Automatic assembling device for semiconductor chilling plate

Abstract

The invention belongs to the technical field of semiconductor chilling plate assembling, and particularly relates to an automatic assembling device for semiconductor chilling plates. A suction cup assembly is used for sucking the semiconductor chilling plates supplied by a chilling plate supply assembly; the positioning assembly moves the semiconductor chilling plate sucked by the suction cup assembly to the smearing assembly; the smearing assembly comprises an upper part and a lower part, each part comprises a driving mechanism and a first pressing plate connected with the driving mechanism, a plurality of through holes are evenly formed in the first pressing plate, a flow guide block is arranged at the top of the first pressing plate, a plurality of branch flow guide pipelines are distributed at the bottom of the flow guide block and communicate with the first pressing plate, and a main flow guide pipeline is arranged at the top of the flow guide block. And the main flow guide pipeline is communicated with a heat-conducting silicone grease packaging cylinder. According to the device, the actions of automatic smearing and uniform smearing of the roller scraper are added, and the perforated pressing plate is added, so that the action consistency in production is ensured. And the problems that the coating thickness of the heat-conducting silicone grease varies from person to person and is not uniform are solved. And the yield of products is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor refrigeration chip assembly, and in particular relates to an automatic assembly device for semiconductor refrigeration chips. Background Art

[0002] Semiconductor refrigerators, also known as thermoelectric refrigerators or Peltier, are heat pumps that use the thermoelectric effect of semiconductor materials to achieve cooling purposes. The working principle of semiconductor refrigerators is based on the Peltier Effect. When direct current passes through a couple made of two different semiconductor materials (usually N-type and P-type semiconductors) in series, one end of the couple absorbs heat (called the cold end) and the other end releases heat (called the hot end), thereby achieving a cooling effect.

[0003] Fans and heat sinks play a vital role in semiconductor refrigeration systems, mainly to effectively dissipate heat from the hot end of the refrigeration plate. Usually, the temperature difference between the hot and cold ends of a semiconductor refrigeration plate can reach 40 to 65 degrees. If the hot end temperature is lowered by active heat dissipation, the cold end temperature will also drop accordingly, thus reaching a lower temperature.

[0004] When assembling a system involving refrigeration fins, heat sinks and cooling blocks, please note the following: 1. The refrigeration fins should be in good contact with the heat sinks and cooling blocks, and a thin layer of thermal grease should be applied to the contact surfaces. 2. When fixing the refrigeration fins, the refrigeration fins should be evenly stressed, but not excessively, to prevent the fins from being crushed.

[0005] The existing designed refrigeration plate assembly process has the following problems:

[0006] 1. In the process of batch refrigeration chip assembly, the thickness of thermal grease is inconsistent and the uniformity is poor: the existing refrigeration chip assembly is mostly manual application of thermal grease, which will cause inconsistent and uneven application thickness during batch production. When the refrigeration chip works for a long time, it will cause uneven surface temperature of the refrigerated parts, affecting the long-term service life.

[0007] 2. Uneven force on the cooling plate during tightening, resulting in easy breakage: When tightening parts, the uneven force on the screws at different positions will also cause uneven force on the cooling plate. If too much force is applied to one corner, it will cause damage at that position, and the life will also be affected.

[0008] 3. The process from loading materials to producing finished products cannot be automated.

[0009] 4. During the assembly process, the cooling plate is prone to deflection and cannot be accurately positioned.

[0010] 5. During the application of thermal grease, it is easy to stick and difficult to clean, causing environmental pollution on the workbench. Summary of the invention

[0011] In order to solve the above technical problem, namely: the problem of inconsistent thickness and poor uniformity of thermal grease applied during the assembly of batch semiconductor refrigeration chips: the existing semiconductor refrigeration chip assembly is mostly manually applied with thermal grease, which will cause inconsistent and uneven application thickness during batch production. When the semiconductor refrigeration chip works for a long time, it will cause uneven surface temperature of the refrigerated parts, affecting the long-term service life. The present invention provides the following technical solutions:

[0012] An automatic assembly device for semiconductor cooling sheets comprises a base, and further comprises a cooling sheet supply component, a suction cup component, a positioning component, and a coating component arranged on the base according to an assembly line.

[0013] The suction cup assembly is used to absorb the semiconductor cooling sheet supplied by the cooling sheet supply assembly;

[0014] The positioning component moves the semiconductor cooling sheet sucked by the suction cup component to the coating component;

[0015] The coating component includes two parts, an upper part and an lower part, each part includes a driving mechanism and a pressure plate one connected to the driving mechanism, a plurality of through holes are evenly opened on the pressure plate one, a guide block is arranged on the top of the pressure plate one, a plurality of branch guide pipes are arranged on the bottom of the guide block, the branch guide pipes are connected to the pressure plate one, a main guide pipe is arranged on the top of the guide block, the main guide pipe is connected to a thermal grease packaging cylinder, and the thermal grease packaging cylinder contains thermal grease; the thermal grease packaging cylinder is connected to the driving mechanism; when coating, the semiconductor refrigeration sheet is located between the upper and lower pressure plates one.

[0016] Furthermore, it also includes a spreading component arranged downstream of the coating component, which is used to spread the thermal grease on the semiconductor refrigeration plate; the spreading component includes an upper and lower part, each part includes a driving mechanism, and a scraper and a roller connected to the driving mechanism, the scraper and the bottom of the roller are located at the same height, and when spreading, the semiconductor refrigeration plate is located between the upper and lower rollers.

[0017] Furthermore, it also includes an installation area component, a parts supply component, and a parts transport clamping component arranged downstream of the smoothing component. The installation area component includes a lifting mechanism, and a bearing structure arranged on the top of the lifting mechanism. The bearing structure is stacked with a radiator, a semiconductor refrigeration plate with evenly spread thermal grease transported by the positioning component, and a refrigeration part grabbed from the parts supply component by the parts transport clamping component.

[0018] Furthermore, it also includes an auxiliary pressure component arranged downstream of the smoothing component, the auxiliary pressure component includes a lifting mechanism connected to the base plate, the lifting mechanism of the auxiliary pressure component is connected to the linear motion reciprocating mechanism of the auxiliary pressure component arranged on the base plate, and a second pressure plate is connected to the top of the lifting mechanism. When working, driven by the linear motion reciprocating mechanism, the second pressure plate moves to the top of the installation area component, and pressure is applied to the parts under the action of the lifting mechanism.

[0019] Furthermore, a suction cup assembly is arranged above the refrigeration plate supply assembly, and is used to suck the semiconductor refrigeration plate at the top of the refrigeration plate stack on the refrigeration plate supply assembly. The suction cup assembly includes a screw motor 2 fixed to a base through a mounting bracket 1, a linear guide rail 1 connected between the screw motor 2 and the bottom of the mounting bracket 1, a support block 1 is passed through the screw of the screw motor 2, the support block 1 is slidably connected to the linear guide rail 1, a lifting cylinder 1 is connected to the top of the support block 1, a crossbeam is connected to the top of the lifting cylinder 1, a suction cup seat is connected to the front end of the crossbeam, and a plurality of vacuum suction cups are arranged on the bottom of the suction cup seat.

[0020] Furthermore, a detection component is arranged on the bottom front side of the suction cup seat, and the detection component includes a probe, a clamping block, a spring, and an optical coupler. The clamping block is arranged on the top front side of the suction cup seat, a spring is arranged on the top of the probe, and the top of the probe is clamped in the cavity of the clamping block, and the optical coupler is arranged on the top of the clamping block.

[0021] Furthermore, the positioning assembly is located downstream of the cooling plate supply assembly, and is used to move the semiconductor cooling plate along the entire assembly line. The positioning assembly includes a second support block arranged on the base, a second lifting cylinder is arranged on the second support block, a positioning tray is connected to the top of the second lifting cylinder, and two limiting columns are arranged around the positioning tray;

[0022] Refrigeration plate clamping assemblies are symmetrically arranged on both sides of support block two, and the refrigeration plate clamping assembly includes a screw motor three arranged on the base, a linear guide rail two is arranged under the screw of the screw motor three, a support block three is slidably connected to the linear guide rail two, and a clamping cylinder is arranged on the top of the support block three.

[0023] Furthermore, the part transport clamping assembly is arranged on one side of the part supply assembly, and is used to pick up the topmost part of the part stack. The part transport clamping assembly includes a cross-arranged screw motor five in the X-axis direction and a screw motor six in the Y-axis direction. One end of the screw of the screw motor five is close to the installation area assembly, and one end of the screw of the screw motor six is ​​close to the part supply assembly, and the screw parts of the screw motors in the two directions are passed through the clamping support block.

[0024] A linear guide rail 4 is arranged at the bottom of the screw motor 5; a linear guide rail 5 is arranged at the bottom of the screw motor 6; the linear guide rail 5 is slidably connected to the top of the linear guide rail 4; the bottom of the clamping support block is arranged on the linear guide rail 5, the top of the clamping support block is connected to a lifting cylinder 7, and the lifting cylinder 7 is connected to a pneumatic clamp.

[0025] Furthermore, the driving mechanism of the smoothing assembly is a lifting cylinder three, the top of the upper thermal grease packaging tube is connected to the lifting cylinder three, the top of the upper lifting cylinder three is connected to the top of the support frame one, the bottom end of the support frame one is arranged on the base, and the support frame one is L-shaped; the bottom of the lower lifting cylinder three is connected to the support frame two, and the bottom end of the support frame two is arranged on the base.

[0026] Furthermore, the upper part of the smoothing assembly includes a support frame three, the bottom end of the support frame three is arranged on the base, the support frame three is L-shaped, and a lifting cylinder four is arranged on the top of the support frame three, and a scraper and a roller are connected to the lifting cylinder four. The mounting ends of the scraper and the roller of the lower part of the smoothing assembly are arranged on the lifting cylinder five, and the bottom of the lifting cylinder five is arranged on the base.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. The present invention adds the action of automatic smearing, roller scraper smearing, and a perforated pressure plate, so as to ensure the consistency of the action in production. It avoids the problem of different thickness and unevenness of thermal grease smearing from person to person, and improves the yield rate of products.

[0029] 2. The combination of the screw motor and the cylinder used in the present invention can realize automation from material loading to the locking of the finished product, ensuring the consistency of the thickness of the thermal grease, the force on the cooling plate and the amount of coating in batch production. It improves the production success rate, saves labor costs, and increases the service life of the product. It ensures the yield rate between batch products. During the coating process, it is easy to stick and difficult to clean, causing the problem of environmental pollution on the workbench. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of the automatic assembly device of the present invention;

[0031] Figure 2 For the present invention Figure 1 A top view of

[0032] Figure 3 For the present invention Figure 1 A schematic diagram of the structure of the cooling plate supply assembly;

[0033] Figure 4 For the present invention Figure 1 A schematic diagram of the structure of the suction cup assembly;

[0034] Figure 5 for Figure 4 The main view;

[0035] Figure 6 For the present invention Figure 1 A schematic diagram of the structure of the positioning component in FIG.

[0036] Figure 7 For the present invention Figure 1 A schematic diagram of the structure of the smear component in FIG.

[0037] Figure 8 For the present invention Figure 1 A schematic diagram of the structure of the smoothing component in FIG.

[0038] Fig. 9 For the present invention Figure 1 A schematic diagram of the structure of the installation area components in FIG.

[0039] Fig.10 For the present invention Figure 1 A schematic diagram of the structure of the auxiliary pressurizing component;

[0040] Fig.11 For the present invention Figure 1 A schematic diagram of the structure of the parts supply assembly in FIG.

[0041] Fig.12 For the present invention Figure 1 Schematic diagram of the structure of the part transport clamping assembly.

[0042] Reference numerals:

[0043] 1 base;

[0044] 2 Refrigeration chip supply assembly;

[0045] 201 support column 1; 202 top plate 1; 203 limit column 1; 204 middle plate; 205 support column 2; 206 screw motor 1; 207 guide shaft; 208 bottom plate; 209 shielding sheet; 210 photoelectric switch;

[0046] 3 suction cup assembly;

[0047] 301 screw motor 2; 302 mounting bracket 1; 303 linear guide 1; 304 support block 1; 305 lifting cylinder 1; 306 crossbeam; 307 suction cup seat; 308 vacuum suction cup; 309 probe; 310 clamping block; 311 pneumatic joint; 312 optical coupler;

[0048] 4 positioning components;

[0049] 401 support block 2; 402 lifting cylinder 2; 403 positioning tray; 404 limit column 2; 405 screw motor 3; 406 linear guide rail 2; 407 support block 3; 408 clamping cylinder;

[0050] 5. Apply components;

[0051] 501 pressing plate 1; 502 through hole; 503 guide block; 504 branch guide pipe; 505 main guide pipe; 506 thermal grease packaging tube; 507 lifting cylinder 3; 508 support frame 1; 509 support frame 2;

[0052] 6. Smooth the components;

[0053] 601 support frame three; 602 lifting cylinder four; 603 scraper; 604 roller; 605 lifting cylinder five;

[0054] 7 installation area components,

[0055] 201 support column 1; 204 middle plate; 206 screw motor 1; 207 guide shaft; 208 bottom plate; 209 shielding sheet; 210 photoelectric switch; 701 top plate 2; 702 support column 3;

[0056] 8 auxiliary pressurizing components;

[0057] 801 linear guide rail three; 802 support frame four; 803 lifting cylinder six; 804 pressure plate two; 805 screw motor four;

[0058] 9 parts supply components;

[0059] 201 support column 1; 202 top plate 1; 203 limit column 1; 204 middle plate; 206 screw motor 1; 207 guide shaft; 208 bottom plate; 209 shielding sheet; 210 photoelectric switch; 901 support column 4;

[0060] 10-part transport clamping assembly,

[0061] 101 screw motor five; 102 screw motor six; 103 clamping support block; 104 lifting cylinder seven; 105 pneumatic clamping; 106 linear guide four; 107 linear guide five;

[0062] 11 semiconductor cooling chip; 12 heat sink; 13 parts. DETAILED DESCRIPTION

[0063] The technical solution of the present invention will be clearly described below in conjunction with the accompanying drawings. Obviously, the described embodiments are not all embodiments of the present invention, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the protection scope of the present invention.

[0064] It should be noted that the directions or positional relationships indicated by terms such as “center”, “up”, “down”, “horizontal”, “left”, “right”, “front”, “back”, “lateral” and “longitudinal” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0065] Combination Figure 1 , Figure 2 As shown, the present invention provides an automatic assembly device for a semiconductor refrigeration sheet, comprising:

[0066] Base 1, and cooling sheet supply assembly 2, suction cup assembly 3, positioning assembly 4, coating assembly 5, smoothing assembly 6, auxiliary pressurizing assembly 8, installation area assembly 7, parts supply assembly 9, parts transport clamping assembly 10, electric control board, power supply, and driver installed on the base 1. The electric control board, power supply, and driver are conventional settings of the prior art in the field, and are omitted in the figure.

[0067] Refrigeration chip supply component 2,

[0068] The cooling sheet supply assembly 2 is the first link of the entire automatic assembly device, and is used to transport the semiconductor cooling sheet 11 to a set height through lifting movement.

[0069] Combination Figure 1 , Figure 2 , Figure 3 As shown, the cooling sheet supply assembly 2 includes four support columns 201, a top plate 202 is arranged on the top of the four support columns 201, four limit columns 203 are arranged on the top plate 202, and the four limit columns 203 are used to stack the semiconductor cooling sheets 11 to form a cooling sheet stack. The bottom of the four support columns 201 is sleeved with an intermediate plate 204.

[0070] The refrigeration plate supply assembly 2 includes four support columns 205, a screw motor 1 206, a guide shaft 207, a shielding sheet 209, and a photoelectric switch 210. A bottom plate 208 is arranged on the top of the four support columns 205, and the bottom of the four support columns 205 is arranged on the base 1.

[0071] The screw motor 1 206 is placed inside the four support columns 205, and the top of the screw motor 1 206 is connected to the lower surface of the bottom plate 208. The screw of the screw motor 1 206 is inserted in the middle of the middle plate 204. The left and right sides of the middle plate 204 are respectively sleeved with guide shafts 207. The bottom of the screw motor 1 206 is located on the base 1.

[0072] The shielding piece 209 is disposed on the bottom plate 208 , and the photoelectric switch 210 is disposed on the middle plate 204 . The shielding piece 209 may mainly function to shield light, and the photoelectric switch 210 is used to detect the position or state of the shielding piece 209 .

[0073] The lead screw motor 206 is electrically connected to the electric control board, and the photoelectric switch 210 is electrically connected to the electric control board.

[0074] Working principle:

[0075] The screw motor 206 moves, driving the middle plate 204 to rise or fall along the guide shaft 207, thereby conveying the semiconductor cooling plate 11 to a desired height.

[0076] When the photoelectric switch 210 moves down to the position of the shielding piece 209, the refrigeration plate supply assembly 2 returns to its initial position, and the shielding piece 209 blocks the light received by the photoelectric switch 210. After the photoelectric switch 210 detects the light change, it triggers the switch action, thereby controlling the screw motor 206 through the electronic control board to stop driving the middle plate 204 to move downward.

[0077] Suction cup assembly 3,

[0078] It is arranged above the cooling sheet supply assembly 2 and is used to absorb the semiconductor cooling sheet 11 at the top of the cooling sheet stack on the cooling sheet supply assembly 2 .

[0079] Combination Figure 1 , Figure 2 , Figure 4 , Figure 5 As shown, the suction cup assembly 3 includes a screw motor 2 301 arranged on the base 1, the end of the screw of the screw motor 2 301 is arranged on a mounting bracket 1 302, and the mounting bracket 1 302 is located on the base 1. A linear guide rail 1 303 is connected between the bottom of the screw motor 2 301 and the bottom of the mounting bracket 1 302.

[0080] A support block 1 304 is provided on the screw of the screw motor 2 301. The bottom of the support block 1 304 is slidably connected to the linear guide rail 1 303. A lifting cylinder 1 305 is connected to the top of the support block 1 304, and a crossbeam 306 is connected to the top of the lifting cylinder 1 305. A suction cup seat 307 is connected to the front end of the crossbeam 306, and the suction cup seat 307 is located directly above the refrigeration sheet supply assembly 2.

[0081] Four vacuum suction cups 308 are arranged on the bottom of the suction cup seat 307. A detection assembly is arranged on the front side of the bottom of the suction cup seat 307, and the detection assembly includes a probe 309, a clamping block 310, a spring, and an optical coupler 312. The clamping block 310 is arranged on the front side of the top of the suction cup seat 307. The top of the probe 309 is sleeved with a spring, and the top of the probe 309 is clamped in the cavity of the clamping block 310. The optical coupler 312 is arranged on the top of the clamping block 310. A pneumatic joint 311 is arranged on the top of the crossbeam 306.

[0082] The lifting cylinder 305 is electrically connected to the electric control board, and the optical coupler 312 is electrically connected to the electric control board.

[0083] Working principle:

[0084] When the vacuum suction cup 308 is connected to an external vacuum pump through the pneumatic joint 311, the lifting cylinder 305 descends, driving the vacuum suction cup 308 to descend, so that the vacuum suction cup 308 contacts the refrigeration sheet stack, and the probe 309 detects the presence or absence of the refrigeration sheet. After the vacuum suction cup 308 absorbs the semiconductor refrigeration sheet 11, the lifting cylinder 305 is lifted up, and the suction cup assembly 3 is driven by the screw motor 301 to move to the downstream positioning assembly 4 station.

[0085] When the probe 309 detects the refrigeration plate, the probe 309 moves upward after receiving the reaction force. The spring allows the probe 309 to have a certain buffering and reset ability when it is under pressure. The probe 309 blocks the light of the optical coupler 312, thereby triggering a signal, and the electric control board controls the lifting cylinder 305 to stop driving the vacuum suction cup 308 to move downward.

[0086] Positioning component 4,

[0087] Located downstream of the refrigeration chip supply assembly 2, it is used to move the semiconductor refrigeration chip 11 along the entire assembly line.

[0088] Combination Figure 1 , Figure 2 , Figure 6 As shown, the positioning assembly 4 includes a supporting block 401 arranged on the base 1, a lifting cylinder 402 is arranged on the supporting block 401, a positioning tray 403 is connected to the top of the lifting cylinder 402, and limiting columns 404 are arranged around the positioning tray 403, and the limiting columns 404 are used to place the semiconductor cooling plate 11.

[0089] The cooling plate clamping assembly is symmetrically arranged on both sides of the support block 2 401, and the cooling plate clamping assembly includes a screw motor 3 405 arranged on the base 1, and a linear guide rail 2 406 is arranged on the base 1 below the screw of the screw motor 3 405, and a support block 3 407 is slidably connected to the linear guide rail 2 406, and a clamping cylinder 408 is arranged on the top of the support block 3 407. The clamping cylinder 408 is located at the same height as the positioning tray 403.

[0090] Working principle:

[0091] The semiconductor cooling sheet 11 is limited to the specified position by the second limiting column 404, and the lifting cylinder 2 402 under the positioning tray 403 works to lift it to the specified position. At this time, the horizontal direction of the semiconductor cooling sheet 11 remains unchanged. Then the clamping cylinders 408 on both sides start to move to clamp the semiconductor cooling sheet 11. Then the lifting cylinder 2 402 descends, and the clamping cylinders 408 on both sides clamp the semiconductor cooling sheet 11 along the direction of the second linear guide rail 406, driven by the screw motor 3 405, and continue to move to the downstream coating component 5 station.

[0092] Apply component 5,

[0093] Located downstream of the positioning component 4, it is used to apply thermal grease to the two surfaces of the semiconductor cooling plate 11.

[0094] Combination Figure 1 , Figure 2 , Figure 7 As shown, the coating assembly 5 includes an upper coating assembly and a lower coating assembly arranged directly below the upper coating assembly. The upper coating assembly includes a pressing plate 501, on which a plurality of through holes 502 are evenly opened, a guide block 503 is arranged on the top of the pressing plate 501, and 9 branch guide pipes 504 are arranged at the bottom of the guide block 503, and the branch guide pipes 504 are connected to the pressing plate 501. A main guide pipe 505 is arranged on the top of the guide block 503, and a thermal grease packaging tube 506 is connected to the main guide pipe 505. The thermal grease packaging tube 506 contains thermal grease.

[0095] The top of the thermal grease packaging tube 506 is connected to a lifting cylinder 3 507, and the top of the lifting cylinder 3 507 is connected to the top of a support frame 1 508, and the bottom end of the support frame 1 508 is arranged on the base 1, and the support frame 1 508 is L-shaped.

[0096] The lower coating assembly includes a pressure plate 501, a guide block 503, a thermal grease packaging tube 506, and a lifting cylinder 507, which are arranged in sequence from bottom to top. The bottom of the lifting cylinder 507 of the lower coating assembly is connected to a support frame 509, and the bottom end of the support frame 509 is arranged on the base 1.

[0097] Working principle:

[0098] The semiconductor cooling sheet 11 enters the workstation of the coating assembly 5, and is located between the two perforated pressing plates 1 501 of the coating assembly 5. The heat-conducting silicone grease in the heat-conducting silicone grease packaging tube 506 is squeezed into the guide block 503 by the pressure of the lifting cylinder 3 507. After further squeezing, the heat-conducting silicone grease is squeezed out from the 9 openings of the guide block 503, passes through the perforated pressing plate 1 501, and sticks to the semiconductor cooling sheet 11. In this way, there are 9 areas of heat-conducting silicone grease on both the upper and lower surfaces of the semiconductor cooling sheet 11.

[0099] After the lifting cylinder three 507 of the smearing component 5 is lifted, the semiconductor refrigeration plate 11 is continued to be driven by the refrigeration plate clamping component to move forward along the linear guide rail two 406 and enter the working station of the smearing component 6.

[0100] Smoothing component 6,

[0101] It is arranged downstream of the coating component 5 and is used to spread the thermal grease on the semiconductor cooling sheet 11 evenly.

[0102] Combination Figure 1 , Figure 2 , Figure 8 As shown, the smoothing assembly 6 includes an upper smoothing assembly and a lower smoothing assembly arranged directly below the upper smoothing assembly.

[0103] The upper smoothing component includes a support frame 3 601, the bottom end of the support frame 3 601 is arranged on the base 1, the support frame 3 601 is L-shaped, and a lifting cylinder 4 602 is arranged on the top of the support frame 3 601, and a scraper 603 and a roller 604 are connected to the lifting cylinder 4 602, the bottom of the scraper 603 and the roller 604 are located at the same height, and the scraper 603 is located upstream of the roller 604.

[0104] The lower smoothing component also has a scraper 603 and a roller 604 , and is symmetrically arranged with the scraper 603 and the roller 604 of the upper smoothing component 6 .

[0105] The mounting ends of the scraper 603 and the roller 604 of the lower smearing assembly are arranged on the lifting cylinder 5 605, and the bottom of the lifting cylinder 5 605 is arranged on the base 1.

[0106] Working principle:

[0107] Through the forward and backward movement of the clamping cylinder 408, the semiconductor cooling sheet 11 moves back and forth in the smearing area, and the 9 thermal grease areas are smeared by the roller 604, and then the scraper 603 scrapes away the excess thermal grease along the surface of the perforated pressing plate 1 501. The two rollers 604 and the lifting cylinder 4 602 and the lifting cylinder 5 605 are retracted, and after the cooling sheet clamping assembly clamps the semiconductor cooling sheet 11 and leaves the smearing assembly 5 station, the thermal grease on the semiconductor cooling sheet 11 will be evenly smeared and scraped away, and then the cooling sheet clamping assembly clamps the semiconductor cooling sheet 11 to the installation area assembly 7.

[0108] Installation area component 7,

[0109] It is arranged at the downstream station of the smoothing component 6 and is used to assemble the semiconductor cooling plate 11, the radiator 12 and the parts 13.

[0110] Combination Figure 1 , Figure 2 , Fig. 9 As shown, the main structure of the installation area component 7 is similar to that of the refrigeration plate supply component 2, and also includes an intermediate plate 204, a support column 201, a screw motor 206, a guide shaft 207, a bottom plate 208, a shielding plate 209, and a photoelectric switch 210. The connection relationship between the structures will not be repeated.

[0111] The differences are:

[0112] The top of the support column 1 201 of the installation area component 7 is connected to the top plate 2 701 , which is different from the top plate 1 202 in that there is no limit column 1 203 on the top plate 2 701 .

[0113] The bottom of the bottom plate 208 of the installation area component 7 is connected to the support column three 702, and the length of the support column three 702 is greater than the length of the support column two 205, so that the screw motor one 206 of the installation area component 7 is suspended on the base 1.

[0114] On the top plate 2 701 of the installation area component 7, the heat sink 12 is placed first, then the semiconductor cooling sheet 11 is placed, and finally the part to be cooled 13 is placed.

[0115] Working principle:

[0116] After the cooling plate clamping assembly drives the semiconductor cooling plate 11 to the station of the installation area assembly 7, the clamping cylinder 408 moves to the specified position, and the screw motor 206 of the installation area assembly 7 moves, catches the semiconductor cooling plate 11 and stops, and the clamping cylinder 408 leaves. In this way, the semiconductor cooling plate 11 evenly coated with thermal conductive silicone grease is accurately placed on the radiator 12.

[0117] Auxiliary pressurizing component 8,

[0118] It is arranged at the downstream station of the smoothing component 6 and is used to apply pressure to the part 13 of the installation area component 7 to ensure that the whole part 13 is evenly stressed.

[0119] Combination Figure 1 , Figure 2 , Fig.10 As shown, the auxiliary pressurizing assembly 8 includes symmetrically arranged linear guide rails 3 801, support frames 4 802, and lifting cylinders 6 803. The linear guide rails 3 801 are arranged on the outside of the linear guide rails 2 406. The linear guide rails 3 801 are slidably connected with support frames 4 802. The top of the support frames 4 802 is provided with lifting cylinders 6 803. The tops of the two lifting cylinders 6 803 are connected with pressure plates 2 804.

[0120] A screw motor 4 805 is provided at the rear end of the inner linear guide rail 3 801 , and the screw of the screw motor 4 805 is rotatably connected to the support frame 4 802 .

[0121] Working principle:

[0122] When the part 13 is placed on the installation area component 7, the screw motor four 805 is activated to transport the auxiliary pressurizing component 8 to the top of the part 13 in the installation area, the lifting cylinder six 803 descends, and the pressure plate two 804 is pressed onto the top of the part 13, gently applying a certain amount of pressure to ensure that the entire part 13 is evenly stressed.

[0123] Parts Supply Kit 9,

[0124] It is arranged on the downstream side of the installation area component 7 and is used to place the parts 13.

[0125] Combination Figure 1 , Figure 2 , Fig.11 As shown, the main structure of the parts supply component 9 is similar to that of the refrigeration plate supply component 2, and also includes a top plate 202, a middle plate 204, a support column 201, a screw motor 206, a guide shaft 207, a bottom plate 208, a shielding plate 209, and a photoelectric switch 210, and the connection relationship between the structures is no longer repeated.

[0126] The difference is that

[0127] The bottom of the base plate 208 of the parts supply assembly 9 is connected to the support column four 901, and the length of the support column four 901 is greater than the length of the support column three 702, so that the screw motor one 206 of the parts supply assembly 9 is suspended on the base 1.

[0128] A plurality of parts 13 are stacked on the top plate 202 of the parts supply assembly 9 to form a parts stack.

[0129] Working principle:

[0130] The screw motor 206 of the part supply assembly 9 moves, driving the middle plate 204 of the part supply assembly 9 to rise or fall along the guide shaft 207, thereby conveying the part 13 to a desired height.

[0131] Parts transport clamping assembly 10,

[0132] It is arranged on one side of the parts supply assembly 9 and is used to take the topmost part 13 of the parts stack.

[0133] Combination Figure 1 , Figure 2 , Fig.12 As shown, the part transport clamping assembly 10 includes a cross-set screw motor 5 101 in the X-axis direction and a screw motor 6 102 in the Y-axis direction. One end of the screw of the screw motor 5 101 is close to the installation area assembly 7 station, and one end of the screw of the screw motor 6 102 is close to the part supply assembly 9 station, and the screw parts of the screw motors in both directions are inserted into the clamping support block 103.

[0134] A linear guide rail 4 106 is provided at the bottom of the screw motor 5 101, and the bottom of the linear guide rail 4 106 is provided on the base 1; a linear guide rail 5 107 is provided at the bottom of the screw motor 6 102; the linear guide rail 5 107 is slidably connected to the top of the linear guide rail 4 106. The bottom of the clamping support block 103 is provided on the linear guide rail 5 107, and the top of the clamping support block 103 is connected to the lifting cylinder 7 104, and the lifting cylinder 7 104 is connected to the pneumatic clamping 105.

[0135] The pneumatic gripper 105 is a standard part in the prior art. Through pneumatic control, the two jaws open and close to clamp and release the parts.

[0136] Working principle:

[0137] The part transport clamping assembly 10 can move in the X-axis direction and the Y-axis direction through the screw motor 5 101, the screw motor 6 102, the linear guide rail 4 106, and the linear guide rail 5 107. Through the lifting cylinder 7 104 and the pneumatic clamp 105, the pneumatic clamp 105 clamps a part 13 from the part stack and places it on the semiconductor cooling sheet 11, and then the part transport clamping assembly 10 leaves.

[0138] Thereby, the parts 13 on the parts stack can be taken and transported to the assembly 7 station in the installation area.

[0139] Workflow of automatic assembly device:

[0140] 1. In the initial state, press the semiconductor cooling sheet 11 Figure 1In the manner shown, the cooling sheet is placed on the stack, and the limiting column 1 203 limits it. The parts 13 to be cooled are placed on the parts stack. The radiator 12 is placed on the lifting cylinder 2 402 of the installation area component 7. All three parts of materials are ready.

[0141] The vacuum suction cup 308 is connected to the vacuum pump, and the lifting cylinder 1 305 descends, so that the vacuum suction cup 308 contacts the refrigeration sheet stack, and the probe 309 detects the presence or absence of the semiconductor refrigeration sheet 11. After the vacuum suction cup 308 absorbs the semiconductor refrigeration sheet 11, the lifting cylinder 1 305 is lifted up, and the suction cup assembly 3 is driven by the screw motor 2 301 to move to the positioning assembly 4 area.

[0142] 3. In the area of ​​the positioning component 4, the semiconductor cooling sheet 11 is limited to the specified position due to the limiting column 2 404, and the lifting cylinder 2 402 below works to lift it to the specified position. At this time, the horizontal direction of the semiconductor cooling sheet 11 is limited. Then the clamping cylinders 408 on both sides start to move and clamp the semiconductor cooling sheet 11. Then the lifting cylinder 2 402 descends, and the clamping cylinders 408 on both sides clamp the semiconductor cooling sheet 11 along the direction of the linear guide 2 406, driven by the screw motor 3 405, and continue to move forward.

[0143] 4. Enter the coating component 5 area. In this area, there are two perforated pressing plates 501 on the upper and lower sides of the semiconductor cooling sheet 11. The thermal grease in the thermal grease packaging tube 506 is squeezed into the guide block 503 by the pressure of the lifting cylinder 507. After further squeezing, it is squeezed out from the 9 openings of the guide block 503, passes through the perforated pressing plate 501, and sticks to the semiconductor cooling sheet 11. In this way, there are 9 thermal grease areas on the upper and lower surfaces of the semiconductor cooling sheet 11.

[0144] 5. Then the lifting cylinder 4 602 of the coating component 5 is lifted, and the semiconductor cooling sheet 11 is continued to be driven by the cooling sheet clamping component to move forward along the linear guide rail 2 406 and enter the smoothing component 6. The smoothing component 6 has a structure of two rollers 604 and a scraper 603. Through the forward and backward movement of the clamping cylinder 408, the semiconductor cooling sheet 11 moves back and forth in the smoothing area, and the above-mentioned 9 thermal grease areas are spread, and then the scraper 603 scrapes away the excess thermal grease along the surface of the perforated pressing plate 1 501. The lifting cylinder 4 602 of the upper and lower rollers 604 is retracted, and after leaving this area, the thermal grease on the semiconductor cooling sheet 11 will be evenly spread and scraped away.

[0145] 6. Continue to move forward and come to the installation area component 7 area. After the clamping cylinder 408 moves to the specified position, the screw motor in the installation area component 7 area moves, catches the semiconductor cooling sheet 11 and stops, and the clamping cylinder 408 leaves. In this way, the semiconductor cooling sheet 11 evenly coated with thermal conductive silicone grease is accurately placed on the radiator 12.

[0146] 7. Take a part 13 from the parts pile through the lifting cylinder 7 104 and the pneumatic gripper 105 of the part transport clamping assembly 10, place it on the semiconductor cooling sheet 11, and then leave.

[0147] 8. At this time, the screw motor 4 805 of the auxiliary pressurizing assembly 8 is activated to transport the auxiliary pressurizing assembly 8 to the top of the part 13 in the installation area, the lifting cylinder 6 803 descends, and the pressure plate 2 804 is pressed onto the top of the part 13 to apply the set pressure to ensure that the entire part 13 is evenly stressed.

[0148] 9. The auxiliary pressurizing assembly 8 leaves, and then the screws are tightened, and the assembled radiator, semiconductor cooling sheet and parts are locked together. The assembled radiator, semiconductor cooling sheet and parts are pushed upward by the screw motor 206 of the installation area assembly 7, and the whole process is completed.

[0149] Continue to place the next radiator 12 and prepare for the next cycle of action flow.

[0150] The transmission mechanism of the present invention includes but is not limited to the screw motor of the present invention, and also includes commonly used synchronous belt transmission, gear rack transmission, worm gear transmission, etc.

[0151] The air cylinder can also be replaced by an electric cylinder or other mechanism that can achieve similar functions. Unlimited.

[0152] The refrigerated parts mentioned in the present invention may be the heating body in a PCR instrument of a medical device, or the CPU in a computer, and all other possible products that require refrigeration.

[0153] The present invention places the radiator, takes out the cooling sheet, positions the cooling sheet, applies, spreads, installs, takes out parts, assists in pressurizing, locks, and produces finished products. These processes are interrelated and connected to each other according to functions and actions. The entire process is driven by a screw motor and a cylinder, and the action is automated, which reduces labor and saves costs.

[0154] The present invention adds the function of loading materials (refrigeration plates, refrigerated parts and radiators), so that the parts are prepared in advance and the material stack is prepared, thereby improving the assembly efficiency during batch production.

[0155] The present invention adds the action of automatic smearing, roller scraper smearing, and a perforated pressing plate, so as to ensure the consistency of the action in production, avoid the problem of different thickness and unevenness of thermal grease smearing from person to person, and improve the yield rate of the product.

[0156] The above technical features constitute the best embodiment of the present invention, which has strong adaptability and best implementation effect. Non-essential technical features can be added or reduced according to actual needs to meet the needs of different situations.

[0157] Finally, it should be noted that the above content is only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Simple modifications or equivalent substitutions of the technical solution of the present invention by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the present invention.

Claims

1. An automatic assembly device for a semiconductor cooling sheet, comprising a base, characterized in that: It also includes a cooling sheet supply component, a suction cup component, a positioning component, and a coating component arranged on the base according to the assembly line. The suction cup assembly is used to absorb the semiconductor cooling sheet supplied by the cooling sheet supply assembly; The positioning component moves the semiconductor cooling sheet sucked by the suction cup component to the coating component; The coating component includes two parts, an upper part and an lower part, each part includes a driving mechanism and a pressure plate one connected to the driving mechanism, a plurality of through holes are evenly opened on the pressure plate one, a guide block is arranged on the top of the pressure plate one, a plurality of branch guide pipes are arranged on the bottom of the guide block, the branch guide pipes are connected to the pressure plate one, a main guide pipe is arranged on the top of the guide block, the main guide pipe is connected to a thermal grease packaging cylinder, and the thermal grease packaging cylinder contains thermal grease; the thermal grease packaging cylinder is connected to the driving mechanism; when coating, the semiconductor refrigeration sheet is located between the upper and lower pressure plates one.

2. The automatic assembly device according to claim 1, characterized in that: It also includes a spreading component arranged downstream of the coating component, which is used to spread the thermal grease on the semiconductor refrigeration plate; the spreading component includes an upper and lower part, each part includes a driving mechanism, and a scraper and a roller connected to the driving mechanism, the bottom of the scraper and the roller are located at the same height, and when spreading, the semiconductor refrigeration plate is located between the upper and lower rollers.

3. The automatic assembly device according to claim 2, characterized in that: It also includes an installation area component, a parts supply component, and a parts transport clamping component arranged downstream of the smoothing component. The installation area component includes a lifting mechanism and a bearing structure arranged on the top of the lifting mechanism. The bearing structure is stacked with a radiator, a semiconductor refrigeration sheet with evenly spread thermal grease transported by the positioning component, and a refrigeration part grabbed from the parts supply component by the parts transport clamping component.

4. The automatic assembly device according to claim 3, characterized in that: It also includes an auxiliary pressure component arranged downstream of the smoothing component, the auxiliary pressure component includes a lifting mechanism connected to the base plate, the lifting mechanism of the auxiliary pressure component is connected to the linear motion reciprocating mechanism of the auxiliary pressure component arranged on the base plate, and a second pressure plate is connected to the top of the lifting mechanism. When working, driven by the linear motion reciprocating mechanism, the second pressure plate moves to the top of the installation area component, and pressure is applied to the parts under the action of the lifting mechanism.

5. The automatic assembly device according to claim 1, characterized in that: The suction cup assembly is arranged above the refrigeration film supply assembly, and is used for sucking the semiconductor refrigeration film at the top of the refrigeration film stack on the refrigeration film supply assembly. The suction cup assembly includes a screw motor 2 fixed to the base through a mounting bracket 1, a linear guide rail 1 connected between the screw motor 2 and the bottom of the mounting bracket 1, a support block 1 is passed through the screw of the screw motor 2, the support block 1 is slidably connected to the linear guide rail 1, a lifting cylinder 1 is connected to the top of the support block 1, a crossbeam is connected to the top of the lifting cylinder 1, a suction cup seat is connected to the front end of the crossbeam, and a plurality of vacuum suction cups are arranged on the bottom of the suction cup seat.

6. The automatic assembly device according to claim 5, characterized in that: A detection component is arranged on the bottom front side of the suction cup seat, and the detection component includes a probe, a clamping block, a spring, and an optical coupler. The clamping block is arranged on the top front side of the suction cup seat, a spring is arranged on the top of the probe, and the top of the probe is clamped in the cavity of the clamping block, and the optical coupler is arranged on the top of the clamping block.

7. The automatic assembly device according to claim 1, characterized in that: The positioning assembly is located downstream of the cooling plate supply assembly and is used to move the semiconductor cooling plate along the entire assembly line. The positioning assembly includes a second support block arranged on the base, a second lifting cylinder is arranged on the second support block, a positioning tray is connected to the top of the second lifting cylinder, and two limiting columns are arranged around the positioning tray; Refrigeration plate clamping assemblies are symmetrically arranged on both sides of support block two, and the refrigeration plate clamping assembly includes a screw motor three arranged on the base, a linear guide rail two is arranged under the screw of the screw motor three, a support block three is slidably connected to the linear guide rail two, and a clamping cylinder is arranged on the top of the support block three.

8. The automatic assembly device according to claim 3, characterized in that: The parts transport clamping assembly is arranged on one side of the parts supply assembly, and is used to pick up the parts at the top of the parts stack. The parts transport clamping assembly includes a cross-arranged screw motor five in the X-axis direction and a screw motor six in the Y-axis direction. One end of the screw of the screw motor five is close to the installation area assembly, and one end of the screw of the screw motor six is ​​close to the parts supply assembly, and the screw parts of the screw motors in the two directions are inserted into the clamping support block. A linear guide rail 4 is arranged at the bottom of the screw motor 5; a linear guide rail 5 is arranged at the bottom of the screw motor 6; the linear guide rail 5 is slidably connected to the top of the linear guide rail 4; the bottom of the clamping support block is arranged on the linear guide rail 5, the top of the clamping support block is connected to a lifting cylinder 7, and the lifting cylinder 7 is connected to a pneumatic clamp.

9. The automatic assembly device according to claim 2, characterized in that: The driving mechanism of the smoothing assembly is a lifting cylinder three, the top of the upper thermal grease packaging tube is connected to the lifting cylinder three, the top of the upper lifting cylinder three is connected to the top of the support frame one, the bottom end of the support frame one is arranged on the base, and the support frame one is L-shaped; the bottom of the lower lifting cylinder three is connected to the support frame two, and the bottom end of the support frame two is arranged on the base.

10. The automatic assembly device according to claim 9, characterized in that: The upper part of the smoothing component includes a support frame three, the bottom end of the support frame three is arranged on the base, the support frame three is L-shaped, and a lifting cylinder four is arranged on the top of the support frame three, and a scraper and a roller are connected to the lifting cylinder four. The mounting ends of the scraper and the roller of the lower part of the smoothing component are arranged on the lifting cylinder five, and the bottom of the lifting cylinder five is arranged on the base.

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