Preparation method of bevel circuit board and bevel circuit board

Abstract

The present invention provides a method for preparing a beveled circuit board and a beveled circuit board. The method includes: providing a circuit board to be processed; determining gold finger target data according to the circuit board to be processed; determining bevel parameters and cutting parameters according to the gold finger target data; performing cutting processing on the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board; performing preprocessing on the first circuit board to obtain a preprocessed first circuit board; performing electroplating processing on the preprocessed first circuit board to obtain a second circuit board; and obtaining a target beveled circuit board according to preset detection conditions and the second circuit board. The present invention not only improves the production efficiency of the target beveled circuit board, but also can improve the product quality and reliability of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and also relates to a preparation method for a beveled circuit board and a beveled circuit board. Background Art

[0002] With the vigorous development of the electronics industry, printed circuit boards have been widely used in various computer products. The edge of the printed circuit board is the output terminal of the circuit (commonly known as the gold finger). The output terminal of the printed circuit board needs to be inserted into the computer connection port for connection. However, the edge of the output terminal is a right angle before processing, and it is difficult to insert when inserting into the connection port. Therefore, the edge of the output terminal of the printed circuit board generally needs to be cut into a bevel. However, the existing bevel processing process is complex and the production efficiency is low. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a preparation method for a beveled circuit board and a beveled circuit board to improve production efficiency.

[0004] To solve the above technical problem, the technical solution of the present invention is as follows:

[0005] In a first aspect of the present invention, a preparation method for a beveled circuit board is provided, including:

[0006] Providing a circuit board to be processed;

[0007] Determining the target data of the gold finger according to the circuit board to be processed;

[0008] Determining the bevel parameters and cutting parameters according to the target data of the gold finger;

[0009] Performing cutting processing on the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board;

[0010] Performing preprocessing on the first circuit board to obtain a preprocessed first circuit board;

[0011] Performing electroplating processing on the preprocessed first circuit board to obtain a second circuit board;

[0012] Obtaining a target beveled circuit board according to the preset detection conditions and the second circuit board.

[0013] Optionally, determining the target data of the gold finger according to the circuit board to be processed includes:

[0014] Determining the target type of the gold finger according to the circuit board to be processed and the target function data;

[0015] Determining the basic data of the gold finger according to the circuit board to be processed and the target connection data;

[0016] Determine the target data of the gold finger according to the basic data of the gold finger and the target type of the gold finger.

[0017] Optionally, determine the bevel parameters according to the target data of the gold finger, including:

[0018] Determine the bevel angle according to the target data of the gold finger;

[0019] Determine the bevel depth according to the target data of the gold finger and the bevel angle;

[0020] Determine the bevel parameters according to the bevel angle and the bevel depth.

[0021] Optionally, determine the cutting parameters according to the target data of the gold finger, including:

[0022] Obtain the cutting path and the bevel depth according to the target data of the gold finger;

[0023] Obtain the cutting speed according to the target data of the gold finger and the circuit board to be processed;

[0024] Determine the cutting depth according to the bevel depth;

[0025] Determine the cutting parameters according to the cutting path, the cutting speed and the cutting depth.

[0026] Optionally, perform cutting processing on the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board, including:

[0027] Fix the circuit board to be processed on a cutting device according to the cutting parameters and perform cutting processing to obtain a cut circuit board;

[0028] Screen the cut circuit board according to the bevel parameters to obtain a first circuit board.

[0029] Optionally, perform preprocessing on the first circuit board to obtain a preprocessed first circuit board, including:

[0030] Deburr the first circuit board to obtain a flat first circuit board;

[0031] Clean the flat first circuit board to obtain a preprocessed first circuit board.

[0032] Optionally, perform electroplating processing on the preprocessed first circuit board to obtain a second circuit board, including:

[0033] Determine the electroplating parameters according to the preprocessed first circuit board;

[0034] Perform electroplating on the pretreated first circuit board according to the electroplating parameters to obtain a second circuit board.

[0035] Optionally, determine the electroplating parameters based on the pretreated first circuit board, including:

[0036] Determine the current density based on the pretreated first circuit board and the target electroplating current;

[0037] Based on the current density, the target electroplating layer thickness, a preset coefficient, and , obtain the electroplating time;

[0038] Determine the electroplating parameters based on the current density and the electroplating time;

[0039] Where t is the electroplating time, W is the target electroplating layer thickness, J is the current density, and k is the preset coefficient.

[0040] Optionally, obtain a target beveled circuit board based on preset detection conditions and the second circuit board, including:

[0041] Perform an appearance inspection on the second circuit board to obtain an appearance inspection result;

[0042] Perform a function inspection on the second circuit board to obtain a function inspection result;

[0043] Screen the second circuit board according to the preset detection conditions, the appearance inspection result, and the function inspection result to obtain a target beveled circuit board.

[0044] In a second aspect of the present invention, a beveled circuit board is provided, and the beveled circuit board is prepared by using the preparation method of the beveled circuit board described in the first aspect.

[0045] The above solution of the present invention has at least the following beneficial effects:

[0046] In the above solution of the present invention, the target data of the gold finger is determined through the provided circuit board to be processed, and then the bevel parameters and cutting parameters are determined and the circuit board to be processed is cut. Then, through pretreatment, electroplating, and inspection of the circuit board, a target beveled circuit board is obtained, which not only improves the production efficiency of the target beveled circuit board, but also can improve the product quality and reliability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a schematic flow chart of the preparation method of the beveled circuit board in the embodiment of the present invention. DETAILED DESCRIPTION

[0048] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention can be more thoroughly understood and the scope of the present invention can be fully conveyed to those skilled in the art.

[0049] As Figure 1 shown, an embodiment of the present invention provides a method for preparing a beveled circuit board, including the following steps:

[0050] Step 101, provide a circuit board to be processed;

[0051] Step 102, determine the target data of the gold finger according to the circuit board to be processed;

[0052] Step 103, determine the bevel parameters and cutting parameters according to the target data of the gold finger;

[0053] Step 104, perform cutting processing on the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board;

[0054] Step 105, preprocess the first circuit board to obtain a preprocessed first circuit board;

[0055] Step 106, perform electroplating processing on the preprocessed first circuit board to obtain a second circuit board;

[0056] Step 107, obtain the target beveled circuit board according to the preset detection conditions and the second circuit board.

[0057] The method for preparing a beveled circuit board proposed by the embodiment of the present invention determines the target data of the gold finger by providing the circuit board to be processed, and then determines the bevel parameters and cutting parameters and performs cutting processing on the circuit board to be processed. Then, through preprocessing, electroplating processing and detection of the circuit board, the target beveled circuit board is obtained, which not only improves the production efficiency of the target beveled circuit board, but also can improve the product quality and reliability of the circuit board. In an alternative embodiment of the present invention, step 101 includes:

[0058] Step 1011, provide a circuit board;

[0059] Specifically, the provided circuit board can have multiple thicknesses and materials for subsequent selection and processing.

[0060] Step 1012, screen the circuit board to obtain a circuit board to be processed.

[0061] Specifically, the thickness range of the circuit board that can be bevelled is from 1.2 mm to 2.4 mm. If the thickness of the circuit board is not within this range, bevel processing may not be possible or the processing effect may not be ideal. Additionally, if there are contaminants on the surface of the circuit board, it may affect the quality of subsequent bevel processing and the electrical performance of the gold fingers. To withstand the mechanical stress during the bevel processing of the gold fingers and the wear during insertion and extraction, the material used for the circuit board should have good electrical conductivity and mechanical strength. Therefore, from the provided circuit boards, circuit boards with a thickness range of 1.2 mm to 2.4 mm and made of materials such as copper-clad boards or composite boards can be screened out, and they can be cleaned and processed to ensure that the surface of the circuit board is clean, flat, and free of contaminants such as oil stains and dust. The cleaned circuit boards are used as the circuit boards to be processed for subsequent processing.

[0062] In an alternative embodiment of the present invention, step 102 includes:

[0063] Step 1021, determine the target type of the gold fingers according to the circuit board to be processed and the target function data;

[0064] Specifically, making gold fingers on the circuit board can improve the efficiency and reliability of the circuit board in transmitting current and signals and improve the heat dissipation performance of the circuit board. Therefore, before cutting the circuit board, it is necessary to determine the target type, basic data, etc. of the gold fingers to facilitate accurate subsequent processing of the circuit board and improve the performance of the circuit board. The types of gold fingers include conventional gold fingers (flush fingers), long and short gold fingers (uneven fingers), segmented gold fingers (intermittent fingers), arc-shaped, straight-line or double-sided types, etc. Determining the target type of the gold fingers needs to be jointly determined according to the length, width, shape, thickness, etc. of the circuit board to be processed and the target function data of the circuit board to be processed, where the target function data refers to the functions that the circuit board required by the user has, such as the target function data of the circuit board is a storage device for high-speed data transmission, etc.

[0065] In a specific embodiment, the length of the circuit board to be processed is 150 mm, the width is 100 mm, the shape is rectangular, the thickness is 1.6 mm, and the target function data is that the network card needs to be stably connected to the slot on the motherboard to achieve the transmission of network communication data. Considering that the aspect ratio of the network card circuit board is moderate and stable connection is required, the target type of the gold fingers is conventional gold fingers (flush fingers). This type of gold fingers is arranged neatly on the edge of the circuit board, and both the length and width are the same as the rectangular pads, which can provide stable electrical connection. According to the specific application scenario and requirements, the target type of the gold fingers can be different.

[0066] Step 1022, determine the basic data of the gold fingers according to the circuit board to be processed and the target connection data;

[0067] Specifically, the basic data of the gold fingers generally includes the number, arrangement, position, length, width, etc. of the gold fingers, which can be determined according to the length, width, shape, thickness, etc. of the circuit board to be processed and the target connection data of the circuit board to be processed. The target connection data refers to the connection requirement data of the circuit board, that is, which external device the circuit board will be used to connect to, etc.

[0068] In a specific embodiment, the length of the circuit board to be processed is 200 mm, the width is 150 mm, the shape is rectangular, the thickness is 1.6 mm, and the target connection data is that the circuit board needs to perform data transmission and power supply with external devices (such as another circuit board, processor, memory, etc.). Considering the rate and stability of data transmission, the gold fingers need to have good electrical conductivity and contact reliability. The power supply part needs to withstand a large current. Therefore, the width and number of the gold fingers need to be appropriately increased. For example, according to the above target connection data, the circuit board to be processed requires 8 gold fingers for data transmission and 4 gold fingers for power supply, so the number of gold fingers is 12; the arrangement is: the data transmission gold fingers are arranged in a single row on one side of the circuit board, and the power supply gold fingers are arranged in a double row on the other side of the circuit board to disperse the current load; the position: the data transmission gold fingers are located on one edge of the circuit board, close to the data interface, and the power supply gold fingers are located on the other edge of the circuit board, close to the power interface; the length: the length of the data transmission gold fingers is 20 mm to provide sufficient contact area and stable connection, and the length of the power supply gold fingers is 25 mm to withstand a large current load; the width: the width of the data transmission gold fingers is 2 mm to ensure good electrical conductivity and signal integrity, and the width of the power supply gold fingers is 4 mm to withstand a large current load and reduce resistance.

[0069] Step 1023, determine the target data of the gold fingers according to the basic data of the gold fingers and the target type of the gold fingers.

[0070] Specifically, the gold finger target data includes the basic data of the gold finger and the target type. Based on this data, it is convenient to determine the parameters for processing the circuit board subsequently, so as to improve production efficiency and meet the expected functions and user requirements of the circuit board. Here, the gold finger target data can also include the bevel angle, and the bevel angle can be determined according to the type of the circuit board to be processed, the target material of the gold finger, the expected number of insertions and removals, and the expected service life. For example, if the type of the circuit board to be processed is a memory module, the target material of the gold finger is gold-plated copper alloy, the expected number of insertions and removals is more than 10,000 times, and the expected service life is more than 5 years, then the corresponding bevel angle is 45 degrees. The reasons are as follows: The main function of the gold finger of the memory module is to connect to the motherboard slot to achieve fast data transmission. The gold finger needs to have good electrical conductivity and insertion / removal performance to ensure the stability and reliability of data; The gold-plated copper alloy has good electrical conductivity and wear resistance. The bevel treatment can reduce the friction and wear during insertion and removal and extend the service life of the gold finger; When the expected number of insertions and removals reaches more than 10,000 times, it is required that the gold finger has good wear resistance and durability. The selection of the bevel angle needs to consider the friction and wear during insertion and removal to ensure that the gold finger can still maintain good electrical conductivity after long-term use. Based on the above reasons, 45 degrees is selected as the bevel angle of the gold finger. This angle can reduce the friction and wear during insertion and removal while ensuring good electrical conductivity, and can also provide sufficient contact area to ensure a stable connection between the gold finger and the motherboard slot. Other angles (ranging from 15 degrees to 45 degrees) can also be selected according to actual needs, such as 20 degrees, 30 degrees, etc.

[0071] In an alternative embodiment of the present invention, step 103 includes:

[0072] Step 1031, determine the bevel angle according to the gold finger target data;

[0073] Specifically, the bevel angle can be included in the gold finger target data, so the bevel angle can be directly extracted from the gold finger target data. For example, the bevel angle is 45 degrees.

[0074] Step 1032, determine the bevel depth according to the gold finger target data and the bevel angle;

[0075] Specifically, the bevel depth can be calculated according to the length and bevel angle in the gold finger target data. The formula is , where d is the bevel depth, L is the length in the gold finger target data, is the bevel angle. For example, if the length in the target data of the gold finger is 20 mm and the bevel angle is 45 degrees, the bevel depth can be calculated to be approximately 7.07 mm according to the above formula. However, considering that in actual operation, the bevel depth usually does not reach half of the gold finger length, and a certain margin needs to be left to avoid damaging the circuit structure. Therefore, the actual bevel depth may be adjusted according to specific circumstances. For example, in this embodiment, the calculated bevel depth of 7.07 mm can be adjusted to 1 mm.

[0076] Step 1033: Determine the bevel parameters according to the bevel angle and the bevel depth.

[0077] Specifically, the bevel parameters include the bevel angle and the bevel depth, which are mainly used to determine the qualified circuit board by checking whether the gold fingers on the circuit board conform to the bevel parameters after the circuit board is cut subsequently.

[0078] In an alternative embodiment of the present invention, Step 103 includes:

[0079] Step 1034: Obtain the cutting path and the bevel depth according to the target data of the gold finger.

[0080] Specifically, the bevel depth can be calculated and adjusted in the above manner. The cutting path needs to be determined according to the type, arrangement mode, and position of the gold fingers in the target data of the gold finger. If the gold fingers are arranged along the edge of the circuit board, the cutting path will be along the length direction of the gold fingers. Among them, if the type of the gold finger is a conventional gold finger (flush finger), the corresponding cutting path can be relatively simple because the gold fingers are flush, and there is no need to consider additional space or angle, as long as it is ensured that the cutting path does not damage the gold fingers; if the type of the gold finger is a long and short gold finger (uneven finger), special attention needs to be paid to the length difference of the gold fingers to ensure that the cutting path does not shorten or damage any gold fingers to adapt to the unevenness of the gold fingers; if the type of the gold finger is a segmented gold finger (intermittent finger), the cutting path needs to avoid the intermittent part of the gold fingers to ensure the integrity and function of the gold fingers. At this time, additional support structures can be designed at the intermittent part of the gold fingers to prevent the gold fingers from being damaged during the cutting process. For example, if the arrangement mode of the gold fingers is a single-row arrangement, the cutting path can be relatively linear because the gold fingers are arranged only on one side, and it is necessary to ensure that the cutting path does not affect the arrangement and position of the gold fingers; the cutting path needs to avoid the position of the gold fingers to prevent damage, and additional support structures or cutting paths can be designed around the gold fingers to ensure the safety of the gold fingers.

[0081] Step 1035: Obtain the cutting speed according to the target data of the gold finger and the circuit board to be processed.

[0082] Specifically, the cutting speed needs to be determined according to the material of the circuit board to be processed, the thickness of the gold fingers in the gold finger target data, the material and performance of the cutting tool, etc. In a specific embodiment, the material of the circuit board to be processed is an FR-4 epoxy resin fiberglass board, the thickness of the gold fingers in the gold finger target data is 15 μm, the material of the cutting tool is a diamond-coated blade, and the performance of the cutting tool is high hardness, high wear resistance, and high cutting efficiency. The corresponding cutting speed can be 1000 revolutions per minute (RPM) to ensure the stability and accuracy of the cutting process, avoid cracks or damage to the circuit board to be processed during the cutting process, avoid unevenness in the thickness of the gold fingers, and ensure the stability and economy of the cutting process.

[0083] Step 1036: Determine the cutting depth according to the bevel depth.

[0084] Specifically, the cutting depth needs to be equal to or greater than the bevel depth to ensure that the bevel of the gold finger can be completely formed. If the bevel depth is 1 mm, the cutting depth should also be set to 1 mm or slightly larger (such as 1.1 mm) to ensure the integrity of the cutting.

[0085] Step 1037: Determine the cutting parameters according to the cutting path, the cutting speed, and the cutting depth.

[0086] Specifically, the cutting parameters include the cutting path, the cutting speed, and the cutting depth, and are used for subsequent accurate cutting of the circuit board to obtain a circuit board that meets the expected requirements.

[0087] In an alternative embodiment of the present invention, step 104 includes:

[0088] Step 1041: Fix the circuit board to be processed on a cutting device according to the cutting parameters for cutting treatment to obtain a cut circuit board.

[0089] Specifically, the cutting parameters can be format-converted to obtain cutting control parameters that conform to the cutting device (such as a drill and router or a laser cutting machine). The cutting control parameters are input into the controller of the cutting device. The circuit board to be processed is placed on the cutting base plate of the cutting device, and the circuit board to be processed is fixed firmly using a fixture or an adhesive to avoid offset or shaking during the cutting process. Then, the cutting device is started to perform cutting treatment on the circuit board to be processed, and gold fingers are formed on the circuit board to be processed to facilitate subsequent electroplating and other treatments of the gold fingers.

[0090] Step 1042: Screen the cut circuit board according to the bevel parameters to obtain a first circuit board.

[0091] Specifically, a protractor can be vertically placed on the hypotenuse of the gold finger on the cut circuit board to ensure close contact between the protractor and the surface of the gold finger, and the angle value displayed by the protractor is read. If the angle value is consistent with the hypotenuse angle of the hypotenuse parameter or the error is within the preset angle error range, it indicates that the cut circuit board meets the expected requirements; use a microscope or optical projector to observe the cutting edge of the gold finger on the cut circuit board, ensure that the observation angle and lighting conditions are appropriate, and precisely measure the depth of the gold finger through the magnification function of the microscope or projector. If the depth of the gold finger is consistent with the hypotenuse depth of the hypotenuse parameter or the error is within the preset depth error range, it indicates that the cut circuit board meets the expected requirements; if both the angle value and depth of the gold finger on the cut circuit board meet the expected requirements, the corresponding cut circuit board is the first circuit board. Otherwise, the cut circuit board needs to be reworked, repaired, etc. to improve the product qualification rate.

[0092] In an alternative embodiment of the present invention, step 105 includes:

[0093] Step 1051, deburr the first circuit board to obtain a flat first circuit board;

[0094] Specifically, a deburring tool can be used to deburr the hypotenuse of the gold finger on the first circuit board to ensure that the hypotenuse is flat, smooth, without protrusions or defects, and prevent the safety of the circuit board during use from being affected due to burrs.

[0095] Step 1052, clean the flat first circuit board to obtain a pre-treated first circuit board.

[0096] Specifically, a cleaning agent is used to clean the gold finger on the flat first circuit board to remove oil stains, dust, and impurities on the surface, and ensure that the surface cleanliness of the gold finger meets the preset cleanliness to improve the effect during subsequent electroplating. Here, a cleaning agent such as sulfuric acid can be used to wash off the oxide layer on the surface of the gold finger, and then the surface of the gold finger is cleaned with water and deionized water to ensure no oil stains, dust, and impurities.

[0097] In an alternative embodiment of the present invention, step 106 includes:

[0098] Step 1061, determine electroplating parameters according to the pre-treated first circuit board;

[0099] Specifically, the electroplating parameters mainly include current density and electroplating time. The current density and electroplating time will affect the electroplating effect, and can be determined according to the surface area of the gold finger on the pre-treated first circuit board, etc.

[0100] Step 1062, perform electroplating treatment on the pre-treated first circuit board according to the electroplating parameters to obtain a second circuit board.

[0101] Specifically, electroplating the pre-treated first circuit board can form a gold layer on the surface of the gold fingers, thereby significantly improving the electrical conductivity, corrosion resistance, wear resistance of the gold fingers, as well as improving the appearance and texture, reducing wear and damage during plugging and unplugging, reducing signal loss and interference, extending the service life of the circuit board, and improving reliability. Here, the pre-treated first circuit board can be placed in an electroplating tank to ensure that the gold fingers are completely immersed in the electroplating solution in the electroplating tank, the power is turned on, and electroplating is carried out according to the current density and electroplating time in the electroplating parameters. After electroplating is completed, the surface of the circuit board can be cleaned with deionized water to remove the residual electroplating solution and impurities.

[0102] In an alternative embodiment of the present invention, step 1061 includes:

[0103] Step 10611, determining the current density according to the pre-treated first circuit board and the target electroplating current;

[0104] Specifically, the current density can be calculated according to the surface area of the gold fingers on the pre-treated first circuit board, the target electroplating current, and the formula where J is the current density, M is the surface area of the gold fingers, and S is the target electroplating current. If the material of the gold fingers on the pre-treated first circuit board is copper and the surface area is 2 , and the target electroplating current is 0.5 A, then the current density .

[0105] Step 10612, obtaining the electroplating time according to the current density, the target electroplating layer thickness, the preset coefficient, and ;

[0106] Specifically, since the electroplating time is usually in minutes or hours, and a certain electroplating current and time need to be maintained during electroplating, the actual electroplating time can be adjusted according to the performance of the electroplating equipment and the requirements of the electroplating solution, such as adjusting the electroplating time to 5 minutes to 2 hours, specifically depending on the performance of the electroplating equipment and the required electroplating layer thickness.

[0107] Step 10613, determining the electroplating parameters according to the current density and the electroplating time;

[0108] where t is the electroplating time, W is the target electroplating layer thickness (the required electroplating layer thickness), J is the current density, and k is the preset coefficient (such as 0.6).

[0109] Specifically, the electroplating parameters include the current density and the electroplating time, and can also include the pH value, temperature, etc. of the electroplating solution.

[0110] In an alternative embodiment of the present invention, step 107 includes:

[0111] Step 1071: Conduct an appearance inspection on the second circuit board to obtain an appearance inspection result;

[0112] Specifically, during the appearance inspection, it is necessary to ensure that the inspection environment has sufficient light and is clean, to avoid dust or debris interfering with the appearance inspection result. Use tools such as magnifying glasses or microscopes to conduct an appearance inspection on the second circuit board; a standard (i.e., a circuit board that meets the preset inspection conditions) circuit board appearance inspection template can also be used as a comparison and reference.

[0113] In a specific embodiment, when the light intensity is in the range of 800 to 1200 Lux, it is necessary to detect whether the surfaces of the second circuit board and the gold fingers are flat, smooth, and have no obvious scratches, depressions, or protrusions. Use a magnifying glass or microscope to detect whether the edges of the gold fingers on the second circuit board are smooth, have no burrs or rough edges, whether the plating is uniform, whether there is exposed copper, exposed nickel, or plating peeling, and whether there are defects such as oxidation, stains, or residual glue on the surface. Use measuring tools to detect whether the length, width, thickness, and position of the gold fingers on the second circuit board meet the corresponding length, width, thickness, and position in the gold finger target data. And record each appearance inspection result in the appearance inspection form of the appearance inspection result. The appearance inspection result can include information such as defect type, position, size, and quantity. For example, an appearance inspection result is: There are 2 obvious scratches on the gold fingers of the second circuit board, 1 area has burrs, the quantity is 5, the length is 20 mm, and the width is 5 mm.

[0114] Step 1072: Conduct a function inspection on the second circuit board to obtain a function inspection result;

[0115] Specifically, the function inspection of the second circuit board can be carried out in the following ways: Use a resistance tester to measure the resistance value when the gold fingers on the second circuit board are in contact with other electronic devices; Immerse the gold fingers on the second circuit board in a salt spray test chamber for a certain period of time for corrosion resistance testing; Use a multimeter to test the conductivity of the gold fingers, including the transmission of current and voltage; Conduct a peel strength test on the gold fingers on the second circuit board to check the adhesion between the plating and the substrate. Record each inspection result in the function inspection result. For example, a specific function inspection result is: The resistance value when the gold fingers on the second circuit board are in contact with other electronic devices, the corrosion resistance result, the transmission of current and voltage, the peel strength result, etc.

[0116] Step 1073: Screen the second circuit board according to the preset inspection conditions, the appearance inspection result, and the function inspection result to obtain a target beveled-edge circuit board.

[0117] Specifically, the preset detection conditions are the criteria for screening the second circuit board. Only the second circuit board that fully meets the preset detection conditions can be used as the target beveled circuit board, that is, the qualified product. Here, the preset detection conditions may include: the appearance detection conditions are that the number of scratches on the gold fingers is less than 1, there are no burrs, the number of gold fingers is consistent with the number in the gold finger target data, the length of the gold fingers is consistent with the length in the gold finger target data, the width of the gold fingers is consistent with the width in the gold finger target data, the thickness of the gold fingers is consistent with the thickness in the gold finger target data, the position of the gold fingers is consistent with the position in the gold finger target data, etc.; the function detection conditions are the standard resistance value when the gold fingers on the second circuit board are in contact with other electronic devices, good corrosion resistance, good transmission of current and voltage, standard peel strength, etc. If the appearance detection result meets the appearance detection conditions and the function detection result meets the function detection conditions, the corresponding second circuit board can be used as a qualified product, that is, the target beveled circuit board. In this way, the second circuit boards that do not meet the preset detection conditions can be reworked and repaired until they are qualified, which is beneficial to improving the product qualification rate and ensuring product quality.

[0118] A specific embodiment of the method for preparing the beveled circuit board according to the embodiment of the present invention includes:

[0119] Step 111, providing a circuit board to be processed;

[0120] Screen the provided multiple circuit boards, and select the circuit boards that meet the circuit board thickness range of 1.2 mm to 2.4 mm and meet the preset materials, etc., as the circuit boards to be processed for subsequent processing to improve the effect of subsequent processing.

[0121] Step 112, determining the gold finger target data;

[0122] The gold finger target data includes the target type of the gold fingers, such as conventional gold fingers (flush fingers), long and short gold fingers (uneven fingers), segmented gold fingers (intermittent fingers), arc-shaped, straight-shaped or double-sided, etc.; it also includes the basic data of the gold fingers, such as the number, arrangement, position, length, width, etc. of the gold fingers; it may also include the bevel angle.

[0123] Step 113, determining the bevel parameters and cutting parameters;

[0124] According to the gold finger target data, determine bevel parameters such as the bevel angle and bevel depth for subsequent inspection of whether the gold fingers on the circuit board meet the bevel parameters after cutting the circuit board; in addition, it is also necessary to determine cutting parameters such as the cutting path, cutting speed, and cutting depth according to the gold finger target data and the circuit board to be processed, so that the cutting equipment can cut the circuit board according to the cutting parameters to form gold fingers on the circuit board.

[0125] Step 114, cutting process;

[0126] After converting the format of the cutting parameters, input them into the controller of the cutting device, so that the cutting device performs cutting on the fixed circuit board to be processed, and then detects it according to the bevel parameters to obtain the first circuit board.

[0127] Step 115, pretreatment;

[0128] Deburr the first circuit board to prevent the burrs from affecting the safety during the use of the circuit board; then clean the circuit board to ensure that there is no oil, dust and impurities.

[0129] Step 116, electroplating process;

[0130] According to the determined electroplating parameters such as current density and electroplating time, put the first circuit board into the electroplating solution in the electroplating tank for electroplating. After electroplating, the surface of the circuit board can be cleaned with deionized water to remove the residual electroplating solution and impurities.

[0131] Step 117, detect to obtain the target bevel circuit board.

[0132] Perform appearance inspection and function inspection on the electroplated circuit board. Only the circuit boards that fully meet the preset inspection conditions can be packed as qualified products and sent to customers, improving customer satisfaction and product quality.

[0133] In the preparation method of the bevel circuit board according to the embodiment of the present invention, the corresponding processing parameters are ensured to meet the expected requirements or the expected functions of the circuit board in each step, and multiple inspections and screenings are carried out, which can greatly improve the quality and qualification rate of the circuit board, and improve product reliability and user satisfaction. The bevel circuit board in this embodiment mainly refers to the circuit board obtained by beveling the gold finger part on the circuit board. The gold finger refers to the metal interface processed on the edge of the circuit board for connection and communication in electronic products. The circuit board with beveled gold fingers can increase the contact area, reduce the contact resistance, and improve the insertion and extraction force and contact stability of the circuit board.

[0134] An embodiment of the present invention also provides a bevel circuit board, which is prepared by using the preparation method of the bevel circuit board according to any one of the above embodiments.

[0135] The bevel circuit board of this embodiment is prepared by using the preparation method of the bevel circuit board according to any one of the above embodiments, and has the advantages of simple preparation method and high product qualification rate.

[0136] It should be noted that in the device and method of the present invention, obviously, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. Moreover, the steps of performing the above series of processes can naturally be executed in chronological order according to the described order, but it is not necessary to be executed in chronological order. Some steps can be executed in parallel, crosswise, or independently of each other.

[0137] It should be noted that in the above embodiments, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including such element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the above implementation manners is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. For example, the described methods can be executed in an order different from that described, and various steps can also be added, omitted, or combined. Additionally, the features described with reference to certain examples can be combined in other examples.

[0138] The above is the preferred implementation manner of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle described in the present invention, several improvements and refinements can still be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for preparing a beveled edge circuit board, characterized in that: include: Providing circuit boards to be processed; Determine the gold finger target data according to the circuit board to be processed; Determine the bevel parameters and cutting parameters according to the golden finger target data; Cutting the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board; Preprocessing the first circuit board to obtain a preprocessed first circuit board; Performing electroplating on the pretreated first circuit board to obtain a second circuit board; According to the preset detection conditions and the second circuit board, a target beveled edge circuit board is obtained; Wherein, determining the gold finger target data according to the circuit board to be processed includes: According to the circuit board to be processed and the target function data, the target type of the gold finger is determined; the target type of the gold finger includes flush gold finger, long and short gold finger, segmented gold finger, arc type, straight line type or double-sided type, and the target type of the gold finger is determined according to the length, width, shape, thickness of the circuit board to be processed and the target function data of the circuit board to be processed, wherein the target function data refers to the function of the circuit board required by the user; According to the circuit board to be processed and the target connection data, the basic data of the gold finger is determined; the basic data of the gold finger includes the number, arrangement, position, length and width of the gold finger; wherein the length of the circuit board to be processed is 200mm, the width is 150mm, the shape is rectangular, and the thickness is 1.6mm; the target connection data is that the circuit board needs to perform data transmission and power supply with an external device; according to the target connection data, the circuit board to be processed requires 8 gold fingers for data transmission and 4 gold fingers for power supply, then the number of gold fingers is 12; the arrangement of the gold fingers is as follows: the data transmission gold finger is arranged in a single row and is located on one side of the circuit board to be processed, and the power supply gold finger is arranged in a double row and is located on the other side of the circuit board to be processed; the data transmission gold finger is located on one side edge of the circuit board to be processed, close to the data interface, and the power supply gold finger is located on the other side edge of the circuit board, close to the power interface; the length of the data transmission gold finger is 20mm, and the length of the power supply gold finger is 25mm; the width of the data transmission gold finger is 2mm, and the width of the power supply gold finger is 4mm; Determine the cheating target data according to the cheating basic data and the cheating target type; Wherein, determining the bevel parameters according to the golden finger target data includes: Determine the bevel angle according to the golden finger target data; According to the golden finger target data and the bevel angle, the bevel depth is determined; wherein, according to Get the hypotenuse depth, where d is the hypotenuse depth and L is the length in the gold finger target data. is the hypotenuse angle; Determining a bevel parameter according to the bevel angle and the bevel depth; Wherein, determining the cutting parameters according to the golden finger target data includes: According to the gold finger target data, a cutting path and a bevel depth are obtained; wherein the cutting path is determined according to the type, arrangement and position of the gold finger in the gold finger target data. If the gold finger is arranged along the edge of the circuit board to be processed, the cutting path is carried out along the length direction of the gold finger; if the type of the gold finger is a flush gold finger, the corresponding cutting path is a cutting path that will not damage the gold finger; if the type of the gold finger is a long and short gold finger, according to the length difference of the gold finger, it is ensured that the cutting path will not shorten or damage any gold finger; if the type of the gold finger is a segmented gold finger, the cutting path needs to avoid the discontinuous part of the gold finger; if the arrangement of the gold finger is a single row arrangement, the cutting path is linearized; Obtaining a cutting speed according to the gold finger target data and the circuit board to be processed; Determining a cutting depth according to the bevel depth; Determining cutting parameters according to the cutting path, the cutting speed and the cutting depth; The method of cutting the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board includes: According to the cutting parameters, the circuit board to be processed is fixed on the cutting equipment for cutting to obtain the cut circuit board; The cut circuit boards are screened according to the bevel edge parameters to obtain a first circuit board.

2. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: Preprocessing the first circuit board to obtain a preprocessed first circuit board includes: Deburring the first circuit board to obtain a flat first circuit board; The flat first circuit board is cleaned to obtain a pre-treated first circuit board.

3. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: The pre-treated first circuit board is electroplated to obtain a second circuit board, comprising: Determining electroplating parameters according to the pretreated first circuit board; The pre-treated first circuit board is electroplated according to the electroplating parameters to obtain a second circuit board.

4. The method for preparing a beveled edge circuit board according to claim 3, characterized in that: Determining electroplating parameters according to the pretreated first circuit board includes: Determining a current density according to the pretreated first circuit board and a target electroplating current; According to the current density, target electroplating layer thickness, preset coefficient and , get the electroplating time; Determining electroplating parameters according to the current density and the electroplating time; Wherein, t is the electroplating time, W is the target electroplating layer thickness, J is the current density, and k is the preset coefficient.

5. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: According to the preset detection conditions and the second circuit board, a target beveled edge circuit board is obtained, including: Performing appearance inspection on the second circuit board to obtain an appearance inspection result; Performing a function test on the second circuit board to obtain a function test result; The second circuit board is screened according to the preset detection conditions, the appearance detection result and the function detection result to obtain a target bevel edge circuit board.

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