Cooling capacity distribution unit and control method thereof

Abstract

The invention provides a cooling capacity distribution unit and a control method thereof.The cooling capacity distribution unit comprises a heat exchanger, a first heat exchange flow path and a second heat exchange flow path are formed in the heat exchanger, heat exchange media circulating in the first heat exchange flow path and the second heat exchange flow path can exchange heat with each other, the first heat exchange flow path and a cooling tower form a primary side cooling cycle, and the second heat exchange flow path and the cooling tower form a secondary side cooling cycle; the cooling capacity distribution unit further comprises a bypass pipeline and an electric appliance box, the bypass pipeline and the second heat exchange flow path are connected in parallel, the bypass pipeline is provided with a heat exchange section, and the heat exchange section is located in the electric appliance box to cool a circuit board in the electric appliance box. The power consumption of the liquid cooling system for the data center is reduced; and the heat exchange medium in the secondary side cooling circulation is utilized, so that the probability of condensation at the electric appliance box can be reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of air conditioning, and in particular relates to a cooling capacity distribution unit and a control method thereof. Background Art

[0002] Since Moore's Law was proposed, the number of transistors in chips has continued to increase. As performance increases, chip power consumption also continues to increase. At the same time, with the development of AI technology and intelligent technology, the demand for data center server performance is increasing. The heat load of a single cabinet has climbed from tens of kilowatts to hundreds of kilowatts. Conventional air-cooling heat dissipation technology is no longer applicable. Compared with conventional air-cooled server cabinets, distributed liquid cooling distribution units have high heat exchange efficiency and are more energy-efficient, making them a better choice for building high-performance, green and energy-saving data centers.

[0003] However, the inventors found that after the current data center is built, electricity costs account for 60% to 70% of the total operation and maintenance costs, and the electricity costs used by the liquid cooling system account for about 40% of this. Therefore, how to reduce the power consumption of the liquid cooling system and reduce PUE (Power Usage Effectiveness) has become the key to building a green data center. Summary of the invention

[0004] Therefore, the present invention provides a cooling capacity distribution unit and a control method thereof, which can solve the technical problem of high power consumption of the liquid cooling system for the data center in the prior art.

[0005] In order to solve the above problems, the present invention provides a cooling capacity distribution unit, including a heat exchanger, wherein a first heat exchange flow path and a second heat exchange flow path are formed in the heat exchanger, and the heat exchange medium flowing in the first heat exchange flow path and the second heat exchange flow path respectively can exchange heat with each other, the first heat exchange flow path and the cooling tower form a primary side cooling cycle, and the second heat exchange flow path and the server of the data center form a secondary side cooling cycle, and the cooling capacity distribution unit also includes: a bypass pipe and an electrical box, the bypass pipe is connected in parallel with the second heat exchange flow path, the bypass pipe has a heat exchange section, and the heat exchange section is located in the electrical box to cool the circuit board in the electrical box.

[0006] In some embodiments, the bypass pipeline is connected in series with a first flow control valve; and / or,

[0007] The circuit board includes a unit main control board and a unit power supply board, and the heat exchange section includes a first section corresponding to the unit main control board and a second section corresponding to the unit power supply board.

[0008] In some embodiments, the outlet of a first water pump is connected in series in the secondary cooling cycle and is connected to the inlet of the second heat exchange flow path, the first port of the bypass line is connected to the outlet of the second heat exchange flow path, and the second port of the bypass line is connected to the inlet of the first water pump.

[0009] In some embodiments, the first water pumps include two connected in parallel, and the two first water pumps can be independently controlled to start and stop; and / or,

[0010] The cold capacity distribution unit further includes a pressure-stabilizing liquid replenishing component, and a liquid outlet of the pressure-stabilizing liquid replenishing component is communicated with an inlet of the first water pump.

[0011] In some embodiments, the pressure-stabilizing fluid infusion component includes a medium holding box and an expansion tank that are controllably connected to an external cooling medium. A fluid infusion pipeline is arranged between the outlet of the medium holding box and the inlet of the first water pump. A second water pump and / or an on-off valve are connected in series to the fluid infusion pipeline. The outlet of the expansion tank is connected to the fluid infusion pipeline between the inlet of the first water pump and the outlet of the second water pump.

[0012] In some embodiments, the cooling capacity distribution unit further includes a unit shell having a accommodating space, the heat exchanger and the electrical box are both assembled in the accommodating space, the first heat exchange flow path has a first liquid inlet pipe and a first liquid outlet pipe, the second heat exchange flow path has a second liquid inlet pipe and a second liquid outlet pipe, the second liquid inlet pipe, the second liquid outlet pipe and the second heat exchange flow path are all located in the upper area of ​​the first liquid inlet pipe, the first liquid outlet pipe and the first heat exchange flow path, and the first water pump and the pressure stabilizing and liquid replenishing component are both assembled in the accommodating space.

[0013] In some embodiments, a second flow control valve is connected in series in the primary cooling cycle.

[0014] The present invention also provides a control method for the above-mentioned cooling capacity distribution unit. When a first flow control valve is connected in series on the bypass pipeline, the control method comprises the following steps:

[0015] The real-time temperature Ts of the circuit board is obtained, and when the real-time temperature Ts is higher than a first preset temperature Ty1, the opening of the first flow control valve is controlled to increase.

[0016] In some embodiments, after the opening of the first flow control valve increases to the maximum and lasts for a first time, when Ts is still higher than Ty1, the first water pump is controlled to increase its rotation speed.

[0017] In some embodiments, before controlling the opening of the first flow control valve to increase when Ts is higher than Ty, first obtain the water supply temperature Tg of the secondary cooling cycle;

[0018] When the water supply temperature Tg is higher than the second preset temperature Ty2, the opening of the first flow control valve is controlled to increase; or,

[0019] When the water supply temperature Tg is not higher than the second preset temperature Ty2, the supply and return water temperature difference △Tc of the primary side cooling cycle is further obtained. When △Tc is less than the preset temperature difference △Ty, the opening of the second flow control valve of the secondary side cooling cycle is controlled to decrease and the first water pump is kept running at the current speed. When △Tc is not less than the preset temperature difference △Ty, the first water pump is kept running at the current speed.

[0020] A cooling capacity distribution unit and a control method thereof provided by the present invention have the following beneficial effects:

[0021] A bypass pipeline connected in parallel with the second heat exchange flow path is provided to dissipate heat and cool the circuit board in the electrical box, that is, the heat exchange medium in the secondary cooling cycle is used to cool the electrical box of the cooling distribution unit. On the one hand, it can ensure efficient cooling of the electrical box, ensure reliable and stable operation of the unit and the system using it, eliminate the disadvantage of large power consumption caused by the traditional configuration of cooling fans, and reduce the power consumption of the liquid cooling system for the data center; on the other hand, the heat exchange medium in the secondary cooling cycle can also reduce the probability of condensation at the electrical box;

[0022] By arranging the first flow control valve in series on the bypass pipeline, the flow of the heat exchange medium entering the bypass pipeline can be accurately controlled, and the pressure difference of the secondary cooling cycle can be accurately controlled, so that the efficient heat dissipation cooling of the server by the secondary cooling cycle can be ensured while the effective cooling of the electrical box is ensured;

[0023] Through the redundant setting of the first water pump, when one first water pump fails to operate normally, the other first water pump will be controlled to continue to operate, ensuring reliable cooling of the server;

[0024] Providing a pressure-stabilizing and liquid-supplementing component at the inlet of the first water pump can effectively prevent the first water pump from being damaged by cavitation in the pump body due to lack of liquid at the inlet during operation;

[0025] On the one hand, the functional components and pipelines of the cooling distribution unit are assembled in the unit shell to ensure the compactness of the unit structure and facilitate the convenient assembly with the aforementioned cooling tower and server; on the other hand, the second liquid inlet pipe, the second liquid outlet pipe and the second heat exchange flow path are all located in the upper area of ​​the first liquid inlet pipe, the first liquid outlet pipe and the first heat exchange flow path, forming an upper and lower layered arrangement in the accommodating space, which can further reduce the difficulty of assembling the functional components in the accommodating space;

[0026] When the real-time temperature Ts of the circuit board is higher than the first preset temperature Ty1, the opening of the first flow control valve is controlled to increase, that is, the flow of the heat exchange medium in the secondary cooling cycle entering the electrical box through the bypass pipeline is increased, so that the temperature of the circuit board can be reduced more promptly to prevent the circuit board from over-temperature rise. It should be particularly emphasized that during this process, the operating speed of the first water pump remains unchanged, and the diversion of the heat exchange medium in the secondary cooling cycle can be used to adjust the cooling capacity of the circuit board and reduce unit energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. The drawings described below are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0028] Figure 1 is a schematic diagram of the system principle of a cooling capacity distribution unit according to an embodiment of the present invention;

[0029] Figure 2 3. It is a schematic diagram of the three-dimensional structure of the cooling capacity distribution unit according to an embodiment of the present invention (the cover of the electrical box is omitted in the figure);

[0030] Figure 3 1 is a schematic diagram of the three-dimensional structure of the cooling capacity distribution unit of an embodiment of the present invention (the cover plate of the electrical box is shown in the figure);

[0031] Figure 4 yes Figure 2 A top view of

[0032] Figure 5 yes Figure 2 A schematic diagram of the three-dimensional structure of the electrical box in FIG.

[0033] Figure 6 yes Figure 5 Schematic diagram of the structure on the back side of the circuit board.

[0034] The accompanying drawings are marked as follows:

[0035] 1. Heat exchanger; 11. First heat exchange flow path; 111. First liquid inlet pipe; 112. First liquid outlet pipe; 12. Second heat exchange flow path; 121. Second liquid inlet pipe; 122. Second liquid outlet pipe; 2. Electrical box; 21. Unit main control board; 22. Unit power board; 31. First water pump; 321. Medium holding box; 322. Expansion tank; 323. Second water pump; 324. On-off valve; 33. Filter; 34. Drain valve; 4. Unit housing; 100. Bypass pipeline; 101. Heat exchange section; 102. First flow control valve; 103. Liquid inlet pipe section; 104. Liquid outlet pipe section; 201. Second flow control valve. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0038] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90° or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0039] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0040] See also Figure 1 and Figure 6 As shown, according to an embodiment of the present invention, a cooling capacity distribution unit is provided, including a heat exchanger 1 (in a specific embodiment, a plate heat exchanger), wherein a first heat exchange flow path 11 and a second heat exchange flow path 12 are formed in the heat exchanger 1, and the heat exchange mediums respectively flowing in the first heat exchange flow path 11 and the second heat exchange flow path 12 can exchange heat with each other, that is, the heat exchange medium in the first heat exchange flow path 11 and the heat exchange medium in the second heat exchange flow path 12 form heat exchange in the heat exchanger 1, the heat exchange medium in the first heat exchange flow path 11 and the heat exchange medium in the second heat exchange flow path 12 can be the same or different, for example, both can be water, and the first heat exchange flow path 11 and a cooling tower (not shown in the figure, not labeled) form a primary cooling cycle (that is, Figure 1 The second heat exchange flow path 12 forms a secondary cooling cycle (i.e. Figure 1 The cooling capacity distribution unit further comprises: a bypass line 100 and an electrical box 2. The bypass line 100 is connected in parallel with the second heat exchange path 12. The bypass line 100 has a heat exchange section 101. The heat exchange section 101 is located in the electrical box 2 to cool the circuit board in the electrical box 2. The aforementioned circuit board includes, for example, a unit main control board 21 and a unit power board 22. Of course, in some specific operating conditions, it may also include other circuit boards.

[0041] In this technical solution, a bypass pipeline 100 connected in parallel with the second heat exchange flow path 12 is set to dissipate heat and cool the circuit board in the electrical box 2, that is, the heat exchange medium in the secondary cooling cycle is used to cool the electrical box 2 of the cold distribution unit. On the one hand, it can ensure efficient cooling of the electrical box 2, ensure the reliable and stable operation of the unit and the system using it, eliminate the disadvantage of high power consumption caused by the traditional configuration of cooling fans, and reduce the power consumption of the liquid cooling system for the data center; on the other hand, the use of the heat exchange medium in the secondary cooling cycle can also reduce the probability of condensation occurring at the electrical box 2.

[0042] In addition, it should be particularly emphasized that the present invention utilizes heat exchange medium to achieve distributed heat exchange for servers in the data center, which has higher heat exchange efficiency and is more energy-efficient, and is a better choice for building a high-performance, green and energy-saving data center.

[0043] In some embodiments, a first flow control valve 102, such as an electric ball valve, is connected in series to the bypass line 100. By setting the first flow control valve 102 in series to the bypass line 100, it is possible to accurately control the flow of the heat exchange medium entering the bypass line 100 while accurately controlling the pressure difference of the secondary cooling cycle. This can ensure effective cooling of the electrical box 2 while ensuring efficient heat dissipation cooling of the server by the secondary cooling cycle.

[0044] In a specific embodiment, the heat exchange section 101 has a first section (not labeled in the figure) corresponding to the unit main control board 21 and a second section (not labeled in the figure) corresponding to the unit power board 22. The heat exchange section 101 includes the first section and the second section for the unit main control board 21 and the unit power board 22, respectively, which can ensure that the cold introduced into the bypass pipeline 100 is used in a targeted manner, further reducing energy consumption. Figure 6 As shown, in a specific embodiment, the first section and the second section are respectively zigzag heat exchange structures, which can significantly improve the heat exchange efficiency. Specifically, the bottom sides of the unit main control board 21 and the unit power board 22 are respectively provided with heat exchange bases (not marked in the figure), and the heat exchange bases can be made of aluminum. The first section and the second section are respectively arranged in the corresponding heat exchange bases. The heat exchange bases even out the cold in the heat exchange section 101 and further contact the corresponding unit main control board 21 and the unit power board 22 for heat exchange, effectively preventing the condensation phenomenon caused by uneven cold.

[0045] In some embodiments, the outlet of the first water pump 31 is connected in series in the secondary cooling cycle and is connected to the inlet of the second heat exchange flow path 12, the first port of the bypass line 100 is connected to the outlet of the second heat exchange flow path 12, and the second port of the bypass line 100 is connected to the inlet of the first water pump 31.

[0046] In this technical solution, the first water pump 31 can not only realize the flow drive of the heat exchange medium in the secondary side cooling cycle, but also realize the synchronous flow drive of the heat exchange medium in the bypass pipeline 100. There is no need to set up corresponding pumping components for the bypass pipeline 100 separately, thereby reducing the design cost.

[0047] In some embodiments, the first water pump 31 has two in parallel, and the two first water pumps 31 can be independently controlled to start and stop, so that one first water pump 31 can be used and the other can be used as a backup, preventing the server from not being cooled in time after a water pump fails. In the present invention, through the redundant setting of the first water pump 31, when one first water pump 31 fails and cannot operate normally, the other first water pump 31 will be controlled to continue to operate, ensuring reliable cooling of the server. It is worth emphasizing that the two first water pumps 31 form a cross-staggered arrangement, which can make the structure more compact.

[0048] See Figure 1 As shown, the cold capacity distribution unit further includes a pressure-stabilizing liquid replenishing component (not labeled in the figure), and the liquid outlet of the pressure-stabilizing liquid replenishing component is connected to the inlet of the first water pump 31.

[0049] In this technical solution, a pressure-stabilizing and liquid-supplementing component is provided at the inlet of the first water pump 31 , which can effectively prevent cavitation damage to the pump body caused by lack of liquid at the inlet of the first water pump 31 during operation.

[0050] In a specific embodiment, see Figure 1 As shown, the pressure-stabilizing fluid infusion component includes a medium holding box 321 and an expansion tank 322 which are controllably connected to an external cooling medium. A fluid infusion pipeline (not marked in the figure) is arranged between the outlet of the medium holding box 321 and the inlet of the first water pump 31. A second water pump 323 and / or an on-off valve 324 (specifically, an electromagnetic on-off valve) are connected in series on the fluid infusion pipeline. The outlet of the expansion tank 322 is connected to the fluid infusion pipeline between the inlet of the first water pump 31 and the outlet of the second water pump 323.

[0051] In this technical solution, when the amount of heat exchange medium in the secondary cooling cycle is insufficient, the medium holding box 321 ensures that the amount of heat exchange medium in the secondary cooling cycle is sufficient through the operation of the second water pump 323 and the conduction and replenishment of fluid by the on-off valve 324, and the expansion tank 322 can ensure that the pressure of the heat exchange medium in the secondary cooling cycle is stable.

[0052] In some embodiments, the cooling capacity distribution unit further includes a unit shell 4, the unit shell 4 has a accommodating space (not marked in the figure), the heat exchanger 1 and the electrical box 2 are both assembled in the accommodating space, the first heat exchange flow path 11 has a first liquid inlet pipe 111 and a first liquid outlet pipe 112, the second heat exchange flow path 12 has a second liquid inlet pipe 121 and a second liquid outlet pipe 122, the second liquid inlet pipe 121, the second liquid outlet pipe 122 and the second heat exchange flow path 12 are all located in the upper area of ​​the first liquid inlet pipe 111, the first liquid outlet pipe 112 and the first heat exchange flow path 11, the first water pump 31 and the pressure stabilizing liquid replenishing component are both assembled in the accommodating space, and the aforementioned first liquid inlet pipe 111, the first liquid outlet pipe 112, the second liquid inlet pipe 121 and the second liquid outlet pipe 122 are respectively connected to the pipe openings of the aforementioned server and the cooling tower.

[0053] In this technical solution, on the one hand, the functional components and pipelines of the cooling distribution unit are assembled in the unit casing 4 to ensure the compactness of the unit structure and facilitate easy assembly with the aforementioned cooling tower and server; on the other hand, the second liquid inlet pipe 121, the second liquid outlet pipe 122 and the second heat exchange flow path 12 are all located in the upper area of ​​the first liquid inlet pipe 111, the first liquid outlet pipe 112 and the first heat exchange flow path 11, forming an upper and lower layered arrangement in the accommodating space. Compared with the parallel arrangement, the structure is more compact and more convenient for the placement of components, which can further reduce the difficulty of assembling the functional components in the accommodating space.

[0054] In a preferred embodiment, the bypass pipeline 100 further includes a liquid outlet pipe section 104 connected to the aforementioned liquid infusion pipeline and a liquid inlet pipe section 103 connected to the aforementioned second liquid outlet pipe 122, and the first flow control valve 102 is specifically connected in series to the liquid inlet pipe section 103. The heat exchange medium in the liquid inlet pipe section 103 first exchanges heat with the unit power board 22 to achieve efficient cooling of the unit power board 22, and then flows to the unit main control board 21 to cool the unit main control board 21, and then flows out from the liquid outlet pipe section 104 and flows back to the first water pump 31 via the liquid infusion pipeline.

[0055] In some embodiments, a second flow control valve 201 is connected in series in the primary side cooling cycle. The second flow control valve 201 can specifically adopt an electromagnetic proportional valve to control the flow of the heat exchange medium in the primary side cooling cycle, thereby adjusting the consumption of the cooling tower's cold energy in the cold energy distribution unit. For example, when the heat exchange load of the server is relatively small, the second flow control valve 201 is adjusted to reduce the flow of the heat exchange medium in the primary side cooling cycle, thereby reducing the conduction from the cooling tower to the cold energy distribution unit.

[0056] See Figure 1As shown, a filter 33 is also provided at the corresponding pipeline position of the primary side cooling cycle, and the filter 33 is used to filter impurities in the circulating heat exchange medium to ensure its cleanliness; the primary side cooling cycle and the secondary side cooling cycle are provided with a drain valve 34 at the corresponding position, and the drain valve 34 can ensure that the residual liquid can be discharged more conveniently when the cooling distribution unit is replaced.

[0057] According to an embodiment of the present invention, a control method for the above-mentioned cooling capacity distribution unit is also provided. When a first flow control valve 102 is connected in series to the bypass pipeline 100, the control method comprises the following steps:

[0058] The real-time temperature Ts of the circuit board is obtained. When the real-time temperature Ts is higher than the first preset temperature Ty1, the opening of the first flow control valve 102 is controlled to increase. Generally speaking, since the unit power board 22 has the largest temperature rise in the circuit board in the electrical box 2, the real-time temperature Ts can be based on the real-time monitoring temperature of the unit power board 22.

[0059] In this technical solution, when the real-time temperature Ts of the circuit board is higher than the first preset temperature Ty1, the opening of the first flow control valve 102 is controlled to increase, that is, the flow of the heat exchange medium in the secondary cooling cycle into the electrical box 2 through the bypass pipe 100 is increased, so that the temperature of the circuit board can be reduced more promptly to prevent the circuit board from over-temperature rise. It should be particularly emphasized that during this process, the operating speed of the first water pump 31 remains unchanged, and the diversion of the heat exchange medium in the secondary cooling cycle can be used to adjust the cooling capacity of the circuit board and reduce the unit energy consumption.

[0060] In some embodiments, after the opening of the first flow control valve 102 increases to the maximum and lasts for a first time (e.g., 2 minutes), when Ts is still higher than Ty1, the first water pump 31 is controlled to increase the speed to increase the flow of the heat exchange medium in the secondary cooling cycle.

[0061] In some embodiments, before controlling the opening of the first flow control valve 102 to increase when Ts is higher than Ty, first obtain the water supply temperature Tg of the secondary cooling cycle (that is, the real-time temperature at the outlet position of the second liquid outlet pipe 122 (that is, the temperature of the heat exchange medium before entering the server)); when the water supply temperature Tg is higher than the second preset temperature Ty2 (in a specific embodiment, Ty2 is 40°C), it means that the chip heat dissipation is poor, so the opening of the first flow control valve 102 is controlled to increase.

[0062] When the water supply temperature Tg is not higher than the second preset temperature Ty2, the supply and return water temperature difference △Tc of the primary side cooling cycle is further obtained. When △Tc is less than the preset temperature difference △Ty, it indicates that most of the heat of the server chip has been dissipated, that is, the heat dissipation demand of the server is relatively small. At this time, the opening of the second flow control valve 201 of the primary side cooling cycle can be reduced, thereby improving the PUE of the entire system. That is, at this time, the opening of the second flow control valve 201 of the secondary side cooling cycle is controlled to be reduced and the first water pump 31 is kept running at the current speed (that is, the speed of the first water pump 31 is not adjusted). When △Tc is not less than the preset temperature difference △Ty, the first water pump 31 is kept running at the current speed.

[0063] It is easy for those skilled in the art to understand that, without conflict, the advantageous technical features of the above-mentioned methods can be freely combined and superimposed.

[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present invention. These improvements and variations should also be regarded as the protection scope of the present invention.

Claims

1. A cooling capacity distribution unit, comprising a heat exchanger (1), wherein a first heat exchange flow path (11) and a second heat exchange flow path (12) are formed in the heat exchanger (1), wherein heat exchange media flowing in the first heat exchange flow path (11) and the second heat exchange flow path (12) respectively can exchange heat with each other, wherein the first heat exchange flow path (11) and the second heat exchange flow path (12) form a primary cooling cycle with a cooling tower, and the second heat exchange flow path (12) and a server in a data center form a secondary cooling cycle, wherein: The cooling capacity distribution unit further comprises: a bypass pipeline (100) and an electrical box (2); the bypass pipeline (100) is connected in parallel with the second heat exchange flow path (12); the bypass pipeline (100) has a heat exchange section (101); the heat exchange section (101) is located in the electrical box (2) to cool the circuit board in the electrical box (2).

2. The cooling capacity distribution unit according to claim 1, characterized in that: The bypass pipeline (100) is connected in series with a first flow control valve (102); and / or, The circuit board comprises a unit main control board (21) and a unit power board (22), and the heat exchange section (101) comprises a first section arranged corresponding to the unit main control board (21) and a second section arranged corresponding to the unit power board (22).

3. The cooling capacity distribution unit according to claim 1 or 2, characterized in that: The outlet of the first water pump (31) is connected in series in the secondary cooling cycle and is connected to the inlet of the second heat exchange flow path (12); the first port of the bypass pipeline (100) is connected to the outlet of the second heat exchange flow path (12); and the second port of the bypass pipeline (100) is connected to the inlet of the first water pump (31).

4. The cooling capacity distribution unit according to claim 3, characterized in that: The first water pumps (31) include two first water pumps (31) connected in parallel, and the two first water pumps (31) can be independently controlled to start and stop; and / or, The cold capacity distribution unit further comprises a pressure-stabilizing liquid replenishing component, the liquid outlet of which is in communication with the inlet of the first water pump (31).

5. The cooling capacity distribution unit according to claim 4, characterized in that: The pressure-stabilizing fluid-infusing component comprises a medium containing box (321) and an expansion tank (322) which are controllably connected to an external cooling medium; a fluid-infusing pipeline is arranged between the outlet of the medium containing box (321) and the inlet of the first water pump (31); a second water pump (323) and / or an on-off valve (324) are connected in series to the fluid-infusing pipeline; and the outlet of the expansion tank (322) is connected to the fluid-infusing pipeline between the inlet of the first water pump (31) and the outlet of the second water pump (323).

6. The cooling capacity distribution unit according to claim 4, characterized in that: The heat exchanger (1) and the electrical box (2) are both assembled in the accommodating space. The first heat exchange flow path (11) has a first liquid inlet pipe (111) and a first liquid outlet pipe (112). The second heat exchange flow path (12) has a second liquid inlet pipe (121) and a second liquid outlet pipe (122). The second liquid inlet pipe (121), the second liquid outlet pipe (122) and the second heat exchange flow path (12) are all located in the upper area of ​​the first liquid inlet pipe (111), the first liquid outlet pipe (112) and the first heat exchange flow path (11). The first water pump (31) and the pressure-stabilizing liquid replenishing component are both assembled in the accommodating space.

7. The cooling capacity distribution unit according to claim 1, characterized in that: A second flow control valve (201) is connected in series in the primary cooling cycle.

8. A control method for a cooling distribution unit according to any one of claims 1 to 7, characterized in that: When a first flow control valve (102) is connected in series to the bypass pipeline (100), the control method comprises the following steps: The real-time temperature Ts of the circuit board is obtained, and when the real-time temperature Ts is higher than a first preset temperature Ty1, the opening of the first flow control valve (102) is controlled to increase.

9. The control method of the cooling distribution unit according to claim 8, characterized in that: After the opening degree of the first flow control valve (102) increases to the maximum and lasts for a first time, when Ts is still higher than Ty1, the first water pump (31) is controlled to increase its rotation speed.

10. The control method of the cooling distribution unit according to claim 8, characterized in that: When Ts is higher than Ty, before controlling the opening of the first flow control valve (102) to increase, first obtain the water supply temperature Tg of the secondary cooling cycle; When the water supply temperature Tg is higher than the second preset temperature Ty2, the opening of the first flow control valve (102) is controlled to increase; or, When the water supply temperature Tg is not higher than the second preset temperature Ty2, the supply and return water temperature difference ΔTc of the primary side cooling cycle is further obtained. When ΔTc is less than the preset temperature difference ΔTy, the opening of the second flow control valve (201) of the secondary side cooling cycle is controlled to decrease and the first water pump (31) is kept running at the current speed. When ΔTc is not less than the preset temperature difference ΔTy, the first water pump (31) is kept running at the current speed.

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