Laser cutting method for electronic paper diaphragm
By setting the cutting start and end point between the cutting point and the completion path by the laser cutting process of the electronic paper film, and ensuring that the cut path is not intersecting or the curve path is overlap, the cutting edges and short circuit problems are solved, and the product has improved the product. The display effect and good product rate.
Patent Information
- Application Number
- CN202411486519.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-01-24
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
During the laser slitting process of electronic paper diaphragm, the cutting edge is prone to refolding and conductive dust particles, resulting in short circuits in contact with the substrate, and the product displays a different color, affecting the yield of the finished product.
Maintain a certain distance by cutting the cutting path at the starting point and ending point, and ensure that the cutting path does not intersect with the completion path, or re -converges to the curve segment in the curve cutting path to avoid serious secondary ablation and sintering.
Effectively avoid reflux and conductive dust particles at the edge of the cutting edges, prevent short circuit with the substrate, improve the sintering state, and ensure the product display effect and good product rate.
Smart Images
Figure CN119347147A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic paper display manufacturing, and in particular to a laser cutting method for an electronic paper film. Background Art
[0002] According to the production process of electronic paper modules, the electronic paper film needs to be cut into small pieces of different sizes by laser, and then bonded to the substrate. After bonding, the conductive layer of the electronic paper film is connected to the electrodes of the substrate through silver dots. The product is given different voltages through the chip to form different electric fields to drive the particles inside the electronic paper film to float up and down to achieve different display effects.
[0003] When the electronic paper film is cut into small pieces by laser, there is a delay between the starting point and the end point of the laser, and the electronic paper film is severely sintered at the starting point and the end point, resulting in folding and conductive dust particles.
[0004] When operating narrow-frame products, the folded edges or the contact of conductive dust particles with the substrate surface will cause a short circuit between the electronic paper film and the substrate, resulting in different colors on the product display, which may further cause batch defects and affect the yield of finished products. Summary of the invention
[0005] The purpose of the present invention is to provide a laser cutting method for an electronic paper film, which is used to solve the problem of edge folding or conductive dust particles contacting a substrate causing a short circuit between the electronic paper film and the substrate when laser cutting small pieces of electronic paper film, thereby avoiding the product display of different colors and ensuring the yield rate.
[0006] To achieve this object, the present invention adopts the following technical solutions:
[0007] The laser cutting method of the electronic paper film comprises:
[0008] The cutting start point and the cutting end point both maintain a first distance from the completed first cutting path, the first distance is not equal to, and the subsequent cutting path of the cutting start point and the previous cutting path of the cutting end point do not intersect with the completed first cutting path, and the first cutting path is a straight line; or,
[0009] The cutting start point and the cutting end point both overlap with the completed second cutting path at a first overlap point, the second cutting path includes a first line segment, the first line segment is in a curved state, and the first overlap point is located on the first line segment.
[0010] As an optional solution of the laser cutting method of an electronic paper film, the subsequent cutting path of the cutting starting point includes a second line segment close to the cutting starting point, and the second line segment is a straight line.
[0011] As an optional solution of the laser cutting method of an electronic paper film, the subsequent cutting path of the cutting starting point includes a third line segment close to the cutting starting point, and the third line segment is in a curved state.
[0012] As an optional solution of the laser cutting method of an electronic paper film, the third line segment is in the shape of a 1 / 4 arc.
[0013] As an optional solution of the laser cutting method of an electronic paper film, the cutting path before the cutting end point includes a fourth line segment close to the cutting end point, and the fourth line segment is in a straight line state.
[0014] As an optional solution of the laser cutting method of an electronic paper film, the cutting path before the cutting end point includes a fifth line segment close to the cutting end point, and the fifth line segment is in a curved state.
[0015] As an optional solution of the laser cutting method of an electronic paper film, the fifth line segment is in the shape of a 1 / 4 circular arc.
[0016] As an optional solution of the laser cutting method of an electronic paper film, the first line segment is in the shape of a 1 / 2 arc.
[0017] Beneficial effects:
[0018] In the present invention, when the first cutting path is in a straight line state, by keeping the first distance between the cutting starting point and the completed first cutting path, that is, maintaining a certain gap between the cutting starting point and the completed first cutting path; by keeping the first distance between the cutting end point and the completed first cutting path, that is, maintaining a certain gap between the cutting end point and the completed first cutting path, secondary ablation will not occur in the same cutting area, thereby avoiding severe ablation resulting in back-bending and conductive dust particles, and improving the sintering state; by making the subsequent cutting path of the cutting starting point and the previous cutting path of the cutting end point not intersect with the completed first cutting path, it is ensured that the subsequent cutting path of the cutting starting point and the previous cutting path of the cutting end point are completely located on one side of the completed first cutting path. Furthermore, when the completed second cutting path is a curve, the length of the curve is longer than that of the straight line at the same point. By making the cutting starting point and the cutting end point coincide with the completed second cutting path at the first coincidence point, and the first coincidence point is located on the curved first line segment, the effect of delayed sintering can be achieved at the first coincidence point, thereby avoiding severe sintering that leads to back-bending and conductive dust particles, thereby avoiding the problem of short circuit between the electronic paper membrane and the substrate, and ensuring the product display effect and yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1is a schematic diagram of a path provided by an embodiment of the present invention, in which the cutting starting point and the cutting end point are both straight lines and are relative to the first cutting path;
[0020] Figure 2 yes Figure 1 A local enlarged view at point A;
[0021] Figure 3 yes Figure 1 A local enlarged view at point B;
[0022] Figure 4 is a schematic diagram of a path provided by an embodiment of the present invention, in which both the cutting starting point and the cutting end point are curved and relative to the first cutting path;
[0023] Figure 5 yes Figure 4 A local enlarged view at C;
[0024] Figure 6 is a schematic diagram of a path in which a cutting starting point coincides with a second cutting path provided by an embodiment of the present invention;
[0025] Figure 7 It is a schematic diagram of a path in which a cutting end point coincides with a second cutting path provided by an embodiment of the present invention.
[0026] In the figure:
[0027] 100, cutting starting point; 110, subsequent cutting path of the cutting starting point; 111, second line segment; 112, third line segment;
[0028] 200, cutting end point; 210, previous cutting path of the cutting end point; 211, fourth line segment; 212, fifth line segment;
[0029] 300, first cutting path;
[0030] 400, second cutting path; 410, first line segment; 411, first coincidence point. DETAILED DESCRIPTION
[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0032] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0033] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0034] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0035] Please see attached Figure 1 -Attached Figure 7 , the present embodiment relates to a laser cutting method for an electronic paper film (hereinafter referred to as the "method"), the method comprising a cutting starting point 100 and a cutting end point 200, wherein the cutting starting point 100 and the cutting end point 200 both maintain a first distance from the completed first cutting path 300, the first distance is not equal to 0, and the subsequent cutting path 110 of the cutting starting point and the previous cutting path 210 of the cutting end point do not intersect with the completed first cutting path 300, and the first cutting path 300 is a straight line; or, the cutting starting point 100 and the cutting end point 200 both overlap with the completed second cutting path 400 at a first overlap point 411, the second cutting path 400 includes a first line segment 410, the first line segment 410 is in a curved state, and the first overlap point 411 is located on the first line segment 410.
[0036] This embodiment is directed to the problem that when cutting small pieces of electronic paper film using a laser cutting method, the electronic paper film is severely sintered at the cutting starting point 100 and the cutting end point 200, resulting in folding and conductive dust particles. In narrow-frame products, the folded edges or the conductive dust particles contact the substrate surface, causing a short circuit between the electronic paper film and the substrate, and the product display screen is discolored, which may further cause batch defects and affect the yield of finished products.
[0037] When the first cutting path 300 is in a straight line state, by making the cutting starting point 100 maintain a first distance from the completed first cutting path 300, that is, maintaining a certain gap between the cutting starting point 100 and the completed first cutting path 300; by making the cutting end point 200 maintain a first distance from the completed first cutting path 300, that is, maintaining a certain gap between the cutting end point 200 and the completed first cutting path 300; secondary ablation will not occur in the same cutting area, thereby avoiding severe ablation resulting in back-bending and conductive dust particles, and improving the sintering state; by making the subsequent cutting path 110 of the cutting starting point and the previous cutting path 210 of the cutting end point not intersect with the completed first cutting path 300, thereby ensuring that the subsequent cutting path 110 of the cutting starting point and the previous cutting path 210 of the cutting end point can be completely located on one side of the completed first cutting path 300.
[0038] In this embodiment, the first distance can be determined according to the accuracy of laser cutting and the situation where the electronic paper film is located at a certain position and mechanical force is used to separate the film.
[0039] Furthermore, when the completed second cutting path 400 is a curve, the length of the curve is longer than that of the straight line at the same point. The cutting starting point 100 and the cutting end point 200 both overlap with the completed second cutting path 400 at the first overlapping point 411, and the first overlapping point 411 is located on the curved first line segment 410. The effect of delayed sintering can be achieved at the first overlapping point 411, thereby avoiding severe sintering that causes back bending and conductive dust particles, and further avoiding the problem of short circuit between the electronic paper film and the substrate, thereby ensuring the product display effect and yield rate.
[0040] Please see attached Figure 2 and attached Figure 3 Optionally, the subsequent cutting path 110 of the cutting starting point includes a second line segment 111 close to the cutting starting point 100, and the second line segment 111 is in a straight line state.
[0041] In this embodiment, the subsequent cutting path 110 along the cutting starting point is a straight line, that is, a certain gap is maintained between the straight line path and the completed first cutting path 300 , thereby improving the delayed sintering state of the cutting starting point 100 .
[0042] Please see attached Figure 4 and attached Figure 5 Optionally, the subsequent cutting path 110 of the cutting starting point includes a third line segment 112 close to the cutting starting point 100, and the third line segment 112 is in a curved state.
[0043] In this embodiment, the subsequent cutting path 110 along the cutting starting point is a curve, which not only maintains a certain gap with the completed first cutting path 300 through the curved path, but also extends the sintering distance of the cutting starting point 100 through the curved path, thereby improving the sintering state.
[0044] Furthermore, the third line segment 112 is in the shape of a 1 / 4 arc.
[0045] In this embodiment, by keeping the third line segment 112 in an arc shape and a 1 / 4 segment, the subsequent right-angle transition of the cutting path can be well achieved, thereby adapting to the square structure of the electronic paper film after cutting.
[0046] Please see attached Figure 3 Optionally, the previous cutting path 210 of the cutting end point includes a fourth line segment 211 close to the cutting end point 200, and the fourth line segment 211 is in a straight line state.
[0047] By making the previous cutting path 210 of the cutting end point include a fourth line segment 211 close to the cutting end point 200, and the fourth line segment 211 remains in a straight line state, it is possible to ensure that a certain gap is maintained between the cutting end point 200 and the completed first cutting path 300, thereby avoiding secondary ablation of the cutting end point 200 and improving the delayed sintering state of the cutting starting point 100.
[0048] Please see attached Figure 4 and attached Figure 5 Further, the previous cutting path 210 of the cutting end point includes a fifth line segment 212 close to the cutting end point 200, and the fifth line segment 212 is in a curve state.
[0049] The end of the previous cutting path 210 at the cutting end point is in a curved state, which not only maintains a certain gap with the completed first cutting path 300 through the curved path, but also extends the sintering distance of the cutting end point 200 through the curved path, thereby improving the sintering state.
[0050] Furthermore, the fifth line segment 212 is in the shape of a 1 / 4 arc.
[0051] By keeping the fifth line segment 212 in an arc shape and a 1 / 4 segment, the subsequent right-angle transition of the cutting path can be well achieved, thereby adapting to the square structure of the electronic paper film after cutting.
[0052] Please see attached Figure 6 and attached Figure 7Optionally, the first line segment 410 is in the shape of a 1 / 2 segment of an arc.
[0053] The first line segment 410 is assumed to be the middle end of a straight line path at both ends. The first line segment 410 is in the shape of a semicircle. The cutting start point 100 and the cutting end point 200 can coincide with each other at any position of the first line segment 410. Exemplarily, the first coincidence point 411 is formed in the middle part of the first line segment 410.
[0054] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.
Claims
1. A laser cutting method for an electronic paper film, characterized in that: include: The cutting start point (100) and the cutting end point (200) both maintain a first distance from the completed first cutting path (300), the first distance is not equal to 0, and the subsequent cutting path (110) of the cutting start point and the previous cutting path (210) of the cutting end point do not intersect with the completed first cutting path (300), and the first cutting path (300) is a straight line; or, The cutting start point (100) and the cutting end point (200) both overlap with the completed second cutting path (400) at a first overlap point (411); the second cutting path (400) comprises a first line segment (410); the first line segment (410) is in a curved state; and the first overlap point (411) is located on the first line segment (410).
2. The laser cutting method of the electronic paper film according to claim 1, characterized in that: The subsequent cutting path (110) of the cutting starting point comprises a second line segment (111) close to the cutting starting point (100), and the second line segment (111) is in a straight line state.
3. The laser cutting method of electronic paper film according to claim 1, characterized in that: The subsequent cutting path (110) of the cutting starting point comprises a third line segment (112) close to the cutting starting point (100), and the third line segment (112) is in a curved state.
4. The laser cutting method of the electronic paper film according to claim 3, characterized in that: The third line segment (112) is in the shape of a 1 / 4 arc.
5. The laser cutting method of electronic paper film according to claim 1, characterized in that: The previous cutting path (210) of the cutting end point includes a fourth line segment (211) close to the cutting end point (200), and the fourth line segment (211) is in a straight line state.
6. The laser cutting method of the electronic paper film according to claim 5, characterized in that: The previous cutting path (210) of the cutting end point includes a fifth line segment (212) close to the cutting end point (200), and the fifth line segment (212) is in a curved state.
7. The laser cutting method of electronic paper film according to claim 6, characterized in that: The fifth line segment (212) is in the shape of a 1 / 4 arc.
8. The laser cutting method of electronic paper film according to claim 1, characterized in that: The first line segment (410) is in the shape of a 1 / 2 segment of an arc.