Substrate processing system and process gas supply control verification method

Abstract

The present invention relates to a substrate processing system and a process gas supply control verification method, and more particularly, to a technique for verifying the operation of a mass flow controller (MFC) for adjusting and supplying a process gas for performing a semiconductor process to an appropriate flow rate according to a Reicpe. The process gas supply control verification method includes: a verification gas supply step of adjusting a supply flow of a verification gas with a mass flow controller, supplying a process gas, and supplying the process gas to a calibration tank through a bypass gas supply line; a verification interval selection step of selecting a verification time interval while changing the state of the calibration tank by supplying a process gas; a change state measuring step: measuring the change state of the calibration tank in the verification time interval; and a supply flow rate calculation step for calculating the supply flow rate of the process gas on the basis of the change state measurement value of the calibration tank.

Description

Technical Field

[0001] The present invention is a substrate processing system and a process gas supply control verification method. More specifically, it discloses a technology for verifying the operation of a mass flow controller (MFC) that adjusts and supplies a process gas used to perform a semiconductor process to an appropriate flow rate according to a recipe. Background Art

[0002] In the semiconductor manufacturing process, various process gases are supplied by a substrate processing device to perform the process. In the semiconductor manufacturing process, a mass flow controller (MFC) is configured to accurately control the process gas in the etching process, chemical vapor deposition process, diffusion process, metal process, cleaning process, etc.

[0003] A mass flow controller (MFC) can precisely control the flow of a supply flow by sensing changes in gas pressure based on the supply pressure of the process gas and ambient conditions.

[0004] When the process gas is supplied by relying on such a mass flow controller, if the mass flow controller does not operate accurately, there is a problem that the supply flow rate of the process gas matching the process conditions cannot be accurately controlled, resulting in the generation of defective products.

[0005] Therefore, the substrate processing apparatus grasps the supply flow rate of the process gas through the mass flow controller to verify whether the process gas is supplied at a set appropriate supply flow rate corresponding to the corresponding process.

[0006] When validating mass flow controllers, there is the problem that it takes a considerable amount of time to validate low flows below 10 sccm.

[0007] In particular, when metal gas is used, there is a problem that it is difficult to verify the supply flow rate due to the temperature sensitivity and residual metal gas. Summary of the invention

[0008] The present invention is made to solve the above-mentioned problems of the conventional technology, and discloses a method for verifying supply control of a process gas supplied to a substrate processing apparatus.

[0009] In particular, it is used to solve the problem that when verifying a mass flow controller, it takes a considerable amount of time to verify a low flow rate below 10sccm, and it is used to solve the problem that when metal gas is used, it is difficult to verify the supply flow rate due to temperature sensitivity and residual metal gas.

[0010] The purpose of the present invention is not limited to the above description, and other purposes and advantages of the present invention that are not mentioned can be understood through the following description.

[0011] An embodiment of a process gas supply control verification method according to the present invention for solving the above-mentioned problem may include: a verification gas supply step, in which a mass flow controller is used to adjust the supply flow rate of the verification gas and to supply the process gas, and at the same time, the process gas is supplied to the calibration tank through a bypass gas supply line; a verification interval selection step, in which the state of the calibration tank is changed by supplying process gas, and a verification time interval is selected; a change state measurement step, in which the change state of the calibration tank is measured in the verification time interval; and a supply flow calculation step, in which the supply flow rate of the process gas is calculated based on the change state measurement value of the calibration tank.

[0012] Preferably, the verification interval selection step may be to select a verification time interval of a set verification pressure range in a linear pressure variation interval of the calibration tank according to the supply of process gas.

[0013] As an example, the change state measuring step may measure the pressure and temperature of the calibration tank during the verification time period.

[0014] As an example, the supply flow calculation step may be based on the pressure change and temperature change of the calibration tank at the start point and the end point of the verification time interval, taking into account the volume of the calibration tank and the volume of the bypass gas supply line to calculate the supply flow of the process gas through the mass flow controller.

[0015] As an example, the supply flow rate calculation step is calculated by the following [Formula 1]:

[0016] [Formula 1]

[0017]

[0018] Wherein, flow represents the supply flow rate of process gas, α represents the correction factor, C represents the temperature of the calibration tank, and V t represents the volume of the calibration tank, the V p represents the volume of the bypass gas supply line, the P 1 represents the pressure of the calibration tank at the start time of the verification time interval, the P 2 represents the pressure of the calibration tank at the end time of the verification time interval, and the T 1 represents the start time of the verification time interval, the T 2 represents the end time of the verification time interval, and Leak represents the leakage amount of the process gas of the calibration tank.

[0019] Furthermore, the volume of the bypass gas supply line may be calculated based on the pressure and temperature of the process gas supplied through the bypass gas supply line.

[0020] As an example, the process gas may be a metal gas.

[0021] Furthermore, the verification gas supplying step may be to adjust the temperature of the calibration tank by a temperature adjusting member and maintain the temperature at a set temperature while supplying the process gas to the calibration tank.

[0022] As an example, the verification gas supplying step may be such that the process gas supplied to the process gas supply line connected to the selected process chamber among the plurality of process chambers is detoured through the bypass gas supply line and supplied to the calibration tank.

[0023] As an example, the verification gas supply step may be such that the process gas supplied through a selected mass flow controller among a plurality of mass flow controllers connected to a plurality of process gas supply parts is detoured through the bypass gas supply line and supplied to the calibration tank.

[0024] Preferably, the process gas supply control verification method further includes: a cleaning step of supplying a purge gas to the bypass gas supply line to flush the bypass supply line and the calibration tank.

[0025] Furthermore, the process gas supply control verification method may further include: a mass flow controller verification step, repeatedly executing the verification gas supply step to the cleaning step to calculate the error rate of the supply flow, and verifying the mass flow controller.

[0026] More preferably, the process gas supply control verification method also includes: a mass flow controller operation judgment step, changing the verification supply flow to execute the verification gas supply step to the verification step, thereby verifying the mass flow controller according to the verification supply flow, and judging whether the mass flow controller is working normally.

[0027] In addition, one embodiment of the substrate processing system according to the present invention includes: a mass flow controller, which controls the supply flow rate of a process gas supplied to a process chamber; a process gas supply line, which supplies the process gas whose supply flow rate is controlled by the mass flow controller to the process chamber; a bypass gas supply line, which bypasses the process gas supplied to the process gas supply line through the mass flow controller; a calibration tank, which stores the process gas supplied through the bypass gas supply line; a measuring device, which measures the change state of the calibration tank; an exhaust component, which discharges the process gas from the calibration tank; a cleaning component, which cleans the bypass gas supply line and the calibration tank by supplying a purge gas to the bypass gas supply line; and a flow calculation unit, which selects a verification time interval based on the change state of the calibration tank, and calculates the supply flow rate of the process gas supplied through the mass flow controller based on the measured value of the change state of the calibration tank in the verification time interval.

[0028] Preferably, the substrate processing system further includes: a bypass control valve, which is arranged on the bypass gas supply line to control the supply of process gas to the calibration tank; and a control unit, which controls the bypass control valve to selectively adjust the supply of process gas to the calibration tank, controls the exhaust component to adjust the exhaust of process gas from the calibration tank, and controls the cleaning component to adjust the cleaning of the bypass gas supply line and the calibration tank.

[0029] Furthermore, the measuring device may include: a pressure gauge for measuring the pressure of the calibration tank; and a thermometer for measuring the process gas temperature of the calibration tank.

[0030] As an example, the substrate processing system may further include: a plurality of process gas source units; and a plurality of mass flow controllers for adjusting the supply flow rate of the process gas supplied to each of the plurality of process gas source units, and the bypass gas supply line allows the process gas supplied to the process gas supply line to be bypassed by a mass flow controller selected from the plurality of mass flow controllers.

[0031] As an example, the substrate processing system may further include: a temperature adjustment component for adjusting the temperature of the calibration tank, and the control unit may control the temperature adjustment component to adjust the temperature of the calibration tank to maintain it at a set temperature.

[0032] As an example, the flow rate calculation unit calculates the supply flow rate by the following [Formula 1]:

[0033] [Formula 1]

[0034]

[0035] Wherein, flow represents the supply flow rate of process gas, α represents the correction factor, C represents the temperature of the calibration tank, and V t represents the volume of the calibration tank, the V p represents the volume of the bypass gas supply line, the P 1 represents the pressure of the calibration tank at the start time of the verification time interval, the P 2 represents the pressure of the calibration tank at the end time of the verification time interval, and the T 1 represents the start time of the verification time interval, the T 2 represents the end time of the verification time interval, and Leak represents the leakage amount of the process gas of the calibration tank.

[0036] Preferably, an embodiment of the process gas supply control verification method according to the present invention comprises: a verification gas supply step, adjusting the mass flow controller to a verification supply flow rate and supplying metal gas, and supplying the metal gas to the calibration tank through a bypass gas supply line; a verification interval selection step, increasing the pressure of the calibration tank by supplying metal gas, and sensing the pressure change, thereby selecting a verification time interval of a set verification pressure range corresponding to the verification supply flow rate in a linearly changing pressure interval; a flow calculation step, substituting the pressure measurement value and the temperature measurement value in the verification time interval into the following [Formula 1] to calculate the supply flow rate of the metal gas,

[0037] [Formula 1]

[0038]

[0039] Wherein, flow represents the supply flow of process gas, α represents the correction factor, C represents the temperature of the calibration tank, and V t represents the volume of the calibration tank, the V p represents the volume of the bypass gas supply line, the P 1 represents the pressure of the calibration tank at the start time of the verification time interval, the P 2 represents the pressure of the calibration tank at the end time of the verification time interval, and the T 1 represents the start time of the verification time interval, the T 2Indicates the end time of the verification time interval, and the Leak indicates the leakage amount of the process gas of the calibration tank; a cleaning step, supplying purge gas to the bypass gas supply line to flush the bypass supply line and the calibration tank; a mass flow controller verification step, repeatedly executing the verification gas supply step to the cleaning step to calculate the error rate of the supply flow, and verifying the mass flow controller; and a mass flow controller operation judgment step, changing the verification supply flow to execute the verification gas supply step to the verification step, thereby verifying the mass flow controller according to the verification supply flow, and judging whether the mass flow controller is working normally.

[0040] According to the present invention, it is possible to verify the supply flow rate of a mass flow controller for a low-flow process gas, especially a metal gas.

[0041] In particular, mass flow controllers for low flow rates below 10 sccm can be accurately verified in a short time, thereby ensuring the reproducibility and reliability of process gas supply.

[0042] In addition, the problem of difficulty in verifying the supply flow rate due to temperature sensitivity and residual metal gas when metal gas is used can be solved.

[0043] Furthermore, it was difficult to accurately measure the supply flow rate of the mass flow controller through the previous chamber, and it took a considerable amount of time for accurate verification. However, in the present invention, corresponding to the type and flow rate of the corresponding process gas, an interval in which the flow rate can be calculated is selected in the interval where the pressure changes linearly, and the supply flow rate is calculated based on the measured value of the change state of the calibration tank in the corresponding interval, so that the flow rate can be accurately calculated in a short time.

[0044] The effects of the present invention are not limited to the effects mentioned above, and a person having ordinary knowledge in the technical field to which the present invention pertains can clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 An embodiment of a substrate processing system to which the present invention is applied is shown.

[0046] Figure 2 1 is a schematic structural diagram showing a substrate processing system including a supply flow rate verification device according to the present invention.

[0047] Figure 3 An embodiment of a supply flow rate verification device in a substrate processing system according to the present invention is shown.

[0048] Figure 4 FIG. 1 is a flow chart showing an embodiment of a process gas supply control verification method according to the present invention.

[0049] Figure 5 The flowchart shows an embodiment of verifying a mass flow controller by repeatedly calculating a supply flow rate in a process gas supply control verification method according to the present invention.

[0050] Figure 6 An example of calculating the supply flow rate by bypassing the supply of process gas to the calibration tank in the process gas supply control verification method according to the present invention is shown.

[0051] Figure 7 An example of the operation of selecting a verification time period in the process gas supply control verification method according to the present invention is shown.

[0052] Figure 8 An example of cleaning the calibration tank and the bypass gas supply line in the process gas supply control verification method according to the present invention is shown.

[0053] Fig. 9 The flowchart shows an embodiment of determining the operating state of a mass flow controller when changing the supply flow rate in the process gas supply control verification method according to the present invention.

[0054] Fig.10 An example of selecting a verification time period according to a supply flow rate in the process gas supply control verification method according to the present invention is shown.

[0055] (Explanation of Reference Numerals)

[0056] 10a, 10b, 10c: substrate processing system,

[0057] 20a, 20b, 20c, 110, 110a, 110b, 110c, 110d, 110e: process chambers,

[0058] 70a, 70b, 60c, 200: Supply flow verification device,

[0059] 130: Gas supply line,

[0060] 150: Process gas supply device,

[0061] 160: Mass flow controller,

[0062] 210: Calibration tank,

[0063] 220: measuring device,

[0064] 221: Pressure gauge,

[0065] 225: Thermometer,

[0066] 230: Bypass gas supply line,

[0067] 240: Exhaust components,

[0068] 250: Control Department,

[0069] 260: flow calculation unit,

[0070] 270: Cleaning components. DETAILED DESCRIPTION

[0071] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or restricted by the embodiments.

[0072] In order to illustrate the present invention and the advantages of the present invention in operation and the objectives achieved by the implementation of the present invention, a preferred embodiment of the present invention will be exemplified below and described with reference to the embodiment.

[0073] First, the terms used in this application are only used to illustrate specific embodiments and are not used to limit the present invention. Unless there is a clearly different definition in the context, a singular expression may include a plural expression. In addition, in this application, the terms "including" or "having" are used to specify the existence of features, numbers, steps, operations, constituent elements, parts or combinations recorded in the specification, and should be understood as not excluding the existence or additional possibility of one or more other features or numbers, steps, operations, constituent elements, parts or combinations in advance.

[0074] When describing the present invention, if it is determined that a detailed description of a related well-known structure or function may obscure the main points of the present invention, the detailed description will be omitted.

[0075] The present invention discloses a technology for verifying the operation of a mass flow controller (MFC) for adjusting and supplying a process gas for performing a semiconductor process to an appropriate flow rate according to a recipe.

[0076] Figure 1 An embodiment of a substrate processing system to which the present invention is applied is shown.

[0077] The substrate processing systems 10a, 10b, 10c may include process chambers 20a, 20b, 20c, supply flow verification devices 70a, 70b, 70c, substrate transfer devices 50a, 50b, 50c, indexing modules 30a, 30b, 30c, etc.

[0078] As various examples of substrate processing systems, the substrate transfer device 50a is used as a reference, and a plurality of process chambers 20a for performing substrate processing processes are arranged on both sides along the length direction. Figure 1(a) This form is named Hyperspace Type.

[0079] In addition, with the substrate transfer device 50b as a reference, a plurality of process chambers 20b for performing substrate processing processes are arranged along the circumferential direction. Figure 1 (b) This form is named Cluster Type.

[0080] In addition, with the substrate transfer device 50c as a reference, a plurality of process chambers 20c for performing substrate processing processes are arranged on the left and right sides and above the circumference. Figure 1 (c) This form is named PURITAS Type.

[0081] The substrate transfer devices 50 a , 50 b , and 50 c may include transfer robots 55 a , 55 b , and 55 c that selectively transfer substrates to the plurality of process chambers 20 a , 20 b , and 20 c .

[0082] The indexing modules 30a, 30b, 30c may include loading ports 31a, 31b, 31c and transfer racks 33a, 33b, 33c.

[0083] The loading ports 31a, 31b, and 31c can be used to place carriers containing substrates W. The number of the loading ports 31a, 31b, and 31c can be changed according to the substrate processing efficiency, production efficiency, etc. As an example, a FOUP (Front Opening Unified Pod) can be used as a carrier. A slit for horizontally storing a plurality of substrates W can be formed inside the carrier.

[0084] The process chambers 20a, 20b, and 20c may be various devices for performing the substrate processing process using process gases such as an etching process, an evaporation process, a diffusion process, a metal process, and a cleaning process.

[0085] The process gas supply device (not shown) may be included to supply process gas to each process chamber 20a, 20b, 20c. The process gas supply device may adjust the process gas to a set supply flow rate corresponding to the substrate processing process and supply the process gas to each process chamber 20a, 20b, 20c.

[0086] The supply flow rate verification devices 70a, 70b, 70c can verify whether the process gas supply device adjusts the corresponding process gas to supply the corresponding process gas at a supply flow rate required to match the corresponding process.

[0087] The supply flow verification devices 70a, 70b, 70c will be described in more detail later through embodiments.

[0088] Thus, the substrate processing systems 10a, 10b, 10c can be based on the substrate transfer devices 50a, 50b, 50c, and the plurality of process chambers 20a, 20b, 20c can be configured in various forms, such as Figure 1 In addition, in the present embodiment, the supply flow verification devices 70a, 70b, 70c are arranged corresponding to the arrangement of the plurality of process chambers 20a, 20b, 20c. Depending on the situation, the supply flow verification devices 70a, 70b, 70c may also be arranged in different places separated from the process chambers 20a, 20b, 20c.

[0089] Furthermore, in the present embodiment, the substrate processing system 10a, 10b, 10c composed of a plurality of process chambers 20a, 20b, 20c is shown and described as an example, but the present invention can also be applied to a substrate processing system that performs a substrate processing process in a single process chamber.

[0090] Figure 2 1 is a schematic structural diagram showing a substrate processing system including a supply flow rate verification device according to the present invention.

[0091] The substrate processing system 100 may include a process chamber 110 for performing a substrate processing process, a process gas supply device 150 for supplying a process gas adjusted to a flow rate to the process chamber 110, a supply flow verification device 200 for verifying the supply flow rate of the process gas supplied in the process gas supply device 150, and the like.

[0092] The process gas supply device 150 may include a gas source part 151 supplying a process gas, a mass flow controller (MFC) 160 adjusting a flow rate of the process gas supplied from the gas source part 151 , and the like.

[0093] The process gas supply device 150 can adjust the supply flow rate of the process gas and supply the process gas to the gas supply line 130. The gas supply line 130 is provided with a gas supply control valve 131 to selectively control the supply of the process gas passing through the gas supply line 130.

[0094] The process gas may be supplied to the process chamber 110 through the process gas supply line 130 . As an example, the process gas supply line 130 may supply the process gas to a gas box 120 disposed corresponding to the process chamber 110 , and the process gas is supplied to the process chamber 110 through the gas box 120 .

[0095] The supply flow rate verification device 200 may verify the supply flow rate of the process gas supplied from the process gas supply device 150 .

[0096] As an example, the supply flow verification device 200 can bypass the process gas supplied to the process gas supply line 130 by adjusting the supply flow through the mass flow controller (MFC) 160 to calculate the supply flow and verify the working state of the mass flow controller (MFC) 160 based on it.

[0097] Figure 3 An embodiment of a supply flow rate verification device in a substrate processing system according to the present invention is shown.

[0098] The process gas supply device 150 may include gas source parts 151 a , 151 b , 151 c , mass flow controllers (MFCs) 160 a , 160 b , 160 c , and the like.

[0099] The process gas supply device 150 may include a plurality of gas source parts 151a, 151b, 151c. The plurality of gas source parts 151a, 151b, 151c retain and supply process gas, and the plurality of gas source parts 151a, 151b, 151c may supply different process gases or the same process gas.

[0100] Mass flow controllers (MFCs) 160a, 160b, 160c may be configured corresponding to the gas source sections 151a, 151b, 151c, and the mass flow controllers (MFCs) 160a, 160b, 160c match the corresponding process conditions and adjust the supply flow of the process gas supplied from the gas source sections 151a, 151b, 151c.

[0101] The process gas with a supply flow rate regulated by mass flow controllers (MFCs) 160a, 160b, and 160c is supplied to the process gas supply line 130, and the process gas supply line 130 corresponds to each process chamber 110a, 110b, 110c, 110d, and 110e and is connected to a single process gas supply line 130a, 130b, 130c, 130d, and 130e branching from the process gas supply line 130.

[0102] Gas supply control valves 131a, 131b, 131c, 131d, 131e are disposed in the individual process gas supply lines 130a, 130b, 130c, 130d, 130e and process gas may be selectively supplied to each of the process gas supply lines 130a, 130b, 130c, 130d, 130e.

[0103] A single process gas supply line 130a, 130b, 130c, 130d, 130e can supply process gas to each of the gas boxes 120a, 120b, 120c, 120d, 120e provided in the process chambers 110a, 110b, 110c, 110d, 110e, and supply corresponding process gases to the process chambers 110a, 110b, 110c, 110d, 110e through the gas boxes 120a, 120b, 120c, 120d, 120e.

[0104] The supply flow rate verification device 200 may verify the supply flow rate of the process gas supplied through the mass flow controllers (MFCs) 160a, 160b, 160c.

[0105] The supply flow verification device 200 may include a calibration tank 210 , a measuring device 220 , a bypass gas supply line 230 , an exhaust member 240 , a cleaning member 270 , a control unit 250 , a flow calculation unit 260 , and the like.

[0106] The bypass gas supply line 230 may be connected to a middle end of the process gas supply line 130 to bypass the process gas supplied through the process gas supply line 130 and supply the process gas to the calibration tank 210 .

[0107] A bypass control valve 231 may be disposed on the bypass gas supply line 230 to control the supply of the process gas to the calibration tank 210 through the bypass gas supply line 230 .

[0108] The calibration tank 210 may have a gas storage space 211 of a set volume and store the supplied process gas in the gas storage space 211. The calibration tank 210 may change the internal state according to the supply of the process gas. For example, the calibration tank 210 may change the pressure and temperature according to the supply of the process gas.

[0109] The measuring device 220 can measure the change state of the calibration tank 210. As an example, the measuring device 220 can include a pressure gauge 221 to measure the change in the internal pressure of the calibration tank 210. As an example, the measuring device 220 can include a thermometer 225 to measure the change in the internal temperature of the calibration tank 210.

[0110] The calibration tank 210 may be provided with a temperature regulating component 215 to regulate the temperature of the calibration tank 210 .

[0111] As an example, the temperature regulating member 215 may include a coil surrounding the circumference of the calibration tank 210 and the temperature of the calibration tank 210 may be regulated by heating the coil.

[0112] The calibration tank 210 may be connected to an exhaust component 240 to exhaust the process gas outside the calibration tank 210. The exhaust component 240 may include an exhaust line 243 connected to the calibration tank 210, an exhaust valve 245 selectively controlling the gas flow of the exhaust line 243, and an exhaust pump 241.

[0113] The cleaning member 270 may perform flushing of the calibration tank 210 and the bypass gas supply line 230. Further, the cleaning member 270 may also perform flushing of the process gas supply line 130, the individual process gas supply lines 130a, 130b, 130c, 130d, 130e, the gas boxes 120a, 120b, 120c, 120d, 120e, and the like.

[0114] The cleaning member 270 may include a purge gas source part 271 , a purge gas control valve 275 , and the like.

[0115] The purge gas source 271 may retain and supply an inert gas or the like as a cleaning gas. The purge gas source 271 may supply the purge gas through the purge gas control valve 275 to perform flushing of the calibration tank 210 and the bypass gas supply line 230 .

[0116] The control unit 250 can control each mass flow controller (MFC) 160a, 160b, 160c to set the supply flow rate of the process gas, and control the gas supply control valves 131a, 131b, 131c, 131d, 131e to selectively supply the process gas supplied through the process gas supply line 130 to a single process gas supply line 130a, 130b, 130c, 130d, 130.

[0117] The control unit 250 may control the bypass control valve 231 to bypass the process gas supplied through the process gas supply line 130 to the bypass gas supply line 230 so as to supply the process gas to the calibration tank 210 .

[0118] The control unit 250 may control the temperature adjustment member 215 to adjust the temperature of the calibration tank 210 .

[0119] The control unit 250 may control the exhaust member 240 to exhaust the process gas stored in the calibration tank 210 to the outside.

[0120] In addition, the control portion 250 may control the cleaning member 270 to perform flushing of the calibration tank 210 and the bypass gas supply line 230 .

[0121] The flow calculation unit 260 may select a verification time interval based on the change state of the calibration tank 210 , and calculate the supply flow rate of the process gas supplied through the corresponding mass flow controllers 160a , 160b , and 160c based on the change state measurement value of the calibration tank 210 during the verification time interval.

[0122] As an example, the flow rate calculation unit 260 can calculate the supply flow rate by the following [Formula 1].

[0123] [Formula 1]

[0124]

[0125] Wherein, flow represents the supply flow rate of process gas, α represents the correction factor, C represents the temperature of the calibration tank, and V t represents the volume of the calibration tank, the V p represents the volume of the bypass gas supply line, the P 1 represents the pressure of the calibration tank at the start time of the verification time interval, the P 2 represents the pressure of the calibration tank at the end time of the verification time interval, and the T 1 represents the start time of the verification time interval, the T 2 represents the end time of the verification time interval, and Leak represents the leakage amount of the process gas of the calibration tank.

[0126] The correction factor α may be the inverse of the gas compressibility coefficient.

[0127] The flow rate calculation unit 260 may calculate the error rate of the supply flow rate based on the set supply flow rate and the calculated supply flow rate and verify the corresponding mass flow controllers 160a, 160b, 160c.

[0128] Furthermore, the flow rate calculation unit 260 may verify the corresponding mass flow controllers 160a, 160b, 160c according to the verification supply flow rate to determine whether the corresponding mass flow controllers 160a, 160b, 160c are normal.

[0129] In particular, in the present invention, the supply flow verification device 200 can verify the supply flow of the mass flow controller of the metal gas. When the metal gas is temperature sensitive and residual gas remains in the pipe or calibration tank, it will be difficult to verify the supply flow.

[0130] In the present invention, the supply flow rate of the low-flow metal gas may be verified by a substrate processing system using the supply flow rate verification device described above, and the reliability and reproducibility of the gas supply may be ensured by verifying the supply flow rate of the metal gas.

[0131] In the present invention, a method for verifying the supply control of process gas by a substrate processing system using the supply flow verification device described above is disclosed. The process gas supply control verification method according to the present invention is implemented by an example of a substrate processing system according to the present invention as described above, so the process gas supply control verification method according to the above description will be referred to. Figure 3 An embodiment of a substrate processing system of a supply flow verification device of the present invention is described together.

[0132] Figure 4 FIG. 1 is a flow chart showing an embodiment of a process gas supply control verification method according to the present invention.

[0133] The supply flow rates of the mass flow controllers 160 a , 160 b , and 160 c , which are the verification objects, are adjusted ( S110 ) to supply the process gas to the gas supply line 130 .

[0134] The supply flow verification device 200 may bypass the process gas supplied to the gas supply line 130 (S120) and supply the process gas to the bypass gas supply line 230. The bypass gas supply line 230 may supply the process gas to the calibration tank 210 (S130).

[0135] As the process gas is supplied to the calibration tank 210 , the state of the calibration tank 210 changes. The change in the state of the calibration tank 210 can be measured by the measuring device 220 , and the flow rate calculation unit 260 selects a verification time interval ( S140 ).

[0136] The flow rate calculation unit 260 may extract the change state measurement value of the calibration tank 210 measured by the measuring device 220 during the verification time period ( S150 ) and calculate the supply flow rate of the process gas based on the change state measurement value of the calibration tank 210 ( S160 ).

[0137] The flow rate calculation unit 260 can determine whether to adjust and supply a supply flow rate that matches the supply flow rate required by the mass flow controllers 160a, 160b, and 160c that are the verification targets, based on the calculated supply flow rate.

[0138] Figure 5 The flowchart shows an embodiment of verifying a mass flow controller by repeatedly calculating a supply flow rate in a process gas supply control verification method according to the present invention.

[0139] Figure 6 An example showing calculation of the supply flow rate by bypassing the supply of process gas to the calibration tank in the process gas supply control verification method according to the present invention will be observed with reference to it.

[0140] The control unit 250 may select the verification target mass flow controller 160a from among the plurality of mass flow controllers 160a, 160b, and 160c and adjust the supply flow rate of the selected mass flow controller 160a to match the verification supply flow rate (S211).

[0141] Since the process gas is supplied to the calibration tank 210, the control unit 250 can control the temperature adjustment member 215 to adjust the temperature of the calibration tank 210 (S213) and maintain it within a set temperature range. The set temperature range can be set according to the type of process gas, the temperature conditions required in the corresponding substrate processing process, etc.

[0142] For example, when the process gas is a metal gas, since the metal gas is sensitive to temperature, the metal gas needs to be supplied under a certain temperature condition. Therefore, in the present invention, when measuring the supply flow rate of the metal gas, the temperature of the calibration tank 210 is first formed to a certain temperature range, and the metal gas can be supplied to the calibration tank 210 while maintaining the certain temperature range.

[0143] The process gas may be supplied to the process gas supply line 130 by adjusting the supply flow rate through the verification object mass flow controller 160a, and the process gas is bypassed to the bypass gas supply line 230, so that the process gas is supplied to the calibration tank 210 (S215).

[0144] For example, the control unit 250 may control the gas supply control valves 131a, 131b, 131c, 131d, 131e of the individual process gas supply lines 130a, 130b, 130c, 130d, 130e connected to the process gas supply line 130 to block the supply of process gas to the individual process gas supply lines 130a, 130b, 130c, 130d, 130e. In addition, the control unit 250 may control the bypass control valve 231 to bypass the process gas supplied through the process gas supply line 130 to the bypass gas supply line 230 so as to supply the process gas to the calibration tank 210.

[0145] As the process gas is supplied to the calibration tank 210 , the pressure of the calibration tank 210 changes, and the pressure change of the calibration tank 210 may be continuously monitored by the pressure gauge 221 of the measuring device 220 ( S221 ).

[0146] In the interval in which the pressure of the calibration tank 210 changes linearly, a verification time interval of a set verification pressure range may be selected according to the supply flow rate of the corresponding process gas ( S223 ).

[0147] Furthermore, the pressure and temperature of the calibration tank 210 at the start point of the verification time interval can be measured by the pressure gauge 221 and the thermometer 225 of the measuring device 220 (S231), and the pressure and temperature of the calibration tank 210 at the end point of the verification time interval can be measured (S233).

[0148] As an example, Figure 7 An example of the operation of selecting a verification time period in the process gas supply control verification method according to the present invention is shown.

[0149] The verification object mass flow controller 160a is set to adjust the metal gas to a low flow rate of 0.5sccm. When the verification object mass flow controller 160a supplies metal gas at a low flow rate of 0.5sccm, the metal gas can be supplied to the calibration tank 210 through the bypass gas supply line 230 and the pressure of the calibration tank 210 can be measured by the pressure gauge 221 to monitor the pressure change.

[0150] The flow rate calculation unit 260 may select a verification time interval corresponding to a verification pressure range of 1 Torr to 4 Torr in the interval in which the pressure of the calibration tank 210 changes linearly. Figure 7 In the calibration tank 210, the pressure of 1 Torr is selected as the start time point of the verification time interval, and the pressure of 4 Torr is selected as the end time point of the verification time interval. In order to facilitate the selection of the verification time interval, the pressure point of 1 Torr is selected as time 0, and the pressure point of 4 Torr change is selected as 02:51 as the verification time interval.

[0151] The flow rate calculator 260 may calculate the supply flow rate of the supplied process gas based on the measurement conditions and measurement values ​​such as the verification time period, the pressure and temperature at the start point, and the pressure and temperature at the end point ( S240 ).

[0152] For example, it can be that in the Figure 7 In the above, the measured values ​​of pressure and temperature at the start time point of the verification time interval, i.e., time point 0, are extracted, and the measured values ​​of pressure and temperature at the end time point of the verification time interval, i.e., time point 02:51, are extracted. Furthermore, the supply flow rate of the metal gas supplied by the verification object mass flow controller 160a may be calculated based on the measured values ​​of pressure and temperature at the start time point of the verification time interval and the measured values ​​of pressure and temperature at the end time point of the verification time interval.

[0153] As an example, the flow rate calculation unit 260 can calculate the supply flow rate by the following [Formula 1].

[0154] [Formula 1]

[0155]

[0156] Wherein, flow represents the supply flow rate of process gas, α represents the correction factor, C represents the temperature of the calibration tank, and V t represents the volume of the calibration tank, the V p represents the volume of the bypass gas supply line, the P 1 represents the pressure of the calibration tank at the start time of the verification time interval, the P 2 represents the pressure of the calibration tank at the end time of the verification time interval, and the T 1 represents the start time of the verification time interval, the T 2 represents the end time of the verification time interval, and Leak represents the leakage amount of the process gas of the calibration tank.

[0157] The correction factor α may be the inverse of the gas compressibility coefficient.

[0158] The calibration tank 210 pre-sets the volume of the gas storage space 211 provided therein, so that the V t .

[0159] The volume of the bypass gas supply line 230 is V p The flow rate can be calculated based on the installation position of the supply flow verification device 200 and the connection point of the process gas supply line 130 from the length and cross-sectional area thereof.

[0160] When the supply flow calculation of the flow calculation unit 260 is completed, the process gas in the calibration tank 210 is discharged and flushing is performed, and the related Figure 8 An example of cleaning the calibration tank and the bypass gas supply line in the process gas supply control verification method according to the present invention is shown.

[0161] When the supply flow calculation of the flow calculation unit 260 is finished, the control unit 250 may control the exhaust component 240 to exhaust the process gas stored in the calibration tank 210 to the outside. The control unit 250 may control the cleaning component 270 to perform flushing of the calibration tank 210, the bypass gas supply line 230, the process gas supply line 130, etc. (S250). Flushing may also be performed together with exhausting the calibration tank 210.

[0162] The cleaning member 270 supplies an inert purge gas, and the control unit 250 may control the purge gas control valve 275 to supply the purge gas to the process gas supply line 130 while the purge gas is supplied through the purge gas source unit 271 .

[0163] The control unit 250 may control the bypass control valve 231 to bypass the purge gas supplied through the process gas supply line 130 to the bypass gas supply line 230 so as to be supplied to the calibration tank 210 .

[0164] The supply of the purge gas can remove process gas and impurities remaining in the calibration tank 210, the bypass gas supply line 230, the process gas supply line 130, etc. The control unit 250 can control the exhaust member 240 to exhaust the flushed process gas, purge gas, impurities, etc. to the outside.

[0165] In order to calculate the supply flow rate more accurately, the verification target mass flow controller 160 a may repeatedly perform the supply of the process gas and the calculation of the supply flow rate thereof during a set number of verification times.

[0166] The flow rate calculation unit 260 determines whether the verification times are met (S250). If the verification times are insufficient, the aforementioned process can be repeated to calculate the supply flow rate. The verification times can be selected by considering the type of process gas, the set supply flow rate, etc.

[0167] If the verification times are satisfied, the flow rate calculation unit 260 may compare the set supply flow rate and the repeatedly calculated supply flow rate to calculate the error rate of the supply flow rate ( S270 ).

[0168] The flow rate calculation unit 260 verifies the verification target mass flow controller 160 a based on the calculated error rate.

[0169] Furthermore, verification can be performed on various supply flows to determine the working status of the mass flow controller and its related Fig. 9 The flowchart shows an embodiment of determining the operating state of a mass flow controller when changing the supply flow rate in the process gas supply control verification method according to the present invention.

[0170] In describing this embodiment, reference will be made to the aforementioned Figures 5 to 8 , and the repeated parts are omitted or briefly described.

[0171] The verification object MFC 160a selects a process gas to be supplied (S310), selects a supply flow rate from a plurality of verification object supply flow rates (S320), and adjusts the supply flow rate to the selected supply flow rate and supplies the process gas (S330).

[0172] The verification target mass flow controller 160a adjusts the supply flow rate and supplies the process gas (S340), and through the above-described process, the mass flow controller 160a is verified for the selected supply flow rate (S350).

[0173] The flow rate calculation unit 260 can verify the verification target mass flow controller 160a for a specific supply flow rate and then determine whether the supply flow rate should be changed (S360). Select another supply flow rate (S320) to repeat the above process, so that the verification target mass flow controller 160a can be verified according to the supply flow rate.

[0174] Fig.10 An example of selecting a verification time period according to a supply flow rate in the process gas supply control verification method according to the present invention is shown and will be observed with reference to it.

[0175] It can be that the supply flow rate of the verification object mass flow controller 160a is set to 0.5sscm and the verification time interval VT1 corresponding to the verification pressure range SP is selected, so that the supply flow rate is calculated based on the pressure and temperature measurement values ​​of the calibration tank 210 in the verification time interval VT1, and based on this, the verification object mass flow controller 160a with a supply flow rate of 0.5sccm is verified.

[0176] The supply flow rate of the verification target mass flow controller 160a may be changed and set to 0.1 sccm and 1.5 sccm in sequence, and the verification time intervals VT2 and VT3 corresponding to the verification pressure range SP are selected, and the supply flow rates are calculated based on the pressure and temperature measurement values ​​of the calibration tank 21 in the verification time intervals VT2 and VT3. Based on this, the verification target mass flow controller 160a with a supply flow rate of 1.0 sccm and 1.5 sccm can be verified.

[0177] The flow rate calculation unit 260 may verify the verification target mass flow controller 160 a according to the supply flow rate to determine the operating state of the verification target mass flow controller 160 a ( S370 ).

[0178] The present invention can verify the mass flow controller for low-flow process gas, especially metal gas. In the past, it was difficult to accurately measure the supply flow of the mass flow controller through the chamber, and it took a considerable time to accurately verify. In the present invention, corresponding to the type and flow of the corresponding process gas, an interval in which the flow can be calculated is selected in the interval where the pressure changes linearly, and the supply flow is calculated based on the measured value of the change state of the calibration tank in the corresponding interval, so that the flow can be accurately calculated in a short time.

[0179] The above description is only an example of the technical concept of the present invention. Anyone with common knowledge in the technical field to which the present invention belongs can make various modifications and deformations without departing from the essential characteristics of the present invention. Therefore, the embodiments recorded in the present invention are not intended to limit the technical concept of the present invention, but to illustrate the technical concept of the present invention, and the technical concept of the present invention is not limited to these embodiments. The protection scope of the present invention should be interpreted according to the attached claims, and all technical concepts within the equivalent scope should be interpreted as included in the scope of the rights of the present invention.

Claims

1. A process gas supply control verification method, characterized in that: include: Verifying the gas supply step, regulating the supply flow rate of the verification gas by using a mass flow controller and supplying the process gas, and supplying the process gas to the calibration tank through a bypass gas supply line; A verification interval selection step, wherein the state of the calibration tank is changed by supplying process gas and a verification time interval is selected; a change state measuring step, measuring the change state of the calibration tank during the verification time interval; and The supply flow rate calculation step calculates the supply flow rate of the process gas based on the measured value of the change state of the calibration tank.

2. The process gas supply control verification method according to claim 1, characterized in that: The verification interval selection step selects a verification time interval of a set verification pressure range in the interval where the pressure of the calibration tank changes linearly according to the supply of process gas.

3. The process gas supply control verification method according to claim 1, characterized in that: The change state measuring step measures the pressure and temperature of the calibration tank during the verification time interval.

4. The process gas supply control verification method according to claim 1, characterized in that: The supply flow rate calculation step calculates the supply flow rate of the process gas through the mass flow controller based on the pressure change and temperature change of the calibration tank at the start point and the end point of the verification time interval, taking into account the volume of the calibration tank and the volume of the bypass gas supply line.

5. The process gas supply control verification method according to claim 4, characterized in that: The supply flow rate calculation step is calculated by the following [Formula 1]: [Formula 1] Wherein, flow represents the supply flow rate of process gas, α represents the correction factor, C represents the temperature of the calibration tank, and V t represents the volume of the calibration tank, the V p represents the volume of the bypass gas supply line, the P1 represents the pressure of the calibration tank at the starting time point of the verification time interval, the P2 represents the pressure of the calibration tank at the ending time point of the verification time interval, the T1 represents the starting time of the verification time interval, the T2 represents the ending time of the verification time interval, and the Leak represents the leakage of process gas from the calibration tank.

6. The process gas supply control verification method according to claim 4, characterized in that: The volume of the bypass gas supply line is calculated based on the pressure and temperature of the process gas supplied through the bypass gas supply line.

7. The process gas supply control verification method according to claim 1, characterized in that: The process gas is a metal gas.

8. The process gas supply control verification method according to claim 1, characterized in that: The verification gas supplying step adjusts the temperature of the calibration tank by a temperature adjusting member and maintains the temperature at a set temperature while supplying the process gas to the calibration tank.

9. The process gas supply control verification method according to claim 1, characterized in that: The verification gas supplying step allows the process gas supplied to the process gas supply line connected to the selected process chamber among the plurality of process chambers to be detoured through the bypass gas supply line and supplied to the calibration tank.

10. The process gas supply control verification method according to claim 1, characterized in that: The verification gas supplying step allows the process gas supplied through a selected mass flow controller among a plurality of mass flow controllers connected to a plurality of process gas supply parts to bypass and be supplied to the calibration tank through the bypass gas supply line.

11. The process gas supply control verification method according to claim 1, characterized in that: The process gas supply control verification method further includes: a cleaning step of supplying a purge gas to the bypass gas supply line to flush the bypass supply line and the calibration tank.

12. The process gas supply control verification method according to claim 11, characterized in that: The process gas supply control verification method further includes: a mass flow controller verification step, repeatedly executing the verification gas supply step to the cleaning step to calculate the error rate of the supply flow rate, and verifying the mass flow controller.

13. The process gas supply control verification method according to claim 12, characterized in that: The process gas supply control verification method also includes: a mass flow controller operation judgment step, changing the verification supply flow to execute the verification gas supply step to the verification step, thereby verifying the mass flow controller according to the verification supply flow, and judging whether the mass flow controller is working normally.

14. A substrate processing system, characterized in that: include: a mass flow controller for controlling a supply flow rate of a process gas supplied to the process chamber; a process gas supply line for supplying the process gas whose supply flow rate is controlled by the mass flow controller to the process chamber; bypassing the gas supply line so that the process gas supplied to the process gas supply line through the mass flow controller is bypassed; a calibration tank for storing the process gas supplied through the bypass gas supply line; A measuring device for measuring a change state of the calibration tank; An exhaust component for exhausting the process gas from the calibration tank; a cleaning member for cleaning the bypass gas supply line and the calibration tank by supplying a purge gas to the bypass gas supply line; and The flow rate calculation unit selects a verification time period based on the change state of the calibration tank, and calculates a supply flow rate of the process gas supplied by the mass flow controller based on a measured value of the change state of the calibration tank in the verification time period.

15. The substrate processing system according to claim 14, characterized in that: The substrate processing system further comprises: a bypass control valve, disposed in the bypass gas supply line to control the supply of the process gas to the calibration tank; and The control unit controls the bypass control valve to selectively adjust the supply of process gas to the calibration tank, controls the exhaust component to adjust the exhaust of process gas from the calibration tank, and controls the cleaning component to adjust the cleaning of the bypass gas supply line and the calibration tank.

16. The substrate processing system according to claim 14, characterized in that: The measuring device comprises: a pressure gauge for measuring the pressure of the calibration tank; and A thermometer is used to measure the process gas temperature of the calibration tank.

17. The substrate processing system according to claim 14, characterized in that: The substrate processing system further comprises: a plurality of process gas sources; and a plurality of mass flow controllers for adjusting the supply flow rate of the process gas supplied to each of the plurality of process gas source parts; The bypass gas supply line bypasses a process gas supplied to the process gas supply line through a selected mass flow controller among a plurality of mass flow controllers.

18. The substrate processing system according to claim 15, characterized in that: The substrate processing system further comprises: a temperature regulating component for regulating the temperature of the calibration tank; The control unit controls the temperature adjustment member to adjust the temperature of the calibration tank to maintain the temperature at a set temperature.

19. The substrate processing system according to claim 14, wherein: The flow rate calculation unit calculates the supply flow rate by the following [Formula 1]: [Formula 1] Wherein, flow represents the supply flow rate of process gas, α represents the correction factor, C represents the temperature of the calibration tank, and V t represents the volume of the calibration tank, the V p represents the volume of the bypass gas supply line, the P1 represents the pressure of the calibration tank at the starting time point of the verification time interval, the P2 represents the pressure of the calibration tank at the ending time point of the verification time interval, the T1 represents the starting time of the verification time interval, the T2 represents the ending time of the verification time interval, and the Leak represents the leakage of process gas from the calibration tank.

20. A process gas supply control verification method, characterized in that: include: a verification gas supply step, adjusting the mass flow controller to a verification supply flow rate and supplying the metal gas, while supplying the metal gas to the calibration tank through a bypass gas supply line; A verification interval selection step, wherein the pressure of the calibration tank is increased by supplying metal gas and the pressure change is sensed at the same time, thereby selecting a verification time interval of a set verification pressure range corresponding to the verification supply flow rate in a linearly changing pressure interval; The flow rate calculation step is to substitute the pressure measurement value and the temperature measurement value in the verification time interval into the following [Formula 1] to calculate the supply flow rate of the metal gas. [Formula 1] Wherein, flow represents the supply flow rate of process gas, α represents the correction factor, C represents the temperature of the calibration tank, and V t represents the volume of the calibration tank, the V p represents the volume of the bypass gas supply line, the P1 represents the pressure of the calibration tank at the start time point of the verification time interval, the P2 represents the pressure of the calibration tank at the end time point of the verification time interval, the T1 represents the start time of the verification time interval, the T2 represents the end time of the verification time interval, and the Leak represents the process gas leakage of the calibration tank; a cleaning step of supplying a purge gas to the bypass gas supply line to flush the bypass supply line and the calibration tank; a mass flow controller verification step, repeatedly executing the verification gas supply step to the cleaning step to calculate the error rate of the supply flow rate and verify the mass flow controller; and The mass flow controller operation judgment step changes the verification supply flow rate to execute the verification gas supply step to the verification step, thereby verifying the mass flow controller according to the verification supply flow rate and judging whether the mass flow controller works normally.

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