High-strength thin-film capacitor support with compression resistance function

Abstract

The invention discloses a high-strength thin-film capacitor support with a compression resistance function, and belongs to the technical field of capacitors. A high-strength thin-film capacitor support with a compression resistance function comprises a first support, and further comprises a second support clamped on the first support; a coating sleeve is arranged between the first support and the second support, and the capacitor is fixedly installed on the coating sleeve. The second bracket and the first bracket are closed end to end; the end-to-end closed annular design and the arc-shaped wall structure are adopted, the overall structural strength is remarkably enhanced, the support can bear large external pressure and does not deform, good deformation adaptability is provided for the support through the design of the first notch and the second notch and the third notch adjacent to the first notch in the arc-shaped wall, and when a capacitor is heated to expand, the support is not prone to deformation. The notches allow the support to be stretched and extended moderately, so that the problem that the support is damaged or the capacitor falls off due to overlarge deformation is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitors, and in particular to a high-strength film capacitor bracket with a compression resistance function. Background Art

[0002] The automotive capacitor bracket is an important supporting structure for automotive capacitors, which is crucial to ensure the stable operation of capacitors and the normal operation of automotive electrical systems.

[0003] At present, after the automobile capacitor is fixed on the bracket, the automobile capacitor itself will generate heat during operation, which will cause the capacitor itself to expand. The expansion of the capacitor will cause the capacitor bracket to deform. Then, after the capacitor cools down, the capacitor bracket is not easy to recover, which makes the capacitor easy to loosen. Therefore, a high-strength film capacitor bracket with compressive resistance is proposed. Summary of the invention

[0004] The present invention aims to solve the problem in the prior art that a capacitor bracket is difficult to recover after being deformed, and proposes a high-strength film capacitor bracket with a compression resistance function.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A high-strength film capacitor bracket with pressure resistance function includes a first bracket and also includes: a second bracket, which is clamped on the first bracket; a covering sleeve is arranged between the first bracket and the second bracket, and the capacitor is fixedly installed on the covering sleeve; the second bracket and the first bracket are both closed end to end, and the first bracket and the second bracket are both provided with an arc wall, and a first notch is opened on the arc wall. When the capacitor expands due to heat, the first bracket and the second bracket are stretched and extended through the first notch and the arc wall after being subjected to force.

[0007] As a preferred embodiment of the present invention: a card slot is provided on the first bracket, and a card plate is fixedly installed on the second bracket. When the first bracket and the second bracket are fixed to the covering sleeve, the card plate is clamped in the card slot.

[0008] As a preferred embodiment of the present invention: the first bracket and the second bracket are both provided with a second slot opening toward the outside and a third slot opening toward the inside, the second slot is adjacent to the third slot, and the slot edges adjacent to the second slot and the third slot are parallel, and the distance between the slot edge of the second slot and the slot edge of the third slot is 2mm-5mm.

[0009] As a preferred embodiment of the present invention: an installation groove is provided on the inner side of the covering sleeve, a fixing groove is opened on the installation groove, the varactor is plugged into the fixing groove, a fixing ring is fixedly installed in the installation groove, the fixing ring covers the outer wall of the varactor, after the capacitor is inserted into the fixing ring, the covering sleeve is filled with thermal conductive resin, and a connecting pipe is fixedly installed on the thermal conductive resin.

[0010] As a preferred embodiment of the present invention: a sealed cavity is provided on the covering sleeve, a heat-conducting medium is stored in the sealed cavity, the covering sleeve is provided with mounting holes penetrating at upper and lower ends, the capacitor is plugged into the mounting holes, and a connecting pipe is fixedly installed on the covering sleeve.

[0011] As a preferred embodiment of the present invention: a copper bar is fixedly installed on the bottom of the covering sleeve, a first sealing plate is fixedly installed on the bottom of the copper bar, and the first sealing plate is fixedly engaged with the first bracket; a second sealing plate is fixedly installed on the top of the covering sleeve, the second sealing plate is plugged and fixed to the copper bar, and the second sealing plate is fixedly engaged with the second bracket.

[0012] As a preferred embodiment of the present invention: a mounting box is fixedly mounted on the second sealing plate, a second heat conducting plate is fixedly mounted on the mounting box, and a heat sink is fixedly mounted on the second heat conducting plate; a liquid capsule is arranged in the mounting box, the liquid capsule is fixedly connected to the connecting pipe, the liquid capsule is filled with a heat conducting medium, and a first heat conducting plate is fixedly mounted on the liquid capsule, and when the heat conducting medium in the liquid capsule absorbs heat and expands, the expanded heat conducting medium drives the first heat conducting plate to come into contact with the second heat conducting plate.

[0013] As a preferred embodiment of the present invention: the heat sink is provided with multiple groups, the multiple groups of heat sinks are arranged side by side on the second heat conducting plate, and an air flow channel is provided between two adjacent heat sinks, and a deflector is fixedly installed on one end of the heat sink away from the second heat conducting plate.

[0014] As a preferred embodiment of the present invention: a connecting rod is fixedly mounted on the second heat conducting plate, a semiconductor refrigeration plate is fixedly mounted on the connecting rod, and a low-temperature end of the semiconductor refrigeration plate is abuttingly connected to the heat sink.

[0015] As a preferred embodiment of the present invention: the heat sink is provided with multiple groups, the multiple groups of heat sinks are arranged side by side on the second heat conducting plate, and an air flow channel is provided between two adjacent heat sinks, an air guide cover is fixedly installed on the end of the heat sink away from the second heat conducting plate, a connecting rod is fixedly installed on the second heat conducting plate, a semiconductor refrigeration fin is fixedly installed on the connecting rod, and the low-temperature end of the semiconductor refrigeration fin is in contact with the heat sink.

[0016] Compared with the prior art, the present invention provides a high-strength film capacitor bracket with compression resistance, which has the following beneficial effects:

[0017] 1. The high-strength film capacitor bracket with compression resistance adopts a closed ring design and an arc-shaped wall structure, which significantly enhances the overall structural strength, enabling it to withstand greater external pressure without deformation. The first notch on the arc-shaped wall and the adjacent second and third notches provide the bracket with good deformation adaptability. When the capacitor expands due to heat, these notches allow the bracket to be stretched and extended appropriately, thereby avoiding problems such as bracket damage or capacitor shedding due to excessive deformation;

[0018] 2. This high-strength film capacitor bracket with compression resistance provides precise positioning for the capacitor through the mounting groove and fixing groove in the covering sleeve, while the tight covering of the fixing ring enhances the installation stability of the capacitor;

[0019] 3. The high-strength film capacitor bracket with pressure resistance function forms an efficient heat conduction system through the heat-conducting resin or the heat-conducting medium in the sealed cavity, the heat-conducting medium in the liquid capsule and the heat sink, which can quickly transfer the heat generated by the capacitor to ensure the normal working temperature of the capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the three-dimensional structure of a high-strength film capacitor bracket with compression resistance proposed by the present invention;

[0021] Figure 2 This is a schematic diagram of the explosion structure of a high-strength film capacitor bracket with compression resistance proposed by the present invention;

[0022] Figure 3 A schematic diagram of the structure of a high-strength film capacitor bracket covering sleeve with compressive resistance proposed by the present invention Figure 1 ;

[0023] Figure 4 The structure of the first bracket and the second bracket of a high-strength film capacitor bracket with compression resistance proposed by the present invention is schematically shown. Figure 1 ;

[0024] Figure 5 The structure of the first bracket and the second bracket of a high-strength film capacitor bracket with compression resistance proposed by the present invention is schematically shown. Figure 2 ;

[0025] Figure 6 A schematic diagram of the structure of a high-strength film capacitor bracket covering sleeve with compressive resistance proposed by the present invention Figure 2 ;

[0026] Figure 7 This is a schematic structural diagram of a high-strength film capacitor bracket with compression resistance proposed by the present invention, in which the first bracket and the second bracket are separated;

[0027] Figure 8 This is a schematic structural diagram of a high-strength film capacitor bracket heat sink with compression resistance proposed by the present invention.

[0028] In the figure: 1. first bracket; 2. second bracket; 3. slot; 4. clamping plate; 5. arc-shaped wall; 6. first notch; 7. second notch; 8. third notch; 9. mounting slot; 10. semiconductor refrigeration plate; 11. air guide cover; 12. covering sleeve; 13. fixing slot; 14. fixing ring; 15. sealing cavity; 16. first sealing plate; 17. copper busbar; 18. second sealing plate; 19. connecting pipe; 20. liquid capsule; 21. first heat conducting plate; 22. mounting box; 23. second heat conducting plate; 24. heat sink; 25. mounting hole. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0030] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] Example: Refer to Figure 1-Figure 8 A high-strength film capacitor bracket with pressure resistance function includes a first bracket 1 and a second bracket 2, which is clamped on the first bracket 1; a covering sleeve 12 is provided between the first bracket 1 and the second bracket 2, and the capacitor is fixedly installed on the covering sleeve 12; the second bracket 2 and the first bracket 1 are both closed end to end, and the first bracket 1 and the second bracket 2 are both provided with an arc wall 5, and a first notch 6 is opened on the arc wall 5. When the capacitor expands due to heat, the first bracket 1 and the second bracket 2 are stretched and extended through the first notch 6 and the arc wall 5 after being subjected to force.

[0032] Among them, the covering sleeve 12 provides precise positioning and stable support for the capacitor, which is convenient for precise installation of the capacitor, and the first bracket 1 and the second bracket 2 both adopt a ring design with closed ends. This design not only enhances the overall strength of the bracket, but also improves its compressive resistance. At the same time, an arc wall 5 is arranged on the bracket. These arc walls 5 not only increase the rigidity of the bracket, but also provide it with good deformation adaptability. In addition, a first notch 6 is opened on the arc wall 5. The first notch 6 enables the first bracket 1 and the second bracket 2 to undergo moderate stretching and extension when the capacitor expands due to heat. Therefore, when the capacitor expands due to increased temperature, the first bracket 1 and the second bracket 2 will be subjected to corresponding pressure. At this time, the cooperation of the first notch 6 and the arc wall 5 enables the bracket to flexibly cope with this deformation, thereby avoiding problems such as bracket damage or capacitor falling off due to capacitor expansion.

[0033] Reference Figure 4 and Figure 5 A card slot 3 is provided on the first bracket 1 , and a card plate 4 is fixedly installed on the second bracket 2 . When the first bracket 1 and the second bracket 2 are fixed to the covering sleeve 12 , the card plate 4 is clamped in the card slot 3 .

[0034] When in use, the card plate 4 is stuck in the card slot 3, and the inner side of the card plate 4 abuts against the covering sleeve 12, so as to quickly fix the first bracket 1 and the second bracket 2, and improve the stability between the first bracket 1 and the second bracket 2 and the covering sleeve 12 after fixation.

[0035] Reference Figure 6 The first bracket 1 and the second bracket 2 are both provided with a second slot 7 opening toward the outside and a third slot 8 opening toward the inside, the second slot 7 is adjacent to the third slot 8, and the adjacent slot edges of the second slot 7 and the third slot 8 are parallel, and the distance between the slot edge of the second slot 7 and the slot edge of the third slot 8 is 2mm-5mm.

[0036] In this embodiment, a second slot 7 with its opening facing outward and a third slot 8 facing inward are provided, and the two slots are adjacent and parallel, thereby providing additional deformation space and adjustment capability for the bracket and making the adjacent slot edges of the second slot 7 and the third slot 8 remain parallel, and the distance therebetween is precisely controlled between 2mm and 5mm, which not only ensures that the bracket can be deformed evenly and stably when subjected to external force or temperature changes, but also avoids problems such as bracket damage or capacitor falling off due to excessive deformation.

[0037] Reference Figure 1-Figure 3A mounting groove 9 is provided on the inner side of the covering sleeve 12, a fixing groove 13 is provided on the mounting groove 9, the varactor is plugged into the fixing groove 13, a fixing ring 14 is fixedly installed in the mounting groove 9, the fixing ring 14 covers the outer wall of the varactor, after the capacitor is inserted into the fixing ring 14, the covering sleeve 12 is filled with thermal conductive resin, and a connecting pipe 19 is fixedly installed on the thermal conductive resin.

[0038] In this embodiment, the covering sleeve 12 serves as an important protective component of the capacitor. The mounting groove 9 designed on the inner side thereof not only facilitates the installation of the capacitor, but also ensures the stability and accuracy of the capacitor on the bracket. The capacitor is plugged into the fixing groove 13 to prevent the capacitor from shaking or misalignment during the installation process.

[0039] The provision of the fixing ring 14 further enhances the fixing effect of the capacitor. The fixing ring 14 is tightly wrapped around the outer wall of the capacitor, providing additional support and protection for the capacitor and improving the installation stability of the capacitor.

[0040] After the capacitor is inserted into the fixing ring 14, we use thermally conductive resin to fill the space inside the covering sleeve 12. The thermally conductive resin has good thermal conductivity and can effectively transfer the heat generated by the capacitor during operation, thereby ensuring the normal working temperature of the capacitor. In addition, the filling of the thermally conductive resin also enhances the overall structural strength of the covering sleeve 12 and improves its compression and shock resistance.

[0041] In addition, in order to further improve the deformation resistance and improve the short-time rapid temperature balancing effect of the capacitor, the covering sleeve 12 adopts another design. In this design, a sealed cavity 15 is opened on the covering sleeve 12, and a heat-conducting medium is stored in the sealed cavity 15. The covering sleeve 12 is provided with mounting holes 25 penetrating the upper and lower ends. The capacitor is plugged into the mounting holes 25, and a connecting pipe 19 is fixedly installed on the covering sleeve 12. The heat-conducting medium can be insulating oil. Insulating oil, as a liquid insulating material, has excellent electrical properties and heat dissipation properties. It is set in the sealed cavity 15 of the covering sleeve 12, which can effectively isolate the capacitor from the electric field and impurities in the external environment, thereby reducing the risk of the capacitor being broken down.

[0042] In addition, the covering sleeve 12 is made of thermally conductive silicone mixed with boron nitride powder and silicone. This material has good insulation and thermal conductivity. It can not only prevent the capacitor from directly contacting the electric field in the external environment, but also conduct the heat generated by the capacitor in time, reduce the operating temperature of the capacitor, and thus reduce the risk of breakdown caused by high temperature.

[0043] Furthermore, the combination of thermal conductive silicone and insulating oil can absorb the micro-vibration generated when the capacitor is working, which not only improves the stability and reliability of the capacitor, but also extends its service life.

[0044] In addition, the insulating oil itself has a certain specific heat capacity. Therefore, when the capacitor generates a large amount of heat energy in a short period of time, the insulating oil can absorb a certain amount of heat by itself, thereby quickly cooling the capacitor and further improving the protection effect of the capacitor.

[0045] Therefore, through the synergistic effect of thermal conductive silicone and insulating oil, the heat and micro-vibration generated by the capacitor during operation are effectively managed and controlled, thereby ensuring the stable operation of the capacitor in various complex environments.

[0046] Reference Figure 1 A copper busbar 17 is fixedly installed at the bottom of the covering sleeve 12, and a first sealing plate 16 is fixedly installed at the bottom of the copper busbar 17, and the first sealing plate 16 is fixedly engaged with the first bracket 1; a second sealing plate 18 is fixedly installed at the top of the covering sleeve 12, and the second sealing plate 18 is plugged and fixed with the copper busbar 17, and the second sealing plate 18 is fixedly engaged with the second bracket 2.

[0047] The first sealing plate 16, the second sealing plate 18, the first bracket 1, the second bracket 2 and the covering sleeve 12 cooperate to form a closed space, and the capacitor is installed in the closed space to prevent the capacitor from being affected by the external environment.

[0048] Reference Figure 2 and Figure 8 A mounting box 22 is fixedly mounted on the second sealing plate 18, a second heat conducting plate 23 is fixedly mounted on the mounting box 22, and a heat sink 24 is fixedly mounted on the second heat conducting plate 23; a liquid capsule 20 is arranged in the mounting box 22, the liquid capsule 20 is fixedly connected to the connecting pipe 19, the liquid capsule 20 is filled with a heat conducting medium, and a first heat conducting plate 21 is fixedly mounted on the liquid capsule 20. When the heat conducting medium in the liquid capsule 20 absorbs heat and expands, the expanded heat conducting medium drives the first heat conducting plate 21 to collide with the second heat conducting plate 23.

[0049] In this embodiment, the thermally conductive resin of the capacitor contacts the thermally conductive medium in the liquid capsule 20 through the connecting tube 19 (the medium in the liquid capsule 20 may be insulating oil, fluorocarbon compounds, etc.). When the thermally conductive medium absorbs the heat dissipated by the capacitor, the liquid capsule 20 expands, thereby driving the first thermally conductive plate 21 to move and contact the second thermally conductive plate 23, thereby conducting the heat to the heat sink 24 and dissipating the heat through the heat sink 24.

[0050] When the temperature of the capacitor drops to a threshold value, the heat-conducting medium contracts, and under the action of gravity, the first heat-conducting plate 21 drops and separates from the second heat-conducting plate 23. After separation, the heat dissipation of the capacitor is reduced and the external low temperature is prevented from being conducted to the capacitor, thereby preventing the capacitor from excessive heat release and improving the stability of the capacitor.

[0051] Reference Figure 2 and Figure 8In this embodiment, a plurality of heat sinks 24 are provided, and the plurality of heat sinks 24 are arranged side by side on the second heat conducting plate 23 , and an air flow channel is provided between two adjacent heat sinks 24 , and an air guide cover 11 is fixedly mounted on one end of the heat sink 24 away from the second heat conducting plate 23 .

[0052] When the vehicle moves, the airflow or the airflow on the vehicle fan passes through the airflow channel to take away the heat on the heat sink 24, thereby dissipating the heat of the heat sink 24 and the capacitor. In addition, the air deflector 11 can also gather the airflow from other parts, allowing the airflow to pass through the airflow channel, so that more airflow contacts the heat sink 24, and the airflow passes through the airflow channel at a faster speed, thereby further improving the cooling effect of the capacitor.

[0053] Reference Figure 2 and Figure 8 In this embodiment, a connecting rod is fixedly installed on the second heat conducting plate 23, and a semiconductor refrigeration sheet 10 is fixedly installed on the connecting rod. The low temperature end of the semiconductor refrigeration sheet 10 is in contact with the heat sink 24. When the temperature of the capacitor is too high and the heat dissipation of the heat sink 24 itself is insufficient to provide sufficient heat dissipation function for the capacitor, the semiconductor refrigeration sheet 10 is started and the semiconductor refrigeration sheet 10 is used to actively absorb the heat dissipated by the capacitor, thereby further realizing rapid cooling of the capacitor.

[0054] Reference Figure 1-Figure 2 and Figure 8 There are multiple groups of heat sinks 24, which are arranged side by side on the second heat conducting plate 23, and an air flow channel is provided between two adjacent heat sinks 24. A guide cover 11 is fixedly installed on one end of the heat sink 24 away from the second heat conducting plate 23, a connecting rod is fixedly installed on the second heat conducting plate 23, a semiconductor refrigeration sheet 10 is fixedly installed on the connecting rod, and the low-temperature end of the semiconductor refrigeration sheet 10 is in contact with the heat sink 24.

[0055] In this embodiment, when the capacitance remains high, the semiconductor refrigeration sheet 10 can be started to quickly absorb the heat dissipated by the capacitor. At the same time, the airflow can be gathered by the air guide cover 11 so that the airflow can be quickly discharged from the air flow channel between the heat sinks 24, quickly absorbing the heat of the heat sink 24 and preventing the capacitor from overheating and damage.

[0056] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high-strength film capacitor bracket with compressive resistance, comprising a first bracket (1), characterized in that: Also includes: A second bracket (2) is clamped onto the first bracket (1); A covering sleeve (12) is provided between the first bracket (1) and the second bracket (2), and the capacitor is fixedly mounted on the covering sleeve (12); The second bracket (2) and the first bracket (1) are both in a closed shape, and the first bracket (1) and the second bracket (2) are both provided with an arc-shaped wall (5), and the arc-shaped wall (5) is provided with a first notch (6). When the capacitor expands due to heat, the first bracket (1) and the second bracket (2) are stretched and extended through the first notch (6) and the arc-shaped wall (5) after being subjected to force.

2. The high-strength film capacitor bracket with compression resistance according to claim 1, characterized in that: The first bracket (1) is provided with a card slot (3), and the second bracket (2) is fixedly mounted with a card plate (4); when the first bracket (1) and the second bracket (2) are fixed to the covering sleeve (12), the card plate (4) is carded into the card slot (3).

3. The high-strength film capacitor bracket with compression resistance according to claim 1, characterized in that: The first bracket (1) and the second bracket (2) are both provided with a second notch (7) opening outward and a third notch (8) opening inward, the second notch (7) and the third notch (8) are adjacent to each other, the adjacent groove edges of the second notch (7) and the third notch (8) are parallel, and the distance between the groove edge of the second notch (7) and the groove edge of the third notch (8) is 2 mm-5 mm.

4. The high-strength film capacitor bracket with compression resistance according to claim 1, characterized in that: The inner side of the covering sleeve (12) is provided with a mounting groove (9), the mounting groove (9) is provided with a fixing groove (13), the varactor is plugged into the fixing groove (13), a fixing ring (14) is fixedly installed in the mounting groove (9), the fixing ring (14) covers the outer wall of the varactor, after the capacitor is inserted into the fixing ring (14), the covering sleeve (12) is filled with a heat-conducting resin, and a connecting pipe (19) is fixedly installed on the heat-conducting resin.

5. The high-strength film capacitor bracket with compression resistance according to claim 1, characterized in that: The covering sleeve (12) is provided with a sealed cavity (15), in which a heat-conducting medium is stored; the covering sleeve (12) is provided with mounting holes (25) penetrating at upper and lower ends; the capacitor is plugged into the mounting holes (25); and a connecting pipe (19) is fixedly mounted on the covering sleeve (12).

6. A high-strength film capacitor bracket with compression resistance according to claim 4 or 5, characterized in that: A copper bar (17) is fixedly mounted on the bottom of the covering sleeve (12), a first sealing plate (16) is fixedly mounted on the bottom of the copper bar (17), and the first sealing plate (16) is fixedly engaged with the first bracket (1); A second sealing plate (18) is fixedly mounted on the top of the covering sleeve (12); the second sealing plate (18) is plugged and fixed to the copper busbar (17), and the second sealing plate (18) is clamped and fixed to the second bracket (2).

7. The high-strength film capacitor bracket with compression resistance according to claim 6, characterized in that: A mounting box (22) is fixedly mounted on the second sealing plate (18), a second heat conducting plate (23) is fixedly mounted on the mounting box (22), and a heat sink (24) is fixedly mounted on the second heat conducting plate (23); A liquid capsule (20) is arranged in the installation box (22), the liquid capsule (20) is fixedly connected to the connecting pipe (19), the liquid capsule (20) is filled with a heat-conducting medium, and a first heat-conducting plate (21) is fixedly mounted on the liquid capsule (20); when the heat-conducting medium in the liquid capsule (20) absorbs heat and expands, the expanded heat-conducting medium drives the first heat-conducting plate (21) to collide with the second heat-conducting plate (23).

8. The high-strength film capacitor bracket with compression resistance according to claim 7, characterized in that: The heat sink (24) is provided in multiple groups, the multiple groups of heat sinks (24) are arranged side by side on the second heat conducting plate (23), an air flow channel is provided between two adjacent heat sinks (24), and an air guide cover (11) is fixedly mounted on one end of the heat sink (24) away from the second heat conducting plate (23).

9. The high-strength film capacitor bracket with compression resistance according to claim 7, characterized in that: A connecting rod is fixedly mounted on the second heat conducting plate (23), a semiconductor refrigeration plate (10) is fixedly mounted on the connecting rod, and a low-temperature end of the semiconductor refrigeration plate (10) is abuttingly connected to a heat sink (24).

10. The high-strength film capacitor bracket with compression resistance according to claim 7, characterized in that: The heat sink (24) is provided in multiple groups, and the multiple groups of heat sinks (24) are arranged side by side on the second heat conducting plate (23), and an air flow channel is provided between two adjacent heat sinks (24), and a flow guide cover (11) is fixedly mounted on one end of the heat sink (24) away from the second heat conducting plate (23), and a connecting rod is fixedly mounted on the second heat conducting plate (23), and a semiconductor refrigeration sheet (10) is fixedly mounted on the connecting rod, and the low-temperature end of the semiconductor refrigeration sheet (10) is abuttingly connected to the heat sink (24).

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