A cooling device for temperature rise test

Abstract

The application discloses a temperature rise test cooling device, which comprises a plurality of semiconductor refrigerating sheets, a heat storage box body and a refrigeration box body, the refrigeration surface of the semiconductor refrigerating sheet is attached to the outer wall of the refrigeration box body, the heat surface of the semiconductor refrigerating sheet is attached to the outer wall of the heat storage box body, the inside of the heat storage box body is provided with heat storage liquid, and the inside of the refrigeration box body is injected with refrigeration liquid; the heating outlet pipe, the heating inlet pipe and the first heat exchange cavity are connected through a first pipeline to form a first circulating liquid path, and the refrigeration inlet pipe and the refrigeration outlet pipe and the second heat exchange cavity are connected through a second pipeline to form a second circulating liquid path; the application utilizes the semiconductor refrigerating sheet to perform refrigeration, wherein the heat of the heat surface of the semiconductor refrigerating sheet is recycled in the process of refrigeration of the semiconductor refrigerating sheet and is applied to subsequent electronic equipment temperature rise test, wherein the energy consumption is effectively reduced, and the cost is low compared with traditional compression refrigeration.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature rise test cooling, in particular to a temperature rise test cooling device. BACKGROUND

[0002] The temperature rise test angle mainly simulates whether the household appliance can cause the temperature of the surrounding environment to be too high or cause a fire under normal or abnormal use conditions of the simulator. With the improvement of people's living standards, the importance of potential hazards that may occur in family life is increasing, so household appliances will be tested for temperature rise before leaving the factory, and the test results will be attached to the product manual to ensure the safety of users. The existing temperature rise system does not have a cooling device for rapid cooling of the product, and generally relies on natural cooling, which can cause the temperature in the environment to be too high and cause discomfort to the workers; at the same time, the heating system is used during temperature rise, and the compressed refrigeration is used for rapid cooling during temperature drop, but they are two independent systems, which increases the production cost. SUMMARY

[0003] To solve the defects in the prior art that the heating system is used during temperature rise, and the compressed refrigeration is used for rapid cooling during temperature drop, but they are two independent systems, which increases the production cost, the present application provides a temperature rise test cooling device.

[0004] In order to solve the above technical problems, the present application provides the following technical scheme:

[0005] The temperature rise test cooling device comprises a plurality of semiconductor refrigeration pieces, a heat storage box body and a refrigeration box body, the refrigeration surface of the semiconductor refrigeration piece is attached to the outer wall of the refrigeration box body, the heating surface of the semiconductor refrigeration piece is attached to the outer wall of the heat storage box body, the inside of the heat storage box body is provided with heat storage liquid, and the inside of the refrigeration box body is injected with refrigeration liquid.

[0006] The refrigeration box body is provided with a refrigeration inlet pipe and a refrigeration outlet pipe which are in communication with the inner cavity, and the heat storage box body is provided with a heating inlet pipe and a heating outlet pipe which are in communication with the inner cavity.

[0007] It also comprises a heat exchange base arranged in the temperature rise box, and the heat exchange base is made of copper material, and the heat exchange base is provided with a first heat exchange cavity and a second heat exchange cavity which are arranged in a zigzag manner and are independent.

[0008] The heating outlet pipe, the heating inlet pipe and the first heat exchange cavity are connected by a first conduit to form a first circulating liquid path, and the refrigeration inlet pipe and the refrigeration outlet pipe and the second heat exchange cavity are connected by a second conduit to form a second circulating liquid path; the first circulating liquid path is provided with a first circulating pump, and the second circulating liquid path is provided with a second circulating pump.

[0009] As a preferred technical scheme of the present application, the first conduit is provided with a second temperature sensor for detecting the temperature of the refrigerant liquid sent into the first heat exchange cavity.

[0010] As a preferred technical scheme of the present application, the outside of the refrigeration box is provided with a heat exchange shell, a heat exchange cavity is formed between the heat exchange shell and the refrigeration box, the heat exchange shell is provided with an air inlet pipe and an air outlet pipe which communicate with the heat exchange cavity, a lifting frame is installed in the temperature rise box by a lifting mechanism, an annular air pipe is arranged on the lifting frame, an air outlet nozzle is arranged on the air pipe, the air pipe is sleeved on the periphery of the electronic equipment to be detected in temperature rise under the lifting operation of the lifting mechanism, the air pipe is connected with the air outlet pipe through an air guide pipe, and a delivery fan is arranged on the air guide pipe.

[0011] As a preferred technical scheme of the present application, the outside of the refrigeration box is provided with a heat exchange shell, a heat exchange cavity is formed between the heat exchange shell and the refrigeration box, the heat exchange shell is provided with an air inlet pipe and an air outlet pipe which communicate with the heat exchange cavity, a lifting frame is installed in the temperature rise box by a lifting mechanism, an annular air pipe is arranged on the lifting frame, an air outlet nozzle is arranged on the air pipe, the air pipe is sleeved on the periphery of the electronic equipment to be detected in temperature rise under the lifting operation of the lifting mechanism, the air pipe is connected with the air outlet pipe through an air guide pipe, and a delivery fan is arranged on the air guide pipe.

[0012] As a preferred technical scheme of the present application, the first heat exchange cavity includes a plurality of cooling cavities arranged in parallel and inclined from the water inlet end to the water outlet end, and the two sides of the cooling cavity are provided with a connection main pipe.

[0013] As a preferred technical scheme of the present application, the first heat exchange cavity includes a plurality of cooling cavities arranged in parallel and inclined from the water inlet end to the water outlet end, and the two sides of the cooling cavity are provided with a connection main pipe.

[0014] As a preferred technical scheme of the present application, the second conduit is provided with a third temperature sensor for detecting the temperature of the heat exchange liquid sent into the second heat exchange cavity.

[0015] As a preferred technical scheme of the present application, when the temperature rise is performed, the semiconductor refrigeration sheet is started to work, the heating surface is used for heating, the refrigeration surface is used for refrigeration, the first circulating pump pumps the hot water in the heat storage box into the first heat exchange cavity in the heat exchange base to warm up the heat exchange base, the second temperature sensor is used to detect the temperature of the heat exchange liquid sent into the first heat exchange cavity, the first temperature sensor is used to detect the temperature of the heat exchange base, and when the data difference between the temperatures detected by the first temperature sensor and the second temperature sensor reaches a set difference value, the first circulating pump stops working, the water in the first heat exchange cavity automatically flows out, the temperature riser is started to warm up the heat exchange base, the electronic equipment fixed on the heat exchange base is warmed up, and the air pipe is used to blow hot air to the electronic equipment.

[0016] When the electronic equipment after temperature rise is cooled, the semiconductor refrigerating sheet is used to cool the refrigerating liquid in the refrigerating cavity during the last cycle, the second circulating pump pumps the cold water in the refrigerating box into the second heat exchange cavity in the heat exchange base to cool the heat exchange base, and the conveying fan is used to blow the cold air after heat exchange of the refrigerating box to the surface of the electronic equipment for temperature rise test to rapidly cool.

[0017] The present application has the following advantages:

[0018] 1. The semiconductor refrigerating sheet is used for refrigeration in the temperature rise test cooling device, the heat of the heating surface of the semiconductor refrigerating sheet is recycled and used in the subsequent electronic equipment temperature rise test, the energy consumption is effectively reduced, the cost is low compared with the traditional compression refrigeration, and the volume is small.

[0019] 2. The air is used for cooling in the temperature rise test cooling device to form cold air, the conveying fan is used to blow the cold air after heat exchange of the refrigerating box to the surface of the temperature rise test equipment to rapidly cool.

[0020] 3. The semiconductor refrigerating sheet is started to work when the temperature rise is carried out, the heating surface is used for heating, the refrigerating surface is used for refrigeration, the first circulating pump pumps the hot water in the heat storage box into the first heat exchange cavity in the heat exchange base to heat the heat exchange base, the second temperature sensor is used to detect the temperature of the heat exchange liquid in the first heat exchange cavity, the first temperature sensor is used to detect the temperature of the heat exchange base, and when the data difference of the temperatures detected by the first temperature sensor and the second temperature sensor reaches the set difference, the first circulating pump stops working, the water in the first heat exchange cavity automatically flows out, the heater is started to heat the heat exchange base, the electronic equipment fixed on the heat exchange base is heated, and the air pipe is used to blow hot air to the electronic equipment.

[0021] When the electronic device after temperature rise is cooled, the semiconductor refrigeration sheet is used to cool the refrigeration liquid in the refrigeration cavity during the last cycle, the second circulating pump pumps the cold water in the refrigeration box into the second heat exchange cavity in the heat exchange base to cool the heat exchange base, and the conveying fan blows the cold air after the heat exchange of the refrigeration box to the surface of the electronic device for temperature rise test to quickly cool. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings are used to provide a better understanding of the temperature rise test cooling device of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the present application, and do not constitute a limitation on the present application. In the drawings:

[0023] Figure 1 is a structural schematic view of a temperature rise test cooling device of the present application;

[0024] Figure 2 is a structural schematic view of a heat exchange base of a temperature rise test cooling device of the present application;

[0025] Figure 3 is an electrical connection schematic view of a temperature rise test cooling device of the present application;

[0026] Figure 4 is a mounting structural schematic view of a semiconductor refrigeration sheet of a temperature rise test cooling device of the present application.

[0027] In the drawings: 1, semiconductor refrigeration sheet; 2, heat storage box; 3, refrigeration box; 5, refrigeration inlet pipe; 6, refrigeration outlet pipe; 8, heating inlet pipe; 7, first circulating pump; 9, heating outlet pipe; 10, heat exchange base 11, first heat exchange cavity; 12, second heat exchange cavity; 13, second circulating pump; 14, temperature riser; 15, first temperature sensor; 16, second temperature sensor; 17, heat exchange shell; 18, air inlet pipe; 19, air outlet pipe; 20, lifting mechanism; 21, lifting frame; 22, air pipe; 23, air guide pipe; 25, conveying fan; 26, cooling cavity; 27, connection main pipe; 28, heat exchange cavity; 29, heat exchange main pipe; 30, third temperature sensor; 31, heating shell; 32, connection pipe; 33, connection pipe; 34, first electric control valve; 35, second electric control valve; 36, air heater. DETAILED DESCRIPTION

[0028] The preferred embodiment of the temperature rise test cooling device of the present application will be described below in conjunction with the drawings, and it should be understood that the preferred embodiment described herein is only used to illustrate and explain the present application, and does not limit the present application.

[0029] Embodiment: as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the temperature rise test cooling device of the present application comprises a plurality of semiconductor refrigeration pieces 1, a heat storage box 2 and a refrigeration box 3, the refrigeration surface of the semiconductor refrigeration piece 1 is attached to the outer wall of the refrigeration box, the heating surface of the semiconductor refrigeration piece 1 is attached to the outer wall of the heat storage box 2, the inside of the heat storage box 2 is provided with heat storage liquid, and the inside of the refrigeration box 3 is injected with refrigeration liquid; the refrigeration box 3 is provided with a refrigeration inlet pipe 5 and a refrigeration outlet pipe 6 which are in communication with the inner cavity, and the heat storage box 7 is provided with a heating inlet pipe 8 and a heating outlet pipe 9 which are in communication with the inner cavity;

[0030] Further comprising a heat exchange base 10 arranged in the temperature rise box, and the heat exchange base 10 is made of copper material, and the heat exchange base 10 is provided with a first heat exchange cavity 11 and a second heat exchange cavity 12 which are arranged in a zigzag manner and are independent;

[0031] The heating outlet pipe 9, the heating inlet pipe 8 and the first heat exchange cavity 11 are connected through a first conduit to form a first circulating liquid path, and the refrigeration inlet pipe 5 and the refrigeration outlet pipe 6 and the second heat exchange cavity 12 are connected through a second conduit to form a second circulating liquid path; the first circulating liquid path is provided with a first circulating pump 12, and the second circulating liquid path is provided with a second circulating pump 13. In the process of refrigeration of the semiconductor refrigeration piece, the heat of the heating surface of the semiconductor refrigeration piece is recovered and applied to the subsequent electronic equipment temperature rise test, which effectively reduces the energy consumption, and compared with the traditional compression refrigeration, the cost is low and the volume is small.

[0032] The upper part of the heat exchange base 10 is further provided with a temperature riser 14 for heating and warming the heat exchange base 10, and the heat exchange base is provided with a first temperature sensor 15 for monitoring the temperature of the heat exchange base, so as to facilitate the detection of the temperature of the heat exchange base and facilitate the heating or cooling operation.

[0033] The first conduit is provided with a second temperature sensor 16 for detecting the temperature of the refrigeration liquid sent into the first heat exchange cavity 11 in the first conduit, so as to monitor the temperature of the refrigeration liquid, and in the subsequent work, the temperature of the liquid can be lowered by controlling the work of the semiconductor refrigeration piece.

[0034] The outer side of the refrigeration box 3 is provided with a heat exchange shell 17, the heat exchange shell 17 and the refrigeration box 3 form a heat exchange cavity, and the heat exchange shell 17 is provided with an air inlet pipe 18 and an air outlet pipe 19 which are communicated with the heat exchange cavity, the temperature rise box is provided with a lifting frame 21 which is installed by a lifting mechanism 20, the lifting frame 21 is provided with an annular air pipe 22, the air pipe 22 is provided with an air outlet nozzle 24 which faces inward, under the lifting operation of the lifting mechanism 20, the air pipe 22 is sleeved on the periphery of the electronic equipment for temperature rise detection, the air pipe 22 is connected with the air outlet pipe 19 through an air guide pipe 23, and the air guide pipe 23 is provided with a conveying fan 25, so that the cold air which is exchanged by the refrigeration box is blown to the surface of the temperature rise test equipment by the conveying fan for rapid cooling.

[0035] The outer side of the heat storage box 2 is provided with a heating shell 31, and the heating shell 31 and the heat storage box 2 form a heating cavity, the heating shell 31 is provided with a connecting pipe 32 which is communicated with the heating cavity, the connecting pipe 32 is communicated with the air guide pipe 23, and the connecting pipe 32 is provided with a first electric control valve 34, the air outlet pipe 19 is provided with a second electric control valve 35, and the air guide pipe 23 is provided with an air heater 36.

[0036] The first heat exchange cavity 11 includes a plurality of cooling cavities 26 which are arranged in parallel and inclined from the water inlet end to the water outlet end, and the two sides of the cooling cavity 26 are provided with a connecting main pipe 27, so that the liquid can automatically flow out of the cooling cavity, and the cooling and heating processes will not affect each other.

[0037] The first heat exchange cavity 11 includes a plurality of heat exchange cavities 28 which are arranged in parallel and inclined from the water inlet end to the water outlet end, and the two sides of the cooling cavity 26 are provided with a heat exchange main pipe 29, so that the liquid can automatically flow out of the cooling cavity, and the cooling and heating processes will not affect each other.

[0038] The second conduit is internally provided with a third temperature sensor 30 for detecting the temperature of the heat exchange liquid sent into the second heat exchange cavity 12 in the second conduit, so that the first temperature sensor detects the temperature of the heat exchange base, and when the data difference between the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor reaches a set difference, the first circulating pump stops working, the heat exchange cavity tilts from the water inlet end to the water outlet end, the water in the first heat exchange cavity automatically flows out, the temperature riser is started to heat the heat exchange base, and the electronic equipment fixed on the heat exchange base is heated, and hot air is blown to the electronic equipment by the air pipe, so that the temperature rises to a suitable temperature. Because the temperature of the heat exchange liquid is relatively low compared with the temperature of the temperature rise test, the heat exchange liquid is used to preliminarily heat the heat exchange base, so that the heat is recycled and reused, and then the temperature riser is used to heat, so that the temperature of the temperature rise test is reached.

[0039] When the temperature is raised, the semiconductor refrigerating sheet is started to work, the heating surface is used for heating, the refrigerating surface is used for refrigeration, the first circulating pump pumps the hot water in the heat storage box into the first heat exchange cavity in the heat exchange base to heat the heat exchange base, and the second temperature sensor is used to detect the temperature of the heat exchange liquid sent into the first heat exchange cavity, and the first temperature sensor is used to detect the temperature of the heat exchange base. When the data difference between the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor reaches a set difference, the first circulating pump stops working, the water in the first heat exchange cavity automatically flows out, the temperature riser is started to heat the heat exchange base, and the electronic equipment fixed on the heat exchange base is heated, and hot air is blown to the electronic equipment by the air pipe;

[0040] When the temperature of the electronic equipment after temperature rise is cooled, the semiconductor refrigerating sheet is used to cool the refrigerating liquid in the refrigerating cavity during the last cycle, the second circulating pump pumps the cold water in the refrigerating box into the second heat exchange cavity in the heat exchange base to cool the heat exchange base, and the delivery fan blows the cold air after heat exchange in the refrigerating box to the surface of the electronic equipment for temperature rise test to rapidly cool.

[0041] Finally, it should be noted that the above only describes the preferred embodiments of the present application, and is not used to limit the present application. Although the temperature rise test cooling device of the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions of the temperature rise test cooling device described in the foregoing embodiments, or make equivalent replacement to some technical features of the temperature rise test cooling device. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature rise test cooling device, characterized by, The application relates to a temperature rising device, which comprises a plurality of semiconductor refrigerating sheets (1), a heat storage box (2) and a refrigerating box (3), the refrigerating surface of the semiconductor refrigerating sheet (1) is attached to the outer wall of the refrigerating box, the heating surface of the semiconductor refrigerating sheet (1) is attached to the outer wall of the heat storage box (2), the inside of the heat storage box (2) is provided with heat storage liquid, and the inside of the refrigerating box (3) is injected with refrigerating liquid. The refrigerating box (3) is provided with a refrigerating inlet pipe (5) and a refrigerating outlet pipe (6) which are communicated with the inner cavity, and the heat storage box (2) is provided with a heating inlet pipe (8) and a heating outlet pipe (9) which are communicated with the inner cavity. The temperature rising device further comprises a heat exchange base (10) arranged in the temperature rising box, the heat exchange base (10) is made of copper, and the heat exchange base (10) is internally provided with a first heat exchange cavity (11) and a second heat exchange cavity (12) which are arranged in a zigzag mode and are independent. The heating outlet pipe (9), the heating inlet pipe (8) and the first heat exchange cavity (11) are connected through a first pipeline to form a first circulating liquid path, the refrigerating inlet pipe (5) and the refrigerating outlet pipe (6) and the second heat exchange cavity (12) are connected through a second pipeline to form a second circulating liquid path, a first circulating pump (7) is arranged on the first circulating liquid path, and a second circulating pump (13) is arranged on the second circulating liquid path. The outer side of the refrigerating box (3) is provided with a heat exchange shell (17), the heat exchange shell (17) and the refrigerating box (3) form a heat exchange cavity, the heat exchange shell (17) is provided with an air inlet pipe (18) and an air outlet pipe (19) which are communicated with the heat exchange cavity, a lifting frame (21) is arranged in the temperature rising box through a lifting mechanism (20), the lifting frame (21) is provided with an annular air pipe (22), the air pipe (22) is provided with an air outlet nozzle (24) which faces inward, the air pipe (22) is sleeved on the periphery of the electronic equipment which is subjected to temperature rising detection under the lifting operation of the lifting mechanism (20), the air pipe (22) is connected with the air outlet pipe (19) through an air guide pipe (23), and the air guide pipe (23) is provided with a conveying fan (25). The outer side of the heat storage box (2) is provided with a heating shell (31), the heating shell (31) and the heat storage box (2) form a heating cavity, the heating shell (31) is provided with a connecting pipe (32) which is communicated with the heating cavity, the connecting pipe (32) is communicated with the air guide pipe (23), the connecting pipe (32) is provided with a first electric control valve (34), the air outlet pipe (19) is provided with a second electric control valve (35), and the air guide pipe is provided with an air heater (36).

2. The temperature rise test cooling device of claim 1, wherein, The upper portion of the heat exchange base (10) is further provided with a temperature riser (14) which heats and rises the temperature of the heat exchange base (10), and the heat exchange base is provided with a first temperature sensor (15) which monitors the temperature of the heat exchange base.

3. The temperature rise test cooling device of claim 1, wherein, The first pipeline is internally provided with a second temperature sensor (16) which detects the temperature of the refrigerating liquid which is sent into the first heat exchange cavity (11) in the first pipeline.

4. The temperature rise test cooling device of claim 1, wherein, The second heat exchange cavity (12) comprises a plurality of cooling cavities (26) arranged in parallel and inclined from the water inlet end to the water outlet end, and the two sides of the cooling cavity (26) are provided with connecting main pipes (27).

5. The temperature rise test cooling device of claim 4, wherein, The first heat exchange cavity (11) comprises a plurality of heat exchange cavities (28) arranged in parallel and inclined from the water inlet end to the water outlet end, and the two sides of the heat exchange cavity (28) are provided with heat exchange main pipes (29).

6. The temperature rise test cooling device of claim 1, wherein, The second conduit is provided with a third temperature sensor (30) for detecting the temperature of the heat exchange liquid sent into the second heat exchange cavity (12) in the second conduit.

7. A temperature rise test cooling arrangement according to any one of claims 1 to 5, characterised in that, When the temperature is raised, the semiconductor refrigeration sheet is started to work, the heating surface is used for heating, the refrigeration surface is used for refrigeration, the first circulating pump pumps the hot water in the heat storage box into the first heat exchange cavity in the heat exchange base to raise the temperature of the heat exchange base, and the second temperature sensor is used to detect the temperature of the heat exchange liquid sent into the first heat exchange cavity, and the first temperature sensor is used to detect the temperature of the heat exchange base. When the data difference between the temperatures detected by the first temperature sensor and the second temperature sensor reaches the set difference, the first circulating pump stops working, the water in the first heat exchange cavity automatically flows out, the temperature riser is started to raise the temperature of the heat exchange base, and the electronic equipment fixed on the heat exchange base is raised in temperature, and hot air is blown to the electronic equipment by the air pipe; When the electronic equipment after temperature rise is cooled, the semiconductor refrigeration sheet is used to cool the refrigeration liquid in the refrigeration cavity during the last cycle, the second circulating pump pumps the cold water in the refrigeration box into the second heat exchange cavity in the heat exchange base to cool the heat exchange base, and the conveying fan blows the cold air after heat exchange in the refrigeration box to the surface of the electronic equipment for temperature test to quickly cool.

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