A Laser Milling-Precision Grinding Process and Device for Small Holes with Large Depth-Diameter Ratio in Hard and Brittle Materials

Abstract

The present invention relates to a laser milling - precision grinding process and device for small holes with a large depth - diameter ratio in hard and brittle materials. First, a mapping relationship between the entrance aperture and laser parameters is established by the response surface method to determine the laser processing parameters. Based on an optical image acquisition system, a pulsed laser is used to prepare micro - through - holes with a large depth - diameter ratio and accurately controllable ablation amount, reducing the grinding amount while decreasing the strength, hardness, or fracture toughness of the material at the processing position, thereby reducing the grinding force and tool wear during the processing of hard and brittle materials. Secondly, grinding is used to remove processing damages such as micro - cracks, recast layers, and tapers caused by laser processing, improving the processing quality of small holes with a large depth - diameter ratio. The device mainly includes a machine body, a workbench, a laser processing spindle, a grinding processing spindle, a differential interference microscope, an optical CCD camera, and X - and Y - axis servo drive modules. It can complete different processing processes and in - situ detection on the same machine tool, avoiding problems such as secondary clamping of workpieces and poor repeat positioning accuracy, improving the processing efficiency. The present invention highly combines the laser processing of bottom holes in hard and brittle materials with grinding and reaming of holes, realizing high - quality and high - efficiency processing of hard and brittle materials, reducing tool wear, and lowering the processing cost.

Description

Technical Field

[0001] The invention belongs to the technical field of grinding, and relates to a laser milling-precision grinding process for a small hole with a large depth-to-diameter ratio of a hard and brittle material and a device thereof. Background Art

[0002] Hard and brittle materials such as ceramic matrix composites are widely used in aerospace, national defense, military industry, nuclear energy and other fields due to their excellent properties such as high hardness, high strength and high temperature resistance. They perform outstandingly in dealing with high temperature and strong radiation environments, but still require some necessary cooling methods at temperatures exceeding 2000°C. Air film holes are common structures in cooling design. They are usually sub-millimeter small holes with a large depth-to-diameter ratio. The high depth-to-diameter ratio results in insufficient chip removal space during machining, which can easily lead to tool breakage. At the same time, hard and brittle materials are hard and brittle, which can cause severe tool wear and surface cracking during machining.

[0003] In response to the problem of deep hole processing, Xi'an Shiyou University has an invention patent application with publication number CN118478038A, which discloses a tool and processing method suitable for medium and large diameter deep hole processing. The present invention mainly opens a groove along the central axis of the tool, and respectively sets blades on the top surface of the processing end and the bottom surface of the groove, thereby dividing a processing area of ​​a traditional internal chip removal deep hole drill into two processing areas: sleeve processing and sleeve removal, thereby reducing the problems of cutting heat concentration and guide block extrusion and increasing chip removal space. However, the patent opens a groove in the center of the tool, which makes it difficult to ensure the cutting force balance of the two blade areas of the tool and the dynamic balance of the tool as a whole. At the same time, the blades are concentrated on the end face and the bottom of the groove, and the outer cylindrical surface of the tool is in contact with the surface of the deep hole, which can easily aggravate tool wear. The invention patent application with publication number CN116213904A owned by China Aero Engine Corporation Limited discloses a method for processing small holes with a large depth-to-diameter ratio based on a combination of mechanical drilling and ultrafast laser. The invention processes a bottom hole by mechanical deep hole drilling and uses an ultrafast laser to perform fine hole repair on the bottom hole to remove burrs, flash and metamorphic hardened layers, effectively improving processing quality and processing efficiency. However, the invention is prone to tool wear during the processing of hard and brittle materials, and the processing cost is relatively high.

[0004] Therefore, there is an urgent need for a method for machining small holes with large depth-to-diameter ratio in hard and brittle materials that takes into account tool life, chip removal and machining efficiency. Summary of the invention

[0005] To solve the problems of tool breakage and severe wear caused by insufficient chip removal space during the machining of small holes with a large depth-to-diameter ratio in hard and brittle materials, the present invention proposes a laser milling-precision grinding process and device for small holes with a large depth-to-diameter ratio in hard and brittle materials, which combines precise and quantitative laser ablation machining of the bottom hole with grinding for hole repair and expansion. First, a low-damage through hole with a large depth-to-diameter ratio is ablated by laser to improve the machinability of the material, and then high-speed grinding is carried out to remove the damaged layer and taper caused by the laser, improving the machining quality and efficiency.

[0006] To achieve the above-mentioned invention purpose, the technical solution adopted by the present invention is as follows:

[0007] A laser milling-precision grinding process for small holes with a large depth-to-diameter ratio in hard and brittle materials. First, a mapping relationship between the entrance aperture and laser parameters is established by the response surface method to determine the laser processing parameters. Based on an optical image acquisition system, a pulsed laser is used to ablate a micro through hole with a large depth-to-diameter ratio, reducing the grinding amount while reducing the strength, hardness or fracture toughness of the material at the machining position, thereby reducing the grinding force and tool wear for machining hard and brittle materials. Then, grinding is used to remove machining damages such as microcracks, recast layers and tapers caused by laser machining, improving the machining quality of small holes with a large depth-to-diameter ratio. Finally, precision grinding is carried out for hole expansion to obtain a hole without burrs, flash and delamination.

[0008] The hard and brittle materials include, but are not limited to: optical glass, crystal materials, ceramic materials, particle-reinforced metal matrix composites, whisker-reinforced ceramic matrix composites, fiber-reinforced ceramic matrix composites.

[0009] A laser milling-precision grinding device for small holes with a large depth-to-diameter ratio in hard and brittle materials, comprising:

[0010] X-axis servo drive module (1), fuselage (2), dynamometer (3), laser processing spindle (4), laser head (41), focusing device (42), optical image acquisition system (5), optical CCD camera (51), differential interference contrast microscope (52), grinding spindle (6), tool holder (7), grinding wheel (8), workpiece (9), workbench (10), Y-axis servo drive module (11). Among them, the laser processing spindle and the grinding spindle are both vertically arranged and can move along the Z-axis. The laser head and the focusing device are connected to the laser processing spindle. The laser head is vertically placed on the upper surface of the workpiece to be processed. The focusing device is used to detect the defocus amount. The optical image acquisition system is rotatably connected to the grinding spindle to complete in-situ detection. The optical image acquisition system includes an optical CCD camera and a differential interference contrast microscope. The optical CCD camera collects the surface topography, and the differential interference contrast microscope collects the damage data. The X- and Y-axis servo drive modules are arranged under the workbench to control the movement of the workbench in the X and Y directions. The workpiece to be processed is placed on the workbench, and the X-axis servo drive module drives it to complete double-station movement. The laser is a nanosecond laser or a picosecond laser. The grinding wheel is a superhard abrasive grinding wheel such as an electroplated diamond grinding wheel, a brazed diamond grinding wheel, or a ceramic-bonded sintered diamond grinding wheel.

[0011] Specifically, the above process includes the following steps:

[0012] A laser milling-precision grinding process for small holes with a large depth-to-diameter ratio in hard and brittle materials, the specific steps are as follows:

[0013] Step 1: According to the empirical values of the workpiece of the hard and brittle material to be processed, initially select the laser processing parameters, which include but are not limited to: laser power, spot overlap rate, feed rate, and track spacing; use the central composite design method to formulate an L29 matrix, and conduct laser drilling experiments on the above laser parameters. The deep micro-holes on the workpiece after laser ablation under different processing parameters are detected and analyzed by the optical image acquisition system to obtain a series of data on the entrance diameter.

[0014] Step 2: By the response surface method, use Design-Expert software to perform linear regression on the series of entrance diameter data obtained in Step 1 to obtain a quadratic regression significant model of the entrance diameter. The established regression model is:

[0015]

[0016] In the formula, D1 is the aperture of the micro-hole entrance after laser ablation; P is the laser power; R is the spot overlap rate; ν1 is the feed rate; d1 is the track spacing.

[0017] Randomly select 5 groups of parameters within the effective range of the obtained regression model for experiments, compare the predicted results with the experimental results. The average error of the established inlet diameter prediction model is less than 5%, and the predicted results are in good agreement with the actual test results; otherwise, it is judged as inaccurate, and insignificant terms need to be eliminated until the regression model is within an acceptable range.

[0018] Step 3: On the basis of effectively eliminating laser heat-induced defects and reserving machining allowance, determine the size of the hole after laser ablation as 90% of the final formed hole size D. Through the above model, the micro-hole inlet aperture D1 under different laser processing parameter combinations is analyzed and predicted. According to the analysis results of this model, the optimal laser processing parameter combination is selected;

[0019] Step 4: Perform micro-hole laser processing using the above optimal parameter combination. Based on the fixed spot diameter d, conduct deep micro-hole ablation experiments with different laser powers P, spot overlap rates R, and track spacings d1 using a spiral trajectory.

[0020] During the laser processing, the center line of the laser beam is perpendicular to the surface to be processed, the focal plane is the upper surface of the workpiece, the laser beam feeds downward at a constant speed to compensate for the defocus amount, and the moving distance is the thickness of the workpiece.

[0021] Step 5: Horizontally move the workpiece after laser processing to the grinding station. According to the real-time image feedback of the optical CCD camera for the processing effect, detect the range of the micro-hole aperture after laser ablation, and use a differential interference contrast microscope to detect the range of the thermal damage area in situ to determine the grinding machining allowance, and perform precision grinding and reaming to remove the damage caused by laser processing. During grinding, the grinding wheel feeds downward at a constant speed and is cooled by a water-based coolant to obtain a small hole with a large depth-to-diameter ratio without burrs, flash, and delamination on the surface.

[0022] During grinding, according to the machining allowance = D - D1, select the grinding machining parameters: the grinding wheel speed ν s 、the spindle feed speed ν2 and the machining stroke, input the machining coordinates of the bottom hole, and perform precision grinding and hole repair machining. During the machining process, the grinding wheel feeds vertically, and the machining stroke = the thickness of the workpiece + 2 mm (the effective grinding length of the grinding wheel);

[0023] Among them, D is the final machining aperture, and D1 is the micro-hole inlet aperture of the laser processing measured optically.

[0024] The beneficial effects of the present invention compared with the prior art are as follows:

[0025] In view of the fact that the laser-assisted grinding machining technology has become increasingly mature, but there is little research on laser-assisted grinding of small holes with a large depth-diameter ratio for hard and brittle materials, the present invention combines laser ablation for machining the bottom hole and grinding for hole repair and reaming highly. By using the worktable to move in the X and Y axes, during the laser ablation process, the laser feeds downward. Based on a fixed spot diameter, a spiral trajectory is adopted to ablate deep micro-holes 8 with different laser powers P, spot overlap rates R, and track spacings d1; realizing the laser machining of tapered micro-through holes with a large depth-diameter ratio, removing a part of the material to improve the chip evacuation environment, solving the problem of insufficient chip evacuation space, and at the same time reducing the material hardness and fracture toughness. On the same worktable, when high-speed grinding is carried out, micro-cracks, recast layers, and taper structures generated by laser machining are removed. At this time, the grinding wheel feeds downward, which can reduce the grinding force, tool wear, reduce the stiffness problem caused by material anisotropy, and improve the machining quality. It realizes that the workpiece completes different machining processes and in-situ detection on the same machine tool, avoids secondary clamping and repeated positioning of the workpiece, improves the overall machining efficiency of the workpiece, reduces tool wear, and reduces the machining cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art.

[0027] Figure 1 It is a flow chart of the laser-assisted grinding method for small holes with a large depth-diameter ratio of hard and brittle materials provided by the present invention;

[0028] Figure 2 It is a schematic diagram of the laser-assisted grinding platform provided by the present invention;

[0029] Figure 3 It is a schematic diagram of the scanning path and hole cross-section diagram of laser ablation of micro-through holes with a large depth-diameter ratio provided by the present invention: (a) laser trajectory schematic diagram, (b) spot overlap degree schematic diagram, (c) hole cross-section schematic diagram;

[0030] Figure 4 It is an experimental schematic diagram of laser machining of small holes with a large depth-diameter ratio provided by the present invention;

[0031] Figure 5 It is an experimental schematic diagram of grinding machining of small holes with a large depth-diameter ratio provided by the present invention;

[0032] Figure 6 It is an electron microscope image of the micro-hole inlet and outlet after laser machining and precision grinding in Example 1.

[0033] Description of main reference numerals: 1. X-axis servo drive module; 2. Machine body; 3. Dynamometer; 4. Laser processing spindle; 41. Laser head; 42. Focusing device; 5. Optical image acquisition system; 51. Optical CCD camera; 52. Differential interference contrast microscope; 6. Grinding processing spindle; 7. Tool holder; 8. Grinding wheel; 9. Workpiece to be processed; 10. Workbench; 11. Y-axis servo drive module. Detailed implementation manners

[0034] The present invention will be further described in detail below with reference to the accompanying drawings, implementation processes and embodiments in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments.

[0035] Embodiment 1:

[0036] In this embodiment, small holes are machined in the ceramic matrix composite material SiC f / SiC, the aperture is 0.4 mm, and the depth-diameter ratio is 10.

[0037] As Figure 2 shown, a device for laser milling-precision grinding of small holes with a large depth-diameter ratio in hard and brittle materials includes an X-axis servo drive module 1, a machine body 2, a dynamometer 3, a laser processing spindle 4, an optical image acquisition system 5, a grinding processing spindle 6, a tool holder 7, a grinding wheel 8, a workpiece 9, a workbench 10, and a Y-axis servo drive module 11. Among them, the laser processing spindle 4 and the grinding processing spindle 6 can move along the Z axis. The laser head 41 and the focusing device 42 are connected to the laser processing spindle 4. The laser head 41 is vertically placed on the upper surface of the workpiece 9 to be processed, and the focusing device 42 is used to detect the defocus amount. The optical image acquisition system 5 is rotatably connected to the grinding processing spindle 6 to complete in-situ detection. The optical image acquisition system 5 includes an optical CCD camera 51 and a differential interference contrast microscope 52. The optical CCD camera 51 collects the surface topography, and the differential interference contrast microscope 52 collects the damage data. The X-axis servo drive module 1 and the Y-axis servo drive module 11 are used to control the movement of the workbench in the X and Y directions. The workpiece 9 to be processed is placed on the workbench 10, and the X-axis servo drive module 1 drives it to complete double-station movement. The laser is a nanosecond laser, and the workpiece 9 to be processed is a rectangular SiC f / SiC ceramic matrix composite material with a thickness of 4 mm. The grinding wheel 8 used is an electroplated diamond grinding wheel with a diameter of 0.4 mm.

[0038] As Figure 1 shown, a process for laser milling-precision grinding of small holes with a large depth-diameter ratio in hard and brittle materials includes the following steps:

[0039] Step 1: Install the workpiece 9 to be processed on the workbench 10, level it with a spirit level, position and clamp it;

[0040] Step 2: Turn on the laser processing spindle 4, adjust the center line of the laser beam output by the laser head 41 to be perpendicular to the surface to be processed, adjust the defocus amount to 0 according to the focusing device 42, and according to the theoretical knowledge and processing experience of laser processing SiC f / SiC, initially select the laser power range of 35w - 50w, the spot overlap rate range of 84% - 98%, the feed rate range of 100μm / s - 500μm / s, and the track spacing range of 15μm - 45μm. Use the central composite design method to formulate the L29 matrix, and conduct laser drilling experiments with corresponding parameters. Use the optical image acquisition system 5 to detect and analyze the deep micro-holes on the workpiece 9 after laser ablation under different processing parameters to obtain the entrance diameter.

[0041] Step 3: Use Design-Expert software to perform regression analysis on the entrance diameter through the response surface method to obtain a quadratic regression significant model of the entrance diameter; the established regression model is:

[0042]

[0043] In the formula, D1 is the aperture diameter of the micro-hole entrance after laser ablation measured optically; P is the laser power; R is the spot overlap rate; ν1 is the feed rate; d1 is the track spacing.

[0044] Randomly select 5 groups of parameters for experiments within the effective range of the above regression model, compare the prediction results with the experimental results. The average error of the established entrance diameter prediction model is 3.7%, and the maximum error is 4.5% respectively, both less than 5%. The overall error is still within the acceptable range, and the prediction results are in good agreement with the actual test results.

[0045] Step 4: Taking the aperture D1 = 0.36mm after laser ablation as the target, according to the above regression prediction model, the selected optimal processing parameter combination is: laser power of 46W, spot overlap rate of 85%, feed rate of 293μm / s, and track spacing of 45μm.

[0046] Step 5: Use the above optimal parameter combination to perform 0.4mm micro-hole laser processing, repeat the experiment 40 times, and prepare an 8x5 hole array. Figure 4 Shows a schematic diagram of laser ablation of small holes with a large depth-to-diameter ratio. During the processing, the workpiece feeds upward, and the moving distance is the thickness of the workpiece. Based on the fixed spot diameter d, a spiral trajectory (see Figure 3 (a)) is used to conduct deep micro-hole 8 ablation experiments with different laser powers P, spot overlap rates R (see Figure 3 (b)) and track spacings d1.

[0047] Step 6: Move the workpiece 9 after laser processing to the grinding machine table through the X-axis servo drive module 1. Install the tool shank 7 holding the grinding wheel 8 onto the grinding spindle 6. The diameter of the grinding wheel is 0.4 mm, the diameter of the shank part is 3 mm, the length of the plated sand is 2 mm, and the tool length is 35 mm. Measure the two-dimensional morphology of the hole after laser ablation through the optical CCD camera 51, and specifically analyze the shape and size of the ablation groove hole, such as the hole diameter D1. Measure the thermal damage processing range of the hole after laser ablation through the differential interference microscope 52. The processing effect is as Figure 6 shown. The actual entrance diameter range is 0.3652 - 0.3773 mm, the ablation depth is 4 mm, and the laser-induced recast layer and thermal damage layer can be controlled below 0.4 mm, meeting the grinding processing requirements. Figure 5 Figure shows a schematic diagram of the grinding experiment for small holes with a large depth-to-diameter ratio. Based on the Figure 4 laser-ablated large-depth-to-diameter-ratio conical hole, a single-factor grinding experiment with multiple processing parameters (grinding wheel speed and feed rate) is carried out, and the grinding wheel feeds downward.

[0048] Step 7: The machining allowance is D - D1 = (22.7, 34.8) μm. Select the grinding parameters as follows: the grinding wheel speed ν s = 15000 rpm, the spindle feed rate ν2 = 1.5 mm / min, the machining stroke is 5 mm. Conduct a precision grinding and reaming experiment. The processing effect is as Figure 6 shown. There are no burrs, flash, or delamination on the hole surface. The number of holes that the tool can machine increases from 2 holes to 16 holes, greatly improving the tool machining life.

[0049] Step 8: Complete the processing, turn off the grinding spindle 4 and the laser processing spindle 6, and unload the workpiece.

[0050] Example 2:

[0051] The main content of this example is the same as that of Example 1. The workpiece to be processed 5 is single-crystalline silicon, the machining hole diameter is 0.2 mm, and the machining depth is 2 mm. The laser is a picosecond laser. During the laser processing, a segmented upward feeding method is adopted, the single-feed depth is 200 μm, and the total number of feeding times is 10 times. According to the basic experimental results, the selected laser parameters are: the track spacing d1 is 10 μm, the processing power P is 16 W, the spot overlap rate R is 87.5%, the number of single processing times is 20 times, and the selected laser processing micro-hole entrance diameter D1 = 0.18 mm. The range of the hole entrance diameter after laser processing is: 0.1901 - 0.1953 mm.

[0052] The specific embodiments of the present invention have been described above in conjunction with the accompanying drawings. However, these descriptions should not be construed as limiting the scope of the present invention. The protection scope of the present invention is defined by the appended claims, and any modification based on the claims of the present invention falls within the protection scope of the present invention.

Claims

1. A laser milling-precision grinding process for small holes with large depth-to-diameter ratio in hard and brittle materials, characterized in that: Firstly, the mapping relationship between the entrance aperture and the laser parameters is established by the response surface method to determine the laser processing parameters. Based on the optical image acquisition system, a pulsed laser is used to ablate a micro-through hole with a large aspect ratio. During the laser ablation process, the workpiece is fed upward. Based on a fixed spot diameter, a spiral trajectory is used to perform different laser power ablation. P , spot overlap ratio R and track spacing d 1 deep micro-hole ablation; then, grinding wheel grinding is used to remove the surface damage caused by laser processing and improve the processing quality of small holes with large depth-to-diameter ratio; finally, precision grinding and hole expansion are performed to obtain small holes with large depth-to-diameter ratio without burrs, flash and delamination; the specific steps are as follows: Step 1: Preliminary selection of laser processing parameters based on the empirical values ​​of the hard and brittle material workpiece to be processed, including: laser power, spot overlap rate, feed speed, and track spacing; the L29 matrix is ​​formulated using the central composite design method, and laser drilling experiments with the above laser parameters are carried out. The deep micro-holes on the workpiece after laser ablation under different laser parameters are detected and analyzed to obtain a series of data on the entrance diameter; Step 2: Through the response surface method, the Design-Expert software is used to perform linear regression on the inlet diameter series data obtained in step 1 to obtain a quadratic regression significant model of the inlet diameter. The established regression model is: ； In the formula, D 1 is the micropore entrance aperture after laser ablation measured by optical measurement; P is the laser power; R is the spot overlap ratio; ν 1 is the feed speed; d 1 is the track spacing; Step 3: On the basis of ensuring the effective elimination of laser thermal defects and reserving processing allowance, the aperture after laser ablation is D 1 Determine the final aperture D The above regression model is used to analyze and predict the microhole entrance aperture under different laser processing parameter combinations. D 1. Based on the analysis results of this model, select the optimal combination of laser processing parameters; Step 4: Use the above optimal laser processing parameter combination for micro-hole laser processing, based on a fixed spot diameter d , using spiral trajectory for different laser powers P , spot overlap ratio R and track spacing d 1 deep micropore ablation experiment; Step 5: Move the workpiece after laser processing horizontally to the grinding station, use the optical CCD camera to feedback the processing effect in real time, detect the aperture range of the micropores after laser ablation, use the differential interference contrast microscope to detect the range of the thermal damage area, determine the grinding allowance, and perform precision grinding and hole expansion to remove the damage caused by laser processing; during the grinding process, the grinding wheel is fed downward at a uniform speed and cooled by a water-based coolant to obtain a small hole with a large depth-to-diameter ratio without burrs, flash, and stratification on the surface.

2. The laser milling-precision grinding process for small holes with large depth-to-diameter ratio of hard and brittle materials according to claim 1 is characterized in that: In step 2, 5 groups of parameters are randomly selected within the effective range of the obtained regression model for testing, and the predicted results are compared with the test results. If the average error of the established inlet diameter prediction model is less than 5%, the predicted results are consistent with the actual test results; otherwise, it is judged to be inaccurate, and the insignificant items need to be eliminated until the regression model error is within an acceptable range.

3. The laser milling-precision grinding process for small holes with large depth-to-diameter ratio of hard and brittle materials according to claim 1 is characterized in that: In step 4, during the laser processing, the center line of the laser beam is perpendicular to the surface to be processed, and the laser is fed downward at a uniform speed to compensate for the defocus amount, and the moving distance is the thickness of the workpiece.

4. The laser milling-precision grinding process for small holes with large depth-to-diameter ratio of hard and brittle materials according to claim 1 is characterized in that: Step 5: During grinding, according to the machining allowance = DD 1. Select grinding parameters: Grinding wheel speed ν s , spindle feed speed ν 2. As well as the processing stroke, input the processing coordinates of the bottom hole, and perform precision grinding and hole repairing. During the processing, the grinding wheel feeds vertically, and the processing stroke = workpiece thickness + effective grinding length of the grinding wheel; in, D The final processing hole diameter, D 1 is the entrance aperture of the laser-processed microhole measured by optical measurement.

5. The laser milling-precision grinding process for small holes with large aspect ratio of hard and brittle materials according to claim 1 is characterized in that: The hard and brittle materials include: optical glass, crystal materials, ceramic materials, particle-reinforced metal-based composite materials, whisker-reinforced ceramic-based composite materials, and fiber-reinforced ceramic-based composite materials.

6. A laser milling-precision grinding device for hard and brittle materials with a large depth-to-diameter ratio small hole based on the laser milling-precision grinding process for hard and brittle materials with a large depth-to-diameter ratio as claimed in claim 1, characterized in that: include: X-axis servo drive module (1), body (2), dynamometer (3), laser processing spindle (4), laser head (41), focusing device (42), optical image acquisition system (5), optical CCD camera (51), differential interference contrast microscope (52), grinding processing spindle (6), tool holder (7), grinding wheel (8), workpiece (9), worktable (10), Y-axis servo drive module (11); wherein the laser processing spindle and the grinding processing spindle can move along the Z axis, the laser processing spindle is connected to the laser head and the focusing device, the laser head is vertically placed on the upper surface of the workpiece to be processed, and the focusing device is used to detect the defocus amount The grinding spindle is connected to an optical image acquisition system to complete in-situ detection. The optical image acquisition system includes an optical CCD camera and a differential interference contrast microscope. The optical CCD camera collects surface morphology, and the differential interference contrast microscope collects damage data. The X-axis and Y-axis servo drive modules are arranged under the workbench to control the movement of the workbench in the X and Y directions. The workpiece to be processed is placed on the workbench, and the X-axis servo drive module drives the double-station movement. The laser is a nanosecond laser or a picosecond laser. The grinding wheel is selected from an electroplated diamond grinding wheel, a super-hard abrasive grinding wheel of a brazed diamond grinding wheel, or a ceramic bonded sintered diamond grinding wheel.

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