Electroplating device for processing integrated circuit board

Abstract

The invention relates to the technical field of circuit board electroplating equipment, and discloses an electroplating device for integrated circuit board processing, the electroplating device comprises an electroplating bath and a floating block, the top of the electroplating bath is provided with a cathode guide rail, and the outer side of the cathode guide rail is fixedly sleeved with a plurality of hanging rings; and a plurality of nozzles capable of adjusting the flow of sprayed electroplating liquid are arranged at the bottom of the electroplating bath. Electroplating liquid circulates in the electroplating bath through the nozzles, the liquid level fluctuation of the electroplating liquid is increased, a circuit board ascends and descends along with the fluctuation of the liquid level under the action of buoyancy, then the circuit board is driven to move back and forth in a transmission mode, and the circuit board is driven to move back and forth under the flowing action and self-shaking of the electroplating liquid sprayed out of the nozzles. Balance between bubbles attached to the side face is broken through, the bubbles break away from the surface of the circuit board and float in an accelerated mode under driving of the electroplating liquid to be discharged out of the surface of the electroplating liquid, pinholes in the surface of the circuit board caused by the bubbles generated by hydrogen evolution are avoided, and the yield of the circuit board is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board electroplating equipment, in particular to an electroplating device for processing integrated circuit boards. Background Art

[0002] Integrated circuit boards are important electronic components used to support electronic components. In the production process of integrated circuit boards, circuit board electroplating equipment is required to electroplate the integrated circuit boards to deposit the required metals. Existing circuit board electroplating equipment includes an electroplating tank and a cathode rail. The cathode rail is connected to a plurality of electroplating clamps through a hanging ring. The electroplating clamps are used to clamp the circuit board. When in use, the cathode rail is driven to move to the corresponding electroplating tank through the gantry moving mechanism, so that the circuit board is vertically immersed in the electroplating tank. Anode plates are provided on both sides of the circuit board in the electroplating tank, and a nozzle is used to form a flowing electroplating solution. Through the action of electrolysis, the cations of the pre-plated metal in the electroplating solution are deposited on the surface of the base metal of the circuit board to form a plating layer.

[0003] However, during the use of traditional circuit board electroplating equipment, the inevitable cathode hydrogen evolution phenomenon will occur on both sides of the circuit board. The bubbles generated by the hydrogen evolution adhere to the electroplating surface, which can easily cause pinholes in the circuit board, resulting in a decrease in the yield rate of circuit board electroplating. Summary of the invention

[0004] In view of the shortcomings of the existing paint heating device mentioned in the background technology during use, the present invention provides an electroplating device for integrated circuit board processing, which has the advantages of avoiding long-term adhesion of bubbles and improving electroplating quality, and solves the technical problems raised in the above background technology.

[0005] The present invention provides the following technical solution: an electroplating device for processing integrated circuit boards, comprising an electroplating tank and a floating block, wherein a cathode guide rail is arranged on the top of the electroplating tank, a plurality of hanging rings are fixedly sleeved on the outer side of the cathode guide rail, a plurality of nozzles for adjusting the flow rate of the electroplating liquid are arranged on the bottom of the electroplating tank, an outer rod is fixedly connected to the bottom of the hanging ring, and a liftable inner rod is slidably sleeved on the inner side of the outer rod.

[0006] The bottom end of the inner rod is fixedly connected with a plating clamp for clamping the circuit board, and the two sides of the floating block are fixedly connected with connecting rods for driving the plating clamp to rise and fall. The floating block drives the circuit board to move up and down in cooperation with the connecting rod and the plating clamp under the action of buoyancy through liquid surface fluctuations.

[0007] Preferably, the inner rod is T-shaped and the wider end is slidably sleeved inside the outer rod, and a spring is movably sleeved on the inner side of the outer rod.

[0008] Preferably, the direction in which the water flow is sprayed from the nozzle is parallel to the side of the circuit board and the nozzle is arranged at an angle.

[0009] Preferably, the top of the floating block is fixedly connected with a push rod, the outer side of the push rod is slidably sleeved with a buffer cylinder, the inner side of the buffer cylinder is slidably sleeved with a sliding plug, and the top and bottom of one side of the buffer cylinder are fixedly provided with a ventilation pipe, and the buffer cylinder, sliding plug and ventilation pipe cooperate to form a damper.

[0010] Preferably, the bottom of the cathode guide rail is fixedly connected to a fixing plate, a float rod is slidably sleeved on the inner side of the fixing plate, the float rod partially extends out of the fixing plate, the top of the float rod is fixedly connected to a variable resistance mechanism, the tube body of the ventilation pipe is fixedly provided with a No. 2 proportional valve, and the variable resistance mechanism and the No. 2 proportional valve are electrically connected in series.

[0011] Preferably, the variable resistance mechanism includes two wiring blocks for connecting to the circuit, a resistance rod is fixedly connected to the top of the wiring block, the two resistance rods are arranged in parallel, and an electric slider for connecting the resistance rods is slidably sleeved on the outer sides of the two resistance rods, the electric slider is fixedly connected to the float rod, and the resistance rod and the No. 2 proportional valve are connected to the No. 2 circuit in series.

[0012] Preferably, the number of the variable resistance mechanisms is set to two, a No. 1 proportional valve is fixedly provided on the nozzle, a connecting plate is fixedly provided on one side of the inner part of the cathode guide rail, and two contacts for electrical connection with the No. 1 proportional valve are fixedly provided at the bottom of the connecting plate located outside the cathode guide rail; A contact sheet corresponding to two contacts is arranged on the top of one side of the electroplating tank. One of the two variable resistance mechanisms cooperates with the two contacts to connect the corresponding two resistance rods to the No. 1 circuit in series with the No. 1 proportional valve.

[0013] Preferably, two parallel anode plates are fixedly connected to the bottom of the electroplating tank, and the No. 1 proportional valve and the No. 2 proportional valve are both electromagnetic proportional valves.

[0014] The present invention has the following beneficial effects: 1. The present invention increases the fluctuation of the liquid level through the electroplating liquid sprayed by the nozzle, and then makes the float float under the action of buoyancy through the fluctuation of the liquid level of the electroplating liquid, cooperates with the connecting rod and the electroplating clamp to drive the circuit board to move synchronously while electroplating, and cooperates with the sliding plug, the buffer cylinder and the vent pipe to generate damping when the float moves, so that the float moves up and down smoothly under the damping action of the top rod, and through the swing and the cooperation of the flowing electroplating liquid, the balance between the circuit board and the bubbles attached to the side of the circuit board is broken, so that the bubbles are separated from the circuit board and accelerated to float to the liquid surface driven by the flow of the electroplating liquid, so as to avoid the bubbles adhering to the surface of the circuit board and causing pinholes in the electroplating, and the electroplating liquid sprayed by the nozzle changes the area through which the plating liquid flows through through the displacement of the circuit board, thereby improving the exchange efficiency of the plating liquid with the circuit board, and improving the yield rate of the circuit board electroplated by the electroplating device.

[0015] 2. The present invention uses a float rod in conjunction with an electric slider and a resistor rod so that the current liquid level is negatively correlated with the opening of the No. 2 proportional valve of the ventilation pipe and the opening of the No. 1 proportional valve in the nozzle. When the liquid level increases, the openings of the two proportional valves are reduced, which does not affect the shaking of the circuit board when the liquid level fluctuation is small, and avoids the circuit board from moving undesirably when the liquid level fluctuates violently, further ensuring the smooth movement of the circuit board. At the same time, by alternating the flow rate of the nozzle, when the liquid level fluctuates to a near peak, the nozzle flow is minimized. Conversely, when the liquid level fluctuates to the bottom, the flow dynamics of the plating liquid are increased, thereby ensuring the fluctuation ability of the liquid level, driving the effective shaking of the circuit board to detach the bubbles, and further improving the reliability of the electroplating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic cross-sectional view of the overall structure of the present invention; Figure 2 It is a schematic cross-sectional view of part of the structure of the present invention; Figure 3 For the present invention Figure 2 Schematic diagram of some structures in ; Figure 4 For the present invention Figure 3 Schematic diagram of the structural section in ; Figure 5 For the present invention Figure 4 A magnified view of the structure at A; Figure 6 It is a structural schematic diagram of the variable resistance mechanism of the present invention; Figure 7 It is a schematic diagram of the cross-section structure of the buffer cylinder of the present invention; Figure 8 It is a schematic cross-sectional view of the structure of the electroplating clamp of the present invention; Fig. 9 It is a schematic diagram of the structure at the contact point of the present invention.

[0017] In the figure: 1. electroplating tank; 2. cathode rail; 3. anode plate; 4. hanging ring; 5. outer rod; 6. inner rod; 7. buffer cylinder; 8. push rod; 9. variable resistance mechanism; 901. electric slider; 902. resistance rod; 903. junction block; 10. floating block; 11. fixing plate; 12. floating rod; 13. connecting plate; 14. connecting rod; 15. electroplating clamp; 16. circuit board; 17. nozzle; 18. No. 1 proportional valve; 19. ventilation pipe; 20. No. 2 proportional valve; 21. sliding plug; 22. spring; 23. contact. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0019] See also Figure 1-Figure 3 and Figure 8 , an electroplating device for processing integrated circuit boards, comprising an electroplating tank 1 and a floating block 10, wherein two parallel anode plates 3 are fixedly connected to the bottom of the electroplating tank 1, a cathode guide rail 2 is arranged on the top of the electroplating tank 1, and a plurality of hanging rings 4 are fixedly sleeved on the outer side of the cathode guide rail 2, and a plurality of nozzles 17 for spraying electroplating liquid are arranged at the bottom of the electroplating tank 1, and the nozzles 17 are connected to a delivery pump through a pipeline, and the delivery pump sucks the electroplating liquid in the electroplating tank 1 through the pipeline and then delivers it back to the electroplating tank through the nozzles 17, so that the electroplating liquid in the electroplating tank flows, and the fluidity of the electroplating liquid is improved, and the direction of the water flow sprayed by the nozzles 17 is parallel to the side of the circuit board 16 and the nozzles 17 are inclined, and the bottom of the hanging ring 4 is fixedly connected to the bottom of the hanging ring 4. An outer rod 5 is connected, and the inner side of the outer rod 5 is slidably sleeved with the inner rod 6. The inner rod 6 is T-shaped and the wider end is slidably sleeved with the outer rod 5. The inner rod 6 can slide relative to the outer rod 5 without separating from the outer rod 5. The bottom end of the inner rod 6 is fixedly connected with a plating clamp 15 for clamping the circuit board 16. The two sides of the floating block 10 are fixedly connected with connecting rods 14 for driving the plating clamp 15 to rise and fall. The connecting rod 14 is fixedly connected to the plating clamp 15. The inner side of the outer rod 5 is movably sleeved with a spring 22. The outer rod 5 is electrically connected to the inner rod 6 in a sliding contact manner. The spring 22 can conduct electricity to ensure the stability of the electrical connection. The plating clamp 15 is electrically connected to the cathode guide rail 2 in a sliding contact manner through the inner rod 6, the outer rod 5 and the hanging ring 4.

[0020] During the electroplating process, the bottom end of the float 10 is immersed in the electroplating solution. Bubbles are generated at the cathode in the electroplating tank 1 due to hydrogen evolution. Driven by the ejection of the electroplating solution from the nozzle 17, the surface of the electroplating solution near the circuit board 16 fluctuates up and down. The fluctuation of the electroplating solution causes the float 10 to follow the up and down fluctuation of the liquid surface under the action of buoyancy. The float 10 drives the connecting rod 14 to move up and down, and then drives the electroplating clamp 15 to move up and down. The electroplating clamp 15 drives the inner rod 6 to move. The outer rod 5 guides the inner rod 6 and cooperates with the spring 22 to use the buoyancy to make the inner rod 6 move up and down. The circuit board 16 follows the floating block 10 to rise and fall synchronously, breaking the stability and balance between the bubbles adhering to the side of the circuit board 16, and then breaking away from the adhesion of the bubbles, cooperating with the flowing electroplating liquid sprayed from the nozzle 17 to accelerate the discharge of the bubbles, and prevent the bubbles from adhering to the side of the circuit board 16 for a long time and causing pinholes. At the same time, the lifting and lowering of the circuit board 16 makes the electroplating liquid sprayed obliquely from the nozzle 17 pass through the surface of the circuit board 16, thereby strengthening the exchange of the electroplating liquid with the electroplating liquid on the surface of the circuit board 16 and improving the uniformity of the electroplating of the circuit board 16. Example

[0021] See also Figure 1-Figure 4 , Figure 7 and Figure 8 On the basis of the first embodiment, the top of the floating block 10 is fixedly connected with a push rod 8, the outer side of the push rod 8 is slidably sleeved with a buffer tube 7, the inner side of the buffer tube 7 is slidably sleeved with a sliding plug 21, the sliding plug 21 is fixedly connected to the push rod 8, and the top and bottom of one side of the buffer tube 7 are fixedly provided with a vent pipe 19. During the sliding of the sliding plug 21 in the buffer tube 7, the air in the cavity of the buffer tube 7 is exchanged with the outside through the vent pipe 19, and the vent pipe 19 produces a damping effect on the sliding of the sliding plug 21. The sliding plug 21 cooperates with the push rod 8 to produce damping on the floating and rising and falling of the floating block 10, so that the floating and falling action of the floating block 10 is smoother than when there is no damping, avoiding the excessive vibration of the circuit board 16 in the electroplating solution to cause additional bubbles, so that the frequency of the floating block 10 driving the circuit board 16 to rise and fall synchronously is within the rated range, and the reliability of the bubble shedding when the circuit board 16 shakes up and down is guaranteed. Example

[0022] See also Figure 1-Figure 7On the basis of the second embodiment, the bottom of the cathode guide rail 2 is fixedly connected with a fixed plate 11, and the inner side of the fixed plate 11 is slidably sleeved with a float rod 12, and the float rod 12 partially extends out of the fixed plate 11, and the top of the float rod 12 is fixedly connected with a variable resistance mechanism 9, and the variable resistance mechanism 9 includes two wiring blocks 903, and the two wiring blocks 903 are fixedly connected to the fixed plate 11, and the top of the wiring block 903 is fixedly connected with a resistor rod 902, and the two resistor rods 902 are arranged in parallel, and the outer sides of the two resistor rods 902 are slidably sleeved with an electric slider 901 for connecting the resistor rods 902, and the electric slider 901 is fixedly connected to the float rod 12, and the pipe body of the ventilation pipe 19 is fixedly provided with a No. 2 proportional valve 20, and the variable resistance mechanism 9 is electrically connected to the No. 2 proportional valve 20 in series. Specifically, the wiring block 903 cooperates with the resistor rod 902 and the electric slider 901, so that the resistor rod 902 and the No. 2 proportional valve 20 are connected to the No. 2 circuit in series.

[0023] During the electroplating process, the bottom end of the float rod 12 is immersed in the electroplating solution. When the liquid level of the electroplating solution fluctuates and rises, the float rod 12 rises under the action of buoyancy, and the float rod 12 drives the electric slider 901 to rise. The length of the resistor rod 902 of the two terminal blocks 903 corresponding to the electric slider 901 connected to the circuit increases, so that the resistance value connected to the second circuit increases, the voltage value of the second circuit remains unchanged, and the current flowing through the second proportional valve 20 decreases. The second proportional valve 20 is an electromagnetic proportional valve and the opening of the valve increases with the increase of current. Therefore, as the float rod 12 rises, the second proportional valve 20 The opening is reduced. When the liquid level of the electroplating solution fluctuates to a large extent, the float rod 12 and the float block 10 both follow the liquid level fluctuations, and the float block 10 floats up. The opening of the valve 20 is smaller than that of the second example, so that the damping of the movement of the sliding plug 21 is increased, so that when the float block 10 fluctuates to a higher position, the damping of the movement of the circuit board 16 driven by the float block 10 is increased. When the liquid level fluctuation amplitude is small, the restriction of the damping on the up and down swinging of the circuit board 16 is reduced. When the liquid level fluctuation amplitude is large, the intensity of the rise and fall of the circuit board 16 is controlled, so as to further ensure the reliability of the bubble shedding when the circuit board 16 shakes up and down. Example

[0024] See also Figure 1-Figure 6 and Fig. 9On the basis of the third embodiment, the number of variable resistance mechanisms 9 is set to two, a No. 1 proportional valve 18 is fixedly provided on the nozzle 17, a connecting plate 13 is fixedly provided on one side of the cathode guide rail 2, and two contacts 23 for electrically connecting to the No. 1 proportional valve 18 are fixedly provided at the bottom of the connecting plate 13 located on the outer side of the cathode guide rail 2, and contact pieces corresponding to the two contacts 23 are respectively provided on the top of one side of the electroplating tank 1. When the cathode guide rail 2 is placed on the electroplating tank 1, the contact 23 is electrically connected to the corresponding contact piece, one of the two variable resistance mechanisms 9 is electrically connected to the No. 2 proportional valve 20, and the other of the two variable resistance mechanisms 9 is connected to the two contacts 23 in series. The two contacts 23 are used to cooperate with the corresponding variable resistance mechanism 9, so that the corresponding two resistance rods 902 are connected to the No. 1 proportional valve 18 in series with the No. 1 circuit, and the No. 1 proportional valve 18 is an electromagnetic proportional valve and its opening increases with the increase of current.

[0025] When the float rod 12 floats up, the resistance value connected to the No. 1 circuit increases, so that the flow rate of the electroplating liquid sprayed from the nozzle 17 gradually decreases when the float block 10 rises. When the float block 10 falls back, the flow rate of the electroplating liquid is increased, which drives the liquid level of the electroplating liquid to fluctuate and rise. By spraying the plating liquid with alternating flow rates, the flow dynamics of the plating liquid are increased when the liquid level fluctuates to the bottom, thereby ensuring the fluctuation ability of the liquid level, ensuring the movement amplitude of the circuit board 16, and improving the effect of shaking the circuit board 16 up and down to remove bubbles.

[0026] The method of use (working principle) of the present invention is as follows: During the electroplating process, the float 10 is lifted and lowered by the liquid level fluctuation through buoyancy, and the spring 22, the connecting rod 14 and the electroplating clamp 15 are used to drive the circuit board 16 to rise and fall synchronously, so that the coordinated flowing electroplating liquid swings away from the bubbles attached to the side of the circuit board 16, and the ejected electroplating liquid passes through different areas of the circuit board 16, thereby improving the exchange efficiency between the circuit board 16 and the electroplating liquid. In addition, the sliding plug 21, the vent pipe 19, the buffer cylinder 7 and the No. 2 proportional valve 20 are used to generate damping that increases as the height of the circuit board 16 increases, so that the circuit board 16 can be moved and lifted when the liquid level fluctuation is small, and the damping is increased when the liquid level fluctuation is violent, thereby ensuring the smooth up and down movement of the circuit board 16. By connecting the variable resistance mechanism 9 of the No. 1 circuit, when the liquid level fluctuation rises, the flow rate of the electroplating liquid ejected from the nozzle 17 is reduced, and when the liquid level drops, the amount of the electroplating liquid ejected is increased, so that the ejected amount of the electroplating liquid changes alternately with the liquid level height, thereby ensuring the amplitude of the liquid level fluctuation and the effect of shaking the circuit board 16 up and down to remove bubbles.

Claims

1. An electroplating device for processing integrated circuit boards, comprising an electroplating tank (1) and a floating block (10), wherein a cathode rail (2) is arranged at the top of the electroplating tank (1), a plurality of hanging rings (4) are fixedly sleeved on the outer side of the cathode rail (2), and a plurality of nozzles (17) for adjusting the flow rate of the electroplating solution are arranged at the bottom of the electroplating tank (1), characterized in that: The bottom of the hanging ring (4) is fixedly connected to an outer rod (5), and the inner side of the outer rod (5) and the inner rod (6) are slidably sleeved with a liftable inner rod (6); The bottom end of the inner rod (6) is fixedly connected to a plating clamp (15) for clamping a circuit board (16), and both sides of the floating block (10) are fixedly connected to connecting rods (14) for driving the plating clamp (15) to move up and down. The floating block (10) drives the circuit board (16) to move up and down in cooperation with the connecting rods (14) and the plating clamp (15) under the action of buoyancy due to fluctuations in the liquid surface.

2. The electroplating device for processing integrated circuit boards according to claim 1, characterized in that: The inner rod (6) is T-shaped and has a wider end that is slidably sleeved inside the outer rod (5). A spring (22) is movably sleeved inside the outer rod (5).

3. The electroplating device for processing integrated circuit boards according to claim 2, characterized in that: The direction in which the nozzle (17) sprays water is parallel to the side of the circuit board (16), and the nozzle (17) is arranged at an angle.

4. The electroplating device for processing integrated circuit boards according to claim 2, characterized in that: The top of the floating block (10) is fixedly connected to a push rod (8), the outer side of the push rod (8) is slidably sleeved with a buffer cylinder (7), the inner side of the buffer cylinder (7) is slidably sleeved with a sliding plug (21), and a vent pipe (19) is fixedly provided at the top and bottom of one side of the buffer cylinder (7), and the buffer cylinder (7), the sliding plug (21) and the vent pipe (19) cooperate to form a damper.

5. The electroplating device for processing integrated circuit boards according to claim 4, characterized in that: The bottom of the cathode guide rail (2) is fixedly connected to a fixed plate (11), the inner side of the fixed plate (11) is slidably sleeved with a floating rod (12), the floating rod (12) partially extends out of the fixed plate (11), the top of the floating rod (12) is fixedly connected to a variable resistance mechanism (9), the body of the ventilation pipe (19) is fixedly provided with a No. 2 proportional valve (20), and the variable resistance mechanism (9) and the No. 2 proportional valve (20) are electrically connected in series.

6. The electroplating device for processing integrated circuit boards according to claim 5, characterized in that: The variable resistance mechanism (9) comprises two wiring blocks (903) for connecting to the circuit, the top of the wiring block (903) is fixedly connected to a resistance rod (902), the two resistance rods (902) are arranged in parallel, the outer sides of the two resistance rods (902) are slidably sleeved with an electric slider (901) for connecting the resistance rods (902), the electric slider (901) is fixedly connected to the floating rod (12), and the resistance rod (902) and the second proportional valve (20) are connected to the second circuit in a series manner.

7. The electroplating device for processing integrated circuit boards according to claim 6, characterized in that: The number of the variable resistance mechanisms (9) is set to two, a No. 1 proportional valve (18) is fixedly provided on the nozzle (17), a connecting plate (13) is fixedly provided on one side of the interior of the cathode guide rail (2), and two contacts (23) for electrical connection with the No. 1 proportional valve (18) are fixedly provided at the bottom of the connecting plate (13) located outside the cathode guide rail (2); A contact sheet corresponding to two contacts (23) is provided at the top of one side of the electroplating tank (1), and one of the two variable resistance mechanisms (9) cooperates with the two contacts (23) to connect the corresponding two resistance rods (902) to the first proportional valve (18) in series to the first circuit.

8. The electroplating device for processing integrated circuit boards according to claim 7, characterized in that: The bottom of the electroplating tank (1) is fixedly connected to two anode plates (3) arranged in parallel, and the No. 1 proportional valve (18) and the No. 2 proportional valve (20) are both electromagnetic proportional valves.

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