower surface of the right end of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive functional layer 10 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the middle part of the conductive coating 13 and a portion of the lower surface of the conductive adhesive layer 12 adjacent to the left side thereof, which can prevent the covered area from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection to other conductive components.

[0153] The fifth structure of the conductive tape in this embodiment is as follows: Fig.18 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive base layer 11, exposing the lower surface of the middle part of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, and the second insulating coating 33 covers the lower surface of the middle part of the conductive base layer 11 and part of the lower surface of the conductive adhesive layer 12 adjacent to the left and right sides, which can prevent the covered area from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0154] The sixth structure of the conductive tape in this embodiment is as follows: Fig.19 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surface of the left and right ends of the conductive base layer 11, exposing the lower surface of the middle part of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is suspended below the lower surface of the middle part of the conductive base layer 11 to form a hollow area 12a. The second protective layer 30 covers a portion of the conductive adhesive layer 12 close to the hollow area.

[0155] The seventh structure of the conductive tape in this embodiment is as follows: Fig. 20As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the lower surfaces of the left and right ends of the conductive coating 13, and the lower surface of the middle part of the conductive coating 13 is exposed. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is suspended below the lower surface of the middle part of the conductive coating 13 to form a hollow area 12a. The second protective layer 30 covers a portion of the conductive adhesive layer 12 close to the hollow area.

[0156] The eighth structure of the conductive tape in this embodiment is as follows: Fig.21 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surface of the left and right ends of the conductive base layer 11, exposing the lower surface of the middle part of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, and the second protective layer 30 (second insulating coating 33) is arranged in an overhead manner below the lower surface of the middle part of the conductive base layer 11 to form a hollow area 12a, and the second protective layer 30 covers the conductive adhesive layer 12 near the hollow area.

[0157] Example 4

[0158] like Figure 22-Figure 24As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive base layer 11. For example, the conductive adhesive layer 12 only covers the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive base layer 11. In order to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 covers the upper surface of the left end of the conductive functional layer 10. The covered area of ​​the upper surface of the conductive functional layer 10 can be prevented from being corroded or electroplated. The exposed area of ​​the upper surface of the conductive functional layer 10 can be used for conductive connection with other conductive components. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and covers the lower surface of the right end of the conductive functional layer 10. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection with other conductive components.

[0159] The first structure of the conductive tape in this embodiment is as follows: Fig. 22As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11, the covered area of ​​the upper surface of the conductive base layer 11 can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the conductive base layer 11 can be used for conductive connection with other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the right end of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0160] The second structure of the conductive tape in this embodiment is as follows: Fig.23 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11. The covered area of ​​the upper surface of the conductive base layer 11 can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the conductive base layer 11 can be used for conductive connection with other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 covers the lower surface of the right end of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0161] The third structure of the conductive tape in this embodiment is as follows: Fig.24As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 covers the upper surface of the left end of the conductive base layer 11 to prevent the covered upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, and the second insulating coating 33 covers the lower surface of the right end of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0162] Example 5

[0163] like Figure 25-27As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. In order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further arranged between the conductive base layer 11 and the conductive adhesive layer 12, and the conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer, the conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 is connected to the upper surface of the conductive functional layer 10, and the first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the conductive functional layer 10 from being corroded or electroplated. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and the second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surfaces of both ends of the conductive functional layer 10 are exposed but not covered. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection with other conductive components. In a specific application environment, the exposed portion of the lower surface of the conductive functional layer 10 is the conductive adhesive layer 12. The conductive adhesive layer 12 exposed on one end of the conductive functional layer 10 is bonded to the conductive component, and the other end of the conductive functional layer 10 is connected to the conductive component by other means, resulting in the conductive adhesive layer 12 exposed on the other end of the conductive functional layer 10 affecting the connection and disassembly. Therefore, a conductive covering layer 40 is arranged on the conductive adhesive layer 12 exposed on the other end of the conductive functional layer 10. The conductive covering layer 40 is a conductor material, such as conductive metals such as copper, aluminum, iron, stainless steel, or conductive silicone or other conductive materials.

[0164] The first structure of the conductive tape in this embodiment is as follows: Fig.25As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of the left and right ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. The exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40 to prevent the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from adhering to other conductive components.

[0165] The second structure of the conductive tape in this embodiment is as follows: Fig.26As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of the left and right ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. The exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40 to prevent the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from adhering to other conductive components.

[0166] The third structure of the conductive tape in this embodiment is as follows: Fig. 27 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 covers the entire area on the upper surface of the conductive base layer 11 to prevent the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, and the second insulating coating 33 covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the two ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. The exposed area on the lower surface of the right end of the conductive adhesive layer 12 is completely covered by the conductive covering layer 40 to prevent the exposed area on the lower surface of the right end of the conductive adhesive layer 12 from adhering to other conductive components.

[0167] Example 6

[0168] like Figure 28-Figure 33 As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 constitutes a conductive material layer. The conductive base layer 11 is a material layer of a surface passivated metal, for example, the conductive base layer 11 is an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive base layer 11. For example, the conductive adhesive layer 12 only covers the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive base layer 11. In order to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of one end or both ends of the conductive functional layer 10 is exposed but not covered. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated. The exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection with other conductive components.

[0169] The first structure of the conductive tape in this embodiment is as follows: Fig.28 As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of the left and right ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0170] The second structure of the conductive tape in this embodiment is as follows: Fig.29As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers a part of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 is bonded to the area to be electroplated on the battery cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used for electroplating the battery cell can flow to the area to be electroplated on the battery cell through the conductive clip and the conductive tape in sequence; the lower surface of the right end of the conductive base layer 11 is not provided with the conductive adhesive layer 12, which can prevent the lower surface of the right end of the conductive base layer 11 from being bonded to the conductive clip and unable to be separated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0171] The third structure of the conductive tape in this embodiment is as follows: Fig.30 As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive base layer 11 is preferably an aluminum foil. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating 13. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surfaces of both ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0172] The fourth structure of the conductive tape in this embodiment is as follows: Fig.31As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating layer 13. The conductive base layer 11 is preferably an aluminum foil. The conductive coating layer 13 is coated on the lower surface of the conductive base layer 11. The conductive coating layer 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers a partial area on the lower surface of the conductive coating layer 13. The conductive adhesive layer 12 covers the lower surface of the conductive coating layer 13 and exposes the lower surface of the right end of the conductive coating layer 13. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the left end of the conductive adhesive layer 12 is exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0173] The fifth structure of the conductive tape in this embodiment is as follows: Fig.32 As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, and the conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The second protective layer 30 includes a second insulating coating 33, and the second insulating coating 33 covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the left and right ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0174] The sixth structure of the conductive tape in this embodiment is as follows: Fig.33As shown, the conductive tape includes a conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12. The conductive base layer 11 is preferably an aluminum foil. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11. The conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. The lower surface of the right end of the conductive base layer 11 can be used for conductive connection with other conductive components. The second protective layer 30 includes a second insulating coating 33. The second insulating coating 33 covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the left end of the conductive adhesive layer 12, keeping the lower surface of the right end of the conductive base layer 11 exposed. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components.

[0175] Example 7

[0176] like Figure 34-40As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive base layer 11. For example, the conductive adhesive layer 12 only covers the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive base layer 11. In order to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 covers the entire or partial area on the upper surface of the conductive functional layer 10. The covered area on the upper surface of the conductive functional layer 10 can be prevented from being corroded or electroplated. The exposed area on the upper surface of the conductive functional layer 10 can be used for conductive connection with other conductive components. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10, and a glue dew groove 30a is provided on the second protective layer 30. The glue dew groove 30a penetrates the second protective layer 30, so that the lower surface of the conductive functional layer 10 is exposed from the glue dew groove 30a, that is, the lower surface of the conductive adhesive layer 12 is exposed from the glue dew groove 30a. Preferably, the glue dew groove 30a extends to the edge along the width direction of the second protective layer 30, dividing the second protective layer 30 into two sections. Preferably, when the first protective layer 20 covers the entire area on the upper surface of the conductive functional layer 10, the second protective layer 30 covers the lower surface of one end of the conductive functional layer 10, exposing the lower surface of the other end of the conductive functional layer 10, and the glue dew groove 30a is arranged near one end of the conductive functional layer 10; when the first protective layer 20 covers the upper surface of one end of the conductive functional layer 10, exposing the upper surface of the other end of the conductive functional layer 10, the second protective layer 30 covers the entire area on the lower surface of the conductive functional layer 10 except the glue dew groove 30a, and the glue dew groove 30a is arranged near one end of the conductive functional layer 10. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection with other conductive components.In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive dew groove 30a. After the conductive adhesive layer 12 exposed from the adhesive dew groove 30a adheres to other conductive components, during the process of separation from the other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced, and the conductive adhesive layer 12 can be more easily separated from the other conductive components as a whole.

[0177] The first structure of the conductive tape in this embodiment is as follows: Fig.34 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11, the covered area of ​​the upper surface of the conductive base layer 11 can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the conductive base layer 11 can be used for conductive connection with other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A glue-exposing groove 30a is provided on the second protective layer 30 near the left end. The glue-exposing groove 30a penetrates the second protective layer 30, so that the lower surface of the conductive adhesive layer 12 is exposed from the glue-exposing groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed from the glue-exposing groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the glue-exposing groove 30a. After the conductive adhesive layer 12 exposed from the glue-exposing groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the process of separation from other conductive components, and the conductive adhesive layer 12 is more easily separated from other conductive components as a whole.

[0178] The second structure of the conductive tape in this embodiment is as follows: Fig.35As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 covers the upper surface of the left end of the conductive base layer 11. The covered area of ​​the upper surface of the conductive base layer 11 can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the conductive base layer 11 can be used for conductive connection with other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A glue-exposing groove 30a is provided on the second protective layer 30 near the left end. The glue-exposing groove 30a penetrates the second protective layer 30, so that the lower surface of the conductive adhesive layer 12 is exposed from the glue-exposing groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed from the glue-exposing groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the glue-exposing groove 30a. After the conductive adhesive layer 12 exposed from the glue-exposing groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the process of separation from other conductive components, and the conductive adhesive layer 12 is more easily separated from other conductive components as a whole.

[0179] The third structure of the conductive tape in this embodiment is as follows: Fig.36As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 covers the upper surface of the left end of the conductive base layer 11 to prevent the covered upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A glue-exposing groove 30a is provided on the second protective layer 30 near the left end. The glue-exposing groove 30a penetrates the second protective layer 30, so that the lower surface of the conductive adhesive layer 12 is exposed from the glue-exposing groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed from the glue-exposing groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the glue-exposing groove 30a. After the conductive adhesive layer 12 exposed from the glue-exposing groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the process of separation from other conductive components, and the conductive adhesive layer 12 is more easily separated from other conductive components as a whole.

[0180] The fourth structure of the conductive tape in this embodiment is as follows: Fig.37As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The second shielding layer 31 does not cover the lower surface of the right end of the conductive adhesive layer 12. A glue dew groove 30a is provided near the left end of the second protective layer 30. The glue dew groove 30a penetrates the second protective layer 30 so that the lower surface of the conductive adhesive layer 12 is exposed from the glue dew groove 30a. Except for the area exposed from the glue dew groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the other areas on the lower surface of the conductive adhesive layer 12 are covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive dew groove 30a. After the conductive adhesive layer 12 exposed from the adhesive dew groove 30a adheres to other conductive components, during the process of separation from the other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced, and the conductive adhesive layer 12 can be more easily separated from the other conductive components as a whole.

[0181] The fifth structure of the conductive tape in this embodiment is as follows: Fig.38As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, the conductive adhesive layer 12 covers a partial area on the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the lower surface of the conductive base layer 11 and exposes the lower surface of the right end of the conductive base layer 11. For example, the conductive adhesive layer 12 covering the lower surface of the conductive base layer 11 is bonded to the area to be electroplated on the battery cell, and the right end of the exposed conductive base layer 11 is connected to the conductive clip, so that the current used to electroplate the battery cell can flow to the area to be electroplated on the battery cell through the conductive clip and the conductive tape in sequence; the conductive adhesive layer 12 is not provided on the lower surface of the right end of the conductive base layer 11, which can prevent the lower surface of the right end of the conductive base layer 11 from being bonded to the conductive clip and unable to be separated. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A glue-exposing groove 30a is provided on the second protective layer 30 near the left end. The glue-exposing groove 30a penetrates the second protective layer 30, so that the lower surface of the conductive adhesive layer 12 is exposed from the glue-exposing groove 30a. The lower surface of the conductive adhesive layer 12, except for the area exposed from the glue-exposing groove 30a, is covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the glue-exposing groove 30a. After the conductive adhesive layer 12 exposed from the glue-exposing groove 30a adheres to other conductive components, the probability of the conductive adhesive layer 12 remaining on other conductive components can be reduced during the process of separation from other conductive components, and the conductive adhesive layer 12 is more easily separated from other conductive components as a whole.

[0182] The sixth structure of the conductive tape in this embodiment is as follows: Fig.39As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The second shielding layer 31 does not cover the lower surface of the right end of the conductive adhesive layer 12. A glue dew groove 30a is provided near the left end of the second protective layer 30. The glue dew groove 30a penetrates the second protective layer 30 so that the lower surface of the conductive adhesive layer 12 is exposed from the glue dew groove 30a. Except for the area exposed from the glue dew groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the other areas on the lower surface of the conductive adhesive layer 12 are covered by the second shielding layer 31. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive dew groove 30a. After the conductive adhesive layer 12 exposed from the adhesive dew groove 30a adheres to other conductive components, during the process of separation from the other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced, and the conductive adhesive layer 12 can be more easily separated from the other conductive components as a whole.

[0183] The seventh structure of the conductive tape in this embodiment is as follows: Fig.40As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 covers the entire area on the upper surface of the conductive base layer 11 to prevent the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, which does not completely cover the lower surface of the conductive adhesive layer 12, and does not cover the lower surface of the right end of the conductive adhesive layer 12. A glue-exposing groove 30a is provided on the second insulating coating 33 near the left end, and the glue-exposing groove 30a penetrates the second insulating coating 33, so that the lower surface of the conductive adhesive layer 12 is exposed from the glue-exposing groove 30a. Except for the area exposed from the glue-exposing groove 30a and the lower surface of the right end of the conductive adhesive layer 12, the other areas on the lower surface of the conductive adhesive layer 12 are covered by the second insulating coating 33. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. In this embodiment, the conductive adhesive layer 12 is exposed through the adhesive dew groove 30a. After the conductive adhesive layer 12 exposed from the adhesive dew groove 30a adheres to other conductive components, during the process of separation from the other conductive components, the probability of the conductive adhesive layer 12 remaining on the other conductive components can be reduced, and the conductive adhesive layer 12 can be more easily separated from the other conductive components as a whole.

[0184] Example 8

[0185] like Figures 41-46As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, the conductive adhesive layer 12 covers a part of the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 is provided with a third connecting groove 12b, the third connecting groove 12b penetrates the conductive adhesive layer 12, so that the lower surface of the conductive base layer 11 is exposed from the third connecting groove 12b. Preferably, the third connecting groove 12b is arranged adjacent to one end of the conductive adhesive layer 12. In order to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the conductive functional layer 10 from being corroded or electroplated; or, the first protective layer 20 is provided with a first connecting groove 20b, the first connecting groove 20b penetrates the first protective layer 20, so that the upper surface of the conductive base layer 11 is exposed from the first connecting groove 20b, and the first connecting groove 20b is provided directly above the third connecting groove 12b. The second protective layer 30 is arranged on the lower surface of the conductive functional layer 10, and a second connecting groove 30b is arranged on the second protective layer 30. The second connecting groove 30b penetrates the second protective layer 30, and the second connecting groove 30b is arranged directly below the third connecting groove 12b, so that the lower surface of the conductive base layer 11 is exposed from the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive functional layer 10 away from the second connecting groove 30b, so that the conductive functional layer 10 at this end is exposed, and the conductive adhesive layer 12 at this end is also exposed. In this embodiment, the upper surface of the conductive base layer 11 is exposed through the first connecting groove 20b, and the lower surface of the conductive base layer 11 is exposed through the third connecting groove 12b and the second connecting groove 30b. When the conductive tape is used as the conductive connecting member, other conductive components are directly connected to the upper surface of the conductive base layer 11 through the first connecting groove 20b, and directly connected to the lower surface of the conductive base layer 11 through the third connecting groove 12b and the second connecting groove 30b, which can reduce the resistance of the current passing through the conductive tape, and also improve the stability of the electrical connection between other conductive components and the conductive tape. Other conductive components can be conductive clips, conductive probes, etc.

[0186] The first structure of the conductive tape in this embodiment is as follows: Fig.41As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a part of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 is provided with a third connecting groove 12b, and the third connecting groove 12b penetrates the conductive adhesive layer 12, so that the lower surface of the conductive base layer 11 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the entire area on the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is provided with a second connecting groove 30b. The second connecting groove 30b penetrates the second protective layer 30. The second connecting groove 30b is arranged directly below the third connecting groove 12b, so that the lower surface of the conductive base layer 11 is exposed from the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0187] The second structure of the conductive tape in this embodiment is as follows: Fig.42As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a part of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 is provided with a third connecting groove 12b, and the third connecting groove 12b penetrates the conductive adhesive layer 12, so that the lower surface of the conductive base layer 11 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the entire area on the lower surface of the conductive base layer 11 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 partially covers the upper surface of the conductive base layer 11 to prevent the covered area on the conductive base layer 11 from being corroded or electroplated. A first connecting groove 20b is provided on the first protective layer 20 (the first shielding layer 21 and the first connecting adhesive layer 22). The first connecting groove 20b penetrates the first protective layer 20 so that the upper surface of the conductive base layer 11 is exposed from the first connecting groove 20b. The first connecting groove 20b is provided directly above the third connecting groove 12b. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b passes through the second protective layer 30. The second connecting groove 30b is provided directly below the third connecting groove 12b, so that the lower surface of the conductive base layer 11 is exposed from the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0188] The third structure of the conductive tape in this embodiment is as follows: Fig.43As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers a partial area on the lower surface of the conductive coating 13. The conductive adhesive layer 12 is provided with a third connecting groove 12b, and the third connecting groove 12b penetrates the conductive adhesive layer 12, so that the lower surface of the conductive coating 13 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the entire area on the lower surface of the conductive coating 13 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32) is provided with a second connecting groove 30b. The second connecting groove 30b penetrates the second protective layer 30. The second connecting groove 30b is arranged directly below the third connecting groove 12b, so that the lower surface of the conductive coating 13 is exposed from the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0189] The fourth structure of the conductive tape in this embodiment is as follows: Fig.44As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers a partial area on the lower surface of the conductive coating 13. The conductive adhesive layer 12 is provided with a third connecting groove 12b, and the third connecting groove 12b penetrates the conductive adhesive layer 12, so that the lower surface of the conductive coating 13 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, the entire area on the lower surface of the conductive coating 13 is covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22. The first shielding layer 21 partially covers the upper surface of the conductive base layer 11 to prevent the covered area on the conductive base layer 11 from being corroded or electroplated. A first connecting groove 20b is provided on the first protective layer 20 (the first shielding layer 21 and the first connecting adhesive layer 22). The first connecting groove 20b penetrates the first protective layer 20 so that the upper surface of the conductive base layer 11 is exposed from the first connecting groove 20b. The first connecting groove 20b is provided directly above the third connecting groove 12b. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. A second connecting groove 30b is provided on the second protective layer 30 (the second shielding layer 31 and the second connecting adhesive layer 32). The second connecting groove 30b passes through the second protective layer 30. The second connecting groove 30b is provided directly below the third connecting groove 12b, so that the lower surface of the conductive coating 13 is exposed from the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0190] The fifth structure of the conductive tape in this embodiment is as follows: Fig.45As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a part of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 is provided with a third connecting groove 12b, and the third connecting groove 12b penetrates the conductive adhesive layer 12, so that the lower surface of the conductive base layer 11 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, all areas on the lower surface of the conductive base layer 11 are covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, and a second connecting groove 30b is provided on the second protective layer 30 (the second insulating coating 33), and the second connecting groove 30b penetrates the second protective layer 30. The second connecting groove 30b is arranged directly below the third connecting groove 12b, so that the lower surface of the conductive base layer 11 is exposed from the second connecting groove 30b, and the second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0191] The sixth structure of the conductive tape in this embodiment is as follows: Fig.46As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers a part of the lower surface of the conductive base layer 11. The conductive adhesive layer 12 is provided with a third connecting groove 12b, and the third connecting groove 12b penetrates the conductive adhesive layer 12, so that the lower surface of the conductive base layer 11 is exposed from the third connecting groove 12b. Except for the area exposed from the third connecting groove 12b, all areas on the lower surface of the conductive base layer 11 are covered by the conductive adhesive layer 12. Specifically, the third connecting groove 12b is arranged adjacent to the right end of the conductive adhesive layer 12. The first protective layer 20 includes a first insulating coating 23, which partially covers the upper surface of the conductive base layer 11 to prevent the covered area on the conductive base layer 11 from being corroded or electroplated. A first connecting groove 20b is provided on the first protective layer 20 (first insulating coating 23), and the first connecting groove 20b penetrates the first protective layer 20 so that the upper surface of the conductive base layer 11 is exposed from the first connecting groove 20b, and the first connecting groove 20b is provided directly above the third connecting groove 12b. The second protective layer 30 includes a second insulating coating 33. A second connecting groove 30b is provided on the second protective layer 30 (the second insulating coating 33). The second connecting groove 30b passes through the second protective layer 30. The second connecting groove 30b is provided directly below the third connecting groove 12b, so that the lower surface of the conductive base layer 11 is exposed from the second connecting groove 30b. The second protective layer 30 does not cover the end of the conductive adhesive layer 12 away from the second connecting groove 30b, that is, the left end of the conductive adhesive layer 12, so that the lower surface of the left end of the conductive adhesive layer 12 is exposed.

[0192] Example 9

[0193] like Figure 47-Figure 50As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive base layer 11. For example, the conductive adhesive layer 12 only covers the lower surface of one end of the conductive base layer 11, or the conductive adhesive layer 12 does not cover the lower surface of the other end of the conductive base layer 11. In order to improve the conductivity of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive coating 13 improves the conductivity of the conductive functional layer 10. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. The conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13. The conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 is connected to the upper surface of the conductive functional layer 10. The first protective layer 20 completely covers the upper surface of the conductive functional layer 10 to prevent the upper surface of the conductive functional layer 10 from being corroded or electroplated. The second protective layer 30 is connected to the lower surface of the conductive functional layer 10. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface of the middle part of the conductive functional layer 10 is covered, and the lower surfaces of the two ends of the conductive functional layer 10 are exposed but not covered. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection with other conductive components. The exposed area of ​​the lower surface of at least one end of the conductive functional layer 10 is the lower surface of the conductive adhesive layer 12. The anti-adhesive sheet 60 is provided on the exposed lower surface of the conductive adhesive layer 12, which can reduce the adhesion of the conductive adhesive layer 12 and the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the components to which it is bonded.

[0194] The first structure of the conductive tape in this embodiment is as follows: Figure 46-Figure 47As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the middle part of the conductive adhesive layer 12 is covered, and the lower surfaces of the two ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. A release sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The release sheet 60 can reduce the adhesion of the conductive adhesive layer 12, and can reduce the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the components to which it is bonded.

[0195] The second structure of the conductive tape in this embodiment is as follows: Fig.49As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11, a conductive adhesive layer 12 and a conductive coating 13. The conductive coating 13 is coated on the lower surface of the conductive base layer 11, and the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11. The upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive coating 13, and the conductive adhesive layer 12 covers the entire area on the lower surface of the conductive coating 13. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22. The first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, and the first shielding layer 21 completely covers the upper surface of the conductive base layer 11 to prevent the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the conductive adhesive layer 12 through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the conductive adhesive layer 12. The lower surface of the middle part of the conductive adhesive layer 12 is covered, and the lower surfaces of the two ends of the conductive adhesive layer 12 are exposed but not covered. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. A release sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The release sheet 60 can reduce the adhesion of the conductive adhesive layer 12, and can reduce the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the components to which it is bonded.

[0196] The third structure of the conductive tape in this embodiment is as follows: Fig.50As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire lower surface of the conductive base layer 11. The first protective layer 20 includes a first insulating coating 23, and the first insulating coating 23 completely covers the upper surface of the conductive base layer 11 to prevent the upper surface of the conductive base layer 11 from being corroded or electroplated. The second protective layer 30 includes a second insulating coating 33, and the second insulating coating 33 covers the lower surface of the conductive adhesive layer 12 and exposes the lower surface of the two ends of the conductive adhesive layer 12. The covered area of ​​the lower surface of the conductive adhesive layer 12 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive adhesive layer 12 can be used for conductive connection with other conductive components. A release sheet 60 is provided on the lower surface of the left end of the conductive adhesive layer 12. The release sheet 60 can reduce the adhesion of the conductive adhesive layer 12 and the bonding area of ​​the lower surface of the conductive adhesive layer 12, thereby reducing the risk of the conductive adhesive layer 12 leaving residual adhesive on the components to which it is bonded.

[0197] Example 10

[0198] For the convenience of description, it is defined that the conductive adhesive layer 12 disposed on the upper surface and the lower surface of the conductive material layer is respectively referred to as the first conductive adhesive layer and the second conductive adhesive layer. Figure 51-56As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, and the conductive base layer 11 constitutes a conductive material layer. Conductive adhesive layers 12 are arranged on the upper and lower surfaces of the conductive base layer 11, the first conductive adhesive layer covers the entire or partial area of ​​the upper surface of the conductive base layer 11, and the second conductive adhesive layer covers the entire or partial area of ​​the lower surface of the conductive base layer 11. For example, the first conductive adhesive layer only covers the upper surface of one end of the conductive base layer 11, and the second conductive adhesive layer only covers the lower surface of the corresponding end of the conductive base layer 11. In order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further arranged between the conductive base layer 11 and the conductive adhesive layer 12, and the conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer. Above the conductive base layer 11, the conductive coating 13 covers the entire or partial area on the upper surface of the conductive base layer 11, the lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive coating 13, and the first conductive adhesive layer covers the entire or partial area on the upper surface of the conductive coating 13. Below the conductive base layer 11, the conductive coating 13 covers the entire or partial area on the lower surface of the conductive base layer 11, the upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive coating 13, and the second conductive adhesive layer covers the entire or partial area on the lower surface of the conductive coating 13. The first protective layer 20 does not completely cover the upper surface of the conductive functional layer 10, the upper surface of the middle part of the conductive functional layer 10 is covered, and the upper surfaces of the two ends of the conductive functional layer 10 are exposed but not covered. The covered area of ​​the upper surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the conductive functional layer 10 can be used for conductive connection with other conductive components. The second protective layer 30 does not completely cover the lower surface of the conductive functional layer 10. The lower surface in the middle of the conductive functional layer 10 is covered, and the lower surfaces at both ends of the conductive functional layer 10 are exposed but not covered. The covered area of ​​the lower surface of the conductive functional layer 10 can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the conductive functional layer 10 can be used for conductive connection with other conductive components.

[0199] In a specific application environment, the first conductive adhesive layer and the second conductive adhesive layer of a conductive tape can be respectively bonded to two battery cells, and the two battery cells are electroplated at the same time, thereby reducing the amount of conductive tape used as a consumable material and reducing the cost of battery cell electroplating. Preferably, the battery cell is a single-sided electroplated battery cell, such as an IBC battery cell.

[0200] The first structure of the conductive tape in this embodiment is as follows: Fig.51As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive adhesive layer 12 is arranged on the upper surface and the lower surface of the conductive base layer 11, the first conductive adhesive layer covers the entire area on the upper surface of the conductive base layer 11, and the second conductive adhesive layer covers the entire area on the lower surface of the conductive base layer 11. The first protective layer 20 includes a first shielding layer 21 and a first connecting adhesive layer 22, the first shielding layer 21 is connected to the upper surface of the conductive base layer 11 through the first connecting adhesive layer 22, the first shielding layer 21 does not completely cover the upper surface of the conductive adhesive layer 12, the upper surface of the middle part of the first conductive adhesive layer is covered, the upper surfaces of the two ends of the first conductive adhesive layer are exposed but not covered, the covered area of ​​the upper surface of the first conductive adhesive layer can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the first conductive adhesive layer can be used for conductive connection with other conductive components. The second protective layer 30 includes a second shielding layer 31 and a second connecting adhesive layer 32. The second shielding layer 31 is connected to the lower surface of the second conductive adhesive layer through the second connecting adhesive layer 32. The second shielding layer 31 does not completely cover the lower surface of the second conductive adhesive layer. The lower surface in the middle of the second conductive adhesive layer is covered, and the lower surfaces at both ends of the second conductive adhesive layer are exposed but not covered. The covered area of ​​the lower surface of the second conductive adhesive layer can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the second conductive adhesive layer can be used for conductive connection with other conductive components.

[0201] The second structure of the conductive tape in this embodiment is as follows: Fig.52 As shown, the difference from the first structure of the conductive tape in this embodiment is that the first conductive adhesive layer covers a partial area on the upper surface of the conductive base layer 11, that is, the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, exposing the upper surface of the right end of the conductive base layer 11, and the second conductive adhesive layer covers the entire area on the lower surface of the conductive base layer 11. In other embodiments, the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, exposing the upper surface of the right end of the conductive base layer 11, and the second conductive adhesive layer covers the lower surface of the left end of the conductive base layer 11, exposing the lower surface of the right end of the conductive base layer 11.

[0202] The third structure of the conductive tape in this embodiment is as follows: Fig.53As shown, the difference from the first structure of the conductive tape in this embodiment is that in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12, and the conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. Above the conductive base layer 11, the conductive coating 13 covers the entire area on the upper surface of the conductive base layer 11, the lower surface of the first conductive adhesive layer is connected to the upper surface of the conductive coating 13, and the first conductive adhesive layer covers the entire area on the upper surface of the conductive coating 13. Below the conductive base layer 11, the conductive coating 13 covers the entire area on the lower surface of the conductive base layer 11, the upper surface of the second conductive adhesive layer is connected to the lower surface of the conductive coating 13, and the second conductive adhesive layer covers the entire area on the lower surface of the conductive coating 13.

[0203] The fourth structure of the conductive tape in this embodiment is as follows: Fig.54 As shown, the difference from the second structure of the conductive tape in this embodiment is that a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12 , and the conductive coating 13 improves the conductive performance of the conductive functional layer 10 .

[0204] The fifth structure of the conductive tape in this embodiment is as follows: Fig.55 As shown, the difference from the first structure of the conductive tape in this embodiment is that the first protective layer 20 includes a first insulating coating 23, the first insulating coating 23 is connected to the upper surface of the conductive base layer 11, the first insulating coating 23 does not completely cover the upper surface of the conductive adhesive layer 12, the upper surface of the middle part of the first conductive adhesive layer is covered, the upper surface of the two ends of the first conductive adhesive layer is exposed and not covered, the covered area of ​​the upper surface of the first conductive adhesive layer can be prevented from being corroded or electroplated, and the exposed area of ​​the upper surface of the first conductive adhesive layer can be used for conductive connection with other conductive components. The second protective layer 30 includes a second insulating coating 33, the second insulating coating 33 is connected to the lower surface of the conductive adhesive layer 12, the second insulating coating 33 does not completely cover the lower surface of the second conductive adhesive layer, the lower surface of the middle part of the second conductive adhesive layer is covered, the lower surface of the two ends of the second conductive adhesive layer is exposed and not covered, the covered area of ​​the lower surface of the second conductive adhesive layer can be prevented from being corroded or electroplated, and the exposed area of ​​the lower surface of the second conductive adhesive layer can be used for conductive connection with other conductive components.

[0205] The sixth structure of the conductive tape in this embodiment is as follows: Fig.56As shown, the difference from the fifth structure of the conductive tape in this embodiment is that the first conductive adhesive layer covers a partial area on the upper surface of the conductive base layer 11, that is, the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, exposing the upper surface of the right end of the conductive base layer 11, and the second conductive adhesive layer covers the entire area on the lower surface of the conductive base layer 11. In other embodiments, the first conductive adhesive layer covers the upper surface of the left end of the conductive base layer 11, exposing the upper surface of the right end of the conductive base layer 11, and the second conductive adhesive layer covers the lower surface of the left end of the conductive base layer 11, exposing the lower surface of the right end of the conductive base layer 11.

[0206] Embodiment 11

[0207] like Figure 57-Figure 63 As shown, the conductive tape is a cylindrical structure, which includes a conductive functional layer 10 located at the center of the cylinder, and a third protective layer 70 coated on the periphery of the conductive functional layer 10, and the third protective layer 70 only covers the middle section of the conductive functional layer 10 and exposes the two ends of the conductive functional layer 10. The third protective layer 70 prevents the middle section of the conductive functional layer 10 from being corroded, and the exposed areas at the two ends of the conductive functional layer 10 can be used for conductive connection with other conductive components. The conductive functional layer 10 includes a conductive base layer 11 located at the center of the cylinder, and a conductive adhesive layer 12 coated on the periphery of the conductive base layer 11. In order to improve the conductive performance, a conductive coating 13 is also provided between the conductive base layer 11 and the conductive adhesive layer 12. The conductive base layer 11 constitutes a conductive material layer, or the conductive base layer 11 and the conductive coating 13 together constitute a conductive material layer.

[0208] The first structure of the conductive tape in this embodiment is as follows: Figure 57-58 As shown, the third protective layer 70 specifically includes a third shielding layer 71 and a third connecting adhesive layer 72. The third shielding layer 71 is bonded and coated on the periphery of the electrical functional layer 10 through the third connecting adhesive layer 72. The conductive functional layer 10 includes a conductive base layer 11 located at the center of the cylinder, and a conductive adhesive layer 12 coated on the periphery of the conductive base layer 11. Fig.59 As shown, as a deformed structure, the exposed two ends of the conductive functional layer 10 are flat structures, which facilitates the conductive adhesive layer 12 to be adhered to other conductive components.

[0209] The second structure of the conductive tape in this embodiment is as follows: Figure 60-61 As shown, the difference from the first structure of the conductive tape in this embodiment is that in order to improve the conductive performance of the conductive functional layer 10, a conductive coating 13 is further provided between the conductive base layer 11 and the conductive adhesive layer 12, and the conductive performance of the conductive functional layer 10 is improved by the conductive coating 13. The conductive functional layer 10 includes a conductive base layer 11 located at the center of the cylinder, a conductive coating 13 coated on the outer periphery of the conductive base layer 11, and a conductive adhesive layer 12 coated on the outer periphery of the conductive coating 13.

[0210] The third structure of the conductive tape in this embodiment is as follows: Figure 62-63 As shown, the difference from the first structure of the conductive tape in this embodiment is that the third protective layer 70 specifically includes a third insulating coating 73 , and the third insulating coating 73 is bonded and coated on the periphery of the electrical functional layer 10 .

[0211] In other embodiments, the conductive tape may be in the shape of a prism, including a conductive functional layer 10 located at the center of the prism, and a third protective layer 70 wrapped around the conductive functional layer 10; or the middle section of the conductive tape is in the shape of a prism, and the two ends of the conductive tape are flat. For example, the conductive tape may be in the shape of a triangular prism, including a conductive functional layer 10 located at the center of the triangular prism, and a third protective layer 70 wrapped around the conductive functional layer 10.

[0212] Example 12

[0213] like Figure 64-Figure 66 As shown, the conductive tape includes a conductive functional layer 10, a first protective layer 20 is arranged on the upper surface of the conductive functional layer 10, and a second protective layer 30 is arranged on the lower surface of the conductive functional layer 10. The conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12, the conductive base layer 11 constitutes a conductive material layer, the upper surface of the conductive adhesive layer 12 is connected to the lower surface of the conductive base layer 11, and the conductive adhesive layer 12 covers the entire or partial area on the lower surface of the conductive base layer 11. The first protective layer 20 and / or the second protective layer 30 can refer to or quote the structures in the aforementioned embodiments 1-9. There are at least two exposed parts of the conductive functional layer 10, one of which is used to bond the first conductive component and is the first exposed part, and the other is used to bond or connect the second conductive component and is the second exposed part. In a specific application embodiment, the conductive tape is used as a conductive connector for electroplating of a battery cell, the first conductive component can be a seed layer or a TCO layer on the battery cell, etc., and the second conductive component can be a conductive clip or a conductive bracket. As shown in FIG. Fig.64 As shown, the first exposed portion is the lower surface of the left end of the conductive functional layer 10, specifically the lower surface of the left end of the conductive adhesive layer 12, and the second exposed portion is the lower surface of the right end of the conductive functional layer 10, specifically the lower surface of the right end of the conductive adhesive layer 12. Fig.65 As shown, the first exposed portion is the lower surface of the left end of the conductive functional layer 10, specifically the lower surface of the left end of the conductive adhesive layer 12, and the second exposed portion is the upper surface of the right end of the conductive functional layer 10, specifically the upper surface of the right end of the conductive base layer 11. Fig.66As shown, the first exposed portion is a glue-exposed groove 30a connected to the lower surface of the conductive functional layer 10, and specifically can be a glue-exposed groove 30a connected to the lower surface of the conductive adhesive layer 12, and the second exposed portion is the lower surface of the right end of the conductive functional layer 10, and specifically can be the lower surface of the right end of the conductive adhesive layer 12. Assuming that the dimension of the first exposed portion extending along the length direction of the conductive tape is a, that is, the length of the first exposed portion is a, the dimension of the second exposed portion extending along the length direction of the conductive tape is b, that is, the length of the second exposed portion is b, and the length of the conductive tape is L, then 0.01L≤a<0.5L, 0.01L≤b<0.5L, 0.02L≤a+b<L; preferably, 0.05L≤a≤0.2L, 0.05L≤b≤0.4L, 0.1L≤a+b≤0.6L are satisfied. The values ​​of a and b should be moderate; if they are too large, the conductive functional layer 10 will be overly exposed, and the first protective layer 20 and / or the second protective layer 30 will not be able to provide good protection. In addition, the area of ​​the first exposed portion is too large, which makes it too firmly bonded to the first conductive component, and it is easy to leave residual glue on the first conductive component; if they are too small, it is easy to cause poor contact. In addition, the area of ​​the first exposed portion is too small, which makes it loosely bonded to the first conductive component, and the conductive tape is easy to fall off the first conductive component.

[0214] Example 13

[0215] Based on the above-mentioned embodiments 1-10, the conductive functional layer 10 at least includes a conductive base layer 11 and a conductive adhesive layer 12. The material of the conductive base layer 11 includes, but is not limited to, one of gold, silver, platinum, copper, aluminum, nickel and stainless steel, or an alloy material composed of any two or more thereof, or a multilayer structure formed by stacking multiple of gold, silver, platinum, copper, aluminum, nickel and stainless steel in the thickness direction.

[0216] The conductive adhesive layer 12 is a conductive pressure-sensitive adhesive layer or a conductive heat-sensitive adhesive layer or a non-woven conductive adhesive layer. The conductive adhesive layer 12 includes a matrix and a conductive filler. The matrix includes an adhesive, a curing agent and a diluent, and may also include additives such as a plasticizer, a coupling agent and a defoaming agent. The adhesive may be an epoxy resin, a phenolic resin, a polyimide, an acrylic resin, or a polyurethane. The conductive filler may be carbon, a metal or a metal oxide, preferably a single metal powder or a mixture of multiple metal powders with low resistivity such as Au, Ag, Cu and Ni. For example, the material composition of the conductive adhesive layer 12 includes a pressure-sensitive adhesive acrylic resin and a plasticizer, wherein the plasticizer may be di-n-octyl phthalate or di-n-butyl phthalate, which may improve the removability of the conductive adhesive layer 12 and reduce or avoid the risk of leaving residual adhesive during the peeling process between the conductive adhesive layer 12 and the adhered object. The conductive adhesive layer 12 may include only an adhesive and a conductive filler, for example, the conductive adhesive layer 12 includes an acrylic resin and Ni powder.

[0217] The conductive functional layer 10 further includes a conductive coating 13 . The conductive coating 13 may be a carbon-coated layer. For example, the conductive functional layer 10 may be a carbon-coated copper foil or a carbon-coated aluminum foil.

[0218] The first shielding layer 21 may be an insulating film layer or a hydrophobic film layer, the second shielding layer 31 may be an insulating film layer or a hydrophobic film layer, and the third shielding layer 71 may be an insulating film layer or a hydrophobic film layer. The materials of the first shielding layer 21, the second shielding layer 31 and the third shielding layer 71 may all be polyethylene terephthalate (PET), polyethylene (PE) or polypropylene (PP). The materials of the first connecting adhesive layer 22, the second connecting adhesive layer 32 and the third connecting adhesive layer 72 may all be silicone.

[0219] Embodiment 14

[0220] Based on the above embodiments 1-11, Figure 67-Figure 71 As shown, this embodiment provides a conductive tape assembly, which includes a conductive tape 1 and a base film 50. The conductive tape 1 is bonded to the base film 50, which is convenient for the storage and transportation of the conductive tape 1. For example, the conductive tape 1 is bonded to the base film 50, and the conductive tape assembly is rolled up to form a roll material, which is convenient for the storage and transportation of the conductive tape 1; when in use, the conductive tape 1 can be torn off from the base film 50. Fig.67 As shown, the conductive functional layer 10 of the conductive tape 1 is bonded to the base film 50. Specifically, the conductive functional layer 10 includes a conductive adhesive layer 12, and the conductive adhesive layer 12 is bonded to the base film 50. Fig.68 As shown, the second protective layer 30 of the conductive tape 1 is bonded to the base film 50 . Specifically, the second protective layer 30 may not have an adhesion function. A third connecting adhesive layer 51 is provided on the base film 50 , and the second protective layer 30 is bonded to the base film 50 through the third connecting adhesive layer 51 .

[0221] The arrangement structure of the conductive tape 1 on the base film 50 can be Figure 69-Figure 71 The structure shown. Fig.69 As shown, the length extension direction of the conductive tape 1 is the same as the length extension direction of the base film 50. The conductive tape 1 is arranged on the base film 50 in a rectangular array. A plurality of conductive tapes 1 are arranged along the length direction of the base film 50, and a plurality of conductive tapes 1 are also arranged along the width direction of the base film 50. Fig.70 As shown, the length extension direction of the conductive tape 1 is the same as the width extension direction of the base film 50, and the conductive tape 1 is arranged on the base film 50 in a linear array, and multiple conductive tapes 1 are arranged at intervals along the length direction of the base film 50. Fig.71 As shown, the conductive tapes 1 are divided into two groups along the width direction of the base film 50 , and each group of conductive tapes 1 is tiltedly arranged on the base film 50 and spaced apart along the length direction of the base film 50 , and each group of conductive tapes 1 is in a linear array.

[0222] Embodiment 15

[0223] This embodiment provides a battery cell, on which a conductive tape 1 is bonded, and the conductive tape 1 can refer to or refer to the structure in the above embodiments 1 to 11. When electroplating metal grid lines on the battery cell 2, the conductive tape 1 is used to connect the battery cell 2 and the negative electrode of the electroplating power source.

[0224] Specifically, the conductive tape 1 includes a conductive functional layer 10 and a surface protective layer (for example, a first protective layer 20 and / or a second protective layer 30), the conductive functional layer 10 is covered by the surface protective layer and at least two parts of the conductive functional layer 10 are exposed, one of which is used to bond to the area to be electroplated on the battery cell 2, called the first exposed part, and the other is used to bond or connect the second conductive component, called the second exposed part, the second conductive component is electrically connected to the negative pole of the electroplating power supply through a wire, the second conductive component can be a conductive clip or a conductive bracket, the second exposed part can be bonded to the conductive clip or the conductive bracket, or the second exposed part is clamped by the conductive clip.

[0225] Specifically, Figure 72-Figure 73 As shown, the area to be electroplated on the cell 2 includes a conductive area at the edge of the cell 2, and the conductive area at the edge of the cell 2 is called a conductive connection point 2a. There are one or more conductive connection points 2a. Fig.72 As shown, conductive connection points 2a are provided on both sides of the battery cell 2, and multiple conductive connection points 2a are provided on each side of the battery cell 2. One end of the conductive tape 1 is bonded to the conductive connection point 2a, that is, the first exposed portion of the conductive tape 1 is connected to the conductive connection point 2a. A conductive tape 1 is bonded to each conductive connection point 2a. Fig.72 As shown, the conductive tape 1 bonded to the battery cell 2 remains straight. In order to facilitate the second exposed portion of the conductive tape 1 to connect to the second conductive component, the conductive tape 1 bonded to the battery cell 2 can be bent, as shown in FIG. Fig.73 As shown, the conductive tape 1 adhered to the battery cell 2 is in a bent state.

[0226] Example 16

[0227] The present embodiment provides an electroplating device, including an electroplating power supply, an electroplating tank 310, an anode 320, a conductive tape 1, and a cathode connector. The electroplating tank 310 is used to contain a plating solution. The anode 320 is disposed in the plating solution. During electroplating, at least the surface of the plated object 2 is located in the plating solution and can face the anode 320. The anode 320 is electrically connected to the positive pole of the electroplating power supply (not shown in the figure). One end of the cathode connector is electrically connected to the negative pole of the electroplating power supply (not shown in the figure). The other end of the cathode connector is connected to one end of the conductive tape 1, and the other end of the conductive tape 1 is connected to the plated surface on the plated object 2. The conductive tape 1 is located in the plating solution, and the other end of the cathode connector is also located in the plating solution. In the present embodiment, the other end of the cathode connector is connected to one end of the conductive tape 1, and the other end of the cathode connector is located in the plating solution, which can shorten the length of the conductive tape used to connect the cathode connector and the plated object 2, thereby reducing the amount and cost of the conductive tape 1.

[0228] It should be noted that the plated surface can face the anode member 320, which means that Fig.74 or Fig.75 In the vertical electroplating structure shown, the plated surface is generally arranged opposite to the anode member 320 to improve the electroplating effect; Fig.76 or Fig.77 In the horizontal electroplating structure shown, if the plated member 2 is movable, the plated surface of the plated member 2 can move to a position facing the anode member 320 during the movement.

[0229] It should be noted that the anode component 320 is electrically connected to the positive electrode of the electroplating power supply, and the anode component 320 may be electrically connected to the positive electrode of the electroplating power supply through a wire. One end of the cathode connector is electrically connected to the negative electrode of the electroplating power supply, and one end of the cathode connector may be electrically connected to the negative electrode of the electroplating power supply through a wire. The other end of the cathode connector is connected to one end of the conductive tape 1, which means that the other end of the cathode connector is mechanically connected and electrically connected to one end of the conductive tape 1, and the mechanical connection includes clamping connection, hinged connection, bonding, snap connection or screw connection, etc., preferably clamping connection, bonding or snap connection. The other end of the conductive tape 1 is connected to the plated surface on the plated part 2, which means that the other end of the conductive tape 1 is mechanically connected and conductively connected to the plated surface on the plated part 2, and the mechanical connection includes clamping connection, hinged connection, bonding, snap connection or screw connection, etc., preferably bonding or snap connection.

[0230] like Fig.74 or Fig.75As shown, a plurality of anodes 320 are vertically arranged in the electroplating tank 310, and the plurality of anodes 320 are arranged parallel to each other. A plating solution is arranged in the electroplating tank 310, and the plating solution covers the top of the anode 320. Each anode 320 is connected to the positive pole of the electroplating power source through a wire. If the plated object 2 is single-sided electroplated, that is, there is only one plated surface, a conductive tape 1 is connected to the one plated surface, and the one plated surface is arranged opposite to one anode 320, and the conductive tape 1 is completely immersed in the plating solution, one end of the cathode connector is electrically connected to the negative pole of the electroplating power source, and the other end of the cathode connector extends into the plating solution to connect to one end of the conductive tape 1, and the cathode connector is arranged above the anode 320. If the plated object 2 is double-sided electroplated, that is, the plated surfaces are two surfaces arranged opposite to each other, the two plated surfaces are connected with conductive tapes 1, the two plated surfaces are respectively arranged opposite to the two anode components 320, the conductive tapes 1 are completely immersed in the electroplating solution, the conductive tapes 1 on the two plated surfaces are connected with a cathode connector, one end of the cathode connector is electrically connected to the negative pole of the electroplating power source, and the other end of the cathode connector extends into the electroplating solution to connect one end of the conductive tapes 1 on the two plated surfaces, and the cathode connector is arranged above the anode component 320. Alternatively, the conductive tapes 1 on the two plated surfaces are respectively connected with two cathode connectors. Fig.74 In the specific embodiment shown, the cathode connecting member is a conductive rod 100a. Fig.75 In the specific embodiment shown, the cathode connector is a clamp 100. The cathode connector may also be other clamp structures.

[0231] like Fig.76 or Fig.77 As shown, a conveying mechanism is provided in the electroplating tank 310. The conveying mechanism is a roller conveying mechanism, including an upper roller 331 and a lower roller 332, which are arranged to rotate. The upper roller 331 and the lower roller 332 are arranged to rotate to form a conveying interval, and the plated object 2 is transported in the conveying interval. The anode member 320 is arranged above or below the conveying mechanism, or is arranged above and below the conveying mechanism at the same time. There are multiple anode members 320 arranged horizontally, and the multiple anode members 320 are arranged at intervals along the length extension direction of the electroplating tank 310. The electroplating solution is set in the electroplating tank 310, and the electroplating solution at least covers the side of the anode member 320 facing the plated object 2. Each anode member 320 is connected to the positive pole of the electroplating power supply through a wire. Fig.74 In the specific embodiment shown, the cathode connecting member is a conductive rod 100a. Fig.75In the specific embodiment shown, the cathode connector is a clamp 100. The cathode connector may also be other clamp structures. In order to reduce the influence on the electroplating electric field between the anode member 320 and the plated member 2, the upper roller 331 is arranged at intervals along the conveying direction of the plated member 2, and at least a part of the anode member 320 is opposite to the interval of the upper roller 331, so that the electric field can act on the plated member 2 through the interval of the upper roller 331. Similarly, the setting method of the lower roller 332 is similar to that of the upper roller 331. In order to avoid the conductive tape 1 on the plated member 2, the upper roller 331 is a cantilevered half-roller structure.

[0232] In some embodiments, the cathode connector is a conductive rod 100a; one end of the conductive rod 100a is electrically connected to the negative electrode of the electroplating power source through a wire, and one end of the conductive tape 1 is bonded and electrically connected to the other end of the conductive rod 100a. Both ends of the conductive rod 100a are exposed for conductive connection to other components, and the middle of the conductive rod 100a is coated with an insulating material layer to reduce the electroplated area on the conductive rod 100a, so that only the end of the conductive rod 100a extending into the electroplating solution will be electroplated.

[0233] In some embodiments, the cathode connector is a clamp 100; the clamp 100 includes a first clamping portion and a second clamping portion, at least one of the first clamping portion and the second clamping portion is a conductive clamping portion; a conductive contact 130 is provided on the clamping end of the conductive clamping portion, and the conductive contact 130 is connected to the negative pole of the electroplating power supply through an external wire or a built-in wire of the conductive clamping portion, and the surface of the conductive clamping portion is an insulating material layer or the surface of the conductive clamping portion immersed in the electroplating solution is an insulating material layer to prevent the surface of the conductive clamping portion immersed in the electroplating solution from being electroplated.

[0234] In some embodiments, the clamping end of the conductive clamping part is further provided with a first sealing member 140 surrounding the conductive contact 130; in the working state, the clamping end of the first clamping part and the clamping end of the second clamping part respectively abut against two surfaces on one end of the conductive tape 1 to clamp the conductive tape 1, that is, the first sealing member 140 surrounding the conductive contact 130 abuts against one side of the conductive tape 1 to form a sealed space, and the conductive contact 130 abuts against one side of the conductive tape 1 to electrically connect the conductive tape 1. The conductive contact 130 is protected by the sealed space to prevent the conductive contact 130 from being electroplated.

[0235] In combination with the aforementioned embodiment, the surface of the conductive clamping part is an insulating material layer or the surface of the conductive clamping part immersed in the electroplating solution is an insulating material layer, thereby preventing the surface of the conductive clamping part immersed in the electroplating solution from being electroplated; and a first sealing member 140 arranged outside the conductive contact 130 abuts against one side of the conductive tape 1 to form a sealed space, thereby preventing the conductive contact 130 from being electroplated; in this way, neither the conductive clamping part nor the conductive contact 130 will be electroplated, thereby eliminating the subsequent process of pin-plating the conductive clamping part and the conductive contact 130.

[0236] In some embodiments, the conductive contact 130 is a retractable structure or the head or the entire conductive contact 130 is made of a conductive rubber material, such as conductive silicone.

[0237] In some embodiments, the clamping end of the first clamping portion is referred to as the first clamping end, and the clamping end of the second clamping portion is referred to as the second clamping end; the first clamping end is provided with a conductive contact 130 and a first seal 140 surrounding the conductive contact 130, and the second clamping end is provided with an insulating contact; or, the second clamping end is provided with a conductive contact 130 and a first seal 140 surrounding the conductive contact 130, and the first clamping end is provided with an insulating contact; or, the first clamping end and the second clamping end are both provided with a conductive contact 130 and a first seal 140 surrounding the conductive contact 130.

[0238] In some embodiments, Figure 78-Figure 81 As shown, the conductive clamping part includes a clamping seat 120, a first countersunk hole 120a is provided on the top of the clamping seat 120, a first mounting hole 120b is provided on one side wall of the clamping seat 120, a conductive contact 130 is provided in the first mounting hole 120b and partially extends out of the first mounting hole 120b, the first countersunk hole 120a is connected to the first mounting hole 120b, an external conductive member 110 is provided in the first countersunk hole 120a, and one end of the external conductive member 110 is mechanically and electrically connected to the conductive contact 130. The first mounting hole 120b is a countersunk hole, and the first mounting hole 120b is connected to the sealed space, so that the first mounting hole 120b and the conductive contact 130 are both isolated from the plating solution.

[0239] Preferably, a first mounting hole 120b is provided on the side wall of the clamping seat 120 and passes through the clamping seat 120 transversely. The head of the conductive contact 130 extends out of the first mounting hole 120b and is close to an opening of the conductive tape 1, and is in a sealed space. The tail of the conductive contact 130 extends out of the first mounting hole 120b and is away from another opening of the conductive tape 1 or is in the first mounting hole 120b, and the tail of the conductive contact 130 is insulated, for example, coated with Teflon.

[0240] In some embodiments, the conductive contact 130 includes a mounting seat and a telescopic member 132, the mounting seat is provided with a second mounting hole 131a, a compressible medium or an elastic member is provided in the second mounting hole 131a, one end of the telescopic member 132 is provided in the second mounting hole 131a and abuts the compressible medium or the elastic member, and the other end of the telescopic member 132 extends out of the second mounting hole 131a; the telescopic member 132 is slidably connected to the second mounting hole 131a, and the telescopic member 132 is electrically connected to the mounting seat. In the working state, one end of the telescopic member 132 extending out of the second mounting hole 131a abuts against the conductive point of the conductive tape 1. By abutting the conductive point of the conductive tape 1 with the telescopic member 132, the conductive contact 130 and the conductive tape 1 can be prevented from rigidly contacting, thereby damaging the conductive tape 1.

[0241] In some embodiments, the mounting seat includes a first shaft segment 1311, a second shaft segment 1312, and a third shaft segment 1313 connected in sequence. The shaft diameters of the first shaft segment 1311, the second shaft segment 1312, and the third shaft segment 1313 increase in sequence. A first mounting hole 120b is provided on the side wall of the clamping seat 120, which passes through the clamping seat 120 transversely. The hole diameter of the first mounting hole 120b is a variable diameter, which is adapted to the corresponding first shaft segment 1311, the second shaft segment 1312, and the second shaft segment 1313. The third shaft segment 1313 extends out of one opening of the first mounting hole 120b, and the first shaft segment 1311 extends out of the other opening of the first mounting hole 120b; the telescopic member 132 is provided on the first shaft segment 1311. Through the third shaft segment 1313 extending out of one opening of the first mounting hole 120b, the conductive contact 130 can be quickly disassembled and replaced.

[0242] In some embodiments, a third mounting hole 131b is arranged around the second shaft section 1312, and a second sealing member 150 is sleeved in the third mounting hole 131b. The second sealing member 150 is an annular ring structure, and the inner ring of the second sealing member 150 abuts against the bottom of the third mounting hole 131b, and the outer ring of the second sealing member 150 abuts against the inner wall of the first mounting hole 120b. The sealing of the second sealing member 150 can reduce the risk of the plating solution entering the sealed space from the first mounting hole 120b. Preferably, one end of the external conductive member 110 is an annular structure, and one end of the external conductive member 110 is sleeved on the second shaft section 1312.

[0243] In some embodiments, a fourth mounting hole 120c is provided on the clamping end of the conductive clamping portion, and the fourth mounting hole 120c is arranged around an opening of the telescopic member 132 extending out of the second mounting hole 131a. The first sealing member 140 is an annular structure, and the first sealing member 140 is clamped in the fourth mounting hole 120c, and the surface of the first sealing member 140 extends out of the fourth mounting hole 120c.

[0244] In some embodiments, when the first clamping portion or the second clamping portion is an insulating clamping portion 220, an elastic abutment 221 is protruded from the clamping end of the insulating clamping portion 220. The elastic abutment 221 contacts one side of the conductive tape 1, thereby preventing the insulating clamping portion 220 from rigidly contacting one side of the conductive tape 1, thereby reducing the risk of damage to the conductive tape 1.

[0245] Preferably, an annular groove 220a is provided on the clamping end of the insulating clamping portion 220, and the elastic abutment member 221 is clamped in the annular groove 220a.

[0246] In some embodiments, both sides of the workpiece 2 are plated surfaces, there are multiple cathode connectors, some of the cathode connectors are connected to one plated surface of the workpiece 2 through the conductive tape 1, and the other cathode connectors are connected to the other plated surface of the workpiece 2 through the conductive tape 1.

[0247] On the other hand, the present embodiment further provides an electroplating device, including an electroplating power source, an electroplating tank 310, an anode component 320, a conductive tape 1, and a cathode connector. The electroplating tank 310 is used to contain a plating solution. The anode component 320 is disposed in the electroplating solution. The anode component 320 is electrically connected to the positive electrode of the electroplating power source. One end of the cathode connector is electrically connected to the negative electrode of the electroplating power source. The other end of the cathode connector can extend into a preset position in the electroplating solution to connect to one end of the conductive tape 1 in the electroplating solution. The other end of the conductive tape 1 is connected to a plated surface on a plated object 2. When the plated object 2 is electroplated, at least the plated surface is located in the electroplating solution and the plated surface is disposed opposite to the anode component 320. The cathode connector can be the aforementioned conductive rod 100a or the clamp 100. In this embodiment, the other end of the cathode connector can extend into a preset position in the electroplating solution to connect to one end of the conductive tape 1 in the electroplating solution, thereby shortening the length of the conductive tape 1 used to connect the cathode connector and the plated object 2, thereby reducing the amount and cost of the conductive tape 1.

[0248] It should be noted that the plated surface and the anode member 320 are arranged opposite to each other. Fig.74 or Fig.75 In the vertical electroplating structure shown, the plated surface is generally arranged opposite to the anode member 320 to improve the electroplating effect; Fig.76 or Fig.77 In the horizontal electroplating structure shown, if the plated member 2 is movable, the plated surface of the plated member 2 can move to a position facing the anode member 320 during the movement.

[0249] On the other hand, the present embodiment further provides an electroplating method, comprising the following steps: placing the plated surface of the plated object 2 in the electroplating solution; connecting the negative electrode of the electroplating power source to the plated surface of the plated object 2 through the cathode connector and the conductive tape 1 in sequence; and placing the conductive tape 1 and one end of the cathode connector connected to the conductive tape 1 in the electroplating solution to shorten the length of the conductive tape 1. The cathode connector is located in the electroplating solution, which can shorten the length of the conductive tape used to connect the cathode connector and the plated object 2.

[0250] The surface of the cathode connector is insulated, or the surface of the cathode connector immersed in the electroplating solution is insulated to expose the portion of the cathode connector used for conductive connection; the conductive tape 1 is insulated to expose the portion of the conductive tape 1 used for conductive connection. In this way, the surface of the cathode connector and the conductive tape 1 immersed in the electroplating solution can be prevented from being electroplated.

[0251] It should be noted that the conductive tape 1 mentioned in Example 16 can adopt the structure in Examples 1-12, but is not limited to the structure in Examples 1-12. The conductive adhesive layer 12 exposed on one end of the conductive tape 1 is bonded and connected to the plated part 2, and the plated part 2 includes but is not limited to a battery cell, a PCB or a chip, preferably a battery cell. The conductive functional layer 10 (conductive substrate layer 11, conductive adhesive layer 12 or conductive coating 13) exposed on the other end of the conductive tape 1 is conductively connected to the cathode connector. The plated part 2 and the cathode connector can be understood as other conductive components in Examples 1-12. The cathode connector can be the aforementioned clamp 100 or the conductive rod 100a.

[0252] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. An electroplating device, characterized in that: The invention comprises an electroplating power source, an electroplating tank, an anode component, a conductive tape and a cathode connector. The electroplating tank is used to contain the electroplating solution. The anode component is arranged in the electroplating solution. During electroplating, at least the surface of the object to be plated is located in the electroplating solution and the surface to be plated can face the anode component. The anode component is electrically connected to the positive pole of the electroplating power source. One end of the cathode connector is electrically connected to the negative pole of the electroplating power source. The other end of the cathode connector is connected to one end of the conductive tape. The other end of the conductive tape is connected to the surface to be plated on the object to be plated. The conductive tape is located in the electroplating solution. The other end of the cathode connector is also located in the electroplating solution.

2. The electroplating equipment according to claim 1, characterized in that: The cathode connector is a conductive rod; one end of the conductive rod is electrically connected to the negative electrode of the electroplating power source through a wire, and one end of the conductive tape is bonded and electrically connected to the other end of the conductive rod.

3. The electroplating equipment according to claim 2, characterized in that: Both ends of the conductive rod are exposed, and the middle part of the conductive rod is covered with an insulating material layer.

4. The electroplating equipment according to claim 1, characterized in that: The cathode connector is a clamp; the clamp includes a first clamping part and a second clamping part, at least one of the first clamping part and the second clamping part is a conductive clamping part; a conductive contact is provided on the clamping end of the conductive clamping part, the conductive contact is connected to the negative pole of the power supply through an external wire or a built-in wire of the conductive clamping part, and the surface of the conductive clamping part is an insulating material layer or the surface of the conductive clamping part immersed in the electroplating solution is an insulating material layer.

5. The electroplating equipment according to claim 4, characterized in that: A first sealing member is also provided on the clamping end of the conductive clamping part and is arranged outside the conductive contact; in the working state, the clamping end of the first clamping part and the clamping end of the second clamping part respectively abut the two sides on one end of the conductive tape to clamp the conductive tape; the first sealing member arranged outside the conductive contact abuts one side of the conductive tape to form a sealed space, and the conductive contact abuts one side of the conductive tape.

6. The electroplating equipment according to claim 5, characterized in that: The conductive contact is a retractable structure, or the head or the entire conductive contact is made of conductive rubber material.

7. The electroplating equipment according to claim 5, characterized in that: The conductive clamping portion comprises a clamping seat, a first countersunk hole is arranged on the top of the clamping seat, a first mounting hole is arranged on a side wall of the clamping seat, the conductive contact is arranged in the first mounting hole and partially extends out of the first mounting hole, the first countersunk hole is connected to the first mounting hole, an external conductive member is arranged in the first countersunk hole, and one end of the external conductive member is mechanically and electrically connected to the conductive contact; The conductive contact includes a mounting seat and a telescopic member, the mounting seat is provided with a second mounting hole, a compressible medium or an elastic member is provided in the second mounting hole, one end of the telescopic member is provided in the second mounting hole and abuts against the compressible medium or the elastic member, and the other end of the telescopic member extends out of the second mounting hole; the telescopic member is slidably connected to the second mounting hole, and the telescopic member is electrically connected to the mounting seat.

8. The electroplating equipment according to claim 5, characterized in that: A fourth mounting hole is provided on the clamping end of the conductive clamping part, and the fourth mounting hole is arranged around an opening of the telescopic member extending out of the second mounting hole. The first sealing member is an annular structure, and the first sealing member is clamped in the fourth mounting hole, and a surface of the first sealing member extends out of the fourth mounting hole.

9. The electroplating equipment according to claim 1, characterized in that: Both sides of the plated object are plated surfaces, and there are multiple cathode connectors. Some of the cathode connectors are connected to one plated surface of the plated object through conductive tape, and the other cathode connectors are connected to the other plated surface of the plated object through conductive tape.

10. The electroplating equipment according to any one of claims 1 to 9, characterized in that: The conductive tape includes a conductive functional layer, a first protective layer is arranged on the upper surface of the conductive functional layer and / or a second protective layer is arranged on the lower surface of the conductive functional layer; the conductive functional layer at least includes a conductive material layer and a conductive adhesive layer, the upper surface of the conductive adhesive layer is connected to the lower surface of the conductive material layer, and the conductive adhesive layer covers the entire or partial area on the lower surface of the conductive material layer; the lower surface of the conductive adhesive layer is formed as the lower surface of the conductive functional layer, and when the second protective layer is arranged on the lower surface of the conductive adhesive layer, the second protective layer does not completely cover the lower surface of the conductive adhesive layer.

11. The electroplating equipment according to claim 10, characterized in that: When a first protective layer is disposed on the upper surface of the conductive functional layer, the first protective layer includes a first shielding layer and a first connecting adhesive layer, and the first shielding layer is connected to the upper surface of the conductive functional layer through the first connecting adhesive layer, or the first protective layer includes a first insulating coating layer, and the first insulating coating layer is connected to the upper surface of the conductive functional layer; When a second protective layer is provided on the lower surface of the conductive functional layer, the second protective layer includes a second shielding layer and a second connecting adhesive layer, and the second shielding layer is connected to the lower surface of the conductive functional layer through the second connecting adhesive layer, or the second protective layer includes a second insulating coating, and the second insulating coating is connected to the lower surface of the conductive functional layer.

12. The electroplating equipment according to claim 10, characterized in that: The conductive adhesive layer includes an adhesive and a conductive filler, the adhesive includes epoxy resin, phenolic resin, polyimide, acrylic resin or polyurethane, and the conductive filler includes carbon, metal or metal oxide, wherein the metal includes at least Au, Ag, Cu or Ni.

13. The electroplating equipment according to claim 10, characterized in that: The conductive adhesive layer further includes one or more of a curing agent, a diluent, a plasticizer, a coupling agent and a defoaming agent. When a plasticizer is included, the plasticizer includes at least di-n-octyl phthalate or di-n-butyl phthalate.

14. The electroplating equipment according to claim 10, characterized in that: The conductive functional layer has at least two exposed parts, one of which is used for bonding the first conductive component and is called a first exposed part, and the other is used for bonding or connecting the second conductive component and is called a second exposed part; The first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the lower surface of the other end of the conductive functional layer; or, the first exposed portion is the lower surface of one end of the conductive functional layer, and the second exposed portion is the upper surface of the other end of the conductive functional layer; or, the first exposed portion is a glue dew groove connected to the lower surface of the conductive functional layer, and the second exposed portion is the lower surface of the conductive functional layer away from the glue dew groove.

15. The electroplating equipment according to any one of claims 1 to 9, characterized in that: The conductive tape is cylindrical or prism-shaped, including a conductive functional layer located at the center of the cylinder or prism, and a third protective layer wrapped around the conductive functional layer. The third protective layer only covers the middle section of the conductive functional layer and exposes both ends of the conductive functional layer.

16. An electroplating device, characterized in that: It includes an electroplating power supply, an electroplating tank, an anode component, a conductive tape and a cathode connector. The electroplating tank is used to contain the electroplating solution. The anode component is arranged in the electroplating solution. The anode component is electrically connected to the positive electrode of the electroplating power supply. One end of the cathode connector is electrically connected to the negative electrode of the electroplating power supply. The other end of the cathode connector can extend into a preset position in the electroplating solution to connect to one end of the conductive tape in the electroplating solution. The other end of the conductive tape is connected to a receiving surface on the receiving component. When electroplating, at least the receiving surface of the receiving component is located in the electroplating solution and the receiving surface is arranged opposite to the anode component.

17. An electroplating method, characterized in that: The following steps are involved: placing the plated surface of the plated object into the electroplating solution; The negative electrode of the electroplating power source is connected to the plated surface of the plated object through the cathode connector and the conductive tape in sequence; The conductive tape and one end of the cathode connector connected to the conductive tape are placed in the electroplating solution to shorten the length of the conductive tape.

18. The electroplating method according to claim 17, characterized in that: Insulating the surface of the cathode connector, or insulating the surface of the cathode connector immersed in the electroplating solution, to expose the portion of the cathode connector used for conductive connection; The conductive tape is insulated to expose a portion of the conductive tape for conductive connection.

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