A high-precision resonant gyroscope and its manufacturing process

Abstract

The present invention relates to the technical field of gyroscopes, and specifically refers to a high-precision resonant gyroscope and a manufacturing process thereof, including obtaining a resonator substrate through fused quartz material, and also including the following steps: step 1, model design; step 2, mass leveling; step 3, assembly packaging; step 4, test compensation; the present invention introduces a shaft system dynamic balance polishing process in the manufacturing process, sets a window structure on the resonator substrate, and uses a balance module to release a balance flow to the inner surface to achieve dynamic balance, and then completes the polishing operation of the inner surface through a polishing flow; it can more accurately predict and evaluate the effect of the leveling operation. This method not only improves the accuracy of leveling, but also reduces the potential performance loss caused by over-leveling or under-leveling.

Description

Technical Field

[0001] The present invention relates to the technical field of gyroscopes, and in particular to a high-precision resonant gyroscope and a manufacturing process thereof. Background Art

[0002] As a high-precision gyroscope, the hemispherical resonator gyroscope (HRG) has many advantages such as impact resistance, radiation resistance, small size, light weight, low energy consumption, high reliability, and long service life. It has been successfully used in the fields of national defense, military, communication satellites, manned spaceflight, astronomical observation, and marine engineering. As the core component of the hemispherical resonator gyroscope, the hemispherical resonator has high requirements for its processing accuracy in order to obtain low-frequency splitting and high quality factor. It is usually required that the manufacturing accuracy of the hemispherical resonator reach the submicron level and the surface roughness reach the nanometer level.

[0003] It should be noted that the manufacturing requirements for high-performance hemispherical resonators have exceeded the current grinding and polishing processing capabilities. A polishing process similar to the dynamic balancing of the shaft system must be introduced to further reduce the frequency cracking value. The accuracy of the adjustment amount has a decisive influence on the performance of the final product. In the processing and manufacturing process, whether it is grinding, polishing, or ion beam and ultrafast laser, the precision processing of the resonator essentially requires stable and controllable mass removal, which requires that the relationship between the local mass removal of the resonator and the performance must be clear. It should also be noted that in addition to clarifying the corresponding relationship and improving manufacturing capabilities, the corresponding processing and manufacturing process requirements can also be reduced by changing the mechanical structure of the gyroscope. Summary of the invention

[0004] The present invention aims to provide a high-precision resonant gyroscope to reduce the difficulty of manufacturing process; and also to provide a manufacturing process of a high-precision resonant gyroscope to reduce the processing error caused by direct contact between the resonator and the manufacturing equipment during the processing.

[0005] The present invention is achieved through the following technical solutions:

[0006] A manufacturing process for a high-precision resonant gyroscope, the manufacturing process comprising obtaining a resonator substrate through fused quartz material, and further comprising the following steps: step 1, model design, using the second-order bending mode wave pattern of a hemispherical resonator to detect the change of an external angle to construct a manufacturing model, and introducing a shaft system dynamic balance polishing process into the manufacturing model, and obtaining a polished substrate after a polishing operation; step 2, mass leveling, calculating the leveling amount of the polished substrate through the manufacturing model, and performing a leveling operation according to the leveling amount to obtain a leveling substrate; step 3, assembly and packaging, assembling and packaging the leveling substrate in step 2 with an excitation cover, a base, and an electrode unit to obtain a gyroscope; step 4, test compensation, performing a precision test on the gyroscope in step 3, and performing error compensation according to the precision test result;

[0007] Among them, the resonator substrate has a window structure, and the manufacturing system includes a polishing module, a fixture module and a balancing module. The end of the polishing module is provided with a polishing cavity. The process of the dynamic balancing polishing process of the shaft system is as follows: in the initial state, the resonator substrate is placed on the fixture module and the outer surface is fitted with the opening of the polishing cavity. The balancing module releases a balancing flow to the inner surface of the resonator substrate and starts to rotate the resonator substrate through the window structure. After the resonator substrate maintains dynamic balance, the balancing module switches the balancing flow to a polishing flow through the window structure, and completes the inner surface polishing operation of the resonator substrate through the continuous flow of the polishing flow.

[0008] A high-precision resonant gyroscope comprises a resonator with a window structure, a hemispherical resonator, an excitation cover, a base and an electrode unit, wherein the electrode unit is a fan-shaped electrode.

[0009] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0010] 1. The present invention introduces a shaft system dynamic balancing polishing process into the manufacturing process, arranges a window structure on the resonator substrate, and uses a balancing module to release a balancing flow to the inner surface to achieve dynamic balancing, and then completes the polishing operation of the inner surface through a polishing flow;

[0011] 2. The present invention can more accurately predict and evaluate the effect of the leveling operation through a quantitative method. This method not only improves the accuracy of leveling, but also reduces the potential performance loss caused by over-leveling or under-leveling;

[0012] 3. The present invention significantly improves the performance of the resonant gyroscope by precisely controlling the leveling process and maintaining dynamic balance. By performing adjustments at high latitudes, manufacturers can more effectively adjust the mass distribution of the resonator substrate and reduce performance losses caused by processing limitations. At the same time, the strategy of maintaining dynamic balance reduces the errors that may be introduced during the processing, further improving the accuracy and reliability of the resonant gyroscope. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of the present invention, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0014] Figure 1 It is a schematic diagram of the process flow of the present invention. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and drawings. The schematic implementation modes and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention. It should be noted that the present invention is already in the actual development and use stage.

[0016] In order to make the technical solution of the present invention clearer, the professional terms involved in the present invention are explained here;

[0017] In the present invention, the term "manufacturing system" refers to the entire system for manufacturing a high-precision resonant gyroscope, including components such as a polishing module, a fixture module, and a balancing module. The modules of the manufacturing system work together to complete the manufacturing process of the gyroscope;

[0018] In the present invention, the term "polishing module" refers to a component in the manufacturing system, with a polishing cavity provided at the end thereof, which is used to perform a polishing operation on the surface of the resonator substrate in the shaft system dynamic balancing polishing process;

[0019] In the present invention, the term "fixture module" refers to a part of the manufacturing system, which is used to fix the resonator substrate during the polishing process so that its surface fits the opening of the polishing chamber;

[0020] In the present invention, the term "balancing module" refers to a key part in the manufacturing system, which is responsible for releasing a balancing flow to the surface of the resonator substrate, so that the resonator substrate starts to rotate and maintains dynamic balance, and then switches to a polishing flow to complete the polishing operation. The balancing module has a nozzle;

[0021] In the present invention, the term "adjustment module" refers to a part of the manufacturing system that adjusts the position and angle of the resonator substrate during the manufacturing process, especially when polishing the inner surface, to ensure the accuracy and uniformity of the polishing;

[0022] In the present invention, the term "leveling amount" refers to a value calculated by a manufacturing model and is used to guide the mass leveling operation of the polishing substrate to ensure that the mass distribution of the resonator substrate is uniform;

[0023] In the present invention, the term "excitation cover" refers to a part of the gyroscope, which is assembled and packaged together with the leveling substrate, the base, and the electrode unit during the assembly process of the resonant gyroscope;

[0024] In the present invention, the term "base" refers to the supporting part of the gyroscope, which together with the leveling substrate, the excitation cover and the electrode unit constitutes a complete resonant gyroscope;

[0025] In the present invention, the term "electrode unit" refers to an important component assembled and packaged together with the leveling substrate, the excitation cover and the base;

[0026] In the present invention, the term "window structure" refers to a structure on the resonator substrate that allows the balancing flow and the polishing flow to pass through to achieve dynamic balancing and polishing operations;

[0027] In the present invention, the term "balancing flow" refers to a fluid used to release to the resonator substrate through the nozzle of the balancing module, preferably pure water;

[0028] In the present invention, the term "polishing flow" refers to a fluid used to release to the resonator substrate through the nozzle of the balancing module and maintain the dynamic balance of the resonator substrate, preferably a compound of cerium oxide polishing powder, sodium hydroxide powder and pure water in a proportion, and the compounding ratio is preferably 1:0.5:20;

[0029] In the present invention, the term "solid wave gyro theory" refers to a theory for determining the rotation speed by analyzing the vibration mode inside a solid material, and is the theoretical basis for constructing a manufacturing model and calculating the leveling amount;

[0030] In the present invention, the term "process capability coefficient" refers to a parameter used to evaluate the process capability in the manufacturing process within the constraints of the manufacturing model;

[0031] In the present invention, the term "sensitivity" refers to the derivative of the frequency splitting with respect to the leveling amount, which is used to evaluate the effect of the leveling amount on the performance of the resonator;

[0032] In the present invention, the term "adjustment angle" refers to the adjustment parameter used to guide the angle during the leveling process in the constraints of the manufacturing model;

[0033] In the present invention, the term "theoretical leveling amount" refers to the parameter obtained by inversely calculating the sensitivity of the manufacturing model and used to guide the actual leveling operation;

[0034] In the present invention, the term "virtual rotational force" refers to the virtual rotational speed generated by the control electrode applied to the resonator during the precision detection process, which is used to detect the performance of the resonator;

[0035] In the present invention, the term "standing wave precession error equation" refers to the relationship between the virtual rotation speed generated by the resonator under the action of the virtual rotation force and the actual rotation speed in the accuracy detection, so as to evaluate the performance of the resonator;

[0036] In the present invention, the term "vibration mode" refers to the basic vibration mode of the gyroscope, that is, the vibration mode of the resonator in the resonant state under the action of the exciting force, which is a four-node vibration mode in the present invention.

[0037] Embodiment 1:

[0038] As attached Figure 1 As shown, a manufacturing process of a high-precision resonant gyroscope includes obtaining a resonator substrate by fused quartz material, and further includes the following steps:

[0039] Step 1, model design, using the second-order bending mode wave pattern of the hemispherical resonator to detect the change of the external angle to build a manufacturing model, and introduce the shaft system dynamic balancing polishing process into the manufacturing model, and obtain a polished substrate after polishing;

[0040] Step 2, mass leveling, calculating the leveling amount of the polishing substrate through the manufacturing model, and performing a leveling operation according to the leveling amount to obtain a leveled substrate;

[0041] Step 3, assembling and packaging, assembling and packaging the leveling substrate in step 2 with the excitation cover, the base and the electrode unit to obtain a gyroscope;

[0042] Step 4, test compensation, perform accuracy detection on the gyroscope in step 3, and perform error compensation according to the accuracy detection result;

[0043] Among them, the resonator substrate has a window structure, and the manufacturing system includes a polishing module, a fixture module and a balancing module. The end of the polishing module is provided with a polishing cavity. The process of the dynamic balancing polishing process of the shaft system is as follows: in the initial state, the resonator substrate is placed on the fixture module and the outer surface is fitted with the opening of the polishing cavity. The balancing module releases a balancing flow to the inner surface of the resonator substrate and starts to rotate the resonator substrate through the window structure. After the resonator substrate maintains dynamic balance, the balancing module switches the balancing flow to a polishing flow through the window structure, and completes the inner surface polishing operation of the resonator substrate through the continuous flow of the polishing flow.

[0044] It should be noted that in the processing and manufacturing process, whether it is grinding, polishing, ion beam or ultrafast laser, the precision processing of the resonator essentially requires the stable and controllable removal of mass. This requires that the relationship between the local mass removal and performance of the resonator must be clear. However, in the existing manufacturing process, it is impossible to avoid the direct contact between the resonator and the manufacturing system. It is understandable that the rigid contact between the resonator and the manufacturing system will inevitably lead to large processing errors in the manufacturing process.

[0045] On the basis of the above problems, the applicant proposed a manufacturing process for a high-precision resonant gyroscope. The general manufacturing process is as follows: first, prepare the resonator substrate by fused quartz material; second, design the model, use the azimuth change of the second-order bending mode wave diagram of the hemispherical resonator to detect the angle change, and introduce the shaft system dynamic balance polishing process in the manufacturing model; then, perform mass leveling, calculate the leveling amount and perform the leveling operation; then, assemble and package, assemble and package the leveled substrate with the excitation cover, base and electrode unit into a gyroscope; finally, perform test compensation, perform accuracy detection on the gyroscope and perform error compensation based on the results. In this process, the importance of the shaft system dynamic balance polishing process is particularly emphasized. By setting a window structure on the resonator substrate and using the balance module to release the balance flow to the inner surface, dynamic balance is achieved, and then the inner surface polishing operation is completed by the polishing flow.

[0046] It is understandable that although the rigid contact of the clamp can provide stable support, it also increases the possibility of stress and damage caused by contact, which will have an adverse effect on the surface quality and geometric accuracy of the oscillator. In addition, the rigid contact may also cause slight deformation of the oscillator during the processing process, affecting its final performance.

[0047] The dynamic balancing and polishing process of the shaft system in the present application releases a balancing flow to the inner surface of the resonator substrate through a balancing module and causes the resonator substrate to start rotating through a window structure. After the resonator substrate maintains dynamic balance, the balancing module switches the balancing flow to a polishing flow through the window structure, and completes the inner surface polishing operation of the resonator substrate through the continuous flow of the polishing flow. This process not only reduces direct contact, but also can effectively improve the processing accuracy and surface quality of the resonator substrate through the polishing operation under dynamic balance.

[0048] It should be noted that in step 1, the construction process of the manufacturing model is as follows: Step 1-1, the angle change is detected by the azimuth change of the second-order bending mode wave diagram of the hemispherical resonator, and the angle change process satisfies: ,in, is the proportionality coefficient; is the zero drift rate; is the angle change; is the precession angle; the above steps utilize that when the resonator is subjected to external rotation or angle change, its internal vibration mode will produce corresponding changes. By monitoring the changes in these vibration modes, the change in the external angle can be accurately sensed and calculated. Specifically, the vibration characteristics of the resonator under static and dynamic conditions are analyzed. Under static conditions, the vibration mode of the resonator is known; under dynamic conditions, that is, when the system in which the resonator is located undergoes rotation, the vibration mode will change due to the Coriolis effect. By measuring these changes, a mathematical model can be derived that relates the changes in the vibration mode to the changes in the external angle.

[0049] This step can be used to accurately detect and quantify the angular change of the resonator in the rotating system. Traditional detection methods may be affected by various errors, such as sensor accuracy limitations, environmental interference, etc. Detection through the azimuth change of the resonator's second-order bending mode wave pattern can provide a more accurate and reliable measurement method.

[0050] Step 1-2, define the frequency decomposition of the second-order bending mode as the difference between the natural frequencies of the two vibration modes of the resonator, and the definition process satisfies: ,in, Indicates frequency splitting; represents a natural frequency of a vibration mode; Represents another natural frequency of the vibration mode; the vibration characteristics of the resonator are analyzed in detail, and the natural frequencies of the resonator are determined through the solid wave gyroscope theory, and the relationship between these frequencies and the mass distribution of the resonator is further analyzed. Under this theoretical framework, frequency splitting is defined as the difference between the natural frequencies of two vibration modes. The above steps use a combination of mathematical modeling and physical analysis to abstract the vibration behavior of the resonator into mathematical expressions, and optimize the frequency splitting by adjusting physical parameters; this step also includes simulation of the dynamic response of the resonator under different working conditions to verify the accuracy and reliability of the model.

[0051] The present invention can significantly improve the performance of the resonant gyroscope by precisely controlling and optimizing frequency splitting. Conventional technology cannot accurately measure or control this parameter, resulting in limited accuracy of the gyroscope. The present invention can not only reduce the vibration error of the resonator but also improve its sensitivity to external rotation through precise frequency splitting control, thereby achieving higher measurement accuracy and dynamic range.

[0052] Step 1-3, determine the relationship between frequency splitting and mass distribution through solid wave gyro theory, the relationship satisfies: ,in, represents the proportionality coefficient; Indicates the fourth harmonic amplitude in the circumferential direction; the vibration mode of the oscillator is linked to the mass distribution. In this process, the proportional coefficient and the fourth harmonic amplitude in the circumferential direction are used to quantify the relationship between frequency splitting and mass distribution, which can achieve precise control of the vibration characteristics of the oscillator, and then manufacture a resonant gyroscope with better performance and higher precision. In addition, the solid wave gyroscope theory is a theory that uses the vibration mode of a solid medium (such as a quartz crystal) to detect and measure angular velocity. In a hemispherical resonant gyroscope, the vibration mode of the oscillator will change due to changes in angular velocity. These changes can be detected by measuring frequency splitting. Frequency splitting refers to the difference between the natural frequencies of the two vibration modes of the oscillator. In this embodiment, the relationship between frequency splitting and mass distribution is preferably determined by finite element analysis or similar numerical methods. The above method can simulate the vibration behavior of the oscillator under different mass distributions and calculate the corresponding frequency splitting.

[0053] Steps 1-4, define The sensitivity of the sub-leveling is the derivative of the frequency splitting with respect to the leveling amount, where the definition process satisfies: ; Indicates sensitivity; Represents the leveling amount; first, the initial frequency cracking of the resonator is determined through a manufacturing model, and then, through simulation or experimental methods, the mass distribution of the resonator is gradually adjusted, and the change in frequency cracking after each adjustment is measured. Through these data, the rate of change of frequency cracking to the leveling amount, that is, sensitivity, is calculated. By clarifying the relationship between sensitivity and leveling amount, the present invention allows manufacturers to optimize leveling strategies and achieve a more efficient and economical manufacturing process.

[0054] Step 1-5, define the objective function and constraints of the manufacturing model, where the objective function is to minimize frequency cracking and satisfy: ; Constraints include: sensitivity, adjustment angle, leveling amount and process capability coefficient. The constraint process satisfies: ; ; All represent the adjustment angle; It represents the process capability coefficient; Indicates the maximum frequency cracking allowed under manufacturing requirements.

[0055] It should also be noted that, compared with traditional technologies, the significant difference of the above steps lies in the precise control and quantitative analysis of the leveling process. The existing technology may rely more on experience or qualitative judgment, while the present invention can more accurately predict and evaluate the effect of the leveling operation through a quantitative method. This method not only improves the accuracy of leveling, but also reduces the potential performance loss caused by over-leveling or under-leveling.

[0056] It should be noted that in step 2, the theoretical leveling amount is inversely calculated through the sensitivity of the manufacturing model, and the inverse process satisfies: ;in, Represents the theoretical leveling amount. The theoretical leveling amount of the resonator substrate is calculated through the manufacturing model. Then, based on the calculation results, the resonator substrate is leveled during the actual manufacturing process to correct its mass distribution and ensure that the difference between the natural frequencies of the two vibration modes of the resonator (i.e., frequency splitting) meets the design requirements.

[0057] It should be noted that when the adjustment of the polishing substrate at the window structure reaches the minimum removal mass limit of the adjustment process, a high-latitude parallel is selected for adjustment. In the prior art, the leveling process cannot achieve the ideal leveling effect in certain key areas due to the limitation of the removal mass, resulting in uneven mass distribution of the resonator substrate, which in turn affects the performance of the resonant gyroscope. The present application effectively solves this problem by converting the adjustment position to a high-latitude parallel when the minimum removal mass limit is reached. After the clamping module cancels the clamping of the resonator substrate, the resonator substrate maintains dynamic balance through the power brought by the polishing flow continuously released by the balancing module. This step further ensures that during the leveling process, the resonator substrate can maintain its dynamic balance, thereby reducing the stress and damage caused by the clamping or polishing process, and improving the processing accuracy and surface quality.

[0058] The above process significantly improves the performance of the resonant gyroscope by precisely controlling the leveling process and maintaining dynamic balance. By performing adjustments at high latitudes, manufacturers can more effectively adjust the mass distribution of the resonator substrate and reduce performance losses caused by processing limitations. At the same time, the strategy of maintaining dynamic balance reduces the errors that may be introduced during the processing process, further improving the accuracy and reliability of the resonant gyroscope.

[0059] More specifically, the sensitivity of the high-latitude region of the oscillator is relatively low. When the calculated adjustment amount at the lip edge is lower than the minimum removal mass achievable by the current process, or the uncertainty of the current process is too large and the performance cannot be further improved, the high-latitude latitude lines are selected for four-point orthogonal adjustment. The four-point orthogonal adjustment process will not be described in detail here.

[0060] It should be noted that after the resonator substrate maintains dynamic balance, the fixture module cancels the clamping effect on the resonator substrate. At this time, the resonator substrate maintains dynamic balance through the power brought by the polishing flow continuously released by the balancing module. It should also be noted that at this time, the resonator substrate no longer relies on the support of the fixture module, but maintains dynamic balance through the power brought by the polishing flow continuously released by the balancing module, which allows the resonator substrate to complete the polishing operation without being affected by rigid clamping, thereby reducing the stress and damage that may be caused by clamping, and improving the processing accuracy and surface quality.

[0061] It should be noted that the manufacturing system also includes an adjustment module. When polishing the inner surface of the resonator substrate, the resonator substrate is placed horizontally, the polishing module is arranged above the resonator substrate and the opening of the polishing cavity is in contact with the outer surface of the resonator substrate, and the balancing module is arranged below the resonator substrate and the position and angle are adjusted by the adjustment module.

[0062] It should also be noted that, first, the resonator substrate is placed horizontally to facilitate inner surface polishing. Then, the polishing module is arranged above the resonator substrate, and the opening of its polishing cavity is in close contact with the outer surface of the resonator substrate, ensuring that the polishing liquid can accurately act on the area that needs to be polished. At the same time, the balancing module is arranged below the resonator substrate, and its position and angle are adjusted by the adjustment module to achieve the best polishing effect. The above steps allow the polishing module and the balancing module to be precisely adjusted in position and angle. This adjustment capability ensures the accuracy and uniformity of the polishing process, thereby improving the polishing quality of the inner surface of the resonator substrate.

[0063] It should be noted that when polishing the outer surface of the resonator substrate, the resonator substrate is placed vertically, the polishing module is set horizontally and the opening of the polishing cavity is in contact with the outer surface of the resonator substrate, and the balancing module is symmetrically arranged with the polishing module based on the central axis of the resonator substrate and tilted upward. It should also be noted that, first, the resonator substrate is placed vertically on a special fixture or platform to ensure its stability and facilitate external surface polishing; the polishing module is set horizontally and ensures that the opening of its polishing cavity is in close contact with the outer surface of the resonator substrate; the balancing module is based on the central axis of the resonator substrate and is symmetrically arranged with the polishing module. In addition, the balancing module is tilted upward at a certain angle, which helps to achieve better dynamic balance during the polishing process.

[0064] With the coordinated action of the polishing module and the balancing module, the outer surface of the resonator substrate is polished. The polishing module is responsible for removing material and achieving the required surface finish, while the balancing module ensures that the substrate remains stable and dynamically balanced during the polishing process. After polishing, the outer surface of the resonator substrate is quality inspected to ensure that the polishing meets the expected accuracy and surface roughness requirements.

[0065] It should be noted that in step 3, the accuracy detection process includes: using the control electrode of the gyroscope to apply a virtual rotational force and act on the standing wave precession error equation, so that the resonator generates a virtual rotational speed, so that the sum of the current rotational speed of the resonator and the virtual rotational speed exceeds the angle measurement threshold. In the third step of the manufacturing process, that is, after assembly and packaging, the gyroscope needs to be precision-tested, and this process involves using the control electrode of the gyroscope. In the accuracy test, a virtual rotational force is applied by the control electrode. This virtual rotational force is theoretical and not a physical force actually acting on the gyroscope, but is used to simulate and detect the performance of the resonator. The virtual rotational force acts on the standing wave precession error equation of the resonator. The standing wave precession error equation is a mathematical model that describes the change of the internal vibration mode of the resonator when it is subjected to external rotation or angle change. By applying a virtual rotational force, the resonator generates a virtual rotational speed. This virtual rotational speed is not an actual physical rotational speed, but a parameter used to evaluate the performance of the resonator. The virtual rotational speed is added to the actual rotational speed of the current resonator, and the sum needs to exceed a specific angle measurement threshold. This threshold is a preset performance parameter used to determine whether the resonator can accurately measure the angle change.

[0066] Embodiment 2:

[0067] This embodiment only describes the parts that are different from the first embodiment, specifically: a high-precision resonant gyroscope, including a resonator with a window structure, a hemispherical resonator, an excitation cover, a base, and an electrode unit, wherein the electrode unit is a fan-shaped electrode. The hemispherical resonator has an inner concave platform, the upper end surface of the inner concave platform is flat, and the window structure is evenly spaced on the flat area.

[0068] It should also be noted that, based on the existing processing and manufacturing of the resonator, in this embodiment, a pulsed laser is preferably used to ablate the concave platform on the top of the resonator. The advantage of pulsed laser ablation of the concave platform is that the mass removed is more concentrated, and the laser has both super-strong and super-fast characteristics, which helps to reduce the quality defects of the resonator. Different from the window structure in the prior art, the window structure in the embodiment is arranged on the flat area of ​​the concave platform. These window structures are combined with the design of the concave platform to help the resonator produce the required vibration mode at a specific frequency, thereby achieving high-precision measurement of angular velocity; in terms of the control system, the demodulation module, the operation module, the control module and the modulation module work together to achieve accurate control and measurement of the vibration state of the resonator. In addition, the redesign of the window structure, which is arranged on the flat area of ​​the concave platform, helps the resonator produce the required vibration mode at a specific frequency, avoids the unexpected vibration response caused by the window structure, and improves the working performance of the resonator.

[0069] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for manufacturing a high-precision resonator gyroscope, the method comprising obtaining a resonator substrate by fused quartz material, characterized in that: The following steps are also included: Step 1, model design, using the second-order bending mode wave pattern of the hemispherical resonator to detect the change of the external angle to build a manufacturing model, and introduce the shaft system dynamic balancing polishing process into the manufacturing model, and obtain a polished substrate after polishing; Step 2, mass leveling, calculating the leveling amount of the polishing substrate through the manufacturing model, and performing a leveling operation according to the leveling amount to obtain a leveled substrate; Step 3, assembling and packaging, assembling and packaging the leveling substrate in step 2 with the excitation cover, the base and the electrode unit to obtain a gyroscope; Step 4, test compensation, perform accuracy detection on the gyroscope in step 3, and perform error compensation according to the accuracy detection result; The resonator substrate has a window structure, and the manufacturing system includes a polishing module, a fixture module and a balancing module. The end of the polishing module is provided with a polishing cavity. The process of the shaft system dynamic balancing polishing process is as follows: in the initial state, the resonator substrate is placed on the fixture module and the outer surface is fitted with the opening of the polishing cavity. The balancing module releases a balancing flow to the inner surface of the resonator substrate and starts to rotate the resonator substrate through the window structure. After the resonator substrate maintains dynamic balance, the balancing module switches the balancing flow to a polishing flow through the window structure, and completes the inner surface polishing operation of the resonator substrate through the continuous flow of the polishing flow. After the resonator substrate maintains dynamic balance, the fixture module cancels the clamping effect on the resonator substrate. At this time, the resonator substrate maintains dynamic balance through the power brought by the polishing flow continuously released by the balancing module. In step 1, the construction process of the manufacturing model is: Step 1-1, detect the angle change through the azimuth change of the second-order bending mode wave diagram of the hemispherical resonator. The angle change process satisfies: ,in, is the proportionality coefficient; is the zero drift rate; is the angle change; is the precession angle; Step 1-2, define the frequency decomposition of the second-order bending mode as the difference between the natural frequencies of the two vibration modes of the resonator, and the definition process satisfies: ,in, Indicates frequency splitting; represents a natural frequency of a vibration mode; represents another natural frequency of the vibration mode; Step 1-3, determine the relationship between frequency splitting and mass distribution through solid wave gyro theory, the relationship satisfies: ,in, represents the proportionality coefficient; Indicates the fourth harmonic amplitude in the circumferential direction; Steps 1-4, define The sensitivity of the sub-leveling is the derivative of the frequency splitting with respect to the leveling amount, where the definition process satisfies: ； Indicates sensitivity; Indicates the leveling amount; Steps 1-5, define the objective function and constraints of the manufacturing model, where: The objective function is to minimize the frequency splitting and satisfy: ； Constraints include: sensitivity, adjustment angle, leveling amount and process capability coefficient. The constraint process satisfies: ； ； All represent the adjustment angle; It represents the process capability coefficient; Indicates the maximum frequency cracking allowed under manufacturing requirements.

2. The method for manufacturing a high-precision resonant gyroscope according to claim 1, characterized in that: In step 2, the theoretical leveling amount is inversely calculated through the sensitivity of the manufacturing model, and the inverse process satisfies: ； in, Indicates the theoretical leveling amount.

3. The method for manufacturing a high-precision resonant gyroscope according to claim 2, characterized in that: When the trimming of the polishing substrate at the window structure reaches the minimum removal mass limit of the trimming process, a high latitude line is selected for trimming.

4. The method for manufacturing a high-precision resonant gyroscope according to claim 1, characterized in that: The manufacturing system also includes an adjustment module. When polishing the inner surface of the resonator substrate, the resonator substrate is placed horizontally, the polishing module is arranged above the resonator substrate and the opening of the polishing cavity abuts against the outer surface of the resonator substrate, and the balancing module is arranged below the resonator substrate and the position and angle are adjusted by the adjustment module.

5. The method for manufacturing a high-precision resonant gyroscope according to claim 4, characterized in that: When polishing the outer surface of the resonator substrate, the resonator substrate is placed vertically, the polishing module is arranged horizontally and the opening of the polishing cavity abuts against the outer surface of the resonator substrate, and the balancing module is symmetrically arranged with the polishing module based on the central axis of the resonator substrate and tilted upward.

6. The method for manufacturing a high-precision resonant gyroscope according to claim 1, characterized in that: In step 3, the accuracy detection process includes: using the control electrode of the gyroscope to apply a virtual rotational force and act on the standing wave precession error equation, so that the resonator generates a virtual rotation speed, and the sum of the current rotation speed of the resonator and the virtual rotation speed exceeds the angle measurement threshold.

7. A high-precision resonant gyroscope, comprising a resonator with a window structure, characterized in that: The high-precision resonant gyroscope is manufactured by the manufacturing method of any one of claims 1 to 6, and further comprises a hemispherical resonator, an excitation cover, a base and an electrode unit, wherein the electrode unit is a fan-shaped electrode.

8. A high-precision resonant gyroscope according to claim 7, characterized in that: The hemispherical resonator has an inner concave platform, the upper end surface of the inner concave platform is flat, and the window structures are evenly spaced on the flat area.

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