Radiator and production process

Abstract

The invention relates to a radiator and a production process in the field of radiators, the radiator comprises a base, a radiating fin group and a heat exchange plate, a water cooling assembly is further arranged on the base, heat transfer is carried out between the water cooling assembly and the heat exchange plate, the water cooling assembly can absorb heat of the heat exchange plate, the radiating fin group is composed of a plurality of metal radiating fins, and the metal radiating fins are arranged on the base. Supporting side plates and inserting grooves are formed in the edges of the metal cooling fins, the supporting side plates and the metal cooling fins are integrally formed, the inserting grooves are formed in the ends, away from the supporting side plates, of the metal cooling fins, inserting parts are arranged at the ends, away from the inserting grooves, of the supporting side plates, and the adjacent supporting side plates are inserted into the inserting grooves through the inserting parts to be combined. The metal radiating fins are sequentially spliced and combined to form the radiating fin group, and the radiating channels for air to flow through are formed between the adjacent metal radiating fins, so that the size of the radiating fin group can be adjusted according to heat generated by an electronic element which actually needs to be radiated, the use is more convenient, and the use range is wider.

Description

Technical Field

[0001] The invention relates to the field of radiators, in particular to a radiator and a production process. Background Art

[0002] A radiator is a device used to conduct and release heat. The radiator market plays an important role in modern society. With the development of electronic equipment and mechanical systems, the demand for radiators continues to increase. They are widely used in heating, computer cooling, automobile cooling, data center cooling, etc. With the rapid development of emerging industries such as new energy vehicles, 5G communications, and the Internet of Things, the application prospects of radiators will be even broader.

[0003] The cooling fins in existing radiators are usually an integral whole, formed in one piece by cutting, casting, etc. The size of the cooling fins is often fixed, and the size of the cooling fins cannot be adjusted according to actual needs. For example, when the heat generated by the electronic components is small and no larger cooling fins are needed, or when the heat generated by the electronic components is large and larger cooling fins are needed, a new cooling fin can only be produced.

[0004] Cutting is to use a precisely controlled special planer to cut a whole piece of metal profile into thin sheets of specified thickness, and then bend it upward into an upright state to become a heat sink fin. Due to the influence of raw materials, the yield rate is low; in order to ensure a certain stress, the fins cannot be cut very thin and long during the cutting process; casting is to melt the aluminum alloy ingot into liquid, fill it into the mold, and use a die-casting machine to die-cast it in one go, and then cool it and undergo subsequent treatment. During die-casting, there are too many surface flow lines and oxide slag, which will reduce the heat conduction effect. The equipment is relatively complex and the output is small. No matter which processing method is used, it is relatively complicated and the radiator produced has many restrictions, and the production cost is relatively high. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art solutions, the present invention provides a radiator that can effectively solve the technical problems of fixed size and small application range.

[0006] The technical solution adopted by the present invention to solve its technical problem is:

[0007] A radiator comprises a base, a heat dissipation fin group and a heat exchange plate, one end of the heat exchange plate is used to contact with an electronic component that needs to be radiated, heat is transferred between the heat dissipation fin group and the heat exchange plate, and the heat dissipation fin group can absorb the heat of the heat exchange plate, a plurality of heat dissipation channels are arranged in the heat dissipation fin group, air can pass through the heat dissipation channels and take away the heat of the heat dissipation fin group, the base is used to install the heat dissipation fin group and the heat exchange plate in the equipment, and a water cooling component is also arranged on the base, heat is transferred between the water cooling component and the heat exchange plate, and the water cooling component can absorb the heat of the heat exchange plate;

[0008] The water cooling assembly includes a water tank, a heat absorbing pipe and a cooling water pump. One end of the heat absorbing pipe is directly connected to the water inlet of the water tank, and the other end is connected to the water outlet of the water tank through the cooling water pump. Cooling water is arranged in the water tank, and the cooling water can circulate in the water tank and the heat absorbing pipe through the cooling water pump. A heat absorbing channel is arranged in the heat exchange plate, and a heat absorbing channel is arranged in the middle section of the heat absorbing pipe, and is in contact with the inner wall of the heat absorbing channel. The heat absorbing pipe exchanges heat with the heat exchange plate, and the cooling water takes away the heat of the heat absorbing pipe after passing through the heat absorbing pipe.

[0009] A heat-conducting copper tube is arranged on the surface of the heat exchange plate. The end of the heat-conducting copper tube away from the heat exchange plate extends to the heat dissipation fin group. The heat dissipation fin group is composed of a plurality of metal heat sinks. Supporting side panels and slots are arranged at the edges of the metal heat sinks. The supporting side panels and the metal heat sinks are integrally formed. The slots are located at the end of the metal heat sink away from the supporting side panels. A plug-in portion is arranged at the end of the supporting side panels away from the slots. Adjacent supporting side panels are combined by inserting the plug-in portions into the slots. A plurality of metal heat sinks are spliced ​​and combined in sequence to form a heat dissipation fin group. A heat dissipation channel for air to flow through is formed between adjacent metal heat sinks.

[0010] Furthermore, the metal heat sink is provided with a heat conduction groove matching the cross-sectional shape of the heat conduction copper tube. One end of the heat conduction copper tube located in the heat sink fin group is installed in the heat conduction groove and fits with the heat conduction groove of the metal heat sink. The metal heat sink is provided with connecting holes, and bolts are passed through the metal heat sinks. After the metal heat sinks are assembled, one end of the bolt passes through the connecting hole and is tightened with a nut.

[0011] Furthermore, the water cooling component also includes a chilled water pump and a heat dissipation pipe. Two groups of heat dissipation fin groups are provided. The heat dissipation channels of the two groups of heat dissipation fin groups are oriented in the same direction. Air can pass through the two groups of heat dissipation fin groups in sequence. The heat dissipation pipe is interspersed in the heat dissipation fin group. The heat dissipation pipe and the heat-conducting copper pipe are respectively installed in the two groups of heat dissipation fin groups to perform heat exchange. One end of the heat dissipation pipe is directly connected to the water inlet of the water tank, and the other end is connected to the water outlet of the water tank through the chilled water pump. The cooling water can circulate between the water tank and the heat dissipation pipe through the chilled water pump.

[0012] Furthermore, a controller is provided on the base, and temperature sensors are provided on the heat exchange plate, the water tank and the two groups of cooling fins. The temperature sensor, the cooling water pump and the freezing water pump are electrically connected to the controller. The temperature sensor is used to detect the temperature of the heat exchange plate, the water tank and the two groups of cooling fins, and convert the temperature into an electrical signal and send it to the controller. The controller controls the start and stop of the cooling water pump and the freezing water pump according to the received electrical signal.

[0013] Furthermore, a heat exchange tube is arranged between the two groups of cooling fins, and both ends of the heat exchange tube extend to the inside of the two groups of cooling fins respectively. Heat exchange can be carried out between the two groups of cooling fins through the heat exchange tube. The two groups of cooling fins are arranged on the base through the upper and lower layers of the bracket.

[0014] Furthermore, the controller is also electrically connected to a cooling fan, which is disposed on a bracket, and an air duct of the cooling fan corresponds to cooling channels of the two groups of cooling fins.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The heat sink fin group is composed of a number of metal heat sinks, which are inserted into the slots through the plug-in parts in turn to form a heat sink fin group. The size of the heat sink fin group can be adjusted according to the heat generated by the electronic components that actually need to be dissipated. When the electronic components generate more heat during operation, the metal heat sinks can be added to improve the heat dissipation efficiency. When the electronic components generate less heat during operation, the metal heat sinks can be reduced to unlock the internal space, making it more convenient to use and having a wider range of uses.

[0017] In order to overcome the deficiencies of the prior art solutions, the present invention provides a production process for a radiator, which can effectively solve the technical problems of complex processing, high equipment requirements and high production costs.

[0018] The technical solution adopted by the present invention to solve the technical problem is: a production process of a radiator, according to which a radiator is processed, comprising the following steps:

[0019] S1: Cutting the material, first cutting a copper plate with a thickness of 2mm-2.8mm into a number of rectangular copper strips with the same width, and then cutting the rectangular copper strips into a number of rectangular copper sheets with the same length to obtain a heat sink blank, and the surface of the heat sink blank is cleaned and set aside;

[0020] S2 shaping: the heat sink blank is processed into shape through two stamping processes. One stamping process: the heat sink blank is stamped and bent by a stamping machine of more than 50 tons to form a supporting side plate at the edge of the heat sink.

[0021] Secondary stamping: Use a stamping machine of more than 25 tons to stamp the heat sink with the supporting side plate to form a slot at the end of the heat sink away from the supporting side plate;

[0022] S3 polishing: the heat sink is subjected to mechanical polishing and chemical polishing in turn to remove oil, dust and oxides on its surface. Mechanical polishing: firstly, it is roughly polished with sandpaper or grinding wheel with a grit of 80-120 until the surface becomes relatively flat, and then it is polished with sandpaper with a grit of 240-400 until the surface becomes smoother and can present the outline of the reflection;

[0023] Chemical polishing: The copper sheet is completely immersed in the prepared polishing liquid. The polishing liquid needs to be heated to a temperature of 45℃-50℃ and soaked for 1-3 minutes to allow the polishing liquid to react chemically with the surface of the copper sheet. After soaking, take it out and spray it with clean water for cleaning;

[0024] S4 surface electroplating: according to the electroplating process requirements, prepare a plating solution containing tin ions, put the cleaned heat sink into the electroplating tank, and make sure it is completely immersed in the electroplating solution, then turn on the power, keep the temperature at 20℃-30℃, electroplating for 10-19 minutes, take it out for cleaning and drying;

[0025] S5: Installation of the heat sink fin group: assemble several heat sinks in sequence to obtain a heat sink fin group;

[0026] S6 is assembled as a whole, the heat sink fin group is installed on the base, and the two ends of the heat-conducting copper tube are respectively combined and connected with the heat exchange plate and the heat sink fin group to obtain a radiator.

[0027] Furthermore, after two stampings, the overall wall thickness of the heat sink is 1 mm to 1.6 mm, and the difference between the maximum thickness and the minimum thickness is less than 0.3 mm.

[0028] Furthermore, after cutting, the heat sink blank is cleaned by a cleaning machine to remove debris adhering to the surface during cutting.

[0029] Furthermore, the heat exchange plate needs to be annealed before assembly. The heat exchange plate is placed in a heating furnace and heated at a high temperature of 400℃-500℃ until the entire surface is red. The heating of the heating furnace is turned off and the heat exchange plate is taken out after slowly cooling in the heating furnace for 5h-8h.

[0030] Compared with the prior art, the beneficial effects of the present invention are: simplifying the production structure, reducing the demand for equipment, no need for die-casting machines or special planers for processing, no need to melt materials, no need to cut out thin sheets of specified thickness and then bend them upward to an upright state, the process is simpler, and thinner and longer heat sinks can be produced. The heat sink produced has a smooth surface and better heat conduction effect, which effectively reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention;

[0032] Figure 2 This is a production process flow chart of Embodiment 1 of the present invention;

[0033] Figure 3 It is a three-dimensional schematic diagram of a heat dissipation fin group in the first embodiment of the present invention;

[0034] Figure 4This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0035] Figure 5 is a three-dimensional schematic diagram of a heat dissipation fin group in the second embodiment of the present invention;

[0036] Figure 6 A top view of a heat dissipation fin assembly in a second embodiment of the present invention;

[0037] Numbers in the figure: 1-base, 2-heat sink fin group, 201-metal heat sink, 202-support side panel, 203-slot, 204-heat dissipation channel, 205-heat conduction groove, 206-bolt, 207-nut, 3-heat exchange plate, 4-water tank, 5-heat absorption pipe, 6-cooling water pump, 7-heat conduction copper pipe, 8-refrigeration water pump, 9-heat dissipation pipe, 10-bracket, 11-cooling fan. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Embodiment 1:

[0040] like Figure 1-Figure 3 As shown, a radiator comprises a base 1, a heat dissipation fin group 2 and a heat exchange plate 3, one end of the heat exchange plate 3 is used to contact with an electronic component that needs to be radiated, heat is transferred between the heat dissipation fin group 2 and the heat exchange plate 3, and the heat dissipation fin group 2 can absorb the heat of the heat exchange plate 3, a plurality of heat dissipation channels 204 are arranged in the heat dissipation fin group 2, the base 1 is used to install the heat dissipation fin group 2 and the heat exchange plate 3 in the equipment, and a water cooling component is also arranged on the base 1, and heat is transferred between the water cooling component and the heat exchange plate 3, and the water cooling component can absorb the heat of the heat exchange plate 3;

[0041] The water cooling assembly includes a water tank 4, a heat absorbing pipe 5 and a cooling water pump 6. One end of the heat absorbing pipe 5 is directly connected to the water inlet of the water tank 4, and the other end is connected to the water outlet of the water tank 4 through the cooling water pump 6. Cooling water is arranged in the water tank 4, and the cooling water can circulate in the water tank 4 and the heat absorbing pipe 5 through the cooling water pump 6. A heat absorbing channel is arranged in the heat exchange plate 3. The middle section of the heat absorbing pipe 5 is arranged in a heat absorbing channel, and is in contact with the inner wall of the heat absorbing channel. The heat absorbing pipe 5 exchanges heat with the heat exchange plate 3, and the cooling water takes away the heat of the heat absorbing pipe 5 after passing through the heat absorbing pipe 5.

[0042] A heat-conducting copper tube 7 is provided on the surface of the heat exchange plate 3. The end of the heat-conducting copper tube 7 away from the heat exchange plate 3 extends to the heat dissipation fin group 2. The heat dissipation fin group 2 is composed of a plurality of metal heat dissipation fins 201. The edge of the metal heat dissipation fin 201 is provided with a supporting side plate 202 and a slot 203. The supporting side plate 202 and the metal heat dissipation fin 201 are integrally formed. The slot 203 is located at the end of the metal heat dissipation fin 201 away from the supporting side plate 202. The end of the supporting side plate 202 away from the slot 203 is provided with a plug-in portion. Adjacent supporting side plates 202 are inserted into the slot 203 through the plug-in portion to be combined. A plurality of metal heat dissipation fins 201 are spliced ​​and combined in sequence to form a heat dissipation fin group 2. A heat dissipation channel 204 for air to flow through is formed between adjacent metal heat dissipation fins 201.

[0043] The size of the heat sink fin group 2 can be adjusted according to the heat generated by the electronic components that actually need to dissipate heat. When the electronic components generate more heat during operation, the metal heat sink 201 can be added to improve the heat dissipation efficiency. When the electronic components generate less heat during operation, the metal heat sink 201 can be reduced to unlock the internal space, making it more convenient to use and having a wider range of uses.

[0044] The metal heat sink 201 is provided with a heat conduction groove 205 matching the cross-sectional shape of the heat conduction copper tube 7. One end of the heat conduction copper tube 7 located in the heat sink fin group 2 is installed in the heat conduction groove 205 and fits with the heat conduction groove 205 of the metal heat sink 201. The metal heat sink 201 is provided with a connection hole. Bolts 206 penetrate between the metal heat sinks 201. After the metal heat sinks 201 are assembled, one end of the bolt 206 passes through the connection hole and is tightened with a nut 207 to prevent the metal heat sink 201 from spreading, so that the connection between the metal heat sinks 201 is more stable.

[0045] The heat exchange plate 3 absorbs the heat of the electronic components and transfers the heat to the cooling fin group 2 through the heat-conducting copper tube 7. The air passes through the heat dissipation channel 204 and takes away the heat of the cooling fin group 2. The cooling water flowing in the heat absorption pipe 5 can further absorb the heat of the heat exchange plate 3 to improve the heat dissipation efficiency.

[0046] The production process comprises the following steps:

[0047] S1: Cutting: first, cut a copper plate with a thickness of 2.4 mm into several rectangular copper strips with the same width, and then cut the rectangular copper strips into several rectangular copper sheets with the same length to obtain a heat sink blank. The surface of the heat sink blank is cleaned and then used. After cutting, the heat sink blank is cleaned by a cleaning machine to remove the debris adhering to the surface during cutting, so as to avoid dents on the surface of the heat sink caused by the debris during subsequent stamping.

[0048] S2 shaping: the heat sink blank is processed into an outer shape through two stamping processes. The first stamping process: a stamping machine with a capacity of more than 50 tons is used to stamp and bend the heat sink blank so that the edge of the heat sink forms a supporting side plate 202;

[0049] Secondary stamping: The heat sink with the supporting side plate 202 is stamped by a stamping machine of more than 25 tons, so that a slot 203 is formed at the end of the heat sink away from the supporting side plate 202. After two stampings, the overall wall thickness of the heat sink is 1.3mm-1.6mm, and the difference between the maximum thickness and the minimum thickness is less than 0.3mm;

[0050] S3 polishing: the heat sink is subjected to mechanical polishing and chemical polishing in turn to remove oil, dust and oxides on its surface. Mechanical polishing: firstly, it is roughly polished with 100-grit sandpaper or grinding wheel until the surface becomes relatively flat, and then it is polished with 400-grit sandpaper until the surface becomes smoother and can present the outline of the reflection;

[0051] Chemical polishing: The copper sheet is completely immersed in the prepared polishing liquid. The polishing liquid needs to be heated to a temperature of 45℃-50℃ and soaked for 3 minutes to allow the polishing liquid to react chemically with the surface of the copper sheet. After soaking, take it out and spray it with clean water. The polishing liquid is copper oxide cleaning agent CJX5-8;

[0052] S4 surface electroplating: according to the electroplating process requirements, prepare a plating solution containing tin ions, put the cleaned heat sink into the electroplating tank, and make sure it is completely immersed in the electroplating solution, then turn on the power, keep the temperature at 20℃-30℃, take it out after electroplating for 14 minutes, wash it with clean water, and then dry the surface moisture in an oven. After electroplating, the corrosion resistance of the heat sink can be improved;

[0053] S5: installing the heat sink fin group 2, assembling a plurality of heat sinks in sequence to obtain the heat sink fin group 2;

[0054] S6 is an overall assembly. The heat exchange plate 3 needs to be annealed before assembly. The heat exchange plate 3 is placed in a heating furnace and heated at a high temperature of 400°C-500°C until the entire surface is red. The heating of the heating furnace is turned off and the heat exchange plate 3 is slowly cooled in the heating furnace for 8 hours. After the temperature of the heat exchange plate 3 returns to room temperature, it is taken out and the heat sink fin group 2 is installed on the base 1. The two ends of the heat-conducting copper tube 7 are respectively combined and connected with the heat exchange plate 3 and the heat sink fin group 2 to obtain a radiator.

[0055] Embodiment 2:

[0056] like Figure 4-Figure 6As shown, the difference between this embodiment and the first embodiment is that the water cooling component also includes a chilled water pump 8 and a heat dissipation pipe 9, and two groups of heat dissipation fin groups 2 are provided. A heat exchange tube is provided between the two groups of heat dissipation fins, and both ends of the heat exchange tube respectively extend to the interior of the two groups of heat dissipation fins. Heat exchange can be performed between the two groups of heat dissipation fins through the heat exchange tube. The two groups of heat dissipation fins are arranged on the base 1 in two layers through the bracket 10. The heat dissipation channels 204 of the two groups of heat dissipation fin groups 2 are in the same direction, and the air can pass through the upper and lower groups of heat dissipation fin groups 2 in sequence.

[0057] The heat dissipation pipe 9 is inserted in the heat dissipation fin group 2 of the lower layer, and the heat-conducting copper pipe 7 is installed in the heat dissipation fin group 2 of the upper layer to perform heat exchange. One end of the heat dissipation pipe 9 is directly connected to the water inlet of the water tank 4, and the other end is connected to the water outlet of the water tank 4 through the chilled water pump 8. The cooling water can circulate between the water tank 4 and the heat dissipation pipe 9 through the chilled water pump 8. A controller is provided on the base 1, and temperature sensors are provided on the heat exchange plate 3, the water tank 4 and the two groups of heat dissipation fin groups 2. The temperature sensor, the cooling water pump 6 and the chilled water pump 8 are all electrically connected to the controller. The temperature sensor is used to detect the temperature of the heat exchange plate 3, the water tank 4 and the two groups of heat dissipation fin groups 2, and convert the temperature into an electrical signal and send it to the controller. The controller controls the cooling water pump 6 and the chilled water pump 8 according to the received electrical signal. The controller is also electrically connected to the cooling fan 11, which is arranged on the bracket 10. The air duct of the cooling fan 11 corresponds to the cooling channel 204 of the two groups of cooling fins. When the temperature sensor detects that the temperature of the heat exchange plate 3 is too high, the cooling water pump 6 is started to circulate the cooling water in the heat absorption pipe 5, and the cooling water absorbs the heat of the heat exchange plate 3. When the temperature sensor detects that the temperature of the cooling water in the water tank 4 is too high, the freezing water pump 8 is started to circulate the cooling water in the cooling pipe 9, and the cooling fins of the lower layer dissipate the heat of the cooling water into the air. When the temperature sensor detects that the temperature of the two groups of cooling fins 2 is high, the cooling fan 11 is started to increase the air flow rate in the cooling channel 204, thereby accelerating the heat dissipation effect. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and range of equivalent elements of the claims are included in the present invention. Any reference sign in the claims should not be regarded as limiting the claims involved.

Claims

1. A radiator, comprising a base, a heat dissipation fin group and a heat exchange plate, one end of the heat exchange plate is used to contact the electronic component to be radiated, heat is transferred between the heat dissipation fin group and the heat exchange plate, the heat dissipation fin group can absorb the heat of the heat exchange plate, a plurality of heat dissipation channels are arranged in the heat dissipation fin group, air can pass through the heat dissipation channels and take away the heat of the heat dissipation fin group, the base is used to install the heat dissipation fin group and the heat exchange plate in the equipment, characterized in that: The base is also provided with a water cooling component, and heat is transferred between the water cooling component and the heat exchange plate, and the water cooling component can absorb the heat of the heat exchange plate; The water cooling assembly includes a water tank, a heat absorbing pipe and a cooling water pump. One end of the heat absorbing pipe is directly connected to the water inlet of the water tank, and the other end is connected to the water outlet of the water tank through the cooling water pump. Cooling water is arranged in the water tank, and the cooling water can circulate in the water tank and the heat absorbing pipe through the cooling water pump. A heat absorbing channel is arranged in the heat exchange plate, and a heat absorbing channel is arranged in the middle section of the heat absorbing pipe, and is in contact with the inner wall of the heat absorbing channel. The heat absorbing pipe exchanges heat with the heat exchange plate, and the cooling water takes away the heat of the heat absorbing pipe after passing through the heat absorbing pipe. A heat-conducting copper tube is arranged on the surface of the heat exchange plate. The end of the heat-conducting copper tube away from the heat exchange plate extends to the heat dissipation fin group. The heat dissipation fin group is composed of a plurality of metal heat sinks. Supporting side panels and slots are arranged at the edges of the metal heat sinks. The supporting side panels and the metal heat sinks are integrally formed. The slots are located at the end of the metal heat sink away from the supporting side panels. A plug-in portion is arranged at the end of the supporting side panels away from the slots. Adjacent supporting side panels are combined by inserting the plug-in portions into the slots. A plurality of metal heat sinks are spliced ​​and combined in sequence to form a heat dissipation fin group. A heat dissipation channel for air to flow through is formed between adjacent metal heat sinks.

2. A radiator according to claim 1, characterized in that: The metal heat sink is provided with a heat conduction groove matching the cross-sectional shape of the heat conduction copper tube. One end of the heat conduction copper tube located in the heat sink fin group is installed in the heat conduction groove and fits with the heat conduction groove of the metal heat sink. The metal heat sink is provided with connection holes. Bolts penetrate between the metal heat sinks. After the metal heat sinks are assembled, one end of the bolt passes through the connection hole and is tightened with a nut.

3. A radiator according to claim 1, characterized in that: The water cooling component also includes a chilled water pump and a heat dissipation pipe. Two groups of heat dissipation fin groups are provided. The heat dissipation channels of the two groups of heat dissipation fin groups are oriented in the same direction. Air can pass through the two groups of heat dissipation fin groups in sequence. The heat dissipation pipe is interspersed in the heat dissipation fin groups. The heat dissipation pipe and the heat-conducting copper pipe are respectively installed in the two groups of heat dissipation fin groups to perform heat exchange. One end of the heat dissipation pipe is directly connected to the water inlet of the water tank, and the other end is connected to the water outlet of the water tank through the chilled water pump. Cooling water can circulate between the water tank and the heat dissipation pipe through the chilled water pump.

4. A radiator according to claim 3, characterized in that: A controller is provided on the base, and temperature sensors are provided on the heat exchange plate, the water tank and the two groups of heat dissipation fins. The temperature sensor, the cooling water pump and the freezing water pump are electrically connected to the controller. The temperature sensor is used to detect the temperature of the heat exchange plate, the water tank and the two groups of heat dissipation fins, and convert the temperature into an electrical signal and send it to the controller. The controller controls the start and stop of the cooling water pump and the freezing water pump according to the received electrical signal.

5. A radiator according to claim 4, characterized in that: A heat exchange tube is arranged between the two groups of heat dissipation fins, and both ends of the heat exchange tube extend to the inside of the two groups of heat dissipation fins respectively. Heat exchange can be carried out between the two groups of heat dissipation fins through the heat exchange tube. The two groups of heat dissipation fins are arranged on the base through the upper and lower layers of the bracket.

6. A radiator according to claim 5, characterized in that: The controller is also electrically connected to a heat dissipation fan, which is arranged on a bracket, and an air duct of the heat dissipation fan corresponds to the heat dissipation channels of the two groups of heat dissipation fins.

7. A production process for a heat sink, comprising processing a heat sink according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1: Cutting the material, first cutting a copper plate with a thickness of 2mm-2.8mm into a number of rectangular copper strips with the same width, and then cutting the rectangular copper strips into a number of rectangular copper sheets with the same length to obtain a heat sink blank, and the surface of the heat sink blank is cleaned and set aside; S2 shaping: the heat sink blank is processed into shape through two stamping processes. One stamping process: the heat sink blank is stamped and bent by a stamping machine of more than 50 tons to form a supporting side plate at the edge of the heat sink. Secondary stamping: Use a stamping machine of more than 25 tons to stamp the heat sink with the supporting side plate to form a slot at the end of the heat sink away from the supporting side plate; S3 polishing: the heat sink is subjected to mechanical polishing and chemical polishing in turn to remove oil, dust and oxides on its surface. Mechanical polishing: firstly, it is roughly polished with sandpaper or grinding wheel with a grit of 80-120 until the surface becomes relatively flat, and then it is polished with sandpaper with a grit of 240-400 until the surface becomes smoother and can present the outline of the reflection; Chemical polishing: The copper sheet is completely immersed in the prepared polishing liquid. The polishing liquid needs to be heated to a temperature of 45℃-50℃ and soaked for 1-3 minutes to allow the polishing liquid to react chemically with the surface of the copper sheet. After soaking, take it out and spray it with clean water for cleaning; S4 surface electroplating: according to the electroplating process requirements, prepare a plating solution containing tin ions, put the cleaned heat sink into the electroplating tank, and make sure it is completely immersed in the electroplating solution, then turn on the power, keep the temperature at 20℃-30℃, electroplating for 10-19 minutes, take it out for cleaning and drying; S5: Installation of the heat sink fin group: assemble several heat sinks in sequence to obtain a heat sink fin group; S6 is assembled as a whole, the heat sink fin group is installed on the base, and the two ends of the heat-conducting copper tube are respectively combined and connected with the heat exchange plate and the heat sink fin group to obtain a radiator.

8. The production process of a heat sink according to claim 7, characterized in that: After two stampings, the overall wall thickness of the heat sink is 1mm-1.6mm, and the difference between the maximum thickness and the minimum thickness is less than 0.3mm.

9. The production process of a heat sink according to claim 7, characterized in that: After cutting, the heat sink blank is passed through a cleaning machine to clean the surface and remove the debris adhering to the surface during cutting.

10. The production process of a heat sink according to claim 7, characterized in that: The heat exchange plate needs to be annealed before assembly. Place the heat exchange plate in a heating furnace and heat it at 400℃-500℃ until the entire surface turns red. Turn off the heating furnace and wait for the heat exchange plate to slowly cool down in the heating furnace for 5h-8h before taking it out.

Images