Cooling device, heat dissipation member, and semiconductor module

Abstract

A cooling device according to the present invention is provided with a liquid cooling jacket and a heat dissipation member. The heat dissipation member includes: a plate-shaped base portion extending in a first direction along a direction in which a refrigerant flows and in a second direction orthogonal to the first direction, and having a thickness in a third direction orthogonal to the first direction and the second direction; at least one fin protruding from the base toward one side in the third direction; and a top plate portion provided at an end portion of the at least one fin on one side in the third direction. The liquid cooling jacket has: a first flow path in which the fins and the top plate portion are disposed and which extends in a first direction; and a second flow path connected downstream of the first flow path and extending from the first flow path toward one side in a third direction. When viewed in a third direction, a connection surface where the second flow path and the first flow path are connected overlaps the top plate portion. A heat generating body is disposed on the most downstream side of the base portion on the other side in the third direction from a position where the second flow path extends toward one side in the third direction.

Description

Technical Field

[0001] The invention relates to a cooling device, a heat dissipation component and a semiconductor module. Background Art

[0002] In the past, a cooling device was used to cool a heat generating element. The cooling device includes a heat dissipation component and a liquid cooling jacket. The heat dissipation component includes a base and a plurality of heat dissipation fins. The plurality of heat dissipation fins protrude from the base. A flow path is formed by the heat dissipation component and the liquid cooling jacket. A refrigerant is caused to flow in the flow path, so that the heat of the heat generating element is transferred to the refrigerant (for example, refer to Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2013 / 157467 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] In conventional cooling devices, a plurality of heating elements are sometimes arranged at the base along the flow direction of the refrigerant in the flow path. In this case, depending on the shape of the flow path based on the liquid cooling jacket, the cooling performance of the heating element arranged on the most downstream side may be insufficient.

[0008] In view of the above circumstances, an object of the present invention is to provide a cooling device or the like capable of improving the cooling performance of a heat generating element arranged on the most downstream side.

[0009] Solutions for solving problems

[0010] An exemplary cooling device of the present invention is a cooling device having a liquid cooling jacket and a heat dissipation component provided on the liquid cooling jacket. The heat dissipation component has: a plate-shaped base portion, which extends in a first direction along the direction of flow of the refrigerant and in a second direction orthogonal to the first direction, and has a thickness in a third direction orthogonal to the first direction and the second direction; at least one heat sink, which protrudes from the base portion to one side of the third direction; and a top plate portion, which is provided at one end of the at least one heat sink in the third direction. The liquid cooling jacket has: a first flow path, which is provided with the heat sink and the top plate portion and extends in the first direction; and a second flow path, which is connected to the first flow path on the downstream side and extends from the first flow path to one side of the third direction. When viewed in the third direction, the connection surface of the second flow path connected to the first flow path overlaps with the top plate portion. From the position where the second flow path starts to extend to one side of the third direction, a heat generating element is arranged on the most downstream side of the other side of the third direction of the base portion.

[0011] In addition, an exemplary cooling device of the present invention is a cooling device having a liquid cooling jacket and a heat dissipation component. The heat dissipation component has: a plate-shaped base portion, which extends in a first direction along the direction of flow of the refrigerant and in a second direction orthogonal to the first direction, and has a thickness in a third direction orthogonal to the first direction and the second direction; at least one heat sink, which protrudes from one surface of the base portion toward the third direction; and a top plate portion, which is provided at one end of the third direction of the at least one heat sink. A heat generating element is arranged on the other surface of the base portion. The refrigerant flows from the other side of the first direction to the one side of the first direction in the flow path formed by the liquid cooling jacket and the heat dissipation component. In an opposing region in the downstream region of the flow path that is opposed to the heat generating element in the third direction, the depth of the liquid cooling jacket becomes deeper in the third direction. The top plate portion is provided in at least a portion of the opposing region.

[0012] In addition, an exemplary heat dissipation component of the present invention is a heat dissipation component provided in a liquid cooling jacket, and has: a plate-shaped base portion, which extends in a first direction along the direction of flow of the refrigerant and in a second direction orthogonal to the first direction, and has a thickness in a third direction orthogonal to the first direction and the second direction; at least one heat sink, which protrudes from the base portion to one side of the third direction; and a top plate portion, which is provided at one end of the at least one heat sink in the third direction. The liquid cooling jacket has: a first flow path, which is provided with the heat sink and the top plate portion and extends in the first direction; and a second flow path, which is connected to the first flow path on the downstream side and extends from the first flow path to one side of the third direction. When viewed in the third direction, the connection surface of the second flow path connected to the first flow path overlaps with the top plate portion. From the position where the second flow path starts to extend to one side of the third direction, a heating element is arranged on the most downstream side of the other side of the third direction of the base.

[0013] Effects of the Invention

[0014] According to the exemplary cooling device and the like of the present invention, it is possible to improve the cooling performance of the heat generating body arranged on the most downstream side. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is an exploded perspective view of a cooling device according to an exemplary embodiment of the present invention.

[0016] Figure 2 is a side cross-sectional view of a cooling device according to an exemplary embodiment of the present invention.

[0017] Figure 3 is a perspective view of a heat dissipation component according to an exemplary embodiment of the present invention.

[0018] Figure 4 is a three-dimensional diagram of a first heat sink.

[0019] Figure 5 is a perspective view of the second heat sink.

[0020] Figure 6 It is a partial side cross-sectional view of a cooling device of a comparative example.

[0021] Figure 7 is a partial side cross-sectional view showing the structure of the most downstream side in the cooling device according to the exemplary embodiment of the present invention.

[0022] Fig. 8A This is a graph showing an example of the simulation result of the first simulation.

[0023] Figure 8B This is a graph showing an example of the simulation result of the first simulation.

[0024] Figure 8C This is a graph showing an example of the simulation result of the first simulation.

[0025] Fig.8D This is a graph showing an example of the simulation result of the first simulation.

[0026] Fig. 9 is a partial side sectional view of the cooling device used in the second simulation.

[0027] Fig.10 This is a graph showing an example of the simulation result of the second simulation.

[0028] Fig.11 It is a perspective view showing a structural example of a heat dissipation member using pin-shaped fins.

[0029] Fig.12 It is an enlarged perspective view showing a structural example of a single spoiler. DETAILED DESCRIPTION

[0030] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0031] In addition, in the accompanying drawings, the first direction is shown as the X direction, X1 is shown as one side of the first direction, and X2 is shown as the other side of the first direction. The first direction is along the direction F of the flow of the refrigerant WT, the downstream side is shown as F1, and the upstream side is shown as F2. The second direction orthogonal to the first direction is shown as the Y direction, Y1 is shown as one side of the second direction, and Y2 is shown as the other side of the second direction. The third direction orthogonal to the first direction and the second direction is shown as the Z direction, Z1 is shown as one side of the third direction, and Z2 is shown as the other side of the third direction. In addition, the above-mentioned orthogonal also includes intersections at angles slightly deviated from 90 degrees. The above-mentioned directions do not limit the directions when the cooling device 150 and the heat dissipation component 1 are assembled in various devices.

[0032] <1. Structure of cooling equipment>

[0033] Figure 1 is an exploded perspective view of a cooling device 150 according to an exemplary embodiment of the present invention. Figure 2 is a side cross-sectional view of cooling device 150 . Figure 2 This is a diagram of a state in which the cooling device 150 is cut along a plane orthogonal to the second direction at a midway position in the second direction and viewed from the other side in the second direction toward the one side in the second direction.

[0034] The cooling device 150 includes a liquid cooling jacket 100 and a heat dissipation component 1 provided on the liquid cooling jacket 100. Figure 2 , the flow of the refrigerant WT is shown. One side in the first direction is the downstream side in the direction in which the refrigerant WT flows, and the other side in the first direction is the upstream side in the direction in which the refrigerant WT flows. The refrigerant WT is a liquid such as water.

[0035] The cooling device 150 is a device for cooling a plurality of semiconductor devices 71A, 71B, 72A, 72B, 73A, 73B (hereinafter, 71A, etc.). The semiconductor device is an example of a heat generating body. The semiconductor device 71A, etc. is, for example, a power transistor of an inverter provided in a traction motor for driving the wheels of a vehicle. The power transistor is, for example, an IGBT insulated gate bipolar transistor. In this case, the cooling device 150 is mounted on the traction motor. In addition, the number of semiconductor devices may be a plurality other than six.

[0036] The heat dissipation component 1 includes a heat dissipation fin portion 10 and a base portion 2. The heat dissipation fin portion 10 is fixed to one side of the base portion 2 in the third direction. The liquid cooling jacket 100 includes an inlet flow path 100A, a first flow path 100B (at Figure 2 The space on the other side of the third direction than the dotted line), the second flow path 100C, and the outlet flow path 100D.

[0037] The inlet channel 100A is disposed on the other side of the first direction of the liquid cooling jacket 100. The first channel 100B extends along the first direction. The end of the first channel 100B on the other side of the first direction is disposed on the other side of the inlet channel 100A in the third direction and is connected to the inlet channel 100A in the third direction.

[0038] The second flow path 100C is arranged on one side of the first direction of the liquid cooling jacket 100 and extends along the third direction. In addition, the second flow path 100C has: a first inclined wall 100C1, which is inclined from one side of the first direction to one side of the third direction; and a second inclined wall 100C2, which is perpendicular to the first direction and extends along the third direction. That is, in addition to the second inclined wall 100C2 extending in the third direction that does not include the first direction component, the second flow path 100C also has a first inclined wall 100C1 extending in a direction that includes the first direction component and the third direction component. In this case, it can also be said that the second flow path 100C extends along the third direction.

[0039] In addition, the second flow path 100C may also have a second inclined wall 100C2 inclined toward the other side of the first direction and one side of the third direction. That is, taking the downstream side of the flow of the refrigerant WT as one side of the first direction, the second flow path 100C may have at least one of the first inclined wall 100C1 inclined toward one side of the first direction and one side of the third direction and the second inclined wall 100C2 inclined toward the other side of the first direction and one side of the third direction. Thus, when the second flow path 100C is formed by casting the liquid cooling jacket 100, demolding is easy.

[0040] The end of the first flow path 100B on one side in the first direction is arranged on the other side of the second flow path 100C in the third direction, and is connected to the second flow path 100C in the third direction. The outlet flow path 100D is arranged on one side in the first direction of the liquid cooling jacket 100, and extends along the first direction. The end of the second flow path 100C on one side in the third direction is connected to the outlet flow path 100D. The outlet flow path 100D opens toward the first side of the liquid cooling jacket 100 (refer to Figure 1 ).

[0041] In the liquid cooling jacket 100 , a top surface 100S1 is formed at one end of the first flow path 100B in the third direction. The top surface 100S1 is a plane extending in the first direction and the second direction.

[0042] When the heat dissipation component 1 is not mounted on the liquid cooling jacket 100, the top surface 100S1 is exposed on the other side in the third direction. The heat dissipation component 1 is mounted on the liquid cooling jacket 100 by fixing the side surface 21 in the third direction of the base 2 of the heat dissipation component 1 to the other side surface 100S2 in the third direction of the liquid cooling jacket 100. When the heat dissipation component 1 is mounted, the other side in the third direction of the top surface 100S1 is covered by the base 2. Thus, the first flow path 100B is closed by the base 2.

[0043] When the heat dissipation component 1 is mounted on the liquid cooling jacket 100, the heat dissipation fin portion 10 is arranged inside the first flow path 100B. As described later, the heat dissipation fin portion 10 is formed by stacking a plurality of heat dissipation fins FP in the second direction. As described later, the heat dissipation fin FP has a top plate portion 503. That is, the heat dissipation fin FP and the top plate portion 503 are arranged in the first flow path 100B.

[0044] The refrigerant WT flowing into the inlet flow path 100A from the outside of the liquid cooling jacket 100 flows into the first flow path 100B after flowing through the inlet flow path 100A. The refrigerant WT flowing toward one side of the first direction in the first flow path 100B flows into the second flow path 100C. The refrigerant WT flowing toward one side of the third direction in the second flow path 100C flows into the outlet flow path 100D and is discharged to the outside of the liquid cooling jacket 100. That is, the refrigerant WT flows from the other side of the first direction to one side of the first direction in the flow path formed by the liquid cooling jacket 100 and the heat dissipation component 1 (the flow path formed by the first flow path 100B and the second flow path 100C).

[0045] The semiconductor device 71A and the like are arranged on the other side of the third direction of the base 2. That is, a heat generating body (71A and the like) is arranged on the other surface of the base 2. The heat generated from the semiconductor device 71A and the like moves from the heat sink 10 to the refrigerant WT flowing inside the first flow path 100B, thereby cooling the semiconductor device 71A and the like. In addition, the semiconductor module 200 is composed of the semiconductor device 71A and the like and the heat dissipation component 1. That is, the semiconductor module 200 includes the heat dissipation component 1 and the semiconductor device 73B as a heat generating body.

[0046] In other words, the liquid cooling jacket 100 includes: a first flow path 100B, in which the heat sink FP and the top plate portion 503 are configured, and which extends along the first direction; and a second flow path 100C, which is connected to the first flow path 100B on the downstream side and extends from the first flow path 100B to one side in the third direction.

[0047] <2. Overall structure of heat dissipation components>

[0048] Next, the heat dissipating member 1 will be described in more detail. Figure 3 is a perspective view of a heat dissipation member 1 according to an exemplary embodiment of the present invention.

[0049] As described above, the heat sink 1 can be provided in the liquid cooling jacket 100 and includes the base 2 and the fin section 10. The fin section 10 includes the upstream fin group 3, the center fin group 4, and the downstream fin group 5.

[0050] The base 2 is in the shape of a plate that extends in the first direction and the second direction and has a thickness in the third direction. The base 2 is made of a metal with high thermal conductivity, such as a copper alloy.

[0051] The upstream fin group 3, the central fin group 4, and the downstream fin group 5 (hereinafter referred to as the fin groups 3, 4, 5) are arranged in sequence from the other side in the first direction (upstream side) toward the one side in the first direction (downstream side) on the third direction side of the base 2. As described later, the fin groups 3, 4, 5 are fixed to the third direction side surface 21 of the base 2 by, for example, brazing.

[0052] Semiconductor device 71A, etc. ( Figure 2 ) is directly or indirectly fixed to the other side surface 22 of the third direction of the base 2. When viewed in the third direction, the heating elements 71A and 71B overlap with the upstream heat sink group 3, the heating elements 72A and 72B overlap with the central heat sink group 4, and the heating elements 73A and 73B overlap with the downstream heat sink group 5.

[0053] The refrigerant WT is supplied to the upstream fin group 3 from the upstream side of the upstream fin group 3, and the refrigerant WT flows through the fin groups 3, 4, and 5 in sequence, and is discharged to the downstream side from the downstream fin group 5. At this time, the heat generated from the semiconductor device 71A and the like moves to the refrigerant WT via the base 2 and the fin groups 3, 4, and 5. As a result, the semiconductor device 71A and the like are cooled.

[0054] <3. Method of forming a heat sink group>

[0055] Here, also refer to Figure 5 and Figure 6 An example of a specific method of forming the fin portion 10 (the fin groups 3 , 4 , 5 ) will be described.

[0056] The heat sink portion 10 is formed by arranging a plurality of heat sinks (heat sink plates) FP in the second direction to form a so-called stacked heat sink. The heat sink FP is formed by a metal plate extending in the first direction, for example, a copper plate. In addition, the heat sinks FP1 and FP2 shown in the figure are both one type of heat sink FP. That is, FP is used as a general reference numeral for the heat sink.

[0057] Figure 4 The first fin FP1 includes an upstream fin section 30, a central fin section 40, and a downstream fin section 50 (hereinafter referred to as fin sections 30, 40, 50). The fin sections 30, 40, 50 constitute fin groups 3, 4, 5, respectively.

[0058] The upstream heat sink portion 30 has a bottom plate portion 301, a side wall portion 302, and a top plate portion 303. The side wall portion 302 is in the shape of a plate extending in the first direction and the third direction and having the second direction as the thickness direction. The bottom plate portion 301 is formed by bending from the other end of the third direction of the side wall portion 302 to one side of the second direction. The top plate portion 303 is formed by bending from the one end of the third direction of the side wall portion 302 to one side of the second direction. In addition, the top plate portion 303 is divided and arranged on one side of the first direction and the other side of the first direction of the cutout portion 304. The cutout portion 304 has a shape of a cutout from one end of the third direction of the side wall portion 302 to the other side of the third direction. The bottom plate portion 301 and the top plate portion 303 are opposed to each other in the third direction. As a result, the upstream heat sink portion 30 has a square U-shaped cross section in the cut surface orthogonal to the first direction.

[0059] The bottom plate portion 301 and bottom plate portions 401 and 501 described later are parts of the bottom plate portion BT extending over the entire length of the first heat sink FP1 in the first direction.

[0060] The central fin section 40 has a bottom plate section 401, a side wall section 402, and a top plate section 403. The downstream fin section 50 has a bottom plate section 501, a side wall section 502, and a top plate section 503. The structures of the central fin section 40 and the downstream fin section 50 are substantially the same as those of the upstream fin section 30 described above, and therefore detailed descriptions thereof are omitted here. Figure 4 As shown, the top plate portion 503 of the downstream side fin portion 50 is not divided in the first direction.

[0061] Connecting fins 61 are arranged between the upstream fin section 30 and the central fin section 40. Connecting fins 61 connect the fin sections 30 and 40 in the first direction. Connecting fins 62 are arranged between the central fin section 40 and the downstream fin section 50. Connecting fins 62 connect the fin sections 40 and 50 in the first direction.

[0062] Figure 5 2 is a perspective view of the second heat sink FP2. The difference between the structure of the second heat sink FP2 and the first heat sink FP1 is that the connecting fin 61 is not arranged between the upstream heat sink section 30 and the central heat sink section 40, and only a part of the bottom plate section BT is arranged, and the connecting fin 62 is not arranged between the central heat sink section 40 and the downstream heat sink section 50, and only a part of the bottom plate section BT is arranged.

[0063] That is, the heat sink FP includes: a flat side wall portion (including the flat plate portion of the side wall portions 302, 402, and 502) extending in the first direction and the third direction and having a thickness in the second direction; and a top plate portion 503 formed by bending one end portion of the side wall portion in the third direction toward the second direction. Thus, since the top plate portion 503 can be formed by stamping, the top plate portion 503 can be easily manufactured.

[0064] like Figure 3 As shown in FIG. 1 , the heat sink portion 10 is formed by alternately arranging the first heat sink FP1 and the second heat sink FP2 in the second direction. However, some of the heat sink FP1 and FP2 are extended to the other side of the first direction or one side of the first direction. The heat sink FP1 and FP2 extending to the other side of the first direction constitute the end heat sink groups 3A and 3B (see FIG. 1 ). Figure 3 A recessed portion 3C that is recessed toward the other side of the third direction is formed between the end fin groups 3A and 3B. By checking the recessed portion 3C, the operator can prevent the heat dissipating component 1 from being installed in the wrong direction.

[0065] In this way, the various heat sinks FP are arranged in the second direction and integrated, for example, by riveting, thereby forming the heat sink section 10 (heat sink groups 3, 4, 5). The formed heat sink section 10 is fixed to the third direction one side surface 21 of the base 2, for example, by brazing. In this way, by using the heat sink FP having a structure in which the heat sink sections 30, 40, 50 are integrated in the first direction to form the heat sink section 10, even when the thickness of the base 2 is reduced for thermal conductivity, the rigidity of the heat sink 1 can be improved, and the deflection caused by the flow of the refrigerant WT can be suppressed.

[0066] That is, the heat dissipation component 1 has at least one heat dissipation fin FP protruding from the base 2 to one side in the third direction and a top plate portion 503 provided at one end of the at least one heat dissipation fin FP in the third direction. In addition, it can also be said that the at least one heat dissipation fin FP protrudes from one surface of the base 2 to one side in the third direction.

[0067] <4. Flow of refrigerant>

[0068] use Figure 2 The flow of the refrigerant WT in the heat dissipation component 1 having such a structure will be described. Figure 2 In FIG. 1 , the flow of the refrigerant WT is shown by arrows. Figure 2 , the first heat sink FP1 is illustrated in a state where a cut surface is viewed from the other side in the second direction. Figure 2 The bottom plate portion BT and the top plate portions 303, 403, 503 shown in the figure are structures included in the second heat sink FP2 (not shown) adjacent to the other side (front side in the paper) of the first heat sink FP1 in the second direction.

[0069] In the heat sink group 3, 4, 5, the refrigerant WT flows in the flow path formed between the heat sink portions 30, 40, 50 adjacent to each other in the second direction. At this time, the refrigerant WT flows on the bottom plate portion BT. In addition, in the case where the heat sink plate FP is not provided with the bottom plate portion BT, the refrigerant WT flows on the base 2. In the upstream heat sink portion 30, the refrigerant WT is guided along the wall surface of the side wall portion 302 (the surface orthogonal to the second direction). In the central heat sink portion 40, the refrigerant WT is guided along the wall surface of the side wall portion 402. In the downstream heat sink portion 50, the refrigerant WT is guided along the wall surface of the side wall portion 502.

[0070] Here, the flow of the refrigerant WT at the most downstream side in the first flow path 100B will be described in detail. Figure 6 It is a partial side cross-sectional view of a cooling device of a comparative example for comparison with the present embodiment. Figure 6 , the structure near the most downstream side of the first flow path 100B is shown. Figure 6 In the heat dissipation member shown, pin-shaped fins PF are used as the heat dissipation fins. A plurality of pin-shaped fins PF protrude in a columnar shape toward one side in the third direction from the base 2. The pin-shaped fins PF are accommodated in the first flow path 100B.

[0071] exist Figure 6 In the case of the structure shown, the refrigerant WT flowing toward one side of the first direction between the pin-shaped heat sinks PF flows from the first flow path 100B to one side of the third direction at the connection portion between the first flow path 100B and the second flow path 100C. As a result, the amount of refrigerant WT flowing to the downstream side end of the first flow path 100B is reduced. Therefore, the cooling performance of the semiconductor device 73B arranged on the other side of the third direction at the downstream side end is reduced. The semiconductor device 73B is arranged on the most downstream side of the plurality of semiconductor devices 71A and the like arranged along the first direction. That is, a problem arises in the cooling performance of the heat generating element on the most downstream side.

[0072] In contrast, in this embodiment, Figure 7 The structure shown. Figure 7 1 is a partial side cross-sectional view showing the structure of the most downstream side of the cooling device 150. Figure 7In the example shown, the end of the other side in the first direction of the semiconductor device 73B is located at the position P where the depth of the second flow path 100C begins to deepen on one side in the third direction. That is, from the position P where the second flow path 100C begins to extend on one side in the third direction, the heating element (semiconductor device 73B) is arranged at the most downstream side of the other side in the third direction of the base 2. In addition, the end of the other side in the first direction of the semiconductor device 73B may also be located at a position closer to the other side in the first direction or one side in the first direction than the position P. That is, at least a part of the heating element may be arranged at a position closer to one side in the first direction than the position P on the other side in the third direction of the base 2.

[0073] Furthermore, when viewed in the third direction, the connection surface CS where the second flow path 100C and the first flow path 100B are connected overlaps with the top plate portion 503. Figure 7 In the example shown, the top plate portion 503 extends from the connection surface CS to the other side in the first direction, and a portion of the top plate portion 503 overlaps with the connection surface CS. Alternatively, the top plate portion 503 may entirely overlap with the connection surface CS.

[0074] In other words, in the opposing region R that is opposed to the heat generating body (semiconductor device 73B) in the third direction in the downstream area of ​​the flow paths 100B and 100C, the depth of the liquid cooling jacket 100 increases in the third direction, and a top plate portion 503 is provided in at least a portion of the opposing region R.

[0075] By providing the top plate portion 503 in this way, the amount of refrigerant WT flowing out from the flow path formed between the heat sink portions 50 adjacent in the second direction to the second flow path 100C side can be suppressed, and the amount of refrigerant WT flowing to the downstream end of the first flow path 100B can be increased. Thus, the cooling performance of the semiconductor device 73B can be improved. In other words, the cooling performance of the heating element arranged on the most downstream side can be improved. In addition, according to this structure, the surface area of ​​the heat sink portion 50 can be increased, thereby improving the cooling performance.

[0076] <5. Conditions for effective cooling performance>

[0077] Here, conditions for more effectively exerting the cooling performance of the heat generating element (semiconductor device 73B) arranged on the most downstream side will be described.

[0078] First, use Figure 6 The cooling device shown in the figure without the pin-shaped heat sink PF having the top plate portion was simulated as follows. In the simulation, the first direction distance from the position P where the second flow path 100C starts to extend in the third direction to the position of the downstream side end of the semiconductor device 73B was set to L, and the first direction width of the heating element was set to W. The ratio calculated by (L / W)×100% was changed to simulate the temperature of the semiconductor device 71A and the like. The conditions of the heat input received by the semiconductor device were fixed.

[0079] exist Fig. 8A , 8B , 8C, and 8D show the results of the simulation. In the graph, the horizontal axis represents the positions of the semiconductor device 71A, etc. The position of the semiconductor device 71A on the most upstream side is set to 0, the position of the second semiconductor device 71B is set to "2nd", the position of the third semiconductor device 72A is set to "3rd", the position of the fourth semiconductor device 72B is set to "4th", the position of the fifth semiconductor device 73A is set to "5th", and the position of the sixth semiconductor device 73B is set to "6th". The interval between adjacent semiconductor devices is fixed. In addition, in the above graph, the vertical axis represents the temperature of the semiconductor device. In addition, in the above graph, the temperature is plotted without the semiconductor device 71A that is affected by the inflow of refrigerant from the inlet of the cooling device.

[0080] Fig. 8A , 8B 8C and 8D show the cases where the calculated ratios are 25%, 50%, 75% and 110%, respectively. Figures 8A to 8D Under any of the conditions, the temperature of the refrigerant increases as it moves toward the downstream side, so the temperatures of the second semiconductor device 71B (2nd) to the fifth semiconductor device 72A (5th) increase approximately in proportion. On the other hand, the temperature of the sixth semiconductor device 73B (6th) increases when the ratio is 25% ( Fig. 8A ), the deviation from the approximate proportional straight line is small, but when the above ratio is 50% or more ( Figure 8B to Figure 8D ), the deviation becomes significant. Figure 6 As described above, this separation is caused by the coolant flowing out from the pin fins PF to the second flow path 100C.

[0081] Therefore, even in Figure 7 In the cooling device 150 of the present embodiment shown in FIG. 1 , when (L / W)×100%≥50% holds, the cooling performance of the heat generating element (semiconductor device 73B) on the most downstream side can be more effectively exerted. Figure 7 In the example, L=W, and the above ratio is 100%.

[0082] In addition, Fig. 9The model of the cooling device shown in the figure is provided with a top plate T at one end of the pin-shaped heat sink PF in the third direction. In the simulation, the length Lop in the first direction from the one end of the top plate T in the first direction to the one end of the semiconductor device 73B in the first direction is changed to simulate the temperature of the semiconductor device 73B (heat generating element on the most downstream side). The length Lop corresponds to the length of the area of ​​the semiconductor device 73B not covered by the top plate T.

[0083] Fig.10 is a graph showing the results of the above simulation. Fig.10 In FIG. 1 , the temperature at the position of the semiconductor device 73B is plotted on the horizontal axis. The first direction width W of the semiconductor device 73B is set to 16 mm, and plotted under the conditions of Lop=6 mm, 8 mm, 12 mm, 16 mm, and when the top plate T is not provided.

[0084] like Fig.10 As shown in FIG. 1 , the temperature of the semiconductor device 73B has almost no difference until Lop=8 mm, but the temperature rises when Lop=8 mm. That is, the temperature rises under the condition of Lop>W / 2.

[0085] Based on this result, Figure 7 In the cooling device 150 of the present embodiment shown, if the following conditions are set: when observed in the third direction, the area of ​​the region where the top plate portion 503 does not overlap with the configuration area of ​​the heat generating element (semiconductor device 73B) is less than 50% of the area of ​​the heat generating element, the cooling performance of the above-mentioned heat generating element can be more effectively exerted.

[0086] <6. Modification of heat dissipation components>

[0087] As in the model used in the above-mentioned simulation, the heat sink is not limited to the heat sink plate, and for example, a pin-shaped heat sink may be used to constitute the heat sink member.

[0088] Fig.11 1 is a perspective view showing a structural example of a heat dissipation component using pin-shaped heat sinks. Fig.11 In the heat sink 1X shown, the pin-shaped heat sink PF protrudes in a columnar shape from the base 2 to one side in the third direction. The heat sink 10X is composed of a plurality of pin-shaped heat sinks PF. A top plate portion T is provided at one end of the heat sink 10X in the third direction. According to the cooling device constituted by providing such a heat sink 1X in a liquid cooling jacket, the cooling performance of the heat generating element disposed on the most downstream side of the other side in the third direction of the base 2 can also be improved.

[0089] <7. Spoiler>

[0090] like Figure 2As shown in FIG. 1 , the fin plate FP is provided with a spoiler 8. Here, the spoiler 8 will be described.

[0091] exist Figure 2 In the structure shown, a single spoiler plate having only one spoiler plate 8 is formed in the upstream fin section 30, and a double spoiler plate having two spoilers 8 is formed in addition to the single spoiler plate in the central fin section 40. Only a double spoiler plate is formed in the downstream fin section 50.

[0092] Fig.12 : is an enlarged stereoscopic view showing a structural example of a single spoiler. The through hole 80 penetrates the side wall portion 402 of the heat sink portion 40 in the second direction. The through hole 80 is rectangular. The through hole 80 has a pair of opposing sides 80A and 80B that are inclined to one side of the first direction and the other side of the third direction. The side 80A is located on the other side of the first direction than the side 80B. The spoiler 8 is formed by bending the side 80A to one side of the second direction. The through hole 80 and the spoiler 8 can be formed by making a cut on the side wall portion 402 and bending it.

[0093] The baffle plate 8 has an opposing surface 8S that is opposite to the flow direction of the refrigerant WT, that is, one side of the first direction. The baffle plate 8 has a function of blocking the flow of the refrigerant WT by using the opposing surface 8S. Turbulence of the refrigerant WT is easily generated near the opposing surface 8S, which can improve the cooling performance of the heat sink portion 30. In addition, the baffle plate 8 is inclined to one side of the first direction and the other side of the third direction. As a result, the baffle plate 8 can be used to guide the refrigerant WT to the side of the base 2, which can improve the cooling performance.

[0094] In addition, in a single spoiler, in addition to Fig.12 In addition to the structure shown, there is a structure in which the spoiler 8 is provided on the side 80B. In addition, in the double spoiler, the spoiler 8 is provided on both sides 80A and 80B.

[0095] As described above, the heat sink FP includes at least one spoiler 8 protruding from the side wall portion in the second direction. Turbulent flow is generated near the spoiler 8, and the cooling performance of the heat sink FP can be further improved.

[0096] In addition, if Figure 2 As shown, in the upstream heat sink portion 30, two single baffles, that is, two baffles 8 are provided. In the central heat sink portion 40, one single baffle and two double baffles are provided, and a total of five baffles 8 are provided. In the downstream heat sink portion 50, four double baffles are provided, and a total of eight baffles 8 are provided.

[0097] That is, the number of spoilers 8 included in each of the plurality of fin sections 30, 40, 50 arranged in the first direction increases as they are disposed toward the first direction. Thus, the cooling performance can be improved in the downstream fin section 50 that requires more cooling performance.

[0098] <8. Others>

[0099] The above describes the embodiments of the present invention. In addition, the scope of the present invention is not limited to the above embodiments. The present invention can be implemented by applying various changes to the above embodiments without departing from the gist of the invention. In addition, the matters described in the above embodiments can be appropriately combined arbitrarily within the scope of not causing contradictions.

[0100] The present invention can be used to cool various heat generating bodies.

[0101] Explanation of symbols

[0102] 1, 1X—heat dissipation component, 2—base, 3—upstream heat sink group, 3A, 3B—end heat sink group, 3C—recess, 4—central heat sink group, 5—downstream heat sink group, 8—baffle, 8S—opposing surface, 10, 10X—heat sink portion, 21—one side in the third direction, 22—the other side in the third direction, 30—upstream heat sink portion, 40—central heat sink portion, 50—downstream heat sink portion, 61, 62—connecting heat sink, 71A, 71B, 72A, 72B, 73A, 73B—semiconductor device, 80—through hole, 80A, 80B—edge, 100—liquid cooling jacket, 100A—inlet flow path, 100B—first flow path, 100C—second flow path, 100C1—first inclined wall, 100C2—second inclined portion, 100D—outlet flow path, 100S1—top surface, 100S2—other side surface in the third direction, 150—cooling device, 200—semiconductor module, 301—bottom plate portion, 302—side wall portion, 303—top plate portion, 304—cut-out portion, 401—bottom plate portion, 402—side wall portion, 403—top plate portion, 501—bottom plate portion, 502—side wall portion, 503—top plate portion, BT—bottom plate portion, CS—connecting surface, FP1—first heat sink, FP2—second heat sink, PF—pin-shaped heat sink, R—opposing area, T—top plate portion, WT—refrigerant.

Claims

1. A cooling device comprising a liquid cooling jacket and a heat dissipation component provided on the liquid cooling jacket, characterized in that: The heat dissipation component has: a plate-shaped base portion extending in a first direction along a direction in which the refrigerant flows and in a second direction orthogonal to the first direction, and having a thickness in a third direction orthogonal to the first direction and the second direction; at least one heat sink protruding from the base toward one side of the third direction; as well as a top plate portion, which is provided at one end portion of the at least one heat sink in the third direction, The liquid cooling jacket has: A first flow path, which is configured with the heat sink and the top plate and extends along a first direction; and a second flow path connected to the first flow path at a downstream side and extending from the first flow path to a third direction; When viewed in the third direction, a connection surface between the second flow path and the first flow path overlaps with the top plate portion. A heat generating element is disposed on the most downstream side of the base portion on the other side in the third direction from a position where the second flow path starts to extend in the first side in the third direction.

2. The cooling device according to claim 1, characterized in that: The heat sink includes: a flat side wall portion extending in the first direction and the third direction and having a thickness in the second direction; and the top plate portion formed by bending an end portion of the side wall portion on one side in the third direction toward the second direction.

3. The cooling device according to claim 2, characterized in that: The heat sink has at least one spoiler protruding from the side wall portion in the second direction.

4. The cooling device according to any one of claims 1 to 3, characterized in that: Assuming that the first direction distance from the position where the second flow path starts to extend in the third direction to the downstream end of the heating element is L, and the first direction width of the heating element is W, the following equation holds: (L / W)×100%≥50%.

5. The cooling device according to any one of claims 1 to 4, characterized in that: When viewed in the third direction, the area of ​​the region where the top plate portion does not overlap with the arrangement region of the heat generating element is 50% or less of the area of ​​the heat generating element.

6. The cooling device according to any one of claims 1 to 5, characterized in that: Taking the downstream side of the refrigerant flow as one side in the first direction, the second flow path has at least one of a first inclined wall inclined toward one side in the first direction and one side in the third direction and a second inclined wall inclined toward the other side in the first direction and one side in the third direction.

7. A cooling device comprising a liquid cooling jacket and a heat dissipation component, characterized in that: The heat dissipation component has: a plate-shaped base portion extending in a first direction along a direction in which the refrigerant flows and in a second direction orthogonal to the first direction, and having a thickness in a third direction orthogonal to the first direction and the second direction; at least one heat sink protruding from one side of the base portion facing the third direction; as well as a top plate portion, which is provided at one end portion of the at least one heat sink in the third direction, A heating element is arranged on the other side of the base. The refrigerant flows from the other side of the first direction to the one side of the first direction in the flow path formed by the liquid cooling jacket and the heat dissipation component. In a region facing the heat generating element in a downstream region of the flow path in a third direction, the depth of the liquid cooling jacket increases in the third direction. The top plate portion is provided in at least a portion of the facing region.

8. A heat dissipation component, arranged on a liquid cooling jacket, characterized in that: have: a plate-like base portion extending in a first direction along a direction in which the refrigerant flows and in a second direction orthogonal to the first direction, and having a thickness in a third direction orthogonal to the first direction and the second direction; at least one heat sink protruding from the base toward one side of the third direction; as well as a top plate portion, which is provided at one end portion of the at least one heat sink in the third direction, The liquid cooling jacket has: A first flow path, which is configured with the heat sink and the top plate and extends along a first direction; and a second flow path connected to the first flow path at a downstream side and extending from the first flow path to one side in a third direction, When viewed in the third direction, a connection surface between the second flow path and the first flow path overlaps with the top plate portion. A heat generating element is disposed on the most downstream side of the base portion on the other side in the third direction from a position where the second flow path starts to extend in the first side in the third direction.

9. A semiconductor module, characterized in that: The invention comprises: the heat dissipation component according to claim 8; and a semiconductor device as the heat generating body.

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