High-thermal-conductivity circuit board copper block embedding device

Abstract

The invention discloses a high-thermal-conductivity circuit board copper block embedding device, relates to the field of circuit board production, and solves the problem that an existing circuit board copper block embedding device is easy to cause glue overflow, the high-thermal-conductivity circuit board copper block embedding device comprises a device base and a placement seat fixedly mounted at the top of the device base, and a first circuit board is arranged at the top of the placement seat; a first circuit board is arranged at the top of the placement seat, a second circuit board is arranged at the top of the first circuit board, a copper block body is arranged between the first circuit board and the second circuit board, a mounting disc is slidably mounted on the outer side of the placement seat, and four scraping plates in central symmetry are arranged at the top of the mounting disc; the glue scraping mechanism is used for cleaning glue overflowing from the outer sides of the first circuit board and the second circuit board, and the glue scraping mechanism is mounted at the top of the mounting disc; through the glue scraping mechanism, glue overflowing from caulking grooves in the outer sides of the first circuit board and the second circuit board is scraped and cleaned through the four scrapers, and therefore the effect of rapid glue removal is achieved.

Description

Technical Field

[0001] The invention relates to the field of circuit board production, in particular to a copper block embedding device for a high thermal conductivity circuit board. Background Art

[0002] PCB is a printed circuit board, which is an important electronic component and an important part of electronic products. Its main function is to transfer the circuit graphics on the circuit board to the printed circuit to form a circuit structure with certain functions. It is widely used. Components include power supplies, transistors, inductors, resistors, etc. These components are connected by interconnection lines to form circuits, thereby realizing the functions of the circuits.

[0003] Embedded copper block PCB is a technology that embeds metal blocks in the local position corresponding to the high-power components mounted on the PCB board. The large amount of heat generated by the device when working is conducted to the dedicated heat dissipation device on the other side of the PCB through the metal block, thereby effectively reducing the working temperature of the components and PCB and improving the service life of the equipment. When embedding the copper block, glue is injected into the embedding groove, and the two circuit boards are fixed to the copper block by pressing. The existing Chinese public patent document: CN211909286U discloses a semi-embedded embedded copper block circuit board. Although it can contact the flow glue layer through the convex ridge to limit the T-shaped copper block to reduce the probability of circumferential displacement of the T-shaped copper block relative to the circuit board body during the pressing process of the circuit board body, when the two circuit boards are pressed, the excess glue will overflow from the embedding groove of the circuit board to the outside. Before the overflowed glue is cured, it is easy to cause the two processed circuit boards that touch each other to stick together. After the glue is cured, it is easy to cover the welding points on the surface of the circuit board, affecting the subsequent welding of the pins of the electrical components. Summary of the invention

[0004] The object of the present invention is to provide a copper block embedding device for a high thermal conductivity circuit board to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A device for embedding copper blocks of a high thermal conductivity circuit board comprises: a device base and a placement seat fixedly mounted on the top of the device base, a circuit board 1 is arranged on the top of the placement seat, a circuit board 2 is arranged on the top of the circuit board 1, a copper block body is arranged between the circuit board 1 and the circuit board 2, the copper block body is fixed in the embedding groove of the circuit board 1 by glue, and the circuit board 1 is placed so that the embedding groove on the circuit board 1 is aligned and pressed with the copper block body, a mounting plate is slidably mounted on the outer side of the placement seat, four scrapers in central symmetry are arranged on the top of the mounting plate for scraping off the glue overflowing from the embedding grooves on the outer sides of the circuit board 1 and the circuit board 2; it also comprises: a scraping mechanism for cleaning the glue overflowing from the outer sides of the circuit board 1 and the circuit board 2, the scraping mechanism being mounted on the top of the mounting plate; a clamping plate mechanism for smoothly aligning the circuit board 1 and the circuit board 2, the clamping plate mechanism being mounted inside the mounting plate; a spring-pressing mechanism for smoothly pressing the circuit board 1 and the circuit board 2, the spring-pressing mechanism being mounted above the circuit board 2.

[0006] The top of the base comprises two pieces of symmetrically arranged bottom plates, each of which is fixedly connected to a top plate of the base plate and is symmetrically distributed. A fixing block is slidably mounted on the inside of the support plate, and a mounting rod is fixedly connected between the two fixing blocks located on the same base plate. The scraper is docked with the mounting rod through a disassembly and assembly component, so that the mounting rod can pull the scraper to move when it moves. The outer side of the support plate is provided with a sliding cavity for limiting the sliding of the fixing block and the mounting rod. A spring 1 is fixedly connected between the fixing block and the inner wall of the sliding cavity. The side of the scraper away from the mounting rod is an inclined structure. The inclined surface of the scraper moves with the outer side of the circuit board 1, so that the scraper can push the fixing block to move through the mounting rod, and the elasticity of the spring 1 is used to make the scraper stick to the outer side of the circuit board 1. A spring 2 located on the outer side of the placement seat is fixedly connected between the mounting plate and the device base, so as to facilitate smooth movement and resetting of the mounting plate.

[0007] Preferably, the clamping plate mechanism includes an adjusting plate rotatably mounted on the inner side of the mounting plate, the outer side of the bottom plate is fixedly connected to a movable plate, the bottom of the movable plate is fixedly connected to a sliding rod extending to the inside of the mounting plate, the outer side of the sliding rod is fixedly connected to a sliding block, the top of the mounting plate is provided with a long groove for limiting the sliding of the sliding block, the outer side of the adjusting plate is provided with an arc groove 1 for limiting the sliding of the sliding rod, rotating the adjusting plate can drive the sliding rod to move through the arc groove 1, so that the sliding rod drives the sliding block to move along the long groove on the mounting plate, and the adjusting A pull rod is fixedly connected to the top of the section disk, and an arc-shaped groove No. 2 is provided on the top of the mounting disk for limiting the sliding of the pull rod. The adjusting disk can be moved by pulling the pull rod, and a threaded barrel is fixedly connected to the top of the pull rod. A rotating block matching the threaded barrel is provided on the top of the mounting disk, and a rubber ring is fixedly connected to the bottom of the rotating block. A rubber gasket is fixedly connected to the top of the arc-shaped groove No. 2. When the rubber ring is squeezed and contacted with the rubber gasket, a limit is provided for the pull rod. A sticking plate is fixedly connected to the outer side of the support plate to facilitate the support of the outer sides of the circuit board one and the circuit board two.

[0008] Preferably, the spring pressing mechanism includes two electric telescopic rods symmetrically fixedly installed on both sides of the device base, a top frame is fixedly connected between the output ends of the two electric telescopic rods, a pressure block located above the placement seat is provided below the top frame, and is used to press circuit board one and circuit board two, a positioning rod sliding through the top frame is fixedly connected to the top of the pressure block, a spring three is provided on the outside of the positioning rod, the spring three is fixedly installed between the pressure block and the top frame, and elastic pressing is performed by utilizing the elasticity of the spring three, pressure plates are provided on both sides of the pressure block, the horizontal height of the bottom of the pressure plate is lower than the horizontal height of the bottom of the pressure block, and two symmetrically distributed pressure rods are fixedly connected between the pressure plate and the top frame.

[0009] Preferably, four centrally symmetrical support rods are fixedly connected to the outer side of the placement seat, and the support rods slide through the installation plate to improve the stability of the movement of the installation plate.

[0010] Preferably, the disassembly and assembly assembly includes a bolt rod fixedly mounted on a side of the scraper close to the mounting rod, a plug is provided on the outer side of the mounting rod for limiting the insertion of the bolt rod, a nut of the bolt rod is in contact with one end of the plug, and a side of the scraper close to the bolt rod is a curved surface structure corresponding to the outer side of the mounting rod, which facilitates quick disassembly and installation of the scraper.

[0011] Preferably, two symmetrically distributed positioning strips are fixedly connected to the outer side of the slider, and positioning slots for limiting the sliding of the positioning strips are provided on the inner side of the long slot of the mounting plate, thereby improving the stability of the movement of the slider.

[0012] Preferably, an insertion rod is fixedly connected to the bottom of the rotating block, and an insertion cavity for limiting the insertion of the insertion rod is opened at the top of the threaded barrel, so as to prevent the rotating block from rotating too much and falling off the threaded barrel.

[0013] Preferably, the top of the positioning rod is fixedly connected to a limiting block, so as to facilitate pulling the positioning rod to move the pressing block away from the second circuit board.

[0014] Preferably, two symmetrically distributed rubber blocks are fixedly connected to the bottom of the pressing plate to provide protection for the pressing between the pressing plate and the mounting plate.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention uses a glue scraping mechanism to scrape and clean the glue overflowing from the outer grooves of the circuit board one and the circuit board two through four scrapers after the circuit board one, the copper block body and the circuit board two are pressed and assembled, thereby solving the problem of glue covering the welding points, thereby achieving the effect of rapid glue removal.

[0016] The present invention can synchronously press the outer sides of the first circuit board and the second circuit board through the clamping plate mechanism, so that the first circuit board and the second circuit board are automatically aligned, and the accuracy of pressing the copper block body is improved, thereby achieving the effect of correcting the positioning.

[0017] The present invention can elastically press the top of the second circuit board through the spring pressing mechanism, and as the second circuit board is pressed, the mounting plate moves downward along the outer side of the placement seat to scrape off the overflowed adhesive, thereby achieving a safe pressing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the circuit board 1 and the copper block body in the present invention; Figure 3 It is a schematic diagram of the structure of the placement seat and the mounting plate in the present invention; Figure 4 It is a schematic diagram of the structure of the moving plate and the adjusting disk in the present invention; Figure 5 It is a schematic diagram of the structure of the fixing block and the supporting plate in the present invention; Figure 6 It is a schematic diagram of the scraper and the insert pipe structure in the present invention; Figure 7 This is a schematic diagram of the structure of the transfer block and the rubber gasket in the present invention; Figure 8 It is a schematic diagram of the structure of the pressing block and the pressing plate in the present invention.

[0019] In the figure: 1. device base; 2. placement seat; 3. circuit board one; 4. circuit board two; 5. copper block body; 6. mounting plate; 7. scraper; 8. bottom plate; 9. support plate; 10. fixed block; 11. mounting rod; 12. spring one; 13. spring two; 14. adjustment plate; 15. moving plate; 16. sliding rod; 17. sliding block; 18. pull rod; 19. threaded cylinder; 20. rotating block; 21. rubber ring; 22. rubber gasket; 23. pasting plate; 24. electric telescopic rod; 25. top frame; 26. pressure block; 27. positioning rod; 28. spring three; 29. ​​pressure plate; 30. pressure rod; 31. support rod; 32. bolt rod; 33. insert tube; 34. positioning strip; 35. insert rod; 36. limit block; 37. rubber block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative inspiration are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figure 1-Figure 8 The illustrated embodiment of the invention is a copper block embedding device for a high thermal conductivity circuit board, comprising a device base 1 and a placement seat 2 fixedly mounted on the top of the device base 1, a circuit board 1 3 is arranged on the top of the placement seat 2, a circuit board 2 4 is arranged on the top of the circuit board 1 3, a copper block body 5 is arranged between the circuit board 1 3 and the circuit board 2 4, the copper block body 5 is fixed in the embedding groove of the circuit board 1 3 by adhesive, and the circuit board 2 4 is placed so that the embedding groove on the circuit board 2 4 is aligned and pressed with the copper block body 5, a mounting plate 6 is slidably mounted on the outer side of the placement seat 2, and four scrapers 7 are centrally symmetrically mounted on the top of the mounting plate 6 for scraping off the adhesive overflowing from the embedding groove on the outer sides of the circuit board 1 3 and the circuit board 2 4; and further comprising: a scraping mechanism for cleaning the adhesive overflowing from the outer sides of the circuit board 1 3 and the circuit board 2 4, the scraping mechanism being mounted on the top of the mounting plate 6; a clamping mechanism for aligning the circuit board 1 3 and the circuit board 2 4 stably, the clamping mechanism being mounted inside the mounting plate 6; a spring-pressing mechanism for pressing the circuit board 1 3 and the circuit board 2 4 stably, the spring-pressing mechanism being mounted above the circuit board 2 4.

[0022] The scraping mechanism includes four bottom plates 8 symmetrically arranged on the top of the mounting plate 6, and two symmetrically distributed support plates 9 are fixedly connected to the top of the bottom plate 8. A fixed block 10 is slidably installed inside the support plate 9, and a mounting rod 11 is fixedly connected between the two fixing blocks 10 located on the same bottom plate 8. The scraper 7 is docked with the mounting rod 11 through a disassembly assembly, so that the mounting rod 11 can pull the scraper 7 to move when it moves. A sliding cavity for limiting the sliding of the fixing block 10 and the mounting rod 11 is opened on the outer side of the support plate 9. A spring 12 is fixedly connected between the fixing block 10 and the inner wall of the sliding cavity. The side of the scraper 7 away from the mounting rod 11 is an inclined structure. The inclined surface of the scraper 7 moves along the outer side of the circuit board 3, so that the scraper 7 can push the fixing block 10 to move through the mounting rod 11. The elasticity of the spring 12 is used to make the scraper 7 stick to the outer side of the circuit board 3. A spring 2 13 located on the outer side of the placement seat 2 is fixedly connected between the mounting plate 6 and the device base 1, which is convenient for the stable movement and reset of the mounting plate 6. After the circuit board 1 3 and the circuit board 2 4 are pressed together with the copper block body 5, the mounting plate 6 can be pressed down to move downward, so that the bottom plate 8 drives the support plate 9 to move synchronously, and the support plate 9 drives the mounting rod 11 to move downward through the fixed block 10, so that the mounting rod 11 drives the inclined surface of the scraper 7 to contact the outer side of the circuit board 2 4, so that the scraper 7 pushes the fixed block 10 to move along the sliding cavity of the support plate 9, and the elasticity of the spring 12 is utilized to make the scraper 7 stick to the outer side of the circuit board 2 4. When the scraper 7 moves downward, the adhesive overflowing from the outer sides of the circuit board 1 3 and the circuit board 2 4 is cleaned to solve the problem of adhesive covering the welding points, thereby achieving the effect of rapid adhesive removal.

[0023] The clamping plate mechanism includes an adjusting plate 14 rotatably mounted on the inner side of the mounting plate 6, a movable plate 15 is fixedly connected to the outer side of the bottom plate 8, a sliding rod 16 extending to the inside of the mounting plate 6 is fixedly connected to the bottom of the movable plate 15, a slider 17 is fixedly connected to the outer side of the sliding rod 16, a long groove for limiting the sliding of the slider 17 is opened on the top of the mounting plate 6, an arc groove 1 is opened on the outer side of the adjusting plate 14 for limiting the sliding of the slider 16, and the rotating adjusting plate 14 can drive the slider 16 to move through the arc groove 1, so that the slider 16 drives the slider 17 to move along the long groove on the mounting plate 6, and the top of the adjusting plate 14 is fixed A pull rod 18 is fixedly connected, and an arc groove 2 is provided on the top of the mounting plate 6 for the pull rod 18 to limit the sliding movement. The adjusting plate 14 can be moved by pulling the pull rod 18. A threaded cylinder 19 is fixedly connected to the top of the pull rod 18. A rotating block 20 matching the threaded cylinder 19 is provided on the top of the mounting plate 6. A rubber ring 21 is fixedly connected to the bottom of the rotating block 20. A rubber gasket 22 is fixedly connected to the top of the arc groove 2. When the rubber ring 21 is squeezed and contacted with the rubber gasket 22, the pull rod 18 is provided with a limit. A sticking plate 23 is fixedly connected to the outer side of the support plate 9 to facilitate the support of the outer sides of the circuit board 1 3 and the circuit board 2 4. Before pressing the circuit board 1 3 and the circuit board 2 4 together, the user can pull the pull rod 18 to move along the annular groove 2 on the mounting plate 6, so that the adjusting plate 14 rotates along the inner side of the mounting plate 6, and the adjusting plate 14 drives the sliding rod 16 to move through the arc groove 1, so that the sliding rod 16 drives the sliding block 17 to move along the long groove on the mounting plate 6, and the bottom plate 8 can be driven by the moving plate 15 to move along the top of the mounting plate 6, so that the bottom plate 8 drives the pasting plate 23 on the support plate 9 to contact the outer sides of the circuit board 1 3 and the circuit board 2 4, and the circuit board 1 3 and the circuit board 2 4 are automatically aligned to improve the accuracy of pressing the copper block body 5, thereby achieving the effect of correcting the positioning, and the rotating block 20 can be rotated to move downward along the threaded cylinder 19, so that the rubber ring 21 on the rotating block 20 squeezes and fixes the rubber gasket 22, so that the pasting plate 23 keeps the circuit board 1 3 and the circuit board 2 4 in position.

[0024] The spring pressing mechanism includes two electric telescopic rods 24 symmetrically fixedly installed on both sides of the device base 1, a top frame 25 is fixedly connected between the output ends of the two electric telescopic rods 24, a pressing block 26 located above the placement seat 2 is arranged below the top frame 25, and is used to press the circuit board 1 3 and the circuit board 2 4 together, a positioning rod 27 sliding through the top frame 25 is fixedly connected to the top of the pressing block 26, a spring 3 28 is arranged on the outside of the positioning rod 27, the spring 3 28 is fixedly installed between the pressing block 26 and the top frame 25, and elastic pressing is performed by utilizing the elasticity of the spring 3 28, pressing plates 29 are arranged on both sides of the pressing block 26, the horizontal height of the bottom of the pressing plate 29 is lower than the horizontal height of the bottom of the pressing plate 26, and two symmetrically distributed pressing rods 30 are fixedly connected between the pressing plate 29 and the top frame 25; After the circuit board 1 3 is aligned with the circuit board 2 4 , the user can start the two electric telescopic rods 24 so that the electric telescopic rods 24 pull the top frame 25 to move downward. The top frame 25 drives the pressing block 26 to contact the top of the circuit board 2 4 through the spring 3 28, and presses the circuit board 2 4 downward, so that the copper block body 5 is embedded in the groove of the circuit board 2 4. As the top frame 25 moves, the elasticity of the spring 3 28 is utilized to make the pressing block 26 elastically squeeze the circuit board 2 4, and the pressing plate 29 is driven by the pressing rod 30 to press down the top of the mounting plate 6, so that the scraper 7 cleans the adhesive overflowing from the outside of the circuit board 1 3 and the circuit board 2 4, thereby achieving a safe pressing effect.

[0025] Working principle: First, the user places the circuit board 1 3 on the placement seat 2, and applies glue in the embedded grooves of the circuit board 1 3 and the circuit board 2 4. Then, the copper block body 5 is inserted into the embedded groove of the circuit board 1 3, and the circuit board 2 4 is covered on the copper block body 5. At this time, the user pulls the pull rod 18 to move along the annular groove 2 on the mounting plate 6, so that the adjustment plate 14 moves along the inner side of the mounting plate 6. The adjustment plate 14 drives the slide rod 16 to move through the arc groove 1, so that the slide rod 16 drives the slider 17 to move along the long groove on the mounting plate 6. The bottom plate 8 is driven to move along the top of the mounting plate 6 by the moving plate 15, so that the bottom plate 8 drives the sticking plate 23 on the supporting plate 9 to contact the outer sides of the circuit board 1 3 and the circuit board 2 4, and the rotating block 20 is rotated to move downward along the threaded cylinder 19, so that the rubber ring 21 on the rotating block 20 squeezes and fixes the rubber gasket 22, so that the sticking plate 23 keeps positioning the circuit board 1 3 and the circuit board 2 4, and the circuit board 1 3 and the circuit board 2 4 can be kept aligned. Then, the user starts the two electric telescopic rods 24, so that the electric telescopic rods 24 pull the top frame 25 As the top frame 25 moves downward, the pressing block 26 is driven by the spring 3 28 to contact the top of the circuit board 2 4, and the circuit board 2 4 is pressed downward, so that the copper block body 5 is embedded in the groove of the circuit board 2 4. As the top frame 25 moves, the elasticity of the spring 3 28 is used to make the pressing block 26 elastically squeeze the circuit board 2 4, and the pressing plate 29 is driven by the pressing rod 30 to press the top of the mounting plate 6 downward. The mounting plate 6 drives the four bottom plates 8 to move, so that the two support plates 9 on the bottom plate 8 drive the mounting rod 11 downward through the corresponding fixing block 10. The mounting rod 11 drives the inclined surface of the scraper 7 to contact the outer side of the circuit board 2 4, and the scraper 7 pushes the fixing block 10 to move along the sliding cavity of the support plate 9. The elasticity of the spring 12 is utilized to make the scraper 7 stick to the outer side of the circuit board 2 4, so that when the scraper 7 moves downward, the adhesive overflowing from the outer sides of the circuit board 1 3 and the circuit board 2 4 can be cleaned. Finally, the user pulls the positioning rod 27 to move upward to make the pressing block 26 away from the circuit board 2 4, so that the formed circuit board can be taken out, thereby achieving the effect of rapid adhesive removal and safe pressing.

[0026] Example 2: Please refer to Figure 2 , Figure 4 and Figure 6, this embodiment further explains the first embodiment. The outer side of the placement seat 2 in the figure is fixedly connected with four centrally symmetrical support rods 31, and the support rods 31 slide through the mounting plate 6 to improve the stability of the movement of the mounting plate 6. The disassembly and assembly components include a bolt rod 32 fixedly mounted on the side of the scraper 7 close to the mounting rod 11. The outer side of the mounting rod 11 is provided with a plug 33 for the bolt rod 32 to limit the insertion. The nut of the bolt rod 32 is in contact with one end of the plug 33. The side of the scraper 7 close to the bolt rod 32 is an arc surface structure corresponding to the outer side of the mounting rod 11, which is convenient for quickly disassembling and installing the scraper 7. The outer side of the slider 17 is fixedly connected with two symmetrically distributed positioning strips 34, and the inner side of the long groove of the mounting plate 6 is provided with a positioning groove for the positioning strip 34 to limit the sliding, thereby improving the stability of the movement of the slider 17.

[0027] In this embodiment: when the mounting plate 6 moves, it can move along the outer side of the support rod 31, so that the mounting plate 6 can move downward horizontally, and when the slider 17 moves, it drives the positioning bar 34 to move along the positioning groove on the mounting plate 6, thereby improving the stability of the movement of the slider 17 and facilitating the installation of the slider 17. The user can pass the bolt rod 32 through the insert tube 33 on the mounting rod 11, so that the curved surface of the scraper 7 is attached to the outer side of the mounting rod 11, and fixed to the insert tube 33 through a nut, so that the scraper 7 can be quickly installed and is easy to disassemble and clean.

[0028] Example 3: Please refer to Figure 1 , Figure 7 and Figure 8 This embodiment further explains other embodiments. The bottom of the rotating block 20 in the figure is fixedly connected with an insertion rod 35, and the insertion rod 35 can be made of magnet material. The top of the threaded tube 19 is provided with an insertion cavity for the insertion rod 35 to limit the insertion, so as to prevent the rotating block 20 from rotating too much and falling off the threaded tube 19. The top of the positioning rod 27 is fixedly connected with a limiting block 36, which is convenient for pulling the positioning rod 27 to keep the pressure block 26 away from the circuit board 4. The bottom of the pressure plate 29 is fixedly connected with two symmetrically distributed rubber blocks 37 to provide protection for the pressing between the pressure plate 29 and the mounting plate 6.

[0029] In this embodiment: when the rotating block 20 rotates, it can drive the insertion rod 35 to move along the inner side of the threaded tube 19 to prevent the rotating block 20 from falling off the threaded tube 19 due to excessive rotation of the rotating block 20 when it rotates upward. After pressing the circuit board 24, the user can pull the limit block 36 to move the pressing block 26 away from the circuit board 24 to take out the manufactured circuit board. When the pressing plate 29 moves, it can contact the top of the mounting disk 6 through the rubber block 37, so that the pressing plate 29 can press the mounting disk 6 smoothly downward, thereby providing protection between the pressing plate 29 and the mounting disk 6.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A copper block embedding device for a high thermal conductivity circuit board, characterized in that: include: A device base (1) and a placement seat (2) fixedly mounted on the top of the device base (1); a circuit board 1 (3) is arranged on the top of the placement seat (2); a circuit board 2 (4) is arranged on the top of the circuit board 1 (3); a copper block body (5) is arranged between the circuit board 1 (3) and the circuit board 2 (4); a mounting plate (6) is slidably mounted on the outer side of the placement seat (2); and four scrapers (7) are arranged on the top of the mounting plate (6) in a centrally symmetrical manner; Also includes: A glue scraping mechanism, used for cleaning glue overflowing from the outer sides of the first circuit board (3) and the second circuit board (4), the glue scraping mechanism being mounted on the top of the mounting plate (6); A clamping plate mechanism, used for smoothly aligning the first circuit board (3) with the second circuit board (4), the clamping plate mechanism being installed inside the mounting plate (6); The spring-pressing mechanism is used to smoothly press the circuit board one (3) and the circuit board two (4), and the spring-pressing mechanism is installed above the circuit board two (4).

2. The copper block embedding device for a high thermal conductivity circuit board according to claim 1, characterized in that: The scraper mechanism comprises four bottom plates (8) symmetrically arranged on the top of the mounting plate (6); two symmetrically distributed support plates (9) are fixedly connected to the top of the bottom plate (8); a fixed block (10) is slidably installed inside the support plate (9); a mounting rod (11) is fixedly connected between the two fixed blocks (10) located on the same bottom plate (8); the scraper (7) is docked with the mounting rod (11) through a disassembly assembly component; a sliding cavity for limiting the sliding of the fixed block (10) and the mounting rod (11) is opened on the outer side of the support plate (9); a spring 1 (12) is fixedly connected between the fixed block (10) and the inner wall of the sliding cavity; a side of the scraper (7) away from the mounting rod (11) is an inclined structure; and a spring 2 (13) located on the outer side of the placement seat (2) is fixedly connected between the mounting plate (6) and the device base (1).

3. The copper block embedding device for a high thermal conductivity circuit board according to claim 2, characterized in that: The clamping plate mechanism comprises an adjusting plate (14) rotatably mounted on the inner side of the mounting plate (6); a movable plate (15) is fixedly connected to the outer side of the bottom plate (8); a sliding rod (16) extending into the interior of the mounting plate (6) is fixedly connected to the bottom of the movable plate (15); a sliding block (17) is fixedly connected to the outer side of the sliding rod (16); a long groove for limiting the sliding of the sliding block (17) is provided on the top of the mounting plate (6); an arc-shaped groove for limiting the sliding of the sliding block (16) is provided on the outer side of the adjusting plate (14); The top of the adjusting disk (14) is fixedly connected to a pull rod (18), the top of the mounting disk (6) is provided with an arc-shaped groove II for limiting the sliding of the pull rod (18), the top of the pull rod (18) is fixedly connected to a threaded tube (19), the top of the mounting disk (6) is provided with a rotating block (20) that matches the threaded tube (19), the bottom of the rotating block (20) is fixedly connected to a rubber ring (21), the top of the arc-shaped groove II is fixedly connected to a rubber gasket (22), and the outer side of the support plate (9) is fixedly connected to a sticking plate (23).

4. The copper block embedding device for a high thermal conductivity circuit board according to claim 3, characterized in that: The spring-pressing mechanism comprises two electric telescopic rods (24) symmetrically fixedly mounted on both sides of the device base (1); a top frame (25) is fixedly connected between the output ends of the two electric telescopic rods (24); a pressure block (26) located above the placement seat (2) is arranged below the top frame (25); a positioning rod (27) slidingly passing through the top frame (25) is fixedly connected to the top of the pressure block (26); a spring three (28) is arranged on the outer side of the positioning rod (27); the spring three (28) is fixedly mounted between the pressure block (26) and the top frame (25); pressure plates (29) are arranged on both sides of the pressure block (26); the horizontal height of the bottom of the pressure plate (29) is lower than the horizontal height of the bottom of the pressure block (26); and two symmetrically distributed pressure rods (30) are fixedly connected between the pressure plate (29) and the top frame (25).

5. The copper block embedding device for a high thermal conductivity circuit board according to claim 2, characterized in that: Four centrally symmetrical support rods (31) are fixedly connected to the outer side of the placement seat (2), and the support rods (31) slide through the installation plate (6).

6. The copper block embedding device for a high thermal conductivity circuit board according to claim 2, characterized in that: The disassembly and assembly component comprises a bolt rod (32) fixedly mounted on a side of the scraper (7) close to the mounting rod (11); an insert tube (33) for limiting insertion of the bolt rod (32) is provided on the outer side of the mounting rod (11); a nut of the bolt rod (32) contacts one end of the insert tube (33); and a side of the scraper (7) close to the bolt rod (32) is a curved surface structure corresponding to the outer side of the mounting rod (11).

7. The copper block embedding device for a high thermal conductivity circuit board according to claim 3, characterized in that: Two symmetrically distributed positioning strips (34) are fixedly connected to the outer side of the sliding block (17), and positioning slots for limiting the sliding of the positioning strips (34) are provided on the inner side of the long slot of the mounting plate (6).

8. The copper block embedding device for a high thermal conductivity circuit board according to claim 3, characterized in that: The bottom of the rotating block (20) is fixedly connected with an insertion rod (35), and the top of the threaded cylinder (19) is provided with an insertion cavity for limiting insertion of the insertion rod (35).

9. The copper block embedding device for a high thermal conductivity circuit board according to claim 4, characterized in that: The top of the positioning rod (27) is fixedly connected to a limiting block (36).

10. The copper block embedding device for a high thermal conductivity circuit board according to claim 4, characterized in that: Two symmetrically distributed rubber blocks (37) are fixedly connected to the bottom of the pressure plate (29).

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