Assembly apparatus and assembly method

Abstract

The invention relates to an assembling device and an assembling method, the assembling device is used for assembling an adsorption pad and a pressing ring on a polishing head, and the assembling device comprises an adsorption head used for adsorbing the adsorption pad; the bearing disc is used for bearing the pressing ring; the first movement control structure is used for controlling the adsorption head and / or the bearing disc to move relatively, so that the adsorption pad is attached to the pressing ring; and the pressing structure comprises a pressing roller and is used for pressing the adsorption pad and the pressing ring after the adsorption pad is attached to the pressing ring. Through the assembling equipment provided by the invention, automatic pasting of the adsorption pad and the rubber compression ring is realized, manpower resources are saved, the pasting precision of the adsorption pad and the rubber compression ring is improved, and the efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor product manufacturing, and in particular to an assembly device and an assembly method. Background Art

[0002] The final polishing machine needs to regularly replace consumable spare parts TA (wafer adsorption pad) and PAD (grinding pad). Replacing the adsorption pad consumes a lot of manpower: since the adsorption pad is attached to the rubber pressure ring (including the rubber film and the clamping rings clamped around the rubber film) and then installed on the polishing head of the polishing machine, a series of processes such as disassembling the rubber pressure ring, tearing off the original adsorption pad, and attaching a new adsorption pad are required during the replacement process, which consumes a lot of manpower;

[0003] There are precision requirements for posting the adsorption pad: The posting of the adsorption pad has certain requirements on the operator's posting technique. The posting process of the adsorption pad is: place the rubber pressure ring after tearing off the adsorption pad in a special posting mold, and then clean and post the surface of the rubber pressure ring. Because the size of the adsorption pad is smaller than the rubber pressure ring, and the flatness of the surface of the rubber pressure ring is very high, manual posting will cause the adsorption pad to be posted in an offset position, and the surface of the rubber pressure ring will be uneven, which will lead to the appearance of bubbles, which will cause equipment failure after being installed on the machine, affecting production efficiency. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides an assembly device and an assembly method to solve the problem of poor pasting when the adsorption pad and the rubber pressure ring are pasted together.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present invention is: an assembly device for assembling an adsorption pad and a pressure ring on a polishing head, comprising:

[0006] An adsorption head, used for adsorbing the adsorption pad;

[0007] A carrying plate, used for carrying the pressure ring;

[0008] A first movement control structure, used for controlling the relative movement of the adsorption head and / or the carrier plate, so that the adsorption pad is attached to the pressure ring;

[0009] The pressing structure comprises a pressing roller, which is used for pressing the adsorption pad and the pressing ring after the adsorption pad is attached to the pressing ring.

[0010] Optionally, the adsorption head includes an adsorption chamber and an adsorption surface communicating with the adsorption chamber;

[0011] The adsorption chamber is connected to the vacuum equipment through a vacuum pipeline so that the adsorption surface can be converted between a first state and a second state. In the first state, the adsorption surface is recessed toward the interior of the adsorption chamber to adsorb the adsorption pad. In the second state, the adsorption surface protrudes in a direction away from the adsorption chamber to fit with the pressure ring.

[0012] Optionally, the adsorption chamber has an opening, and an elastic metal sheet is provided at the opening, and the elastic metal sheet is the adsorption surface.

[0013] Optionally, the carrying plate includes a first carrying platform and a second carrying platform located on the first carrying platform, and the area of ​​the second carrying platform is smaller than the area of ​​the first carrying platform, so that the pressure ring can be sleeved on the outside of the second carrying platform.

[0014] Optionally, a foreign body detection structure is also included, including:

[0015] An image acquisition unit, used for scanning and detecting the surface of the pressure ring carried on the carrying plate;

[0016] The processing unit is used to determine whether there is foreign matter on the surface of the pressure ring according to the image acquired by the image acquisition unit.

[0017] Optionally, the image acquisition unit includes a laser sensor, and the foreign matter detection structure further includes:

[0018] The moving unit is used to control the rotation of the carrier plate to drive the pressure ring to rotate during the scanning process of the image acquisition unit.

[0019] Optionally, the foreign object detection structure includes a support rod and a support ring, the support ring is supported on the support rod, and the image acquisition unit is arranged on the support ring.

[0020] Optionally, a cleaning structure is further included, for cleaning the pressure ring when the foreign matter detection structure detects a foreign matter.

[0021] Optionally, the cleaning structure includes:

[0022] A nozzle, used for spraying a cleaning liquid onto the surface of the pressure ring;

[0023] The air knife is used to spray clean dry air toward the pressure ring.

[0024] Optionally, a second movement control structure is further included, including:

[0025] A first moving part, used for conveying the adsorption pad to a first position to be adsorbed by the adsorption head;

[0026] The second moving part is used to transfer the pressure ring to a second position to be carried by the carrying plate.

[0027] The present invention also provides an assembly method, which assembles the adsorption pad and the pressure ring of the polishing head by the above-mentioned assembly equipment, comprising:

[0028] Adsorbing the adsorption pad by an adsorption head, and carrying the pressure ring by a carrying plate;

[0029] Controlling the adsorption head and / or the carrier plate to move relative to each other so that the adsorption pad is attached to the pressure ring;

[0030] The fitted adsorption pad and the pressing ring are pressed together by a pressing structure.

[0031] The beneficial effects of the present invention are as follows: through the assembly equipment provided by the present invention, the automatic posting of the adsorption pad and the rubber pressure ring is realized, human resources are saved, and the accuracy of posting the adsorption pad and the rubber pressure ring is improved, thereby improving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram showing the relative position relationship of the adsorption head, the carrier plate, and the foreign matter detection structure in an embodiment of the present invention;

[0033] Figure 2 A schematic diagram showing the relative position relationship between the fitting area and the pressing area;

[0034] Figure 3 A schematic diagram showing an adsorption head;

[0035] Figure 4 A schematic diagram showing the adsorption head in a first state;

[0036] Figure 5 A schematic diagram showing the adsorption head in a second state;

[0037] Figure 6 a schematic diagram showing a first moving part;

[0038] Figure 7 A schematic diagram showing a conveyor belt;

[0039] Figure 8 A schematic diagram showing a detection state of a foreign body detection structure performing detection;

[0040] Fig. 9 Schematic diagram showing the adsorption pad and the pressure ring after being attached. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0042] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0044] In the process of producing silicon wafers, the final polishing (FP) process is the last step to control the flatness and roughness parameters of the silicon wafer. The final polishing process is to remove a certain amount of silicon wafer surface to remove the defects of the front-end process and to mirror-polish the silicon wafer surface.

[0045] Conventional FP operation is to bring a polishing head loaded with a silicon wafer into contact with the surface of a polishing pad attached to a lower platen, and the surface of the silicon wafer reacts chemically with the colloidal slurry supplied through a slurry tube and the chemical, and is polished due to the physical reaction caused by mechanical pressure.

[0046] In order to ensure the quality of polishing, the adsorption pad on the polishing head (including the deformable adsorption film and the hard ring around the adsorption film) needs to be replaced regularly. However, the adsorption pad is pasted on the pressure ring (including the elastic film (such as rubber film) and the hard ring around the elastic film) and then installed on the polishing head. Since the size of the adsorption pad is smaller than that of the pressure ring and the flatness of the pressure ring surface is required to be high, the artificial posting will cause the adsorption pad to be offset and the surface of the pressure ring to be uneven, resulting in bubbles, which will cause equipment failure after being installed on the machine, affecting production efficiency.

[0047] refer to Figure 1-Figure 9 In view of the above problems, this embodiment provides an assembly device for assembling the adsorption pad 200 and the pressure ring 100 on the polishing head, realizing the automatic attachment of the adsorption pad 200 and the pressure ring 100, and reducing the labor consumption. The attachment accuracy of the adsorption pad 200 and the pressure ring 100 is improved, the attachment quality is improved, and the equipment failure after being installed is avoided. And to a certain extent, the loss of spare parts and the time required to replace spare parts are reduced, and the efficiency is submitted.

[0048] Specifically, the assembly equipment provided in this embodiment includes:

[0049] An adsorption head 1, used for adsorbing the adsorption pad 200;

[0050] A carrying plate 2, used for carrying the pressure ring 100;

[0051] A first movement control structure, used for controlling the relative movement of the adsorption head 1 and / or the carrier plate 2, so that the adsorption pad 200 is attached to the pressure ring 100;

[0052] The pressing structure includes a pressing roller 51 , which is used to press the adsorption pad 200 and the pressing ring 100 after the adsorption pad 200 is attached to the pressing ring 100 .

[0053] In an exemplary embodiment, the adsorption head 1 includes a main body, and an adsorption chamber is provided in the main body. The adsorption chamber is connected to an external vacuum device through a vacuum pipe 12 to realize the operation of evacuating and inflating the adsorption chamber. The adsorption end of the main body is provided with an adsorption surface 101 connected to the adsorption chamber. The adsorption surface 101 is switched between a first state and a second state by evacuating or inflating the vacuum pipe 12. In the first state, the adsorption surface 101 is recessed toward the inside of the adsorption chamber to adsorb the adsorption pad 200. Figure 4 In the second state, the vacuum pipe 12 is inflated, and the adsorption surface 101 protrudes away from the adsorption chamber. Figure 5 , with a certain degree of pressing operation between the adsorption head 1 and the carrier plate 2, the adsorption pad 200 is fitted with the pressure ring 100.

[0054] In an exemplary embodiment, the adsorption chamber has an opening, and an elastic metal sheet is disposed at the opening, and the elastic metal sheet is the adsorption surface 101 .

[0055] The elastic metal sheet may be a thin sheet fixed on the side wall of the opening.

[0056] The elastic metal sheet may include a bottom sheet and side sheets located around the bottom sheet, and the side sheets are fixed around the opening.

[0057] The elastic metal sheet can be a thin iron sheet or aluminum sheet, etc., and there is no limitation here. The thickness of the metal sheet can also be set according to actual needs, as long as it can be deformed to a preset shape under the action of the vacuum or inflation operation through the vacuum pipeline 12.

[0058] In an exemplary embodiment, the adsorption surface 101 may be a side surface of the adsorption chamber, that is, the adsorption surface 101 and the adsorption chamber are an integrated structure, and by reducing the thickness of the side surface of the adsorption chamber at the adsorption end, the side surface can be reused as the adsorption surface 101.

[0059] In an exemplary embodiment, the supporting plate 2 includes a first supporting platform 21 and a second supporting platform 22 located on the first supporting platform 21 , and the area of ​​the second supporting platform 22 is smaller than the area of ​​the first supporting platform 21 , so that the pressure ring 100 can be mounted on the outside of the second supporting platform 22 .

[0060] The shape of the second carrier platform 22 is consistent with the shape of the pressure ring 100, and when the pressure ring 100 is mounted on the second carrier platform 22, the pressure ring 100 is in close contact with the second carrier platform 22. The pressure ring 100 is mounted around the second carrier platform 22, which can keep the pressure ring 100 in a tensioned state to avoid the generation of bubbles when attached to the adsorption pad 200.

[0061] In an exemplary embodiment, the bearing surface of the second bearing platform 22 is a convex surface that protrudes in the direction away from the first bearing platform, which not only has the effect of stably bearing the pressure ring 100, but also the setting of the convex surface can make the elastic surface of the pressure ring 100 be subjected to stable tension, so that the elastic surface will not appear concave or convex during the pasting operation with the adsorption pad 200.

[0062] Exemplarily, a support column is disposed at the bottom of the carrying plate 2 for supporting the carrying plate 2 .

[0063] In an exemplary embodiment, the assembly equipment further includes a foreign body detection structure, including:

[0064] An image acquisition unit, used for scanning and detecting the surface of the pressure ring 100 carried on the carrying plate;

[0065] The processing unit is used to determine whether there is foreign matter on the surface of the pressure ring 100 according to the image acquired by the image acquisition unit.

[0066] Move the carrier plate 2 or move the foreign object detection structure so that the carrier plate 2 drives the pressure ring 100 thereon to move to a preset position, so that the pressure ring 100 is located within the scanning detection range of the image acquisition unit, and the surface of the pressure ring 100 (the surface is the attachment surface for attaching to the adsorption pad 200) is scanned by the image acquisition unit to obtain an image of the pressure ring 100, and the image is analyzed and processed by the processing unit to determine whether there is a foreign object on the surface of the pressure ring 100.

[0067] The image acquisition unit may be a laser sensor 301 , but is not limited thereto.

[0068] In the implementation manner where the image unit adopts a laser sensor 301, the foreign body detection structure further includes:

[0069] The moving unit is used to control the rotation of the carrier plate 2 to drive the pressure ring 100 to rotate during the scanning process of the image acquisition unit.

[0070] The moving unit controls the carrier plate 2 to rotate so that the laser sensor 301 can fully scan the pressure ring 100 .

[0071] Exemplarily, the number of the laser sensors 301 can be set according to actual needs. In some embodiments, the number of the laser sensors 301 is two, and when performing an image scanning on the pressure ring 100, the two laser sensors 301 are symmetrically arranged on opposite sides of the pressure ring 100. In this way, the supporting plate 2 can complete a comprehensive scan of the pressure ring 100 by rotating one circle.

[0072] In an exemplary embodiment, the foreign matter detection structure includes a support rod 303 and a support ring 302 . The support ring 302 is supported on the support rod 303 , and the image acquisition unit is disposed on the support ring 302 .

[0073] In some embodiments, two laser sensors 301 are symmetrically arranged on the support ring 302. Figure 8 .

[0074] The area of ​​the support ring 302 is larger than the area of ​​the first support platform 21 , so that the support plate 2 can be located inside the support ring 302 , and the support plate 2 can be located between the two laser sensors 301 , so that the two laser sensors 301 can scan the pressure ring 100 .

[0075] In some embodiments, in order to facilitate scanning of the pressure ring 100, before starting the scan, the pressure ring 100 needs to be located within the detection area of ​​the laser sensor 301, for example, the vertical distance between the surface of the pressure ring 100 and the center line of the laser beam of the laser sensor 301 is less than or equal to 2 mm.

[0076] In an exemplary embodiment, the assembly equipment further includes a cleaning structure for cleaning the pressure ring 100 when the foreign matter detection structure detects a foreign matter.

[0077] In an exemplary embodiment, the cleaning structure includes:

[0078] A nozzle, used for spraying a cleaning liquid onto the surface of the pressure ring 100;

[0079] The air knife is used to spray clean dry air toward the pressure ring 100 .

[0080] When the foreign matter detection structure detects that there is foreign matter on the surface of the pressure ring 100, such as residual glue, high-pressure cleaning liquid is sprayed toward the pressure ring 100 through the nozzle to clean the surface of the pressure ring 100, and after cleaning, the pressure ring 100 is dried by blowing high-pressure clean dry air through the wind knife.

[0081] Exemplarily, the pressing ring 100 may be repeatedly cleaned and dried multiple times to effectively clean the pressing ring 100 .

[0082] Exemplarily, after cleaning the pressure ring 100, the pressure ring 100 needs to be inspected again by the foreign matter detection structure until no foreign matter is detected on the surface of the pressure ring 100, thereby ensuring the cleanliness of the surface of the pressure ring 100 and ensuring the quality of attachment to the adsorption pad 200.

[0083] Exemplarily, the cleaning liquid sprayed by the nozzle may be ultrapure water, but is not limited thereto.

[0084] Exemplarily, a plurality of the nozzles and a plurality of the air knives may be provided to improve cleaning efficiency.

[0085] In an exemplary embodiment, the first movement control structure can independently control the movement of the adsorption head 1 and the carrying plate 2, or can simultaneously control the movement of the adsorption head 1 and the carrying plate 2, as long as the positioning and pressing of the carrying plate 2 and the adsorption head 1 can be achieved to achieve the attachment of the adsorption pad 200 and the pressure ring 100.

[0086] Exemplarily, the first movement control structure may include a lifting cylinder for controlling the lifting and lowering of the adsorption head 1 and / or the carrying plate 2, but is not limited thereto.

[0087] In an exemplary embodiment, the adsorption head 1 is located directly above the carrying plate 2, that is, the adsorption head 1 and the carrying plate 2 can be pre-aligned in the horizontal direction through a pre-alignment structure. In this way, when attaching, it is only necessary to move the adsorption head 1 or the carrying plate 2 in the vertical direction, and there is no need to re-align in the horizontal direction, thereby improving efficiency.

[0088] In an exemplary embodiment, in the initial state, that is, before the attachment work, the foreign matter detection structure is located between the adsorption head 1 and the carrier plate 2. At this time, the carrier plate 2 rises to a preset position to complete the foreign matter detection, and then continues to rise to complete the attachment process.

[0089] In the embodiment where the adsorption head 1 is located directly above the carrier plate 2, the assembly device further includes a second movement control structure, including:

[0090] The first moving part 41 is used to transport the adsorption pad 200 to a first position to be adsorbed by the adsorption head 1; the first position is directly below the adsorption head 1 to facilitate the adsorption of the adsorption pad 200;

[0091] The second moving part 42 is used to transfer the pressure ring 100 to a second position to be carried by the carrying plate 2 . The second position is directly above the carrying plate 2 , so that the carrying plate 2 can rise and fix the pressure ring 100 .

[0092] refer to Figure 1 , Figure 6 and Figure 7 The first moving part 41 includes a set of clamping claws (refer to Figure 1 The first gripper 402 in the embodiment of the present invention controls the conveyor belt (reference Figure 1 The first conveyor belt 401 in the embodiment of the present invention is provided, and a cylinder 4001 ( Figure 7 The middle cylinder 4001 is meshed and connected with the transmission gear 4002 through a gear, and the transmission belt is driven by the transmission gear 4002 to realize the position transmission of the clamping jaws. The cylinder 4001 realizes the opening and closing of the clamping jaws to clamp or release the adsorption pad 200.

[0093] The second moving part 42 can adopt the same structure as the first moving part 41, that is, it includes a group of clamping claws (refer to Figure 1 The second gripper 404 in the embodiment of the present invention controls the conveyor belt (reference Figure 1 The second conveyor belt 403 in the figure) and the cylinder controlling the opening and closing (movement toward or away from each other) of a group of the clamping jaws, the transmission belt is driven by the transmission gear 4002 to realize the position transmission of the clamping jaws, and the cylinder 4001 realizes the opening and closing of the clamping jaws to clamp or release the adsorption pad 200.

[0094] In an exemplary embodiment, the pressing structure includes a pressing roller 51, referring to Figure 2 After the adsorption pad and the pressure ring are bonded in the bonding area 10, they are transferred to the bonding area 20 for bonding by the pressing roller 51. This prevents the adsorption pad 200 from being debonded due to the edge of the adsorption pad 200 or the overall bonding not being in place after the bonded adsorption pad 200 and the pressure ring 100 are installed on the polishing head.

[0095] The pressing roller 51 may be made of hard rubber and press the entire adsorption pad 200 without scratching the adsorption pad 200 .

[0096] Exemplarily, after the adsorption pad 200 and the pressing ring 100 are bonded together, the first moving part 41 or the second moving part 42 can move the bonded adsorption pad 200 and the pressing ring 100 to a bonding process position, and the pressing roller 51 can be used to perform the bonding operation.

[0097] Exemplarily, the adsorption pad 200 and the pressure ring 100 after bonding can also be transported by a separately arranged moving control structure, which is not limited here.

[0098] The present invention also provides an assembly method, which assembles the adsorption pad 200 and the pressure ring 100 of the polishing head by the above-mentioned assembly equipment, comprising:

[0099] The adsorption pad 200 is adsorbed by the adsorption head 1, and the pressure ring 100 is carried by the carrying plate 2;

[0100] Controlling the adsorption head 1 and / or the carrier plate 2 to move relative to each other so that the adsorption pad 200 is attached to the pressure ring 100;

[0101] The adsorbent pad 200 and the pressing ring 100 are pressed together by a pressing structure.

[0102] Specifically, the assembling method includes:

[0103] The adsorption pad 200 is placed at a preset position, the adsorption pad 200 is clamped by the clamping claws 402, and is transported by a conveyor belt;

[0104] The conveyor belt moves to the first position (i.e., directly below the adsorption head 1, i.e., the waiting adsorption position of the adsorption head 1), and after the adsorption head 1 descends to contact the adsorption pad 200, the vacuum is drawn through the vacuum pipeline 12, so that the adsorption surface 101 of the adsorption head 1 adsorbs the adsorption pad 200;

[0105] The pressing ring 100 is placed at a preset position, clamped by the clamping jaws 402, and conveyed by a conveyor belt;

[0106] The conveyor belt moves to the second position (i.e., directly above the carrier plate 2, i.e., the position where the carrier plate 2 is to be fixed);

[0107] The carrying plate 2 rises to support the pressure ring 100;

[0108] The carrying plate 2 drives the pressure ring 100 to descend or rise to the detection area of ​​the foreign object detection structure (when the image acquisition unit of the foreign object detection structure includes a laser sensor 301, the distance between the surface of the pressure ring 100 and the center of the laser beam is 2 mm), and controls the carrying plate 2 to drive the pressure ring 100 to rotate at a constant speed to start detection.

[0109] If the test result shows that there is no abnormality on the surface of the pressure ring 100, the carrier plate 2 rises and / or the adsorption head 1 descends. When the adsorption head 1 and the carrier plate 2 are located in the preparation operation area (for example, the adsorption head 1 is 4 mm away from the carrier plate 2, but not limited to this), the internal pressure of the adsorption head 1 is relieved and the adsorption chamber begins to be inflated, so that the center of the adsorption pad 200 changes from concave to convex (that is, the adsorption surface 101 is in the second state). Due to the shape design of the adsorption head 1 (the inner side of the adsorption head 1 protrudes slightly compared to the outer side, that is, the adsorption surface of the adsorption head forms a convex surface protruding outward), the adsorption pad 200 will not detach immediately when it is in the convex state for the first time. At this time, the carrier plate 2 begins to slowly move upward until it is completely in contact with the adsorption head 1, so that the pressure ring 100 is in contact with the adsorption pad 200, and the operation is completed.

[0110] If the detection result of the foreign matter detection is that there are residual rubber particles or other impurities on the surface of the pressure ring 100 (i.e., there are foreign matters), the carrier plate 2 is moved to the cleaning area, and the high-pressure nozzle starts to perform cleaning work in the form of spraying cleaning liquid-blow-drying-spraying cleaning liquid-blow-drying repeatedly. After the cleaning is completed, the carrier plate 2 is moved to the detection area of ​​the foreign matter detection structure, and the detection operation is performed again;

[0111] After the adsorption pad 200 and the pressure ring 100 are bonded together, the supporting plate 2 will drop to the lowest end, and the lowest moving structure (which can be a second moving control structure) controls the movement of the adsorption pad 200 and the pressure ring 100 after bonding. The adsorption pad 200 and the pressure ring 100 are pressed again by the pressing roller 51, so that the adsorption pad 200 is tightly attached to the pressure ring 100.

[0112] It should be noted that the inner side of the adsorption head 1 protrudes slightly compared to the outer side, that is, the adsorption surface of the adsorption head forms a convex surface protruding outward (because the outer side of the silicon wafer adsorption pad protrudes compared to the inner side, that is, it is designed to have a concave structure, and the adsorption surface of the adsorption head is a convex surface that matches the shape of the silicon wafer surface, so that the adsorption head 1 can be completely fitted with the silicon wafer adsorption pad), the surface of the adsorption head 1 is a slightly deformable stainless steel sheet (that is, the elastic metal sheet, a thin sheet material made of stainless steel), the adsorption chamber in the adsorption head 1 is a closed chamber, and the inward and outward deformation of the stainless steel sheet is achieved through the exhaust gas and the filling gas of the vacuum pipeline 12. When the adsorption head 1 is completely fitted with the silicon wafer adsorption pad, the gas in the adsorption chamber of the adsorption head is extracted to cause the stainless steel sheet to deform inward. At this time, the adsorption pad will be firmly adsorbed on the adsorption head through the action of atmospheric pressure.

[0113] There are a few points to note:

[0114] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0115] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0116] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0117] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An assembly device for assembling an adsorption pad and a pressure ring on a polishing head, characterized in that: include: An adsorption head, used for adsorbing the adsorption pad; A carrying plate, used for carrying the pressure ring; A first movement control structure, used for controlling the relative movement of the adsorption head and / or the carrier plate, so that the adsorption pad is attached to the pressure ring; The pressing structure comprises a pressing roller, which is used for pressing the adsorption pad and the pressing ring after the adsorption pad is attached to the pressing ring.

2. The assembly device according to claim 1, characterized in that: The adsorption head comprises an adsorption chamber and an adsorption surface communicated with the adsorption chamber; The adsorption chamber is connected to the vacuum equipment through a vacuum pipeline so that the adsorption surface can be converted between a first state and a second state. In the first state, the adsorption surface is recessed toward the interior of the adsorption chamber to adsorb the adsorption pad. In the second state, the adsorption surface protrudes in a direction away from the adsorption chamber to fit with the pressure ring.

3. The assembly device according to claim 2, characterized in that: The adsorption chamber has an opening, and an elastic metal sheet is arranged at the opening, and the elastic metal sheet is the adsorption surface.

4. The assembly device according to claim 1, characterized in that: The carrying plate includes a first carrying platform and a second carrying platform located on the first carrying platform, and the area of ​​the second carrying platform is smaller than that of the first carrying platform, so that the pressure ring can be sleeved on the outside of the second carrying platform.

5. The assembly device according to claim 1, characterized in that: Also includes foreign body detection structure, including: An image acquisition unit, used for scanning and detecting the surface of the pressure ring carried on the carrying plate; The processing unit is used to determine whether there is foreign matter on the surface of the pressure ring according to the image acquired by the image acquisition unit.

6. The assembly device according to claim 5, characterized in that: The image acquisition unit includes a laser sensor, and the foreign matter detection structure also includes: The moving unit is used to control the rotation of the carrier plate to drive the pressure ring to rotate during the scanning process of the image acquisition unit.

7. The assembly device according to claim 5, characterized in that: The foreign matter detection structure comprises a support rod and a support ring, wherein the support ring is supported on the support rod, and the image acquisition unit is arranged on the support ring.

8. The assembly device according to claim 5, characterized in that: It also includes a cleaning structure for cleaning the pressure ring when the foreign matter detection structure detects a foreign matter.

9. The assembly device according to claim 8, characterized in that: The cleaning structure comprises: A nozzle, used for spraying a cleaning liquid onto the surface of the pressure ring; The air knife is used to spray clean dry air toward the pressure ring.

10. The assembly device according to claim 1, characterized in that: Also included is a second movement control structure, including: A first moving part, used for conveying the adsorption pad to a first position to be adsorbed by the adsorption head; The second moving part is used to transfer the pressure ring to a second position to be carried by the carrying plate.

11. An assembly method, characterized in that: Assembling the adsorption pad and the pressure ring of the polishing head by the assembly device according to any one of claims 1 to 10 comprises: Adsorbing the adsorption pad by an adsorption head, and carrying the pressure ring by a carrying plate; Controlling the adsorption head and / or the carrier plate to move relative to each other so that the adsorption pad is attached to the pressure ring; The fitted adsorption pad and the pressing ring are pressed together by a pressing structure.

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