Lightweight waveguide sheet processing technology and laser cutting workbench thereof

Abstract

The invention discloses a lightweight waveguide sheet processing technology and a laser cutting workbench thereof, and relates to the technical field of waveguide sheet processing, the technology comprises the following steps: firstly, cleaning the surface of a waveguide sheet to be processed so as to keep the surface of the waveguide sheet to be processed clean; placing and fixing the cleaned waveguide sheet on a laser cutting workbench; cutting the waveguide sheet by using a laser cutting technology; and after laser cutting is completed on the waveguide sheet, the flatness of the surface of the cut waveguide sheet is inspected through a flatness inspection tester, and secondary machining is conducted on the waveguide sheet with the error exceeding + / -0.05 mm. When the laser cutting technology is used for cutting the waveguide sheet, the cutting effect is better, in the cutting process, the laser cutting speed is higher, and the probability of waveguide sheet defective products in the cutting process can be reduced. And meanwhile, unqualified waveguide sheets are managed and controlled, and defective products are subjected to secondary processing, so that the yield of cutting the waveguide sheets is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of waveguide processing, and in particular to a lightweight waveguide processing technology and a laser cutting workbench thereof. Background Art

[0002] The existing waveguide processing technology mainly includes laser cutting technology and laser splitting technology, so as to realize the cutting and splitting operations of diffraction optical waveguides (such as high refractive index glass). During the processing, the waveguide needs to be placed on a cutting workbench for processing.

[0003] With respect to the above-mentioned related technologies, the inventors believe that the following defects exist: when cutting waveguide sheets, laser vaporization is mostly used for cutting. When using laser cutting, due to the low power of laser cutting, the probability of defective products appearing during cutting is high, and when defective products appear, the secondary processing capability of the defective products is low, thereby reducing the yield of the cut products. Summary of the invention

[0004] The purpose of the present invention is to provide a lightweight waveguide processing technology and a laser cutting workbench thereof, wherein the waveguide is cut by high-power laser cutting technology, and the high-power cutting effect is high during cutting, and the cutting speed of the high-power laser is fast during the cutting process, thereby reducing the probability of defective products in the cutting process. At this time, the high-power laser has high cutting accuracy, and the defective products can be processed twice, thereby improving the yield rate of the cut waveguide.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a lightweight waveguide sheet processing process, comprising the following steps: first, cleaning the surface of the waveguide sheet to be processed to make the surface of the waveguide sheet to be processed clean; placing and fixing the cleaned waveguide sheet on a laser cutting workbench; cutting the waveguide sheet using laser cutting technology; after the waveguide sheet is cut using laser cutting, checking the surface flatness of the cut waveguide sheet using a flatness inspection instrument, and repeating the step of cutting the waveguide sheet using laser cutting technology for waveguide sheets with an error exceeding ±0.05 mm until the error does not exceed ±0.05 mm.

[0006] Preferably, when the waveguide is cut by laser, the laser used is a femtosecond laser; when the waveguide is cut by using the femtosecond laser, the femtosecond laser can emit 0.00025 joules of energy within 1 femtosecond.

[0007] Preferably, when using a femtosecond laser to cut a waveguide, the femtosecond laser can focus energy in a circular space with a diameter of 0.06mm; when repeating the step of cutting the waveguide using the laser cutting technology for a waveguide with an error exceeding ±0.05mm, the femtosecond laser focuses energy in a circular space with a diameter of 0.06mm, and repeats the step of cutting the waveguide using the laser cutting technology for a waveguide with an error exceeding ±0.05mm until the error does not exceed ±0.05mm.

[0008] Preferably, during the process of cutting the waveguide using a femtosecond laser, nitrogen is added to assist the femtosecond laser in cutting the waveguide, so that during the process of cutting the waveguide, the femtosecond laser releases nitrogen to form protection around the waveguide.

[0009] Preferably, when cleaning the surface of the waveguide sheet to be processed, the waveguide sheet is first placed in water for a first cleaning;

[0010] After the first cleaning is completed, the waveguide is cleaned for the second time using ultrasonic waves.

[0011] The present application also discloses a laser cutting workbench for processing lightweight waveguide sheets, the laser cutting workbench for processing lightweight waveguide sheets is used for the lightweight waveguide sheet processing process as mentioned above, the laser cutting workbench comprises a base, the upper surface of the base is provided with a rotating groove, a rotating ball is rotatably arranged in the rotating groove; a workbench body, the workbench body is installed on the upper surface of the base, the bottom surface of the workbench body and the upper surface of the rotating ball are fixed to each other; the upper surface of the workbench body is provided with a mounting groove, a mounting piece is installed in the mounting groove, and a through hole is penetrated through the upper surface of the mounting piece; a vacuum generating device, the vacuum generating device is installed on the workbench body, and is used to fix the waveguide sheet on the mounting piece.

[0012] Preferably, an air inlet is provided on the side wall of the workbench body, a throttling groove is provided on the inner wall of the air inlet, an enlargement groove is penetrated through the inner wall of the throttling groove away from the air inlet, a suction groove is penetrated through the inner top wall of the enlargement groove, and the suction groove is opposite to the through hole; the vacuum generating device includes an air inlet joint installed in the air inlet and an air outlet pipe installed in the enlargement groove; a sealing gasket is fixedly provided on the inner bottom wall of the mounting groove, an exhaust hole is penetrated through the upper surface of the sealing gasket, the exhaust hole is opposite to the through hole and the suction groove, and the upper surface of the sealing gasket abuts against the bottom surface of the mounting member.

[0013] Preferably, a silencer is installed at one end of the air outlet pipe away from the air inlet joint, and a plurality of silencer cavities are opened in the silencer; connecting holes are opened through the inner walls of the plurality of silencer cavities, and the axes of the plurality of connecting holes coincide with each other.

[0014] Preferably, a first fixing groove is provided on the inner wall of the installation groove, a second fixing groove is provided on the outer wall of the installation piece, a rotating groove is provided through the inner top wall of the first fixing groove, and the first fixing groove is directly opposite to the second fixing groove; a rotating rod is rotatably arranged in the rotating groove, a fixing piece is sleeved on the outer wall of the rotating rod, and the fixing piece and the rotating rod are fixed to each other; a rubber sleeve is fixedly provided on the inner wall of the rotating groove, and the rotating rod is rotatably connected to the rubber sleeve.

[0015] Preferably, a first fixing hole is provided on the inner wall of the second fixing groove, and a second fixing hole is provided on the outer wall of the fixing piece, and the first fixing hole is opposite to the second fixing hole; a fixing rod is slidably arranged in the first fixing hole, and the fixing rod is slidably connected to the second fixing hole, and a first spring is fixedly arranged on the side wall of the fixing rod away from the second fixing hole, and the other end of the first spring is fixedly arranged on the inner wall of the first fixing hole, and an end of the fixing rod away from the first spring is provided with a rounded corner; a rotating hole is provided on the bottom surface of the rotating rod, and a semicircular piece is fixedly arranged on the inner bottom wall of the first fixing groove, and the semicircular piece is rotatably connected to the rotating hole; a limiting baffle is fixedly arranged on the inner wall of the rotating hole, and the side wall of the limiting baffle abuts against the side wall of the semicircular piece.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] When the waveguide is cut by laser cutting technology, the cutting effect is better, and during the cutting process, the laser cutting speed is faster, which can reduce the probability of defective waveguides in the cutting process. At the same time, unqualified waveguides are controlled and defective products are processed again, thereby improving the yield of cut waveguides. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of a flow chart of an embodiment of the present invention;

[0019] Figure 2 is a schematic diagram of the overall structure of an embodiment of the present invention;

[0020] Figure 3 It is a structural schematic diagram of a workbench body and a mounting member in an embodiment of the present invention;

[0021] Figure 4 is a schematic cross-sectional structure diagram of a base and a workbench body in an embodiment of the present invention;

[0022] Figure 5 yes Figure 4 A is a schematic diagram of the enlarged structure of the middle part;

[0023] Figure 6 yes Figure 4 Schematic diagram of the enlarged structure of B;

[0024] Figure 7 is a schematic structural diagram of a rotating rod and a fixing member in an embodiment of the present invention;

[0025] Figure 8 is a schematic structural diagram of a rotating rod and a semicircular member in an embodiment of the present invention;

[0026] Fig. 9 Schematic diagram of the waveguide processing technology in the embodiment of the present invention.

[0027] In the figure: 1. base; 11. rotating groove; 12. rotating ball; 13. workbench body; 14. mounting groove; 15. mounting piece; 16. through hole; 2. vacuum generator; 21. air inlet joint; 22. air outlet pipe; 23. air inlet; 24. throttling groove; 25. amplifying groove; 26. suction groove; 3. silencer; 31. silencer chamber; 32. connecting hole; 4. first fixed groove; 41. second fixed groove; 42. rotating groove; 43. rotating rod; 44. fixing piece; 5. first fixing hole; 51. second fixing hole; 52. fixing rod; 53. first spring; 6. rotating hole; 61. semicircular piece; 62. limit baffle; 7. sealing pad; 71. exhaust hole; 8. rubber sleeve. DETAILED DESCRIPTION

[0028] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. The following describes various embodiments of the present invention in detail in conjunction with the drawings.

[0029] See also Figure 1 and Fig. 9 The present invention preferably provides a technical solution: a lightweight waveguide processing process, the steps are as follows:

[0030] S100, first cleaning the surface of the waveguide plate to be processed so as to keep the surface of the waveguide plate to be processed clean;

[0031] S200, placing the cleaned waveguide sheet on a laser cutting workbench, and then fixing the cleaned waveguide sheet on the laser cutting workbench;

[0032] S300, after the waveguide is fixed on the laser cutting workbench, the waveguide is cut using laser cutting technology;

[0033] S400, after the waveguide is cut by laser, the surface flatness of the cut waveguide is checked by a flatness checker, and the waveguide with an error exceeding ±0.05mm is cut by repeating the steps of cutting the waveguide using the laser cutting technology until the error does not exceed ±0.05mm.

[0034] In this embodiment, when the waveguide is cut by laser cutting technology, the cutting effect is better, and during the cutting process, the laser cutting speed is faster, which can reduce the probability of defective waveguides in the cutting process. At the same time, unqualified waveguides are controlled, and the step of cutting the waveguide using laser cutting technology is repeated for the defective products until the error does not exceed ±0.05mm, thereby improving the yield rate of cut waveguides.

[0035] It is worth mentioning that when a high-power laser is used to cut a defective waveguide, the waveguide can be slightly trimmed, thereby making the unevenly cut defective product smooth.

[0036] The present invention uses high-power laser cutting technology to cut the waveguide sheet. During cutting, the high-power cutting effect is high, and during the cutting process, the high-power laser has a fast cutting speed, thereby reducing the probability of defective products in the cutting process. At this time, the high-power laser has high cutting accuracy, and the step of cutting the waveguide sheet using the laser cutting technology can be repeated for the defective products until the error does not exceed ±0.05mm, thereby improving the yield rate of the cut waveguide sheet.

[0037] Furthermore, when the waveguide is cut by laser, the laser used is a femtosecond laser; when the waveguide is cut by using the femtosecond laser, the femtosecond laser can emit 0.00025 joules of energy within 1 femtosecond.

[0038] Combination Fig. 9 As shown, when cutting the waveguide, a femtosecond laser is used for cutting. When in use, the femtosecond laser can emit 0.00025 joules of energy within 1 femtosecond. Due to its characteristic of being able to burst out high power in a short period of time, the cutting speed is relatively fast during the cutting process. In addition, due to the high power, the cutting surface is guaranteed to be flat when the waveguide is cut, thereby reducing the probability of defective products during cutting.

[0039] Furthermore, when using a femtosecond laser to cut a waveguide, the femtosecond laser can focus energy in a circular space with a diameter of 0.06mm; when the step of using the laser cutting technology to cut the waveguide is repeated for unqualified waveguides until the error does not exceed ±0.05mm, the femtosecond laser will focus energy in a circular space with a diameter of 0.06mm, and the step of using the laser cutting technology to cut the waveguide is repeated for unqualified waveguides until the error does not exceed ±0.05mm.

[0040] like Fig. 9 As shown, when performing a second cutting on an unqualified waveguide, the staff can focus the energy of the femtosecond laser in a circular space with a diameter of 0.06mm, and then repeat the steps of cutting the waveguide using laser cutting technology on the waveguide with an uneven cutting surface until the error does not exceed ±0.05mm, and the uneven cutting surface is cut flat.

[0041] Furthermore, in the process of using a femtosecond laser to cut the waveguide, nitrogen is added to assist the femtosecond laser in cutting the waveguide, so that the femtosecond laser releases nitrogen to form protection around the waveguide during the process of cutting the waveguide.

[0042] like Fig. 9 As shown, nitrogen is added during the cutting process to assist in cutting, which will form protection around the waveguide during cutting. Since nitrogen has good anti-oxidation function, the probability of the waveguide being oxidized during cutting is guaranteed, thereby reducing the probability of an oxide film forming on the cutting surface.

[0043] Furthermore, when cleaning the surface of the waveguide to be processed, the waveguide is first placed in water for a first cleaning; after the first cleaning is completed, the lightweight waveguide is secondarily cleaned by ultrasonic means.

[0044] like Fig. 9 As shown in the figure, when cleaning the waveguide, first use a cleaning method to clean the impurities on the surface of the lightweight waveguide. Then, the cleaned waveguide is ultrasonically cleaned. Through ultrasonic cleaning, the ultrasonic waves are radiated forward in the water in a sparse and dense manner, generating overpressure and negative pressure, and bubbles at the same time, which then make the bubbles vibrate on the waveguide, enhancing the cleaning effect and achieving deep cleaning.

[0045] See also Figure 2-7The embodiment of the present application also discloses a lightweight waveguide laser cutting workbench, the laser cutting workbench for lightweight waveguide processing is used for the lightweight waveguide processing process as mentioned above, the laser cutting workbench includes a base 1, the upper surface of the base 1 is provided with a rotating groove 11, and a rotating ball 12 is rotatably arranged in the rotating groove 11; a workbench body 13, the workbench body 13 is installed on the upper surface of the base 1, and the bottom surface of the workbench body 13 and the upper surface of the rotating ball 12 are fixed to each other; the upper surface of the workbench body 13 is provided with a mounting groove 14, and a mounting member 15 is installed in the mounting groove 14, and a through hole 16 is opened through the upper surface of the mounting member 15; a vacuum generating device 2, the vacuum generating device 2 is installed on the workbench body 13, and is used to fix the waveguide on the mounting member 15.

[0046] When the staff needs to cut the waveguide sheet, the staff needs to place the waveguide sheet on the mounting member 15. Then, the staff needs to start the vacuum generating device 2 to adsorb the waveguide sheet on the surface of the mounting member 15. At this time, the staff cuts the waveguide sheet, and when the cutting is completed, the staff turns off the vacuum generating device 2 and removes the waveguide sheet from the mounting member 15.

[0047] Furthermore, an air inlet 23 is provided on the side wall of the workbench body 13, a throttling groove 24 is provided on the inner wall of the air inlet 23, an enlargement groove 25 is penetrated through the inner wall of the throttling groove 24 away from the air inlet 23, a suction groove 26 is penetrated through the inner top wall of the enlargement groove 25, and the suction groove 26 is opposite to the through hole 16; the vacuum generating device 2 includes an air inlet joint 21 installed in the air inlet 23 and an air outlet pipe 22 installed in the enlargement groove 25; a sealing gasket 7 is fixedly provided on the inner bottom wall of the mounting groove 14, an exhaust hole 71 is penetrated through the upper surface of the sealing gasket 7, the exhaust hole 71 is opposite to the through hole 16 and the suction groove 26, and the upper surface of the sealing gasket 7 abuts against the bottom surface of the mounting member 15.

[0048] like Figure 2-4As shown, when the staff needs to adsorb the waveguide sheet on the mounting member 15, the staff needs to connect it with the air compressor through the air inlet connector 21. Subsequently, the staff starts the air compressor, and the compressed air generated by the air compressor enters the air inlet 23 through the air inlet connector 21, enters the throttling groove 24 through the air inlet 23, and then enters the amplifying groove 25 through the throttling groove 24, and finally is discharged through the air outlet pipe 22. In this process, it can be seen from the figure that the diameter of the throttling groove 24 is smaller than the diameter of the amplifying groove 25, which leads to the process in which the compressed air ejected from the throttling groove 24 enters the amplifying groove 25. Due to the instantaneous decrease in pressure, the flow rate of the air around the suction groove 26 is driven. Under the action of gas viscosity, the high-speed flowing compressed air sucks away the air around the suction groove 26. Since the suction groove 26 is directly opposite to the through hole 16, the air in the through hole 16 is also sucked away. At this time, the waveguide sheet on the surface of the mounting member 15 is adsorbed on the surface of the mounting member 15. In addition, the sealing gasket 7 reduces the probability of air leakage in the suction groove 26 and the through hole 16, thereby improving the sealing performance of the device.

[0049] Furthermore, a silencer 3 is installed at one end of the air outlet pipe 22 away from the air inlet connector 21, and a plurality of silencer cavities 31 are opened in the silencer 3; connection holes 32 are opened through the inner walls of the plurality of silencer cavities 31, and the axes of the plurality of connection holes 32 coincide with each other.

[0050] like Figure 2-4 As shown, when the flowing gas flows into the silencer 3 from the outlet pipe 22, a plurality of silencer cavities 31 are formed inside the silencer 3 under the action of the baffle plate, so that the gas is blocked by the baffle plates layer by layer and continuously reflected in the silencer cavities 31, so that the flow rate of the gas is weakened. When the gas flows out of the silencer 3, the flow rate of the gas is reduced, and the noise generated is also reduced, thereby reducing the probability of excessive noise during use.

[0051] Furthermore, a first fixed groove 4 is provided on the inner wall of the mounting groove 14, a second fixed groove 41 is provided on the outer wall of the mounting member 15, a rotating groove 42 is provided through the inner top wall of the first fixed groove 4, and the first fixed groove 4 is directly opposite to the second fixed groove 41; a rotating rod 43 is rotatably provided in the rotating groove 42, a fixing member 44 is sleeved on the outer wall of the rotating rod 43, and the fixing member 44 and the rotating rod 43 are fixed to each other; a rubber sleeve 8 is fixedly provided on the inner wall of the rotating groove 42, and the rotating rod 43 is rotatably connected to the rubber sleeve 8.

[0052] like Figure 2 , 4As shown in FIGS. 5 and 7, when the mounting member 15 is damaged after long-term use, the staff needs to replace the mounting member 15. At this time, the staff needs to rotate the rotating rod 43, so that the fixing member 44 rotates under the action of the rotating rod 43, so that the fixing member 44 rotates into the first fixing groove 4, and then the fixing member 44 and the second fixing groove 41 are separated from each other. At this time, the staff can take the mounting member 15 out of the mounting groove 14. Subsequently, when a new mounting member 15 needs to be installed, the staff places the mounting member 15 in the mounting groove 14 so that the first fixing groove 4 and the second fixing groove 41 are directly opposite. At this time, the staff rotates the rotating rod 43, so that the fixing member 44 rotates with the rotating rod 43, so that the fixing member 44 rotates into the second fixing groove 41, and then the fixing member 44 is fixed in the second fixing groove 41. In addition, rubber has good elasticity, and the rubber sleeve 8 made of rubber material increases the upper limit of the maximum static friction between the rotating rod 43 and the rotating groove 42, thereby reducing the probability of shaking of the rotating rod 43 when subjected to external force, thereby improving the stability of the device.

[0053] Furthermore, a first fixing hole 5 is provided on the inner wall of the second fixing groove 41, and a second fixing hole 51 is provided on the outer wall of the fixing piece 44, and the first fixing hole 5 is directly opposite to the second fixing hole 51; a fixing rod 52 is slidably arranged in the first fixing hole 5, and the fixing rod 52 is slidably connected to the second fixing hole 51, and a first spring 53 is fixedly arranged on the side wall of the fixing rod 52 away from the second fixing hole 51, and the other end of the first spring 53 is fixedly arranged on the inner wall of the first fixing hole 5, and the end of the fixing rod 52 away from the first spring 53 is provided with a rounded corner; a rotating hole 6 is provided on the bottom surface of the rotating rod 43, and a semicircular piece 61 is fixedly arranged on the inner bottom wall of the first fixing groove 4, and the semicircular piece 61 is rotatably connected to the rotating hole 6; a limiting baffle 62 is fixedly arranged on the inner wall of the rotating hole 6, and the side wall of the limiting baffle 62 abuts against the side wall of the semicircular piece 61.

[0054] like Figure 4 , 5As shown in Figures 6 and 8, when the fixing member 44 rotates into the second fixing slot 41 under the action of the rotating rod 43, the fixing rod 52 moves into the first fixing hole 5 under the action of the fixing member 44. Subsequently, when the first fixing hole 5 is directly opposite to the second fixing hole 51, the fixing rod 52 slides into the second fixing hole 51 at one end under the action of the first spring 53, thereby fixing the fixing member 44 in the second fixing slot 41, thereby reducing the probability of the fixing member 44 rotating when subjected to external force, thereby improving the stability of the device. In addition, when the rotating rod 43 rotates, the limit baffle 62 rotates synchronously with the rotating rod 43 under the action of the rotating rod 43. In this process, when the limit baffle 62 abuts against the side wall of the semicircular member 61, the rotating rod 43 cannot continue to grasp that. As can be seen from the figure, the rotating rod 43 can only rotate degrees, thereby reducing the difficulty of the first fixing hole 5 and the second fixing hole 51 being directly opposite, thereby reducing the difficulty of the staff's work.

[0055] In the present invention, unless otherwise clearly specified and limited, terms such as "install", "connect", "connect", and "fix" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection. There are many ways of detachable installation, for example, it can be through the method of plug-in and snap-fit, or through the method of bolt connection, etc.

[0056] The specific description of the present invention in the above embodiments is only used to further illustrate the present invention and cannot be understood as limiting the scope of protection of the present invention. Technical engineers in this field may make some non-essential improvements and adjustments to the present invention based on the contents of the above invention, which fall within the scope of protection of the present invention.

Claims

1. A lightweight waveguide processing technology, characterized in that: include: First, the surface of the waveguide to be processed is cleaned to keep the surface of the waveguide to be processed clean; Place and fix the cleaned waveguide on the laser cutting workbench; The waveguide is cut using laser cutting technology; After the waveguide is cut using laser, the surface flatness of the cut waveguide is checked using a flatness checker, and the waveguide with an error exceeding ±0.05 mm is cut using the laser cutting technique repeatedly until the error does not exceed ±0.05 mm.

2. A lightweight waveguide processing process according to claim 1, characterized in that: When laser cutting the waveguide, the laser used is a femtosecond laser; When using a femtosecond laser to cut a waveguide, the femtosecond laser can emit 0.00025 joules of energy within 1 femtosecond.

3. A lightweight waveguide processing process according to claim 2, characterized in that: When using a femtosecond laser to cut a waveguide, the femtosecond laser can focus energy into a circular space with a diameter of 0.06 mm. When repeating the step of cutting the waveguide sheet using the laser cutting technology for a waveguide sheet with an error exceeding ±0.05mm, the femtosecond laser focuses the energy in a circular space with a diameter of 0.06mm, and repeats the step of cutting the waveguide sheet using the laser cutting technology for a waveguide sheet with an error exceeding ±0.05mm until the error does not exceed ±0.05mm.

4. The lightweight waveguide processing technology according to claim 1, characterized in that: In the process of using a femtosecond laser to cut the waveguide, nitrogen is added to assist the femtosecond laser in cutting the waveguide, so that the femtosecond laser releases nitrogen to form protection around the waveguide during the process of cutting the waveguide.

5. The lightweight waveguide processing technology according to claim 1, characterized in that: When cleaning the surface of the waveguide to be processed, first put the waveguide into water for the first cleaning; After the first cleaning is completed, the waveguide is cleaned for the second time using ultrasonic waves.

6. A laser cutting workbench for processing a lightweight waveguide sheet, the laser cutting workbench for processing a lightweight waveguide sheet being used in the lightweight waveguide sheet processing process according to any one of claims 1 to 5, characterized in that: include: A base (1), wherein a rotating groove (11) is provided on the upper surface of the base (1), and a rotating ball (12) is rotatably arranged in the rotating groove (11); A workbench body (13), the workbench body (13) being mounted on the upper surface of the base (1), the bottom surface of the workbench body (13) and the upper surface of the rotating ball (12) being fixed to each other; The upper surface of the workbench body (13) is provided with a mounting groove (14), a mounting member (15) is installed in the mounting groove (14), and a through hole (16) is formed through the upper surface of the mounting member (15); A vacuum generating device (2) is installed on the workbench body (13) and is used to fix the waveguide plate on the mounting member (15).

7. The laser cutting workbench for processing lightweight waveguide sheets according to claim 6, characterized in that: An air inlet (23) is provided on the side wall of the workbench body (13), a throttling groove (24) is provided on the inner wall of the air inlet (23), an enlargement groove (25) is provided through the inner wall of the throttling groove (24) away from the air inlet (23), a suction groove (26) is provided through the inner top wall of the enlargement groove (25), and the suction groove (26) is directly opposite to the through hole (16); The vacuum generating device (2) comprises an air inlet joint (21) installed in the air inlet (23) and an air outlet pipe (22) installed in the amplifying tank (25); A sealing gasket (7) is fixedly arranged on the inner bottom wall of the mounting groove (14); an exhaust hole (71) is penetrated through the upper surface of the sealing gasket (7); the exhaust hole (71) is directly opposite to the through hole (16) and the suction groove (26); and the upper surface of the sealing gasket (7) abuts against the bottom surface of the mounting member (15).

8. The laser cutting workbench for processing lightweight waveguide sheets according to claim 7, characterized in that: A silencer (3) is installed at one end of the air outlet pipe (22) away from the air inlet connector (21), and a plurality of silencer cavities (31) are provided in the silencer (3); The inner walls of the plurality of muffler cavities (31) are all provided with connecting holes (32) penetrating therethrough, and the axes of the plurality of connecting holes (32) are mutually coincident.

9. The laser cutting workbench for processing lightweight waveguide sheets according to claim 6, characterized in that: A first fixing groove (4) is provided on the inner wall of the installation groove (14), a second fixing groove (41) is provided on the outer wall of the installation member (15), a rotation groove (42) is provided through the inner top wall of the first fixing groove (4), and the first fixing groove (4) is directly opposite to the second fixing groove (41); A rotating rod (43) is rotatably arranged in the rotating groove (42), a fixing member (44) is sleeved on the outer wall of the rotating rod (43), and the fixing member (44) and the rotating rod (43) are fixed to each other; A rubber sleeve (8) is fixedly arranged on the inner wall of the rotating groove (42), and the rotating rod (43) is rotatably connected to the rubber sleeve (8).

10. The laser cutting workbench for processing lightweight waveguide sheets according to claim 9, characterized in that: A first fixing hole (5) is formed on the inner wall of the second fixing groove (41), and a second fixing hole (51) is formed on the outer wall of the fixing member (44), wherein the first fixing hole (5) is directly opposite to the second fixing hole (51); A fixing rod (52) is slidably arranged in the first fixing hole (5), and the fixing rod (52) is slidably connected to the second fixing hole (51). A first spring (53) is fixedly arranged on a side wall of the fixing rod (52) away from the second fixing hole (51), and the other end of the first spring (53) is fixedly arranged on the inner wall of the first fixing hole (5), and one end of the fixing rod (52) away from the first spring (53) is provided with a rounded corner; A rotating hole (6) is formed on the bottom surface of the rotating rod (43); a semicircular piece (61) is fixedly provided on the inner bottom wall of the first fixing groove (4); and the semicircular piece (61) is rotatably connected to the rotating hole (6); A limit baffle (62) is fixedly arranged on the inner wall of the rotating hole (6), and the side wall of the limit baffle (62) abuts against the side wall of the semicircular member (61).

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