Heat dissipation assembly and electronic equipment

Abstract

The invention relates to a heat dissipation assembly and electronic equipment. The heat dissipation assembly comprises a heat conduction piece, the heat conduction piece comprises a first heat conduction part and a plurality of first protrusions, the first heat conduction part comprises a first surface and a second surface which are oppositely arranged in the thickness direction of the heat dissipation assembly, and the first protrusions are arranged on the first surface at intervals in the first direction and extend in the second direction; a first heat dissipation channel is formed between every two adjacent first protrusions, the first direction and the second direction intersect, and the first direction and the second direction are both perpendicular to the thickness direction of the heat dissipation assembly. The fans are arranged on the sides, away from the first heat conduction part, of the first protrusions at intervals. Therefore, according to the heat dissipation assembly and the electronic equipment provided by the invention, the heat dissipation effect of the heat dissipation assembly and the electronic equipment can be improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to heat dissipation components and electronic devices. Background Art

[0002] In a computer, a voltage regulator module (VRM) is used to adjust the voltage on the motherboard to a voltage acceptable to a central processing unit (CPU). However, the heat dissipation effect of existing heat sinks on the voltage regulator module needs to be improved. Summary of the invention

[0003] Based on this, it is necessary to provide a heat dissipation component and an electronic device, which can improve the heat dissipation effect of the heat dissipation component and the electronic device.

[0004] In a first aspect, an embodiment of the present application provides a heat dissipation component, comprising: a heat conducting member, comprising a first heat conducting portion and a plurality of first protrusions, the first heat conducting portion comprising a first surface and a second surface arranged opposite to each other along a thickness direction of the heat dissipation component, a plurality of first protrusions being arranged on the first surface at intervals along the first direction, and all extending along the second direction; a first heat dissipation channel being formed between two adjacent first protrusions, the first direction and the second direction intersecting, and both the first direction and the second direction being perpendicular to the thickness direction of the heat dissipation component; a plurality of fans being arranged at intervals on a side of the plurality of first protrusions away from the first heat conducting portion.

[0005] The heat dissipation component provided in the embodiment of the present application accelerates the airflow velocity in the first heat dissipation channel by setting a fan to accelerate the airflow velocity in the electronic device, so that the heat dissipation method of the heat dissipation component is an active heat dissipation method, which can improve the heat dissipation effect of the heat dissipation component.

[0006] In one embodiment, the first heat-conducting portion includes a first sub-heat-conducting portion and a plurality of second sub-heat-conducting portions, and the plurality of second sub-heat-conducting portions are all arranged on one side of the first sub-heat-conducting portion along the first direction;

[0007] The plurality of second heat-conducting sub-portions are arranged at intervals along the second direction and extend along the first direction. A second heat-dissipating channel is formed between two adjacent second heat-conducting sub-portions. The first heat-dissipating channel and the second heat-dissipating channel are interconnected.

[0008] In one embodiment, the plurality of first protrusions together form a first protrusion group, the first protrusion group includes a third surface and a fourth surface arranged opposite to each other along a first direction, and the direction from the third surface to the fourth surface is the same as the direction from the first sub-heat conducting portion to the second sub-heat conducting portion;

[0009] A plurality of second protrusions are arranged on the fourth surface, and the plurality of second protrusions are arranged at intervals along the second direction and all extend along the first direction. A third heat dissipation channel is formed between two adjacent second protrusions. The third heat dissipation channel and the second heat dissipation channel are arranged correspondingly, and the third heat dissipation channel is connected to the corresponding second heat dissipation channel.

[0010] In one embodiment, the second heat dissipation channel penetrates at least a portion of the first protrusion near an end of the first heat conducting portion along the first direction;

[0011] And / or, each second protrusion is provided with a plurality of third protrusions on one side toward the first heat conducting part along the thickness direction of the heat dissipation component; on the same second protrusion, the plurality of third protrusions are arranged at intervals along the first direction and all extend along the second direction, and sub-heat dissipation channels are formed between two adjacent third protrusions and between the third protrusion closest to the fourth surface and the fourth surface; the sub-heat dissipation channels on the plurality of second protrusions are arranged along the second direction and together form a fourth heat dissipation channel, there are a plurality of fourth heat dissipation channels, the plurality of fourth heat dissipation channels are arranged at intervals along the first direction, and the fourth heat dissipation channel is connected to the third heat dissipation channel.

[0012] In one embodiment, the heat conducting member includes a second heat conducting portion, the second heat conducting portion is connected to the fourth surface, the second heat conducting portion is located on a side of the second protrusion away from the first heat conducting portion along the thickness direction of the heat dissipation component, and protrudes from a surface of the first protrusion away from the first heat conducting portion;

[0013] A plurality of heat dissipation grooves are arranged on both sides of the second heat conducting portion along the first direction; on the same side of the second heat conducting portion along the first direction, the plurality of heat dissipation grooves are arranged at intervals along the thickness direction of the heat dissipation component and extend along the second direction.

[0014] In one embodiment, the heat conducting member further includes an auxiliary heat conducting portion, which is located on a side of the second heat conducting portion away from the first protrusion along the first direction;

[0015] On one side of the second heat-conducting portion away from the first protrusion along the first direction, a plurality of heat-dissipating grooves are distributed on both sides of the auxiliary heat-conducting portion along the thickness direction of the heat-dissipating component;

[0016] And / or, two first mounting holes are provided on a side of the second heat-conducting portion facing away from the second protrusion, and the two first mounting holes are spaced apart at two ends of the second heat-conducting portion along the second direction; the heat dissipation assembly includes two first mounting members, the first mounting members are provided corresponding to the first mounting holes, the first mounting members include a first end and a second end that are arranged opposite to each other, a flange is provided on the outer periphery of the first mounting member, the flange is located between the first end and the second end, the first end is plug-connected to the corresponding first mounting hole, and the second end is used to be plug-connected to the through hole of the circuit board;

[0017] And / or, the second heat conducting portion and the second protrusion are arranged at an interval, and a fifth heat dissipation channel is formed between the second heat conducting portion and the second protrusion, and the fifth heat dissipation channel is connected to the third heat dissipation channel.

[0018] In one embodiment, the heat dissipation assembly includes a plurality of second mounting members, and the plurality of fans are arranged correspondingly to the plurality of second mounting members; the second mounting member includes an inserting portion and an abutting portion, a plurality of second mounting holes are arranged on a side of the first protrusion away from the first heat conducting portion, and the plurality of second mounting members are arranged correspondingly to the plurality of second mounting holes; the inserting portion penetrates the corresponding fan and is inserted into the corresponding second mounting hole, and the abutting portion abuts against a side of the corresponding fan away from the first protrusion;

[0019] And / or, one of the air inlet and the air outlet of the fan faces the first heat dissipation channel and is communicated with the first heat dissipation channel.

[0020] In one embodiment, the heat conducting member further comprises a third heat conducting portion, the third heat conducting portion is disposed on the second surface, and the third heat conducting portion extends from the second heat conducting sub-portion to the first heat conducting sub-portion in a direction away from the first heat conducting sub-portion;

[0021] A buffer is provided on one side of the third heat conducting portion facing the first protrusion along the thickness direction of the heat dissipation component.

[0022] In a second aspect, an embodiment of the present application provides an electronic device, comprising a circuit board and the heat dissipation assembly in the first aspect, wherein the circuit board is arranged on one side of the heat dissipation assembly in a thickness direction, and the thickness direction of the heat dissipation assembly is consistent with the thickness direction of the circuit board.

[0023] In one embodiment, the electronic device includes two third mounting members, a first heating element is arranged on a side of the circuit board facing the heat dissipation assembly, and the first heating element is located between the second heat conducting portion of the heat dissipation assembly and the circuit board; two through holes are arranged on the circuit board, and the two through holes are located on both sides of the first heating element along the second direction; the second end of the first mounting member of the heat dissipation assembly is inserted into the corresponding through hole, one end of the third mounting member is inserted into the corresponding second end, and the other end of the third mounting member abuts against a side of the circuit board away from the heat dissipation assembly; the dimension of the flange of the first mounting member along the thickness direction of the heat dissipation assembly is greater than the dimension of the first heating element along the thickness direction of the heat dissipation assembly;

[0024] And / or, a first heating element is arranged on a side of the circuit board facing the heat dissipation component, and the first heating element is located between the second heat conduction part of the heat dissipation component and the circuit board; a first heat conductive adhesive is arranged between the first heating element and the second heat conduction part;

[0025] And / or, a second heating element is provided on a side of the circuit board facing the heat dissipation assembly, the second heating element is located between the auxiliary heat conduction portion of the heat dissipation assembly and the circuit board, and a second heat conductive adhesive is provided between the auxiliary heat conduction portion and the second heating element;

[0026] And / or, a third heating element is further disposed on one side of the circuit board facing the heat dissipation component, and the third heating element is disposed at intervals on one side of the heat dissipation component along the first direction and close to a third heat dissipation channel of the heat dissipation component;

[0027] And / or, an interface component is provided on one side of the circuit board facing the heat dissipation component, the interface component is provided between the third heat conduction portion of the heat dissipation component and the circuit board, and the buffer of the heat dissipation component is located between the interface component and the third heat conduction portion;

[0028] And / or, a first heating element is disposed on a side of the circuit board facing the heat dissipation component, and the first heating element includes a power transistor;

[0029] And / or, a second heating element is disposed on a side of the circuit board facing the heat dissipation component, and the second heating element includes an inductor;

[0030] And / or, a third heating element is disposed on a side of the circuit board facing the heat dissipation assembly, and the third heating element includes a central processing unit.

[0031] The electronic device provided in the embodiment of the present application includes a heat dissipation component, which accelerates the airflow velocity in the first heat dissipation channel by setting a fan to accelerate the airflow velocity in the electronic device, so that the heat dissipation method of the heat dissipation component is an active heat dissipation method, which can improve the heat dissipation effect of the heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] FIG. 1 is a schematic diagram of the structure of a heat sink provided in an embodiment of the present application.

[0033] FIG. 2 is a schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application.

[0034] FIG3 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0035] FIG. 4 is an exploded view of an electronic device provided in an embodiment of the present application.

[0036] Description of reference numerals:

[0037] 10. electronic device; 100. heat dissipation assembly; 101. heat conducting member; 110. first heat conducting portion; 111. first sub-heat conducting portion; 112. second sub-heat conducting portion; 1131. first surface; 1132. second surface; 120. second heat conducting portion; 121. heat dissipation slot; 130. third heat conducting portion; 141. first protrusion; 141a. first protrusion group; 1412. second mounting hole; 1413. third surface; 1414. fourth surface; 142. second protrusion; 143. third protrusion; 144. auxiliary heat conducting portion; 151. first heat dissipation channel; 152. second heat dissipation channel; 1 53. The third heat dissipation channel; 154. The fourth heat dissipation channel; 1541. The sub-heat dissipation channel; 155. The fifth heat dissipation channel; 161. The first mounting member; 1611. The first end; 1612. The second end; 1613. The flange; 162. The second mounting member; 1621. The insertion portion; 1622. The abutment portion; 163. The buffer member; 164. The fan; 211. The first heating element; 212. The second heating element; 213. The third heating element; 214. The interface assembly; 220. The circuit board; 223. The through hole; 231. The first thermally conductive adhesive; 232. The second thermally conductive adhesive; 230. The third mounting member. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0039] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0040] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0041] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0042] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0044] In the related art, in a computer, a metal heat sink can be used to dissipate heat from a voltage regulating module. The heat of the voltage regulating module is transferred to the metal heat sink, which has a high thermal conductivity. Through the natural convection of the air in the external environment, the heat can be transferred to the external environment more quickly, thereby achieving heat dissipation of the voltage regulating module. However, the natural convection of the air in the external environment takes away the heat of the metal heat sink, which is a passive heat dissipation method with low heat dissipation efficiency, thereby causing the heat of the voltage regulating module to be unable to be dissipated, affecting the performance and life of the voltage regulating module.

[0045] In order to solve the above problems, an embodiment of the present application provides a heat dissipation component and an electronic device, which can improve the heat dissipation effect of the heat dissipation component and the electronic device.

[0046] The heat dissipation assembly 100 provided in the embodiment of the present application will be described below in conjunction with FIGS. 1 to 4 .

[0047] Referring to FIG. 1 , the heat dissipation assembly 100 may have a first direction A, a second direction B and a third direction C, and the first direction A, the second direction B and the third direction C are all different. For example, the first direction A, the second direction B and the third direction C may be perpendicular to each other. Exemplarily, the first direction A may be the width direction of the heat dissipation assembly 100, the second direction B may be the length direction of the heat dissipation assembly 100, and the third direction C may be the thickness direction of the heat dissipation assembly 100. The length, width and thickness in the embodiments of the present application are merely for the convenience of description and do not imply any limitation on the size. For example, the width may be greater than, equal to or less than the length. The direction of the heat dissipation assembly 100 may be consistent with the direction of the circuit board 220.

[0048] In some embodiments, referring to FIGS. 1 and 2 , the heat dissipation assembly 100 includes a heat conductor 101, which is used to absorb heat from heating elements (e.g., at least one of the first heating element 211, the second heating element 212, and the third heating element 213) on a circuit board 220 (FIG. 4), and transfer the heat to the external environment to dissipate the heat from the heating elements on the circuit board 220.

[0049] Exemplarily, the heat conductor 101 may be formed of a material with a high thermal conductivity, such as aluminum, copper, or other metals, or may be made of a ceramic material.

[0050] In some embodiments, referring to FIG. 1 , the heat conducting member 101 includes a first heat conducting portion 110 and a plurality of first protrusions 141, the first heat conducting portion 110 includes a first surface 1131 and a second surface 1132 that are disposed opposite to each other along the thickness direction of the heat dissipation assembly 100, the plurality of first protrusions 141 are arranged on the first surface 1131 at intervals along a first direction A, and the plurality of first protrusions 141 all extend along a second direction B. Thus, by providing a plurality of first protrusions 141, the heat dissipation area of ​​the heat conducting member 101 can be increased, thereby improving the heat dissipation effect of the heat conducting member 101.

[0051] Exemplarily, a first heat dissipation channel 151 is formed between two adjacent first protrusions 141, and the first heat dissipation channel 151 extends along the second direction B. The airflow velocity in the first heat dissipation channel 151 is relatively fast, and the first heat dissipation channel 151 has a guiding effect on the airflow, which can improve the heat dissipation effect of the multiple first protrusions 141, thereby improving the heat dissipation effect of the heat conductor 101, so as to improve the performance and life of the heating element.

[0052] In some embodiments, referring to FIG. 2 , the heat dissipation assembly 100 includes a plurality of fans 164 , which are arranged at intervals on a side of the plurality of first protrusions 141 away from the first heat conducting portion 110 , and the plurality of fans 164 are arranged along the second direction B. In this way, the airflow velocity in the first heat dissipation channel 151 is accelerated by arranging the fans 164 , so as to accelerate the airflow velocity in the electronic device 10 , so that the heat dissipation mode of the heat dissipation assembly 100 is an active heat dissipation mode, and the heat dissipation effect of the heat dissipation assembly 100 can be improved.

[0053] Exemplarily, the number of fans 164 may be 2, 3, or any number greater than or equal to 4. For example, referring to FIG. 2 , the number of fans 164 may be four.

[0054] Exemplarily, one of the air outlet and the air inlet of the fan 164 faces the first heat dissipation channel 151 and is connected to the first heat dissipation channel 151, thereby facilitating better improvement of the air flow velocity in the first heat dissipation channel 151, allowing the air flow to quickly pass through the first heat dissipation channel 151 to quickly take away the heat on the heat conductor 101, thereby facilitating improvement of the heat dissipation effect of the heat dissipation assembly 100.

[0055] In some embodiments, the first heat-conducting portion 110 includes a first heat-conducting sub-portion 111 and a plurality of second heat-conducting sub-portions 112, the plurality of second heat-conducting sub-portions 112 are all disposed on one side of the first heat-conducting sub-portion 111 along the first direction A, and the plurality of second heat-conducting sub-portions 112 may be connected through the first heat-conducting sub-portion 111. The plurality of second heat-conducting sub-portions 112 are arranged at intervals along the second direction B, and the plurality of second heat-conducting sub-portions 112 extend along the first direction A. In this way, by dividing the first heat-conducting portion 110 into the first heat-conducting sub-portion 111 and the plurality of second heat-conducting sub-portions 112, the heat dissipation area of ​​the first heat-conducting portion 110 may be increased, thereby improving the heat dissipation effect of the heat-conducting member 101.

[0056] Exemplarily, a second heat dissipation channel 152 is formed between two adjacent second heat-conducting sub-parts 112, and the second heat dissipation channel 152 extends along the first direction A. The first heat dissipation channel 151 and the second heat dissipation channel 152 are interconnected, and the first heat dissipation channel 151 and the second heat dissipation channel 152 are intertwined with each other, and the "aerodynamics and thermal principles" are used to increase air circulation to enhance heat dissipation capacity and improve product performance, so that airflow can quickly pass through the heat conductive member 101 along the first direction A and the second direction B, so that more airflow can enter the heat conductive member 101, speed up the heat exchange speed between the gas and the heat conductive member 101 in all directions, and better improve the heat dissipation effect of the heat conductive member 101.

[0057] Exemplarily, referring to FIG. 1 , a plurality of first protrusions 141 together form a first protrusion group 141 a, and the first protrusion group 141 a includes a third surface 1413 and a fourth surface 1414 arranged opposite to each other along a first direction A, and a direction from the third surface 1413 to the fourth surface 1414 is the same as a direction from the first sub-heat conducting portion 111 to the second sub-heat conducting portion 112 (i.e., a direction from left to right in FIG. 1 ).

[0058] In some embodiments, referring to FIG. 1 , a plurality of second protrusions 142 are disposed on the fourth surface 1414 , the plurality of second protrusions 142 are arranged at intervals along the second direction B, and the plurality of second protrusions 142 all extend along the first direction A. Thus, by providing a plurality of second protrusions 142 , the heat dissipation area of ​​the heat conducting member 101 can be increased, thereby improving the heat dissipation effect of the heat conducting member 101 .

[0059] Exemplarily, referring to FIG. 1 , a third heat dissipation channel 153 is formed between two adjacent second protrusions 142 , and the third heat dissipation channel 153 extends along the first direction A. The airflow velocity in the third heat dissipation channel 153 is relatively fast, and the third heat dissipation channel 153 has a guiding effect on the airflow, which can improve the heat dissipation effect of the multiple second protrusions 142 , thereby improving the heat dissipation effect of the heat conductor 101 .

[0060] Exemplarily, referring to Figure 1, the third heat dissipation channel 153 and the second heat dissipation channel 152 are arranged correspondingly, and the third heat dissipation channel 153 is connected to the corresponding second heat dissipation channel 152. The airflow in the corresponding second heat dissipation channel 152 can be guided to the desired position through the third heat dissipation channel 153, which is beneficial to improve the flexibility of the setting position of the second heat dissipation channel 152. In addition, the extension length of the second heat dissipation channel 152 can be extended through the third heat dissipation channel 153, which is beneficial to improve the heat dissipation effect of the second heat dissipation channel 152, thereby improving the heat dissipation effect of the heat conductor 101.

[0061] In some embodiments, the second heat dissipation channel 152 penetrates at least a portion of the first protrusion 141 along the first direction A near one end of the first heat conducting portion 110, thereby expanding the size of the second heat dissipation channel 152 along the thickness direction (third direction C) of the heat dissipation component 100, which is beneficial to accelerate the airflow exchange in the first heat dissipation channel 151 and the second heat dissipation channel 152, so that the heat dissipation uniformity of the first heat dissipation channel 151 and the second heat dissipation channel 152 is higher, and the heat dissipation uniformity of the heat conducting member 101 can be improved.

[0062] In some embodiments, referring to FIG. 1 , each second protrusion 142 is provided with a plurality of third protrusions 143 on one side of the heat dissipation component 100 toward the first heat conducting portion 110 along the thickness direction of the heat dissipation component 100 . Thus, by providing a plurality of third protrusions 143 , the heat dissipation area of ​​the heat conducting component 101 can be increased, thereby improving the heat dissipation effect of the heat conducting component 101 .

[0063] Exemplarily, referring to FIG. 1 , on the same second protrusion 142, a plurality of third protrusions 143 are arranged at intervals along the first direction A, and the plurality of third protrusions 143 extend along the second direction B, and a sub-heat dissipation channel 1541 is formed between two adjacent third protrusions 143, and between the third protrusion 143 closest to the fourth surface 1414 and the fourth surface 1414. The sub-heat dissipation channels 1541 on the plurality of second protrusions 142 are arranged along the second direction B, and together form a fourth heat dissipation channel 154. The fourth heat dissipation channel 154 extends along the second direction B. There are a plurality of fourth heat dissipation channels 154, and the plurality of fourth heat dissipation channels 154 are arranged at intervals along the first direction A, and the fourth heat dissipation channel 154 is connected to the third heat dissipation channel 153. In this way, the fourth heat dissipation channel 154 and the third heat dissipation channel 153 are interlaced with each other, so that the airflow can quickly pass through the heat conductive member 101 along the first direction A and the second direction B, so that more airflow can enter the heat conductive member 101, speeding up the heat exchange speed between the gas and the heat conductive member 101 in all directions, and better improving the heat dissipation effect of the heat conductive member 101. In addition, the plurality of third protrusions 143 are arranged on the side of the second protrusion 142 facing the first heat conducting portion 110, and the third protrusions 143 have little effect on the thickness of the heat dissipation assembly 100, which is conducive to reducing the thickness of the heat dissipation assembly 100.

[0064] In some embodiments, referring to FIG. 1 , the heat conducting member 101 includes a second heat conducting portion 120, which is connected to the fourth surface 1414, and the second heat conducting portion 120 is located on a side of the second protrusion 142 away from the first heat conducting portion 110 along the third direction C. By providing the second heat conducting portion 120, the heat dissipation area of ​​the heat conducting member 101 can be increased, thereby improving the heat dissipation effect of the heat conducting member 101.

[0065] Illustratively, the second heat conducting portion 120 protrudes from the surface of the first protrusion 141 that is away from the first heat conducting portion 110. In this way, the second heat conducting portion 120 and the first protrusion 141 together enclose a first accommodating space for accommodating the fan 164, which helps to reduce the impact of the fan 164 on the thickness of the heat dissipation assembly 100 and can also provide protection for the fan 164.

[0066] Exemplarily, referring to FIG. 1 , the second heat conducting portion 120 and the second protrusion 142 are spaced apart, and a fifth heat dissipation channel 155 is formed between the second heat conducting portion 120 and the second protrusion 142, the fifth heat dissipation channel 155 is communicated with the third heat dissipation channel 153, and the fifth heat dissipation channel 155 extends along the second direction B. In this way, the fifth heat dissipation channel 155 and the third heat dissipation channel 153 are interlaced with each other, so that the airflow can quickly pass through the heat conducting member 101 along both the first direction A and the second direction B, so that more airflow can enter the heat conducting member 101, speed up the heat exchange speed between the gas in all directions and the heat conducting member 101, and better improve the heat dissipation effect of the heat conducting member 101.

[0067] Exemplarily, referring to FIG. 1 , a plurality of heat dissipation grooves 121 are provided on both sides of the second heat conducting portion 120 along the first direction A. On the same side of the second heat conducting portion 120 along the first direction A, the plurality of heat dissipation grooves 121 are arranged at intervals along the thickness direction of the heat dissipation assembly 100, and the plurality of heat dissipation grooves 121 extend along the second direction B. In this way, the airflow velocity in the heat dissipation grooves 121 is relatively fast, and the airflow is guided. In addition, the heat exchange area of ​​the second heat conducting portion 120 can be increased, thereby improving the heat dissipation effect of the second heat conducting portion 120, thereby improving the heat dissipation effect of the heat conducting member 101.

[0068] In some embodiments, referring to FIG. 1 , the heat conducting member 101 further includes an auxiliary heat conducting portion 144, which is located on the side of the second heat conducting portion 120 away from the first protrusion 141 along the first direction A, so that the fan 164 and the auxiliary heat conducting portion 144 are respectively located on both sides of the second heat conducting portion 120, which can prevent the auxiliary heat conducting portion 144 from interfering with the fan 164, and is beneficial to reducing the volume of the heat dissipation assembly 100. In addition, by providing the auxiliary heat conducting portion 144, it is beneficial to increase the heat exchange area of ​​the heat conducting member 101, thereby improving the heat dissipation effect of the heat conducting member 101.

[0069] Exemplarily, on the side of the second heat-conducting portion 120 away from the first protrusion 141 along the first direction A, a plurality of heat-dissipating grooves 121 are distributed on both sides of the auxiliary heat-conducting portion 144 along the thickness direction of the heat-dissipating assembly 100, thereby facilitating the improvement of the heat-dissipating uniformity on both sides of the auxiliary heat-conducting portion 144. In addition, one end of the second heat-conducting portion 120 away from the first heat-conducting portion 110 along the third direction C and the auxiliary heat-conducting portion 144 together enclose a second accommodation space for accommodating the second heating element 212 (FIG. 4), so that the total volume of the heat-dissipating assembly 100 and the second heating element 212 is small, which is conducive to reducing the volume of the electronic device 10.

[0070] In some embodiments, referring to FIG. 2 and FIG. 4 , two first mounting holes (for example, the first mounting holes may be blind holes) are provided on the side of the second heat conducting part 120 away from the first heat conducting part 110 along the thickness direction of the heat dissipation component 100, and the two first mounting holes are spaced apart at both ends of the second heat conducting part 120 along the second direction B. The heat dissipation component 100 includes two first mounting members 161, the first mounting members 161 are provided corresponding to the first mounting holes, the first mounting members 161 include a first end 1611 and a second end 1612 which are arranged opposite to each other, a flange 1613 is provided around the outer periphery of the first mounting member 161, the flange 1613 is located between the first end 1611 and the second end 1612, the first end 1611 is plug-connected with the corresponding first mounting hole, and the second end 1612 is used to be plug-connected with the through hole 223 of the circuit board 220. In this way, by providing the first mounting member 161, the heat conducting member 101 can be positioned, and the installation of the heat conducting member 101 can be simplified. The flange 1613 can create a gap between the heat conductor 101 and the circuit board 220 , which can be used to accommodate the heating element on the circuit board 220 , and can reduce the pressure of the heat conductor 101 on the heating element (eg, the first heating element 211 ), thereby protecting the heating element.

[0071] In some embodiments, referring to FIG. 2 and FIG. 4 , the heat dissipation assembly 100 includes a plurality of second mounting members 162, a plurality of fans 164 are provided corresponding to the plurality of second mounting members 162, and the fans 164 are installed on the first protrusion 141 through the corresponding second mounting members 162. The fan 164 may be provided with at least one second mounting member 162 in correspondence. The embodiment of the present application takes the example that one fan 164 may be provided with four second mounting members 162 in correspondence. The second mounting member 162 includes an insertion portion 1621 and an abutment portion 1622, a plurality of second mounting holes 1412 are provided on the side of the first protrusion 141 facing away from the first heat conducting portion 110, and the plurality of second mounting members 162 are provided corresponding to the plurality of second mounting holes 1412. The insertion portion 1621 passes through the corresponding fan 164 and is inserted into the corresponding second mounting hole 1412 . The abutting portion 1622 abuts against a side of the corresponding fan 164 away from the first protrusion 141 , thereby fixing the corresponding fan 164 on the heat conducting member 101 through the second mounting member 162 .

[0072] For example, the inserting portion 1621 may be threadedly connected to the second mounting hole 1412. The second mounting hole 1412 may be a blind hole.

[0073] In some embodiments, referring to FIG. 1 and FIG. 4 , the heat-conducting member 101 further includes a third heat-conducting portion 130, which is disposed on the second surface 1132, and the third heat-conducting portion 130 extends from the second sub-heat-conducting portion 112 to the first sub-heat-conducting portion 111 in a direction away from the first sub-heat-conducting portion 111, so that the third heat-conducting portion 130 protrudes from the third surface 1413. In this way, the third heat-conducting portion 130 and the third surface 1413 jointly form a third accommodating space for accommodating the interface component 214, which helps to reduce the adverse effects of the interface component 214 on the thickness of the electronic device 10.

[0074] Exemplarily, referring to FIG. 4 , a buffer member 163 is provided on one side of the third heat conducting portion 130 along the third direction C toward the first protrusion 141 . The buffer member 163 can reduce the force of the heat conducting member 101 on the structural member therebelow (eg, the interface assembly 214 ), thereby protecting the interface assembly 214 .

[0075] The electronic device 10 provided in the embodiment of the present application is described below.

[0076] In some embodiments, referring to FIG. 3 and FIG. 4 , the electronic device 10 includes a circuit board 220 and a heat dissipation assembly 100, wherein the circuit board 220 is disposed on one side of the heat dissipation assembly 100 in the thickness direction, and the thickness direction of the heat dissipation assembly 100 is consistent with the thickness direction of the circuit board 220. The heat dissipation assembly 100 is connected to the circuit board 220 and is used to dissipate heat from the heating element on the circuit board 220.

[0077] In some embodiments, the electronic device 10 includes two third mounting members 230, the third mounting members 230 are arranged corresponding to the first mounting member 161, and the first heating element 211 is arranged on the side of the circuit board 220 facing the heat dissipation assembly 100, and the first heating element 211 is located between the second heat conducting portion 120 and the circuit board 220. Two through holes 223 are arranged on the circuit board 220, the through holes 223 are arranged corresponding to the first mounting member 161, and the two through holes 223 are located on both sides of the first heating element 211 along the second direction B to prevent the through holes 223 from having an adverse effect on the layout of the first heating element 211. The second end 1612 of the first mounting member 161 is inserted into the corresponding through hole 223, and the dimension of the flange 1613 along the thickness direction of the heat dissipation assembly 100 is greater than the dimension of the first heating element 211 along the thickness direction of the heat dissipation assembly 100. The flange 1613 allows a gap for accommodating the first heating element 211 to be provided between the heat conductive member 101 and the circuit board 220, thereby preventing the heat conductive member 101 from exerting pressure on the first heating element 211, which is beneficial to protecting the first heating element 211. One end of the third mounting member 230 is inserted into the corresponding second end 1612, and the other end of the third mounting member 230 abuts against the side of the circuit board 220 that is away from the heat dissipation assembly 100. In this way, the first mounting member 161 is fixed to the circuit board 220 through the third mounting member 230, so as to fix the heat conductive member 101 to the circuit board 220.

[0078] Exemplarily, the third mounting member 230 and the first mounting member 161 may be threadedly connected.

[0079] Exemplarily, referring to Figures 3 and 4, a first thermally conductive adhesive 231 is provided between the first heating element 211 and the second heat-conducting part 120, and thermal contact is achieved through the first thermally conductive adhesive 231, which is beneficial to improving the heat conduction efficiency between the first heating element 211 and the second heat-conducting part 120 and improving the heat dissipation effect of the first heating element 211.

[0080] Exemplarily, referring to Figures 3 and 4, a second heating element 212 is provided on the side of the circuit board 220 facing the heat dissipation assembly 100, and the second heating element 212 is located between the auxiliary heat-conducting part 144 and the circuit board 220. A second thermally conductive adhesive 232 is provided between the auxiliary heat-conducting part 144 and the second heating element 212, and thermal contact is achieved through the second thermally conductive adhesive 232, which is beneficial to improving the heat conduction efficiency between the second heating element 212 and the auxiliary heat-conducting part 144, and improving the heat dissipation effect of the second heating element 212.

[0081] In some embodiments, referring to FIG. 3 and FIG. 4 , a third heating element 213 is further provided on the side of the circuit board 220 facing the heat dissipation component 100. The third heating element 213 is spaced apart on one side of the heat dissipation component 100 along the first direction A and is arranged close to the third heat dissipation channel 153. Thus, the third heat dissipation channel 153 helps to increase the circulation speed of the airflow on the third heating element 213, thereby improving the heat dissipation effect of the third heating element 213. In addition, the heat conductive member 101 does not cover the third heating element 213 but dissipates the heat for the third heating element 213 through the third heat dissipation channel 153, which helps to reduce the volume and weight of the heat conductive member 101.

[0082] In some embodiments, referring to FIG. 3 and FIG. 4 , an interface component 214 is provided on the side of the circuit board 220 facing the heat dissipation component 100 , the interface component 214 is provided between the third heat conducting part 130 and the circuit board 220 , the buffer component 163 is located between the interface component 214 and the third heat conducting part 130 , and the buffer component 163 can protect the interface component 214 .

[0083] Exemplarily, the first heating element 211 includes a power transistor (eg, a MOS transistor). The number of the first heating element 211 may be one or more.

[0084] Exemplarily, the second heating element 212 includes an inductor. The number of the second heating element 212 may be one or more.

[0085] Exemplarily, the third heating element 213 includes a central processing unit.

[0086] Exemplarily, at least one of the first heating element 211 and the second heating element 212 may be used to form a voltage regulating module.

[0087] By way of example, the electronic device 10 may include a computer or other electronic devices.

[0088] Exemplarily, capacitors or other electronic components may also be disposed on the circuit board 220 .

[0089] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A heat dissipation component, characterized in that: include: A heat conducting member, comprising a first heat conducting portion and a plurality of first protrusions, wherein the first heat conducting portion comprises a first surface and a second surface which are arranged opposite to each other along the thickness direction of the heat dissipation component, wherein the plurality of first protrusions are arranged on the first surface at intervals along the first direction and all extend along the second direction; a first heat dissipation channel is formed between two adjacent first protrusions, wherein the first direction and the second direction intersect, and both the first direction and the second direction are perpendicular to the thickness direction of the heat dissipation component; A plurality of fans are arranged at intervals on a side of the plurality of first protrusions away from the first heat conducting portion.

2. The heat dissipation assembly according to claim 1, characterized in that: The first heat-conducting portion includes a first sub-heat-conducting portion and a plurality of second sub-heat-conducting portions, and the plurality of second sub-heat-conducting portions are all arranged on one side of the first sub-heat-conducting portion along the first direction; The plurality of second heat-conducting sub-portions are arranged at intervals along the second direction and extend along the first direction. A second heat-dissipating channel is formed between two adjacent second heat-conducting sub-portions, and the first heat-dissipating channel and the second heat-dissipating channel are interconnected.

3. The heat dissipation assembly according to claim 2, characterized in that: The plurality of first protrusions together form a first protrusion group, the first protrusion group includes a third surface and a fourth surface arranged opposite to each other along the first direction, and the direction from the third surface to the fourth surface is the same as the direction from the first sub-heat conducting portion to the second sub-heat conducting portion; A plurality of second protrusions are arranged on the fourth surface, the plurality of second protrusions are arranged at intervals along the second direction and all extend along the first direction, a third heat dissipation channel is formed between two adjacent second protrusions, the third heat dissipation channel and the second heat dissipation channel are arranged correspondingly, and the third heat dissipation channel is connected to the corresponding second heat dissipation channel.

4. The heat dissipation assembly according to claim 3, characterized in that: The second heat dissipation channel penetrates at least a portion of the first protrusion along the first direction and is close to an end of the first heat conducting portion; And / or, each of the second protrusions is provided with a plurality of third protrusions on one side of the first heat conducting part along the thickness direction of the heat dissipation component; on the same second protrusion, the plurality of third protrusions are arranged at intervals along the first direction and all extend along the second direction, and sub-heat dissipation channels are formed between two adjacent third protrusions and between the third protrusion closest to the fourth surface and the fourth surface; the sub-heat dissipation channels on the plurality of second protrusions are arranged along the second direction and together form a fourth heat dissipation channel, there are a plurality of fourth heat dissipation channels, the plurality of fourth heat dissipation channels are arranged at intervals along the first direction, and the fourth heat dissipation channel is connected to the third heat dissipation channel.

5. The heat dissipation assembly according to claim 3, characterized in that: The heat conducting member includes a second heat conducting portion, the second heat conducting portion is connected to the fourth surface, the second heat conducting portion is located on a side of the second protrusion away from the first heat conducting portion along the thickness direction of the heat dissipation component, and protrudes from a surface of the first protrusion away from the first heat conducting portion; A plurality of heat dissipation grooves are arranged on both sides of the second heat conducting portion along the first direction; on the same side of the second heat conducting portion along the first direction, the plurality of heat dissipation grooves are arranged at intervals along the thickness direction of the heat dissipation component and extend along the second direction.

6. The heat dissipation assembly according to claim 5, characterized in that: The heat conducting member further comprises an auxiliary heat conducting portion, wherein the auxiliary heat conducting portion is located at a side of the second heat conducting portion away from the first protrusion along the first direction; On a side of the second heat-conducting portion away from the first protrusion along the first direction, a plurality of heat-dissipating grooves are distributed on both sides of the auxiliary heat-conducting portion along the thickness direction of the heat-dissipating component; And / or, two first mounting holes are provided on a side of the second heat-conducting portion facing away from the second protrusion, and the two first mounting holes are spaced apart at two ends of the second heat-conducting portion along the second direction; the heat dissipation assembly includes two first mounting members, the first mounting members are provided corresponding to the first mounting holes, the first mounting members include a first end and a second end that are arranged oppositely, a flange is provided on the outer periphery of the first mounting member, the flange is located between the first end and the second end, the first end is plug-connected to the corresponding first mounting hole, and the second end is used to be plug-connected to the through hole of the circuit board; And / or, the second heat conducting portion and the second protrusion are arranged at an interval, and a fifth heat dissipation channel is formed between the second heat conducting portion and the second protrusion, and the fifth heat dissipation channel is connected to the third heat dissipation channel.

7. The heat dissipation assembly according to any one of claims 1 to 6, characterized in that: The heat dissipation assembly includes a plurality of second mounting members, and the plurality of fans are arranged corresponding to the plurality of second mounting members; the second mounting member includes an inserting portion and an abutting portion, a plurality of second mounting holes are arranged on a side of the first protrusion away from the first heat conducting portion, and the plurality of second mounting members are arranged corresponding to the plurality of second mounting holes; the inserting portion penetrates the corresponding fan and is inserted into the corresponding second mounting hole, and the abutting portion abuts against a side of the corresponding fan away from the first protrusion; And / or, one of the air inlet and the air outlet of the fan faces the first heat dissipation channel and is connected to the first heat dissipation channel.

8. The heat dissipation assembly according to any one of claims 2 to 6, characterized in that: The heat conducting member further comprises a third heat conducting portion, the third heat conducting portion is disposed on the second surface, and the third heat conducting portion extends from the second heat conducting sub-portion to the first heat conducting sub-portion in a direction away from the first heat conducting sub-portion; A buffer is provided on one side of the third heat conducting portion along the thickness direction of the heat dissipation component facing the first protrusion.

9. An electronic device, characterized in that: It comprises a circuit board and the heat dissipation assembly described in any one of claims 1 to 8, wherein the circuit board is arranged on one side of the heat dissipation assembly in the thickness direction, and the thickness direction of the heat dissipation assembly is consistent with the thickness direction of the circuit board.

10. The electronic device according to claim 9, characterized in that: The electronic device comprises two third mounting members, a first heating element is arranged on one side of the circuit board facing the heat dissipation assembly, and the first heating element is located between the second heat conducting part of the heat dissipation assembly and the circuit board; two through holes are arranged on the circuit board, and the two through holes are located on both sides of the first heating element along the second direction; the second end of the first mounting member of the heat dissipation assembly is inserted into the corresponding through hole, one end of the third mounting member is inserted into the corresponding second end, and the other end of the third mounting member abuts against the side of the circuit board away from the heat dissipation assembly; the dimension of the flange of the first mounting member along the thickness direction of the heat dissipation assembly is greater than the dimension of the first heating element along the thickness direction of the heat dissipation assembly; And / or, a first heating element is arranged on a side of the circuit board facing the heat dissipation component, and the first heating element is located between the second heat conduction part of the heat dissipation component and the circuit board; a first heat conductive adhesive is arranged between the first heating element and the second heat conduction part; And / or, a second heating element is provided on a side of the circuit board facing the heat dissipation component, the second heating element is located between the auxiliary heat-conducting portion of the heat dissipation component and the circuit board, and a second heat-conducting adhesive is provided between the auxiliary heat-conducting portion and the second heating element; And / or, a third heating element is further provided on a side of the circuit board facing the heat dissipation component, and the third heating element is arranged at intervals on one side of the heat dissipation component along the first direction and close to a third heat dissipation channel of the heat dissipation component; And / or, an interface component is provided on a side of the circuit board facing the heat dissipation component, the interface component is provided between the third heat conduction portion of the heat dissipation component and the circuit board, and the buffer of the heat dissipation component is located between the interface component and the third heat conduction portion; And / or, a first heating element is disposed on a side of the circuit board facing the heat dissipation component, and the first heating element includes a power transistor; And / or, a second heating element is disposed on a side of the circuit board facing the heat dissipation component, and the second heating element includes an inductor; And / or, a third heating element is disposed on a side of the circuit board facing the heat dissipation assembly, and the third heating element includes a central processing unit.

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