Heat dissipation substrate and filtering module

Abstract

The invention relates to the field of semiconductor devices, in particular to a heat dissipation substrate and a filtering module. At least two parallel metal wiring layers are laid on the substrate body; the adjacent metal wiring layers are arranged at intervals in the direction perpendicular to the substrate body. The substrate body is provided with a heat dissipation hole, a heat conduction structure is arranged in the heat dissipation hole, and the heat conduction structure is located between every two adjacent metal wiring layers and connected with the adjacent metal wiring layers. According to the invention, the substrate is improved, so that the heat dissipation performance of the filter chip can be improved, and the performance of a device can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor devices, and in particular to a heat dissipation substrate and a filter module. Background Art

[0002] SAW filters have the advantages of low cost, small size, superior performance, and reliable quality. They have been widely used in mobile communications, navigation, new energy vehicles and other fields. At present, the development direction of SAW filters is miniaturization and multifunctionality. People expect the size of filters to become smaller and smaller, and to include more frequency bands in the same smaller size, from a single frequency band to a duplexer or even a quadplexer. On the one hand, as the input power of the filter becomes higher and higher, the heat generated by the filter becomes more and more. On the other hand, the reduction in the size of the filter leads to weaker heat dissipation. Therefore, the heat dissipation capacity of the filter under high power has become an obstacle to the development of the device, resulting in the performance of the filter being limited. Summary of the invention

[0003] The purpose of the present application is to provide a heat dissipation substrate and a filter module, which can improve the heat dissipation performance of the filter chip by improving the substrate, which is beneficial to improving the performance of the device.

[0004] The embodiment of the present application is implemented as follows: In the first aspect, an embodiment of the present application provides a heat dissipation substrate, including a substrate body; at least two layers of parallel metal routing layers are laid on the substrate body; adjacent metal routing layers are spaced apart in a direction perpendicular to the substrate body; the substrate body has a heat dissipation hole, a heat conductive structure is provided in the heat dissipation hole, and the heat conductive structure is located between two adjacent layers of the metal routing layers and connects adjacent metal routing layers.

[0005] As an optional implementation, the heat-conducting structure includes a metal column arranged in the heat dissipation hole, and two ends of the metal column are respectively connected to two adjacent metal wiring layers.

[0006] As an optional implementation, the heat-conducting structure includes a metal ring sleeved on the metal column, and the metal ring is located at the connection between the metal column and the metal wiring layer.

[0007] As an optional implementation, the central axis of the metal column is perpendicular to the metal routing layer.

[0008] In the second aspect, an embodiment of the present application provides a filtering module, comprising the above-mentioned heat dissipation substrate, and a filter chip arranged on the heat dissipation substrate; the metal routing layer is arranged on the surface of the heat dissipation substrate on one side close to the filter chip, and the filter chip is connected to the metal routing layer through a metal implant ball.

[0009] As an optional implementation, a grounding wire is pre-buried in the heat dissipation substrate, one end of the grounding wire is connected to the filter chip, and the other end of the grounding wire is connected to the heat conducting structure.

[0010] As an optional implementation, there are a plurality of heat-conducting structures and they are arranged at intervals on the heat dissipation substrate; some of the heat-conducting structures are located within the projection of the filter chip.

[0011] As an optional embodiment, a coating is laid on the surface of the heat dissipation substrate close to the filter chip, and the coating wraps the filter chip; the coating and the heat dissipation substrate form an annular contact surface surrounding the filter chip, and the projection of part of the thermal conductive structure is located in the annular contact surface.

[0012] As an optional implementation, a distance is set between the heat conducting structure and the metal wiring layer.

[0013] As an optional implementation, a heat dissipation coil is disposed on the surface of the heat dissipation substrate, and the heat dissipation coil is arranged around the periphery of the filter chip; the heat dissipation coil is connected to the heat conductive structure.

[0014] As an optional implementation, the heat dissipation coil is connected to the metal wiring layer.

[0015] The beneficial effects of the embodiments of the present application include: In the first aspect, an embodiment of the present application provides a heat dissipation substrate, including a substrate body; at least two layers of parallel metal routing layers are laid on the substrate body of the embodiment of the present application; and adjacent metal routing layers are spaced apart in a direction perpendicular to the substrate body. Compared with the prior art, the embodiment of the present application has a heat dissipation hole on the substrate body, and a heat-conducting structure is provided in the heat dissipation hole. The heat-conducting structure is located between two adjacent metal routing layers and connects the adjacent metal routing layers. The embodiment of the present application connects adjacent metal routing layers through the heat-conducting structure, thereby being able to conduct away the heat generated on the metal routing layers, thereby achieving improved heat dissipation performance. In addition, the metal routing layer of the embodiment of the present application is used to connect to the filter chip. Therefore, the heat generated by the filter chip can be guided to the outside of the substrate through the heat-conducting structure, thereby achieving heat dissipation of the filter chip.

[0016] On the second aspect, the embodiment of the present application provides a filter module, including the above-mentioned heat dissipation substrate, and a filter chip arranged on the heat dissipation substrate; a metal wiring layer is arranged on the surface of the heat dissipation substrate close to the filter chip, and the filter chip is connected to the metal wiring layer through a metal implant ball. The filter module of the embodiment of the present application adopts the above-mentioned heat dissipation substrate, which can improve the heat dissipation performance of the filter chip by embedding a heat-conducting structure in the substrate body, which is beneficial to improving the performance of the device. In addition, unlike the prior art method of directly setting a heat dissipation structure on the outside of the substrate, the heat dissipation substrate provided in the embodiment of the present application is embedded with a heat-conducting structure, which will not increase the volume of the entire filter module. In addition, the heat-conducting structure can be in direct contact with heat sources such as the metal wiring layer and the filter chip, thereby achieving efficient heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is one of the structural schematic diagrams of the heat dissipation substrate of an embodiment of the present application; Figure 2 This is one of the structural schematic diagrams of the filter module in the embodiment of the present application; Figure 3 This is the second structural schematic diagram of the heat dissipation substrate of the embodiment of the present application; Figure 4 This is the third structural schematic diagram of the heat dissipation substrate of the embodiment of the present application; Figure 5 This is the fourth structural schematic diagram of the heat dissipation substrate of the embodiment of the present application; Figure 6 This is the second structural diagram of the filtering module according to the embodiment of the present application.

[0019] icon: 100-substrate body; 101-metal wiring layer; 102-heat dissipation hole; 103-heat conduction structure; 104-metal column; 105-metal ring; 106-filter module; 107-filter chip; 108-metal planting ball; 109-film; 110-annular contact surface; 111-heat dissipation coil. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0022] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0023] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] SAW filters have the advantages of low cost, small size, superior performance, and reliable quality. They have been widely used in mobile communications, navigation, new energy vehicles and other fields. At present, the development direction of SAW filters is miniaturization and multifunctionality. People expect the size of filters to become smaller and smaller, and to include more frequency bands in the same smaller size, from a single frequency band to a duplexer or even a quadplexer. On the one hand, as the input power of the filter becomes higher and higher, the heat generated by the filter becomes more and more. On the other hand, the reduction in the size of the filter leads to weaker heat dissipation. Therefore, the heat dissipation capacity of the filter under high power has become an obstacle to the development of the device, resulting in the performance of the filter being limited.

[0025] In order to solve the above technical problems, the embodiment of the present application provides a heat dissipation substrate and a filter module 106.

[0026] Reference Figure 1 , Figure 2As shown, an embodiment of the present application provides a heat dissipation substrate, including a substrate body 100; at least two layers of parallel metal routing layers 101 are laid on the substrate body 100; adjacent metal routing layers 101 are spaced apart in a direction perpendicular to the substrate body 100; the substrate body 100 has a heat dissipation hole 102, and a heat conductive structure 103 is provided in the heat dissipation hole 102, and the heat conductive structure 103 is located between two adjacent metal routing layers 101 and connects the adjacent metal routing layers 101.

[0027] The heat dissipation substrate provided in the embodiment of the present application includes a substrate body 100 ; at least two parallel metal routing layers 101 are laid on the substrate body 100 of the embodiment of the present application; and adjacent metal routing layers 101 are spaced apart in a direction perpendicular to the substrate body 100 .

[0028] It should be noted that the substrate body 100 can be a PCB board or other types of substrates. At least two layers of metal routing layers 101 are arranged in parallel. A layer of metal routing layer 101 can be set on two corresponding surfaces of the substrate body 100, and one or more layers of metal routing layers 101 can also be pre-buried inside the substrate body 100.

[0029] The plane where the metal wiring layer 101 is located is parallel to the plane where the substrate body 100 is located, and the distance between adjacent metal wiring layers 101 can be set by those skilled in the art as needed.

[0030] In addition, the coverage area and specific structure of each metal wiring layer 101 are not particularly limited in the embodiment of the present application, and those skilled in the art can also set them as needed.

[0031] Compared with the prior art, the embodiment of the present application has a heat dissipation hole 102 on the substrate body 100 . A heat conduction structure 103 is provided in the heat dissipation hole 102 . The heat conduction structure 103 is located between two adjacent metal wiring layers 101 and connects the adjacent metal wiring layers 101 .

[0032] It should be noted that the projections of two adjacent metal wiring layers 101 on the substrate body 100 in the embodiment of the present application have an overlapping area, and the projections of the heat dissipation holes 102 provided in the embodiment of the present application on the substrate body 100 fall into the aforementioned overlapping area.

[0033] The heat conducting structure 103 provided in the heat dissipation hole 102 of the embodiment of the present application can directly connect two adjacent metal wiring layers 101. It should be noted that in the operation of the entire module, the metal wiring layer 101 also generates heat. The embodiment of the present application connects the metal wiring layer 101 through the heat conducting structure 103, and can export the heat to the outside of the substrate body 100.

[0034] The heat dissipation hole 102 can vertically penetrate the substrate body 100, the heat conduction structure 103 is embedded in the heat dissipation hole 102, and the two ends of the heat conduction structure 103 are respectively connected to the metal wiring layer 101 on the two side surfaces of the substrate body 100. The middle part of the heat conduction structure 103 passes through the metal wiring layer 101 embedded in the substrate body 100.

[0035] Reference Figure 2 , Figure 3 As shown, in the embodiment of the present application, a filter chip 107 is arranged on the surface of one side of the substrate body 100, and the filter chip 107 is connected to one layer of the metal wiring layer 101. When the filter chip 107 works in a high-power state, the heat dissipated by the filter chip 107 will be transferred to the end of the heat-conducting structure 103 close to the filter chip 107 through the metal wiring layer 101, and then the heat will be transferred to the end far away from the filter chip 107 through the heat-conducting structure 103. It should be noted that the end of the heat-conducting structure 103 is connected to the metal wiring layer 101 far away from the filter chip 107, has a large heat dissipation area, and can achieve efficient heat dissipation.

[0036] Therefore, refer to Figure 2 , Figure 3 As shown, the embodiment of the present application connects adjacent metal wiring layers 101 through a heat-conducting structure 103, thereby being able to conduct heat generated on the metal wiring layer 101, thereby improving heat dissipation performance. In addition, the metal wiring layer 101 of the embodiment of the present application is used to connect with the filter chip 107, so the heat generated by the filter chip 107 can be guided to the outside of the substrate through the heat-conducting structure 103, thereby achieving heat dissipation of the filter chip 107.

[0037] Reference Figure 2 , Figure 3 As shown, as an optional implementation, the heat-conducting structure 103 includes a metal column 104 disposed in the heat-dissipating hole 102 , and two ends of the metal column 104 are respectively connected to two adjacent metal wiring layers 101 .

[0038] Furthermore, the heat conducting structure 103 of the embodiment of the present application includes a metal column 104 , and the central axis of the metal column 104 is perpendicular to the metal wiring layer 101 .

[0039] Regarding the shape of the metal pillar 104 , it should be noted that the cross section of the metal pillar 104 can be any one of a circle, a triangle, a rectangle and a polygon. Exemplarily, the metal pillar 104 is a hexagonal metal pillar 104 .

[0040] In addition, the metal column 104 may be a solid structure, or may be configured as a tubular structure as required.

[0041] Exemplarily, the metal pillar 104 is in the shape of a circular tube.

[0042] Regarding the number and arrangement of the metal pillars 104 , it should be noted that there are a plurality of metal pillars 104 , and the plurality of metal pillars 104 are arranged at intervals on the substrate body 100 .

[0043] In addition, the metal pillar 104 may be made of a metal material with relatively good thermal conductivity, such as a copper metal pillar 104 .

[0044] Reference Figure 2 , Figure 3 As shown, as an optional implementation, the heat-conducting structure 103 includes a metal ring 105 sleeved on the metal column 104 , and the metal ring 105 is located at the connection between the metal column 104 and the metal wiring layer 101 .

[0045] Furthermore, in the embodiment of the present application, a metal ring 105 is disposed at the connection between the metal pillar 104 and the metal wiring layer 101 , wherein one side of the metal ring 105 is in contact with the metal wiring layer 101 .

[0046] In the embodiment of the present application, by sleeve-arranging the metal ring 105 on the metal pillar 104 , the contact area with the metal wiring layer 101 can be increased, which is convenient for heat transfer and beneficial for improving the heat dissipation performance.

[0047] Second, refer to Figure 5 , Figure 6 As shown, an embodiment of the present application provides a filter module 106, including the above-mentioned heat dissipation substrate, and a filter chip 107 arranged on the heat dissipation substrate; a metal wiring layer 101 is arranged on the surface of the heat dissipation substrate on one side close to the filter chip 107, and the filter chip 107 is connected to the metal wiring layer 101 through a metal implant ball 108.

[0048] The filter module 106 of the embodiment of the present application adopts the above-mentioned heat dissipation substrate, which can improve the heat dissipation performance of the filter chip 107 by embedding the heat-conducting structure 103 in the substrate body 100, which is conducive to improving the performance of the device. In addition, unlike the method of directly setting the heat dissipation structure outside the substrate in the prior art, the heat-conducting structure 103 is embedded on the heat dissipation substrate provided in the embodiment of the present application, which will not increase the volume of the entire filter module 106. In addition, the heat-conducting structure 103 can be in direct contact with the heat source such as the metal wiring layer 101 and the filter chip 107, thereby achieving efficient heat dissipation.

[0049] As an optional implementation, a grounding wire is pre-buried in the heat dissipation substrate, one end of the grounding wire is connected to the filter chip 107 , and the other end is connected to the heat conducting structure 103 .

[0050] It should be noted that, in addition to conducting heat, the heat conducting structure 103 in the embodiment of the present application can also realize the grounding of the filter chip 107 .

[0051] As an optional implementation, there are multiple heat-conducting structures 103 and they are arranged at intervals on the heat dissipation substrate; some of the heat-conducting structures 103 are located within the projection of the filter chip 107 .

[0052] Furthermore, in the embodiment of the present application, a plurality of heat-conducting structures 103 arranged at intervals are arranged within the projection range of the filter chip 107. The heat-conducting structures 103 within the projection range can directly conduct heat generated by the filter chip 107, which is beneficial to directly reduce the temperature of the filter chip 107 and realize efficient heat dissipation of the filter chip 107. Therefore, the embodiment of the present application can improve the heat dissipation capacity of the filter, so that the power tolerance capacity of the filter is improved.

[0053] Reference Figure 2 , Figure 3 As shown, as an optional embodiment, a coating 109 is laid on the surface of the heat dissipation substrate close to the filter chip 107, and the coating 109 wraps the filter chip 107; the coating 109 and the heat dissipation substrate form an annular contact surface 110 surrounding the filter chip 107, and the projection of part of the heat-conducting structure 103 is located in the annular contact surface 110, and one end of the heat-conducting structure 103 is in contact with the coating 109.

[0054] The heat-conducting structure 103 in contact with the coating 109 is independent of the metal wiring layer 101 , that is, a gap is set between the heat-conducting structure 103 and the metal wiring layer 101 .

[0055] In the embodiment of the present application, a coating 109 is provided on the heat dissipation substrate, and the filter chip 107 is wrapped by the coating 109. It should be noted that the coating 109 can be applied to epoxy film plastic and contain heat conductive materials. The thermal conductivity of the coating 109 is greater than that of the substrate body 100, so the heat generated by the filter chip 107 can be transferred from the substrate body 100 to the coating 109, and the heat dissipation of the entire substrate body 100 is achieved through the coating 109.

[0056] In the embodiment of the present application, a plurality of heat-conducting structures 103 are arranged on the substrate body 100, so that heat can be dispersed to various areas of the substrate body 100, and the heat-conducting structures 103 are in contact with the coating 109 to form a heat-conducting path. The embodiment of the present application can conduct the heat generated by the filter chip 107 to the external environment through the coating 109 through the heat-conducting path, effectively improving the heat dissipation capacity of the SAW filter, thereby improving its power tolerance.

[0057] It should be noted that the heat conduction formula is:

[0058] in, is the heat flux; is the thermal conductivity; is the heat conduction area, is the temperature difference between the two sides of the microelement thickness (T1-T2); is the microelement thickness.

[0059] Further, see Figure 4 , Figure 5 As shown, in the embodiment of the present application, a heat dissipation coil 111 is disposed on the surface of the heat dissipation substrate, and the heat dissipation coil 111 is disposed around the periphery of the filter chip 107 ; the heat dissipation coil 111 is connected to the heat conductive structure 103 .

[0060] It should be noted that the heat dissipation coil 111 of the embodiment of the present application is arranged around the periphery of the filter chip 107, and the heat dissipation coil 111 can be connected to the metal wiring layer 101. The heat dissipation coil 111 is arranged on the surface of the substrate body 100 close to the filter chip 107, and can be in direct contact with the coating 109, thereby greatly increasing the heat conduction surface and enhancing the heat dissipation effect of the coating 109.

[0061] The projection of the heat dissipation coil 111 and the annular contact surface 110 has an overlapping area. Since part of the heat-conducting structure 103 is arranged in the area, the heat-conducting structure 103 can transfer heat to the heat dissipation coil 111. In addition, the heat dissipation coil 111 is an annular metal sheet structure, which has a large heat dissipation area, and can quickly discharge the heat on the heat-conducting structure 103, thereby realizing efficient heat dissipation of the entire module.

[0062] The heat dissipation coil 111 can be arranged on the surface of the side away from the filter chip 107. It should be noted that the heat dissipation coil 111 can also be pre-buried inside the substrate body 100 as needed, and multiple heat dissipation coils 111 can also be arranged. Those skilled in the art can arrange them as needed, and no special limitation is made here.

[0063] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipation substrate, characterized in that: The invention comprises a substrate body (100); at least two layers of metal wiring layers (101) arranged in parallel are laid on the substrate body (100); adjacent metal wiring layers (101) are arranged at intervals along a direction perpendicular to the substrate body (100); the substrate body (100) has a heat dissipation hole (102), a heat conduction structure (103) is arranged in the heat dissipation hole (102), and the heat conduction structure (103) is located between two adjacent layers of the metal wiring layers (101) and connects adjacent metal wiring layers (101).

2. The heat dissipation substrate according to claim 1, characterized in that The heat-conducting structure (103) comprises a metal column (104) arranged in the heat-dissipating hole (102), and two ends of the metal column (104) are respectively connected to two adjacent metal wiring layers (101).

3. The heat dissipation substrate according to claim 2, characterized in that The heat-conducting structure (103) comprises a metal ring (105) sleeved on a metal column (104), wherein the metal ring (105) is located at the connection between the metal column (104) and the metal wiring layer (101).

4. The heat dissipation substrate according to claim 2, characterized in that The central axis of the metal column (104) is perpendicular to the metal wiring layer (101).

5. A filtering module (106), characterized in that: The invention comprises a heat dissipation substrate as claimed in any one of claims 1 to 4, and a filter chip (107) arranged on the heat dissipation substrate; the metal wiring layer (101) is arranged on a surface of the heat dissipation substrate on a side close to the filter chip (107), and the filter chip (107) is connected to the metal wiring layer (101) via a metal implant ball (108).

6. The filtering module (106) according to claim 5, characterized in that A grounding wire is pre-buried in the heat dissipation substrate, one end of the grounding wire is connected to the filter chip (107), and the other end is connected to the heat conducting structure (103).

7. The filtering module (106) according to claim 5, characterized in that There are a plurality of the heat-conducting structures (103) which are arranged at intervals on the heat dissipation substrate; and some of the heat-conducting structures (103) are located within the projection of the filter chip (107).

8. The filtering module (106) according to claim 5, characterized in that A coating (109) is laid on the surface of the heat dissipation substrate on one side close to the filter chip (107), and the coating (109) wraps the filter chip (107); the coating (109) and the heat dissipation substrate form an annular contact surface (110) surrounding the filter chip (107); a projection of a portion of the heat-conducting structure (103) is located in the annular contact surface (110), and one end is connected to the coating (109).

9. The filtering module (106) according to claim 8, characterized in that A distance is provided between the heat conducting structure (103) and the metal wiring layer (101).

10. The filtering module (106) according to claim 5, characterized in that A heat dissipation coil (111) is provided on the surface of the heat dissipation substrate, and the heat dissipation coil (111) is arranged around the periphery of the filter chip (107); the heat dissipation coil (111) is connected to the heat conduction structure (103).

11. The filtering module (106) according to claim 10, characterized in that The heat dissipation coil (111) is connected to the metal wiring layer (101).

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