Silicon wafer overturning system and silicon wafer overturning method

Abstract

The invention provides a silicon wafer overturning system and a silicon wafer overturning method. The silicon wafer overturning method comprises the following steps: transmitting n stacked support plates bearing silicon wafers to an overturning cavity; driving the n rows of first sucker rod groups to move downwards to suck the silicon wafers; the n carrier plates are conveyed out of the overturning cavity; driving the n rows of first sucker rod groups to rotate by 180 degrees, driving the n rows of first sucker rod groups to move downwards, placing the overturned silicon wafers on the n platforms through channels of the corresponding platforms respectively, and then continuously moving downwards; driving the n rows of first suction cup rod groups to rotate by 180 degrees, and then driving the top row of suction cup rods and the n rows of first suction cup rod groups to move downwards, suck the silicon wafers on the n platforms and ascend; the n no-load plates are conveyed to an overturning cavity; and finally, the sucked silicon wafers are placed in n no-load plates by the top row of suction cup rods and the adjacent (n-1) rows of first suction cup rods, and the carrier plate carrying the overturned silicon wafers is conveyed out of the overturning cavity. According to the invention, suction nozzle marks can be effectively reduced, the yield is improved, and the productivity of solar cells is greatly improved.

Description

Technical Field

[0001] The invention relates to the field of photovoltaic equipment manufacturing, and in particular to a silicon wafer flipping system and a silicon wafer flipping method. Background Art

[0002] In the manufacturing process of heterojunction solar cells, PECVD equipment is used for double-sided coating, which involves flipping the cell, and a flipping mechanism is required to perform it. In the prior art, the flipping of silicon wafers in the middle of double-sided coating is performed by an automated mechanism that transfers the carrier carrying the cell from a vacuum to the atmosphere, and then transfers the silicon wafer from the carrier to a basket, flips the basket to achieve the flipping of the silicon wafer, and then transfers the flipped silicon wafer from the basket to the carrier and then from the atmosphere to the vacuum chamber for coating.

[0003] The silicon wafer flipping method in the prior art will greatly affect the production capacity of heterojunction solar cells, and the existing suction nozzle for transferring silicon wafers between the flower basket and the carrier adopts a vacuum negative pressure suction nozzle, which is easy to form a suction nozzle mark on the silicon wafer during suction, thereby causing the corresponding solar cell to be judged as a defective piece.

[0004] Therefore, how to provide a silicon wafer flipping system and flipping method to effectively reduce nozzle marks, improve the yield rate and significantly increase the production capacity of solar cells has become a technical problem that needs to be solved urgently in the industry. Summary of the invention

[0005] In view of the above problems in the prior art, the present invention proposes a silicon wafer flipping system, which is arranged in a flipping chamber and includes:

[0006] n rows of first suction cup rod groups are stacked and driven to rotate by the first driving module, and driven to move up and down by the second driving module, each row of the first suction cup rod group includes m first suction cup rods, and each first suction cup rod includes p suction cups arranged at the lower end;

[0007] n platforms, which are arranged at intervals with the n rows of first suction cup rod groups and are used to place n carriers, and each platform is provided with a pin for pushing the carrier to rise and fall and a plurality of channels for accommodating the passage of the first suction cup rods;

[0008] A top row second suction cup rod group, which is stacked on the n rows of first suction cup rod groups and driven by the second driving module to move up and down, the top row second suction cup rod group includes m second suction cup rods, each second suction cup rod includes p suction cups arranged at the lower end;

[0009] The flip module controls the second driving module to drive the n rows of first suction cup rod groups to move downward to absorb the silicon wafers and to rise and reset after the n rows of stacked robotic arms in the adjacent transmission chambers transfer the n stacked carriers carrying the silicon wafers to the top of the n platforms, and then controls the n rows of robotic arms in the adjacent transmission chambers to take out the n carriers from the flip chamber, and then controls the first driving module to drive the n rows of first suction cup rod groups to rotate 180 degrees and then be driven by the second driving module to move downward, and respectively pass through the channels of the corresponding platforms to take the flipped silicon wafers. After the wafer is placed on the n platforms, it continues to move downward a predetermined distance, and then controls the first driving module to drive the n rows of first suction cup rod groups to rotate 180 degrees, and then controls the second driving module to drive the top row of suction cup rods and the n rows of first suction cup rod groups to move downward and suck the silicon wafers on the n platforms and rise a predetermined distance, and after the n rows of robotic arms outside the cavity transfer n empty plates to the top of the n platforms, the sucked silicon wafers are placed on the n empty plates.

[0010] In one embodiment, both sides of the flip chamber are transmission chambers, and n rows of robot arms are stacked in the transmission chamber.

[0011] In one embodiment, n is 2-4, and the suction cups of each first suction cup rod in the n-row first suction cup rod group and each second suction cup rod in the top row second suction cup rod group are suction cups made of bionic adhesive materials.

[0012] In one embodiment, when n rows of robotic arms in adjacent transfer chambers transfer n carriers loaded with silicon wafers to the flip chamber, the n platforms raise their pins to support the n carriers, and the n rows of robotic arms retract to the adjacent transfer chamber.

[0013] In one embodiment, when n rows of robotic arms in adjacent transfer chambers transfer n empty carrier plates to the flip chamber, the n platforms raise their pins to support the n carrier plates, and after the top row of suction cup rod groups and the adjacent n-1 rows of first suction cup rod groups thereunder place the sucked silicon wafers into the n empty carrier plates, the pins move downward, and the n rows of robotic arms support the n carrier plates loaded with flipped silicon wafers and transfer the n carrier plates to the transfer chamber.

[0014] The present invention also provides a silicon wafer flipping method, comprising the following steps:

[0015] Step 1, transferring n stacked carriers carrying silicon wafers to a flip chamber;

[0016] Step 2: driving the n rows of first suction cup rod groups to move downward to absorb the silicon wafer and then rise to reset;

[0017] Step 3, transferring n carriers out of the flip chamber;

[0018] Step 4, driving the n rows of first suction cup rod groups to rotate 180 degrees, driving them to move downward and pass through the channels of the corresponding platforms respectively to place the flipped silicon wafers on the n platforms and continue to move downward by a predetermined distance;

[0019] Step 5, driving the n rows of first suction cup rod groups to rotate 180 degrees, and then driving the top row of suction cup rods and the n rows of first suction cup rod groups to move downward to a position convenient for sucking silicon wafers from the corresponding platform;

[0020] Step 6, the top row of suction cup rod groups and the adjacent n-1 row of first suction cup rod groups below suck up the silicon wafers on the n platforms and raise them to a predetermined distance;

[0021] Step 7, transferring n empty plates to the flip chamber; and

[0022] Step eight, the top row of suction cup rod groups and the adjacent n-1 rows of first suction cup rod groups below them place the sucked silicon wafers into n empty carrier plates and transfer the carrier plates loaded with the flipped silicon wafers out of the flip chamber.

[0023] In one embodiment, both sides of the flip chamber are transfer chambers, and n rows of robotic arms are stacked in the transfer chamber, and the n rows of robotic arms transfer n carriers into or out of the flip chamber.

[0024] In one embodiment, n is 2-4, and the suction cups of each first suction cup rod in the n-row first suction cup rod group and each second suction cup rod in the top row second suction cup rod group are suction cups made of bionic adhesive materials.

[0025] In one embodiment, step one includes: transferring n carriers loaded with silicon wafers to the flip chamber by n rows of stacked robotic arms in adjacent transfer chambers, raising the n platforms with their pins to support the n carriers, and retracting the n rows of robotic arms to the adjacent transfer chamber.

[0026] In one embodiment, step seven includes: when n empty carrier plates are transferred to the flip chamber by n rows of robotic arms adjacent to the transfer chamber, the n platforms raise their pins to support the n carrier plates; step eight includes: the top row of suction cup rod groups and the adjacent n-1 rows of first suction cup rod groups below place the sucked silicon wafers into the n empty carrier plates, the pins move downward, and the n rows of robotic arms support the n carrier plates loaded with flipped silicon wafers and transfer the n carrier plates from the flip chamber to the transfer chamber.

[0027] Compared with the prior art in which a carrier carrying silicon wafers is transferred from a vacuum environment to an atmospheric environment to flip the silicon wafers and then transported by a negative pressure suction nozzle, which results in lower productivity and easy nozzle marks on the silicon wafers, the silicon wafer flipping method of the present invention first transfers n stacked carriers carrying silicon wafers to a flipping chamber, then drives n rows of first suction cup rod groups to move downward to suck up the silicon wafers and rise to reset, then transfers the n carriers out of the flipping chamber, then drives the n rows of first suction cup rod groups to rotate 180 degrees, drives them to move downward and pass through the channels of the corresponding platforms respectively to place the flipped silicon wafers on the n platforms and continue to flip to the flipping chamber. The first suction cup rod group of the n rows is driven to rotate 180 degrees, and then the top suction cup rod group and the first suction cup rod group of the n rows are driven to move downward to a position convenient for sucking silicon wafers from the corresponding platform; then the top suction cup rod group and the n-1 row of first suction cup rod groups adjacent thereto suck the silicon wafers on the n platforms and rise a predetermined distance; then the n empty carriers are transferred to the flip chamber; finally, the top suction cup rod group and the n-1 row of first suction cup rod groups adjacent thereto place the sucked silicon wafers into the n empty carriers and transfer the carrier loaded with flipped silicon wafers out of the flip chamber. The present invention can effectively reduce nozzle marks, improve the yield rate and greatly increase the production capacity of solar cells. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0029] Figure 1 It is a schematic diagram of the structure of a silicon wafer flipping system according to an embodiment of the present invention;

[0030] Figure 2 A schematic diagram of a motion state of a silicon wafer flipping system embodiment of the present invention;

[0031] Figure 3 It is a schematic diagram of the second motion state of the silicon wafer flipping system embodiment of the present invention;

[0032] Figure 4 for Figure 1 A schematic diagram of the composition structure of the first suction cup rod / the second suction cup rod;

[0033] Figure 5 A schematic diagram of an application example of a silicon wafer flipping system embodiment of the present invention; and

[0034] Figure 6 for Figure 5 A schematic diagram of an application example of the silicon wafer flipping system embodiment after the chamber is removed; and

[0035] Figure 7 The figure is a flow chart of an embodiment of the silicon wafer flipping method of the invention. DETAILED DESCRIPTION

[0036] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0039] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0040] See also Figures 1 to 3 , Figure 1 It is a schematic diagram of the structure of a silicon wafer flipping system according to an embodiment of the present invention; Figure 2 and Figure 3 They are respectively schematic diagrams of motion state 1 and motion state 2 of the silicon wafer flipping system embodiment of the present invention. Figures 1 to 3As shown, the silicon wafer flipping system 1 of the present invention is arranged in a flipping chamber, and the silicon wafer flipping system 1 includes n rows of first suction cup rod groups 10, a first driving module 11, a top row of second suction cup rod groups 12, a second driving module drive 13, n platforms 14 and a flipping module 15.

[0041] The n rows of first suction cup rod groups 10 are driven to rotate by the first driving module 11, and driven to move up and down by the second driving module 13. Each row of the first suction cup rod group 10 includes m first suction cup rods 100, and each first suction cup rod 100 includes p suction cups 102 arranged at the lower end. The first driving module 11 can be a rotary motor, and the second driving module 13 can be a direct motor.

[0042] The top row second suction cup rod group 12 is arranged in parallel on the n rows of first suction cup rod groups 10, and is driven by the second driving module 13 to move up and down. The top row second suction cup rod group 12 includes m second suction cup rods 120, and each second suction cup rod 120 includes p suction cups 122 arranged at the lower end.

[0043] Figure 4 for Figure 1 Schematic diagram of the composition structure of the first suction cup rod 100 / the second suction cup rod 120. Figure 4 The suction cups 102 / 122 on the first suction cup rod 100 and the second suction cup rod 120 shown are both bionic adhesive material suction cups, which can be specifically silicone rubber microstructures. The principle is similar to that of a gecko's foot. It does not require the aid of negative pressure vacuum or suction action, but only relies on the van der Waals force generated when the material approaches the silicon wafer to absorb the silicon wafer.

[0044] The number m of first suction cup rods 100 in each row of the first suction cup rod group 10 is equal to the number of rows of silicon wafers placed on the carrier, and the number p of suction cups 102 on each first suction cup rod 100 is equal to the number of silicon wafers 2 carried by each row of the carrier. The number m of second suction cup rods 120 in the top row of the second suction cup rod group 12 is equal to the number of rows of silicon wafers placed on the carrier, and the number p of suction cups 122 on each second suction cup rod 120 is equal to the number of silicon wafers 2 carried by each row of the carrier.

[0045] The n platforms 14 are spaced apart from the n rows of first suction cup rod groups 10 for placing n carriers 3. Each platform 14 is provided with a pin (not shown) for pushing the carrier 3 up and down and a plurality of channels 140 for accommodating the first suction cup rods 100 to pass through.

[0046] After the stacked n-row robotic arms in the adjacent transfer chamber transfer the n-stacked carriers 3 carrying the silicon wafers 2 to the top of the n-platforms, the flip module 15 controls the second driving module 13 to drive the n-row first suction cup rod groups 10 to move downward to absorb the silicon wafers 2 and rise to reset, specifically, to absorb the silicon wafers 2 after moving downward by a predetermined distance and rise by the predetermined distance. Figure 2That is, it shows the state that the n rows of first suction cup rod groups 10 have sucked the silicon wafers 2 from the n carriers 3, and Figure 2 The carrier 3 in the middle is pushed by the pins of the platform 14. The flip module 15 then controls the n rows of mechanical arms of the adjacent transfer chamber to take out n carriers 3 from the flip chamber, and then controls the first driving module 11 to drive the n rows of first suction cup rod groups 10 to rotate 180 degrees, and then the second driving module 13 drives them to move downward, and respectively pass through the channels 140 of the corresponding platforms 14 to place the flipped silicon wafers 2 on the n platforms and then continue to move downward a predetermined distance, and then controls the first driving module 11 to drive the n rows of first suction cup rod groups to rotate 180 degrees, Figure 3 That is, it shows that the n-row first suction cup rod group 10 has placed the silicon wafer 2 on the platform 14 and has completed two 180-degree flips with the suction cup 122 facing downward. In order to simplify the diagram and optimize the diagram effect, Figure 3 The silicon wafer 2 that has been flipped and set on the platform 14 is not shown. The flip module 15 then controls the second driving module 13 to drive the top row of suction cup rods 12 and the n-row first suction cup rod group 10 to move downward and suck the silicon wafers on the n platforms and rise a predetermined distance. Specifically, they first move downward to a position convenient for sucking silicon wafers from the corresponding platform 14, and then the top row of suction cup rods 12 and the adjacent n-1 row of first suction cup rods 10 suck the silicon wafers 2 on the n platforms 14 and then rise a predetermined distance. After the mechanical arm outside the cavity transfers n empty plates 3 to the top of the n platforms 14, the sucked silicon wafers 2 are placed on the n empty plates 3. The n is 2-4. In this embodiment, n is equal to 4.

[0047] When the n rows of mechanical arms in the adjacent transmission chamber transfer n carriers 3 loaded with silicon wafers 2 to the flip chamber, the n platforms 14 raise their pins to support the n carriers 3, and the n rows of mechanical arms retract to the adjacent transmission chamber. When the n rows of mechanical arms in the adjacent transmission chamber transfer n empty carriers 3 to the flip chamber, the n platforms 14 raise their pins to support the n carriers 3, and after the top row of suction cup rod groups 12 and the adjacent n-1 rows of first suction cup rod groups 10 below place the sucked silicon wafers into the n empty carriers 3, the pins move downward, and the n rows of mechanical arms support the n carriers 3 loaded with flipped silicon wafers 2 and transfer the n carriers 3 to the transmission chamber.

[0048] See also Figure 5 as well as Figure 6 , Figure 5 A schematic diagram of an application example of a silicon wafer flipping system embodiment of the present invention; Figure 6 for Figure 5 Schematic diagram of an application example of a silicon wafer flipping system embodiment after removing the chamber. Figure 5 and Figure 6 As shown, the first process chamber 4, the first transfer chamber 5, the flip chamber 6, the second transfer chamber 7 and the second process chamber 8 are connected in sequence and are all in a vacuum state. N rows of robotic arms are stacked in the first transfer chamber 5 and the second transfer chamber 7. The first process chamber 4 and the second process chamber 8 are respectively used to form an amorphous silicon thin film layer on different surfaces of the silicon wafer 2, for example, both of them form an amorphous silicon thin film layer on the front and back surfaces of the silicon wafer 2.

[0049] exist Figure 5 In the example shown, the n rows of robotic arms 50 of the first transfer chamber 5 transfer n carriers 3 loaded with silicon wafers 2 to the flip chamber 6 , the n platforms 14 raise their pins to support the n carriers 3 , and the n rows of robotic arms 50 retract to the first transfer chamber 5 . The flip module 15 in the flip system 1 controls the second driving module 13 to drive the n rows of first suction cup rod groups 10 to move downward a predetermined distance, then suck up the silicon wafer 2 and rise the predetermined distance, the n rows of mechanical arms 70 of the second transfer chamber 7 extend into the flip chamber 6 and take out the n empty carrier plates 3, and then the flip module 15 in the silicon wafer flip system 1 completes the flipping of the silicon wafer 2 as described above, and the n rows of mechanical arms 70 of the second transfer chamber 7 transfer the n empty carrier plates to the flip chamber 6, the n platforms 14 raise their pins to support the n carrier plates 3, and after the top row of suction cup rod groups 12 and the adjacent n-1 rows of first suction cup rod groups 10 place the sucked silicon wafers 2 into the n empty carrier plates 3, the pins move downward, and the n rows of mechanical arms 70 support the n carrier plates 3 loaded with the flipped silicon wafers 2 and transfer the n carrier plates 3 from the flip chamber 6 to the second transfer chamber 7. The n rows of robot arms 70 can deliver the n carriers 3 supported by them to the second reaction chamber 8, so as to form an amorphous silicon film on the side of the silicon wafer where no film is formed.

[0050] join Figure 7 , combined with reference to Figure 1 , Figure 7 FIG. 1 is a flow chart of an embodiment of the inventive method for flipping a silicon wafer. Figure 7 As shown, the silicon wafer flipping method S70 of the present invention first performs step S700, transferring n stacked carriers carrying silicon wafers to the flipping chamber. In this embodiment, step S700 includes: n stacked rows of robotic arms in adjacent transfer chambers transfer n carriers carrying silicon wafers to the flipping chamber, the n platforms raise their pins to support the n carriers, and the n rows of robotic arms retract to the adjacent transfer chamber.

[0051] In this embodiment, both sides of the flip chamber are transfer chambers, and n rows of robotic arms are stacked in the transfer chamber. The n rows of robotic arms transfer n carriers into or out of the flip chamber.

[0052] Then proceed to step S710, drive the n-row first suction cup rod group to move downward to absorb the silicon wafer and rise to reset. The n is 2-4, and the suction cups on the n-row first suction cup rod group are bionic adhesive material suction cups, which do not need to rely on negative pressure vacuum, do not need to have suction action, and only rely on the van der Waals force generated when the material approaches the silicon wafer to absorb the silicon wafer. In this example, the n is 4, that is, there are four layers of trays 3 carrying silicon wafers to form films in the reaction chamber.

[0053] Then proceed to step S720 to transfer the n carriers out of the inversion chamber. In this example, the n carriers are taken out from the inversion chamber by n rows of stacked robot arms adjacent to the transfer chamber.

[0054] Then proceed to step S730, driving the n rows of first suction cup rod groups to rotate 180 degrees. In this example, the first driving module 11 can be used to drive the n rows of first suction cup rod groups to rotate 180 degrees.

[0055] Then proceed to step S740, drive the n rows of first suction cup rod groups to move downward and pass through the channels of the corresponding platforms respectively to place the flipped silicon wafer on the n platforms and continue to move downward by a predetermined distance. In this example, the n rows of first suction cup rod groups can be driven to move downward by the second driving module 13, and the second driving module 13 can be a linear motor.

[0056] Then proceed to step S750, driving the n rows of first suction cup rod groups to rotate 180 degrees. In this example, the first driving module 11 can drive the n rows of first suction cup rod groups to rotate 180 degrees.

[0057] Then proceed to step S760, driving the top row of suction cup rods and the n rows of first suction cup rod groups to move downward to a position convenient for sucking silicon wafers from the corresponding platform. In this example, the top row of suction cup rods and the n rows of first suction cup rod groups can be driven to move downward by the second driving module 13, and the second driving module 13 can be a linear motor.

[0058] Then proceed to step S770, the top row of suction cup rods and the adjacent n-1 row of first suction cup rods below suck up the silicon wafers on the n platforms and rise a predetermined distance. In this embodiment, the suction cups of each first suction cup rod in the n row of first suction cup rods and each second suction cup rod in the top row of second suction cup rods are bionic adhesive material suction cups, which do not require other external assistance such as negative pressure vacuum, and do not require suction action, and only rely on the van der Waals force generated when the material approaches the silicon wafer to suck up the silicon wafer.

[0059] Then proceed to step S780, transferring n empty carriers to the flip chamber. In this embodiment, step S780 includes: when n rows of robotic arms in adjacent transfer chambers transfer n empty carriers to the flip chamber, the n platforms raise their pins to support the n carriers. Although the carrier supported by the robotic arm can directly place silicon wafers, considering that the weight of the carrier and silicon wafers when the robotic arm lifts the carrier will cause the carrier to be not very flat, it is best to still raise the pins on the platform to ensure the levelness of the carrier so that the silicon wafers can be placed smoothly later.

[0060] Then proceed to step S790, the top row suction cup rod group and the n-1 row first suction cup rod group adjacent thereto place the sucked silicon wafers into n empty carrier plates and transfer the carrier plates loaded with flipped silicon wafers out of the flip chamber. The step S790 includes: the top row suction cup rod group and the n-1 row first suction cup rod group adjacent thereto place the sucked silicon wafers into n empty carrier plates, the pins move downward, the n rows of mechanical arms support the n carrier plates loaded with flipped silicon wafers and transfer the n carrier plates from the flip chamber to the transfer chamber.

[0061] In summary, the silicon wafer flipping method of the present invention first transfers n stacked carriers carrying silicon wafers to a flipping chamber, then drives n rows of first suction cup rod groups to move downward to absorb the silicon wafers and rise to reset, then transfers the n carriers out of the flipping chamber, then drives the n rows of first suction cup rod groups to rotate 180 degrees, drives them to move downward and pass through the channels of the corresponding platforms respectively to place the flipped silicon wafers on the n platforms and continue to move downward a predetermined distance; then drives the n rows of first suction cup rod groups to rotate 180 degrees, Then drive the top row of suction cup rods and the n-row first suction cup rod group downward to a position convenient for sucking silicon wafers from the corresponding platform; then the top row of suction cup rod group and the n-1 row of first suction cup rod group adjacent thereto suck the silicon wafers on the n platforms and rise a predetermined distance; then transfer the n empty carrier plates to the flip chamber; finally, the top row of suction cup rod group and the n-1 row of first suction cup rod group adjacent thereto place the sucked silicon wafers into the n empty carrier plates and transfer the carrier plate loaded with flipped silicon wafers out of the flip chamber. The present invention can effectively reduce nozzle marks, improve the yield rate and greatly increase the production capacity of solar cells.

[0062] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the universal principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein. The above embodiments are provided to persons familiar with the art to implement or use the present invention, and persons familiar with the art may make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention, and thus the scope of protection of the present invention is not limited by the above embodiments, but should be the maximum scope of the innovative features mentioned in the claims.

Claims

1. A silicon wafer flipping system, which is arranged in a flipping chamber, characterized in that: include: n rows of first suction cup rod groups are stacked and driven to rotate by the first driving module, and driven to move up and down by the second driving module, each row of the first suction cup rod group includes m first suction cup rods, and each first suction cup rod includes p suction cups arranged at the lower end; n platforms, which are arranged at intervals with the n rows of first suction cup rod groups and are used to place n carriers, and each platform is provided with a pin for pushing the carrier to rise and fall and a plurality of channels for accommodating the passage of the first suction cup rods; A top row second suction cup rod group, which is stacked on the n rows of first suction cup rod groups and driven by the second driving module to move up and down, the top row second suction cup rod group includes m second suction cup rods, each second suction cup rod includes p suction cups arranged at the lower end; The flip module controls the second driving module to drive the n rows of first suction cup rod groups to move downward to absorb the silicon wafers and to rise and reset after the n rows of stacked robotic arms in the adjacent transmission chambers transfer the n stacked carriers carrying the silicon wafers to the top of the n platforms, and then controls the n rows of robotic arms in the adjacent transmission chambers to take out the n carriers from the flip chamber, and then controls the first driving module to drive the n rows of first suction cup rod groups to rotate 180 degrees and then be driven by the second driving module to move downward, and respectively pass through the channels of the corresponding platforms to take the flipped silicon wafers. After the wafer is placed on the n platforms, it continues to move downward a predetermined distance, and then controls the first driving module to drive the n rows of first suction cup rod groups to rotate 180 degrees, and then controls the second driving module to drive the top row of suction cup rods and the n rows of first suction cup rod groups to move downward and suck the silicon wafers on the n platforms and rise a predetermined distance, and after the n rows of robotic arms outside the cavity transfer n empty plates to the top of the n platforms, the sucked silicon wafers are placed on the n empty plates.

2. The silicon wafer flipping system according to claim 1, characterized in that: Both sides of the flip chamber are transmission chambers, and n rows of mechanical arms are stacked in the transmission chamber.

3. The silicon wafer flipping system according to claim 1, characterized in that: The n is 2-4, and the suction cups of each first suction cup rod in the n-row first suction cup rod group and each second suction cup rod in the top row second suction cup rod group are all bionic adhesive material suction cups.

4. The silicon wafer flipping system according to claim 1, characterized in that: When the n rows of mechanical arms in the adjacent transmission chamber transfer n carriers loaded with silicon wafers to the flip chamber, the n platforms raise their pins to support the n carriers, and the n rows of mechanical arms retract to the adjacent transmission chamber.

5. The silicon wafer flipping system according to claim 1, characterized in that: When the n rows of robotic arms in adjacent transfer chambers transfer n empty carrier plates to the flip chamber, the n platforms raise their pins to support the n carrier plates, and after the top row of suction cup rod groups and the adjacent n-1 rows of first suction cup rod groups below them place the sucked silicon wafers into the n empty carrier plates, the pins move downward, and the n rows of robotic arms support the n carrier plates loaded with flipped silicon wafers and transfer the n carrier plates to the transfer chamber.

6. A silicon wafer flipping method, characterized in that: The following steps are involved: Step 1, transferring n stacked carriers carrying silicon wafers to a flip chamber; Step 2: driving the n rows of first suction cup rod groups to move downward to absorb the silicon wafer and then rise to reset; Step 3, transferring n carriers out of the flip chamber; Step 4, driving the n rows of first suction cup rod groups to rotate 180 degrees, driving them to move downward and pass through the channels of the corresponding platforms respectively to place the flipped silicon wafers on the n platforms and continue to move downward by a predetermined distance; Step 5, driving the n rows of first suction cup rod groups to rotate 180 degrees, and then driving the top row of suction cup rods and the n rows of first suction cup rod groups to move downward to a position convenient for sucking silicon wafers from the corresponding platform; Step 6, the top row of suction cup rod groups and the adjacent n-1 row of first suction cup rod groups below suck up the silicon wafers on the n platforms and raise them to a predetermined distance; Step 7, transferring n empty plates to the flip chamber; as well as Step eight, the top row of suction cup rod groups and the adjacent n-1 rows of first suction cup rod groups below them place the sucked silicon wafers into n empty carrier plates and transfer the carrier plates loaded with the flipped silicon wafers out of the flip chamber.

7. The method for flipping a silicon wafer according to claim 6, characterized in that: Both sides of the flip chamber are transfer chambers, and n rows of mechanical arms are stacked in the transfer chamber. The n rows of mechanical arms transfer n carriers into or out of the flip chamber.

8. The method for flipping a silicon wafer according to claim 6, characterized in that: The n is 2-4, and the suction cups of each first suction cup rod in the n-row first suction cup rod group and each second suction cup rod in the top row second suction cup rod group are all bionic adhesive material suction cups.

9. The method for flipping a silicon wafer according to claim 6, characterized in that: The step 1 includes: transferring n carriers loaded with silicon wafers to the flip chamber by n stacked rows of robotic arms in adjacent transfer chambers, raising the n platforms with their pins to support the n carriers, and retracting the n rows of robotic arms to the adjacent transfer chambers.

10. The method for flipping a silicon wafer according to claim 6, characterized in that: The step seven includes: when n empty carrier plates are transferred to the flip chamber by n rows of robotic arms in adjacent transfer chambers, the n platforms raise their pins to support the n carrier plates; the step eight includes: the top row of suction cup rod groups and the adjacent n-1 rows of first suction cup rod groups below place the sucked silicon wafers into the n empty carrier plates, the pins move downward, and the n rows of robotic arms support the n carrier plates loaded with flipped silicon wafers and transfer the n carrier plates from the flip chamber to the transfer chamber.

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