Cooling equipment and data center

Abstract

The embodiment of the invention provides cooling equipment and a data center, the cooling equipment comprises a heat exchange module, a first heat exchange flow path and a second heat exchange flow path are defined in the heat exchange module, the first heat exchange flow path is used for allowing a cooling medium to flow, and the second heat exchange flow path is used for allowing a heat exchange medium to flow; the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path so as to reduce the temperature of the cooling medium; the first pipeline group comprises a first liquid supply pipeline and a first liquid return pipeline; the second pipeline group comprises a second liquid supply pipeline and a second liquid return pipeline; the first pipeline set and the second pipeline set are arranged on the two opposite sides of the heat exchange module correspondingly. According to the technology, the heat exchange efficiency of the cooling system in the equipment cluster can be improved, meanwhile, the pipeline design of the cooling system is optimized, and a better heat dissipation effect is achieved in the limited space of the equipment cluster.

Description

Technical Field

[0001] The present application relates to the technical field of equipment cluster cooling, and in particular to a cooling device and a data center. Background Art

[0002] Computing systems, server clusters, data centers and other high-performance computing equipment clusters generate a lot of heat during operation. An effective heat dissipation system can ensure that the equipment cluster operates within a safe temperature range and prevent performance degradation and hardware damage caused by overheating.

[0003] A heat dissipation system using air cooling has been proposed in the related art. The cooling effect of air cooling is limited and it is difficult to meet the heat dissipation requirements of high-performance and highly integrated computing devices. The liquid cooling system can directly or indirectly remove the heat generated by the computing device through a liquid cooling medium (such as water or coolant), and has better heat dissipation efficiency and temperature control performance than the air cooling system. However, the existing liquid cooling system has a simple structure, limited functions, and the pipeline design needs to be optimized. Summary of the invention

[0004] The embodiments of the present application provide a cooling device and a data center to solve or alleviate one or more technical problems in the prior art.

[0005] As one aspect of an embodiment of the present application, an embodiment of the present application provides a cooling device, including: a heat exchange module, which defines a first heat exchange flow path and a second heat exchange flow path inside, the first heat exchange flow path is used to supply a cooling medium to flow, the second heat exchange flow path is used to supply a heat exchange medium to flow, the cooling medium in the first heat exchange flow path and the heat exchange medium in the second heat exchange flow path perform heat exchange to reduce the temperature of the cooling medium; a first pipeline group, including a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected to the output end of the first heat exchange flow path, and the first liquid supply pipeline is connected to the computing assembly The first liquid return pipeline is connected to the liquid inlet of the cooling flow path; the first liquid return pipeline is connected to the input end of the first heat exchange flow path, and the first liquid return pipeline is connected to the liquid outlet of the cooling flow path; the second pipeline group includes a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected to the input end of the second heat exchange flow path, and the second liquid supply pipeline is connected to the medium output end of the cold source equipment; the second liquid return pipeline is connected to the output end of the second heat exchange flow path, and the second liquid return pipeline is connected to the medium return end of the cold source equipment; wherein the first pipeline group and the second pipeline group are respectively arranged on opposite sides of the heat exchange module.

[0006] In one embodiment, there are multiple computing assemblies, and the multiple computing assemblies are arranged side by side along a first direction; the heat exchange module is disposed on one side of the multiple computing assemblies in the first direction, and the first pipeline group and the second pipeline group are respectively disposed on opposite sides of the heat exchange module in the second direction, and the second direction intersects with the first direction.

[0007] In one embodiment, the first liquid supply pipeline is connected to the liquid inlets of the cooling flow paths of the plurality of computing assemblies respectively.

[0008] In one embodiment, the first liquid supply pipeline includes a first liquid supply sub-pipeline and a second liquid supply sub-pipeline that are connected to each other. The first liquid supply sub-pipeline and the second liquid supply sub-pipeline extend in the first direction respectively, and are arranged side by side and at intervals in the second direction. The first end of the first liquid supply sub-pipeline is connected to the output end of the first heat exchange flow path, the second end of the first liquid supply sub-pipeline is connected to the first end of the second liquid supply sub-pipeline, and the second end of the second liquid supply sub-pipeline is provided with an exhaust valve.

[0009] In one embodiment, the second liquid supply sub-pipeline is provided with a plurality of liquid distribution ports, which are arranged at intervals along the first direction and correspond one-to-one to a plurality of computing assemblies, and each liquid distribution port is connected to a liquid inlet of a cooling flow path of a corresponding computing assembly.

[0010] In one embodiment, the first liquid return pipeline includes a first liquid return section, and the first liquid return section is provided with multiple liquid return ports. The multiple liquid return ports are arranged at intervals along the first direction and correspond one-to-one to multiple computing assemblies. Each liquid return port is connected to the liquid outlet of the cooling flow path of the corresponding computing assembly.

[0011] In one embodiment, the first liquid supply pipeline includes a first liquid supply sub-pipeline and a second liquid supply sub-pipeline arranged side by side and at intervals in the second direction, and the first liquid return section is arranged between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

[0012] In one embodiment, the first liquid return pipeline also includes a second liquid return section and a third liquid return section, the second liquid return section and the third liquid return section extend along a third direction respectively, and the third direction is perpendicular to the first direction and the second direction respectively; the first end of the first liquid return section is closed, the second end of the first liquid return section is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path.

[0013] In one embodiment, a first power device is further provided between the second end of the second liquid return section and the first end of the third liquid return section, and the first power device is used to provide power for the flow of the cooling medium.

[0014] In one embodiment, the cooling device also includes a first liquid storage container; the first liquid return pipeline also includes a first liquid replenishment branch, the first end and the second end of the first liquid replenishment branch are respectively connected to the interior of the second liquid return section, and a first liquid replenishment interface is opened on the wall of the first liquid replenishment branch, and the first liquid replenishment interface is connected to the interior of the first liquid storage container through a first connecting branch.

[0015] In one embodiment, the first liquid storage container is disposed below the heat exchange module.

[0016] In one embodiment, the cooling device also includes a first pressure stabilizing tank; the first liquid return pipeline also includes a first pressure stabilizing branch pipe, the first end of the first pressure stabilizing branch pipe is connected to the interior of the first pressure stabilizing tank, and the second end of the first pressure stabilizing branch pipe is connected to the interior of the third liquid return section.

[0017] In one embodiment, the first pressure stabilizing tank is disposed below the heat exchange module.

[0018] In one embodiment, the second liquid supply pipeline includes a first liquid supply section and a second liquid supply section connected to each other, the first end of the first liquid supply section is connected to the medium output end of the cold source equipment, the second end of the first liquid supply section is connected to the first end of the second liquid supply section, and the second end of the second liquid supply section is connected to the input end of the second heat exchange flow path; wherein the first liquid supply section and the second liquid supply section extend respectively along the third direction and are spaced apart in the first direction.

[0019] In one embodiment, a second power device is further provided between the second end of the first liquid supply section and the first end of the second liquid supply section, and the second power device is used to provide power for the flow of the heat exchange medium.

[0020] In one embodiment, the cooling device also includes a second liquid storage container; the second liquid supply pipeline also includes a second liquid replenishment branch, the first end and the second end of the second liquid replenishment branch are respectively connected to the interior of the first liquid supply section, and a second liquid replenishment interface is opened on the tube wall of the second liquid replenishment branch, and the second liquid replenishment interface is connected to the interior of the second liquid storage container through a second connecting branch.

[0021] In one embodiment, the second liquid storage container is disposed below the heat exchange module.

[0022] In one embodiment, the cooling device further includes a second pressure stabilizing tank; the second liquid supply pipeline further includes a second pressure stabilizing branch pipe, the first end of the second pressure stabilizing branch pipe is connected to the interior of the second pressure stabilizing tank, and the second end of the second pressure stabilizing branch pipe is connected to the interior of the first liquid supply section.

[0023] In one embodiment, the second pressure stabilizing tank is disposed below the heat exchange module.

[0024] In one embodiment, the medium flow directions of the first heat exchange flow path and the second heat exchange flow path are opposite.

[0025] In one embodiment, the input end of the first heat exchange flow path is located below the output end of the first heat exchange flow path; the input end of the second heat exchange flow path is located above the output end of the second heat exchange flow path.

[0026] An embodiment of the present application also provides a data center, including: at least one computing assembly, the computing assembly includes a cabinet, multiple computing devices and a cooling flow path, the multiple computing devices are integrated in the cabinet, and the cooling flow path is used to supply a cooling medium to flow through the multiple computing devices; a cold source device, used to cool the heat exchange medium; a cooling device of any of the above-mentioned embodiments of the present application, the first heat exchange flow path of the heat exchange module is connected to the cooling flow path of at least one computing assembly to form a first circulation flow path, and the second heat exchange flow path of the heat exchange module is connected to the cold source device to form a second circulation flow path.

[0027] In one embodiment, the data center further includes a box, and the computing assembly and cooling equipment are arranged inside the box.

[0028] The cooling device provided in the embodiment of the present application uses a heat exchange module to enable the cooling medium in the first heat exchange path to exchange heat with the heat exchange medium in the second heat exchange path, which can improve the heat exchange efficiency of the cooling system in the equipment cluster, while optimizing the pipeline design of the cooling system, thereby achieving better heat dissipation effect in the limited space of the equipment cluster.

[0029] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0031] Figure 1 A schematic diagram showing the cooling principle of a cooling device according to an embodiment of the present application;

[0032] Figure 2 A partial structural schematic diagram of a data center according to an embodiment of the present application is shown;

[0033] Figure 3 A schematic diagram showing the structure of the first pipeline group and the second pipeline group in an embodiment of the present application at a certain viewing angle;

[0034] Figure 4 A schematic diagram showing the first pipeline group and the second pipeline group of the embodiment of the present application at another viewing angle;

[0035] Figure 5 A schematic diagram of the overall structure of a data center according to an embodiment of the present application is shown.

[0036] Description of reference numerals:

[0037] Data Center 1;

[0038] Cooling device 100;

[0039] Heat exchange module 10; first heat exchange flow path 10a; second heat exchange flow path 10b;

[0040] First pipeline group 20; first liquid supply pipeline 21; first liquid supply sub-pipeline 211; second liquid supply sub-pipeline 212; liquid distribution port 212a; exhaust valve 212b; first liquid return pipeline 22; first liquid return section 221; liquid return port 221a; second liquid return section 222; third liquid return section 223; first liquid replenishment branch pipe 224; first liquid replenishment interface 224a; first pressure stabilizing branch pipe 225;

[0041] The second pipeline group 30; the second liquid supply pipeline 31; the first liquid supply section 311; the second liquid supply section 312; the second liquid replenishment branch 313; the second liquid replenishment interface 313a; the second pressure stabilizing branch 314; the second liquid return pipeline 32;

[0042] A first power device 40; a second power device 50; a first surge tank 60; a second surge tank 70; a first liquid storage container 80; a second liquid storage container 90;

[0043] Computing assembly 200; cooling flow path 210; cabinet 220; computing device 230;

[0044] Cold source equipment 300; liquid inlet pipeline 301; liquid outlet pipeline 302;

[0045] Box 400;

[0046] Frame structure 500;

[0047] Support platform 600;

[0048] Power distribution cabinet 700;

[0049] The first direction L1; the second direction L2; the third direction L3. DETAILED DESCRIPTION

[0050] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0051] In related technologies, a computing assembly is a complete computing system that integrates physical components and program components and is capable of performing specific computing tasks. In modern computing device clusters, especially high-performance computing systems, data centers, and server clusters, computing assemblies generate a lot of heat during operation. An effective heat dissipation system can ensure that the computing device cluster operates within a safe temperature range and prevent performance degradation and hardware damage caused by overheating.

[0052] Based on this, the embodiments of the present application propose a cooling device and a data center, which can improve the cooling efficiency of the computing assembly of the data center, and at the same time optimize the pipeline design of the cooling equipment, and can achieve better heat dissipation effect in the limited space of a computing equipment cluster such as a data center.

[0053] Figure 1 A schematic diagram showing the cooling principle of the cooling device according to an embodiment of the present application is shown. Figure 2 A schematic diagram of the structure of a data center in an embodiment of the present application is shown. Figure 1 , Figure 2 As shown, the cooling device 100 provided in the embodiment of the present application may include a heat exchange module 10 , a first pipeline group 20 and a second pipeline group 30 .

[0054] Specifically, a first heat exchange flow path 10a and a second heat exchange flow path 10b may be defined inside the heat exchange module 10. The first heat exchange flow path 10a may be used for the flow of cooling medium, the second heat exchange flow path 10b may be used for the flow of heat exchange medium, and the cooling medium in the first heat exchange flow path 10b may perform heat exchange with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium.

[0055] The first pipeline group 20 may include a first liquid supply pipeline 21 and a first liquid return pipeline 22. The first liquid supply pipeline 21 may be connected to the output end of the first heat exchange flow path 10a, and the first liquid supply pipeline 21 may be connected to the liquid inlet of the cooling flow path 210 of the computing assembly 200; the first liquid return pipeline 22 may be connected to the input end of the first heat exchange flow path 10a, and the first liquid return pipeline 22 may be connected to the liquid outlet of the cooling flow path 210 of the computing assembly 200. The second pipeline group 30 may include a second liquid supply pipeline 31 and a second liquid return pipeline 32; the second liquid supply pipeline 31 may be connected to the input end of the second heat exchange flow path 10b, and the second liquid supply pipeline 31 may be connected to the medium output end of the cold source device 300; the second liquid return pipeline 32 may be connected to the output end of the second heat exchange flow path 10b, and the second liquid return pipeline 32 may be connected to the medium return end of the cold source device 300; wherein, the first pipeline group 20 and the second pipeline group 30 may be respectively arranged on opposite sides of the heat exchange module 10. In the embodiment of the present application, the heat exchange module 10 may be a heat exchange device integrated with at least two heat exchange flow paths. Through the internal heat conductive material, the heat exchange module 10 can realize the heat exchange of fluids in different heat exchange flow paths. The heat exchange module 10 can adopt a plate type, a shell and tube type, or a spiral plate type structure, and its shell and partition can be made of materials with high thermal conductivity and corrosion resistance, such as copper, stainless steel, nickel-based alloys, or titanium alloys, so as to improve the heat exchange efficiency and durability of the heat exchange device. The embodiment of the present application does not limit the specific type and structure of the heat exchange module 10. Preferably, the heat exchange module 10 can adopt a plate heat exchanger.

[0056] The cooling medium may be a fluid medium that flows through the first heat exchange flow path 10a and needs to be cooled, and the heat exchange medium may be a fluid medium that flows through the second heat exchange flow path 10b and is used to absorb heat. The cooling medium and the heat exchange medium may be fluid media with good thermal conductivity and stability, such as cooling water, refrigerant, etc., which are not specifically limited in the present embodiment of the application.

[0057] In a specific example, the corresponding pipe diameter can be adjusted according to the flow requirements at different locations of the cooling device 100. For example, the nominal diameters of the first pipe group 20 and the second pipe group 30 can be 100 mm, and the nominal diameter of the cooling flow path 210 can be 50 mm.

[0058] It should be noted that the size parameters of the first pipeline group 20 and the second pipeline group 30 are only illustrative descriptions and should not be construed as limitations on the present application. Those skilled in the art can flexibly set the size parameters of the first pipeline group 20 and the second pipeline group 30 according to actual conditions.

[0059] like Figure 1 , Figure 2As shown, the first pipeline group 20 can be connected to the first heat exchange flow path 10a, and the second pipeline group 30 can be connected to the second heat exchange flow path 10b. The first pipeline group 20 and the second pipeline group 30 can be respectively arranged on opposite sides of the heat exchange module 10. It should be noted that, Figure 1 The illustration of the first heat exchange flow path 10a and the second heat exchange flow path 10b in the heat exchange module 10 is to facilitate understanding of the connection relationship between the first heat exchange flow path 10a, the second heat exchange flow path 10b and the first pipeline group 20 and the second pipeline group 30. The embodiment of the present application does not limit the specific structural design of the heat exchange between the first heat exchange flow path 10a and the second heat exchange flow path 10b. For example, parallel heat exchange flow paths, cross heat exchange flow paths or spiral heat exchange flow paths can be used.

[0060] In the embodiment of the present application, the cooling flow path 210 of the computing assembly 200 may be a series of fine pipes. The computing assembly 200 may include a cabinet and multiple computing devices disposed in the cabinet, and a cooling medium flow path is disposed inside the computing device, and the cooling medium flow paths of multiple computing devices together constitute the cooling flow path 210 of the computing assembly 200. The cooling medium flow path may be attached to or embedded in the key heat source parts of the computing device, such as heat-generating electronic components such as a central processing unit, a graphics processing unit, and a memory module.

[0061] For example, the heat exchange module 10 can realize heat exchange between the cooling medium in the first heat exchange flow path 10a and the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium and ensure that the cooling medium is in a low temperature state before entering the first pipeline group 20 through the output end of the first heat exchange flow path 10a. The cold source device 300 can be used to refrigerate the circulating heat exchange medium to ensure that it is in a low temperature state before entering the second heat exchange flow path 10b.

[0062] Specifically, the low-temperature cooling medium can enter the first liquid supply pipeline 21 through the output end of the first heat exchange flow path 10a, and enter the cooling flow path 210 of the computing assembly 200 through the first liquid supply pipeline 21 to absorb the heat generated by the computing assembly 200 during operation; the high-temperature cooling medium after absorbing heat can flow back to the input end of the first heat exchange flow path 10a through the first return liquid pipeline 22, and exchange heat with the heat exchange medium in the second heat exchange flow path 10b in the first heat exchange flow path 10a, thereby circulating.

[0063] The low-temperature heat exchange medium can flow out from the medium output end of the cold source device 300 and enter the second heat exchange flow path 10b via the second liquid supply pipeline 31. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After the heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b increases, and the high-temperature heat exchange medium flows back to the medium return end of the cold source device 300 through the second return liquid pipeline 32. The cold source device 300 further processes the heat exchange medium to cool it down again and prepare to enter the next cooling cycle. The embodiment of the present application does not specifically limit the structure and type of the cold source device 300. For example, the cold source device 300 can cool the heat exchange medium by utilizing a gaseous medium or a liquid medium, and specifically a cooling tower or a dry cooler can be used.

[0064] In this way, the cooling device 100 proposed in the embodiment of the present application uses the heat exchange module 10 to exchange heat between the cooling medium in the first heat exchange path 10a and the heat exchange medium in the second heat exchange path 10b, thereby using the cooled cooling medium to cool the computing assembly 200, which can improve the cooling efficiency of the computing assembly 200 and prevent performance degradation and hardware damage of the computing elements due to overheating.

[0065] It should be noted that the cooling device 100 of the embodiment of the present application can be applied to the data center 1 and integrated with the computing assembly 200 of the data center 1. The data center 1 can specifically adopt a container-type data center, for example, it can include a box 400, and the cooling device 100 and the computing assembly 200 are integrated and arranged inside the box 400. Since the internal space of the box 400 is limited, in order to improve the utilization rate of the internal space of the box 400 and to increase the number of computing assemblies 200 deployed in the box 400 as much as possible, the arrangement of the first pipeline group 20 and the second pipeline group 30 of the cooling device 100 in the box 400 is particularly important.

[0066] In the embodiment of the present application, by respectively arranging the first pipeline group 20 and the second pipeline group 30 on the opposite sides of the heat exchange module 10, on the one hand, it is beneficial to improve the convenience of the pipeline connection between the cooling equipment 100 and the computing assembly 200 and the cold source equipment 300, and on the other hand, it can make full use of the space on both sides of the heat exchange module, so that the first pipeline group 20 and the second pipeline group 30 do not interfere with each other, and can also improve the utilization rate of the internal space of the box 400, thereby improving the structural compactness of the data center 1.

[0067] In one embodiment, the number of computing assemblies 200 may be multiple, and the multiple computing assemblies 200 may be arranged side by side along the first direction L1; the heat exchange module 10 is disposed on one side of the multiple computing assemblies 200 in the first direction L1, and the first pipeline group 20 and the second pipeline group 30 may be respectively disposed on opposite sides of the heat exchange module 10 in the second direction L2, and the second direction L2 may intersect with the first direction L1.

[0068] In the present application embodiment, Figure 2 As shown, the data center 1 may include a box 400 (partial structure of the box 400 is shown in the figure), and a cooling device 100 and a plurality of computing assemblies 200 may be provided inside the box 400. In some specific examples, the box 400 of the data center 1 may be a rectangular parallelepiped structure, and the first direction L1 may be parallel to the length direction of the box 400, wherein the length direction of the box 400 may be understood as a straight line direction extending from one end of the longest side of the box 400 to the other end. The second direction L2 may intersect with the first direction L1. Exemplarily, the second direction L2 may be parallel to the width direction of the box 400, wherein the width direction of the box 400 may be a direction perpendicular to the length direction of the box 400 and in the same plane. It should be noted that the above application examples provided in the embodiments of the present application are for ease of understanding, and the embodiments of the present application do not specifically limit the specific directions and positional relationships of the first direction L1 and the second direction L2.

[0069] Furthermore, multiple computing assemblies 200 may be arranged side by side and adjacent to each other along the first direction L1. The heat exchange module 10 may be arranged on one side of the multiple computing assemblies 200 in the first direction L1, and the first pipeline group 20 and the second pipeline group 30 may be respectively arranged on opposite sides of the heat exchange module 10 in the second direction L2. The cooling device provided in the embodiment of the present application can be applied to the heat dissipation of a high-performance, high-density computing device cluster, and can improve the heat exchange efficiency of the cooling system in the device cluster. By optimizing the spatial arrangement of the heat exchange module and the pipeline group in the cooling device, a better heat dissipation effect is achieved in the limited space of the device cluster.

[0070] In other examples of the present application, multiple computing assemblies 200 may also be arranged side by side and adjacent to each other along the second direction L2. It is understandable that the arrangement of the multiple computing assemblies 200 may be flexibly arranged according to the size of the computing assemblies 200 and the spatial size of the data center 1, as long as the integrated arrangement of the multiple computing assemblies 200 adjacent to each other can be followed.

[0071] In one embodiment, the first liquid supply pipeline 21 may be connected to the liquid inlets of the cooling flow paths 210 of the plurality of computing assemblies 200 respectively.

[0072] For example, each computing assembly 200 may be provided with an independent cooling flow path 210, and the independently provided cooling flow path 210 may ensure that each computing assembly 200 is cooled uniformly, thereby improving the heat dissipation efficiency of each computing assembly 200. The first liquid supply pipeline 21 may be connected to the liquid inlets of the cooling flow paths 210 of the plurality of computing assemblies 200, respectively, to ensure that the cooling medium can flow smoothly into the cooling flow path 210 of each computing assembly 200. In one embodiment, the first liquid supply pipeline 21 may include a first liquid supply sub-pipeline 211 and a second liquid supply sub-pipeline 212 that are connected to each other. The first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 may extend respectively along the first direction L1, and are arranged side by side and at intervals in the second direction L2. The first end of the first liquid supply sub-pipeline 211 may be connected to the output end of the first heat exchange flow path 10a, and the second end of the first liquid supply sub-pipeline 211 may be connected to the first end of the second liquid supply sub-pipeline 212. The second end of the second liquid supply sub-pipeline 212 is provided with an exhaust valve 212b.

[0073] Figure 3 A schematic structural diagram of the first pipeline group and the second pipeline group in an embodiment of the present application at a certain viewing angle is shown. Figure 4 FIG. 1 is a schematic diagram showing the first pipeline group and the second pipeline group of the embodiment of the present application from another perspective. Figures 1 to 4 As shown, the first liquid supply pipeline 21 may include a first liquid supply sub-pipeline 211 and a second liquid supply sub-pipeline 212 that are connected and extend along the first direction L1. Further, the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 may be arranged side by side and at intervals in the second direction L2. By arranging several liquid supply sub-pipelines side by side and at intervals, on the one hand, the flow rate of the medium can be evenly distributed to avoid a single pipeline from being subjected to excessive flow velocity and pressure, thereby reducing the pressure loss of the fluid flow and reducing the local resistance of the fluid when entering and leaving the pipeline. On the other hand, by independently arranging each liquid supply sub-pipeline, the thermal interference of the cooling fluid between the pipelines can be reduced, thereby improving the overall heat exchange efficiency of the cooling device.

[0074] Further, the first end of the first liquid supply sub-pipeline 211 may be connected to the output end of the first heat exchange flow path 10a, so that the cooling medium from the first heat exchange flow path 10a can enter the first liquid supply sub-pipeline 211. The second end of the first liquid supply sub-pipeline 211 may be connected to the first end of the second liquid supply sub-pipeline 212 to form a continuous liquid supply path, ensuring that the cooling medium can flow to the cooling flow path 210 of the computing assembly 200 through the second liquid supply pipeline 21. The second end of the second liquid supply sub-pipeline 212 may be provided with an exhaust valve 212b for exhausting air in the system, preventing air from being obstructed during the flow of the cooling medium, reducing the pressure loss caused by the air during the flow of the cooling medium, and ensuring the smooth flow of the cooling medium.

[0075] In one embodiment, the second liquid supply sub-pipeline 212 may be provided with a plurality of liquid distribution ports 212a, which may be arranged at intervals along the first direction L1 and correspond one-to-one to a plurality of computing assemblies 200, and each liquid distribution port 212a may be connected to the liquid inlet of the cooling flow path 210 of the corresponding computing assembly 200.

[0076] For example, each liquid dispensing port 212a can be connected to a liquid inlet of a cooling flow path of a corresponding computing assembly 200 through a joint. The liquid dispensing port 212a can be opened at the bottom of the wall of the second liquid supply sub-pipeline 212.

[0077] In one embodiment, the first liquid return pipeline 22 may include a first liquid return section 221, and the first liquid return section 221 may be provided with a plurality of liquid return ports 221a, and the plurality of liquid return ports 221a may be arranged at intervals along the first direction L1 and correspond one-to-one to a plurality of computing assemblies 200, and each liquid return port 221a may be connected to the liquid outlet of the cooling flow path 210 of the corresponding computing assembly 200.

[0078] Exemplarily, each liquid return port 221a can be connected to the liquid outlet of the cooling flow path 210 of the corresponding computing assembly 200 through a joint. The high-temperature cooling medium in the cooling flow path 210 of each computing assembly 200 enters the first liquid return pipeline 22 through the liquid return port 221a, and then flows back to the first heat exchange flow path 10a of the heat exchange module 10 through the first liquid return pipeline 22.

[0079] In some specific examples, such as Figure 1 As shown, each liquid distribution port 212a can be connected to the liquid inlet of the cooling flow path 210 of the corresponding computing assembly 200 through the liquid inlet pipeline 301. Each liquid return port 221a can be connected to the liquid outlet of the cooling flow path 210 of the corresponding computing assembly 200 through the liquid outlet pipeline 302. The low-temperature cooling medium in the second liquid supply sub-pipeline 212 can flow into the cooling flow path 210 of the computing assembly 200 through the liquid inlet pipeline 301 to take away the heat generated by the computing assembly during operation. The high-temperature cooling medium in the cooling flow path 210 of each computing assembly 200 can enter the first liquid return pipeline 22 through the liquid outlet pipeline 302, and then flow back to the first heat exchange flow path 10a of the heat exchange module 10 through the first liquid return pipeline 22 to achieve cooling of the cooling medium.

[0080] In some examples, at least one of the liquid inlet pipeline 301 and the liquid inlet pipeline 302 is a hose to adapt to space limitations and facilitate installation and removal.

[0081] In other examples, at least one of the liquid inlet pipeline 301 and the liquid inlet pipeline 302 is a hard pipe to improve the structural strength of the pipeline.

[0082] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the hoses used in the liquid inlet pipelines 301 and 302 can be bendable and elastic pipes such as plastic pipes and corrugated pipes, and the hard pipes can be metal pipes with greater hardness such as copper pipes, aluminum pipes, stainless steel pipes, or plastic pipes with greater hardness and support, or hard pipes made of plastic, metal or composite materials with a certain hardness and bending ability.

[0083] The materials of the liquid inlet pipeline 301 and the liquid inlet pipeline 302 are not limited to the above examples, and can also be any combination of the above materials, such as a soft and hard pipeline, both soft pipes or both hard pipes, etc., but are not limited thereto. Any other changes or replacements that can be thought of by those skilled in the art within the technical scope disclosed in this application should be included in the protection scope of this application.

[0084] According to the above embodiment, by providing a plurality of liquid return ports 221a arranged at intervals along the first direction L1, the return path of the cooling medium is evenly distributed, and the space utilization is optimized. At the same time, the modular design of the liquid distribution port 212a and the liquid return port 221a corresponding to the computing assembly 200 is conducive to the overall expansion and maintenance of the cooling equipment. When it is necessary to increase or decrease the computing assembly 200, it is only necessary to adjust the position and number of the corresponding liquid distribution port 212a and the liquid return port 221a, thereby improving the flexibility and maintenance efficiency of the cooling system.

[0085] In one embodiment, the first liquid supply pipeline 21 includes a first liquid supply sub-pipeline 211 and a second liquid supply sub-pipeline 212 arranged side by side and at intervals in the second direction L2, and the first liquid return section 221 is arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212.

[0086] Exemplarily, the ends of the first liquid supply sub-pipeline 21 and the second liquid supply sub-pipeline 22 away from the heat exchange module are connected to each other, and the first liquid return section 221 can be arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 in the second direction.

[0087] Such an arrangement can fully utilize the space between the first liquid supply sub-pipeline 21 and the second liquid supply sub-pipeline 22 .

[0088] In one embodiment, the first liquid return pipeline 22 further includes a second liquid return section 222 and a third liquid return section 223, the second liquid return section 222 and the third liquid return section 223 respectively extend along a third direction L3, and the third direction L3 is respectively perpendicular to the first direction L1 and the second direction L2. The first end of the first liquid return section 221 is closed, the second end of the first liquid return section 221 is connected to the first end of the second liquid return section 222, the second end of the second liquid return section 222 is connected to the first end of the third liquid return section 223, and the second end of the third liquid return section 223 is connected to the input end of the first heat exchange flow path 10a.

[0089] In some examples, the first direction L1 and the second direction L2 may be two horizontal directions perpendicular to each other, and the third direction L3 may be a vertical direction perpendicular to the first direction L1 and the second direction L2 respectively. The upper end of the second liquid return section 222 forms its first end, and the upper end of the second liquid return section 222 is connected to the second end of the first liquid return section 221; the lower end of the second liquid return section 222 forms its second end, and the lower end of the second liquid return section 222 is connected to the first end of the third liquid return section 223. The lower end of the third liquid return section 223 forms its first end, the upper end of the third liquid return section 223 forms its second end, and the upper end of the third liquid return section 223 is connected to the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0090] More specifically, the second liquid return section 222 and the third liquid return section 223 can be arranged side by side and spaced apart in the first direction L1, so that the first liquid return section 221, the second liquid return section 222 and the third liquid return section 223 are coplanarly arranged in a plane perpendicular to the second direction L2, thereby further reducing the space occupied by the first liquid return pipeline 22 in the second direction L2. In this way, the pipeline layout can be effectively optimized, the structure of the cooling system is compact, and the installation and maintenance of the pipeline are convenient.

[0091] like Figure 3 , Figure 4 As shown, the first liquid return section 221, the second liquid return section 222 and the third liquid return section 223 are interconnected. The first end of the first liquid return section 221 can be a closed setting. After the cooling medium enters the first liquid return section 221 from the output end of the first heat exchange flow path 10a, it can flow along the first liquid return section 221 to the second liquid return section 222. The second end of the second liquid return section 222 can be connected to the first end of the third liquid return section 223 to form a continuous liquid supply path, so that the cooling medium eventually flows back to the first heat exchange flow path 10a through the third liquid return section 223, completing the closed loop design of the entire liquid return pipeline. In this way, the cooling medium can be output from the cooling flow path 210, through the first liquid return pipeline 22, and finally enter the first heat exchange flow path 10a, thereby achieving an efficient heat exchange effect.

[0092] In one embodiment, a first power device 40 is further disposed between the second end of the second liquid return section 222 and the first end of the third liquid return section 223 , and the first power device 40 is used to provide power for the flow of the cooling medium.

[0093] In some examples, the first power device 40 may be a fluid power pump for driving the cooling medium to flow in the pipeline. For example, the first power device 40 may have a head of 3 bar and a delivery flow of 60 m 3 / h fluid power pump.

[0094] It should be noted that the operating parameters of the first power device 40 can be flexibly set according to actual conditions such as the heat generated by the computing assembly 200 and the heat dissipation efficiency of the cooling device 100. The above is only an exemplary description, and the embodiment of the present application does not specifically limit the operating parameters of the first power device 40.

[0095] In one embodiment, Figure 1 As shown, the cooling device may further include a first liquid storage container 80, which is used to contain a cooling medium; the first liquid return pipeline 22 may further include a first liquid replenishment branch 224, the first end and the second end of the first liquid replenishment branch 224 may be respectively connected to the interior of the second liquid return section 222, and the wall of the first liquid replenishment branch 224 may be provided with a first liquid replenishment interface 224a, and the first liquid replenishment interface 224a is connected to the interior of the first liquid storage container 80 through a first connecting branch (not shown in the figure).

[0096] In the embodiment of the present application, the cooling device 100 can realize the liquid replenishment function for the cooling medium through the cooperation of the first liquid storage container 80 and the first liquid replenishment branch pipe 224. For example, the cooling medium in the first pipeline group 20 can be replenished by an automatic water replenishment pump, and the cooling medium can be filtered by a filter. Figure 1 , Figure 2 As shown, for the first pipeline group 20, the first liquid return pipeline 22 can be further designed to include one or more first liquid replenishment branches 224 that are connected to the interior of the second liquid return section 222. The pipe wall of the first liquid replenishment branch 224 can be provided with a first liquid replenishment interface 224a, and the first liquid replenishment interface 224a can be connected to the interior of the first liquid storage container 80 below the heat exchange module 10 through a first connecting branch (not shown in the figure). Further, the cooling device 100 can automatically replenish the cooling medium during operation through the first liquid storage container 80, the first liquid replenishment branch 224 and the automatic water replenishment pump to ensure that the total amount of the cooling medium inside the cooling device 100 is maintained in an appropriate state.

[0097] Furthermore, the first liquid storage container 80 can be disposed below the heat exchange module 10. This arrangement can fully utilize the space below the heat exchange module 10, reduce the space occupied by the first liquid storage container 80 in the horizontal direction, and further improve the structural compactness of the cooling device 100.

[0098] In one embodiment, the cooling device 100 may further include a first pressure-stabilizing tank 60; the first liquid return pipeline 22 may further include a first pressure-stabilizing branch pipe 225, the first end of the first pressure-stabilizing branch pipe 225 may be connected to the interior of the first pressure-stabilizing tank 60, and the second end of the first pressure-stabilizing branch pipe 225 may be connected to the interior of the third liquid return section 223.

[0099] In the embodiment of the present application, the pressure in the cooling device 100 can be adjusted and stabilized by the pressure stabilizing tank. During the operation of the cooling device 100, temperature changes and fluid flow may cause fluctuations in its internal pressure. The first pressure stabilizing tank 60 can be used to maintain the pressure balance of the cooling device 100 to avoid the influence of excessive or low pressure on the heat dissipation effect. In addition, when the flow rate of the cooling medium in the cooling device 100 changes suddenly, the first pressure stabilizing tank 60 can play a buffering role, reduce the impact of flow fluctuations on the system, and protect other components of the cooling device 100. In some examples, one end of the first pressure stabilizing branch pipe 225 can be connected to the first pressure stabilizing tank 60, and the other end can be connected to the third liquid return section 223. Through the first pressure stabilizing branch pipe 225, the cooling medium can flow freely between the third liquid return section 223 and the first pressure stabilizing tank 60. When the system pressure is too high, the excess cooling medium will enter the pressure stabilizing tank; when the system pressure is too low, the cooling medium in the pressure stabilizing tank will flow back to the system to keep the pressure stable. Preferably, the volume of the first pressure stabilizing tank 60 can be 20L. The cooling device 100 provided in the embodiment of the present application can improve the stability, reliability and heat dissipation exchange efficiency of the cooling system operation.

[0100] In one embodiment, the first surge tank 60 may be disposed below the heat exchange module 10 .

[0101] Exemplarily, the first surge tank 60 is disposed below the first liquid storage container 80. That is, the heat exchange module 10, the first liquid storage container 80 and the first surge tank 60 are disposed in sequence from top to bottom in the vertical direction. In this way, the space below the heat exchange module 10 can be further utilized, the space occupied by the first surge tank 60 in the horizontal direction is reduced, and the structural compactness of the cooling device 100 is further improved.

[0102] In one embodiment, the second liquid supply pipeline 31 may include a first liquid supply section 311 and a second liquid supply section 312 connected to each other, the first end of the first liquid supply section 311 may be connected to the medium output end of the cold source device 300, the second end of the first liquid supply section 311 may be connected to the first end of the second liquid supply section 312, and the second end of the second liquid supply section 312 may be connected to the input end of the second heat exchange flow path 10b; wherein the first liquid supply section 311 and the second liquid supply section 312 may extend respectively along the third direction L3 and be spaced apart in the first direction L1.

[0103] Exemplarily, the upper end of the first liquid supply section 311 forms its first end, and the upper end of the first liquid supply section 311 is connected to the medium output end of the cold source device 300 through a pipeline. The lower end of the first liquid supply section 311 forms its second end, and the lower end of the first liquid supply section 311 is connected to the first end of the second liquid supply section 312. The lower end of the second liquid supply section 312 forms its first end, the upper end of the second liquid supply section 312 forms its second end, and the upper end of the second liquid supply section 312 is connected to the input end of the second heat exchange flow path 10b.

[0104] In this way, the first liquid supply section 311 and the second liquid supply section 312 can form a continuous liquid supply path. During the cooling process, the low-temperature heat exchange medium can flow out from the medium output end of the cold source device 300, and enter the second heat exchange flow path 10b through the first liquid supply section 311 and the second liquid supply section 312. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After the heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b increases. The heat exchange medium can return to the medium return end of the cold source device 300 through the second liquid return pipeline 32, and the cold source device 300 further processes the heat exchange medium to cool it down again and prepare to enter the next cooling cycle. In this way, the cooling device proposed in the embodiment of the present application uses a heat exchange module to enable the cooling medium in the first heat exchange path to exchange heat with the heat exchange medium in the second heat exchange path, thereby improving the heat exchange efficiency of the cooling system in the computing device cluster and preventing performance degradation and hardware damage of the computing elements due to overheating.

[0105] In addition, by arranging the first liquid supply section 311 and the second liquid supply section 312 at intervals in the first direction L1, the space occupied by the second liquid supply pipeline 31 in the second direction L2 can be reduced, further improving the structural compactness of the cooling device.

[0106] In one embodiment, a second power device 50 may be provided between the second end of the first liquid supply section 311 and the first end of the second liquid supply section 312, and the second power device 50 may be used to provide power for the flow of the heat exchange medium. The second power device 50 may be used to provide power for the flow of the heat exchange medium.

[0107] In some examples, the second power device 50 may be a fluid power pump to push the heat exchange medium to flow in the pipeline. For example, the second power device 50 may have a head of 2.5 bar and a delivery flow of 65 m 3 / h fluid power pump.

[0108] It should be noted that the operating parameters of the second power device 50 can be flexibly set according to actual conditions such as the heat generated by the computing assembly 200 and the heat dissipation efficiency of the cooling device 100. The above is only an exemplary description, and the embodiment of the present application does not specifically limit the operating parameters of the second power device 50.

[0109] In one embodiment, the cooling device 100 may also include a second liquid storage container 90, which is used to contain a cooling medium; the second liquid supply pipeline 31 may also include a second liquid replenishment branch 313, and the first end and the second end of the second liquid replenishment branch 313 may be respectively connected to the interior of the first liquid supply section 311, and the tube wall of the second liquid replenishment branch 313 may be provided with a second liquid replenishment interface 313a, and the second liquid replenishment interface 313a may be connected to the interior of the second liquid storage container 90 through a second connecting branch (not shown in the figure).

[0110] In the embodiment of the present application, the cooling device 100 can realize the liquid replenishment function for the heat exchange medium through the cooperation of the second liquid storage container 90 and the second liquid replenishment branch pipe 313. For example, the cooling medium in the second pipeline group 30 can be replenished by an automatic water replenishment pump, and the cooling medium can be filtered by a filter. Figure 1 , Figure 2 As described above, for the second pipeline group 30, the second liquid supply pipeline 31 may be further designed to include one or more second liquid replenishment branches 313 that are connected to the interior of the first liquid supply section 311. The wall of the second liquid replenishment branch 313 may be provided with a second liquid replenishment interface 313a, and the second liquid replenishment interface 313a may be connected to the interior of the second liquid storage container 90 below the heat exchange module 10 through a second connecting branch (not shown in the figure). Furthermore, the cooling device 100 may automatically replenish the cooling medium during operation through the second liquid storage container 90, the second liquid replenishment branch 313 and the automatic water replenishment pump to ensure that the total amount of the heat exchange medium inside the cooling device 100 is maintained in an appropriate state.

[0111] In one embodiment, the second liquid storage container 90 can be disposed below the heat exchange module 10, and the second liquid storage container 90 and the first liquid storage container 80 are disposed side by side and adjacent to each other in the second direction L2. Such an arrangement can fully utilize the space below the heat exchange module 10, reduce the space occupied by the second liquid storage container 90 in the horizontal direction, and further improve the structural compactness of the cooling device 100.

[0112] In one embodiment, the cooling device 100 may further include a second pressure-stabilizing tank 70; the second liquid supply pipeline 31 may further include a second pressure-stabilizing branch pipe 314, the first end of the second pressure-stabilizing branch pipe 314 is connected to the interior of the second pressure-stabilizing tank 70, and the second end of the second pressure-stabilizing branch pipe 314 may be connected to the interior of the first liquid supply section 311.

[0113] In the embodiment of the present application, the second liquid storage container 90 can cooperate with the second liquid replenishment branch 313 to realize the liquid replenishment function of the second pipeline group 30 in the cooling device 100, and the pressure in the cooling device 100 can be adjusted and stabilized by the second pressure stabilizing tank 70. Preferably, the volume of the second liquid storage container 90 can be 30L, and the volume of the second pressure stabilizing tank 70 can be 20L. The cooling device provided in the embodiment of the present application can improve the stability, reliability and heat dissipation exchange efficiency of the cooling system operation by providing the liquid storage container and the pressure stabilizing tank.

[0114] In one embodiment, the second surge tank 70 may be disposed below the heat exchange module 10 .

[0115] Exemplarily, the second pressure stabilizing tank 70 is disposed below the second liquid storage container 90. That is, the heat exchange module 10, the second liquid storage container 90 and the second pressure stabilizing tank 70 are disposed sequentially from top to bottom in the vertical direction, and the second pressure stabilizing tank 70 is adjacent to and arranged side by side with the first pressure stabilizing tank 60 in the second direction L2. Such an arrangement can further utilize the space below the heat exchange module 10, reduce the space occupied by the second pressure stabilizing tank 70 in the horizontal direction, and further improve the structural compactness of the cooling device 100.

[0116] In one embodiment, the medium flow direction of the first heat exchange flow path 10a is the same as that of the second heat exchange flow path 10b.

[0117] For example, the medium of the first heat exchange flow path 10a and the medium of the second heat exchange flow path 10b may flow in the same direction in the heat exchange module 10. In the embodiment of the present application, the high-temperature cooling medium and the low-temperature heat exchange medium flow in the heat exchange module 10 in the same direction, so that the temperature change in the heat exchange module 10 can be more uniform, thereby extending the service life of the heat exchange module 10.

[0118] In one embodiment, the medium flow directions of the first heat exchange flow path 10a and the second heat exchange flow path 10b are opposite.

[0119] For example, the flow directions of the media in the first heat exchange flow path 10a and the second heat exchange flow path 10b in the heat exchange module 10 may be opposite. The embodiment of the present application uses countercurrent heat exchange, that is, the opposite flow of the high-temperature cooling medium and the low-temperature heat exchange medium in the heat exchange module 10, to maintain a large temperature difference at both ends of the heat exchange module 10, thereby improving the efficiency of heat transfer.

[0120] In one embodiment, the input end of the first heat exchange flow path 10a may be located below the output end of the first heat exchange flow path 10a; the input end of the second heat exchange flow path 10b may be located above the output end of the second heat exchange flow path 10b. In some examples, the flow direction of the medium in the first pipeline group 20 and the second pipeline group 30 can be set according to specific application requirements, and the specific position relationship between the input end and the output end of the heat exchange flow path can be set accordingly according to the actual flow direction of the cooling medium and the heat exchange medium in the pipeline group.

[0121] As another aspect of this application, Figure 1 , Figure 2 As shown, an embodiment of the present application further provides a data center 1, comprising: at least one computing assembly 200, a cold source device 300 and a cooling device 100 of any one of the above-mentioned embodiments of the present application.

[0122] Specifically, the computing assembly 200 may include a cabinet 220, a plurality of computing devices 230, and a cooling flow path 210. The plurality of computing devices 230 may be integrated and arranged inside the cabinet 220, and the cooling flow path 210 may be used to allow cooling medium to flow through the plurality of computing devices 230.

[0123] In the embodiment of the present application, the cooling device 100 can use liquid cooling to cool the computing devices 230 of each computing assembly 200. The cooling flow path 210 passes through multiple computing devices 230, and is used to allow the cooling medium to flow through each computing device 230 during the flow of the cooling medium inside the cooling flow path 210, so that the cooling medium can exchange heat with each computing device 230, thereby transferring the heat generated by the computing device 230 during operation to the cooling medium, thereby cooling the multiple computing devices 230.

[0124] The cooling device 100 may include a heat exchange module 10, a first pipeline group 20 and a second pipeline group 30. The heat exchange module 10 may include a first heat exchange flow path 10a and a second heat exchange flow path 10b for cooling the cooling medium. The first pipeline group 20 may include a first liquid supply pipeline 21 and a first liquid return pipeline 22. The first liquid supply pipeline 21 is connected between the input end of the cooling flow path 210 of each computing assembly 200 and the heat exchange module 10, and is used to transport the low-temperature cooling medium cooled by the heat exchange module 10 to the cooling flow path 210 of the computing assembly 200. The first liquid return pipeline 22 is connected between the output end of the cooling flow path 210 of each computing assembly 200 and the heat exchange module 10, and is used to transport the high-temperature cooling medium after flowing through the computing assembly 200 from the cooling flow path 210 of the computing assembly 200 back to the heat exchange module 10.

[0125] The first heat exchange flow path 10a of the heat exchange module 10 can be connected to the cooling flow path 210 of at least one computing assembly 200 to form a first circulation flow path, and the second heat exchange flow path 10b of the heat exchange module 10 can be connected to the cold source device 300 to form a second circulation flow path. Specifically, the first heat exchange flow path 10a is used for the flow of cooling medium, and the second heat exchange flow path 10b is used for the flow of heat exchange medium. The cooling medium in the first heat exchange flow path 10a and the heat exchange medium in the second heat exchange flow path 10b perform heat exchange during the flow process, and the heat of the cooling medium is transferred to the heat exchange medium to reduce the temperature of the cooling medium and realize the cooling of the cooling medium. The heat exchange module 10 is connected to the cooling flow path 210 of the computing assembly 200 through the first pipeline group 20, and is connected to the cold source device 300 through the second pipeline group 30. The output end of the first heat exchange flow path 10a is connected to the first liquid supply pipeline 21, and the input end of the first heat exchange flow path 10a is connected to the first liquid return pipeline 22. The input end and the output end of the second heat exchange flow path 10b are respectively connected to the medium output end and the medium input end of the cold source device 300 through the second pipeline group 30. The cold source device 300 can be used to cool the heat exchange medium.

[0126] In an embodiment of the present application, the heat exchange module may adopt any one of a plate heat exchanger, a shell and tube heat exchanger, a spiral plate heat exchanger, a finned tube heat exchanger, and a microchannel heat exchanger. It should be noted that the above is only an exemplary description, and the embodiment of the present application does not specifically limit the structure and form of the heat exchange module. In some specific examples, the data center 1 may include a plurality of computing assemblies 200. A plurality of computing assemblies 200 may be arranged side by side and adjacently along the first direction L1. The first pipeline group 20 of the cooling device 100 passes through a plurality of computing assemblies 200 and is connected to the cooling flow path 210 of each computing assembly 200. Among them, the frame structure 500 can be fixedly connected to the top of a plurality of computing assemblies 200 to achieve connection and fixation of a plurality of computing assemblies 200. In addition, the frame structure 500 can also be used to provide support and fixation to the first pipeline group 20, thereby achieving fixation of the first pipeline group 20 relative to at least one computing assembly 200.

[0127] In some embodiments, the data center 1 may further include a frame structure 500 and a support platform 600. Specifically, the frame structure 500 is fixed to the top of at least one computing assembly 200, and at least part of the first pipeline group 20 is supported on the frame structure 500. At least one computing assembly 200 and the cooling device 100 are integrated on the support platform 600, the heat exchange module 10 is arranged on one side of at least one computing assembly 200 in the first direction L1, and the first pipeline group 20 is located on one side of the heat exchange module 10 in the second direction L2, and the second direction intersects with the first direction. The data center 1 of the embodiment of the present application integrates the computing assembly 200 and the cooling device 100 into a unified support platform 600 to form a skid structure, which can be uniformly transported and delivered, and can be directly put into place after delivery, reducing the requirements for land flatness and concrete foundation. In addition, the heat exchange module 10, the first pipeline group 20, and the second pipeline group 30 can be spatially adapted to the computing assembly 200, and the frame structure 500 provides a supporting and fixing structure for the first pipeline group 20 of the cooling equipment 100, thereby improving space utilization, the integration of the data center 1, and structural stability.

[0128] In some embodiments, the data center 1 may further include a power distribution cabinet 700, which directly supplies power to the computing devices 200 of the data center 1. In a high-density equipment environment such as the data center 1, water-electricity separation can effectively prevent potential safety hazards caused by liquid leakage to power equipment, and ensure efficient, safe and stable operation of the data center.

[0129] Exemplarily, the power distribution cabinet 700 may be spaced apart from the cooling device 100 .

[0130] In some examples, the power distribution cabinet 700 and the cooling device 100 are distributed on opposite sides of at least one computing assembly 200 in the first direction L1, that is, the cooling device 100 is arranged on one side of at least one computing assembly 200 in the first direction L1, and the power distribution cabinet 700 is arranged on the other side of at least one computing assembly 200 in the first direction L1. While increasing the distance between the power distribution cabinet 700 and the cooling device 100, the power distribution cabinet 700 and the cooling device 100 are physically isolated by the computing assembly 200, thereby greatly improving the overall reliability of the data center.

[0131] In other examples, the power distribution cabinet 700 and the cooling device 100 are distributed on opposite sides of at least one computing assembly 200 in the second direction L2, and the power distribution cabinet 700 and the cooling device 100 are isolated by at least one computing assembly 200 to improve the safety of water-electricity separation.

[0132] It should be noted that the above is only an example and does not constitute a limitation to the present application.

[0133] Those skilled in the art can understand that, based on the basic principle of spacing the power distribution cabinet 700 and the cooling device 100, there can be many other ways to space the power distribution cabinet 700 and the cooling device 100. For example, the power distribution cabinet 700 and the cooling device 100 are spaced apart in the upper and lower directions of at least one computing assembly 200, that is, one of the power distribution cabinet 700 and the cooling device 100 is located above the computing assembly 200, and the other is located below the computing assembly 200, so as to achieve physical isolation between the power distribution cabinet 700 and the cooling device 100; for another example, the power distribution cabinet 700 and the cooling device 100 are not isolated by the computing assembly 200, and water and electricity separation can be achieved by adding other objects for isolation or directly increasing the distance between the two. It should be noted that this is only for example, and the spacing between the power distribution cabinet 700 and the cooling device 100 is not limited to the aforementioned example.

[0134] In some examples, the power distribution cabinet 700 and the cooling equipment 100 can be integrated in different areas of the support platform 600. On the one hand, the support platform 600 lifts the power distribution cabinet 700 so that it does not contact the placement surface of the data center 1. This can prevent the cooling equipment 100 from leaking and causing water to accumulate on the placement surface and affect the power distribution cabinet 700. On the other hand, the support platform 600 can guide any leakage that may occur from the cooling equipment 100 to the outside of the support platform 600, completely isolating water and electricity, and further improving the safety of the data center 1.

[0135] In a specific example, the power distribution cabinet 700 of the data center 1 is arranged on the supporting platform 600 and is located on the other side of at least one computing assembly 200 in the first direction L1, that is, the power distribution cabinet 700 and the heat exchange module 10 are opposite to each other in the first direction L1, and are respectively located on the opposite sides of at least one computing assembly 200 in the first direction L1. Possible leakage of the cooling equipment 100 can be discharged to the outside of the supporting platform 600 and will not be deposited on the supporting platform 600. At the same time, surface water will not affect the power distribution cabinet 700.

[0136] In addition, the power distribution cabinet 700 and the cooling equipment 100 are integrated into the support platform 600, which ensures that water and electricity can be completely isolated, while improving the integration of the data center 1. It not only effectively utilizes the vertical and horizontal space, reduces the physical footprint, and facilitates overall transportation and delivery; it can also simplify the monitoring and management process, making it easier for operation and maintenance personnel to operate and maintain; furthermore, the integrated design can reduce the distance and time of power and signal transmission, improve the response speed of the data center 1, and enhance the overall reliability of the data center 1. It should be noted that this is only an example, and the positional relationship between the power distribution cabinet 700 and the cooling equipment 100 relative to the support platform 600 is not limited to the aforementioned example. Various other changes or alternatives that can be thought of by technicians in this field within the technical scope disclosed in this application should be included in the protection scope of this application.

[0137] Figure 5 FIG. 1 is a schematic diagram showing the overall structure of a data center according to an embodiment of the present application. Figure 5 As shown, the data center 1 may also include a box 400. The interior of the box 400 defines a receiving cavity, and at least one computing assembly 200, a cooling device 100, a frame structure 500, and a support platform 600 may be integrated in the receiving cavity. In the embodiment of the present application, the shape and size of the box 400 may be arbitrarily set by those skilled in the art according to actual conditions. For ease of transportation, preferably, the shape and size of the box 400 may be set accordingly with reference to a standard container, for example, the same shape and size as a standard container of 20 feet, 40 feet, or 45 feet may be adopted.

[0138] In a specific example, the shape and size of the box 400 can be set accordingly with reference to a standard container of 40 feet, and the overall dimensions are 12.192m*2.438m*2.438m. Therefore, after the computing assembly 200, the cooling device 100, the frame structure 500 and the support platform 600 are integrated and deployed in the accommodating cavity of the box 400, the data center 1 can be directly packaged and transported by sea or land transportation or other means, and no secondary assembly is required after the transportation is completed, thereby improving the convenience of transportation and delivery.

[0139] It should be noted that the shape and size of the box 400 can be flexibly set according to actual conditions. Preferably, the shape and size of the box 400 can match the shape and size of the data center 1 to ensure optimal space utilization.

[0140] In addition, it should be noted that in the example where the data center 1 is set inside the box 400 to form a container-type, the positional relationship between the power distribution cabinet 700 and the cooling device 100 and the box 400, in addition to both being contained inside the box 400, can also have other positional relationships, for example, one of the power distribution cabinet 700 and the cooling device 100 can be set inside the box 400, and the other can be set outside the box 400, and the power distribution cabinet 700 and the cooling device 100 are physically isolated by the box 400, thereby improving the safety of water-electricity separation; for another example, the power distribution cabinet 700 and the cooling device 100 are both located outside the box 400, and are respectively located on different sides of the box 400, and the power distribution cabinet 700 and the cooling device 100 are physically isolated by the box 400, thereby ensuring the safety of water-electricity separation. It should be noted that this is only an example and does not constitute a limitation of the present application. The positional relationship between the power distribution cabinet 700 and the cooling device 100 relative to the box 400 is not limited to the aforementioned example. Any other changes or alternatives that can be conceived by those skilled in the art within the technical scope disclosed in this application should be included in the protection scope of this application.

[0141] Other components of the data center 1 in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0142] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0143] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0144] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0145] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0146] It should be noted that although the various steps of the method in the present application are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps can be omitted, multiple steps can be combined into one step for execution, and / or one step can be decomposed into multiple steps for execution, etc. The above-mentioned drawings are only schematic illustrations of the processing included in the method according to the exemplary embodiments of the present application, and are not intended to be limiting. It is easy to understand that the processing shown in the above-mentioned drawings does not indicate or limit the time sequence of these processing. In addition, it is also easy to understand that these processing can be, for example, performed synchronously or asynchronously in multiple modules.

[0147] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0148] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A cooling device, characterized in that: include: The heat exchange module has a first heat exchange flow path and a second heat exchange flow path defined therein, wherein the first heat exchange flow path is used for a cooling medium to flow, and the second heat exchange flow path is used for a heat exchange medium to flow, and the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to reduce the temperature of the cooling medium; A first pipeline group, comprising a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected to the output end of the first heat exchange flow path, and the first liquid supply pipeline is connected to the liquid inlet of the cooling flow path of the computing assembly; the first liquid return pipeline is connected to the input end of the first heat exchange flow path, and the first liquid return pipeline is connected to the liquid outlet of the cooling flow path; A second pipeline group includes a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected to the input end of the second heat exchange flow path, and the second liquid supply pipeline is connected to the medium output end of the cold source device; the second liquid return pipeline is connected to the output end of the second heat exchange flow path, and the second liquid return pipeline is connected to the medium return end of the cold source device; Wherein, the first pipeline group and the second pipeline group are respectively arranged on two opposite sides of the heat exchange module.

2. The cooling device according to claim 1, characterized in that: There are multiple computing assemblies, and the multiple computing assemblies are arranged side by side along a first direction; the heat exchange module is arranged on one side of the multiple computing assemblies in the first direction, and the first pipeline group and the second pipeline group are respectively arranged on opposite sides of the heat exchange module in the second direction, and the second direction intersects with the first direction.

3. The cooling device according to claim 2, characterized in that: The first liquid supply pipeline is respectively connected to the liquid inlets of the cooling flow paths of the plurality of computing assemblies.

4. The cooling device according to claim 3, characterized in that: The first liquid supply pipeline includes a first liquid supply sub-pipeline and a second liquid supply sub-pipeline connected to each other, the first liquid supply sub-pipeline and the second liquid supply sub-pipeline extend along the first direction respectively, and are arranged side by side and at intervals in the second direction, the first end of the first liquid supply sub-pipeline is connected to the output end of the first heat exchange flow path, the second end of the first liquid supply sub-pipeline is connected to the first end of the second liquid supply sub-pipeline, and the second end of the second liquid supply sub-pipeline is provided with an exhaust valve.

5. The cooling device according to claim 4, characterized in that The second liquid supply sub-pipeline is provided with a plurality of liquid distribution ports, which are arranged at intervals along the first direction and correspond one-to-one to the plurality of computing assemblies, and each of the liquid distribution ports is connected to a liquid inlet of the cooling flow path of the corresponding computing assembly.

6. The cooling device according to claim 2, characterized in that: The first liquid return pipeline is respectively connected to the liquid outlets of the cooling flow paths of the plurality of computing assemblies.

7. The cooling device according to claim 6, characterized in that The first liquid return pipeline includes a first liquid return section, and the first liquid return section is provided with a plurality of liquid return ports. The plurality of liquid return ports are arranged at intervals along the first direction and correspond one-to-one to the plurality of computing assemblies, and each of the liquid return ports is connected to a liquid outlet of the cooling flow path of the corresponding computing assembly.

8. The cooling device according to claim 7, characterized in that The first liquid supply pipeline includes a first liquid supply sub-pipeline and a second liquid supply sub-pipeline which are arranged side by side and at intervals in the second direction, and the first liquid return section is arranged between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

9. The cooling device according to claim 7, characterized in that: The first liquid return pipeline also includes a second liquid return section and a third liquid return section, the second liquid return section and the third liquid return section extend along a third direction respectively, and the third direction is perpendicular to the first direction and the second direction respectively; the first end of the first liquid return section is closed, the second end of the first liquid return section is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path.

10. The cooling device according to claim 9, characterized in that A first power device is further provided between the second end of the second liquid return section and the first end of the third liquid return section, and the first power device is used to provide power for the flow of the cooling medium.

11. The cooling device according to claim 9, characterized in that The cooling device also includes a first liquid storage container; The first liquid return pipeline also includes a first liquid replenishment branch pipe, the first end and the second end of the first liquid replenishment branch pipe are respectively connected to the interior of the second liquid return section, and a first liquid replenishment interface is opened on the wall of the first liquid replenishment branch pipe, and the first liquid replenishment interface is connected to the interior of the first liquid storage container through a first connecting branch pipe.

12. The cooling device according to claim 11, characterized in that The first liquid storage container is arranged below the heat exchange module.

13. The cooling device according to claim 9, characterized in that The cooling device also includes a first pressure-surge tank; The first liquid return pipeline further includes a first pressure stabilizing branch pipe, a first end of the first pressure stabilizing branch pipe is communicated with the interior of the first pressure stabilizing tank, and a second end of the first pressure stabilizing branch pipe is communicated with the interior of the third liquid return section.

14. The cooling device according to claim 13, characterized in that The first pressure stabilizing tank is arranged below the heat exchange module.

15. The cooling device according to claim 2, characterized in that The second liquid supply pipeline includes a first liquid supply section and a second liquid supply section connected to each other, the first end of the first liquid supply section is connected to the medium output end of the cold source equipment, the second end of the first liquid supply section is connected to the first end of the second liquid supply section, and the second end of the second liquid supply section is connected to the input end of the second heat exchange flow path; wherein, the first liquid supply section and the second liquid supply section extend respectively along the third direction and are spaced apart in the first direction.

16. The cooling device according to claim 15, characterized in that A second power device is also provided between the second end of the first liquid supply section and the first end of the second liquid supply section, and the second power device is used to provide power for the flow of the heat exchange medium.

17. The cooling device according to claim 15, characterized in that The cooling device also includes a second liquid storage container; The second liquid supply pipeline also includes a second liquid infusion branch, the first end and the second end of the second liquid infusion branch are respectively connected to the interior of the first liquid supply section, and a second liquid infusion interface is opened on the wall of the second liquid infusion branch, and the second liquid infusion interface is connected to the interior of the second liquid storage container through a second connecting branch.

18. The cooling device according to claim 17, characterized in that The second liquid storage container is arranged below the heat exchange module.

19. The cooling device according to claim 15, characterized in that The cooling device also includes a second pressure-surge tank; The second liquid supply pipeline further includes a second pressure stabilizing branch pipe, a first end of the second pressure stabilizing branch pipe is communicated with the interior of the second pressure stabilizing tank, and a second end of the second pressure stabilizing branch pipe is communicated with the interior of the first liquid supply section.

20. The cooling device according to claim 19, characterized in that The second pressure stabilizing tank is arranged below the heat exchange module.

21. The cooling device according to any one of claims 1 to 20, characterized in that: The medium flow directions of the first heat exchange flow path are opposite to those of the second heat exchange flow path.

22. The cooling device according to claim 21, characterized in that The input end of the first heat exchange flow path is located below the output end of the first heat exchange flow path; the input end of the second heat exchange flow path is located above the output end of the second heat exchange flow path.

23. A data center, characterized in that: include: at least one computing assembly, the computing assembly comprising a cabinet, a plurality of computing devices, and a cooling flow path, the plurality of computing devices being integrated in the cabinet, the cooling flow path being used for cooling medium to flow through the plurality of computing devices; Cold source equipment, used to cool the heat exchange medium; According to the cooling device as described in any one of claims 1 to 22, the first heat exchange flow path of the heat exchange module is connected to the cooling flow path of the at least one computing assembly to form a first circulation flow path, and the second heat exchange flow path of the heat exchange module is connected to the cold source device to form a second circulation flow path.

24. The data center according to claim 23, characterized in that: Also includes: The computing assembly and the cooling device are arranged inside the box.

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