Direct contact type heat dissipation module

Abstract

The invention discloses a direct contact type heat dissipation module. The direct contact type heat dissipation module comprises at least two heat pipes, at least one fin group and a heat dissipation plate, the heat pipes belonging to the rectangular pipe are arranged side by side, and a first seamless contact surface is formed on the front surfaces of the heat pipes; the heat dissipation plate is provided with at least one opening, the heat pipes and the fin set are arranged on one face and the other face of the heat dissipation plate respectively, the first seamless contact face makes direct contact with the electronic heating element, and the back faces of the heat pipes make direct contact with the fin set through the openings. Therefore, the effect of improving the heat dissipation efficiency on the premise of avoiding the use of a uniform temperature plate can be achieved.

Description

Technical Field

[0001] The invention relates to a heat dissipation module, in particular to a direct-contact heat dissipation module. Background Art

[0002] With regard to heat dissipation of electronic heating elements in electronic devices, as the performance requirements are getting higher and higher (such as electronic devices used in gaming), the heat generated by the electronic heating elements is also getting higher and higher, and the existing heat dissipation modules are no longer able to bear the load.

[0003] For example, although the heat dissipation efficiency can be improved by arranging two heat pipes side by side in principle, after the two heat pipes are arranged side by side, groove-shaped gaps will inevitably be formed on the front and back sides, which will cause gaps between the front sides of the two heat pipes and the electronic heating elements that are not attached to each other, resulting in poor heat dissipation efficiency. Even if you want to add fins on the back sides of the two heat pipes to dissipate heat, there will be a carrier (such as a temperature equalizer) between the fins and the back sides of the heat pipes, resulting in the heat pipes having to pass through the carrier to transfer heat to the fins, which cannot effectively improve the heat dissipation efficiency.

[0004] Furthermore, the existing heat dissipation module uses a large temperature-averaging plate to improve the heat dissipation efficiency, but the use of the temperature-averaging plate requires at least three heat dissipation fin groups and fans. The structure is too complicated and difficult to manufacture, and even requires a lot of troublesome strengthening processing to make the structural strength barely pass. Summary of the invention

[0005] In view of the deficiencies in the prior art, an object of the present invention is to provide a direct-contact heat dissipation module, in which the front sides of at least two heat pipes arranged side by side jointly form a first seamless contact surface for directly contacting an electronic heating element, and the back sides of these heat pipes can also directly contact a fin group through openings provided in a heat dissipation plate, thereby improving the heat dissipation efficiency.

[0006] In order to achieve the above-mentioned purpose, the present invention provides a direct-contact heat dissipation module for providing heat dissipation for an electronic heating element and comprising: at least two heat pipes, each of which is a rectangular tube and has a front side and a back side opposite to each other, the at least two heat pipes are arranged side by side, and the front sides of the at least two heat pipes jointly form a first seamless contact surface; at least one fin group; and a heat sink having at least one opening, the at least two heat pipes being arranged on one side of the heat sink, the at least one fin group being arranged on the other side of the heat sink, the first seamless contact surface directly contacting the electronic heating element, and the back sides of the at least two heat pipes both directly contacting the at least one fin group via the at least one opening.

[0007] It can be seen from the above technical solution that the present invention has the following effects: by directly contacting the electronic heating element through the front side of the heat pipe, the heat of the electronic heating element can be directly transferred to the heat pipe, and the back side of the heat pipe can also directly contact the fin group through the opening, so that the heat transferred to the heat pipe can also be directly transferred to the fin group, thereby improving the heat dissipation efficiency without using a temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a three-dimensional exploded view of the first embodiment of the heat dissipation module of the present invention when viewed from above;

[0009] Figure 2 It is a three-dimensional exploded view of the first embodiment of the heat dissipation module of the present invention when viewed from above;

[0010] Figure 3 A three-dimensional composite diagram of the first embodiment of the heat dissipation module of the present invention when viewed upside down;

[0011] Figure 4 FIG1 is a cross-sectional schematic diagram of a first embodiment of a heat dissipation module of the present invention (I);

[0012] Figure 5 FIG2 is a cross-sectional schematic diagram of the first embodiment of the heat dissipation module of the present invention;

[0013] Fig. 6A Schematic cross-sectional view of the first embodiment of the heat dissipation module of the present invention (III);

[0014] Figure 6B is a cross-sectional schematic diagram of a second embodiment of a heat dissipation module of the present invention;

[0015] Figure 7 is a cross-sectional schematic diagram of a third embodiment of a heat dissipation module of the present invention;

[0016] Figure 8 is a perspective exploded view of a fourth embodiment of a heat dissipation module of the present invention when viewed from above;

[0017] Fig. 9 It is a three-dimensional exploded view of the heat dissipation plate and two reinforcing beams in a fourth embodiment of the heat dissipation module of the present invention when viewed from above;

[0018] Fig.10 is a three-dimensional diagram of a fourth embodiment of a heat dissipation module of the present invention when viewed from above;

[0019] Fig.11 The fourth embodiment of the heat dissipation module of the present invention is based on Fig.10 A cross-sectional schematic diagram of (a);

[0020] Fig.12 The fourth embodiment of the heat dissipation module of the present invention is based on Fig.10 Schematic cross-sectional view (II);

[0021] Fig.13 is a perspective exploded view of a fifth embodiment of a heat dissipation module of the present invention when viewed from above;

[0022] Fig.14 It is a three-dimensional exploded view of the heat dissipation plate and two reinforcing beams in a fifth embodiment of the heat dissipation module of the present invention when viewed from above;

[0023] Fig.15 A three-dimensional composite diagram of a fifth embodiment of a heat dissipation module of the present invention when viewed from above;

[0024] Fig.16 The fifth embodiment of the heat dissipation module of the present invention is based on Fig.15 A cross-sectional schematic diagram of

[0025] Among them, the reference numerals

[0026] 100a, 100b, 100d, 100e-heat dissipation module;

[0027] 1- Fin set;

[0028] 2- Heat pipe;

[0029] 21-front;

[0030] 22-back side;

[0031] 23-one end;

[0032] 24- other end;

[0033] 3- heat sink;

[0034] 31- one side;

[0035] 32-the other side;

[0036] 33,34-lateral;

[0037] 35-opening;

[0038] 36,38-First avoidance section;

[0039] 361-bending structure;

[0040] 37-Second avoidance section;

[0041] 371-bending structure;

[0042] 381-Gap;

[0043] 4-Reinforcement beam;

[0044] 6a-first amplification fin group;

[0045] 6b-second amplification fin group;

[0046] 8-Fix the components;

[0047] 81-fixing element;

[0048] 811,812-Fixed section;

[0049] 82- elastic element;

[0050] 83-ring piece;

[0051] 900-circuit board;

[0052] 9-Electronic heating element;

[0053] F1-first seamless contact surface;

[0054] F2-second seamless contact surface;

[0055] T-Extension end. DETAILED DESCRIPTION

[0056] The detailed description and technical contents of the present invention are described as follows with reference to the accompanying drawings. However, the accompanying drawings are only provided for reference and description and are not intended to limit the present invention.

[0057] The present invention provides a direct contact heat dissipation module, which is mainly capable of Fig. 6A As shown, the heat pipe 2 is directly in contact with the electronic heating element 9, and can even be Figure 6B As shown, the heat pipe 2 is directly in contact with the electronic heating element 9 and the fin group 1 at the same time. Figures 1 to 6A The first embodiment is shown. Figure 6B and Figure 7 The second and third embodiments are shown respectively. Figures 8 to 12 A fourth embodiment is shown. Figures 13 to 16 The fifth embodiment is shown.

[0058] like Figures 1 to 6A As shown, the direct contact heat dissipation module (hereinafter referred to as heat dissipation module) 100a of the present invention is used to provide heat dissipation for at least one electronic heating element 9, and includes: a fin group 1, at least two heat pipes 2 and a heat dissipation plate 3.

[0059] The present invention does not limit the number of the fin groups 1 , and the number may be one or more. In this embodiment, two fin groups 1 are taken as an example for description.

[0060] Each heat pipe 2 is a rectangular tube and has a front side 21 and a back side 22 opposite to each other. Each long strip heat pipe 2 also has an end 23 and another end 24 opposite to each other. The present invention does not limit the number of heat pipes 2, and there can be more than two heat pipes 2 arranged side by side. In this embodiment, multiple heat pipes 2 are arranged side by side. Figure 5 and Fig. 6AAs shown, the front sides 21 of one section (eg, the middle section) of all the heat pipes 2 together form a first seamless contact surface F1, that is, the front sides 21 of any two adjacent heat pipes 2 are seamlessly adjacent to each other.

[0061] The heat sink 3 has one side 31 and another side 32 opposite to each other and is provided with at least one opening 35, the opening 35 passing through the one side 31 and the other side 32. The present invention does not limit the number of the openings 35, which may be one or more. In this embodiment, two openings 35 are used as an example for explanation. Through the two openings 35, the two opposite sides (as shown in the figure, the two short sides of the heat sink 3) 33, 34 of the heat sink 3 are respectively adjacent to the two openings 35.

[0062] like Figures 2 to 6A As shown, all the heat pipes 2 arranged side by side are arranged with their back sides 22 of the middle sections on one side 31 of the heat dissipation plate 3, and the back sides 22 of one end 23 and the back sides 22 of the other end 24 of all the heat pipes 2 are exposed corresponding to the two openings 35. Each fin group 1 is arranged on the other side 32 of the heat dissipation plate 3 corresponding to the position of each opening 35, so that the back sides 22 of one end 23 and the back sides 22 of the other end 24 of all the heat pipes 2 directly contact the two fin groups 1 through the two openings 35. As for the first seamless contact surface F1 formed by the front sides 21 of the middle sections of all the heat pipes 2, it directly contacts the electronic heating element 9.

[0063] It should be noted that if Fig. 6A As shown, the electronic heating element 9 is disposed on a circuit board 900. The number of the electronic heating element 9 can be one (as shown in the figure) or two (not shown in the figure, for example, one is a CPU (central processing unit) and the other is a GPU (graphics processing unit)), which is not limited in the present invention, and one is used as an example for explanation in this embodiment.

[0064] In addition, in one embodiment, the present invention can also fix the heat dissipation module 100a through multiple fixing components 8, and further fix the heat dissipation module 100a on the aforementioned circuit board 900. Each fixing component 8 includes a fixing element 81 and an elastic element 82. The rod portion (not marked with an element symbol) of the fixing element 81 is inserted into the fin group 1 and the heat dissipation plate 3 and forms a fixed section 811 at one end. Each fixing element 81 is fixed to the circuit board 900 with its fixed section 811, and the elastic element 82 is sleeved on the rod portion of the fixing element 81 and elastically supported between the heat dissipation plate 3 and the cap portion (not marked with an element symbol) of the fixing element 81. In this way, the first seamless contact surface F1 of all heat pipes 2 can elastically abut against the electronic heating element 9.

[0065] Therefore, since all the heat pipes 2 directly contact the electronic heating element 9 through the first seamless contact surface F1 formed by the front side 21 thereof, there is no gap or almost no gap at the joint between the first seamless contact surface F1 and the electronic heating element 9, which is conducive to heat conduction; and, all the heat pipes 2 also directly contact the fin group 1 through the opening 35 through the back side 22 thereof, so the heat generated by the electronic heating element 9 will be directly transferred to the heat pipe 2, and then directly transferred from the heat pipe 2 to the fin group 1 for heat dissipation, so that the heat dissipation efficiency can be improved without using a temperature equalizing plate.

[0066] like Figure 6B The second embodiment of the present invention is shown in FIG. 1 . In the second embodiment, the heat dissipation module 100b of the present invention is substantially the same as the first embodiment, except that the back surfaces 22 of two sections (e.g., the head section and the tail section) of all the heat pipes 2 form a second seamless contact surface F2. In this way, all the heat pipes 2 of the second embodiment also directly contact the fin group 1 through the opening 35 with the second seamless contact surface F2 formed by the back surfaces 22, so that the joint between the second seamless contact surface F2 and the fin group 1 has no gap or almost no gap, which is conducive to heat conduction, thereby further improving the heat dissipation efficiency.

[0067] like Figure 7 The third embodiment of the present invention is shown in FIG. The third embodiment is substantially the same as the first embodiment, with the difference being the parallel arrangement of the heat pipes 2, as described below.

[0068] All the heat pipes 2 in the first or second embodiment are arranged side by side (see Fig. 6A and Figure 6B ) to reduce the overall height of the heat dissipation modules 100a, 100b and thus be suitable for thinner electronic devices. Figure 7 In the third embodiment shown, all the heat pipes 2 are arranged upright and side by side, and the front sides 21 of one section (eg, the middle section) of the entire section of all the heat pipes 2 also jointly form a first seamless contact surface F1.

[0069] like Figures 8 to 12 FIG. 1 is a fourth embodiment of a heat dissipation module 100d of the present invention. The fourth embodiment is substantially the same as the first embodiment, with the difference only in the heat pipe 2 and the heat dissipation plate 3, as described in detail below.

[0070] In the fourth embodiment, at least one end of all the heat pipes 2 is integrally extended and together form an extended end portion T, which may be one end or both ends. The present invention is not limited to this. In this embodiment, both ends (one end 23 and the other end 24) form an extended end portion T as an example for explanation.

[0071] At least one side of the heat sink 3 forms a avoidance portion corresponding to the extended end portion T, which may be one side 33 (or 34) or both side sides 33 and 34. The present invention is not limited to this. In this embodiment, the two side sides 33 and 34 form a first avoidance portion 36 and a second avoidance portion 37 corresponding to the two extended end portions T, respectively. The two extended end portions T are respectively accommodated in the first avoidance portion 36 and the second avoidance portion 37 (in other words, the extended end portion T does not protrude from the heat sink 3), and the two extended end portions T are also respectively attached to the first avoidance portion 36 and the second avoidance portion 37 for heat conduction.

[0072] The present invention does not limit the structure of the first and second avoidance portions 36 and 37. In this embodiment, the first and second avoidance portions 36 and 37 are both bent structures 361 and 371, and the bent structures 361 and 371 are sandwiched and attached between the extended end portion T and the fin set 1 for heat conduction. The bent structures 361 and 371 can be, for example, U-shaped bends, that is, the required bent structures 361 and 371 are bent from one side 31 of the heat sink 3 toward the other side 32.

[0073] In addition, since the two sides 33 and 34 of the heat sink 3 are respectively formed with the first avoidance portion 36 and the second avoidance portion 37, it is possible that the structural strength is weakened at the corresponding positions of the first avoidance portion 36 and the second avoidance portion 37 (although it is weakened, the structural strength of the present invention is still better than that of the structure using the temperature equalizing plate). In order to strengthen this weakening, the fourth embodiment of the present invention also includes two reinforcing beams 4, as described below.

[0074] The two reinforcing beams 4 are sandwiched and fixed between the heat sink 3 and the fin assembly 1 at positions corresponding to the first avoidance portion 36 and the second avoidance portion 37 .

[0075] It should be noted that each fixing assembly 8 of the fourth embodiment further includes a ring sheet 83. Fig.12 As shown, the fixing section (necked section) 812 of each fixing element 81 is inserted from the top surface of the circuit board 900 and protrudes from the bottom surface of the circuit board 900 , and the ring piece 83 is snapped into the fixing section 812 and abuts against the bottom surface of the circuit board 900 .

[0076] like Figures 13 to 16 The fifth embodiment is substantially the same as the fourth embodiment, except that the heat pipe 2 and the heat sink 3 are different, and further includes a first amplified fin group 6a and a second amplified fin group 6b, as described below.

[0077] In the fifth embodiment, the first avoidance portion 38 formed on at least one side 33 of the heat dissipation plate 3 can be a notch 381 , that is, the notch 381 is opened on the side 33 ; and the second avoidance portion 37 formed on the other side 34 can still be the aforementioned bending structure 371 .

[0078] At least one end of all the heat pipes 2 is integrally extended and forms an extended end portion T, which may be one end or both ends. The present invention is not limited to this. In this embodiment, both ends (one end 23 and the other end 24) form an extended end portion T as an example for explanation, and the extended length of one of the two extended end portions T is much greater than the extended length of the other of the two extended end portions T.

[0079] In this way, the longer extension ends T of all heat pipes 2 will extend beyond the periphery of the heat sink 3 through the first avoidance portion 38, and all front faces 21 and back faces 22 of all heat pipes 2 extending beyond the periphery of the heat sink 3 are respectively attached to or even directly contact the first amplified fin group 6a and the second amplified fin group 6b, that is, they are sandwiched by the first amplified fin group 6a and the second amplified fin group 6b, so as to maximize the heat dissipation efficiency. As for the shorter extension ends T of all heat pipes 2, they are accommodated in the second avoidance portion 37 (in other words, the shorter extension ends T do not protrude from the heat sink 3) and are attached to the second avoidance portion 37 for heat conduction.

[0080] In addition, in other embodiments not shown in the drawings, since the heat dissipation efficiency of all the aforementioned embodiments of the present invention is better than the heat dissipation efficiency of using a temperature vapor chamber, the present invention can simultaneously dissipate heat for two electronic heating elements 9 (for example, one is a CPU and the other is a GPU).

[0081] In summary, the present invention directly contacts the electronic heating element through the front side of the heat pipe, so that the heat of the electronic heating element can be directly transferred to the heat pipe. In addition, the back side of the heat pipe can directly contact the fin group through the opening, so that the heat transferred to the heat pipe can also be directly transferred to the fin group. Therefore, the heat dissipation efficiency can be improved without using a temperature equalizer.

[0082] The above-described embodiments are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural changes made by using the contents of the present invention description and drawings should fall within the scope of the present invention.

Claims

1. A direct contact heat dissipation module, used to provide heat dissipation for electronic heating elements, characterized in that: include: At least two heat pipes, each of the heat pipes is a rectangular tube and has a front side and a back side opposite to each other, the at least two heat pipes are arranged side by side, and the front sides of the at least two heat pipes jointly form a first seamless contact surface; at least one fin set; as well as A heat sink is provided with at least one opening, wherein the at least two heat pipes are arranged on one side of the heat sink, and the at least one fin group is arranged on the other side of the heat sink, wherein the first seamless contact surface directly contacts the electronic heating element, and the back sides of the at least two heat pipes directly contact the at least one fin group through the at least one opening.

2. The direct contact heat dissipation module according to claim 1, characterized in that: The back surfaces of the at least two heat pipes jointly form a second seamless contact surface, and the at least two heat pipes directly contact the at least one fin group via the at least one opening with the second seamless contact surface.

3. The direct contact heat dissipation module according to claim 1, characterized in that: At least one end of the at least two heat pipes extends integrally and forms an extended end portion together, at least one side of the heat dissipation plate forms a avoidance portion corresponding to the extended end portion, and the extended end portion is accommodated in the avoidance portion and is bonded to each other.

4. The direct contact heat dissipation module according to claim 3, characterized in that: The avoiding portion is a bending structure.

5. The direct contact heat dissipation module according to claim 3 or 4, characterized in that: It also includes at least one reinforcement beam, which is clamped and fixed between the heat sink and the fin group corresponding to the avoidance portion.

6. The direct contact heat dissipation module according to claim 1, characterized in that: At least one end of the at least two heat pipes is integrally extended and jointly forms an extended end portion, at least one side of the heat sink forms a avoidance portion corresponding to the extended end portion, and the extended end portion protrudes from the periphery of the heat sink via the avoidance portion.

7. The direct contact heat dissipation module according to claim 6, characterized in that: It also includes a first amplification fin group, and one side of the extension end directly contacts the first amplification fin group.

8. The direct contact heat dissipation module according to claim 7, characterized in that: A second amplification fin group is also included, and the other surface of the extended end directly contacts the second amplification fin group.

9. The direct contact heat dissipation module according to claim 6, characterized in that: The avoidance portion is a notch.

10. The direct contact heat dissipation module according to claim 6 or 9, characterized in that: It also includes at least one reinforcement beam, which is clamped and fixed between the heat sink and the fin group corresponding to the avoidance portion.

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