Miniature light emitting diode packaging body

Abstract

The invention discloses a micro light emitting diode packaging body. The miniature light emitting diode packaging body comprises a first substrate, a plurality of miniature light emitting diode chips, a transparent protection layer and a plurality of conductive pads. Wherein the first substrate is provided with an upper surface and a lower surface which are opposite; the micro light-emitting diode chip is arranged on the upper surface of the first substrate, wherein the micro light-emitting diode chip is provided with a first electrode and a second electrode which is electrically opposite to the first electrode. The transparent protective layer covers the micro light-emitting diode chips. The plurality of conductive pads are arranged on the lower surface of the first substrate, and the conductive pads comprise a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad. The first conductive pad, the second conductive pad and the third conductive pad are electrically connected with the first electrodes of the corresponding micro light-emitting diode chips respectively, and the fourth conductive pad is jointly electrically connected with the second electrodes of the micro light-emitting diodes.

Description

Technical Field

[0001] The invention relates to a micro light emitting diode package, in particular to a micro light emitting diode package for fluid assembly. Background Art

[0002] Micro-LED displays use micro-LEDs to emit three colors of light: red, green, and blue. The challenge of micro-LED displays is how to accurately place millions of micro-LEDs in the correct position on the display substrate to connect the circuits and form a pixel array. Micro-LEDs are grabbed from the micro-LED supply substrate by a stamp, and then placed on the display substrate. For a high-definition television (HDTV) with 6.2 million sub-pixels and a pitch of 200 microns (μm), the transfer time may take several days. For 4K and 8K TVs, the number of sub-pixels increases to 24.9 million and 99.5 million, respectively, while the sub-pixel size decreases accordingly, so the complexity and cost of the above technology will increase significantly with the increase in pixel density. Summary of the invention

[0003] Some embodiments of the present invention provide a micro-light emitting diode package. The micro-light emitting diode package includes a first substrate, a plurality of micro-light emitting diode chips, a transparent protective layer and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other. The micro-light emitting diode chip is arranged on the upper surface of the first substrate, wherein the micro-light emitting diode chip has a first electrode and a second electrode electrically corresponding to the first electrode. The transparent protective layer covers the micro-light emitting diode chip. A plurality of conductive pads are arranged on the lower surface of the first substrate, and the conductive pads include a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad. The first conductive pad, the second conductive pad and the third conductive pad are respectively electrically connected to the first electrodes of the corresponding micro-light emitting diode chips, and the fourth conductive pad is electrically connected to the second electrodes of the plurality of micro-light emitting diodes in common.

[0004] The above does not represent every embodiment or every aspect of the present invention, but only provides examples of some novel aspects and features described herein. When combined with the accompanying drawings and the appended claims, the above features and advantages of the present invention and other features and advantages will become apparent from the following detailed description of representative embodiments and methods for implementing the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Through the following detailed description in conjunction with the attached drawings, the viewpoints of the embodiments of the present invention can be better understood. It is worth noting that, according to standard practices in the industry, some components may not be drawn to scale. In fact, the sizes of different components may be increased or reduced in order to clearly describe.

[0006] Figure 1 Schematic cross-sectional view of a micro light emitting diode package according to some embodiments of the present invention;

[0007] Figure 2 A bottom view of a micro light emitting diode package according to some embodiments of the present invention;

[0008] Figure 3 A top view of a second substrate of a micro light emitting diode package according to some embodiments of the present invention;

[0009] Figure 4 A cross-sectional schematic diagram of a micro light emitting diode package installed on a second substrate according to some embodiments of the present invention;

[0010] Figure 5A is a cross-sectional schematic diagram of a micro light emitting diode package not mounted on a second substrate according to some embodiments of the present invention;

[0011] Figure 5B A top view of a micro light emitting diode package according to some embodiments of the present invention, wherein the micro light emitting diode package is not mounted on a second substrate;

[0012] Figure 6 A schematic diagram of circuit routing of a first substrate of a micro light emitting diode package according to some embodiments of the present invention;

[0013] Figure 7 A bottom view of a micro light emitting diode package according to some embodiments of the present invention;

[0014] Figure 8 A bottom view of a micro light emitting diode package according to some embodiments of the present invention;

[0015] Fig. 9 is a top view of a second substrate according to some embodiments of the present invention;

[0016] Fig.10 is a top view of a second substrate according to some embodiments of the present invention;

[0017] Fig.11 is a top view of a second substrate according to some embodiments of the present invention;

[0018] Fig.12 A schematic diagram of circuit routing of a first substrate of a micro light emitting diode package according to some embodiments of the present invention;

[0019] Fig.13 A cross-sectional schematic diagram of a micro light emitting diode package installed on a second substrate according to some embodiments of the present invention;

[0020] Fig.14 A bottom view of a micro light emitting diode package according to some embodiments of the present invention;

[0021] Fig.15 A bottom view of a micro light emitting diode package according to some embodiments of the present invention;

[0022] Fig.16 is a top view of a second substrate according to some embodiments of the present invention;

[0023] Fig.17 is a top view of a second substrate according to some embodiments of the present invention;

[0024] Fig.18 is a top view of a second substrate according to some embodiments of the present invention;

[0025] Fig.19 A schematic diagram of circuit routing of a first substrate of a micro light emitting diode package according to some embodiments of the present invention;

[0026] Fig. 20 A cross-sectional schematic diagram of a micro light emitting diode package installed on a second substrate according to some embodiments of the present invention;

[0027] Fig.21 A bottom view of a micro light emitting diode package according to some embodiments of the present invention;

[0028] Fig. 22 is a top view of a second substrate according to some embodiments of the present invention;

[0029] Fig.23 A schematic diagram of circuit routing of a first substrate of a micro light emitting diode package according to some embodiments of the present invention;

[0030] Fig.24 For along Fig. 22 A cross-sectional schematic diagram of the micro light emitting diode package mounted on the second substrate captured along line AA';

[0031] Fig.25 Schematic cross-sectional view of a micro light emitting diode package according to some embodiments of the present invention;

[0032] Fig.26 Schematic cross-sectional view of a micro light emitting diode package according to some embodiments of the present invention;

[0033] Fig. 27 Schematic diagram of a micro light emitting diode package in a fluid assembly process according to some embodiments of the present invention;

[0034] Fig.28 Schematic diagram of a micro light emitting diode package in a fluid assembly process according to some embodiments of the present invention;

[0035] Fig.29is a schematic diagram of a micro light emitting diode package according to Comparative Example 1 of the present invention during fluid assembly;

[0036] Fig.30 It is a schematic diagram of the upper surface of the blue light micro-LED chip and the green light micro-LED chip of the present invention.

[0037] Explanation of symbols

[0038] 10: First substrate

[0039] 100: Micro LED chips

[0040] 100F: First electrode

[0041] 100S: Second electrode

[0042] 100B: Blue light micro-LED chip

[0043] 100B1: First electrode

[0044] 100B2: Second electrode

[0045] 100G: Green light micro-LED chip

[0046] 100G1: First electrode

[0047] 100G2: Second electrode

[0048] 100R: Red light micro-LED chip

[0049] 100R1: First electrode

[0050] 100R2: Second electrode

[0051] 120: Transparent protective layer

[0052] 140: Adhesive layer

[0053] 160: Fluid guide column

[0054] 410, 420, 430, 440: Conductive circuits

[0055] 412, 422, 432, 442: Guide hole

[0056] 500: Conductive pad

[0057] 510: First conductive pad

[0058] 520: Second conductive pad

[0059] 530: The third conductive pad

[0060] 540: Fourth conductive pad

[0061] 600: Micro light emitting diode display device

[0062] 800: Conductive interface

[0063] 810: First conductive junction

[0064] 820: Second conductive junction

[0065] 830: Third conductive junction

[0066] 840: Fourth conductive junction

[0067] 900: Second substrate

[0068] 1000, 1000R: Micro LED package

[0069] P: Flat cut edge

[0070] S1: Upper surface

[0071] S2: Lower surface

[0072] S3: Upper surface

[0073] B: Bottom surface

[0074] W: Sidewall

[0075] T: Receptacle

[0076] TP: Flat edge tab

[0077] N: Notch DETAILED DESCRIPTION

[0078] The following disclosure provides different embodiments for implementing different components in the provided packaging structure. Specific examples of each component and its configuration are described below to simplify the embodiments of the present invention, and are certainly not intended to limit the present invention. For example, if the description mentions that a first component is formed on a second component, it may include an embodiment in which the first component and the second component are in direct contact, and it may also include an embodiment in which an additional component is formed between the first component and the second component so that the first component and the second component are not in direct contact. In addition, the present invention may repeat component symbols and / or characters in different embodiments or examples. Such repetition is for simplicity and clarity, and is not used to indicate the relationship between the different embodiments and / or examples discussed.

[0079] The present invention provides a micro light emitting diode package. Figure 1 . Figure 1 4 is a schematic cross-sectional view of a micro light emitting diode package according to some embodiments of the present invention.

[0080] refer to Figure 1, a micro-LED package 1000 includes a first substrate 10, a plurality of micro-LED chips 100, a transparent protective layer 120 and a plurality of conductive pads 500. The first substrate 10 has an upper surface S1 and a lower surface S2 opposite to each other. The micro-LED chip 100 is disposed on the upper surface S1 of the first substrate 10, wherein the micro-LED chip 100 has a first electrode 100F and a second electrode 100S (not shown) electrically corresponding to the first electrode 100F. The transparent protective layer 120 covers the micro-LED chip 100. A plurality of conductive pads 500 are disposed on the lower surface S2 of the first substrate 10. Please refer to Figure 2 The conductive pad 500 includes a first conductive pad 510, a second conductive pad 520, a third conductive pad 530 and a fourth conductive pad 540. Through the circuit wiring (not shown) in the first substrate 10, the first conductive pad 510, the second conductive pad 520 and the third conductive pad 530 are respectively electrically connected to the first electrodes 100F of the corresponding micro-LED chips 100, and the fourth conductive pad 540 is commonly electrically connected to the second electrodes 100S (not shown) of the plurality of micro-LEDs 100. That is, the first substrate 10 is provided with a circuit wiring layout for electrically connecting the micro-LED chips 100 to the first substrate 10.

[0081] In some embodiments, the micro-LED chip 100 may be a micro-LED chip (micro LED chip) or a quantum dot LED (quantum dot LED), but the present invention is not limited thereto. In some embodiments, the micro-LED chip 100 may emit red light, green light or blue light, but the present invention is not limited thereto, and the micro-LED chip 100 may also emit light of other wavelengths, such as ultraviolet light (UV). In some embodiments, the micro-LED chip 100 may be a flip-chip LED chip.

[0082] refer to Figure 1 In some embodiments, the micro LED chip 100 includes a red micro LED chip 100R, a blue micro LED chip 100B, and a green micro LED chip 100G.

[0083] In some embodiments, the red micro-LED chip 100R has a first electrode 100R1 and a second electrode 100R2 , the blue micro-LED chip 100B has a first electrode 100B1 and a second electrode 100B2 , and the green micro-LED chip 100G has a first electrode 100G1 and a second electrode 100G2 .

[0084] In some embodiments, the first electrode 100F includes the first electrode 100B1 of the blue light micro-LED chip 100B, the first electrode 100G1 of the green light micro-LED chip 100G, and the first electrode 100R1 of the red light micro-LED chip 100R, and the second electrode 100S includes the second electrode 100B2 of the blue light micro-LED chip 100B, the second electrode 100G2 of the green light micro-LED chip 100G, and the second electrode 100R2 of the red light micro-LED chip 100R.

[0085] In some embodiments, the first electrode 100B1 of the blue light micro-LED chip 100B, the first electrode 100G1 of the green light micro-LED chip 100G, and the first electrode 100R1 of the red light micro-LED chip 100R are positive electrodes, and the second electrode 100B2 of the blue light micro-LED chip 100B, the second electrode 100G2 of the green light micro-LED chip 100G, and the second electrode 100R2 of the red light micro-LED chip 100R are negative electrodes.

[0086] In some embodiments, the first electrode 100B1 of the blue light micro-LED chip 100B, the first electrode 100G1 of the green light micro-LED chip 100G, and the first electrode 100R1 of the red light micro-LED chip 100R are negative electrodes, and the second electrode 100B2 of the blue light micro-LED chip 100B, the second electrode 100G2 of the green light micro-LED chip 100G, and the second electrode 100R2 of the red light micro-LED chip 100R are positive electrodes.

[0087] In some embodiments, the transparent protective layer 120 may include solid molding compound (EPOXY MOLDING COMPOUND, EMC), silicone resin (POLYSILOXANE or SILICONE), liquid molding compound (LIQUID MOLDING COMPOUND, LMC), but the present invention is not limited thereto, and other suitable molding materials are also applicable to the present invention. In some embodiments, the light transmittance of the transparent protective layer 120 may be greater than 90%. In some embodiments, the thickness of the transparent protective layer 120 is 20 microns to 90 microns, for example, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, 70 microns, 80 microns or 90 microns.

[0088] refer to Figure 2 In some embodiments, in the bottom view of the micro-LED package 1000, the first substrate 10 of the micro-LED package 1000 has a flat cut edge P. Therefore, the outline of the micro-LED package 1000 in the top view is similar to a silicon wafer shape with a flat cut edge, that is, a circle with a flat cut edge P.

[0089] refer to Figure 1 and Figure 2 , a bottom view of the micro light emitting diode package 1000 , a plurality of conductive pads 500 are disposed on the lower surface S2 of the first substrate 10 , and the conductive pads 500 include a first conductive pad 510 , a second conductive pad 520 , a third conductive pad 530 and a fourth conductive pad 540 .

[0090] In some embodiments, the lower surface of the first conductive pad 510, the lower surface of the second conductive pad 520, the lower surface of the third conductive pad 530, and the lower surface of the fourth conductive pad 540 may be substantially flush, but the present invention is not limited thereto. In some embodiments, the thickness of the first conductive pad 510, the thickness of the second conductive pad 520, the thickness of the third conductive pad 530, and the thickness of the fourth conductive pad 540 may be substantially the same. In some embodiments, the thickness of the first conductive pad 510, the thickness of the second conductive pad 520, and the thickness of the third conductive pad 530 are greater than the thickness of the fourth conductive pad 540. In some embodiments, the thickness of the first conductive pad 510, the thickness of the second conductive pad 520, and the thickness of the third conductive pad 530 are less than the thickness of the fourth conductive pad 540. In some embodiments, the thickness of the first conductive pad 510, the thickness of the second conductive pad 520, the thickness of the third conductive pad 530, and the thickness of the fourth conductive pad 540 are different.

[0091] In some embodiments, the lower surface of the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 may be in the shape of a polygon. In some embodiments, the lower surface of the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 may be in the shape of a heptagon, a hexagon, a pentagon, a quadrilateral or a triangle, but the present invention is not limited thereto. In some embodiments, the lower surface of the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 may be in the shape of an ellipse or a circle, but the present invention is not limited thereto.

[0092] refer to Figure 3 , Figure 3The figure is a top view of the second substrate 900 of some embodiments of the present invention. The second substrate 900 has an upper surface S3 and a receiving groove T, the receiving groove T has a side wall W, and a plurality of conductive junctions 800 are arranged on the bottom surface B of the receiving groove T, wherein the receiving groove T is similar to a silicon wafer (chip) in shape (having a flat cut edge shape). The conductive junction 800 includes a first conductive junction 810, a second conductive junction 820, a third conductive junction 830, and a fourth conductive junction 840. The first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840 are arranged on the bottom surface B of the receiving groove T. The second substrate 900 has a flat edge protrusion TP extending from the side wall W of the receiving groove T. The flat cut edge P substantially matches the shape of the flat edge protrusion TP.

[0093] refer to Figure 3 , Figure 3 Although the second substrate 900 is shown to have only one receiving groove T, the number of the receiving grooves T is not limited thereto. In some embodiments, the second substrate 900 includes a plurality of receiving grooves T. Therefore, the efficiency of the overall fluid assembly is increased.

[0094] Figure 4 FIG. 9 is a cross-sectional view of a micro-LED package mounted on a second substrate 900 according to some embodiments of the present invention. Figure 4 In some embodiments, the micro-LED package 1000 is disposed in the receiving groove T through fluid assembly, and the flat edge protrusion TP of the second substrate 900 corresponds to the flat cut edge P of the first substrate 10 of the micro-LED package 1000. In some embodiments, the flat edge protrusion TP of the second substrate 900 substantially matches the flat cut edge P of the first substrate 10 in shape. During fluid assembly, when the micro-LED package 1000 is disposed in the receiving groove T of the second substrate 900, only when the flat edge protrusion TP of the second substrate 900 is aligned with the flat cut edge P of the first substrate 10, the micro-LED package 1000 will be disposed in the receiving groove T, and the conductive pad 500 of the micro-LED package 1000 will be ensured to be butted with the conductive junction 800. That is, the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 of the micro LED package 1000 are connected with the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 in the correct direction and with the correct polarity. In some embodiments, a plurality of micro LED packages 1000 are mounted to a plurality of receiving grooves T of the second substrate 900 to form a micro LED display device 600.

[0095] Figure 5A Schematic cross-sectional view of a micro-LED package not mounted on a second substrate in some embodiments of the present invention. Figure 5AIn some embodiments, during fluid assembly, when the flat edge protrusion TP of the second substrate 900 cannot be aligned with the flat cut edge P of the first substrate 10, the micro-LED package 1000 cannot be disposed in the receiving groove T. In some embodiments, if the conductive pad 500 of the micro-LED package 1000 faces the receiving groove T, but if the flat cut edge P of the micro-LED package 1000 is not aligned with the flat edge protrusion TP of the second substrate 900, the micro-LED package 1000 cannot be disposed in the receiving groove T. At this time, the micro-LED package 1000 will be driven by the suspension fluid to leave the receiving groove T, continue to roll on the upper surface S3 of the second substrate 900, and may fall into another receiving groove T (such as Figure 4 shown).

[0096] Figure 5B FIG. 1 is a top view of a micro-LED package of some embodiments of the present invention not mounted on the second substrate. In some embodiments, when the flat edge protrusion TP of the second substrate 900 cannot be aligned with the flat cut edge P of the first substrate 10 during fluid assembly, the micro-LED package 1000 cannot be disposed in the receiving groove T. The micro-LED package 1000 needs to be rotated 180 degrees before it can be disposed in the receiving groove T.

[0097] Figure 6 Schematic diagram of circuit routing of the first substrate 10 of the micro light emitting diode package 1000 according to some embodiments of the present invention. Figure 6 for Figure 2Schematic diagram of circuit routing of the first substrate 10 of the micro-LED package 1000. In some embodiments, the micro-LED chip 100 may be a flip-chip LED chip. The first electrode 100B1 of the blue micro-LED chip 100B is electrically connected to the conductive line 410, and the conductive line 410 is electrically connected to the guide hole 412, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the first conductive pad 510 on the lower surface S2. The first electrode 100G1 of the green micro-LED chip 100G is electrically connected to the conductive line 420, and the conductive line 420 is electrically connected to the guide hole 422, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the second conductive pad 520 on the lower surface S2. The first electrode 100R1 of the red micro-LED chip 100R is electrically connected to the conductive line 430, and the conductive line 430 is electrically connected to the guide hole 432, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the third conductive pad 530 on the lower surface S2. In addition, the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R are electrically connected to the conductive line 440, and the conductive line 440 is electrically connected to the guide hole 442, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the fourth conductive pad 540 on the lower surface S2.

[0098] In some embodiments, the conductive circuit 410, the conductive circuit 420, the conductive circuit 430 and the conductive circuit 440 are flatly disposed on the upper surface S1 of the first substrate 10. The conductive circuit 410, the conductive circuit 420 and the conductive circuit 430 are L-shaped. In some embodiments, the conductive circuit 440 is J-shaped. In some embodiments, the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 are flatly disposed on the lower surface S2 of the first substrate 10. In some embodiments, the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 are square.

[0099] Through the structural design of the above circuit routing, the first conductive pad 510 is electrically connected to the first electrode 100B1 of the blue micro-LED chip 100B, and the second conductive pad 520 is electrically connected to the first electrode 100G1 of the green micro-LED chip 100G. The third conductive pad 530 is electrically connected to the first electrode 100R1 of the red micro-LED chip 100R. The fourth conductive pad 540 is electrically connected to the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R. In some embodiments, the number of conductive pads 500 can be four, five, six, etc., but the present invention is not limited thereto, and the number of conductive pads 500 can be adjusted accordingly according to design requirements.

[0100] In some embodiments, the first electrode 100B1 of the blue micro-LED chip 100B, the first electrode 100G1 of the green micro-LED chip 100G, and the first electrode 100R1 of the red micro-LED chip 100R are electrically connected to the first conductive pad 510, the second conductive pad 520, and the third conductive pad 530, which can be changed as required. For example, the first electrode 100G1 of the green micro-LED chip 100G can be electrically connected to the first conductive pad 510, the first electrode 100B1 of the blue micro-LED chip 100B can be electrically connected to the second conductive pad 520, and the first electrode 100R1 of the red micro-LED chip 100R can be electrically connected to the third conductive pad 530.

[0101] In some embodiments, the first conductive junction 810 , the second conductive junction 820 , the third conductive junction 830 and the fourth conductive junction 840 are connected to the wiring (not shown) inside the second substrate 900 to control the light emission of the micro LED package 1000 .

[0102] Figure 7 FIG. 1 is a bottom view of a micro-LED package according to some embodiments of the present invention. Figure 7 , the outline of the micro-LED package 1000 in a top view may be circular. In some embodiments, the first substrate 10 of the micro-LED package 1000 is circular, and the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 form a concentric circle structure on the first substrate 10. Through the circuit traces (not shown) in the first substrate 10, the first conductive pad 510, the second conductive pad 520 and the third conductive pad 530 are respectively electrically connected to the first electrodes 100F of the corresponding micro-LED chips 100, and the fourth conductive pad 540 is commonly electrically connected to the second electrodes 100S of the plurality of micro-LEDs 100.

[0103] In some embodiments, through the circuit traces (not shown) in the first substrate 10, the first conductive pad 510 is electrically connected to the first electrode 100G1 of the green micro-LED chip 100G, and the second conductive pad 520 is electrically connected to the first electrode 100B1 of the blue micro-LED chip 100B. The third conductive pad 530 is electrically connected to the first electrode 100R1 of the red micro-LED chip 100R. The fourth conductive pad 540 is electrically connected to the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R, that is, the fourth conductive pad 540 is a common electrode.

[0104] In some embodiments, the first electrode 100B1 of the blue micro-LED chip 100B, the first electrode 100G1 of the green micro-LED chip 100G, and the first electrode 100R1 of the red micro-LED chip 100R are electrically connected to the first conductive pad 510, the second conductive pad 520, and the third conductive pad 530, which can be changed as required. For example, the first electrode 100B1 of the blue micro-LED chip 100B can be electrically connected to the first conductive pad 510, the first electrode 100G1 of the green micro-LED chip 100G can be electrically connected to the second conductive pad 520, and the first electrode 100R1 of the red micro-LED chip 100R can be electrically connected to the third conductive pad 530.

[0105] refer to Figure 7 In some embodiments, the fourth conductive pad 540 surrounds the first conductive pad 510, the second conductive pad 520 and the third conductive pad 530 in a concentric circle shape, that is, the fourth conductive pad 540 is in the outermost area, that is, the common electrode is in the outermost area. In some embodiments, the first conductive pad 510 is circular, the second conductive pad 520 is annular, the third conductive pad 530 is annular, and the fourth conductive pad 540 is annular.

[0106] In some embodiments, there are spacings between the first conductive pad 510, the second conductive pad 520, the third conductive pad 530, and the fourth conductive pad 540. There are three spacings between the first conductive pad 510, the second conductive pad 520, the third conductive pad 530, and the fourth conductive pad 540. There is a spacing between the fourth conductive pad 540 and the edge of the first substrate 10.

[0107] refer to Figure 8In some embodiments, the first conductive pad 510, the second conductive pad 520 and the third conductive pad 530 surround the fourth conductive pad 540 in a concentric circle shape, that is, the fourth conductive pad 540 is in the innermost area, that is, the common electrode is in the innermost area. In some embodiments, the fourth conductive pad 540 is circular, the third conductive pad 530 is annular, the second conductive pad 520 is annular, and the first conductive pad 510 is annular. In some embodiments, there are a total of three spacings between the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540. The fourth conductive pad 510 has a spacing from the edge of the first substrate 10.

[0108] Fig. 9 FIG. 9 is a top view of the second substrate 900 according to some embodiments of the present invention. Fig. 9 , the receiving groove T of the second substrate 900 is circular, and the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 are concentric circles and are disposed on the bottom surface B in the receiving groove T. In some embodiments, the fourth conductive junction 840 surrounds the first conductive junction 810, the second conductive junction 820 and the third conductive junction 830, that is, the fourth conductive junction 840 is located in the outermost area.

[0109] refer to Fig. 9 In some embodiments, the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 may be closed concentric circles. In some embodiments, the first conductive junction 810 is circular, the second conductive junction 820 is annular, the third conductive junction 830 is annular, and the fourth conductive junction 840 is annular.

[0110] In some embodiments, there are spacings between the first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840. In some embodiments, there are three spacings between the first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840. The fourth conductive junction 840 is spaced from the edge of the receiving groove T.

[0111] In some embodiments, the outline of the micro-LED package 1000 in a top view may be an ellipse or a circle, but the present invention is not limited thereto. In some embodiments, the outline of the receiving groove T in a top view may be an ellipse, a circle or other shapes, but the present invention is not limited thereto. In some embodiments, the shape of the receiving groove T substantially matches that of the micro-LED package 1000.

[0112] Fig.10 FIG. 9 is a top view of the second substrate 900 according to some embodiments of the present invention. Fig.10In some embodiments, the receiving groove T of the second substrate 900 is circular, and the first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840 are concentric circle structures and are disposed on the bottom surface B in the receiving groove T. The first conductive junction 810, the second conductive junction 820, and the third conductive junction 830 surround the fourth conductive junction 840, that is, the fourth conductive junction 840 is located in the innermost area.

[0113] In some embodiments, there are spacings between the first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840. In some embodiments, there are three spacings between the first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840. The first conductive junction 810 is spaced from the edge of the receiving groove T.

[0114] refer to Fig.10 In some embodiments, the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 may be closed concentric circles. In some embodiments, the fourth conductive junction 840 is circular, the third conductive junction 830 is annular, the second conductive junction 820 is annular, and the first conductive junction 810 is annular.

[0115] Fig.11 FIG. 1 is a top view of the second substrate of some embodiments of the present invention. Fig.11 In some embodiments, the receiving groove T of the second substrate 900 is circular, and the first conductive joint 810, the second conductive joint 820, the third conductive joint 830 and the fourth conductive joint 840 are arranged on the bottom surface B in the receiving groove T. The first conductive joint 810, the second conductive joint 820, the third conductive joint 830 and the fourth conductive joint 840 can be a non-closed concentric arc structure. In some embodiments, the first conductive joint 810, the second conductive joint 820, the third conductive joint 830 can be an arc shape and the fourth conductive joint 840 is circular. The first conductive joint 810, the second conductive joint 820, the third conductive joint 830 and the fourth conductive joint 840 have a spacing between each other.

[0116] Fig.12 Schematic diagram of circuit routing of the first substrate 10 of the micro light emitting diode package 1000 according to some embodiments of the present invention. Fig.12 for Figure 7Schematic diagram of circuit routing of the first substrate 10 of the micro-LED package 1000. In some embodiments, the outline of the micro-LED package 1000 in a top view may be circular. In some embodiments, the first substrate 10 of the micro-LED package 1000 is circular. The first electrode 100G1 of the green micro-LED chip 100G is electrically connected to the conductive line 410, and the conductive line 410 is electrically connected to the guide hole 412, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the first conductive pad 510 on the lower surface S2. The first electrode 100B1 of the blue micro-LED chip 100B is electrically connected to the conductive line 420, and the conductive line 420 is electrically connected to the guide hole 422, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the second conductive pad 520 on the lower surface S2. The first electrode 100R1 of the red micro-LED chip 100R is electrically connected to the conductive line 430, the conductive line 430 is electrically connected to the guide hole 432, and the guide hole 432 is connected to the third conductive pad 530 below it. In addition, the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R are electrically connected to the conductive line 440, the conductive line 440 is electrically connected to the guide hole 442, and the guide hole 442 passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the fourth conductive pad 540 on the lower surface S2.

[0117] In some embodiments, the conductive circuits 410, 420, 430 and 440 are disposed flat on the upper surface S1 of the first substrate 10. In some embodiments, the conductive circuit 430 is elongated. In some embodiments, the conductive circuit 440 is T-shaped.

[0118] Through the structural design of the above circuit routing, the first conductive pad 510 is electrically connected to the first electrode 100G1 of the green micro-LED chip 100G, and the second conductive pad 520 is electrically connected to the first electrode 100B1 of the blue micro-LED chip 100B. The third conductive pad 530 is electrically connected to the first electrode 100R1 of the red micro-LED chip 100R. The fourth conductive pad 540 is electrically connected to the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R.

[0119] Fig.13 FIG. 1 is a cross-sectional view of a micro-LED package mounted on a second substrate according to some embodiments of the present invention. Fig.13Through fluid assembly, the micro LED package 1000 is disposed in the receiving groove T of the second substrate 900. Because the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 are designed as concentric circles, and the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 are designed as concentric circles, during fluid assembly, as long as the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive junction 840 are directed downward, the micro LED package 1000 can ensure that the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 of the micro LED package 1000 are connected to the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 in the correct direction and with the correct polarity at any angle within the 360-degree range in the horizontal direction. In some embodiments, the outline of the micro LED package 1000 in a top view may be circular. In some embodiments, the spacing between the first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840 corresponds to the spacing between the first conductive pad 510, the second conductive pad 520, the third conductive pad 530, and the fourth conductive pad 540.

[0120] refer to Fig.13 In some embodiments, the first conductive junction 810 is electrically connected to the first electrode 100G1 of the green micro-LED chip 100G through the first conductive pad 510. The second conductive junction 820 is electrically connected to the first electrode 100B1 of the blue micro-LED chip 100B through the second conductive pad 520. The third conductive junction 830 is electrically connected to the first electrode 100R1 of the red micro-LED chip 100R through the third conductive pad 530. The fourth conductive junction 840 is electrically connected to the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R through the fourth conductive pad 540. In some embodiments, a plurality of micro-LED packages are mounted to a plurality of accommodating grooves T of the second substrate 900 to form a micro-LED display device 600.

[0121] Fig.14 FIG. 1 is a bottom view of a micro-LED package according to some embodiments of the present invention. Fig.14In some embodiments, the outline of the micro-LED package 1000 in a top view may be a rectangle. In some embodiments, the first substrate 10 of the rectangular micro-LED package 1000 is a rectangle, and the first conductive pad 510, the second conductive pad 520, the third conductive pad 530, and the fourth conductive pad 540 form a concentric square structure on the first substrate 10. In some embodiments, the first conductive pad 510, the second conductive pad 520, the third conductive pad 530, and the fourth conductive pad 540 have a spacing between each other. There are three spacings between the first conductive pad 510, the second conductive pad 520, the third conductive pad 530, and the fourth conductive pad 540. The fourth conductive pad 540 has a spacing from the edge of the first substrate 10.

[0122] refer to Fig.14 In some embodiments, the fourth conductive pad 540 surrounds the first conductive pad 510, the second conductive pad 520 and the third conductive pad 530 in a concentric square shape, that is, the fourth conductive pad 540 is in the outermost area, that is, the common electrode (the fourth conductive pad 540) is in the outermost area.

[0123] Fig.15 FIG. 1 is a bottom view of a micro-LED package according to some embodiments of the present invention. Fig.15 In some embodiments, the outline of the micro-LED package 1000 in a top view may be a rectangle. In some embodiments, the first substrate 10 of the micro-LED package 1000 is a rectangle, and the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 form a concentric square structure on the first substrate 10. Fig.15 In some embodiments, the first conductive pad 510, the second conductive pad 520 and the third conductive pad 530 surround the fourth conductive pad 540 in a concentric square shape, that is, the fourth conductive pad 540 is in the innermost area, that is, the common electrode (the fourth conductive pad 540) is in the innermost area. The first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 have spacings between each other. There are three spacings between the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540. The first conductive pad 510 has a spacing from the edge of the first substrate 10.

[0124] Fig.16 FIG. 1 is a top view of the second substrate of some embodiments of the present invention. Fig.16, the receiving groove T of the second substrate 900 is rectangular, and the first conductive joint 810, the second conductive joint 820, the third conductive joint 830 and the fourth conductive joint 840 are concentric square structures and are arranged on the bottom surface B in the receiving groove T. In some embodiments, the fourth conductive joint 840 surrounds the first conductive joint 810, the second conductive joint 820 and the third conductive joint 830 in a concentric square shape, that is, the fourth conductive joint 840 is located in the outermost area. In some embodiments, the first conductive joint 810, the second conductive joint 820, the third conductive joint 830 and the fourth conductive joint 840 have a spacing between each other. There are a total of three spacings between the first conductive joint 810, the second conductive joint 820, the third conductive joint 830 and the fourth conductive joint 840. The fourth conductive joint 840 has a spacing with the edge of the receiving groove T.

[0125] Fig.17 FIG. 1 is a top view of the second substrate of some embodiments of the present invention. Fig.17 In some embodiments, the first conductive junction 810, the second conductive junction 820, and the third conductive junction 830 surround the fourth conductive junction 840 in a concentric square shape, that is, the fourth conductive junction 840 is located in the innermost area. The first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840 have a spacing between each other. There are a total of three spacings between the first conductive junction 810, the second conductive junction 820, the third conductive junction 830, and the fourth conductive junction 840. The first conductive junction 810 has a spacing from the edge of the receiving groove T.

[0126] refer to Fig.16 or Fig.17 In some embodiments, the first conductive junction 810 , the second conductive junction 820 , the third conductive junction 830 , and the fourth conductive junction 840 may be closed concentric square structures.

[0127] refer to Fig.18 In some embodiments, the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 may be a non-closed concentric square structure. In some embodiments, the first conductive junction 810, the second conductive junction 820 and the third conductive junction 830 are L-shaped.

[0128] Fig.19 Schematic diagram of circuit routing of the first substrate 10 of the micro light emitting diode package 1000 according to some embodiments of the present invention. Fig.19 for Fig.14Schematic diagram of circuit routing of the first substrate 10 of the micro-LED package 1000. The first electrode 100G1 of the green micro-LED chip 100G is electrically connected to the conductive line 410, and the conductive line 410 is electrically connected to the guide hole 412. The guide hole 412 passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the first conductive pad 510 on the lower surface S2. The first electrode 100B1 of the blue micro-LED chip 100B is electrically connected to the conductive line 420, and the conductive line 420 is electrically connected to the guide hole 422. The guide hole 422 passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the second conductive pad 520 on the lower surface S2. The first electrode 100R1 of the red micro-LED chip 100R is electrically connected to the conductive line 430, and the conductive line 430 is electrically connected to the guide hole 432, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the third conductive pad 530 on the lower surface S2. In addition, the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R are electrically connected to the conductive line 440, and the conductive line 440 is electrically connected to the guide hole 442, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the fourth conductive pad 540 on the lower surface S2.

[0129] In some embodiments, the conductive circuits 410, 420, 430 and 440 are disposed flat on the upper surface S1 of the first substrate 10. The conductive circuits 420 and 430 are elongated. In some embodiments, the conductive circuit 440 is T-shaped.

[0130] Through the structural design of the above circuit routing, the first conductive pad 510 is electrically connected to the first electrode 100G1 of the green micro-LED chip 100G, and the second conductive pad 520 is electrically connected to the first electrode 100B1 of the blue micro-LED chip 100B. The third conductive pad 530 is electrically connected to the first electrode 100R1 of the red micro-LED chip 100R. The fourth conductive pad 540 is electrically connected to the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R.

[0131] Fig. 20 FIG. 1 is a cross-sectional view of a micro-LED package mounted on a second substrate according to some embodiments of the present invention. Fig. 20In some embodiments, the micro light emitting diode package 1000 is disposed in the receiving groove T of the second substrate 900 through fluid assembly. Because the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 are designed as concentric squares, and the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 are designed as concentric squares, when the micro LED package 1000 is assembled in the fluid, as long as the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 are oriented downward, the micro LED package 1000 can be rotated 90 degrees in the horizontal direction each time to ensure that the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 of the micro LED package 1000 are connected to the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 in the correct direction and with the correct polarity.

[0132] Fig. 20 FIG. 1 is a cross-sectional view of a micro-LED package mounted on a second substrate according to some embodiments of the present invention. Fig. 20 In some embodiments, the first conductive junction 810 is electrically connected to the first electrode 100G1 of the green micro-LED chip 100G through the first conductive pad 510. The second conductive junction 820 is electrically connected to the first electrode 100B1 of the blue micro-LED chip 100B through the second conductive pad 520. The third conductive junction 830 is electrically connected to the first electrode 100R1 of the red micro-LED chip 100R through the third conductive pad 530. The fourth conductive junction 840 is electrically connected to the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R through the fourth conductive pad 540. In some embodiments, a plurality of micro-LED packages are mounted to a plurality of accommodating grooves T of the second substrate 900 to form a micro-LED display device 600.

[0133] Fig.211 is a bottom view of a micro-LED package of some embodiments of the present invention. In some embodiments, the outline of the micro-LED package 1000 in a top view may be a rectangle. In some embodiments, the first substrate 10 is a rectangle, a first conductive pad 510 is disposed at the center point of the first substrate 10, a second conductive pad 520 corresponds to the relative middle position of any four sides of the lower surface S2 of the first substrate 10, and a third conductive pad 530 is disposed at the relative vertex position of the rectangular diagonal line of the lower surface S2 of the first substrate 10. The fourth conductive pad 540 surrounds the first conductive pad 510, the second conductive pad 520 and the third conductive pad 530. In some embodiments, the fourth conductive pad 540 is a common electrode.

[0134] Fig. 22 FIG. 9 is a top view of the second substrate 900 according to some embodiments of the present invention. Fig. 22 In some embodiments, the receiving groove T of the second substrate 900 is rectangular, the first conductive junction 810 is disposed at the center point of the bottom surface B of the second substrate 900, the four second conductive junctions 820 are disposed at the relative middle positions of the four sides on the bottom surface B of the second substrate 900, and the four second conductive junctions 830 are disposed at the relative vertices of the diagonal lines of the rectangle on the bottom surface B of the second substrate 900. The fourth conductive junction 840 surrounds the first conductive junction 810, the second conductive junction 820, and the third conductive junction 830.

[0135] Fig.23 Schematic diagram of circuit routing of the first substrate 10 of the micro light emitting diode package 1000 according to some embodiments of the present invention. Fig.23 for Fig.21Schematic diagram of circuit routing of the first substrate 10 of the micro-LED package 1000. The first electrode 100G1 of the green micro-LED chip 100G is electrically connected to the conductive line 410, and the conductive line 410 is electrically connected to the guide hole 412. The guide hole 412 passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the first conductive pad 510 on the lower surface S2. The first electrode 100B1 of the blue micro-LED chip 100B is electrically connected to the conductive line 420, and the conductive line 420 is electrically connected to the guide hole 422. The guide hole 422 passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the second conductive pad 520 on the lower surface S2. The first electrode 100R1 of the red micro-LED chip 100R is electrically connected to the conductive line 430, and the conductive line 430 is electrically connected to the guide hole 432, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the third conductive pad 530 on the lower surface S2. In addition, the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R are electrically connected to the conductive line 440, and the conductive line 440 is electrically connected to the guide hole 442, which passes through the first substrate 10 from the upper surface S1 of the first substrate 10 to the lower surface S2 and is electrically connected to the fourth conductive pad 540 on the lower surface S2.

[0136] In some embodiments, the conductive circuit 420 may be in a strip shape. In some embodiments, the conductive circuit 430 may be in an L shape. In some embodiments, the conductive circuit 440 may be in a T shape.

[0137] Through the structural design of the above circuit routing, the first conductive pad 510 is electrically connected to the first electrode 100G1 of the green micro-LED chip 100G, and the second conductive pad 520 is electrically connected to the first electrode 100B1 of the blue micro-LED chip 100B. The third conductive pad 530 is electrically connected to the first electrode 100R1 of the red micro-LED chip 100R. The fourth conductive pad 540 is electrically connected to the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R.

[0138] Fig.24 For along Fig. 22 The cross-sectional view of the micro-LED package 1000 mounted on the second substrate 900 is captured along the AA' line. Fig.24In some embodiments, the micro light emitting diode package 1000 having a nine-grid conductive pad design is disposed in the receiving groove T of the second substrate 900 through fluid assembly. Because the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 are symmetrically designed in a nine-square grid, and the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 are symmetrically designed in a nine-square grid, when the micro-LED package 1000 is assembled in a fluidic manner, as long as the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 are oriented downward, each rotation of the micro-LED package 1000 by 90 degrees in the horizontal direction can ensure that the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 of the micro-LED package 1000 are connected to the first conductive junction 810, the second conductive junction 820, the third conductive junction 830 and the fourth conductive junction 840 in the correct direction and with the correct polarity.

[0139] refer to Fig.24 In some embodiments, the micro-LED package 1000 with the nine-grid conductive pad design is disposed in the receiving groove T of the second substrate 900, and the first conductive junction 810 is electrically connected to the first electrode 100G1 of the green micro-LED chip 100G through the first conductive pad 510. The second conductive junction 820 is electrically connected to the first electrode 100B1 of the blue micro-LED chip 100B through the second conductive pad 520. The third conductive junction 830 is electrically connected to the first electrode 100R1 of the red micro-LED chip 100R through the third conductive pad 530. The fourth conductive junction 840 is electrically connected to the second electrode 100B2 of the blue micro-LED chip 100B, the second electrode 100G2 of the green micro-LED chip 100G, and the second electrode 100R2 of the red micro-LED chip 100R through the fourth conductive pad 540. In some embodiments, a plurality of micro-LED packages 1000 are mounted to a plurality of receiving grooves T of the second substrate 900 to form a micro-LED display device 600.

[0140] Fig.25 Schematic cross-sectional view of a micro-LED package according to some embodiments of the present invention. Fig.25In some embodiments, the micro-LED package 1000 includes a fluid guide column 160. The fluid guide column 160 is disposed on the transparent protective layer 120. The fluid guide column 160 can increase the micro-LED package to flip when the fluid is suspended until it falls into the receiving groove T. In some embodiments, after the micro-LED package 1000 is placed in the receiving groove T, the fluid guide column 160 can be removed. In some embodiments, the micro-LED package 1000 does not include the fluid guide column 160.

[0141] Fig.26 Schematic cross-sectional view of a micro-LED package according to some embodiments of the present invention. Fig.26 In some embodiments, the micro-LED package 1000 further includes an adhesive layer 140, which is disposed between the fluid guide column 160 and the transparent protective layer 120. The adhesive layer 140 can make the fluid guide column 160 easily attached to the transparent protective layer 120. The adhesive layer 140 can be silicon dioxide, but the present invention is not limited thereto. In some embodiments, the adhesive layer 140 can be wet-etched to remove the fluid guide column 160. In some embodiments, after the micro-LED package 1000 is disposed in the receiving groove T, the fluid guide column 160 can be removed. In some embodiments, the micro-LED package 1000 does not include the fluid guide column 160.

[0142] The present invention provides a method for manufacturing a micro-LED display device 600. The method includes the following operations: (A) providing a second substrate 900, wherein the second substrate 900 has a plurality of receiving grooves T, and a first conductive junction 810, a second conductive junction 820, a third conductive junction 830, and a fourth conductive junction 840 are disposed on the bottom surface B of the receiving grooves T. (B) allowing a suspension fluid containing a micro-LED package 1000 to flow over the upper surface S3 of the second substrate 900. Since the micro-LED package 1000 has a fluid guide column 160, when the fluid guide column 160 contacts the upper surface S3 of the second substrate 900, the suspension fluid will flip on the second substrate 900 until it falls into the receiving groove T. (C) placing the micro-LED package 1000 in the receiving groove T.

[0143] Fig. 27 The micro-LED packages of some embodiments of the present invention are shown in the fluid assembly process. Fig. 27When the micro-LED package 1000 falls into the receiving groove T, the first conductive pad 510, the second conductive pad 520, the third conductive pad 530 and the fourth conductive pad 540 of the micro-LED package 1000 are not facing the receiving groove T, so the micro-LED package 1000 cannot be set in the receiving groove T. The micro-LED package 1000 will be driven by the suspension fluid to leave the receiving groove T and continue to roll on the second substrate 900 until it falls into another receiving groove T.

[0144] Fig.28 The micro-LED package of some embodiments of the present invention is in the process of fluid assembly. During the fluid assembly process, when the fluid guide column 160 of the micro-LED package 1000 contacts the upper surface S3 of the second substrate 900, the micro-LED package 1000 is turned over on the second substrate 900 due to the flow of the fluid guide column 160 and the suspension fluid until it falls into the receiving groove T.

[0145] The micro-LED package 1000 of the present invention is installed in the receiving groove T of the second substrate 900 by a fluid assembly method in a fluid, thereby forming a micro-LED display device 600. In some embodiments, during the fluid assembly process, because the transparent protective layer 120 covers the micro-LED package 1000, the micro-LED chip 100 does not contact the fluid, so the transparent protective layer 120 can protect the micro-LED chip 100. In some embodiments, during the fluid assembly process, the micro-LED chip 100 is prevented from being damaged by collision when the fluid flows. After installation, the fluid guide column 160 is removed from the transparent protective layer 120.

[0146] Fig.29The micro-LED package of Comparative Example 1 of the present invention is in fluid assembly. Comparative Example 1 is a tenon structure design, and Comparative Example 1 is a micro-LED package 1000R, including a first substrate 10, a plurality of micro-LED chips 100, a packaging layer and a plurality of conductive pads. The upper surface and the lower surface of the first substrate 10, the edge of the lower surface has a notch N. The plurality of micro-LED chips 100 are disposed on the upper surface of the first substrate 10. The plurality of conductive pads are disposed on the lower surface of the first substrate 10, and are electrically connected to the positive and negative electrodes of the micro-LED chips 100 respectively. The second substrate 900 has a receiving groove T and a protrusion TP. The conductive interface is disposed on the bottom surface of the receiving groove T. When the protrusion TP of the second substrate 900 is located in the notch N of the first substrate of the micro-LED package 1000R, the micro-LED package 1000R is correctly disposed in the receiving groove T. However, due to the square design of the protrusion TP, during fluid assembly, there is only a small angle range in the horizontal direction to align the protrusion TP with the notch N of the first substrate, so it often happens that the protrusion TP of the second substrate 900 is not aligned with the notch N of the first substrate 110, making it difficult for the protrusion TP to enter the notch N. Therefore, the micro-LED package 1000R cannot be set in the receiving groove T, which reduces the manufacturing rate and manufacturing yield.

[0147] Please refer to Figure 4 In some embodiments of the present invention, the design of the silicon-like wafer flat cutting edge P of the micro-LED package 1000 has a larger horizontal angle range because the setting of the single flat cutting edge P can easily align the flat edge protrusion TP of the second substrate 900, thereby increasing the manufacturing rate and manufacturing yield. Please refer to Fig.13 , Fig. 20 , Fig.24 The concentric circle conductive pad 500, the concentric square conductive pad 500 and the nine-grid symmetrical conductive pad 500 do not require additional latch structure design, which can improve the efficiency of fluid assembly.

[0148] In some embodiments, the light emitting surface of the blue light micro-LED chip 100B, the light emitting surface of the green light micro-LED chip 100G, and the light emitting surface of the red light micro-LED chip 100R have textures. Fig.30 , Fig.30The upper surface (light-emitting surface) of the blue light micro-LED chip 100B and the green light micro-LED chip 100G has periodically arranged concave-convex textures. In some embodiments, the micro-LED chip 200 is not equipped with a sapphire substrate, but is equipped with periodically arranged concave-convex textures after laser peeling of the sapphire substrate to enhance light extraction and adjust the pointing angle of the micro-LED chip 200. In some embodiments, the light-emitting surface of the red light micro-LED chip 100R has uneven textures.

[0149] In some embodiments, the micro LED package 1000 may include a control element, which is disposed on the first substrate 10, wherein the control element includes a micro driving integrated circuit device, a micro control integrated circuit device, or a combination thereof. The control element electrically connects the blue micro LED chip 100B, the green micro LED chip 100G, and the red micro LED chip 100R to control the light emission of the blue micro LED chip 100B, the green micro LED chip 100G, and the red micro LED chip 100R.

[0150] In some embodiments, the outline of the micro-LED package 1000 in a top view may be a rectangle. In some embodiments, the outline of the micro-LED package 1000 in a top view may be a polygon, such as a heptagon, a hexagon, a pentagon, a quadrilateral, or a triangle, but the present invention is not limited thereto. In some embodiments, the outline of the receiving groove T in a top view may be a polygon. In some embodiments, the outline of the receiving groove T in a top view may be a heptagon, a hexagon, a pentagon, a quadrilateral, or a triangle, but the present invention is not limited thereto. In some embodiments, the shape of the receiving groove T substantially matches that of the micro-LED package 1000.

[0151] When manufacturing a display, the above-mentioned fluid assembly method can be used to transfer a plurality of micro-LED packages 1000 including micro-LED chips 100 of three different colors into the receiving groove T of the second substrate 900 at one time. Since the micro-LED package 1000 is a pixel unit, only one transfer is required using the fluid assembly method of the present invention. Therefore, the structural design of the micro-LED package 1000 of the present invention can reduce manufacturing costs and greatly save manufacturing time. The present invention can be used to produce micro-LED displays with high pixel density (pixels per inch, PPI).

[0152] The flat cut edge P of the micro-LED package 1000 of the present invention, and the concentric circles, concentric squares and nine-square grid designs of the conductive pad 500 ensure that the conductive pad 500 of the micro-LED package 1000 is connected to the conductive interface 800 in the correct direction and polarity, thereby improving the yield rate of manufacturing the micro-LED display. The method of manufacturing the micro-LED display of the present invention adopts a fluid assembly method, which can realize the mass transfer of the micro-LED package 1000 to the second substrate 900, saving manufacturing time and significantly reducing manufacturing costs.

[0153] As long as the components between the embodiments of the present invention do not violate the spirit of the invention or conflict with each other, they can be mixed and matched for use at will. In addition, the scope of protection of the present invention is not limited to the manufacturing process, machine, manufacture, material composition, device, method and steps in the specific embodiment described in the specification. Any ordinary technician in the field can understand the current or future developed manufacturing process, machine, manufacture, material composition, device, method and steps from the disclosure of the present invention. As long as substantially the same function can be implemented in the embodiments described herein or substantially the same result can be obtained, they can be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned manufacturing process, machine, manufacture, material composition, device, method and steps. Any embodiment or claim of the present invention is not required to achieve all the purposes, advantages and / or features disclosed in the present invention.

Claims

1. A micro light emitting diode package, comprising: A first substrate having an upper surface and a lower surface opposite to each other; A plurality of micro light emitting diode chips are disposed on the upper surface of the first substrate, wherein the micro light emitting diode chips have a first electrode and a second electrode electrically opposite to the first electrode; A transparent protective layer covering the micro light emitting diode chips; A plurality of conductive pads are disposed on the lower surface of the first substrate; and The conductive pads include a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad. The first conductive pad, the second conductive pad and the third conductive pad are respectively electrically connected to the first electrodes of the corresponding micro-light emitting diode chips, and the fourth conductive pad is commonly electrically connected to the second electrodes of the micro-light emitting diodes. 2 . The micro light emitting diode package as claimed in claim 1 , wherein the first substrate is in a silicon wafer shape, and the first substrate has a flat cut edge. 3 . The micro light emitting diode package as claimed in claim 1 , wherein the first substrate is circular, and the first conducting pad, the second conducting pad, the third conducting pad and the fourth conducting pad form a concentric circle structure. 4 . The micro light emitting diode package as claimed in claim 3 , wherein the fourth conducting pad surrounds the first conducting pad, the second conducting pad and the third conducting pad. 5 . The micro light emitting diode package as claimed in claim 3 , wherein the first conducting pad, the second conducting pad and the third conducting pad surround the fourth conducting pad. 6 . The micro light emitting diode package as claimed in claim 1 , wherein the first substrate is rectangular, and the first conducting pad, the second conducting pad, the third conducting pad and the fourth conducting pad form a concentric square structure. 7 . The micro light emitting diode package as claimed in claim 6 , wherein the fourth conducting pad surrounds the first conducting pad, the second conducting pad and the third conducting pad. 8 . The micro light emitting diode package as claimed in claim 6 , wherein the first conducting pad, the second conducting pad and the third conducting pad surround the fourth conducting pad.

9. The micro light emitting diode package as claimed in claim 1, wherein the first substrate is rectangular, the first conductive pad is disposed at the center point of the first substrate, the second conductive pad corresponds to the relative middle position of any four sides of the lower surface of the first substrate, and the third conductive pad is disposed at the relative vertex position of the rectangular diagonal line of the lower surface of the first substrate. 10 . The micro light emitting diode package as claimed in claim 9 , wherein the fourth conducting pad surrounds the first conducting pad, the second conducting pad and the third conducting pad.

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