Bonding impressing method of display panel and display panel

Abstract

The invention provides a bonding imprinting method of a display panel and the display panel, and belongs to the technical field of photoelectron manufacturing. The bonding imprinting method comprises the following steps: providing a product, wherein the product comprises a carrier plate and at least one light-emitting core particle arranged on the carrier plate; a coining template is manufactured, the plate face of the coining template is provided with at least one kind of coining protrusions, and the arrangement mode of the coining protrusions on the coining template is the same as the arrangement mode of the light-emitting core particles; coining protrusions of the coining template are coated with color changing material layers, and the color changing material layers on the coining protrusions of different types are used for converting incident light into light of different colors; and bonding the color-changing material layer on the imprinting template to each light-emitting core particle of the product. The preparation difficulty and cost of the display panel can be reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of optoelectronic manufacturing technology, and in particular to a bonding and imprinting method of a display panel and a display panel. Background Art

[0002] Micro LED display panels have incomparable advantages in terms of luminous efficiency, power consumption, contrast, response speed, lifespan, etc. Micro LED display panels usually include a carrier board and multiple pixels arranged in an array on the carrier board. Among them, the pixels are micron-sized LED core particles.

[0003] In the related art, when preparing a display panel, a laser mass transfer method is usually used to transfer LED core particles of different luminous colors to corresponding positions on a carrier board, thereby achieving full-color display of the display panel.

[0004] However, laser mass transfer is mainly achieved by laser lift-off and laser transfer, which are relatively complex technologies and difficult to transfer, and are prone to poor transfer accuracy. Summary of the invention

[0005] The embodiment of the present disclosure provides a bonding imprinting method of a display panel and a display panel, which can reduce the difficulty and cost of manufacturing the display panel. The technical solution is as follows:

[0006] The present disclosure provides a bonding and stamping method for a display panel, the bonding and stamping method comprising: providing a product, the product comprising a carrier and at least one light-emitting core arranged on the carrier; making an imprinting template, the plate surface of the imprinting template having at least one imprinting protrusion, the arrangement of one of the imprinting protrusions on the imprinting template being the same as the arrangement of one of the light-emitting cores; coating a color-changing material layer on the imprinting protrusions of the imprinting template, the color-changing material layers on different types of imprinting protrusions being used to convert incident light into light of different colors; and bonding the color-changing material layer on the imprinting template to each light-emitting core of the product.

[0007] In another implementation of the embodiment of the present disclosure, making an imprint template includes: preparing a first substrate, the surface of the first substrate having at least one groove, and the arrangement of one groove on the first substrate is the same as the arrangement of one of the light-emitting core particles; coating a quantum dot layer on the surface of a second substrate; bonding the surface of the second substrate having the quantum dot layer to the surface of the first substrate having the groove, so that the quantum dot layer is embedded in the groove, controlling the bonding pressure to 100kg to 3000kg, controlling the bonding temperature to 50°C to 200°C, and controlling the bonding time to 2min to 100min; after curing the quantum dot layer, forming the imprint protrusion on the second substrate to obtain the imprint template.

[0008] In another implementation of the embodiment of the present disclosure, a plurality of first light-emitting core particles, a plurality of second light-emitting core particles, and a plurality of third light-emitting core particles are arranged at intervals on the carrier, and the light-emitting colors of the first light-emitting core particles, the second light-emitting core particles, and the third light-emitting core particles are the same; the plate surface of the embossing template has a plurality of first embossing protrusions, a plurality of second embossing protrusions, and a plurality of third embossing protrusions arranged at intervals, and the arrangement of the first embossing protrusions on the embossing template is the same as the arrangement of the first light-emitting core particles on the carrier, and the arrangement of the second embossing protrusions on the embossing template is the same as the arrangement of the second light-emitting core particles on the carrier. The arrangement manner is the same, the arrangement manner of the third embossing protrusions on the embossing template is the same as the arrangement manner of the third light-emitting core particles on the carrier; the surface of the first substrate has a plurality of first grooves, a plurality of second grooves and a plurality of third grooves arranged at intervals, the arrangement manner of the first grooves on the first substrate is the same as the arrangement manner of the first light-emitting core particles on the carrier, the arrangement manner of the second grooves on the first substrate is the same as the arrangement manner of the second light-emitting core particles on the carrier, and the arrangement manner of the third grooves on the first substrate is the same as the arrangement manner of the third light-emitting core particles on the carrier.

[0009] In another implementation of the embodiment of the present disclosure, after controlling the bonding time of the first substrate and the second substrate, the method further includes: controlling the first substrate and the second substrate to cool to below 25° C. to solidify the quantum dot layer.

[0010] In another implementation of the embodiment of the present disclosure, preparing the first substrate includes: etching the first groove, the second groove and the third groove on the surface of the silicon substrate to obtain the first substrate, and the groove depths of the first groove, the second groove and the third groove are 20μm to 40μm.

[0011] In another implementation of the embodiment of the present disclosure, the length of the first groove is 45μm to 65μm, and the width of the first groove is 20μm to 40μm; the length of the second groove is 45μm to 65μm, and the width of the second groove is 20μm to 40μm; the length of the third groove is 45μm to 65μm, and the width of the third groove is 20μm to 40μm.

[0012] In another implementation of the embodiment of the present disclosure, coating a color-changing material layer on at least two imprinting protrusions of the imprint template includes: coating a first quantum dot material layer on the first imprinting protrusion, the first quantum dot material layer being used to convert incident light of a first color into light of a second color; coating a second quantum dot material layer on the second imprinting protrusion, the second quantum dot material layer being used to convert incident light of the first color into light of a third color; and coating a third quantum dot material layer on the third imprinting protrusion, the third quantum dot material layer being used to convert incident light of the first color into light of a fourth color.

[0013] In another implementation of the embodiment of the present disclosure, bonding the color-changing material layer on the imprint template to each light-emitting core particle of the product includes: bonding the first imprint protrusion coated with the first quantum dot material layer to the first light-emitting core particle; bonding the second imprint protrusion coated with the second quantum dot material layer to the second light-emitting core particle; bonding the third imprint protrusion coated with the third quantum dot material layer to the third light-emitting core particle.

[0014] In another implementation of the embodiment of the present disclosure, preparing the product includes: bonding the electrodes of the first light-emitting core particle, the second light-emitting core particle and the third light-emitting core particle to the surface of the carrier, and controlling the surfaces of the first light-emitting core particle, the second light-emitting core particle and the third light-emitting core particle away from the electrodes to face away from the carrier.

[0015] An embodiment of the present disclosure provides a display panel, which is prepared by the bonding and imprinting method as described above, and the display panel includes: a carrier, a plurality of first light-emitting core particles, a plurality of second light-emitting core particles and a plurality of third light-emitting core particles, wherein the plurality of first light-emitting core particles, the plurality of second light-emitting core particles and the plurality of third light-emitting core particles are arranged on the carrier at intervals, and the light-emitting colors of the first light-emitting core particles, the second light-emitting core particles and the third light-emitting core particles are the same; a first quantum dot material layer is provided on a surface of the first light-emitting core particle away from the carrier, and the first quantum dot material layer is used to convert incident light of a first color into light of a second color; a second quantum dot material layer is provided on a surface of the second light-emitting core particle away from the carrier, and the second quantum dot material layer is used to convert incident light of the first color into light of a third color; a third quantum dot material layer is provided on a surface of the third light-emitting core particle away from the carrier, and the third quantum dot material layer is used to convert incident light of the first color into light of a fourth color.

[0016] The beneficial effects brought by the technical solution provided by the embodiments of the present disclosure include at least:

[0017] The bonding and imprinting method provided by the embodiment of the present disclosure first produces a product with consistent luminous colors of each luminescent core particle; then, an imprinting template is produced, so that imprinting protrusions corresponding to the luminescent core particles on the product are formed on the imprinting template; then, different color-changing material layers are coated on different types of imprinting protrusions of the imprinting template. Finally, the color-changing material layer on the imprinting protrusion is bonded to the luminescent core particles through the imprinting template, so that different color-changing material layers are formed on all the luminescent core particles.

[0018] Since the color-changing material layers on the different types of embossed protrusions are used to convert the incident light into light of different colors. In this way, after each light-emitting core particle emits light, it can be converted into light of other colors through the color-changing material layer thereon, thereby realizing full-color display. Compared with the preparation method in the related art that uses laser mass transfer to transfer light-emitting core particles of different luminous colors to a carrier plate, the present disclosure avoids the use of laser mass transfer, and instead uses bonding and embossing to form different color-changing material layers on the light-emitting core particles, and also realizes full-color display. Therefore, the difficulty and cost of preparing the display panel can be effectively reduced, and the bonding and embossing method can ensure that the color-changing material layer is accurately bonded to the area required by the design, thereby ensuring the accuracy of the three-color graphics on the product and improving the preparation yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 is a flow chart of a bonding and imprinting method of a display panel provided by an embodiment of the present disclosure;

[0021] Figure 2 is a structural schematic diagram of a product provided by an embodiment of the present disclosure;

[0022] Figure 3 is a state diagram of preparing a first substrate provided by an embodiment of the present disclosure;

[0023] Figure 4 is a bonding state diagram of a first substrate and a second substrate provided by an embodiment of the present disclosure;

[0024] Figure 5 is a schematic diagram of an imprint template provided by an embodiment of the present disclosure;

[0025] Figure 6 is a state diagram of coating a quantum dot material on an embossed protrusion provided by an embodiment of the present disclosure;

[0026] Figure 7 is a schematic diagram of a display panel provided in an embodiment of the present disclosure.

[0027] The descriptions of the marks in the figure are as follows:

[0028] 10. Carrier board;

[0029] 11. first light-emitting core particle; 12. second light-emitting core particle; 13. third light-emitting core particle; 14. electrode;

[0030] 20. embossing template; 21. first embossing protrusion; 22. second embossing protrusion; 23. third embossing protrusion;

[0031] 201, second substrate; 202, quantum dot layer;

[0032] 30. Color-changing material layer; 31. First quantum dot material layer; 32. Second quantum dot material layer; 33. Third quantum dot material layer;

[0033] 40. first substrate; 41. first groove; 42. second groove; 43. third groove;

[0034] 50. Mask plate. DETAILED DESCRIPTION

[0035] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0036] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons with ordinary skills in the field to which the present disclosure belongs. The words "first", "second", "third" and similar words used in the patent application specification and claims of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limitation, but indicate the existence of at least one. Words such as "include" or "comprise" and similar words mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right", "top", "bottom" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0037] Figure 1 FIG. 1 is a flow chart of a bonding imprinting method for a display panel provided by an embodiment of the present disclosure. Figure 1 As shown, the bonding imprint method includes:

[0038] Step S11: providing a product.

[0039] The product includes a carrier 10 and at least one light-emitting core particle disposed on the carrier 10 .

[0040] Exemplarily, the product includes a carrier 10 and a plurality of first light-emitting core particles 11, a plurality of second light-emitting core particles 12 and a plurality of third light-emitting core particles 13 arranged at intervals on the carrier 10, and the first light-emitting core particles 11, the second light-emitting core particles 12 and the third light-emitting core particles 13 have the same light-emitting color.

[0041] Step S12: making an imprint template 20 .

[0042] The plate surface of the imprint template 20 has at least one imprint protrusion, and the arrangement of one imprint protrusion on the imprint template 20 is the same as the arrangement of one light-emitting core particle.

[0043] Exemplarily, the plate surface of the imprint template 20 has a plurality of first imprint protrusions 21, a plurality of second imprint protrusions 22 and a plurality of third imprint protrusions 23 arranged at intervals, the arrangement of the first imprint protrusions 21 on the imprint template 20 is the same as the arrangement of the first light-emitting core particles 11 on the carrier, the arrangement of the second imprint protrusions 22 on the imprint template 20 is the same as the arrangement of the second light-emitting core particles 12 on the carrier, and the arrangement of the third imprint protrusions 23 on the imprint template 20 is the same as the arrangement of the third light-emitting core particles 13 on the carrier.

[0044] Step S13 : coating a color-changing material layer 30 on the embossing protrusions of the embossing template 20 .

[0045] The color-changing material layers 30 on the different types of embossed protrusions are used to convert incident light into light of different colors.

[0046] Step S14: bonding the color-changing material layer 30 on the imprint template 20 to each light-emitting core particle of the product.

[0047] The bonding and embossing method provided by the embodiment of the present disclosure first manufactures a product with consistent luminous colors of each luminescent core particle; then, manufactures an embossing template 20, and forms a first embossing protrusion 21 corresponding to the first luminescent core particle 11 on the product, a second embossing protrusion 22 corresponding to the second luminescent core particle 12, and a third embossing protrusion 23 corresponding to the third luminescent core particle 13 on the embossing template 20; then, different color-changing material layers 30 are coated on different types of embossing protrusions of the embossing template 20. Finally, the color-changing material layer 30 on the first embossing protrusion 21 is bonded to the first luminescent core particle 11, the color-changing material layer 30 on the second embossing protrusion 22 is bonded to the second luminescent core particle 12, and the color-changing material layer 30 on the third embossing protrusion 23 is bonded to the third luminescent core particle 13 through the embossing template 20, so that different color-changing material layers 30 are formed on all the luminescent core particles.

[0048] Since the color-changing material layer 30 on the different types of embossed protrusions is used to convert the incident light into light of different colors. In this way, after each light-emitting core particle emits light, it can be converted into light of other colors through the color-changing material layer 30 thereon, thereby realizing full-color display. Compared with the preparation method in the related art that uses laser mass transfer to transfer light-emitting core particles of different luminous colors to the carrier 10, the present disclosure avoids the use of laser mass transfer, and instead uses bonding and embossing to form different color-changing material layers 30 on the light-emitting core particles, and also realizes full-color display. Therefore, the difficulty and cost of preparing the display panel can be effectively reduced, and the bonding and embossing method can ensure that the color-changing material layer 30 is accurately bonded to the area required by the design, thereby ensuring the accuracy of the three-color graphics on the product and improving the preparation yield of the display panel.

[0049] Optionally, step S11 may include: bonding the electrodes 14 of the first light-emitting core 11, the second light-emitting core 12 and the third light-emitting core 13 to the surface of the carrier 10, and controlling the surfaces of the first light-emitting core 11, the second light-emitting core 12 and the third light-emitting core 13 away from the electrodes 14 to face away from the carrier 10.

[0050] Figure 2 Schematic diagram of a product provided by an embodiment of the present disclosure. Figure 2 As shown, a first light-emitting core particle 11 , a second light-emitting core particle 12 and a third light-emitting core particle 13 are arranged on the surface of the carrier 10 , and an electrode 14 of each light-emitting core particle is connected to the carrier 10 .

[0051] In the disclosed embodiment, the first light-emitting core particle 11 , the second light-emitting core particle 12 and the third light-emitting core particle 13 have the same light-emitting color.

[0052] Exemplarily, the light emitting colors of the first light emitting core particle 11 , the second light emitting core particle 12 and the third light emitting core particle 13 are all white.

[0053] Exemplarily, the carrier 10 may be a circuit board, and the electrodes 14 of the light-emitting core particles are bonded to the surface of the circuit board, so as to control the light emission of each light-emitting core particle through the circuit board.

[0054] Optionally, preparing the imprint template 20 in step S12 may include the following steps:

[0055] In the first step, a first substrate 40 is prepared.

[0056] The surface of the first substrate 40 has at least one kind of grooves, and the arrangement of one kind of grooves on the first substrate 40 is the same as the arrangement of one kind of light-emitting core particles.

[0057] Specifically, the method may include etching a first groove 41 , a second groove 42 and a third groove 43 on the surface of the silicon substrate to obtain the first substrate 40 .

[0058] Figure 3 4 is a state diagram of preparing a first substrate 40 provided by an embodiment of the present disclosure. Figure 3 As shown, an array pattern is prepared on a silicon substrate by irradiating a mask 50 with ultraviolet light.

[0059] In the disclosed embodiment, the first substrate 40 is a silicon substrate, and an array pattern is formed on the silicon substrate by ultraviolet etching.

[0060] Alternatively, if Figure 3 As shown, the array pattern on the surface of the first substrate 40 includes a plurality of first grooves 41 , a plurality of second grooves 42 and a plurality of third grooves 43 arranged at intervals.

[0061] Exemplarily, the arrangement of the first grooves 41 on the first substrate 40 is the same as the arrangement of the first light-emitting core particles 11 on the carrier, the arrangement of the second grooves 42 on the first substrate 40 is the same as the arrangement of the second light-emitting core particles 12 on the carrier, and the arrangement of the third grooves 43 on the first substrate 40 is the same as the arrangement of the third light-emitting core particles 13 on the carrier.

[0062] Exemplarily, the groove depths of the first groove 41 , the second groove 42 and the third groove 43 are 20 μm to 40 μm.

[0063] As an example, the groove depth of the first groove 41 , the second groove 42 , and the third groove 43 is 30 μm.

[0064] Exemplarily, the length of the first groove 41 is 45 μm to 65 μm, and the width of the first groove 41 is 20 μm to 40 μm.

[0065] As an example, the length of the first groove 41 is 55 μm, and the width of the first groove 41 is 30 μm.

[0066] Exemplarily, the length of the second groove 42 is 45 μm to 65 μm, and the width of the second groove 42 is 20 μm to 40 μm.

[0067] As an example, the length of the second groove 42 is 55 μm, and the width of the second groove 42 is 30 μm.

[0068] Exemplarily, the length of the third groove 43 is 45 μm to 65 μm, and the width of the third groove 43 is 20 μm to 40 μm.

[0069] As an example, the length of the third groove 43 is 55 μm, and the width of the third groove 43 is 30 μm.

[0070] It should be noted that the first groove 41 , the second groove 42 and the third groove 43 can be set according to the actual size of the light-emitting core particles on the product, and the embodiment of the present disclosure does not limit this.

[0071] In the second step, a quantum dot layer 202 is coated on the surface of the second substrate 201 .

[0072] Exemplarily, the second substrate 201 may be a sapphire substrate.

[0073] Figure 4 FIG. 4 is a diagram showing a bonding state of a first substrate 40 and a second substrate 201 provided in an embodiment of the present disclosure. Figure 4 As shown, quantum dot material is spin-coated on the surface of a sapphire substrate.

[0074] The third step is Figure 4As shown, the surface of the second substrate 201 having the quantum dot layer 202 is bonded to the surface of the first substrate 40 having the grooves, so that the quantum dot layer 202 is embedded in the first groove 41 , the second groove 42 and the third groove 43 .

[0075] Optionally, when bonding the first substrate 40 and the second substrate 201 , the bonding pressure is controlled to be 100 kg to 3000 kg, the bonding temperature is controlled to be 50° C. to 200° C., and the bonding time is controlled to be 2 min to 100 min.

[0076] Exemplarily, when bonding the first substrate 40 and the second substrate 201 , the bonding pressure is controlled to be 500 kg, the bonding temperature is controlled to be 100° C., and the bonding time is controlled to be 20 min.

[0077] The fourth step is Figure 5 As shown, after the quantum dot layer 202 is cured, a first imprinting protrusion 21 , a second imprinting protrusion 22 and a third imprinting protrusion 23 are formed on the second substrate 201 to obtain an imprinting template 20 .

[0078] Exemplarily, curing the quantum dot layer 202 may include: controlling the first substrate 40 and the second substrate 201 to cool to below 25° C. to cure the quantum dot layer 202 .

[0079] During the bonding process, the quantum dot layer 202 coated on the second substrate 201 is still a liquid quantum dot with fluidity, so the quantum dot layer 202 can flow into each groove during bonding, and after being cured, the quantum dots can form the required embossing protrusions according to the shape of each groove.

[0080] Optionally, steps S13 to S14 may include the following steps:

[0081] Figure 6 It is a state diagram of coating a quantum dot material on an embossed protrusion provided by an embodiment of the present disclosure.

[0082] The first step, such as Figure 6 As shown in the first figure on the left, a first quantum dot material layer 31 is coated on the first embossing protrusion 21 .

[0083] The first quantum dot material layer 31 is used to convert incident light of a first color into light of a second color.

[0084] Exemplarily, the first quantum dot material layer 31 may be a blue light quantum dot material layer.

[0085] In the second step, the first embossing protrusion 21 coated with the first quantum dot material layer 31 is bonded to the first light-emitting core particle 11 .

[0086] like Figure 6As shown in the first figure on the right, after the first quantum dot material layer 31 is bonded to the first light-emitting core particle 11, the light emitted by the first light-emitting core particle 11 is converted from the first color to blue light, that is, a blue light core particle is obtained.

[0087] The third step is Figure 6 As shown in the second figure from the left, a second quantum dot material layer 32 is coated on the second embossing protrusion 22 .

[0088] The second quantum dot material layer 32 is used to convert incident light of the first color into light of the third color.

[0089] Exemplarily, the second quantum dot material layer 32 may be a green light quantum dot material layer.

[0090] The fourth step is to bond the second embossing protrusion 22 coated with the second quantum dot material layer 32 to the second light-emitting core particle 12 .

[0091] like Figure 6 As shown in the first figure on the right side, after the second quantum dot material layer 32 is bonded to the second light-emitting core particle 12, the light emitted by the second light-emitting core particle 12 is converted from the first color to green light, that is, a green light core particle is obtained.

[0092] Step 5: Figure 6 As shown in the third figure from the left, a third quantum dot material layer 33 is coated on the third embossing protrusion 23 .

[0093] The third quantum dot material layer 33 is used to convert incident light of the first color into light of the fourth color.

[0094] Exemplarily, the third quantum dot material layer 33 may be a red light quantum dot material layer.

[0095] In the sixth step, the third embossing protrusion 23 coated with the third quantum dot material layer 33 is bonded to the third light-emitting core particle 13 .

[0096] like Figure 6 As shown in the first figure on the right side, after the third quantum dot material layer 33 is bonded to the third light-emitting core particle 13, the light emitted by the third light-emitting core particle 13 is converted from the first color to red light, that is, a red light core particle is obtained.

[0097] Figure 7 is a schematic diagram of a display panel provided by an embodiment of the present disclosure. The display panel is prepared by the bonding imprinting method as described above.

[0098] like Figure 7As shown, the display panel includes: a carrier board 10, a plurality of first light-emitting core particles 11, a plurality of second light-emitting core particles 12 and a plurality of third light-emitting core particles 13, wherein the plurality of first light-emitting core particles 11, the plurality of second light-emitting core particles 12 and the plurality of third light-emitting core particles 13 are arranged on the carrier board 10 at intervals, and the light-emitting colors of the first light-emitting core particles 11, the second light-emitting core particles 12 and the third light-emitting core particles 13 are the same.

[0099] like Figure 7 As shown, a first quantum dot material layer 31 is provided on a surface of the first light-emitting core particle 11 away from the carrier 10 . The first quantum dot material layer 31 is used to convert incident light of a first color into light of a second color.

[0100] like Figure 7 As shown, the second light-emitting core particle 12 has a second quantum dot material layer 32 on the surface away from the carrier 10 . The second quantum dot material layer 32 is used to convert the incident light of the first color into light of the third color.

[0101] like Figure 7 As shown, a third quantum dot material layer 33 is provided on a surface of the third light emitting core particle 13 away from the carrier 10 . The third quantum dot material layer 33 is used to convert incident light of the first color into light of the fourth color.

[0102] In the embodiment of the present disclosure, the structures of the first light-emitting core particle 11 , the second light-emitting core particle 12 and the third light-emitting core particle 13 are all the same.

[0103] Taking the first light-emitting core 11 as an example, the first light-emitting core 11 includes an epitaxial layer, a first electrode 14 and a second electrode 14. The epitaxial layer generally includes a first semiconductor layer, a multi-quantum well layer and a second semiconductor layer stacked in sequence. The second semiconductor layer has a groove exposing the first semiconductor layer.

[0104] The first electrode 14 is located on the surface of the second semiconductor layer, and the second electrode 14 is located in the groove and connected to the first semiconductor layer.

[0105] Optionally, one of the first semiconductor layer and the second semiconductor layer is a p-type layer, and the other of the first semiconductor layer and the second semiconductor layer is an n-type layer.

[0106] Exemplarily, the p-type layer includes a p-type GaN layer.

[0107] The multi-quantum well layer may include alternately grown InGaN quantum well layers and GaN quantum barrier layers. The first light emitting layer may include 3 to 8 periods of alternately stacked InGaN quantum well layers and GaN quantum barrier layers.

[0108] Exemplarily, the n-type layer includes an n-type GaN layer.

[0109] Optionally, the thickness of the first light-emitting core particle 11 is 2 μm to 10 μm.

[0110] Exemplarily, the carrier 10 may be a circuit board, and the electrodes 14 of the light-emitting core particles are bonded to the surface of the circuit board, so as to control the light emission of each light-emitting core particle through the circuit board.

[0111] Exemplarily, the surface of the first light-emitting core particle 11 is bonded with a first quantum dot material layer 31 , and the light emitted by the first light-emitting core particle 11 can be converted from the first color to blue light after passing through the first quantum dot material layer 31 , that is, a blue light core particle is obtained.

[0112] Wherein, illustratively, the first quantum dot material layer 31 may be a blue light quantum dot material layer.

[0113] Exemplarily, a second quantum dot material layer 32 is bonded to the surface of the second light-emitting core particle 12 , and the light emitted by the second light-emitting core particle 12 can be converted from the first color to green light after passing through the second quantum dot material layer 32 , that is, a green light core particle is obtained.

[0114] Exemplarily, the second quantum dot material layer 32 may be a green light quantum dot material layer.

[0115] Exemplarily, a third quantum dot material layer 33 is bonded to the surface of the third light-emitting core particle 13 , and the light emitted by the third light-emitting core particle 13 can be converted from the first color to red light after passing through the third quantum dot material layer 33 , that is, a red light core particle is obtained.

[0116] The third quantum dot material layer 33 may be a red light quantum dot material layer.

[0117] Optionally, the display panel may further include a driver integrated circuit (IC). The driver IC is located on the carrier board.

[0118] The driver IC is located on the carrier and is electrically connected to the driving wires on the carrier, and the electrodes of the plurality of light-emitting core particles are also electrically connected to the driving wires on the carrier, so that the driver IC can control each light-emitting core particle through the driving wires.

[0119] The above does not limit the present disclosure in any form. Although the present disclosure has been disclosed as above through the embodiments, it is not used to limit the present disclosure. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present disclosure. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure still falls within the scope of the technical solution of the present disclosure.

Claims

1. A bonding imprinting method for a display panel, characterized in that: The bonding imprinting method comprises: A product is provided, the product comprising a carrier (10) and at least one light-emitting core particle arranged on the carrier (10); Manufacturing an embossing template (20), wherein the plate surface of the embossing template (20) has at least one embossing protrusion, and the arrangement of one of the embossing protrusions on the embossing template (20) is the same as the arrangement of one of the light-emitting core particles; A color-changing material layer (30) is coated on the embossing protrusions of the embossing template (20), wherein the color-changing material layers (30) on different types of embossing protrusions are used to convert incident light into light of different colors; The color-changing material layer (30) on the imprint template (20) is bonded to each light-emitting core particle of the product.

2. The bonding imprinting method according to claim 1, characterized in that: The method of making the embossing template (20) comprises: Prepare a first substrate (40), wherein the surface of the first substrate (40) has at least one groove, and the arrangement of the grooves on the first substrate (40) is the same as the arrangement of the light-emitting core particles; Coating a quantum dot layer (202) on the surface of the second substrate (201); Bonding the surface of the second substrate (201) having the quantum dot layer (202) to the surface of the first substrate (40) having the groove, so that the quantum dot layer (202) is embedded in the groove, controlling the bonding pressure to be 100 kg to 3000 kg, controlling the bonding temperature to be 50° C. to 200° C., and controlling the bonding time to be 2 min to 100 min; After curing the quantum dot layer (202), the embossing protrusion is formed on the second substrate (201) to obtain the embossing template (20).

3. The bonding imprinting method according to claim 2, characterized in that: A plurality of first light-emitting core particles (11), a plurality of second light-emitting core particles (12) and a plurality of third light-emitting core particles (13) are arranged at intervals on the carrier (10), and the first light-emitting core particles (11), the second light-emitting core particles (12) and the third light-emitting core particles (13) emit the same light color; The plate surface of the embossing template (20) has a plurality of first embossing protrusions (21), a plurality of second embossing protrusions (22) and a plurality of third embossing protrusions (23) arranged at intervals; the arrangement of the first embossing protrusions (21) on the embossing template (20) is the same as the arrangement of the first light-emitting core particles (11) on the carrier (10); the arrangement of the second embossing protrusions (22) on the embossing template (20) is the same as the arrangement of the second light-emitting core particles (12) on the carrier (10); and the arrangement of the third embossing protrusions (23) on the embossing template (20) is the same as the arrangement of the third light-emitting core particles (13) on the carrier (10); The surface of the first substrate (40) has a plurality of first grooves (41), a plurality of second grooves (42) and a plurality of third grooves (43) arranged at intervals. The arrangement of the first grooves (41) on the first substrate (40) is the same as the arrangement of the first light-emitting core particles (11) on the carrier (10). The arrangement of the second grooves (42) on the first substrate (40) is the same as the arrangement of the second light-emitting core particles (12) on the carrier (10). The arrangement of the third grooves (43) on the first substrate (40) is the same as the arrangement of the third light-emitting core particles (13) on the carrier (10).

4. The bonding imprinting method according to claim 3, characterized in that: After controlling the bonding time of the first substrate (40) and the second substrate (201), the method further comprises: The first substrate (40) and the second substrate (201) are controlled to cool to below 25° C. to solidify the quantum dot layer (202).

5. The bonding imprinting method according to claim 3, characterized in that: Preparing the first substrate (40) includes: The first groove (41), the second groove (42) and the third groove (43) are formed by etching on the surface of a silicon substrate to obtain the first substrate (40), wherein the groove depths of the first groove (41), the second groove (42) and the third groove (43) are 20 μm to 40 μm.

6. The bonding imprinting method according to claim 3, characterized in that: The length of the first groove (41) is 45 μm to 65 μm, and the width of the first groove (41) is 20 μm to 40 μm; The length of the second groove (42) is 45 μm to 65 μm, and the width of the second groove (42) is 20 μm to 40 μm; The length of the third groove (43) is 45 μm to 65 μm, and the width of the third groove (43) is 20 μm to 40 μm.

7. The bonding imprinting method according to any one of claims 3 to 6, characterized in that: Coating a color-changing material layer (30) on at least two embossing protrusions of the embossing template (20) comprises: Coating a first quantum dot material layer (31) on the first embossing protrusion (21), wherein the first quantum dot material layer (31) is used to convert incident light of a first color into light of a second color; coating a second quantum dot material layer (32) on the second embossing protrusion (22), wherein the second quantum dot material layer (32) is used to convert incident light of a first color into light of a third color; A third quantum dot material layer (33) is coated on the third embossing protrusion (23), and the third quantum dot material layer (33) is used to convert incident light of the first color into light of a fourth color.

8. The bonding imprinting method according to claim 7, characterized in that: Bonding the color-changing material layer (30) on the imprint template (20) to each light-emitting core particle of the product comprises: Bonding the first embossing protrusion (21) coated with the first quantum dot material layer (31) to the first light-emitting core particle (11); Bonding the second embossing protrusion (22) coated with the second quantum dot material layer (32) to the second light-emitting core particle (12); The third embossing protrusion (23) coated with the third quantum dot material layer (33) is bonded to the third light-emitting core particle (13).

9. The bonding imprinting method according to any one of claims 3 to 6, characterized in that: The preparation of the product comprises: The electrodes (14) of the first light-emitting core (11), the second light-emitting core (12) and the third light-emitting core (13) are bonded to the surface of the carrier (10), and the surfaces of the first light-emitting core (11), the second light-emitting core (12) and the third light-emitting core (13) away from the electrodes (14) are controlled to face away from the carrier (10).

10. A display panel, characterized in that: The display panel is prepared by the bonding and imprinting method according to any one of claims 1 to 9, and comprises: a carrier (10), a plurality of first light-emitting core particles (11), a plurality of second light-emitting core particles (12) and a plurality of third light-emitting core particles (13), wherein the plurality of first light-emitting core particles (11), the plurality of second light-emitting core particles (12) and the plurality of third light-emitting core particles (13) are arranged on the carrier (10) at intervals, and the first light-emitting core particles (11), the second light-emitting core particles (12) and the third light-emitting core particles (13) emit light of the same color; A first quantum dot material layer (31) is provided on a surface of the first light-emitting core particle (11) away from the carrier (10), and the first quantum dot material layer (31) is used to convert incident light of a first color into light of a second color; A second quantum dot material layer (32) is provided on a surface of the second light-emitting core particle (12) away from the carrier (10), and the second quantum dot material layer (32) is used to convert incident light of a first color into light of a third color; A third quantum dot material layer (33) is provided on the surface of the third light-emitting core particle (13) away from the carrier (10), and the third quantum dot material layer (33) is used to convert incident light of the first color into light of a fourth color.

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