Chip heat dissipation analysis device for circuit substrate

Abstract

The invention provides a chip heat dissipation analysis device for a circuit substrate, and relates to the technical field of heat dissipation analysis, and the device comprises the steps: carrying out the real-time monitoring of a chip of the circuit substrate, determining the current working state of the chip of the circuit substrate, and obtaining the working temperature data of the chip of the circuit substrate; starting chip heat dissipation equipment of the circuit substrate, performing chip heat dissipation on a chip of the circuit substrate according to a preset chip heat dissipation strategy, setting a heat dissipation area, and obtaining chip heat dissipation temperature distribution data; performing area-by-area heat dissipation analysis on heat dissipation of the chip according to the working temperature data and the heat dissipation temperature distribution data of the chip, determining heat dissipation performance of the chip, and optimizing a heat dissipation strategy of the chip in each area according to the heat dissipation performance of the chip; the working environment data of the circuit substrate are controlled, and the heat dissipation performance of a chip of the circuit substrate under different working environment data is simulated and analyzed; and the heat dissipation performance of the chip for the circuit substrate is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation analysis, and in particular to a chip heat dissipation analysis device for a circuit substrate. Background Art

[0002] The circuit substrate will inevitably generate working heat during operation, which will affect the working performance of the chip. Therefore, in order to ensure the working performance of the chip, the chip in the working state is usually cooled. However, the temperature distribution inside the chip is uneven, and the accuracy of heat dissipation analysis by monitoring the chip temperature is low. Moreover, heat dissipation analysis based only on existing temperature monitoring cannot be applied to chip heat dissipation in various working environments of the circuit substrate.

[0003] Therefore, the present invention provides a chip heat dissipation analysis device for a circuit substrate. Summary of the invention

[0004] The present invention provides a chip heat dissipation analysis device for a circuit substrate. The device determines the current chip working state of the circuit substrate and obtains the working temperature data of the chip of the circuit substrate by real-time monitoring of the chip of the circuit substrate; enables the chip heat dissipation device of the circuit substrate, performs chip heat dissipation on the chip of the circuit substrate according to a preset chip heat dissipation strategy, sets the heat dissipation area, and obtains the chip heat dissipation temperature distribution data; performs heat dissipation analysis on the chip heat dissipation area by area according to the working temperature data and the chip heat dissipation temperature distribution data, determines the chip heat dissipation performance, and optimizes the chip heat dissipation strategy of each area according to the chip heat dissipation performance; controls the working environment data of the circuit substrate, simulates and analyzes the chip heat dissipation performance of the chip of the circuit substrate under different working environment data; and ensures the heat dissipation performance of the chip used for the circuit substrate.

[0005] The present invention provides a chip heat dissipation analysis device for a circuit substrate, comprising: A chip monitoring module is used to monitor the chip of the circuit substrate in real time, determine the current chip working state of the circuit substrate and obtain the working temperature data of the chip of the circuit substrate; A chip heat dissipation module is used to enable the chip heat dissipation device of the circuit substrate, perform chip heat dissipation on the chip of the circuit substrate according to a preset chip heat dissipation strategy, set a heat dissipation area, and obtain chip heat dissipation temperature distribution data; The heat dissipation analysis module is used to perform heat dissipation analysis on the chip region by region based on the operating temperature data and the chip heat dissipation temperature distribution data, determine the chip heat dissipation performance, and optimize the chip heat dissipation strategy in each region based on the chip heat dissipation performance; The simulation analysis module is used to control the working environment data of the circuit substrate and simulate and analyze the chip heat dissipation performance of the chip of the circuit substrate under different working environment data.

[0006] According to the present invention, a chip heat dissipation analysis device for a circuit substrate, a chip monitoring module, includes: A monitoring sensor selection unit is used to select a sensor for monitoring the chip of the circuit substrate according to the chip heat dissipation monitoring requirements, set the sensor deployment position, and perform real-time monitoring of the chip of the circuit substrate, wherein the sensors include: a chip power sensor and a temperature sensor; A working state unit, used to determine the current chip working state of the circuit substrate according to the real-time monitoring data of the chip power sensor, wherein the current chip working state includes: a pause state and a working state; The operating temperature data unit is used to determine the operating temperature data of the chip of the circuit substrate according to the real-time monitoring data of the temperature sensor.

[0007] According to the present invention, a chip heat dissipation analysis device for a circuit substrate, a working status unit, includes: A working operation state block is used to analyze the real-time monitoring data of the chip power sensor to determine the current working operation state of the chip of the circuit substrate, wherein the current working operation state includes: non-operating state, normal operating state and abnormal operating state; When the analysis result shows that the chip does not have operating power, the current working state is determined to be a non-operating state; Determine the normal operating power range of the chip according to the historical monitoring data of the chip power sensor, and when the analysis result shows that the current operating power of the chip is within the normal operating power range, determine that the current working state is a normal operating state; When the analysis result shows that the current operating power of the chip is not within the normal operating power range, the current operating state is determined to be an abnormal operating state; A workload state block is used to determine the current workload state of the chip according to the power ratio of the current operating power within the normal operating power range when the current operating state is the normal operating state; The working status block is used to summarize the current working operation status and the current workload status, and determine the current chip working status of the circuit substrate.

[0008] According to the present invention, a chip heat dissipation analysis device for a circuit substrate, a chip heat dissipation module, includes: A temperature alarm unit, used to determine a temperature alarm threshold value according to historical operating temperature data of the chip of the circuit substrate, and to generate temperature alarm data and execute a preset chip heat dissipation strategy when the operating temperature data is not lower than the temperature alarm threshold value; A heat dissipation activation unit, used to activate a chip heat dissipation device of the circuit substrate when monitoring that the current chip working state of the circuit substrate switches from a pause state to a working state; The chip heat dissipation unit is used to determine the heat dissipation method according to the chip heat dissipation device, obtain the heat dissipation target of the chip, determine the preset chip heat dissipation strategy to perform chip heat dissipation treatment on the chip of the circuit substrate, wherein the heat dissipation target includes: heat dissipation temperature target and heat dissipation efficiency target; A heat dissipation area unit, used to determine the heat dissipation area of ​​the chip according to the chip heat dissipation device and the current chip working state of the circuit substrate; The heat dissipation temperature distribution unit is used to obtain the current operating temperature data of the heat dissipation area after the chip heat dissipation process is completed, which is recorded as the chip heat dissipation temperature distribution data.

[0009] According to the present invention, a chip heat dissipation analysis device for a circuit substrate, a heat dissipation area unit, includes: The total heat dissipation area block is used to determine the chip area of ​​the circuit substrate and the heat dissipation area of ​​the chip heat dissipation device, and determine the total heat dissipation area of ​​the chip, wherein the total heat dissipation area of ​​the chip includes: the chip area and the heat dissipation area; The preliminary area division block is used to divide the total heat dissipation area into regions according to the set heat dissipation area size and preliminarily determine the heat dissipation sub-areas of the chip; The area merging block is used to obtain the historical operating temperature data of the heat dissipation sub-area. If the historical operating temperature data are consistent or the data deviation does not exceed the temperature difference threshold, the heat dissipation sub-areas are merged and regarded as the same heat dissipation sub-area. The heat dissipation region block is used to determine the heat dissipation sub-region of the chip based on the region merging result.

[0010] According to the present invention, a chip heat dissipation analysis device for a circuit substrate, a heat dissipation analysis module, includes: A data processing unit, used to process the operating temperature data and the chip heat dissipation temperature distribution data one by one according to the heat dissipation areas of the chip, and obtain the heat dissipation temperature control data of each heat dissipation area; The heat dissipation zone-by-zone analysis unit is used to perform zone-by-zone heat dissipation analysis on the chip according to the chip heat dissipation temperature distribution data. When the chip heat dissipation temperature distribution data is not higher than the temperature data corresponding to the heat dissipation temperature target, it is determined that the chip heat dissipation in the corresponding heat dissipation zone is initially effective; Acquire historical temperature control data of the heat dissipation area where heat dissipation is initially effective, determine the temperature control range, and when the heat dissipation temperature control data of the heat dissipation area where heat dissipation is initially effective is within the temperature control range, determine that the heat dissipation is effective and the heat dissipation control is effective, and record the corresponding heat dissipation area as a normal heat dissipation area; When the heat dissipation temperature control data of the heat dissipation area where heat dissipation is initially effective is not within the temperature control range, it is determined that the heat dissipation is effective but the heat dissipation control is invalid, and the corresponding heat dissipation area is recorded as a heat dissipation abnormal area, wherein the heat dissipation abnormal area includes: an abnormal area where heat dissipation is invalid and an abnormal area where heat dissipation control is invalid; When the chip heat dissipation temperature distribution data is higher than the temperature data corresponding to the heat dissipation temperature target, the heat dissipation area where the chip heat dissipation temperature distribution data is higher than the temperature data corresponding to the heat dissipation temperature target is located and recorded as the heat dissipation abnormal area; The chip heat dissipation performance unit is used to determine the chip heat dissipation performance evaluation index according to the heat dissipation target and calculate the chip heat dissipation performance score; ;in, Indicates the chip's heat dissipation performance score; Indicates Chip heat dissipation temperature distribution data of each heat dissipation area; Indicates the temperature data corresponding to the heat dissipation temperature target of the chip; Indicates when When the chip heat dissipation temperature distribution data of each heat dissipation area is not lower than the temperature data corresponding to the chip heat dissipation temperature target, the output , otherwise, output 1; Indicates the heat dissipation time of the chip. Indicates the cooling time corresponding to the cooling efficiency target of the chip; Indicates the influence weight of heat dissipation temperature on heat dissipation performance score; Indicates the weight of the influence of heat dissipation time on the heat dissipation performance score; Indicates the number of heat dissipation areas of the chip; The chip heat dissipation score threshold is set according to the historical temperature control data. When the chip heat dissipation performance score is not higher than the chip heat dissipation score threshold, the chip heat dissipation is judged to be uncontrollable and the chip working state needs to be suspended. When the chip's heat dissipation performance score is higher than the chip's heat dissipation score threshold, the chip's heat dissipation is determined to be controllable, the chip's working state is maintained, and the chip's heat dissipation strategy in each area is optimized based on the chip's heat dissipation performance score; The heat dissipation optimization unit is used to optimize the chip heat dissipation strategy of the heat dissipation abnormality area according to the heat dissipation performance score of the chip. If the regional heat dissipation performance score of the heat dissipation abnormality area after optimization is not lower than the heat dissipation performance score of the chip, it is determined that the chip heat dissipation strategy optimization is completed.

[0011] According to the present invention, a chip heat dissipation analysis device for a circuit substrate, a simulation analysis module, includes: A working environment control unit, used to obtain environmental factors that affect the heat dissipation of the chip of the circuit substrate, and determine control factors for controlling the working environment data of the circuit substrate, wherein the environmental factors include: environmental temperature factors, environmental airflow factors, environmental humidity factors, environmental pressure factors, and workload factors; The simulation heat dissipation unit is used to control the working environment data of the circuit substrate according to the control factors, and simulate and analyze the chip heat dissipation performance of the chip of the circuit substrate under different working environment data according to the preset simulation analysis software.

[0012] A chip heat dissipation analysis device for a circuit substrate provided by the present invention further includes: The heat dissipation optimization module is used to optimize the chip heat dissipation strategy according to the working environment data of the circuit substrate and the chip heat dissipation performance; An optimization verification module is used to optimize and verify the optimized chip heat dissipation strategy according to the actual operation of the circuit substrate; The heat dissipation analysis visualization module is used to visualize the chip heat dissipation strategy that has passed the optimization verification, the corresponding circuit substrate working environment data, and the chip heat dissipation performance.

[0013] Compared with the prior art, the present invention has the following beneficial effects: By real-time monitoring of the chip on the circuit substrate, the current chip working status of the circuit substrate is determined and the working temperature data of the chip on the circuit substrate is obtained; the chip cooling device of the circuit substrate is enabled, the chip on the circuit substrate is cooled according to the preset chip cooling strategy, the cooling area is set, and the chip cooling temperature distribution data is obtained; the chip cooling is analyzed area by area according to the working temperature data and the chip cooling temperature distribution data, the chip cooling performance is determined, and the chip cooling strategy of each area is optimized according to the chip cooling performance; the working environment data of the circuit substrate is controlled, and the chip cooling performance of the chip on the circuit substrate under different working environment data is simulated and analyzed; the cooling performance of the chip used for the circuit substrate is ensured.

[0014] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0015] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a structural schematic diagram of a chip heat dissipation analysis device for a circuit substrate provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0017] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0018] Embodiment 1: The embodiment of the present invention provides a chip heat dissipation analysis device for a circuit substrate, such as Figure 1 As shown, including: A chip monitoring module is used to monitor the chip of the circuit substrate in real time, determine the current chip working state of the circuit substrate and obtain the working temperature data of the chip of the circuit substrate; A chip heat dissipation module is used to enable the chip heat dissipation device of the circuit substrate, perform chip heat dissipation on the chip of the circuit substrate according to a preset chip heat dissipation strategy, set a heat dissipation area, and obtain chip heat dissipation temperature distribution data; The heat dissipation analysis module is used to perform heat dissipation analysis on the chip region by region based on the operating temperature data and the chip heat dissipation temperature distribution data, determine the chip heat dissipation performance, and optimize the chip heat dissipation strategy in each region based on the chip heat dissipation performance; The simulation analysis module is used to control the working environment data of the circuit substrate and simulate and analyze the chip heat dissipation performance of the chip of the circuit substrate under different working environment data.

[0019] In this embodiment, the current chip working state refers to the working state of the chip in the current period, including: a pause state and a working state.

[0020] In this embodiment, the operating temperature data refers to temperature data of the chip in the operating state obtained by real-time monitoring of the chip by a temperature sensor.

[0021] In this embodiment, the chip heat dissipation device refers to a device used to achieve chip heat dissipation.

[0022] In this embodiment, the preset chip heat dissipation strategy refers to a strategy for achieving chip heat dissipation.

[0023] In this embodiment, the heat dissipation area refers to the area where the chip needs to dissipate heat.

[0024] In this embodiment, the chip heat dissipation temperature distribution data refers to the current operating temperature data of the heat dissipation area after the chip heat dissipation process is completed.

[0025] In this embodiment, the region-by-region heat dissipation analysis is to perform heat dissipation analysis on each heat dissipation sub-region of the chip according to the heat dissipation temperature distribution data of the chip, thereby achieving accurate heat dissipation analysis of the chip.

[0026] In this embodiment, the chip heat dissipation performance refers to the performance of the chip in achieving heat dissipation.

[0027] In this embodiment, the working environment data refers to the environment data when the chip is working.

[0028] The working principle and beneficial effects of the above technical solution are: by real-time monitoring of the chip on the circuit substrate, the current chip working state of the circuit substrate is determined and the working temperature data of the chip on the circuit substrate is obtained; the chip heat dissipation device of the circuit substrate is enabled, the chip on the circuit substrate is cooled according to the preset chip heat dissipation strategy, the heat dissipation area is set, and the chip heat dissipation temperature distribution data is obtained; the chip heat dissipation is analyzed region by region according to the working temperature data and the chip heat dissipation temperature distribution data, the chip heat dissipation performance is determined, and the chip heat dissipation strategy of each region is optimized according to the chip heat dissipation performance; the working environment data of the circuit substrate is controlled, and the chip heat dissipation performance of the chip on the circuit substrate under different working environment data is simulated and analyzed; the heat dissipation performance of the chip used for the circuit substrate is ensured.

[0029] Embodiment 2: The embodiment of the present invention provides a chip heat dissipation analysis device for a circuit substrate, a chip monitoring module, including: A monitoring sensor selection unit is used to select a sensor for monitoring the chip of the circuit substrate according to the chip heat dissipation monitoring requirements, set the sensor deployment position, and perform real-time monitoring of the chip of the circuit substrate, wherein the sensors include: a chip power sensor and a temperature sensor; A working state unit, used to determine the current chip working state of the circuit substrate according to the real-time monitoring data of the chip power sensor, wherein the current chip working state includes: a pause state and a working state; The operating temperature data unit is used to determine the operating temperature data of the chip of the circuit substrate according to the real-time monitoring data of the temperature sensor.

[0030] In this embodiment, the chip heat dissipation monitoring requirement refers to the requirement of monitoring the heat dissipation of the chip, for example, determining the heat dissipation condition of the chip by monitoring the working state of the chip and the chip temperature.

[0031] In this embodiment, the chip power sensor is used to monitor the working state of the chip, and the temperature sensor is used to monitor the temperature of the chip.

[0032] In this embodiment, the current chip working state refers to the working state of the chip in the current period, including: a pause state and a working state.

[0033] In this embodiment, the operating temperature data refers to temperature data of the chip in the operating state obtained by real-time monitoring of the chip by a temperature sensor.

[0034] The working principle and beneficial effect of the above technical solution are: by real-time monitoring of the chip on the circuit substrate, the current chip working status of the circuit substrate is determined and the working temperature data of the chip on the circuit substrate is obtained, laying the working temperature foundation for subsequent chip heat dissipation analysis.

[0035] Embodiment 3: The embodiment of the present invention provides a chip heat dissipation analysis device for a circuit substrate, a working status unit, including: A working operation state block is used to analyze the real-time monitoring data of the chip power sensor to determine the current working operation state of the chip of the circuit substrate, wherein the current working operation state includes: non-operating state, normal operating state and abnormal operating state; When the analysis result shows that the chip does not have operating power, the current working state is determined to be a non-operating state; Determine the normal operating power range of the chip according to the historical monitoring data of the chip power sensor, and when the analysis result shows that the current operating power of the chip is within the normal operating power range, determine that the current working state is a normal operating state; When the analysis result shows that the current operating power of the chip is not within the normal operating power range, the current operating state is determined to be an abnormal operating state; A workload state block is used to determine the current workload state of the chip according to the power ratio of the current operating power within the normal operating power range when the current operating state is the normal operating state; The working status block is used to summarize the current working operation status and the current workload status, and determine the current chip working status of the circuit substrate.

[0036] In this embodiment, the operating power refers to the real-time monitoring data of the chip power sensor, which is used to indicate whether the chip is working. If the operating power exists, it is determined that the chip is in a working state, and if the operating power does not exist, the chip is not operating.

[0037] In this embodiment, the normal operating power range refers to a power range corresponding to the normal operating state of the chip.

[0038] In this embodiment, the current operating power refers to the operating power of the chip in the current period.

[0039] In this embodiment, the abnormal operation state refers to a state when the current operation power of the chip exceeds the normal operation power range, for example, the chip is in an overload operation state.

[0040] In this embodiment, the current workload state refers to the workload state corresponding to the specific operating power of the chip in the current period, for example, a1 proportional load working state, full load working state, overload working state.

[0041] The working principle and beneficial effect of the above technical solution are: by determining the current working status and current workload status of the chip, the effectiveness of subsequent chip heat dissipation analysis is ensured.

[0042] Embodiment 4: The embodiment of the present invention provides a chip heat dissipation analysis device for a circuit substrate, a chip heat dissipation module, including: A temperature alarm unit, used to determine a temperature alarm threshold value according to historical operating temperature data of the chip of the circuit substrate, and to generate temperature alarm data and execute a preset chip heat dissipation strategy when the operating temperature data is not lower than the temperature alarm threshold value; A heat dissipation activation unit, used to activate a chip heat dissipation device of the circuit substrate when monitoring that the current chip working state of the circuit substrate switches from a pause state to a working state; The chip heat dissipation unit is used to determine the heat dissipation method according to the chip heat dissipation device, obtain the heat dissipation target of the chip, determine the preset chip heat dissipation strategy to perform chip heat dissipation treatment on the chip of the circuit substrate, wherein the heat dissipation target includes: heat dissipation temperature target and heat dissipation efficiency target; A heat dissipation area unit, used to determine the heat dissipation area of ​​the chip according to the chip heat dissipation device and the current chip working state of the circuit substrate; The heat dissipation temperature distribution unit is used to obtain the current operating temperature data of the heat dissipation area after the chip heat dissipation process is completed, which is recorded as the chip heat dissipation temperature distribution data.

[0043] In this embodiment, the historical operating temperature data refers to the operating temperature data of the chip in a historical period.

[0044] In this embodiment, the preset chip heat dissipation strategy refers to a strategy for achieving chip heat dissipation.

[0045] In this embodiment, the temperature alarm threshold refers to a threshold used to determine whether the operating temperature data below the temperature is normal. When the operating temperature data is not lower than the temperature alarm threshold, temperature alarm data is generated and a preset chip heat dissipation strategy is executed. The temperature alarm data refers to the alarm data generated when the operating temperature data is not lower than the temperature alarm threshold. The preset chip heat dissipation strategy executed this time is a preset chip heat dissipation strategy under the temperature alarm data, which is intended to dissipate heat and lower the operating temperature. It is somewhat different from the preset chip heat dissipation strategy when the chip is working normally.

[0046] In this embodiment, when it is monitored that the current chip working state of the circuit substrate switches from the pause state to the working state, the chip heat dissipation device of the circuit substrate is enabled, that is, the heat is dissipated as soon as the chip is in the working state.

[0047] In this embodiment, the heat dissipation methods include: heat sink heat dissipation method, water cooling heat dissipation method and fan heat dissipation method. Different heat dissipation methods have different heat dissipation efficiencies and heat dissipation qualities.

[0048] In this embodiment, the chip heat dissipation device refers to a device used to achieve chip heat dissipation.

[0049] In this embodiment, the heat dissipation target refers to the target that needs to be achieved for chip heat dissipation, for example, heat dissipation controls the temperature to a1 degrees and completes heat dissipation within a t1 period.

[0050] In this embodiment, the heat dissipation area refers to the area where the chip needs to dissipate heat.

[0051] In this embodiment, the chip heat dissipation temperature distribution data refers to the current operating temperature data of the heat dissipation area after the chip heat dissipation process is completed.

[0052] The working principle and beneficial effects of the above technical solution are: activating the chip heat dissipation device of the circuit substrate, performing chip heat dissipation on the chip of the circuit substrate according to a preset chip heat dissipation strategy, setting the heat dissipation area, and obtaining the chip heat dissipation temperature distribution data, so as to facilitate subsequent accurate chip heat dissipation analysis and improve the analysis quality.

[0053] Embodiment 5: The embodiment of the present invention provides a chip heat dissipation analysis device for a circuit substrate, a heat dissipation area unit, comprising: The total heat dissipation area block is used to determine the chip area of ​​the circuit substrate and the heat dissipation area of ​​the chip heat dissipation device, and determine the total heat dissipation area of ​​the chip, wherein the total heat dissipation area of ​​the chip includes: the chip area and the heat dissipation area; The preliminary area division block is used to divide the total heat dissipation area into regions according to the set heat dissipation area size and preliminarily determine the heat dissipation sub-areas of the chip; The area merging block is used to obtain the historical operating temperature data of the heat dissipation sub-area. If the historical operating temperature data are consistent or the data deviation does not exceed the temperature difference threshold, the heat dissipation sub-areas are merged and regarded as the same heat dissipation sub-area. The heat dissipation region block is used to determine the heat dissipation sub-region of the chip based on the region merging result.

[0054] In this embodiment, the chip area refers to the area where the chip device is located.

[0055] In this embodiment, the heat dissipation area of ​​the chip heat dissipation device refers to the coverage area where the chip heat dissipation device can dissipate heat.

[0056] In this embodiment, the total heat dissipation area of ​​the chip refers to the area where the heat dissipation is actually performed when the chip is dissipating heat. For example, when dissipating heat to chip a1, the area of ​​chip a1 is b1. The heat dissipation of chip a1 is achieved by dissipating heat to area b2 (including chip a1) through the chip heat dissipation device. Area b2 is the total heat dissipation area of ​​chip a1.

[0057] In this embodiment, setting the heat dissipation area size refers to the size used to divide the total heat dissipation area. The accuracy of heat dissipation analysis is ensured by dividing the total heat dissipation area by setting the heat dissipation area size.

[0058] In this embodiment, the heat dissipation sub-region refers to a heat dissipation region determined by dividing the total heat dissipation region according to a set heat dissipation region size.

[0059] In this embodiment, the temperature difference threshold refers to a threshold used to determine whether the heat dissipation sub-areas can be merged.

[0060] In this embodiment, if the historical operating temperature data are consistent or the data deviation does not exceed the temperature difference threshold, the heat dissipation sub-areas are merged and regarded as the same heat dissipation sub-area. For example, if the historical operating temperature data of the heat dissipation sub-area c1 is consistent with the heat dissipation sub-area c2, it means that the temperature generated when the chip is working has the same impact on the two areas, and the heat dissipation temperature changes of the two areas are also the same when the heat dissipation operation is performed. Therefore, they are regarded as the same heat dissipation sub-area to simplify the heat dissipation analysis and improve the efficiency of the heat dissipation analysis.

[0061] The working principle and beneficial effect of the above technical solution are: by determining and dividing the heat dissipation area of ​​the chip, it is convenient to perform accurate analysis on the subsequent heat dissipation of the chip.

[0062] Embodiment 6: The embodiment of the present invention provides a chip heat dissipation analysis device for a circuit substrate, a heat dissipation analysis module, including: A data processing unit, used to process the operating temperature data and the chip heat dissipation temperature distribution data one by one according to the heat dissipation areas of the chip, and obtain the heat dissipation temperature control data of each heat dissipation area; The heat dissipation zone-by-zone analysis unit is used to perform zone-by-zone heat dissipation analysis on the chip according to the chip heat dissipation temperature distribution data. When the chip heat dissipation temperature distribution data is not higher than the temperature data corresponding to the heat dissipation temperature target, it is determined that the chip heat dissipation in the corresponding heat dissipation zone is initially effective; Acquire historical temperature control data of the heat dissipation area where heat dissipation is initially effective, determine the temperature control range, and when the heat dissipation temperature control data of the heat dissipation area where heat dissipation is initially effective is within the temperature control range, determine that the heat dissipation is effective and the heat dissipation control is effective, and record the corresponding heat dissipation area as a normal heat dissipation area; When the heat dissipation temperature control data of the heat dissipation area where heat dissipation is initially effective is not within the temperature control range, it is determined that the heat dissipation is effective but the heat dissipation control is invalid, and the corresponding heat dissipation area is recorded as a heat dissipation abnormal area, wherein the heat dissipation abnormal area includes: an abnormal area where heat dissipation is invalid and an abnormal area where heat dissipation control is invalid; When the chip heat dissipation temperature distribution data is higher than the temperature data corresponding to the heat dissipation temperature target, the heat dissipation area where the chip heat dissipation temperature distribution data is higher than the temperature data corresponding to the heat dissipation temperature target is located and recorded as the heat dissipation abnormal area; The chip heat dissipation performance unit is used to determine the chip heat dissipation performance evaluation index according to the heat dissipation target and calculate the chip heat dissipation performance score; ;in, Indicates the chip's heat dissipation performance score; Indicates Chip heat dissipation temperature distribution data of each heat dissipation area; Indicates the temperature data corresponding to the heat dissipation temperature target of the chip; Indicates when When the chip heat dissipation temperature distribution data of each heat dissipation area is not lower than the temperature data corresponding to the chip heat dissipation temperature target, the output , otherwise, output 1; Indicates the heat dissipation time of the chip. Indicates the cooling time corresponding to the cooling efficiency target of the chip; Indicates the influence weight of heat dissipation temperature on heat dissipation performance score; Indicates the weight of the influence of heat dissipation time on the heat dissipation performance score; Indicates the number of heat dissipation areas of the chip; The chip heat dissipation score threshold is set according to the historical temperature control data. When the chip heat dissipation performance score is not higher than the chip heat dissipation score threshold, the chip heat dissipation is judged to be uncontrollable and the chip working state needs to be suspended. When the chip's heat dissipation performance score is higher than the chip's heat dissipation score threshold, the chip's heat dissipation is determined to be controllable, the chip's working state is maintained, and the chip's heat dissipation strategy in each area is optimized based on the chip's heat dissipation performance score; The heat dissipation optimization unit is used to optimize the chip heat dissipation strategy of the heat dissipation abnormality area according to the heat dissipation performance score of the chip. If the regional heat dissipation performance score of the heat dissipation abnormality area after optimization is not lower than the heat dissipation performance score of the chip, it is determined that the chip heat dissipation strategy optimization is completed.

[0063] In this embodiment, the operating temperature data and the chip heat dissipation temperature distribution data are processed one-to-one according to the heat dissipation area of ​​the chip. For example, the operating temperature data T1 of area b1 and the chip heat dissipation temperature distribution data T2 are processed one-to-one to improve the efficiency of subsequent heat dissipation analysis.

[0064] In this embodiment, the heat dissipation temperature control data refers to the temperature data of the actual heat dissipation during chip heat dissipation. For example, the heat dissipation temperature control data of region b1 is the temperature difference between the operating temperature data T1 and the chip heat dissipation temperature distribution data T2.

[0065] In this embodiment, the heat dissipation analysis for each region is to perform heat dissipation analysis on each heat dissipation sub-region of the chip according to the chip heat dissipation temperature distribution data, so as to achieve accurate heat dissipation analysis of the chip.

[0066] In this embodiment, when the chip heat dissipation temperature distribution data is not higher than the temperature data corresponding to the heat dissipation temperature target, it is determined that the chip heat dissipation in the corresponding heat dissipation region is initially effective, that is, the chip heat dissipation in this region is initially realized, and the chip in this region can operate normally. Among them, the corresponding heat dissipation region is the heat dissipation sub-region.

[0067] In this embodiment, the temperature control range refers to the temperature range that the chip temperature should change when the chip heat dissipation device is enabled to effectively dissipate heat from the chip. For example, when the chip heat dissipation device is enabled, the chip temperature drops by T1 - T2.

[0068] In this embodiment, effective heat dissipation means that the heat is successfully controlled to below the heat dissipation target temperature, and effective heat dissipation control means that the heat dissipation of the chip heat dissipation device is effectively utilized.

[0069] In this embodiment, the normal heat dissipation region refers to the region where chip heat dissipation is achieved and the chip heat dissipation device is effectively utilized.

[0070] In this embodiment, ineffective heat dissipation control means that the heat dissipation of the heat dissipation device is not effectively utilized. For example, in heat dissipation region d2, when the chip heat dissipation device is enabled, the chip temperature changes by T3 < T1, then the heat dissipation control is ineffective.

[0071] In this embodiment, the abnormal heat dissipation region refers to the region where chip heat dissipation is not achieved or the chip heat dissipation device is not effectively utilized. For example, in heat dissipation region d2, when the chip heat dissipation device is enabled, the chip temperature changes by T3 < T1, and the heat dissipation control is ineffective, so heat dissipation region d2 is the abnormal heat dissipation region.

[0072] In this embodiment, the ineffective heat dissipation abnormal region refers to the region where chip heat dissipation is not achieved, and the ineffective heat dissipation control abnormal region refers to the region where the chip heat dissipation device is not effectively utilized.

[0073] In this embodiment, when the chip heat dissipation temperature distribution data is higher than the temperature data corresponding to the heat dissipation temperature target, that is, the heat dissipation is ineffective.

[0074] In this embodiment, the chip heat dissipation performance refers to the performance of the chip to achieve heat dissipation.

[0075] In this embodiment, the chip heat dissipation performance evaluation index refers to an index determined by the heat dissipation target and used to evaluate the chip heat dissipation performance, including: a heat dissipation temperature performance evaluation index and a heat dissipation efficiency performance evaluation index.

[0076] In this embodiment, the heat dissipation performance score of the chip refers to a score value of the heat dissipation performance of the chip determined according to the chip heat dissipation performance evaluation index, and is used to represent the heat dissipation performance of the chip.

[0077] In this embodiment, the heat dissipation score threshold refers to a score threshold used to determine whether the chip heat dissipation performance meets the chip heat dissipation score. When the chip heat dissipation performance score is not higher than the chip heat dissipation score threshold, it is determined that the chip heat dissipation is uncontrollable, that is, the chip cannot effectively achieve heat dissipation, and the chip's working state needs to be suspended.

[0078] In this embodiment, when the heat dissipation performance score of the chip is higher than the heat dissipation score threshold of the chip, it is determined that the heat dissipation of the chip is controllable, and the heat dissipation of the chip can be effectively achieved, and the chip can continue to maintain a normal working state.

[0079] In this embodiment, the chip heat dissipation strategy in the heat dissipation abnormality area is optimized according to the heat dissipation performance score of the chip, for example, the utilization rate of the chip heat dissipation equipment in the heat dissipation abnormality area is improved, and the heat dissipation efficiency is improved.

[0080] In this embodiment, if the regional heat dissipation performance score of the heat dissipation abnormal area after optimization is not lower than the heat dissipation performance score of the chip, it is determined that the chip heat dissipation strategy optimization is completed and the heat dissipation processing of the chip can be implemented.

[0081] The working principle and beneficial effects of the above technical solution are: by performing heat dissipation analysis on the chip region by region based on the operating temperature data and the chip heat dissipation temperature distribution data, the chip heat dissipation performance is determined, and the chip heat dissipation strategy in each region is optimized according to the chip heat dissipation performance, thereby realizing the heat dissipation analysis of the chip used for the circuit substrate and ensuring the heat dissipation performance of the chip used for the circuit substrate.

[0082] Embodiment 7: The embodiment of the present invention provides a chip heat dissipation analysis device for a circuit substrate, a simulation analysis module, including: A working environment control unit, used to obtain environmental factors that affect the heat dissipation of the chip of the circuit substrate, and determine control factors for controlling the working environment data of the circuit substrate, wherein the environmental factors include: environmental temperature factors, environmental airflow factors, environmental humidity factors, environmental pressure factors, and workload factors; The simulation heat dissipation unit is used to control the working environment data of the circuit substrate according to the control factors, and simulate and analyze the chip heat dissipation performance of the chip of the circuit substrate under different working environment data according to the preset simulation analysis software.

[0083] In this embodiment, the environmental factors refer to factors that affect the heat dissipation of the chip of the circuit substrate, such as environmental temperature factors, environmental airflow factors, environmental humidity factors, environmental pressure factors, and workload factors.

[0084] In this embodiment, the control factor refers to the controllable factor in the environmental factor. The working environment data of the circuit substrate is controlled by controlling the control factor, and then various working environments of the chip are simulated to perform heat dissipation analysis to ensure the applicability of the heat dissipation analysis.

[0085] In this embodiment, the working environment data refers to the environment data when the chip is working.

[0086] In this embodiment, the preset simulation analysis software refers to software used to perform simulation heat dissipation analysis according to the working environment data of the circuit substrate.

[0087] In this embodiment, the working environment data of the circuit substrate is controlled according to the control factors, and one control factor is controlled at a time. For example, other control factors are kept unchanged, and the environmental temperature factor is controlled alone to change, so as to simulate the chip heat dissipation analysis under different environmental temperature factors.

[0088] The working principle and beneficial effect of the above technical solution are: by controlling the working environment data of the circuit substrate, simulating and analyzing the chip heat dissipation performance of the chip of the circuit substrate under different working environment data, further realizing the heat dissipation analysis of the chip used for the circuit substrate.

[0089] Embodiment 8: An embodiment of the present invention provides a chip heat dissipation analysis device for a circuit substrate, further comprising: The heat dissipation optimization module is used to optimize the chip heat dissipation strategy according to the working environment data of the circuit substrate and the chip heat dissipation performance; An optimization verification module is used to optimize and verify the optimized chip heat dissipation strategy according to the actual operation of the circuit substrate; The heat dissipation analysis visualization module is used to visualize the chip heat dissipation strategy that has passed the optimization verification, the corresponding circuit substrate working environment data, and the chip heat dissipation performance.

[0090] In this embodiment, the optimized chip heat dissipation strategy is optimized and verified according to the actual operation of the circuit substrate. For example, the chip of the circuit substrate is effectively cooled down, and the chip heat dissipation strategy optimization verification completed by Youhu is passed.

[0091] In this embodiment, the chip cooling strategy that has passed the optimization verification and the corresponding circuit substrate working environment data and chip cooling performance are visualized one by one. If one of them is selected, the relevant data, for example, if the working environment data is selected, the corresponding chip cooling strategy and chip cooling performance will be displayed consistently.

[0092] The working principle and beneficial effects of the above technical solution are: by optimizing and verifying the chip heat dissipation strategy, the effectiveness of chip heat dissipation is ensured; by performing visual display processing, the rational use of chip heat dissipation analysis is ensured.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip heat dissipation analysis device for a circuit substrate, characterized in that: include: A chip monitoring module is used to monitor the chip of the circuit substrate in real time, determine the current chip working state of the circuit substrate and obtain the working temperature data of the chip of the circuit substrate; A chip heat dissipation module is used to enable the chip heat dissipation device of the circuit substrate, perform chip heat dissipation on the chip of the circuit substrate according to a preset chip heat dissipation strategy, set a heat dissipation area, and obtain chip heat dissipation temperature distribution data; The heat dissipation analysis module is used to perform heat dissipation analysis on the chip region by region based on the operating temperature data and the chip heat dissipation temperature distribution data, determine the chip heat dissipation performance, and optimize the chip heat dissipation strategy in each region based on the chip heat dissipation performance; The simulation analysis module is used to control the working environment data of the circuit substrate and simulate and analyze the chip heat dissipation performance of the chip of the circuit substrate under different working environment data.

2. A chip heat dissipation analysis device for a circuit substrate according to claim 1, characterized in that: Chip monitoring module, including: A monitoring sensor selection unit is used to select a sensor for monitoring the chip of the circuit substrate according to the chip heat dissipation monitoring requirements, set the sensor deployment position, and perform real-time monitoring of the chip of the circuit substrate, wherein the sensors include: a chip power sensor and a temperature sensor; A working state unit, used to determine the current chip working state of the circuit substrate according to the real-time monitoring data of the chip power sensor, wherein the current chip working state includes: a pause state and a working state; The operating temperature data unit is used to determine the operating temperature data of the chip of the circuit substrate according to the real-time monitoring data of the temperature sensor.

3. A chip heat dissipation analysis device for a circuit substrate according to claim 2, characterized in that: Working status unit, including: A working operation state block is used to analyze the real-time monitoring data of the chip power sensor to determine the current working operation state of the chip of the circuit substrate, wherein the current working operation state includes: non-operating state, normal operating state and abnormal operating state; When the analysis result shows that the chip does not have operating power, the current working state is determined to be a non-operating state; Determine the normal operating power range of the chip according to the historical monitoring data of the chip power sensor, and when the analysis result shows that the current operating power of the chip is within the normal operating power range, determine that the current working state is a normal operating state; When the analysis result shows that the current operating power of the chip is not within the normal operating power range, the current operating state is determined to be an abnormal operating state; A workload state block is used to determine the current workload state of the chip according to the power ratio of the current operating power within the normal operating power range when the current operating state is the normal operating state; The working status block is used to summarize the current working operation status and the current workload status, and determine the current chip working status of the circuit substrate.

4. A chip heat dissipation analysis device for a circuit substrate according to claim 1, characterized in that: Chip heat dissipation module, including: A temperature alarm unit, used to determine a temperature alarm threshold value according to historical operating temperature data of the chip of the circuit substrate, and to generate temperature alarm data and execute a preset chip heat dissipation strategy when the operating temperature data is not lower than the temperature alarm threshold value; A heat dissipation activation unit, used to activate a chip heat dissipation device of the circuit substrate when monitoring that the current chip working state of the circuit substrate switches from a pause state to a working state; The chip heat dissipation unit is used to determine the heat dissipation method according to the chip heat dissipation device, obtain the heat dissipation target of the chip, determine the preset chip heat dissipation strategy to perform chip heat dissipation treatment on the chip of the circuit substrate, wherein the heat dissipation target includes: heat dissipation temperature target and heat dissipation efficiency target; A heat dissipation area unit, used to determine the heat dissipation area of ​​the chip according to the chip heat dissipation device and the current chip working state of the circuit substrate; The heat dissipation temperature distribution unit is used to obtain the current operating temperature data of the heat dissipation area after the chip heat dissipation process is completed, which is recorded as the chip heat dissipation temperature distribution data.

5. A chip heat dissipation analysis device for a circuit substrate according to claim 4, characterized in that: Heat dissipation area unit, comprising: The total heat dissipation area block is used to determine the chip area of ​​the circuit substrate and the heat dissipation area of ​​the chip heat dissipation device, and determine the total heat dissipation area of ​​the chip, wherein the total heat dissipation area of ​​the chip includes: the chip area and the heat dissipation area; The preliminary area division block is used to divide the total heat dissipation area into regions according to the set heat dissipation area size and preliminarily determine the heat dissipation sub-areas of the chip; The area merging block is used to obtain the historical operating temperature data of the heat dissipation sub-areas. If the historical operating temperature data are consistent or the data deviation does not exceed the temperature difference threshold, the heat dissipation sub-areas are merged and regarded as the same heat dissipation sub-area. The heat dissipation region block is used to determine the heat dissipation sub-region of the chip based on the region merging result.

6. The chip heat dissipation analysis device for a circuit substrate according to claim 1, characterized in that: Thermal analysis module, including: A data processing unit, used to process the operating temperature data and the chip heat dissipation temperature distribution data one by one according to the heat dissipation areas of the chip, and obtain the heat dissipation temperature control data of each heat dissipation area; A heat dissipation zone-by-zone analysis unit is used to perform a heat dissipation analysis of the chip heat dissipation zone by zone according to the chip heat dissipation temperature distribution data. When the chip heat dissipation temperature distribution data is not higher than the temperature data corresponding to the heat dissipation temperature target, it is determined that the chip heat dissipation in the corresponding heat dissipation zone is initially effective; Acquire historical temperature control data of the heat dissipation area where heat dissipation is initially effective, determine the temperature control range, and when the heat dissipation temperature control data of the heat dissipation area where heat dissipation is initially effective is within the temperature control range, determine that the heat dissipation is effective and the heat dissipation control is effective, and record the corresponding heat dissipation area as a normal heat dissipation area; When the heat dissipation temperature control data of the heat dissipation area where heat dissipation is initially effective is not within the temperature control range, it is determined that the heat dissipation is effective but the heat dissipation control is invalid, and the corresponding heat dissipation area is recorded as a heat dissipation abnormal area, wherein the heat dissipation abnormal area includes: an abnormal area where heat dissipation is invalid and an abnormal area where heat dissipation control is invalid; When the chip heat dissipation temperature distribution data is higher than the temperature data corresponding to the heat dissipation temperature target, the heat dissipation area where the chip heat dissipation temperature distribution data is higher than the temperature data corresponding to the heat dissipation temperature target is located and recorded as the heat dissipation abnormal area; The chip heat dissipation performance unit is used to determine the chip heat dissipation performance evaluation index according to the heat dissipation target and calculate the chip heat dissipation performance score; ;in, Indicates the chip's thermal performance rating; Indicates Chip heat dissipation temperature distribution data of each heat dissipation area; Indicates the temperature data corresponding to the heat dissipation temperature target of the chip; Indicates when When the chip heat dissipation temperature distribution data of each heat dissipation area is not lower than the temperature data corresponding to the chip heat dissipation temperature target, the output , otherwise, output 1; Indicates the heat dissipation time of the chip. Indicates the cooling time corresponding to the cooling efficiency target of the chip; Indicates the influence weight of heat dissipation temperature on heat dissipation performance score; Indicates the weight of the influence of heat dissipation time on the heat dissipation performance score; Indicates the number of heat dissipation areas of the chip; The chip heat dissipation score threshold is set according to the historical temperature control data. When the chip heat dissipation performance score is not higher than the chip heat dissipation score threshold, the chip heat dissipation is judged to be uncontrollable and the chip working state needs to be suspended. When the chip's heat dissipation performance score is higher than the chip's heat dissipation score threshold, the chip's heat dissipation is determined to be controllable, the chip's working state is maintained, and the chip's heat dissipation strategy in each area is optimized based on the chip's heat dissipation performance score; The heat dissipation optimization unit is used to optimize the chip heat dissipation strategy of the heat dissipation abnormality area according to the heat dissipation performance score of the chip. If the regional heat dissipation performance score of the heat dissipation abnormality area after optimization is not lower than the heat dissipation performance score of the chip, it is determined that the chip heat dissipation strategy optimization is completed.

7. A chip heat dissipation analysis device for a circuit substrate according to claim 1, characterized in that: Simulation analysis module, including: A working environment control unit, used to obtain environmental factors that affect the heat dissipation of the chip of the circuit substrate, and determine control factors for controlling the working environment data of the circuit substrate, wherein the environmental factors include: environmental temperature factors, environmental airflow factors, environmental humidity factors, environmental pressure factors, and workload factors; The simulation heat dissipation unit is used to control the working environment data of the circuit substrate according to the control factors, and simulate and analyze the chip heat dissipation performance of the chip of the circuit substrate under different working environment data according to the preset simulation analysis software.

8. The chip heat dissipation analysis device for a circuit substrate according to claim 1, characterized in that: Also includes: The heat dissipation optimization module is used to optimize the chip heat dissipation strategy according to the working environment data of the circuit substrate and the chip heat dissipation performance; An optimization verification module is used to optimize and verify the optimized chip heat dissipation strategy according to the actual operation of the circuit substrate; The heat dissipation analysis visualization module is used to visualize the chip heat dissipation strategy that has passed the optimization verification, the corresponding circuit substrate working environment data, and the chip heat dissipation performance.

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